WO2015007904A1

WO2015007904A1 - Lighting device having a semiconductor light source and having a driver circuit board

Info

Publication number: WO2015007904A1
Application number: PCT/EP2014/065557
Authority: WO
Inventors: Georg Rosenbauer; Johannes Hoechtl; Marcel Vuc
Original assignee: Osram Gmbh
Priority date: 2013-07-19
Filing date: 2014-07-18
Publication date: 2015-01-22
Also published as: DE102013214236A1

Abstract

The invention relates to a lighting device (1), comprising: a substrate (4), which has a front side (9) for arranging at least one semiconductor light source (3), a back side (10), and at least one feed-through (12); and a driver circuit board (2) for arranging at least one electrical and/or electronic component (8) for operating the at least one semiconductor light source, which driver circuit board is arranged on the back side; wherein the substrate has at least one SMD contact element (14) on the front side of the substrate, the at least one SMD contact element being fastened by means of a surface mounting technique and being connected in a region of the front side of the substrate to an electrical conductor (13), which is fed through a feed-through, by means of a different manner of fastening, wherein the electrical conductor establishes a connection of the SMD contact element to the driver circuit board (2). The invention further relates to a method comprising: attaching an SMD contact element to the front side (9) of the substrate (4) by means of a surface mounting technique; feeding an electrical conductor (13) through the feed-through (12); and connecting the electrical conductor (13) to an SMD contact element (14) in a region of the front side of the substrate (4) by means of a different manner of fastening.

Description

description

Lighting device with semiconductor light source and

driver board

The invention relates to a lighting device, comprising a substrate having a front side for the arrangement of at least one semiconductor light source, with a rear side and with at least one passage between the front side and the rear side and having one at the rear side of the substrate

arranged driver board [to the arrangement of at least one electrical and / or electronic component for

Operating the at least one semiconductor light source], which driver board is electrically connected to the substrate, the substrate having on its front side at least one surface mounted SMD contact element. The invention further relates to a method for producing such a lighting device. The invention is particularly advantageous for use with, in particular, lamps, in particular retrofit lamps, in particular

Incandescent retrofit lamps.

There are lighting devices of the type in question, in which it is the SMD contact element is a plug, which is guided through a recess and contacted the driver plugged. The driver has a matching mating connection. These lighting devices have the disadvantage that such a plug solution requires a lot of space at the front of the substrate and is also expensive. Such formed as a plug SMD

Contact elements are e.g. available from the company JAE, e.g. in the series "ES3" ("LED power supply card edge type connector ES3 series"). Furthermore, lighting devices are known which comprise a substrate having a front side for arranging at least one

Semiconductor light source, with a back and at least one passage between the front and the back and further comprising a drive board arranged on the rear side of the substrate [for arranging at least one electrical and / or electronic component for

Operating the at least one semiconductor light source] electrically connected to the substrate. The substrate and driver board are interconnected by means of several cables which are manually soldered. However, such an electrical connection is not easy to automate. Rather, a high installation and manufacturing effort is needed. Therefore, such are also

Lighting devices comparatively expensive.

It is the object of the present invention to overcome the disadvantages of the prior art, at least in part, and in particular a cost-effective and simple, in particular automatable to produce electrical connection between a substrate and a driver board

provide. This object is achieved according to the characteristics of the independent

Claims solved. Preferred embodiments are

in particular the dependent claims.

The object is achieved by a lighting device, comprising a substrate with a front side for the arrangement of at least one semiconductor light source, with a rear side and with at least one passage between the

Front side and the rear side and having a driver board arranged on the rear side of the substrate for

Arrangement of at least one electrical and / or

electronic component for operating the at least one semiconductor light source, which driver board is electrically connected to the substrate, wherein the substrate is at its

Front has at least one surface mounted by a surface mounted SMD contact element and wherein the at least one SMD contact element in a region of

Front of the substrate by means of another

Mounting style as the surface mounting technique with one through a bushing guided electrical conductor

is connected, wherein the electrical conductor makes an electrical connection from the SMD contact element to the driver board.

