EP3167224B1 - Lampe à semi-conducteur - Google Patents

Lampe à semi-conducteur Download PDF

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Publication number
EP3167224B1
EP3167224B1 EP15721647.4A EP15721647A EP3167224B1 EP 3167224 B1 EP3167224 B1 EP 3167224B1 EP 15721647 A EP15721647 A EP 15721647A EP 3167224 B1 EP3167224 B1 EP 3167224B1
Authority
EP
European Patent Office
Prior art keywords
substrate
heat sink
semiconductor
lamp
semiconductor lamp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP15721647.4A
Other languages
German (de)
English (en)
Other versions
EP3167224A1 (fr
Inventor
Thomas Weng
Stefan Ringler
Thomas Klafta
Marianne Auernhammer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ledvance GmbH
Original Assignee
Osram GmbH
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Filing date
Publication date
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Publication of EP3167224A1 publication Critical patent/EP3167224A1/fr
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Publication of EP3167224B1 publication Critical patent/EP3167224B1/fr
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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/233—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/237—Details of housings or cases, i.e. the parts between the light-generating element and the bases; Arrangement of components within housings or cases
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/69—Details of refractors forming part of the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/101—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening permanently, e.g. welding, gluing or riveting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/508—Cooling arrangements characterised by the adaptation for cooling of specific components of electrical circuits
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/87—Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/002—Refractors for light sources using microoptical elements for redirecting or diffusing light
    • F21V5/004—Refractors for light sources using microoptical elements for redirecting or diffusing light using microlenses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/04—Refractors for light sources of lens shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention relates to a semiconductor lamp, comprising at least one semiconductor light source arranged on one side of a substrate and a driver circuit for driving the at least one semiconductor light source.
  • the invention is particularly applicable to retrofit lamps, in particular incandescent or halogen lamp retrofit lamps.
  • Another disadvantage is that the heat transfer from the LEDs to the heat sink is not effective by the intervening carrier.
  • metal core boards are sometimes used as LED carrier, which are expensive.
  • thin (e.g., 0.5 mm thick) FR4 boards can be used which also add cost and reduce thermal resistance from the LEDs to the heat sink only to a limited extent.
  • WO 2010/032169 A1 is a semiconductor lamp with a printed circuit board with a thermally conductive portion and with a heat sink, which communicates with this section is known.
  • a semiconductor lamp comprising at least one semiconductor light source arranged on a first side (hereinafter referred to as "front side” without limitation of generality) of a substrate and a driver circuit for driving the at least one semiconductor light source, wherein at least a part of the driver circuit is connected to a semiconductor light source the second side facing away from the at least one semiconductor light source (hereinafter referred to as the "backside” without limitation of generality) of the substrate, a heat sink rests flat on the front side of the substrate, wherein the heat sink is followed by at least one optical element, which rearwardly projecting legs which extend through a respective recess in the bottom of the heat sink to the substrate.
  • the driver circuit is no longer mounted on a separate from the substrate of the semiconductor light sources printed circuit board, the need for electrical connection of two carriers is eliminated, which significantly facilitates production.
  • a carrier is saved.
  • the manufacturing process eg a combination of wave soldering and SMD soldering
  • for such a populated substrate is comparable to manufacturing processes for all common two-sided boards and thus known, available and inexpensive. This in turn enables a saving of investment costs in special machines for eg laser soldering and / or a saving of manual workstations.
