DE10134381A1 - Light source bearer, preferably for vehicle lights, is stamped metal grid with at least two folded regions per LED, whereby each LED contact vane is arranged between legs of folded region - Google Patents
Light source bearer, preferably for vehicle lights, is stamped metal grid with at least two folded regions per LED, whereby each LED contact vane is arranged between legs of folded regionInfo
- Publication number
- DE10134381A1 DE10134381A1 DE10134381A DE10134381A DE10134381A1 DE 10134381 A1 DE10134381 A1 DE 10134381A1 DE 10134381 A DE10134381 A DE 10134381A DE 10134381 A DE10134381 A DE 10134381A DE 10134381 A1 DE10134381 A1 DE 10134381A1
- Authority
- DE
- Germany
- Prior art keywords
- light source
- led
- lead frame
- source support
- legs
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000002184 metal Substances 0.000 title abstract 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical group [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
- 238000005452 bending Methods 0.000 claims description 2
- 239000004020 conductor Substances 0.000 description 6
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000004907 flux Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000010409 ironing Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000036316 preload Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000002918 waste heat Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
- F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
- F21S43/13—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source characterised by the type of light source
- F21S43/14—Light emitting diodes [LED]
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
- F21S45/40—Cooling of lighting devices
- F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/13—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L33/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
Abstract
Description
Die Erfindung betrifft einen Lichtquellenträger, vorzugsweise für Fahrzeugleuchten, mit zumindest einer LED, insbesondere einer Hochleistungs-LED, die mechanisch und elektrisch mit dem Träger verbunden ist. The invention relates to a light source carrier, preferably for Vehicle lights, with at least one LED, in particular one High performance LED that is mechanically and electrically connected to the carrier is.
Eine gute thermische Kontaktierung von LEDs ist besonders bei Hochleistungs- LEDs wichtig. Herkömmliche, sogenannte "3 mm"-"5 mm"-Dioden zeichnen sich durch einen hohen thermischen Widerstand von ca. 280 K/W aus. Da auf Grund dieses thermischen Widerstands die Abwärme des LED-Chips im Betrieb schlecht abgeführt wird, ist dieser LED-Typ nicht für hohe Lichtleistungen geeignet. Im Gegensatz dazu stellen Dioden mit Lichtströmen mit über 10 Im sogenannte Hochleistungsdioden dar. Ein Beispiel für diese Hochleistungsdioden sind die sogenannten "Snap-LEDs". Ihr thermischer Widerstand beträgt nur ca. 70K/W, wobei die Wärme über die verbreiterten LED-Kontaktfahnen abgeführt wird. Um den Lichtstrom der LED nutzen zu können, ist die thermische Degradation der Diode und damit der thermische Widerstand von der LED zur Umgebung möglichst gering zu halten. Good thermal contacting of LEDs is particularly important for high-performance LEDs important. Conventional, so-called "3 mm" - "5 mm" diodes stand out due to a high thermal resistance of approx. 280 K / W. Because of reason this thermal resistance the waste heat of the LED chip during operation is poorly dissipated, this type of LED is not for high light outputs suitable. In contrast, diodes with luminous fluxes of over 10 Im so-called high-performance diodes. An example of these high-performance diodes are the so-called "snap LEDs". Their thermal resistance is only approx. 70K / W, whereby the heat is dissipated via the widened LED contact tabs becomes. In order to be able to use the luminous flux of the LED, the thermal Degradation of the diode and thus the thermal resistance from the LED to To keep the environment as small as possible.
Es ist bekannt, LEDs als Lichtquellen für Beleuchtungselemente zu verwenden, deren elektrische Kontaktierung mit der Spannungsversorgung durch Löten der LEDs auf Leiterplatten erfolgt. Dieses hat jedoch zur Folge, dass durch die hohe Temperatur beim Löten die LEDs vorbeschädigt werden können und so die Lebensdauer der LEDs herabgesetzt wird. It is known to use LEDs as light sources for lighting elements their electrical contact with the power supply by soldering the LEDs on printed circuit boards. However, this means that the high temperature during soldering the LEDs can be damaged and so the LED life is reduced.
