WO2013051208A1 - Lampe et équipement d'éclairage - Google Patents

Lampe et équipement d'éclairage Download PDF

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Publication number
WO2013051208A1
WO2013051208A1 PCT/JP2012/005994 JP2012005994W WO2013051208A1 WO 2013051208 A1 WO2013051208 A1 WO 2013051208A1 JP 2012005994 W JP2012005994 W JP 2012005994W WO 2013051208 A1 WO2013051208 A1 WO 2013051208A1
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WO
WIPO (PCT)
Prior art keywords
base
insulating sheet
substrate
lamp
light emitting
Prior art date
Application number
PCT/JP2012/005994
Other languages
English (en)
Japanese (ja)
Inventor
吉典 覚野
仕田　智
田村　哲志
松井　伸幸
Original Assignee
パナソニック株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パナソニック株式会社 filed Critical パナソニック株式会社
Priority to JP2013508061A priority Critical patent/JP5319855B1/ja
Publication of WO2013051208A1 publication Critical patent/WO2013051208A1/fr

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V25/00—Safety devices structurally associated with lighting devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
    • F21V23/002—Arrangements of cables or conductors inside a lighting device, e.g. means for guiding along parts of the housing or in a pivoting arm
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/15—Thermal insulation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F21Y2105/14—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array
    • F21Y2105/16—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array square or rectangular, e.g. for light panels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Definitions

  • the present invention relates to a lamp using an LED (light emitting diode) or the like, and more particularly to a technique for improving withstand voltage performance.
  • FIG. 17 (a) is a perspective view of the lamp 1000
  • FIG. 17 (b) is a cross-sectional view of a portion surrounded by an alternate long and short dash line A1 in FIG. 17 (a).
  • the lamp 1000 includes a light emitting module 1010 including a light emitting unit 1013 and a module substrate 1011 on which the light emitting unit 1013 is mounted, and a power supply unit (shown in FIG. And a case 1060 cylindrically formed of metal and housing the power supply unit therein, a base 1020 formed of metal and attached to one end of the case 1060 in the axial direction of the cylinder, and case 1060 And a globe 1030 attached to the housing 1060 so as to cover the light emitting module 1010.
  • the light emitting unit 1013 includes a sealing body 1013 a for sealing a semiconductor light emitting element (not shown) and an electrode portion 1013 b electrically connected to the semiconductor light emitting element.
  • a hole 1011 a is formed in the central portion of the module substrate 1011, and a twisted pair wiring 1043 derived from the power supply unit is connected to a feed terminal 1018 provided on the module substrate 1011 through a connector 1015.
  • the feed terminal 1018 and the electrode portion 1013 b are connected via the wiring pattern 1017.
  • an insulator portion 1072 is interposed between the housing 1060 and the base 1070, and the housing 1060 and the base 1070 are electrically insulated.
  • the module substrate 1011 is configured of a metal substrate 1086 formed in a plate shape of a metal such as aluminum and an insulating sheet 1080 provided on the main surface of the metal substrate 1086. It is done.
  • this light bulb shaped lamp in order to ensure safety, a withstand voltage between the circuit including the light emitting module 1010, the power supply unit and the base 1070, and the housing 1060 is required.
  • a withstand voltage between the circuit including the light emitting module 1010, the power supply unit and the base 1070, and the housing 1060 is required.
  • the lamp since the lamp is sometimes used at a rated voltage of 220 V to 250 V higher than the rated voltage of 100 V to 110 V in Japan, higher breakdown voltage is required.
  • an AC of 4 kV is applied between the cap 1070 and the housing 1060 with the shell 1070a of the cap 1070 and the eyelet 1070c shorted. This is performed by determining whether current flows in the housing 1060 when a voltage (for example, a frequency of 60 Hz) is applied.
  • the shell 1070a and the eyelet 1070c are usually electrically insulated by the insulating portion 1070b.
  • the electrode portion having the smallest distance to the base 1020 in contact with the housing 1060 when the above-described insulation withstand voltage test is performed on the lamp 1000, among the circuits electrically connected to the base 1070, the electrode portion having the smallest distance to the base 1020 in contact with the housing 1060. A creeping discharge may occur between 1013 b and the base 1020 and a desired withstand voltage performance may not be obtained.
  • the minimum value of the creepage distance between the electrode portion 1013b and the metal substrate 1086 in contact with the base 1020 When W is 1.5 mm or less, the rate of occurrence of creeping discharge is greatly increased.
  • the arrangement between the light emitting units 1013 and the base 1020 can be changed by changing the arrangement of the light emitting units 1013 toward the central portion side of the module substrate 1011 or increasing the area of the module substrate 1011. It is conceivable to increase the creeping distance.