This lighting device has the advantage that it is inexpensive and easy to implement and is also compact. Also, the substrate is versatilely electrically connectable to the driver board such that e.g. the substrate is particularly flexible interpretable with respect to different designs. In particular, the electrical connection between the substrate and the driver board is automated, in particular contactless. Through automation, short cycle times can be achieved during production.

The substrate (which may also be referred to as a "mounting substrate", for example) may be, for example, a ceramic substrate or a printed circuit board

effective heat dissipation from the attached

Semiconductor light sources e.g. In particular, the substrate may be a metal core PCB (MCPCB)

be plate-shaped.

The front and / or back of the substrate may be flat or curved.

The driver board may be e.g. an inexpensive FR4 board. The driver board may in particular be equipped with at least one electrical and / or electronic component for operating the at least one semiconductor light source. The driver board may also be referred to as control electronics, drivers, etc. The driver board may be disposed in contact with the substrate or spaced from the substrate (and, for example, also separated by a baffle).

The form of at least one implementation is not

limited and may be, for example, round, oval, rectangular, etc. The implementation may also as a hole, opening, hole, etc. be designated. The feedthrough may be circumferentially enclosed by the material of the substrate, but is not limited thereto, but may also be formed, for example, on the edge contour of the substrate.

Preferably, the at least one

Semiconductor light source at least one light emitting diode. at

If several LEDs are present, they can be lit in the same color or in different colors. A color may be monochrome (e.g., red, green, blue, etc.) or multichrome (e.g., white). This can also be done by the at least one

LED emitted light is an infrared light (IR LED) or an ultraviolet light (UV LED). Several

Light emitting diodes can produce a mixed light; e.g. a white mixed light. The at least one light-emitting diode may contain at least one wavelength-converting phosphor

(Conversion LED). The phosphor may alternatively or additionally be arranged away from the light-emitting diode

("Remote Phosphor"). The at least one light-emitting diode can be in the form of at least one individually housed light-emitting diode or in the form of at least one LED chip. Several LED chips can be mounted on a common substrate ("submount"). The at least one light emitting diode may be equipped with at least one own and / or common optics for beam guidance, e.g. at least one Fresnel lens,

Collimator, and so on. Instead of or in addition to inorganic light emitting diodes, e.g. based on InGaN or AlInGaP, organic LEDs (OLEDs, for example polymer OLEDs) can generally also be used. Alternatively, the at least one semiconductor light source may be e.g. have at least one diode laser.

The SMD ("Surface Mounted Device") contact element is

In particular, an electrically conductive element, which is attached by means of a surface mounting technology (also referred to as "Surface Mounting Technology", SMT) to the substrate and for electrical connection of the substrate with the

Driver board is used. The SMD contact element may in particular be a reflow-enabled element or an element that has been attached to the substrate by means of a reflow method (also known as reflow soldering or reflow soldering). The SMD contact element may in particular on a conductor track (including, for example, a contact pad or

Contact pad) of the substrate, e.g. by

Reflow soldering.

That the at least one SMD contact element in a region of the front side of the substrate with a through a

Carrying guided guided electrical conductor may mean in particular that an SMD contact element is connected to an electrical conductor at or in front of the front side of the substrate.

The type of attachment other than the surface mount technique may include, for example, press fitting, welding, laser soldering, and so on. It is a preferred embodiment for particularly simple soldering that the SMD contact element is coated with a low-melting metal alloy.

It is an embodiment that at least one SMD contact element is a metallic plate, e.g. a thin slice. This plate allows by increasing the

Metal layer thickness in particular a welding of the guided through the implementation of electrical conductor.

Conventional, thin traces of the substrate can

however, be destroyed during welding. The guided through the implementation of electrical conductors like to

in particular be bent.

It is still an embodiment that at least one SMD contact element is an upstanding from the substrate element. This allows the guided through the implementation

electrical conductors are contacted without a bend, especially in front of the front. The high-level SMD contact element particularly likes this in a room area protrude above the implementation and in particular contact the electrical conductor in this area, for example by welding or soldering.