Aus der EP 0 896 898 A2 geht ein Verfahren hervor, die LEDs mittels Laserschweißen mit den Leiterbahnen des Trägerelementes zu verbinden. Die Kontaktflächen zwischen den LED-Kontaktfahnen und den elektrischen Leiterbahnen ist hierbei relativ klein, so dass die Wärmeableitung nicht optimal ist. Die EP 0 653 586 B1 offenbart ein mechanisches Verbindungsverfahren, bei dem die Kontaktfahnen der LEDs auf Leiterbahnen aufgelegt sind und sowohl die mechanische Befestigung als auch die elektrische Leitung durch eine Clinchverbindung erfolgt. Hierbei ist rein theoretisch die Berührungsfläche zwischen den LED-Kontaktfahnen und den Leiterbahnen groß. In der Praxis ist dieses jedoch nicht gewährleistet, da durch das Clinchen Spannungen in den großflächigen Kontaktfahnen erzeugt werden, die zum Abheben der Kontaktfahnenenden von den elektrischen Leiterbahnen führen. Durch das Clinchen werden zwar in dem Clinchpunkt zwischen den beiden zu verbindenden Teilen große Anpressdrücke erzeugt, die jedoch durch den in der Folgezeit sich auswirkenden Materialfluss nachlassen. Aus diesem Grund gestaltet man das Clinchwerkzeug auch so, dass Hinterschneidungen zwischen den Befestigungsflächen der beiden zu verbindenden Teile entstehen. Durch diese Hinterschneidungen entstehen aber wiederum höhere Spannungen in den LED- Kontaktfahnen. Das Abheben der Kontaktfahnen von den elektrischen Leiterbahnen ist in der Serienfertigung schlecht zu überprüfen. A method emerges from EP 0 896 898 A2 which uses LEDs To connect laser welding with the conductor tracks of the carrier element. The Contact areas between the LED contact lugs and the electrical ones Conductor paths are relatively small, so that heat dissipation is not optimal. EP 0 653 586 B1 discloses a mechanical connection method in which the contact tabs of the LEDs are placed on conductor tracks and both the mechanical attachment as well as the electrical line through a Clinch connection is made. The contact surface is purely theoretical between the LED contact lugs and the conductor tracks. In practice it is however, this is not guaranteed, since the clinching tensions in the Large contact flags are generated, which are used to lift off the Guide the ends of the contact tabs from the electrical conductor tracks. By clinching are in the clinch point between the two parts to be connected generates large contact pressures, which, however, become apparent in the subsequent period the impact of the material flow. For this reason, you design it Clinching tool so that undercuts between the Fastening surfaces of the two parts to be connected are created. Through this However, undercuts create higher voltages in the LED Contact flags. The lifting of the contact lugs from the electrical ones Printed conductors are difficult to check in series production.
Beide der vorgenannten Befestigungs- und Kontaktierungsverfahren der LEDs erfordern jeweils aufwendige und kostenintensive Fertigungsmethoden. Both of the aforementioned fastening and contacting methods of the LEDs each require complex and costly manufacturing methods.
Aufgabe der Erfindung ist, einen Lichtquellenträger, vorzugsweise für Fahrzeugleuchten, mit zumindest einer LED, insbesondere einer Hochleistungs- LED, die mechanisch und elektrisch mit dem Lichtquellenträger verbunden ist, so zu verbessern, dass neben einer guten elektrischen Kontaktierung eine gute thermische Kontaktierung stattfindet, damit die entstehende Wärme gut abgeführt wird. The object of the invention is a light source carrier, preferably for Vehicle lights, with at least one LED, in particular a high-performance LED, which is mechanically and electrically connected to the light source carrier, to improve so that in addition to good electrical contacting, a good one Thermal contacting takes place so the heat generated is good is dissipated.
Diese Aufgabe wird erfindungsgemäß in Verbindung mit dem Oberbegriff des Anspruchs 1 dadurch gelöst, dass der Lichtquellenträger ein metallisches Stanzgitter ist, an welchem für jede LED zumindest zwei gefaltete Bereiche angeordnet sind und wobei jede Kontaktfahne der zumindest einen LED federndklemmend und unter Vorspannung zwischen den Schenkeln eines gefalteten Bereiches angeordnet ist und großflächig an dem Stanzgitter anliegt. This task is inventively in connection with the preamble of Claim 1 solved in that the light source support is a metallic The lead frame is on which at least two folded areas for each LED are arranged and wherein each contact tab of the at least one LED resiliently clamped and under tension between the legs of a folded Area is arranged and bears extensively on the lead frame.