  • the arrangement of the light emitting units 1013 is changed so as to be closer to the central portion of the module substrate 1011, there is a possibility that a desired light distribution characteristic can not be obtained.
  • the case 1060 for housing the module substrate 1011 also has to be enlarged, and the lamp 1000 itself is enlarged.
  • the present invention has been made in view of the above, and it is an object of the present invention to provide a lamp capable of improving performance with respect to a withstand voltage test, maintaining light distribution characteristics, and reducing manufacturing costs.
  • the lamp according to the present invention comprises a metal case formed in a cylindrical shape, a power supply unit housed inside the case, and one end of the case in the cylinder axial direction.
  • the insulating sheet intervenes between the two, and in plan view, the peripheral edge of the insulating sheet extends outward beyond the peripheral edge of the substrate at least at a portion where the distance between the peripheral edge of the substrate and the electrode portion is minimum. ing.
  • the peripheral edge of the insulating sheet extends outward beyond the peripheral edge of the substrate at least at a portion where the distance between the peripheral edge of the substrate and the electrode portion is minimized. Since the creeping distance between the portion and the base can be increased by the portion of the insulating sheet extending from the substrate, the withstand voltage between the electrode portion and the base can be improved. Further, since it is not necessary to change the arrangement of the light emitting portion to improve the withstand voltage, it is possible to maintain the light distribution characteristic. Furthermore, since there is no need to change the specification of the substrate, such as increasing the area of the substrate, it is possible to reduce the manufacturing cost of the lamp by making the specifications of the substrate common.
  • the perspective view of the lamp concerning Embodiment 1 The lamp which concerns on Embodiment 1 is shown, (a) is sectional drawing, (b) is principal part sectional drawing.
  • Schematic perspective view of a light emitting module according to Embodiment 1 Sectional drawing and schematic perspective view which show a part of manufacturing process of light emitting module concerning Embodiment 1
  • the perspective view of the lamp concerning Embodiment 2 The lamp
  • the configuration of the lamp 1 according to the present embodiment will be described.
  • FIG. 1 is a perspective view of the lamp 1.
  • FIG. 2A is a cross-sectional view taken along the line A-A 'shown in FIG. FIG.2 (b) is sectional drawing of part A2 enclosed with the dashed-dotted line in FIG. 2 (a).
  • FIG. 3 is a schematic perspective view of the light emitting module 10.
  • the alternate long and short dash line drawn along the vertical direction of the drawing shows the lamp axis J of the lamp 1, and the upper side of the drawing is the front of the lamp 1 and the lower side of the drawing is the rear of the lamp 1. .
  • the state viewed from the front to the rear of the lamp 1 is referred to as a "plan view".
  • the lamp 1 includes a housing 60, a circuit holder 50 disposed inside the housing 60, and a power supply unit 40 housed inside the circuit holder 50.
  • a base 20 attached to a housing 60, a globe 30 disposed to cover the front of the base 20, a base 70 disposed in a state of being electrically insulated from the housing 60, a base And 20 a light emitting module 10 disposed on the front side.
  • the housing 60 is formed of a metal such as aluminum, and has a cylindrical shape with both ends opened and reduced in diameter from the front to the rear.
  • the base 20 and the opening side end 31 of the glove 30 are accommodated in the front side end 60 a of the housing 60.
  • the base 20 is fixed to the housing 60 in a state where a part of the peripheral surface is in contact with the inner peripheral surface 60 b of the housing 60.
  • the outer peripheral surface 25 of the base 20 is tapered according to the shape of the inner peripheral surface 60 b of the housing 60, and is in surface contact with the inner peripheral surface 60 b of the housing 60.
  • the heat generated by the light emitting module 10 can be easily transmitted to the housing 60 through the base 20.
  • the circuit holder 50 is formed of an insulating material such as a synthetic resin, and has a substantially cylindrical shape with both sides opened.
  • the circuit holder 50 includes a large diameter portion 50a, a small diameter portion 50b positioned rearward of the large diameter portion 50a, and a lid 50c covering a front opening of the large diameter portion 50a.
  • the power supply unit 40 is accommodated in the large diameter portion 50a.
  • a base 70 is externally fitted to the small diameter portion 50b.
  • the rear side opening 50 d of the small diameter portion 50 b is closed by the base 70.
  • the power supply unit 40 is for supplying power to the light emitting module 10, and includes a circuit board 40a and various electronic components 40b mounted on the circuit board 40a. . In the drawings, only some electronic components are denoted by reference numerals.
  • the power supply unit 40 is fixed to the circuit holder 50 by screwing, bonding, engagement or the like.
  • Two lead wires 43 a and 43 b connected to the connector 15 are led out from the power supply unit 40.
  • the two lead wires 43a and 43b constitute a twisted pair wiring.
