WO2015007904A1 - Dispositif d'éclairage muni d'une source lumineuse à semi-conducteurs et d'une carte de commande - Google Patents

Dispositif d'éclairage muni d'une source lumineuse à semi-conducteurs et d'une carte de commande Download PDF

Info

Publication number
WO2015007904A1
WO2015007904A1 PCT/EP2014/065557 EP2014065557W WO2015007904A1 WO 2015007904 A1 WO2015007904 A1 WO 2015007904A1 EP 2014065557 W EP2014065557 W EP 2014065557W WO 2015007904 A1 WO2015007904 A1 WO 2015007904A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
contact element
lighting device
smd contact
smd
Prior art date
Application number
PCT/EP2014/065557
Other languages
German (de)
English (en)
Inventor
Georg Rosenbauer
Johannes Hoechtl
Marcel Vuc
Original Assignee
Osram Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Gmbh filed Critical Osram Gmbh
Publication of WO2015007904A1 publication Critical patent/WO2015007904A1/fr

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
    • F21V23/002—Arrangements of cables or conductors inside a lighting device, e.g. means for guiding along parts of the housing or in a pivoting arm
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/006—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F21Y2105/14—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array
    • F21Y2105/16—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array square or rectangular, e.g. for light panels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/048—Second PCB mounted on first PCB by inserting in window or holes of the first PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1028—Thin metal strips as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors

Definitions

  • Lighting device with semiconductor light source
  • the invention relates to a lighting device, comprising a substrate having a front side for the arrangement of at least one semiconductor light source, with a rear side and with at least one passage between the front side and the rear side and having one at the rear side of the substrate
  • driver board [to the arrangement of at least one electrical and / or electronic component for
  • the invention further relates to a method for producing such a lighting device.
  • the invention is particularly advantageous for use with, in particular, lamps, in particular retrofit lamps, in particular
  • the SMD contact element is a plug, which is guided through a recess and contacted the driver plugged.
  • the driver has a matching mating connection.
  • These lighting devices have the disadvantage that such a plug solution requires a lot of space at the front of the substrate and is also expensive.
  • Contact elements are e.g. available from the company JAE, e.g. in the series “ES3" ("LED power supply card edge type connector ES3 series”). Furthermore, lighting devices are known which comprise a substrate having a front side for arranging at least one
  • Semiconductor light source with a back and at least one passage between the front and the back and further comprising a drive board arranged on the rear side of the substrate [for arranging at least one electrical and / or electronic component for
  • the substrate and driver board are interconnected by means of several cables which are manually soldered.
  • Such an electrical connection is not easy to automate. Rather, a high installation and manufacturing effort is needed. Therefore, such are also
  • a lighting device comprising a substrate with a front side for the arrangement of at least one semiconductor light source, with a rear side and with at least one passage between the
  • driver board is electrically connected to the substrate, wherein the substrate is at its
  • Front has at least one surface mounted by a surface mounted SMD contact element and wherein the at least one SMD contact element in a region of
  • the electrical conductor makes an electrical connection from the SMD contact element to the driver board.
  • the substrate is versatilely electrically connectable to the driver board such that e.g. the substrate is particularly flexible interpretable with respect to different designs.
  • the electrical connection between the substrate and the driver board is automated, in particular contactless. Through automation, short cycle times can be achieved during production.
  • the substrate (which may also be referred to as a "mounting substrate", for example) may be, for example, a ceramic substrate or a printed circuit board
  • the substrate may be a metal core PCB (MCPCB)
  • the front and / or back of the substrate may be flat or curved.
  • the driver board may be e.g. an inexpensive FR4 board.
  • the driver board may in particular be equipped with at least one electrical and / or electronic component for operating the at least one semiconductor light source.
  • the driver board may also be referred to as control electronics, drivers, etc.
  • the driver board may be disposed in contact with the substrate or spaced from the substrate (and, for example, also separated by a baffle).
  • the feedthrough may be circumferentially enclosed by the material of the substrate, but is not limited thereto, but may also be formed, for example, on the edge contour of the substrate.
  • Semiconductor light source at least one light emitting diode.
  • a color may be monochrome (e.g., red, green, blue, etc.) or multichrome (e.g., white). This can also be done by the at least one
  • LED emitted light is an infrared light (IR LED) or an ultraviolet light (UV LED).
  • Light emitting diodes can produce a mixed light; e.g. a white mixed light.
  • the at least one light-emitting diode may contain at least one wavelength-converting phosphor
  • the phosphor may alternatively or additionally be arranged away from the light-emitting diode
  • the at least one light-emitting diode can be in the form of at least one individually housed light-emitting diode or in the form of at least one LED chip. Several LED chips can be mounted on a common substrate (“submount").
  • the at least one light emitting diode may be equipped with at least one own and / or common optics for beam guidance, e.g. at least one Fresnel lens,
  • organic LEDs can generally also be used.
  • the at least one semiconductor light source may be e.g. have at least one diode laser.
  • the SMD Surface Mounted Device
  • an electrically conductive element which is attached by means of a surface mounting technology (also referred to as “Surface Mounting Technology", SMT) to the substrate and for electrical connection of the substrate with the SMT.
  • SMT Surface Mounting Technology
  • the SMD contact element may in particular be a reflow-enabled element or an element that has been attached to the substrate by means of a reflow method (also known as reflow soldering or reflow soldering).
  • the SMD contact element may in particular on a conductor track (including, for example, a contact pad or
  • Carrying guided guided electrical conductor may mean in particular that an SMD contact element is connected to an electrical conductor at or in front of the front side of the substrate.
  • the type of attachment other than the surface mount technique may include, for example, press fitting, welding, laser soldering, and so on. It is a preferred embodiment for particularly simple soldering that the SMD contact element is coated with a low-melting metal alloy.
  • At least one SMD contact element is a metallic plate, e.g. a thin slice. This plate allows by increasing the
  • Metal layer thickness in particular a welding of the guided through the implementation of electrical conductor.
  • At least one SMD contact element is an upstanding from the substrate element. This allows the guided through the implementation
  • the high-level SMD contact element particularly likes this in a room area protrude above the implementation and in particular contact the electrical conductor in this area, for example by welding or soldering.
  • staircase-shaped SMD contact element comprises. This allows a simple way of providing a particularly large contact surface with the guided through the implementation of electrical conductors
  • the SMD contactor may also have any other suitable shape, e.g. be arcuate.
  • the at least one SMD contact element comprises at least one wire-shaped SMD contact element. This allows a particularly easy flexibility in all
  • At least one SMD contact element is a clamping element.
  • Carrying guided electrical conductor can be clamped while performing without further action with the SMD clamping element and thus firmly with this mechanical and
  • the SMD contact element is a latching element. It is also an embodiment that the driver board is arranged perpendicular to the substrate. This allows a compact arrangement, a vertical positioning of the electrical conductor and a little error-prone
  • This embodiment is particularly suitable for lighting devices in which the driver board is housed in a driver cavity and wherein the substrate can serve as a closure or cover of this driver cavity.
  • This embodiment is particularly suitable for lighting devices in which the driver board is housed in a driver cavity and wherein the substrate can serve as a closure or cover of this driver cavity.
  • Incandescent or halogen lamp retrofit lamps Incandescent or halogen lamp retrofit lamps.
  • the driver board has at least one contact region which represents the electrical conductor routed through the bushing.
  • the electrical conductor passed through the feedthrough is therefore here a subarea of the driver board itself, e.g. a tab-shaped or band-shaped contact area. This eliminates the need for a separate intermediate element.
  • the contact area can be metallized on one or two sides. In the case of a two-sided metallization of the contact region, one side or both sides may be contacted by an SMD contact element. Thus, both sides may be contacted by a respective SMD contact element, e.g. by soldering, pressing or welding.
  • the contact region is preferably connected directly to the at least one SMD contact element (and not, for example, via another electrical connection element) to form a
  • Contacting includes in particular a contact via a solder or other electrical
  • Carrying guided electrical conductor is an electrical connection element which is electrically connected to the driver board.
  • the connecting element is so too electrically connected to the driver board, but no
  • the connecting element may be a self-manufactured, electrically
  • Manufacturing step has been connected to the driver board, e.g. by a surface mounting technique, welding (in particular laser welding), soldering, etc.
  • This embodiment has the advantage that the shape and / or the
  • electrical connection element is electrically isolated, e.g. A cable with one wire or with multiple wires.
  • the electrical connection element is preferred
  • a connecting element provides only a single electrical path, that is, in particular has only exactly one core.
  • the invention is particularly advantageous applicable when the lighting device is a lamp, in particular a halogen or an incandescent lamp retrofit lamp.
  • the lamp likes
  • driver cavity in which the driver board is housed.
  • the substrate may serve as a closure or cover of this driver cavity.
  • This embodiment is particularly suitable for retrofit lamps, e.g. for incandescent or halogen lamp retrofit lamps.
  • the front of the substrate may be e.g. of a
  • the lighting device may also be an LED module or a light.
  • the problem is also solved by a method for
  • FIGS. 2 to 7 show oblique views of first to fifth possible embodiments of the incandescent light retrofit lamp from FIG.
  • Fig.l shows a sectional side view of a lighting device in the form of a filament retrofit lamp 1 with a driver board 2 and a semiconductor light source in the form of LED chips 3 supporting substrate in the form of a
  • the driver board 2 is in a front side open
  • the housing 6 may be designed, for example, in two parts, so that the driver cavity 5 can be opened.
  • the housing 6 may also be formed as a heat sink, e.g. by an external cooling structure, e.g.
  • a base 7 for connection to a socket e.g. a luminaire, via which base 7 the incandescent retrofit lamp 1 can be supplied with electrical energy, e.g. to one
  • the base 7 may e.g. be an Edison socket or a bipin socket.
  • the driver board 2 is formed as FR4 board and is equipped with electrical and electronic components (eg, a microcontroller, IC, etc.) 8, which is suitable for converting an electrical signal received through the socket 7 in a suitable for operating the LED chips 3 electrical Signal serve.
  • the LED chips 3 are mounted on a front side 9 of the metal core board 4, while the
  • Metal core board 4 rests with its rear side facing away from 10 on the housing 6.
  • the driver cavity 5 is provided on the front side with at least one opening 11, and the metal core board 4 has congruents thereto passages 12.
  • At least one opening 11 and associated at least one passage 12, at least one electrical conductor 13 is guided, which is connected to the driver board 2 and was already connected before the driver board 2 in the driver cavity 5 has been used.
  • the insertion of the electrical conductor 13 happens, for example, at
  • Driver board 2 perpendicular to the metal core board 4 and is spaced therefrom.
  • the electrical conductor 13 For electrically connecting the electrical conductor 13 to the metal core board 4, in particular a conductor track or a conductor track section thereof, the electrical conductor 13 contacts an electrically conductive element (hereinafter referred to as "SMD contact element" 14 without restriction of generality), which is also connected to the Metal core board 4.
  • SMD contact element electrically conductive element
  • the SMD contact element 14 may have been connected to the metal core plate 4 by means of a reflow soldering process before the thus equipped metal core board 4 is married to the housing 6.
  • Types of connection as a surface mounting technology, in particular by means of a laser welding or
  • Incandescent retrofit lamp 1 The driver board 2 is electrically connected to two electrical conductors 13 in the form of separately prepared electrical connection elements in the form of single-core wires 15, for example by soldering or welding.
  • the wires 15 are stripped only at the ends and otherwise have an electrically insulating jacket 16.
  • the wires 15 protrude through respective bushings 12 in the
  • Metal core board 4 and are bent over the front.
  • Contact element 14 in the form of a thin metal plate 17 is present.
  • the metal plates 17 have been applied to the metal core board 4 by means of a reflow process. They cause a material reinforcement at the contact with the respective wire 15, so that the wire 15 without destruction of a located below the metal plate 17
  • connection process can be automated.
  • Metal core board 4 passed. Therefore, there is a front, stripped end portion 18 of the wires 15 in front of the front side 9 of the metal core board 4. To contact them on the front side 9 of the metal core board 4 respective SMD contact elements 14 in the form of stepped
  • upstanding metal bodies 19 present. These protrude into the space above the ducts 12 and are located
  • Stepped upstanding metal body 19 can then be easily welded or soldered to the stripped end portion 18, in particular in the context of an automatically running production step.
  • 4 shows a third possible embodiment of
  • the driver board 2 now has two tab-shaped areas, hereinafter referred to as 20, which project through the feedthroughs 12 in an area on the front side 9 of the metal-core board 4.
  • a separately produced connecting element can be dispensed With, since the contact areas 20 are stiff, they are also suitable for clamping Contacting with a respective SMD contact element 14.
  • the contact regions 20 can be metallized on one side or on both sides.
  • the SMD contact elements 14 are here reflow-soldered
  • Clamping elements 21 attached to the front side 9 of the metal core board 4, in particular to a respective one
  • This connection variant is particularly easy to implement.
  • the driver board 2 may be inserted into the driver cavity 5 and fixed there. Then she likes
  • Metal core board 4 are placed so that the
  • Wires 22 electrically and mechanically connected, for example by a welded joint or a solder joint, in particular by means of a laser.
  • the wires 22 have been previously fixed to the metal core board 4 at the other end thereof by a surface mount technique.
  • FIG. 7 shows two further embodiments of the connection between contact regions 20 serving as electrical conductors 13 with respective SMD contact elements 14 in the form of FIG.
  • curved tubes or wires 22 In the upper and in the lower embodiment shown in Fig. 7, the curved wire 22 is not connected as in Fig. 6 butt with the contact portion 20, but tangentially brought to this. This allows a large-area connection, which is mechanically very stable and also allows the transmission of large currents. In the upper embodiment is on
  • the lower embodiment shows an embodiment in which two wires 22 with a
  • connection geometry i. In the case of a geometry according to FIGS. 3 and 5, an action parallel to the longitudinal extension of the electrical conductor 13 is preferred, while in the exemplary embodiments according to FIG. 7 an action orthogonal thereto, in particular from a direction in which the electrical conductor is partially or completely covered by the wire 22 will, benefit.
  • a number may include exactly the specified number as well as a usual tolerance range, as long as this is not explicitly excluded.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