Eine effiziente Wärmeabfuhr ist durch die große Kontaktfläche zwischen den LED-Kontaktfahnen und dem metallischen Stanzgitter gewährleistet. Durch die gefalteten Bereiche und den damit verbundenen doppelseitigen Kontakt der Kontaktfahnen ist die zur Wärmeabfuhr nutzbare Kontaktfläche noch weiter vergrößert. Das Anordnen der Kontaktfahnen zwischen die unter Vorspannung stehenden Schenkel der gefalteten Bereiche und die dadurch erzeugte federnd-klemmende Befestigung der LED hat den Vorteil, dass der großflächige Kontakt zwischen den Kontaktfahnen und dem metallischen Stanzgitter dauerhaft und sicher hergestellt ist. Efficient heat dissipation is due to the large contact area between the LED contact flags and the metallic lead frame guaranteed. Through the folded areas and the associated double-sided contact of the Contact tabs are the contact surface that can be used for heat dissipation increased. Placing the contact tabs between the under tension standing leg of the folded areas and the generated thereby The spring-clamped fastening of the LED has the advantage that the large area Contact between the contact tabs and the metallic lead frame is made permanently and safely.
Die Vorspannkraft der Schenkel wird zweckmäßigerweise durch ein Überbiegen der Schenkel bei der Faltung erzeugt, so dass kein zusätzliches Federelement zur Erzeugung der Vorspannkraft eingesetzt werden muss. The pretensioning force of the legs is advantageously determined by a Bending over the legs created when folding, so no additional Spring element must be used to generate the preload.
Die gefalteten Bereiche sind einstückig mit dem Stanzgitter ausgeführt, wodurch die Kosten des Lichtquellenträgers, bedingt durch die reduzierte Anzahl an Bauteilen und Montageschritten, vorteilhaft minimiert sind. The folded areas are made in one piece with the lead frame, whereby the cost of the light source carrier due to the reduced number on components and assembly steps are advantageously minimized.
Um den Lichtquellenträger in großflächigen Leuchten oder für lichtstarke Lichtfunktionen einsetzen zu können, sind bei einer vorteilhaften Ausführungsform der Erfindung zwei oder mehr LEDs auf dem Lichtquellenträger angeordnet. Ein derartiger Aufbau des Lichtquellenträgers minimiert durch die reduzierte Anzahl an Bauteilen und Montageschritten die Kosten einer mit einem derartigen Lichtquellenträger bestückten Fahrzeugleuchte noch weiter. Around the light source support in large-area luminaires or for bright lights To be able to use light functions are in an advantageous embodiment the invention two or more LEDs arranged on the light source support. Such a structure of the light source carrier is minimized by the reduced Number of components and assembly steps the cost of one with one Such light source carrier equipped vehicle lamp even further.
Die Position der zumindest einen auf dem Lichtquellenträger angeordneten LED ist dauerhaft zwischen den Schenkeln der jeweiligen Faltungen fixiert, wenn vorteilhaft zumindest eine Anschlagfläche an das Stanzgitter angeformt ist, die ein Verrutschen der LED verhindert. The position of the at least one arranged on the light source carrier LED is permanently fixed between the legs of the respective folds, if advantageous, at least one stop surface is formed on the lead frame that prevents the LED from slipping.
Zur Reduzierung des benötigten Bauraumes ist es zweckmäßig, dass an das Stanzgitter zumindest ein Kontaktbereich für weitere elektronische Bauteile (z. B. zur Steuerung der auf dem Lichtquellenträger angeordneten LEDs) angeformt ist. To reduce the space required, it is advisable that the Lead frame at least one contact area for other electronic components (e.g. for controlling the LEDs arranged on the light source carrier) is molded.
Die Anzahl der zum Aufbau einer Fahrzeugleuchte benötigten Bauteile wird vorteilhaft weiter minimiert, wenn an das Stanzgitter zumindest ein Kontaktbereich angeformt ist, der zum Anschluss der Stanzgitters an die elektrische Spannungsversorgung dient. The number of components required to build a vehicle lamp is advantageously further minimized if at least one on the lead frame Contact area is formed, which is used to connect the lead frame to the electrical Power supply is used.
Bei einer vorteilhaften Ausgestaltung der Erfindung ist das Stanzgitter mit einem Kunststoffträger verbunden, wodurch die Montage des Lichtquellenträgers in einer Fahrzeugleuchte wesentlich vereinfacht wird. In an advantageous embodiment of the invention, the lead frame is included connected to a plastic carrier, which enables the mounting of the light source carrier in a vehicle lamp is significantly simplified.