  • the power supply unit 40 and the base 70 are connected via two power supply lines 41a and 41b.
  • the base 20 is formed of a metal such as aluminum and has a substantially disc shape.
  • the base 20 is disposed in a posture in which the central axis coincides with the lamp axis J (see FIG. 2). Therefore, the front surface and the rear surface of the base 20 orthogonal to the lamp axis J are both substantially annular.
  • the outer dimensions of the recess 20 b in a plan view are substantially the same as the outer dimensions of the module substrate 11 of the light emitting module 10.
  • the module substrate 11 is fitted inside the recess 20b.
  • the module substrate 11 is fixed to the bottom of the recess 20 b by the adhesive 22 applied to the bottom of the recess 20 b. Further, a through hole 20c penetrating in the thickness direction of the base 20 and penetrating the lead wires 43a and 43b led from the power supply unit 40 is penetratingly provided in a substantially central portion of the recess 20b. Further, a stepped portion 20 a is formed on the periphery of the base 20.
  • the globe 30 has a shape that simulates a bulb of an A-shaped bulb that is a general bulb shape, and covers the front of the light emitting module 10.
  • the opening side end 31 of the globe 30 is disposed in the region between the inside of the front side end 60 a of the housing 60 and the step 20 a formed on the periphery of the base 20. Then, the opening side end 31 of the glove 30 is fixed to the housing 60 by the adhesive 34 filled in the region between the front side end 60 a and the step 20 a.
  • globe 30 is not limited to the shape which imitated the bulb
  • the lamp 1 may not be provided with a glove.
  • the glove 30 may be fixed to the housing 60 by press fitting or the like.
  • the inner surface 32 of the globe 30 is subjected to a diffusion process (for example, a diffusion process using silica, a white pigment, or the like) for diffusing the light emitted from the light emitting module 10.
  • a diffusion process for example, a diffusion process using silica, a white pigment, or the like
  • the light incident on the inner surface 32 of the globe 30 passes through the globe 30 and is extracted to the outside of the globe 30.
  • Base A base 70 is a member for receiving power from the socket of the lighting apparatus when the lamp 1 is attached to the lighting apparatus and turned on.
  • the type of the base 70 is an E26 base which is an Edison type.
  • the base 70 includes a shell 70a which has a substantially cylindrical shape and whose outer peripheral surface is an external thread, and an eyelet 70c attached to the shell 70a via the insulating portion 70b.
  • An insulator portion 72 is interposed between the shell 70 a and the housing 60. Further, a power supply line 41a is connected to the shell 70a, and a power supply line 41b is connected to the eyelet 70c.
  • the light emitting module 10 includes a module substrate 11 and a plurality of (12 in FIG. 1) light emitting units 13 disposed on the module substrate 11. This light emitting module 10 is shown in FIG.
  • the light emitting unit 13 includes a sealing body 13a for sealing a semiconductor light emitting element (not shown), and an electrode portion 13b electrically connected to the semiconductor light emitting element and extended to the outside of the sealing body 13a.
  • the semiconductor light emitting element is an LED for emitting blue light
  • the sealing body 13a is made of silicone resin mixed with phosphor particles for converting the wavelength of blue light into yellow light. Then, a part of the blue light emitted from the semiconductor light emitting element is wavelength-converted to yellow light by the sealing body, and white light generated by mixing the unconverted blue light and the converted yellow light is the light emitting portion 13 It is emitted from
  • the module substrate 11 is formed larger than the metal substrate 86 formed in a rectangular plate shape and the metal substrate 86 in plan view, and is provided on the surface of the metal substrate 86 on the side where the light emitting unit 13 is provided.
  • the insulating sheet 80 having a circular shape in plan view.
  • the metal substrate 86 is formed of, for example, a metal such as aluminum.
  • the insulating sheet 80 is formed of polyamide resin or the like and has flexibility.
  • the shape of the insulating sheet 80 is not limited to a circular shape in plan view, and may be, for example, a rectangular shape, an elliptical shape, a star shape, or any other shape in plan view.
  • the module substrate 11 is formed with a hole 11a at a central portion for inserting the lead wires 43a and 43b. Further, in the vicinity of the hole portion 11 a in the module substrate 11, a feed terminal 18 is disposed. The power supply terminal 18 and the electrode portion 13 b are electrically connected to each other through the wiring pattern 17 formed on the insulating sheet 80. Further, the plurality of light emitting units 13 are also connected in series by the wiring patterns 82 a formed on the insulating sheet 80. In FIG. 3, only a part of the plurality of wiring patterns 82a is shown. In addition, the connector 15 connected to the tip of the lead wires 43a and 43b is attached to the feed terminal 18.