It is an embodiment of that the at least one SMD contact element at least one L-shaped or

staircase-shaped SMD contact element comprises. This allows a simple way of providing a particularly large contact surface with the guided through the implementation of electrical conductors

However, the SMD contactor may also have any other suitable shape, e.g. be arcuate. Thus, it is a further embodiment that the at least one SMD contact element comprises at least one wire-shaped SMD contact element. This allows a particularly easy flexibility in all

Directions. In particular, a blunt, i.

frontal attachment of the contact element with the

electrical conductor as well as a tangential attachment (i.e., in particular, that the contact element and the

electrical conductors at least in sections in their

Longitudinal extent parallel) possible. While a blunt attachment is space-saving and due to the small contact surface allows a simple and fast connection, a tangential attachment is particularly stable executable and thus relatively insensitive

Relative movements of substrate and driver board.

It is yet another embodiment that at least one SMD contact element is a clamping element. The one by the

Carrying guided electrical conductor can be clamped while performing without further action with the SMD clamping element and thus firmly with this mechanical and

be electrically connected.

It is still a development that the SMD contact element is a latching element. It is also an embodiment that the driver board is arranged perpendicular to the substrate. This allows a compact arrangement, a vertical positioning of the electrical conductor and a little error-prone

Contact with the SMD contact element. This embodiment is particularly suitable for lighting devices in which the driver board is housed in a driver cavity and wherein the substrate can serve as a closure or cover of this driver cavity. This embodiment is

especially suitable for retrofit lamps, e.g. For

Incandescent or halogen lamp retrofit lamps.

It is also an embodiment that the driver board has at least one contact region which represents the electrical conductor routed through the bushing. The electrical conductor passed through the feedthrough is therefore here a subarea of the driver board itself, e.g. a tab-shaped or band-shaped contact area. This eliminates the need for a separate intermediate element. The contact area can be metallized on one or two sides. In the case of a two-sided metallization of the contact region, one side or both sides may be contacted by an SMD contact element. Thus, both sides may be contacted by a respective SMD contact element, e.g. by soldering, pressing or welding.

The contact region is preferably connected directly to the at least one SMD contact element (and not, for example, via another electrical connection element) to form a

Installation effort to keep particularly low. A direct one

Contacting includes in particular a contact via a solder or other electrical

conductive adhesion promoter. It is also an embodiment that by the

Carrying guided electrical conductor is an electrical connection element which is electrically connected to the driver board. The connecting element is so too electrically connected to the driver board, but no

Part of the driver board. Rather, the connecting element may be a self-manufactured, electrically

be a conductive element that is in a dedicated

Manufacturing step has been connected to the driver board, e.g. by a surface mounting technique, welding (in particular laser welding), soldering, etc. This embodiment has the advantage that the shape and / or the

Properties of the electrical conductor are highly variable. Thus, the electrical connection element may be e.g. be a bright, flexible wire. It is preferred for safe compliance with larger creepage distances and creepage distances that the

electrical connection element is electrically isolated, e.g. A cable with one wire or with multiple wires.

The electrical connection element is preferred

Cohesively connected to the driver board, in particular by means of a soldering and / or a welded connection,

Laser soldering or laser welding, which is easy to automate.

It is advantageous for a particularly compact construction if a connecting element provides only a single electrical path, that is, in particular has only exactly one core.

The invention is particularly advantageous applicable when the lighting device is a lamp, in particular a halogen or an incandescent lamp retrofit lamp. The lamp likes

For example, have a driver cavity, in which the driver board is housed. The substrate may serve as a closure or cover of this driver cavity. This embodiment is particularly suitable for retrofit lamps, e.g. for incandescent or halogen lamp retrofit lamps. The front of the substrate may be e.g. of a

be covered by translucent piston.