L'invention concerne un dispositif d'éclairage (1) qui comprend un substrat (4) présentant une face avant (9) servant à l'agencement d'au moins une source lumineuse à semi-conducteurs (3), une face arrière (10) et au moins une ouverture (12), et qui comprend une carte de commande (2) agencée sur la face arrière pour l'agencement d'au moins un composant électrique et/ou électronique (8) permettant de faire fonctionner la ou les sources lumineuses à semi-conducteurs. Le substrat présente sur sa face avant au moins un élément de contact CMS (14) qui est fixé par une technique de montage en surface et qui est connecté au moyen d'un autre type de fixation dans une partie de la face avant du substrat à un conducteur électrique (13) passant par l'ouverture, le conducteur électrique établissant une connexion entre l'élément de contact CMS et la carte de commande (2). Un procédé selon l'invention consiste à monter un élément de contact CMS sur la face avant (9) du substrat (4) au moyen d'une technique de montage en surface, à introduire un conducteur électrique (13) à travers l'ouverture (12), et à connecter le conducteur électrique (13) à l'élément de contact CMS (14) dans une partie de la face avant du substrat (4) au moyen d'un autre type de fixation.
PCT/EP2014/065557 2013-07-19 2014-07-18 Dispositif d'éclairage muni d'une source lumineuse à semi-conducteurs et d'une carte de commande WO2015007904A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102013214236.6A DE102013214236A1 (de) 2013-07-19 2013-07-19 Leuchtvorrichtung mit Halbleiterlichtquelle und Treiberplatine
DE102013214236.6 2013-07-19