  • the peripheral edge of the insulating sheet 80 extends outside the peripheral edge of the metal substrate 86 over the entire circumference in plan view. Further, as shown in FIG. 2, the insulating sheet 80 further extends outward from the peripheral edge of the base 20, and the tip end thereof is placed on the inner wall of the glove 30. That is, the insulating sheet 80 covers from the front surface of the base 20 to a part of the inner wall of the globe 30. Thereby, the minimum value of the creeping distance along the direction from electrode 13b to base 20 on the surface of insulating sheet 80 can be increased, so a high voltage (for example, In the insulation withstand voltage test (see FIG.
  • the dielectric breakdown surface area between the base 20 electrically connected to the housing 60 and the electrode portion 13 b electrically connected to the base
  • Discharge is unlikely to occur, and such a withstand voltage test performance can be improved.
  • the minimum value of the creeping distance between through hole 20 c of base 20 and wiring pattern 17 is larger than the minimum value of the creeping distance between electrode portion 13 b of light emitting unit 13 and the periphery of metal substrate 86. It has become. Therefore, in the insulation withstand voltage test, the creeping discharge is more likely to occur between the electrode portion 13 b and the peripheral edge of the metal substrate 86 than between the through hole 20 c and the wiring pattern.
  • the inventor directed the size of the insulating sheet 80 in the direction from the electrode portion 13 b to the base 20 on the surface of the insulating sheet 80 between the electrode portion 13 b and the base 20. If the minimum value of the creepage distance (see Fig. 2 (b)) is selected to be 1.5 mm or more, the insulation between the electrode portion 13b and the base 20 is ensured in the aforementioned withstand voltage test. It is verified experimentally that it is done.
  • the creeping distance along the surface of the insulating sheet 80 between the electrode portion 13 b and the base 20 is 1.5 mm or more. It is considered preferable that the size is such that In this way, it is possible to secure the performance required in the above-described insulation withstand voltage test.
  • Manufacturing Direction of Lamp A method of manufacturing the lamp 1 according to the present embodiment will be described based on FIGS. 4 and 5. Here, among the steps of manufacturing the lamp 1, the step of manufacturing the light emitting module and the step of attaching the light emitting module 10 to the base 20 will be described.
  • the insulating sheet 80 made of a polyamide resin is laminated on a metal foil 82 made of copper, aluminum or the like, thereby having flexibility made of the metal foil 82 and the insulating sheet 80 as shown in FIG.
  • the film-like member 84 is obtained.
  • the film-like member 84 is manufactured by applying the organic solvent which becomes a basis of the insulating sheet 80 on the surface on one side of the metal foil 82.
  • the film-like member 84 has a circular shape in plan view as shown in FIG. 4 (a-2).
  • the film-like member 84 is formed of a metal such as aluminum and attached to the surface of the metal substrate 86 having a plate-like shape, whereby the module substrate base material 88 as shown in FIG. 4B is obtained.
  • the module substrate base 88 is manufactured by heating and pressure welding with a press or the like in a state where the insulating sheet 80 side of the film-like member 84 is in close contact with the metal substrate 86.
  • the film-like member 84 has an outer dimension larger than that of the metal substrate 86 in a plan view.
  • the diameter of the film-like member 84 is determined such that the film-like member 84 is sized to cover the entire metal substrate 86 in a plan view.
  • a through hole 86a which is a base of the hole portion 11a penetrates in the thickness direction.
  • a portion corresponding to the through hole 86 a in the film-like member 84 is cut out.
  • the film-like member 84 is cut out using a laser trimming technique.
  • the metal foil 82 of the module substrate base 88 is patterned using a photolithography technique and an etching technique to obtain a wiring pattern 82a as shown in FIG. 4C.
  • the light emitting unit 13 is attached (die bonding) on the wiring pattern 82a, and the power supply terminal 18 is disposed, whereby the light emitting module 10 as shown in FIGS. 4 (d) and 4 (d-2) is obtained. obtain.
  • the module substrate 11 of the light emitting module 10 is fitted into the recess 20 b formed in the approximate center of the base 20 (see FIG. 5A).
  • the connector 15 drawn out from the through hole 20 c penetrating the bottom of the recess 20 b is inserted into the hole 11 a of the module substrate 11.
  • the adhesive 22 is applied in advance to the bottom of the recess 20b.
  • the rear surface of the module substrate 11 (the surface opposite to the main surface on which the light emitting unit 13 is disposed) and the bottom of the recess 20 b are bonded by the adhesive 22 .
  • the connector 15 connected to the tip of the lead wires 43a and 43b led out from the hole 11a of the module substrate 11 is attached to the feed terminal 18 (see FIG. 5B).
  • the periphery of the insulating sheet 80 extends outside the periphery of the housing 60 in a plan view over the entire periphery.