  • the previous contacting of the driver board and the LED carrier is often a mechanical and manufacturing technical weakness and thus often a problem for quality assurance and achieving a long life. Since this contacting is no longer necessary in the present invention, the quality and the service life can be increased or a risk of failure can be minimized.
  • the at least one semiconductor light source comprises at least one light-emitting diode ("LED"). If several LEDs are present, they can be lit in the same color or in different colors. A color can be monochrome (eg red, green, blue etc.) or multichrome (eg white).
  • the light emitted by the at least one light-emitting diode can also be an infrared light (IR LED) or an ultraviolet light (UV LED).
  • IR LED infrared light
  • UV LED ultraviolet light
  • Several light emitting diodes can produce a mixed light; eg a white mixed light.
  • the at least one light-emitting diode can at least contain a wavelength-converting phosphor (conversion LED).
  • the phosphor may alternatively or additionally be arranged remotely from the light-emitting diode ("remote phosphor").
  • the at least one light-emitting diode can be in the form of at least one individually housed light-emitting diode or in the form of at least one LED chip. Several LED chips can be mounted on a common substrate (“submount").
  • the at least one light emitting diode may be equipped with at least one own and / or common optics for beam guidance, for example at least one Fresnel lens, collimator, and so on.
  • backward or “backward” may refer to a direction or orientation toward the socket.
  • front or “forward” may analogously be understood a direction or orientation away from the pedestal.
  • front or “forward” may mean a direction or orientation to a light emitting area. It is a development that the semiconductor lamp has a longitudinal axis, which extends from a rear base area to a front Lichtabstrahl Scheme. Then under “front” or “forward” an arrangement or orientation in the direction of the longitudinal axis and under “backwards” or “to the rear a Arrangement or orientation against the direction of the longitudinal axis to be understood.
  • the substrate may comprise any suitable electrically insulating base material, e.g. conventional base material for circuit boards such as FR4, other plastic or ceramic. Also, a metal core board may be used.
  • the substrate may have a conductive structure (e.g., comprising at least one conductive trace and / or at least one contact patch) at its front side and / or at its back surface. Alternatively or additionally, components attached to the substrate may be attached by means of a bonding wire or the like. be electrically connected. However, other connection methods can be used.
  • a heat sink lies flat on the front side of the substrate. This is now possible because the heat sink no longer needs to be provided as a partition between the driver board and the LED carrier.
  • the heat sink may for example consist of ceramic or metal, for example aluminum.
  • the heat sink is a shell-like heat sink with a plate-shaped bottom and an edge thereof angled outgoing edge, wherein the at least one recess for the at least one semiconductor light source is introduced into the ground.
  • a heat sink can be easily produced.
  • the heat sink is attached to the substrate by means of an adhesive heat-conducting layer, in particular adhered thereto.
  • the adhesive thermal conductive layer may e.g. a TIM (Thermal Interface Material) film.
  • the heat conducting layer may also consist of a thermal compound.
  • the heat sink rests on a thermally good conductive gap filler on the front of the substrate. This may eliminate the need for recesses in the bottom (e.g., solder points) because the gap filler allows for a greater clearance between the heat sink and the front of the substrate.
  • the gap filler has a significantly higher thermal conductivity than conventional substrate materials. He likes e.g. consist of thermal grease.
  • the housing consists in particular of an electrically insulating material, in particular plastic.
  • the housing may be formed in one or more parts.
  • the housing is open on the front side. This allows use of components of the semiconductor lamp. In addition, a joining direction is determined, which keeps manufacturing complexity at a low level.
  • the side edge of the heat sink rests flat against an inner side of the housing. This enables effective heat dissipation on and through the housing as well as a secure fit in the housing, for example in a tight fit.
  • the side edge may be inserted in particular between retaining tabs and a rigid housing wall, for example, be trapped.
  • the retaining tabs may wear the substrate on the upper side.