Ein vorteilhaftes Ausführungsbeispiel der Erfindung ist anhand der Figuren näher erläutert. Es zeigen An advantageous embodiment of the invention is based on the figures explained in more detail. Show it
Fig. 1 eine perspektivische Ansicht eines Lichtquellenträgers, Fig. 1 is a perspective view of a light source carrier
Fig. 2 einen vergrößerten Ausschnitt des mittleren Abschnittes von Fig. 1 und Fig. 2 shows an enlarged section of the central portion of Fig. 1 and
Fig. 3 die Draufsicht auf den in Fig. 1 gezeigten Lichtquellenträger ohne LEDs. Fig. 3 is a plan view of the light source support shown in Fig. 1 without LEDs.
Der Lichtquellenträger besteht, wie aus Fig. 1 ersichtlich, aus einem Stanzgitter (10), auf dem drei LEDs (12) angeordnet sind. Für jede LED (12) sind an dem Stanzgitter (10) zwei gefaltete Bereiche angeordnet, welche einstückig mit dem Stanzgitter (10) ausgeführt sind. Die Kontaktfahnen (18) der LEDs (12) sind jeweils federnd-klemmend und unter Vorspannung zwischen den Schenkeln (14) eines gefalteten Bereiches fixiert. Um die LEDs (12) auch bei im Betrieb des Fahrzeuges auftretenden Erschütterungen in ihrer Position zu halten, sind an dem Stanzgitter (10) jeweils seitlich der LEDs (12) Anschlagflächen (16) angeformt, die ein Verschieben der LEDs (12) verhindern. Die zum Betrieb der LEDs (12) benötigten, hier nicht dargestellten, elektronischen Bauteile sind in an das Stanzgitter (10) angeformte Kontaktbereiche (20) einsetzbar. Ebenso ist das Stanzgitter (10) über angeformte Kontaktbereiche (22) mit der Spannungsversorgung verbindbar. Das Stanzgitter (10) wird montagefreundliche mit einem nicht dargestellten Kunststoffträger verbunden, wofür in das Stanzgitter (10) Bohrungen (24) eingebracht sind, über welche das Stanzgitter, z. B. mittels Warmverbügeln mit dem Kunststoffträger verbindbar ist. Um das Stanzgitter (10) in verschiedene Stromlaufkreise aufzuteilen, weist es Trennstege (26) auf, welche nach dem Verbinden des Stanzgitters (10) mit dem Kunststoffträger durchtrennt werden. Durch einen derartigen Aufbau kann das Stanzgitters (10) einstückig hergestellt werden, wodurch die Fertigung des Stanzgitters sowie des kompletten Lampenträgers wesentlich vereinfacht wird. As can be seen in FIG. 1, the light source carrier consists of a lead frame ( 10 ) on which three LEDs ( 12 ) are arranged. For each LED ( 12 ) two folded areas are arranged on the lead frame ( 10 ), which are made in one piece with the lead frame ( 10 ). The contact tabs ( 18 ) of the LEDs ( 12 ) are each spring-clamped and fixed under pretension between the legs ( 14 ) of a folded area. In order to keep the LEDs ( 12 ) in their position even when shocks occur during operation of the vehicle, stop surfaces ( 16 ) are formed on the lead frame ( 10 ) to the side of the LEDs ( 12 ), which prevent the LEDs ( 12 ) from moving. The electronic components (not shown here) required for operating the LEDs ( 12 ) can be inserted into contact areas ( 20 ) molded onto the lead frame ( 10 ). The lead frame ( 10 ) can also be connected to the power supply via molded contact areas ( 22 ). The lead frame ( 10 ) is connected in an assembly-friendly manner to a plastic carrier (not shown), for which purpose bores ( 24 ) are made in the lead frame ( 10 ) via which the lead frame, eg. B. is connectable to the plastic carrier by means of hot ironing. In order to divide the lead frame ( 10 ) into different electrical circuits, it has separating webs ( 26 ) which are cut after the lead frame ( 10 ) has been connected to the plastic carrier. With such a structure, the lead frame ( 10 ) can be produced in one piece, which considerably simplifies the manufacture of the lead frame and of the complete lamp holder.