  • the lamp 2 according to the present embodiment is substantially the same as the configuration of the lamp 1 according to Embodiment 1, and as shown in FIGS.
  • FIG. 7A is a cross-sectional view taken along the line AA ′ shown in FIG.
  • FIG. 7B is a cross-sectional view of a portion A3 surrounded by an alternate long and short dash line in FIG. 7A.
  • the base 220 is formed in a circular shape in a plan view.
  • the base 220 is formed of a metal such as aluminum.
  • the slit part 220b extended toward the center part of the base 220 is formed in two site
  • the light emitting module 210 is attached to the front side of the base 220.
  • a recess 220 a having a rectangular shape in a plan view is formed in a substantially central portion of the base 220.
  • the light emitting module 210 includes a module substrate 211 and a plurality of (eight in FIG. 6) light emitting units 13 disposed on the module substrate 211.
  • the light emitting unit 13 includes a sealing body 13 a that seals the semiconductor light emitting element with a sealing body, and an electrode unit 13 b electrically connected to the semiconductor light emitting element.
  • the semiconductor light emitting element and the sealing body 13a are the same as in the first embodiment, so the description will be omitted.
  • the module substrate 211 has a metal substrate 286 formed in a rectangular shape in plan view, and an insulating sheet 281 provided on the front side of the metal substrate 286.
  • the metal substrate 286 is formed of a metal such as aluminum.
  • the insulating sheet 281 is formed of an insulating material such as polyamide resin.
  • the area of the insulating sheet 281 is approximately the same size as the area of the metal substrate 286 in plan view, and the peripheral edge of the insulating sheet 281 matches the peripheral edge of the metal substrate 286.
  • the wiring pattern 217 and the feeding terminal 210a are formed on the insulating sheet 281.
  • tip part of lead wire 43a, 43b is connected to the electric power feeding terminal 210a.
  • the insulating sheet 280 is formed of an insulating material such as polyamide resin, has flexibility, and has a rectangular shape in plan view.
  • the shape of the insulating sheet 280 is not limited to a rectangular shape, For example, circular shape, elliptical shape, a star shape, or another shape may be sufficient.
  • the insulating sheet 280 covers the rear surface of the module substrate 211 opposite to the main surface on which the light emitting unit 13 is disposed. Further, as shown in FIG. 6, in plan view, the periphery of the insulating sheet 280 extends outward over the entire outer periphery of the module substrate 211. The peripheral edge of the insulating sheet 280 extends forward from the peripheral edge of the module substrate 211. In this case, as shown in FIG.
  • the creepage distance W includes the distance along the front and back sides of the portion of the insulating sheet 280 which has been extended forward, so the part of the insulating sheet 280 is The creeping distance along the direction from the electrode portion 13 b toward the base 220 can be increased on both the front and back sides. That is, for the portion extended forward, a creeping distance twice as long as that length is obtained.
  • the space between the housing 60 and the cap 70 is It is possible to prevent the generation of creeping discharge between the electrode portion 13b and the base 20 in the insulation withstand voltage test (see FIG. 18) performed by applying an alternating voltage of 4 kV.
  • the peripheral portion of the insulating sheet 280 may extend from the outer peripheral portion of the module substrate 211 by 0.75 mm or more.
  • the insulating sheet 280 formed in a sheet shape is covered so as to cover the entire recess 220 a formed in the base 220.
  • an adhesive is applied in advance to the bottom of the recess 220a, and the insulating sheet 280 is adhered to the bottom of the recess 220a.
  • the light emitting module 210 is fitted to the recess 220 a from the front of the insulating sheet 280.
  • the insulating sheet 280 has flexibility, the insulating sheet 280 is bent toward the inside of the recess 220 a at the periphery of the module substrate 211 as the module substrate 211 is fitted into the recess 220 a.
  • the peripheral portion of the insulating sheet 280 extends from the periphery of the module substrate 211 toward the front of the module substrate 211. It will be out.
  • the creeping distance between the electrode portion 13b of the light emitting portion 13 and the base 20 is along the front and back sides of the portion of the insulating sheet 280 extending forward. Since the distance is included, the creepage distance can be increased accordingly.
  • Embodiment 3 The structure of the lighting fixture 601 according to the present embodiment is shown in FIG.
  • the lighting fixture 601 includes the lamp 1 according to the first embodiment and a fixture main body 603.
  • the fixture body 603 is a so-called downlight illumination fixture.
  • the appliance main body 603 is connected to a socket 605 electrically connected to the lamp 1 and holding the lamp, a bowl-shaped reflecting plate 607 reflecting light emitted from the lamp 1 in a predetermined direction, and an external commercial power supply. And a connection portion 609.
  • the reflecting plate 607 is attached to the ceiling 611 in such a manner as to abut on the lower surface of the periphery of the opening 613 of the ceiling 611.