Publications (1)

Publication Number Publication Date
WO2015007904A1 true WO2015007904A1 (fr) 2015-01-22

Family

ID=51211245

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2014/065557 WO2015007904A1 (fr) 2013-07-19 2014-07-18 Dispositif d'éclairage muni d'une source lumineuse à semi-conducteurs et d'une carte de commande

Country Status (2)

Country Link
DE (1) DE102013214236A1 (fr)
WO (1) WO2015007904A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104913274A (zh) * 2015-06-15 2015-09-16 立达信绿色照明股份有限公司 Led光源驱动板
DE102015117007B3 (de) 2015-10-06 2017-03-30 Bjb Gmbh & Co. Kg Befestigungselement
DE102016124492A1 (de) * 2016-08-15 2018-02-15 Guido Kellermann Produktentwicklung & Handel E. K. Motorradleuchte
DE102018101599A1 (de) * 2018-01-24 2019-07-25 Ledvance Gmbh Leuchtvorrichtung mit Steckverbindung zur elektrischen Verbindung zweier Platinen
JP2022147293A (ja) 2021-03-23 2022-10-06 東芝ライテック株式会社 車両用照明装置、および車両用灯具

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2224161A1 (fr) * 2009-02-27 2010-09-01 Toshiba Lighting & Technology Corporation Dispositif d'éclairage et accessoire d'éclairage
EP2270385A1 (fr) * 2009-06-30 2011-01-05 Toshiba Lighting & Technology Corporation Lampe
EP2302285A2 (fr) * 2009-09-25 2011-03-30 Toshiba Lighting & Technology Corporation Module électroluminescent, lampe à lumière mixte et équipement d'éclairage
US20120069545A1 (en) * 2010-11-08 2012-03-22 Lg Innotek Co., Ltd. Lighting device
US20120230034A1 (en) * 2011-03-07 2012-09-13 Lighting Science Group Corporation Led luminaire
US20120287632A1 (en) * 2011-01-25 2012-11-15 Kenji Takahashi Lamp light source
WO2012160731A1 (fr) * 2011-05-20 2012-11-29 パナソニック株式会社 Lampe
WO2013009049A2 (fr) * 2011-07-08 2013-01-17 Lg Innotek Co., Ltd. Dispositif d'éclairage
WO2013051208A1 (fr) * 2011-10-06 2013-04-11 パナソニック株式会社 Lampe et équipement d'éclairage