Fig. 2 zeigt einen vergrößerten Ausschnitt des mittleren Abschnittes des in Fig. 1 dargestellten Stanzgitters (10). Der Aufbau des Stanzgitters (10) ist bereits zu Fig. 1 beschrieben und bedarf keiner Wiederholung. Fig. 2 shows an enlarged section of the central portion of the lead frame ( 10 ) shown in Fig. 1. The structure of the lead frame ( 10 ) has already been described for FIG. 1 and does not require repetition.
In Fig. 3 ist das Stanzgitter (10) in der Draufsicht von Oben ohne LEDs (12)
dargestellt. Die wesentlichen Merkmale des Stanzgitters (10) sind bereits zu
Fig. 1 beschrieben und bedürfen keiner Wiederholung. Der Draufsicht ist die
Anordnung der drei Anschlagflächen (16) für die Kontaktfahnen (18) der LEDs
(12) entnehmbar. Eine Anschlagfläche (16) ist jeweils vor den Schenkeln (14)
der gefalteten Bereiche angeordnet, so dass die Kontaktfahnen (18) nach dem
Einsetzen zwischen die Schenkel (14) nicht wieder entgegen der
Einschubrichtung aus den gefalteten Bereichen herausrutschen kann. Eine Anschlagfläche
(16) ist versetzt auf der den beiden ersten Anschlagflächen (16)
gegenüberliegenden Seite der gefalteten Bereiche angeordnet und dient dazu, dass die
Kontaktfahnen (18) der LEDs (12) nur bis zur Anlage an diese dritte
Anschlagfläche (16) in die gefalteten Bereiche einschiebbar ist. Durch die drei
Anschlagflächen (16) wird somit auf einfache Weise die räumliche Lage der LEDs (12)
auf dem Stanzgitter (10) festgelegt und dauerhaft fixiert.
Bezugszeichenliste
10 Stanzgitter
12 LED
14 Schenkel
16 Anschlagfläche
18 Kontaktfahne
20 Kontaktbereich
22 Kontaktbereich
24 Bohrung
26 Trennsteg
In Fig. 3, the lead frame ( 10 ) is shown in plan view from above without LEDs ( 12 ). The essential features of the lead frame ( 10 ) have already been described for FIG. 1 and do not require repetition. The arrangement of the three stop surfaces ( 16 ) for the contact tabs ( 18 ) of the LEDs ( 12 ) can be seen from the top view. A stop surface ( 16 ) is arranged in front of each of the legs ( 14 ) of the folded areas, so that the contact tabs ( 18 ) cannot slip out of the folded areas again after insertion between the legs ( 14 ) against the direction of insertion. An abutment surface ( 16 ) is offset on the side of the folded areas opposite the first two abutment surfaces ( 16 ) and serves to ensure that the contact tabs ( 18 ) of the LEDs ( 12 ) only come into contact with this third abutment surface ( 16 ) folded areas can be inserted. The three stop surfaces ( 16 ) thus easily and permanently fix the spatial position of the LEDs ( 12 ) on the lead frame ( 10 ). Legend: 10 leadframe
12 LED
14 legs
16 stop surface
18 contact flag
20 contact area
22 contact area
24 hole
26 separator
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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DE10134381A DE10134381A1 (en) | 2001-07-14 | 2001-07-14 | Light source bearer, preferably for vehicle lights, is stamped metal grid with at least two folded regions per LED, whereby each LED contact vane is arranged between legs of folded region |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10134381A DE10134381A1 (en) | 2001-07-14 | 2001-07-14 | Light source bearer, preferably for vehicle lights, is stamped metal grid with at least two folded regions per LED, whereby each LED contact vane is arranged between legs of folded region |
Publications (1)
Publication Number | Publication Date |
---|---|
DE10134381A1 true DE10134381A1 (en) | 2003-01-23 |
Family
ID=7691861
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE10134381A Withdrawn DE10134381A1 (en) | 2001-07-14 | 2001-07-14 | Light source bearer, preferably for vehicle lights, is stamped metal grid with at least two folded regions per LED, whereby each LED contact vane is arranged between legs of folded region |
Country Status (1)
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DE (1) | DE10134381A1 (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005062089A1 (en) * | 2003-12-02 | 2005-07-07 | 3M Innovative Properties Company | Solid state light device |