  • the socket 605 disposed on the bottom side of the reflecting plate 607 is located on the back side of the ceiling 611. Further, the central axis of the reflecting plate 607 coincides with the lamp axis J of the lamp 1.
  • the structure of the lighting fixture 601 shown in FIG. 9 is a mere example, and is not limited to the above-mentioned lighting fixture for down lights.
  • the lamp axis J of the lamp 1 is disposed to coincide with the central axis of the wedge-shaped reflector 607, but the lamp axis J of the lamp 1 is the central axis of the reflector 607 It may be arranged so as to be oblique to.
  • part of the power supply unit of the lamp 1 may be disposed in the luminaire 601 instead of in the lamp 1.
  • the insulating sheet 80 is disposed only on the front side of the metal substrate 86 in the state where the light emitting module 10 is attached to the base 20 has been described. It is not a thing.
  • the lamp 3 may be provided with the insulating sheet 380 provided on the rear side of the metal substrate 86 opposite to the front side.
  • the circuit holder 350 is configured of the large diameter portion 350a and the small diameter portion 350b, and does not have a lid. Therefore, the circuit holder 350 and the housing 360 are miniaturized because there is no lid.
  • the base 320 is formed in an annular shape in plan view, and the first base portion 320 a whose peripheral surface is in contact with the inner peripheral surface of the housing 360, and is formed in an annular shape in plan view.
  • a second base portion 320b disposed at the rear of the second base portion 320b.
  • the first base portion 320a is formed of a metal such as aluminum
  • the second base portion 320b is formed of an insulating material such as a resin.
  • the module substrate 11 is fixed in such a manner that its periphery is supported by the first base portion 320a.
  • the power supply unit 40 is fixed in such a manner that the peripheral portion of the circuit board 40a is supported by the second base portion 320b.
  • the withstand voltage between the metal substrate 86 and the wiring pattern formed on the circuit substrate 40 a is improved.
  • the wiring formed on the metal substrate 86 and the circuit substrate 40 a while the lid or the like is not interposed between the circuit substrate 40 a and the metal substrate 86 on the rear surface side of the module substrate 11. It is possible to suppress the occurrence of discharge between the pattern (for example, the tip of the lead wire protruding from the rear surface opposite to the surface on which the electronic component 40b is mounted on the circuit board 40a).
  • the present invention is not limited to this.
  • the lamp 4 may be one in which a part of the rear surface of the metal substrate 286 is not covered by the base 320.
  • the circuit holder 350 includes the large diameter portion 350 a and the small diameter portion 350 b as in the modification described in (1) above, and the base 320 is the first It is comprised from the base part 320a and the 2nd base part 320b.
  • the first base portion 320a has a recess 321a having a rectangular shape in plan view at the center, and a window having a rectangular shape in plan view at the approximate center of the recess 321a. 322a is provided.
  • the insulation sheet 280 is provided so as to cover the rear surface side of the metal substrate 286, thereby improving the withstand voltage between the metal substrate 286 and the wiring pattern formed on the circuit substrate 40 a.
  • the metal substrate 286 and the circuit are formed even though the lid or the like formed of the insulating material is not interposed between the circuit substrate 40 a and the metal substrate 286 on the rear surface side of the module substrate 211. Suppress discharge between the wiring formed on the substrate 40a (for example, the tip of the lead of the electronic component 40b protruding from the rear surface opposite to the surface on which the electronic component 40b is mounted on the circuit substrate 40a) it can.
  • the lamp 4 according to this modification can be manufactured, for example, using a manufacturing method as shown in FIG.
  • the insulating sheet 280 is covered so as to cover the concave portion 321a of the first base portion 320a (see FIG. 12A).
  • the light emitting module 210 is fitted to the recess 321a from the front of the insulating sheet 280.
  • the peripheral portion of the insulating sheet 280 is bent toward the inside of the recess 321 a at the periphery of the module substrate 211 as the module substrate 211 is fitted into the recess 321 a. .
  • the peripheral portion of the insulating sheet 280 extends from the outer peripheral portion of the module substrate 211 toward the front of the module substrate 211. It will be in a state of
  • the lead wires 43a and 43b are connected to the feed terminal 210a such that the lead wires 43a and 43b cross the periphery of the insulating sheet 280 on the front side of the module substrate 211. Do.
  • the insulating sheet 80 extends outward from the peripheral edge of the base 20, and the tip of the insulating sheet 80 is placed on the inner wall of the glove 30.
  • the peripheral edge of the insulating sheet 80a and the peripheral edge of the surface of the base 20 on the side to which the light emitting module 10 is attached coincide with each other.
  • the plan view shape of the table 20 may be the same.