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE20106055U1 (de) * 2001-04-06 2001-06-21 Vogt Electronic Ag Leuchtmittelaufbau
US7758223B2 (en) * 2005-04-08 2010-07-20 Toshiba Lighting & Technology Corporation Lamp having outer shell to radiate heat of light source
DE102008039365A1 (de) * 2008-08-22 2010-03-04 Osram Gesellschaft mit beschränkter Haftung Leuchtvorrichtung
DE102010028481A1 (de) * 2010-05-03 2011-11-03 Osram Gesellschaft mit beschränkter Haftung Elektronikgehäuse für eine Lampe, Halbleiterlampe und Verfahren zum Vergießen eines Elektronikgehäuses für eine Lampe
DE102011016458A1 (de) * 2011-04-08 2012-10-11 Wago Verwaltungsgesellschaft Mbh Leiteranschlussstecker, Steckverbinder und Set aus Leiteranschlussstecker und Steckverbinder

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2224161A1 (fr) * 2009-02-27 2010-09-01 Toshiba Lighting & Technology Corporation Dispositif d'éclairage et accessoire d'éclairage
EP2270385A1 (fr) * 2009-06-30 2011-01-05 Toshiba Lighting & Technology Corporation Lampe
EP2302285A2 (fr) * 2009-09-25 2011-03-30 Toshiba Lighting & Technology Corporation Module électroluminescent, lampe à lumière mixte et équipement d'éclairage
US20120069545A1 (en) * 2010-11-08 2012-03-22 Lg Innotek Co., Ltd. Lighting device
US20120287632A1 (en) * 2011-01-25 2012-11-15 Kenji Takahashi Lamp light source
US20120230034A1 (en) * 2011-03-07 2012-09-13 Lighting Science Group Corporation Led luminaire
WO2012160731A1 (fr) * 2011-05-20 2012-11-29 パナソニック株式会社 Lampe
WO2013009049A2 (fr) * 2011-07-08 2013-01-17 Lg Innotek Co., Ltd. Dispositif d'éclairage
WO2013051208A1 (fr) * 2011-10-06 2013-04-11 パナソニック株式会社 Lampe et équipement d'éclairage

Also Published As

Publication number Publication date
DE102013214236A1 (de) 2015-01-22

Similar Documents

Publication Publication Date Title
EP3167224B1 (fr) Lampe à semi-conducteur
EP2815177B1 (fr) Module d'éclairage
EP2531772A1 (fr) Plaquette de circuits imprimés comportant au moins une source de lumière à semi-conducteurs, support pour la plaquette, système composé de la plaquette et du support et procédé pour fixer la plaquette sur le support
DE102010030702A1 (de) Halbleiterlampe
DE102013203666B4 (de) Leuchtband mit bandförmigem Substrat
WO2015007904A1 (fr) Dispositif d'éclairage muni d'une source lumineuse à semi-conducteurs et d'une carte de commande
EP2347639B1 (fr) Dispositif d'éclairage avec deux cartes de circuits
EP2732209B1 (fr) Moyen d'éclairage comportant au moins une diode électroluminescente organique
WO2016091432A1 (fr) Lampe à carte pilote et embase
DE102010043220A1 (de) Leuchtvorrichtung und Verfahren zum Zusammenbauen einer Leuchtvorrichtung
WO2014056834A1 (fr) Procédé de fabrication d'une unité de production de lumière
EP2613079A1 (fr) Moyen d'eclairage à DEL
DE102006009812B4 (de) Montageanordnung für mehrere Leistungshalbleiter und Schaltung mit einer solchen Montageanordnung
DE102016203400A1 (de) Lichtmodul
EP2938170A1 (fr) Support pour diode lumineuse SMD
EP2143989B1 (fr) Unité d'éclairage, module DEL et procédé
EP2852791B1 (fr) Dispositif d'éclairage à pilote
WO2017140885A1 (fr) Lampe
EP2694874A1 (fr) Dispositif de fixation et de mise en contact d'une lampe et/ou d'un module lumineux, ainsi que luminaire
WO2014026876A1 (fr) Module lumineux et cache associé
DE102019219943A1 (de) Halogenlampenersatz
DE102012211143A1 (de) Träger für elektrisches bauelement mit wärmeleitkörper
WO2014036579A1 (fr) Dispositif d'éclairage
DE202010010647U1 (de) Y-Kondensator-Einheit und Leuchtvorrichtung mit der Y-Kondensator-Einheit
DE102015118485A1 (de) Elektrische Verbindungseinrichtung

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 14741310

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 14741310

Country of ref document: EP

Kind code of ref document: A1