WO2005083803A2 (en) * | 2004-02-26 | 2005-09-09 | Osram Opto Semiconductors Gmbh | Light-emitting diode arrangement for a high-power light-emitting diode, and method for producing a light-emitting diode arrangement |
US7163327B2 (en) | 2002-12-02 | 2007-01-16 | 3M Innovative Properties Company | Illumination system using a plurality of light sources |
EP1744373A1 (en) * | 2005-07-13 | 2007-01-17 | CML Innovative Technologies | Holding and connection device for optoelectronic components like LEDs of the PLCC2 or PLCC4 type |
US7189983B2 (en) | 2003-12-02 | 2007-03-13 | 3M Innovative Properties Company | LED modifying apparatus and method |
US7403680B2 (en) | 2003-12-02 | 2008-07-22 | 3M Innovative Properties Company | Reflective light coupler |
DE102009029319A1 (en) * | 2009-09-09 | 2011-03-17 | Robert Bosch Gmbh | Base support for use with lamp module of vehicle lighting device, comprises support body, which has holding unit for mechanical attachment of lamp module at given mounting area |
WO2013064405A1 (en) * | 2011-11-03 | 2013-05-10 | Osram Gmbh | Lighting device having semiconductor light sources |
DE102019009034A1 (en) * | 2019-12-31 | 2021-07-01 | Marquardt Gmbh | Light band |
DE102021107369A1 (en) | 2021-03-24 | 2022-09-29 | Marquardt Gmbh | Optimized punched grid arrangement |
Citations (2)
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US7658526B2 (en) | 2002-12-02 | 2010-02-09 | 3M Innovative Properties Company | Illumination system using a plurality of light sources |
US7163327B2 (en) | 2002-12-02 | 2007-01-16 | 3M Innovative Properties Company | Illumination system using a plurality of light sources |
US7250611B2 (en) | 2003-12-02 | 2007-07-31 | 3M Innovative Properties Company | LED curing apparatus and method |
WO2005062089A1 (en) * | 2003-12-02 | 2005-07-07 | 3M Innovative Properties Company | Solid state light device |
US7403680B2 (en) | 2003-12-02 | 2008-07-22 | 3M Innovative Properties Company | Reflective light coupler |
US7189983B2 (en) | 2003-12-02 | 2007-03-13 | 3M Innovative Properties Company | LED modifying apparatus and method |
US7202489B2 (en) | 2003-12-02 | 2007-04-10 | 3M Innovative Properties Company | LED modifying apparatus and method |
US7202490B2 (en) | 2003-12-02 | 2007-04-10 | 3M Innovative Properties Company | LED modifying apparatus and method |
CN1926685B (en) * | 2004-02-26 | 2011-04-27 | 奥斯兰姆奥普托半导体有限责任公司 | Light-emitting diode arrangement, and method for producing a light-emitting diode arrangement |
WO2005083803A3 (en) * | 2004-02-26 | 2006-03-09 | Osram Opto Semiconductors Gmbh | Light-emitting diode arrangement for a high-power light-emitting diode, and method for producing a light-emitting diode arrangement |
WO2005083803A2 (en) * | 2004-02-26 | 2005-09-09 | Osram Opto Semiconductors Gmbh | Light-emitting diode arrangement for a high-power light-emitting diode, and method for producing a light-emitting diode arrangement |
US8975532B2 (en) | 2004-02-26 | 2015-03-10 | OSPAM Opto Semiconductor GmbH | Light-emitting diode arrangement for a high-power light-emitting diode and method for producing a light-emitting diode arrangement |
EP1744373A1 (en) * | 2005-07-13 | 2007-01-17 | CML Innovative Technologies | Holding and connection device for optoelectronic components like LEDs of the PLCC2 or PLCC4 type |
DE102009029319A1 (en) * | 2009-09-09 | 2011-03-17 | Robert Bosch Gmbh | Base support for use with lamp module of vehicle lighting device, comprises support body, which has holding unit for mechanical attachment of lamp module at given mounting area |
WO2013064405A1 (en) * | 2011-11-03 | 2013-05-10 | Osram Gmbh | Lighting device having semiconductor light sources |
DE102019009034A1 (en) * | 2019-12-31 | 2021-07-01 | Marquardt Gmbh | Light band |
DE102021107369A1 (en) | 2021-03-24 | 2022-09-29 | Marquardt Gmbh | Optimized punched grid arrangement |
WO2022199876A1 (en) | 2021-03-24 | 2022-09-29 | Marquardt Gmbh | Optimized lead frame assembly |
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