  • the minimum value W1 of the creeping distance along the direction from the electrode portion 13b on the surface of the insulating sheet 80a to the base 20 between the electrode portion 13b of the light emitting portion 13 and the base 20 is 1.5 mm or more.
  • the insulation withstand voltage test (see FIG. 18) performed by applying an alternating voltage of 4 kV between the housing 60 and the base 70, the creeping discharge generated between the electrode portion 13b and the base 20 may be suppressed. it can.
  • the shape in plan view of the insulating sheet 80a and the shape in plan view of the base 20 do not necessarily have to match, and for example, as shown in FIG. 13B, the periphery of the insulating sheet 80b is in plan view It may exist inside the base 20.
  • the minimum value W2 of the creeping distance along the direction from the electrode portion 13b on the surface of the insulating sheet 80b to the base 20 between the electrode portion 13b of the light emitting unit 13 and the base 20 is shown in FIG. It is smaller than the distance W1 shown in).
  • the periphery of the insulating sheet 80c is extended by a length W4 from the outer peripheral portion of the metal substrate 86 in plan view, thereby the electrode portion 13b of the light emitting portion 13 and the base 20
  • the minimum value W3 of the creeping distance along the direction from the electrode portion 13b on the surface of the insulating sheet 80b to the base 20 may be increased.
  • the minimum values W3 and W4 of the creeping distance along the direction from the electrode portion 13b on the surface of the insulating sheet 80a to the base 20 between the electrode portion 13b of the light emitting portion 13 and the base 20 are 1. If it is 5 mm or more, between the electrode part 13 b of the light emitting part 13 and the base 20 in the insulation withstand voltage test (refer to FIG. 18) performed by applying an alternating voltage of 4 kV between the housing 60 and the base 70. It is possible to suppress the creeping discharge that occurs.
  • the material cost can be reduced.
  • the insulating sheet 280 covers the rear surface of the module substrate 211 opposite to the main surface on which the light emitting unit 13 is disposed, and from the outer peripheral portion of the module substrate 211 to the main surface of the module substrate 211
  • ramp 2 extended to the side was demonstrated, it is not limited to this.
  • the insulating sheet 580 may be a lamp 5 which is larger than the area of the base 520 in plan view and extends outside the outer peripheral portion of the base 520.
  • FIG. 15 is a cross-sectional view taken along the line A-A 'shown in FIG.
  • the module substrate 511 which constitutes a part of the light emitting module 510 has a metal substrate 586 formed in a rectangular shape in a plan view and an insulating sheet 581 provided on the front side of the metal substrate 586.
  • the area of the insulating sheet 581 is approximately the same size as the area of the metal substrate 586 in plan view, and the peripheral edge of the insulating sheet 581 matches the peripheral edge of the metal substrate 586.
  • the metal substrate 586 is formed of a metal such as aluminum
  • the insulating sheet 581 is formed of an insulating material such as a polyamide resin.
  • the insulating sheet 580 covers the rear surface of the module substrate 511 opposite to the main surface on which the light emitting unit 13 is disposed, and extends from the outer peripheral portion of the module substrate 511 to the main surface of the module substrate 511.
  • the insulating sheet 580 further extends outward from the peripheral edge of the base 520, and the distal end portion of the extended portion is placed on the inner wall of the glove 30.
  • the example has been described in which the insulating sheet 80 covers the opening edge of the hole 11a in the module substrate 11 up to the surface on which the light emitting unit 13 is provided.
  • the insulating sheet 680 may be provided so as to cover up to the hole 11a of the module substrate 11 and the inner wall of the through hole 20c of the base 20.
  • a cylinder formed in a cylindrical shape and having an outer diameter substantially the same as the inner diameter of the hole 11a and the through hole 20c and disposed inside the hole 11a and the through hole 20c.
  • a bushing 780 may be provided, which includes a ring-shaped portion 780a and a flange portion 780b extending from the light emitting portion 13 side in the cylinder axial direction of the cylindrical portion 780a to the outer periphery of the opening of the hole 11a.
  • the bushing 780 is formed of a nonconductive material such as a resin.
  • a hole 881c may be formed, and a screw 881 having a male screw portion 881d formed at the tip end of the shaft opposite to the head portion 881b may be provided.
  • the male screw portion 881d is screwed into the female screw portion 620d formed on the inner wall of the through hole 620c of the base 620.
  • the bottom of the first cylindrical portion 880a of the bushing 880 is held between the head portion 881a of the screw 881 and the outer peripheral portion of the opening on the light emitting portion 13 side of the hole 11a.
  • the lamp 1 in which the peripheral edge of the insulating sheet 80 extends outside the peripheral edge of the base 20 in plan view along the entire periphery has been described, but is limited thereto
  • the lamp may be a lamp in which only a part of the periphery of the insulating sheet 80 extends outside the periphery of the base 20.