However, the lighting device may also be an LED module or a light. The problem is also solved by a method for

Producing a lighting device as described above, wherein the method comprises at least the following steps

comprising: attaching at least one SMD contact element on the front side of the substrate by means of a

Surface mounting technique (e.g., by reflow soldering);

Passing at least one electrical conductor through at least one feedthrough from the backside of the substrate; and connecting the at least one electrical conductor to at least one SMD contact element in a region of the front side of the substrate by means of another

Mounting method as the surface mounting technique. This task can be produced analogously to the lighting device and has the same advantages.

The above-described characteristics, features and advantages of this invention as well as the manner in which they are achieved will become clearer and more clearly understood

In connection with the following schematic description of exemplary embodiments that are associated with the

Drawings are explained in more detail. It can to

Clarity identical or equivalent elements must be provided with the same reference numerals.

Fig.l outlined as a sectional view in

Side view of a lighting device in the form of a filament retrofit lamp with a driver board and a

Semiconductor light source carrying substrate; and

FIGS. 2 to 7 show oblique views of first to fifth possible embodiments of the incandescent light retrofit lamp from FIG

electrical connection between the

Driver board and the substrate according to a first to fifth embodiment. Fig.l shows a sectional side view of a lighting device in the form of a filament retrofit lamp 1 with a driver board 2 and a semiconductor light source in the form of LED chips 3 supporting substrate in the form of a

Metal core board 4.

The driver board 2 is in a front side open

Driver cavity 5 of a housing 6 housed. The housing 6 may be designed, for example, in two parts, so that the driver cavity 5 can be opened.

The housing 6 may also be formed as a heat sink, e.g. by an external cooling structure, e.g.

having cooling fins. At the rear of the housing 6 is a base 7 for connection to a socket e.g. a luminaire, via which base 7 the incandescent retrofit lamp 1 can be supplied with electrical energy, e.g. to one

Mains voltage can be connected. The base 7 may e.g. be an Edison socket or a bipin socket. The driver board 2 is formed as FR4 board and is equipped with electrical and electronic components (eg, a microcontroller, IC, etc.) 8, which is suitable for converting an electrical signal received through the socket 7 in a suitable for operating the LED chips 3 electrical Signal serve. The LED chips 3 are mounted on a front side 9 of the metal core board 4, while the

Metal core board 4 rests with its rear side facing away from 10 on the housing 6. For electrical connection of the driver board 2 with the

Metal core board 4 and the LED chips 3 arranged thereon, the driver cavity 5 is provided on the front side with at least one opening 11, and the metal core board 4 has congruents thereto passages 12. By the

At least one opening 11 and associated at least one passage 12, at least one electrical conductor 13 is guided, which is connected to the driver board 2 and was already connected before the driver board 2 in the driver cavity 5 has been used. The insertion of the electrical conductor 13 happens, for example, at

Inserting the driver board 4 in the driver cavity 5. The electrical conductor 13 is then the front of the

Metal core board 4 before. In the assembled state is the

Driver board 2 perpendicular to the metal core board 4 and is spaced therefrom.

For electrically connecting the electrical conductor 13 to the metal core board 4, in particular a conductor track or a conductor track section thereof, the electrical conductor 13 contacts an electrically conductive element (hereinafter referred to as "SMD contact element" 14 without restriction of generality), which is also connected to the Metal core board 4. The connection of the SMD contact element 14 with the metal core board 4 is connected by a connection in

Surface mount technologist or SMT connection achieved. For this purpose, the SMD contact element 14 may have been connected to the metal core plate 4 by means of a reflow soldering process before the thus equipped metal core board 4 is married to the housing 6.

The electrical connection of the electrical conductor 13 with the SMD contact element 14 is done via others

Types of connection as a surface mounting technology, in particular by means of a laser welding or

Laser soldering.

2 shows a first possible embodiment of

electrical connection between the metal core board 4 and the driver board 2 with the SMD contact element 13 of

Incandescent retrofit lamp 1. The driver board 2 is electrically connected to two electrical conductors 13 in the form of separately prepared electrical connection elements in the form of single-core wires 15, for example by soldering or welding. The wires 15 are stripped only at the ends and otherwise have an electrically insulating jacket 16. The wires 15 protrude through respective bushings 12 in the

Metal core board 4 and are bent over the front.