  • the side edge extends in particular to the rear. It may have one or more interruptions to provide elastic deformability.
  • the substrate has a line structuring on only one side and components attached to the other side of the substrate are electrically connected to the line structuring via electrically conductive feedthroughs through the substrate.
  • a substrate is particularly inexpensive.
  • a substrate provided with a conductive structure on both sides may be used.
  • the heat sink is followed by at least one optical element having rearwardly projecting legs or feet extending through a respective recess in the bottom of the heat sink to the substrate.
  • the legs easily enable accurate positioning of the optical element with respect to the at least one semiconductor light source. They may serve as spacers, for example.
  • the recesses may serve as alignment aids and as lateral guides.
  • the base region 3 is used for mechanical attachment of the semiconductor lamp 1 in a conventional bipin socket (not shown), e.g. for halogen lamps.
  • a conventional bipin socket (not shown), e.g. for halogen lamps.
  • two metallic pins 4 protrude rearward from a rear end face of the base area 3, which together with the base area 3 form a biped base of the semiconductor lamp 1, for example of the "GU" type, e.g. GU10.
  • the substrate 6 is provided on both sides with a respective line structure, which may each have one or more conductor tracks and / or contact pads.
  • the line structure here has four contact fields 9, which interconnect the spatially annularly arranged LED chips 8 electrically in series.
  • the substrate 6 only one-sided, e.g. here at the front 7, is provided with a respective line structure.
  • An electrical connection of the components 11 of the back 10 may then be e.g. be implemented by means of the conductive bushing (s) with the line structure of the front side 7. This may be e.g. be done by the fact that the components 11 are configured as through-mounted components, for example by having guided through the substrate 6 pins (o. Fig.) Have.
  • the heat sink 12 On the front side 7 of the substrate 6 is a heat sink 12 with a shell-like basic shape on the surface, in more detail in Fig.2 is shown.
  • the heat sink 12 has a plate-shaped bottom 13 and one of the edge side to the rear outgoing, multi-perforated side edge 14.
  • the bottom 13 has recesses 15 for the LED chips 8 and further recesses 16, for example, for projections produced by conductive bushings on the front side 7 of the substrate 6.
  • 13 recesses 23 in the bottom for legs 22 available, as will be explained in more detail below.
  • the housing 2 is filled to the substrate 6 with a potting material 20, which thus surrounds the components 11.
  • the lens element 21 is pressed by means of a retaining ring 24 in a rearward direction, so that it does not detach from the substrate 6.
  • the retaining ring 24 is arranged in front of the lens element 21 and can be latched to an inner side of the housing 2 via latching hooks 25.
  • the side edge 14 of the heat sink 12 lies with its outer surface on the housing 2 and thus enables effective heat transfer to the housing 2.
  • the heat sink 12 may be held so clamped in the housing 2.
  • the substrate 6 rests with an edge region of its rear side 10 on retaining tabs 26, which protrude from an inner side of the housing 2 to the front.
  • This semiconductor lamp 1 has only one joining direction, which keeps the manufacturing complexity of the entire platform at a low level.
  • the driver circuit is connected via the electrical connection pins 4
  • Driver components 11 with an electrical supply signal (eg a mains voltage) supplied.
  • the driver circuit converts the electrical supply signal into an electrical operating signal suitable for operating the series-connected LED chips 8. This may for example be clocked and / or be adjustable in terms of its current level.
  • the operating signal may allow for dimmed operation of the LED chips 8.
  • the at least some of the pins of the driver components 11 of the driver circuit are passed through the substrate 6 and are electrically connected to the local contact pads 9, the operating signal can be easily fed into the LED chips 8.
  • the light then emitted from the LED chips 8 passes through the recesses 15 of the bottom 13 of the heat sink 12 and into respective light collecting regions 27 of the lens element 21.
  • Waste heat generated by the LED chips 8 is transferred to the bottom 13 of the heat sink 12 and, in the following, mainly emitted from its side wall 14 onto the housing 2 and through the housing 2 to the outside.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Claims (10)