  • the insulating sheets 80, 280, and 281 may be made of an aromatic polyamide resin, a polyether sulfone, an acrylic resin or the like.
  • the light emitting unit 13 may be a surface mount type LED, a COB (Chip On Board) type LED, or the like, and the semiconductor light emission inside when mounted on the module substrate 11
  • the present invention is applicable as long as the electrode portion electrically connected to the element is exposed to the surface of the module substrate 11.
  • the present invention is not limited to this and may include other light emitting elements such as EL elements It is also good.
  • the lamp according to the invention is widely available for lighting applications in general.
  • Lamp 10 1, 2, 3, 4, 5 Lamp 10, 210, Light emitting module 11, 211 Module substrate 13 Light emitting part 13a Sealing body 13b Electrode part 15, 215 Connector 17 Wiring pattern 18 Feeding terminal 20, 220, 320, 520 Base Reference Signs List 30 glove 40 power supply unit 41a, 41b power supply wire 43a, 43b lead wire 50 circuit holder 60, 360 casing 70 base 70a shell 70b insulation portion 70c eyelet portion 72 insulation portion 80, 280, 281 insulation sheet 86 metal substrate 320a 1 base part 320b 2nd base part 601 lighting fixture 603 fixture main body 605 socket

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

La présente invention concerne une lampe (1) comprenant : un cadre métallique (60) de forme cylindrique ; une unité d'alimentation électrique (40) logée à l'intérieur du cadre (60) ; une base métallique (20) montée à une extrémité dans la direction axiale cylindrique du cadre (60) ; une douille (70) permettant d'alimenter l'unité d'alimentation électrique en électricité (40) provenant d'une source d'alimentation externe, étant disposée dans un emplacement isolé électriquement du cadre (60), à l'autre extrémité dans la direction axiale cylindrique du cadre (60) ; et une section électroluminescente disposée sur la face externe de la base (20). Une feuille isolante (80) est intercalée entre la base (20) et une section électroluminescente (13). Sur une vue en plan, la périphérie de la feuille isolante (80) s'étend vers l'extérieur au-delà de la périphérie d'une carte de circuit imprimé métallique (86), à un emplacement où la distance entre la périphérie de la carte de circuit imprimé (86) et une électrode (13b) est minimum.
PCT/JP2012/005994 2011-10-06 2012-09-21 Lampe et équipement d'éclairage WO2013051208A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013508061A JP5319855B1 (ja) 2011-10-06 2012-09-21 ランプおよび照明器具

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Application Number Priority Date Filing Date Title
JP2011221824 2011-10-06
JP2011-221824 2011-10-06

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Publication Number Publication Date
WO2013051208A1 true WO2013051208A1 (fr) 2013-04-11

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JP (1) JP5319855B1 (fr)
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015007904A1 (fr) * 2013-07-19 2015-01-22 Osram Gmbh Dispositif d'éclairage muni d'une source lumineuse à semi-conducteurs et d'une carte de commande
JP2016170984A (ja) * 2015-03-12 2016-09-23 パナソニックＩｐマネジメント株式会社 照明用光源及び照明装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010129501A (ja) * 2008-12-01 2010-06-10 Toshiba Lighting & Technology Corp 照明装置および照明器具
WO2011007874A1 (fr) * 2009-07-17 2011-01-20 電気化学工業株式会社 Ensemble puce à del, boîtier de del et procédé de fabrication de boîtier de del
JP2011146241A (ja) * 2010-01-14 2011-07-28 Sharp Corp 照明装置
JP2011181248A (ja) * 2010-02-26 2011-09-15 Toshiba Lighting & Technology Corp 電球形ランプおよび照明器具

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010129501A (ja) * 2008-12-01 2010-06-10 Toshiba Lighting & Technology Corp 照明装置および照明器具
WO2011007874A1 (fr) * 2009-07-17 2011-01-20 電気化学工業株式会社 Ensemble puce à del, boîtier de del et procédé de fabrication de boîtier de del
JP2011146241A (ja) * 2010-01-14 2011-07-28 Sharp Corp 照明装置
JP2011181248A (ja) * 2010-02-26 2011-09-15 Toshiba Lighting & Technology Corp 電球形ランプおよび照明器具

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015007904A1 (fr) * 2013-07-19 2015-01-22 Osram Gmbh Dispositif d'éclairage muni d'une source lumineuse à semi-conducteurs et d'une carte de commande
JP2016170984A (ja) * 2015-03-12 2016-09-23 パナソニックＩｐマネジメント株式会社 照明用光源及び照明装置

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JP5319855B1 (ja) 2013-10-16
JPWO2013051208A1 (ja) 2015-03-30

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