On the metal core board 4 is in the range of

front end of the wires 15 each have a SMD

Contact element 14 in the form of a thin metal plate 17 is present. The metal plates 17 have been applied to the metal core board 4 by means of a reflow process. They cause a material reinforcement at the contact with the respective wire 15, so that the wire 15 without destruction of a located below the metal plate 17

Track section of the metal core board 4 laser weldable or laser solderable with the metal plate 17 and thus also with the metal core board 4 electrically and mechanically

is connectable. The connection process can be automated.

3 shows a second possible embodiment of

electrical connection between the metal core board 4 and the driver board 2. The wires 15 are now not bent, but straight through the passages 12 of the

Metal core board 4 passed. Therefore, there is a front, stripped end portion 18 of the wires 15 in front of the front side 9 of the metal core board 4. To contact them on the front side 9 of the metal core board 4 respective SMD contact elements 14 in the form of stepped

upstanding metal bodies 19 present. These protrude into the space above the ducts 12 and are located

therefore close to or contacting the

stripped end portions 18 of the wires 15. The

Stepped upstanding metal body 19 can then be easily welded or soldered to the stripped end portion 18, in particular in the context of an automatically running production step. 4 shows a third possible embodiment of

electrical connection between the metal core board 4 and the driver board 2. The driver board 2 now has two tab-shaped areas, hereinafter referred to as 20, which project through the feedthroughs 12 in an area on the front side 9 of the metal-core board 4. In this case, a separately produced connecting element can be dispensed With, since the contact areas 20 are stiff, they are also suitable for clamping Contacting with a respective SMD contact element 14. The contact regions 20 can be metallized on one side or on both sides. The SMD contact elements 14 are here reflow-soldered

Clamping elements 21 attached to the front side 9 of the metal core board 4, in particular to a respective one

Track section. This connection variant is particularly easy to implement. Thus, first, the driver board 2 may be inserted into the driver cavity 5 and fixed there. Then she likes

Metal core board 4 are placed so that the

Contact areas 20 through the bushings 12 in the

Retract clamping elements 21 and get into a clamping engagement with these.

5 shows a fourth possible embodiment of

electrical connection between the metal core board 4 and the driver board 2. Here are now serving as electrical conductors 13 contact areas 20 with respective SMD contact elements 14 in the form of stepped upstanding metal bodies 19 electrically and mechanically connected, e.g. by a welded joint or a solder joint, in particular by means of a laser.

6 shows a fifth possible embodiment of

electrical connection between the metal core board 4 and the driver board 2. Here are now serving as electrical conductor 13 contact areas 20 with respective SMD

Contact elements 14 in the form of curved tubes or

Wires 22 electrically and mechanically connected, for example by a welded joint or a solder joint, in particular by means of a laser. The wires 22 have been previously fixed to the metal core board 4 at the other end thereof by a surface mount technique. FIG. 7 shows two further embodiments of the connection between contact regions 20 serving as electrical conductors 13 with respective SMD contact elements 14 in the form of FIG

curved tubes or wires 22. In the upper and in the lower embodiment shown in Fig. 7, the curved wire 22 is not connected as in Fig. 6 butt with the contact portion 20, but tangentially brought to this. This allows a large-area connection, which is mechanically very stable and also allows the transmission of large currents. In the upper embodiment is on

Contact area 20 a solder 23 applied, by means of which the connection between the contact region 20 and wire 22 is made. The lower embodiment shows an embodiment in which two wires 22 with a

Contact area 20 are welded. Of course, here is a tinning of the contact area denkbvar, wqie conversely, a single wire of course

can be welded. Also shown schematically is the preferred direction from which a laser acts on the connection. This depends on the connection geometry, i. In the case of a geometry according to FIGS. 3 and 5, an action parallel to the longitudinal extension of the electrical conductor 13 is preferred, while in the exemplary embodiments according to FIG. 7 an action orthogonal thereto, in particular from a direction in which the electrical conductor is partially or completely covered by the wire 22 will, benefit.