  1. Lampe à semi-conducteurs (1), comportant
    - au moins une source de lumière à semi-conducteurs (8) agencée au niveau d'une face avant (7) d'un support (6) et
    - un circuit d'attaque (11) destiné à commander l'au moins une source de lumière à semi-conducteurs (8),
    dans laquelle
    - au moins une partie du circuit d'attaque (11) est fixée à une face arrière (10), éloignée de l'au moins une source de lumière à semi-conducteurs (8), du support (6), dans laquelle un corps de refroidissement (12) repose par sa surface sur la face avant (7) du support (6),
    caractérisée en ce qu'au moins un élément optique (21) est placé en aval du corps de refroidissement (12), lequel élément optique comporte des pattes de soutien (22) qui font saillie vers l'arrière et qui atteignent le support (6) à travers un évidement (23) respectif dans le fond (13) du corps de refroidissement (12).
  2. Lampe à semi-conducteurs (1) selon la revendication 1, dans laquelle le corps de refroidissement (12) comporte au moins un évidement (15) pour l'au moins une source de lumière à semi-conducteurs (8).
  3. Lampe à semi-conducteurs (1) selon l'une quelconque des revendications précédentes, dans laquelle le corps de refroidissement (12) est un corps de refroidissement (12) du type coque avec un fond (13) en forme de plaque et avec un bord latéral (14) partant de là suivant un certain angle et dans laquelle l'au moins un évidement (15) pour l'au moins une source de lumière à semi-conducteurs (8) est placé dans le fond (13).
  4. Lampe à semi-conducteurs (1) selon l'une quelconque des revendications 1 à 3, dans laquelle le corps de refroidissement (12) est fixé au support (6) au moyen d'une couche thermoconductrice (17) adhésive.
  5. Lampe à semi-conducteurs (1) selon l'une quelconque des revendications précédentes, dans laquelle le support (6) est placé dans un boîtier (2).
  6. Lampe à semi-conducteurs (1) selon la revendication 5, dans laquelle le boîtier (2) comporte une zone de socle (3) à l'arrière et est ouvert à l'avant.
  7. Lampe à semi-conducteurs (1) selon l'une quelconque des revendications 3 ou 4 en combinaison avec l'une quelconque des revendications 5 ou 6, dans laquelle le bord latéral (14) du corps de refroidissement (12) repose par sa surface sur un côté intérieur du boîtier (2).
  8. Lampe à semi-conducteurs (1) selon l'une quelconque des revendications 5 à 7, dans laquelle le circuit d'attaque (11) est entouré, dans le boîtier (2), par un matériau d'enrobage (20).
  9. Lampe à semi-conducteurs (1) selon l'une quelconque des revendications précédentes, dans laquelle le support ne comporte une structure conductrice (9) que sur une face (7) et dans laquelle des composants (11) fixés sur l'autre face (10) du substrat (6) sont reliés électriquement à la structure conductrice (9) par l'intermédiaire de traversées électriquement conductrices dans le substrat (6).
  10. Lampe à semi-conducteurs (1) selon l'une quelconque des revendications précédentes, dans laquelle la lampe à semi-conducteurs (1) est une lampe dite rétrofit.
EP15721647.4A 2014-07-09 2015-04-29 Lampe à semi-conducteur Active EP3167224B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102014213388.2A DE102014213388A1 (de) 2014-07-09 2014-07-09 Halbleiterlampe
PCT/EP2015/059410 WO2016005069A1 (fr) 2014-07-09 2015-04-29 Lampe à semi-conducteur

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EP3167224A1 EP3167224A1 (fr) 2017-05-17
EP3167224B1 true EP3167224B1 (fr) 2018-07-25

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US (1) US10197223B2 (fr)
EP (1) EP3167224B1 (fr)
KR (1) KR101920480B1 (fr)
CN (1) CN106537024B (fr)
DE (1) DE102014213388A1 (fr)
WO (1) WO2016005069A1 (fr)

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Publication number Publication date
CN106537024B (zh) 2019-09-13
KR101920480B1 (ko) 2018-11-21
EP3167224A1 (fr) 2017-05-17
DE102014213388A1 (de) 2016-01-14
WO2016005069A1 (fr) 2016-01-14
KR20170037603A (ko) 2017-04-04
US10197223B2 (en) 2019-02-05
US20170146199A1 (en) 2017-05-25
CN106537024A (zh) 2017-03-22

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