Although the invention shown in detail by

Embodiments have been further illustrated and described, the invention is not limited thereto and other variations can be derived therefrom by those skilled in the art without departing from the scope of the invention. Generally, "on", "an", etc. may be taken to mean a singular or a plurality, in particular in the sense of "at least one" or "one or more", etc., as long as this is not explicitly excluded, eg by the expression "exactly a "etc.

Also, a number may include exactly the specified number as well as a usual tolerance range, as long as this is not explicitly excluded.

Reference sign

1 incandescent retrofit lamp

2 driver board

3 LED chip

4 metal core board

5 driver cavity

6 housing

7 sockets

8 electrical and / or electronic component

9 Front side of the metal core board

10 remote rear side of the metal core board

11 opening

12 implementation

13 electrical conductors

14 SMD contact element

15 single-core wire

16 electrically insulating jacket

17 metal tiles

18 end section

19 high-standing metal body

20 contact area

21 clamping element

22 wire

Claims

Lighting device (1), comprising

- a substrate (4) with a front side (9).

Arrangement of at least one semiconductor light source (3), with a back (10) and with at least one feedthrough (12) between the front (9) and the back (10) and having

- one on the back (10) of the substrate (4)

arranged driver board

(2) for order

at least one electrical and/or electronic component (8) for operating the at least one semiconductor light source

(3), which driver board (2) is electrically connected to the substrate (4), where

- the substrate (4) has on its front side (9) at least one SMD contact element (14) attached to it using a surface mounting technique and where

- The at least one SMD contact element (14) in an area of the front side (9) of the substrate (4) by means of a different type of fastening than that

Surface mount technology with one by one

Electrical conductor (13) is connected to the bushing (12),

- Wherein the electrical conductor (13) establishes an electrical connection from the SMD contact element (14) to the driver board (2).

Lighting device (1) according to claim 1, wherein at least one SMD contact element (14) is a metallic plate (17).

Lighting device (1) according to one of the preceding claims, wherein at least one SMD contact element (14) is an element (19; 21; 22) projecting from the substrate.

4. Lighting device (1) according to claim 3, wherein the

at least one SMD contact element (14) comprises at least one L-shaped or step-shaped SMD contact element (19).

5. Lighting device (1) according to one of claims 3 or 4, wherein the at least one SMD contact element (14) comprises at least one wire-shaped SMD contact element (22).

6. Lighting device (1) according to one of the preceding

Claims, wherein at least one SMD contact element (14) is a clamping element (21).

7. Lighting device (1) according to one of the preceding

Claims, wherein the driver board (2) is arranged perpendicular to the substrate (4).

8. Lighting device (1) according to one of the preceding

Claims, wherein the driver board (2) has at least one contact area (20), which represents the electrical conductor (13) guided through the feedthrough (12) and which is connected directly to the at least one SMD contact element (19; 21).

9. Lighting device (1) according to one of the preceding

Claims, whereby the implementation (12)

guided electrical conductor (13) an electrical

Connecting element (15) is electrically connected to the driver board (4).

10. Lighting device (1) according to one of the preceding

Claims, wherein the other type of fastening is a

Welding, in particular laser welding, and/or soldering.

11. Lighting device (1) according to one of the preceding

Claims, wherein the lighting device (1) is a lamp, in particular a halogen or incandescent retrofit lamp.

Method for producing a lighting device (1) according to one of the preceding claims, wherein the method has at least the following steps:

- Attaching at least one SMD contact element (14) to the front (9) of the substrate (4) using a surface mounting technique;

- Passing at least one electrical conductor (13) through at least one feedthrough (12) from the back (10) of the substrate (4); and

- Connecting the at least one electrical conductor (13) to at least one SMD contact element (14) in an area of the front side (9) of the substrate (4) by means of a different type of fastening than that

Surface mount technology.