WO2023243588A1 - Module de source de lumière - Google Patents
Module de source de lumière Download PDFInfo
- Publication number
- WO2023243588A1 WO2023243588A1 PCT/JP2023/021703 JP2023021703W WO2023243588A1 WO 2023243588 A1 WO2023243588 A1 WO 2023243588A1 JP 2023021703 W JP2023021703 W JP 2023021703W WO 2023243588 A1 WO2023243588 A1 WO 2023243588A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- light source
- board
- source module
- heat dissipation
- connector
- Prior art date
Links
- 230000017525 heat dissipation Effects 0.000 claims abstract description 39
- 239000011347 resin Substances 0.000 claims abstract description 18
- 229920005989 resin Polymers 0.000 claims abstract description 18
- 239000000463 material Substances 0.000 claims abstract description 16
- 238000004512 die casting Methods 0.000 claims abstract description 6
- 230000037431 insertion Effects 0.000 claims description 39
- 238000003780 insertion Methods 0.000 claims description 39
- 230000003287 optical effect Effects 0.000 claims description 11
- 238000005422 blasting Methods 0.000 claims description 4
- 238000004381 surface treatment Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 description 10
- 230000005855 radiation Effects 0.000 description 7
- 239000007769 metal material Substances 0.000 description 5
- 230000001105 regulatory effect Effects 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 230000004907 flux Effects 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- -1 for example Polymers 0.000 description 2
- 238000010422 painting Methods 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 238000004382 potting Methods 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
- F21S45/40—Cooling of lighting devices
- F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
- F21S45/48—Passive cooling, e.g. using fins, thermal conductive elements or openings with means for conducting heat from the inside to the outside of the lighting devices, e.g. with fins on the outer surface of the lighting device
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2102/00—Exterior vehicle lighting devices for illuminating purposes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Definitions
- the present invention relates to the technical field of a light source module that is used by being attached to a mounting member such as a lamp housing.
- a vehicular lamp is provided with a light source module that is removable from a lamp housing made up of a lamp housing and a cover, and the light emitted from the light source of the light source module is transmitted through the cover to the outside.
- a light source module that is removable from a lamp housing made up of a lamp housing and a cover, and the light emitted from the light source of the light source module is transmitted through the cover to the outside.
- the light source module is provided with a heat radiating section such as a heat radiating fin for discharging heat generated when the light source is driven to the outside.
- a heat radiating section such as a heat radiating fin for discharging heat generated when the light source is driven to the outside.
- a plate-shaped member made of a metal material and functioning as a heat sink is provided, and the heat sink is covered with a resin material having thermal conductivity.
- JP2021-57118A Japanese Patent Application Publication No. 2018-113234
- a so-called derating function that suppresses the amount of current supplied to the light source when the light source is at high temperature during operation may be added. It may be necessary to incorporate it.
- the light source module of the present invention aims to improve heat dissipation and ensure high functionality.
- the light source module includes: a board on which a light source is mounted; a board mounting part to which the board is attached; a heat dissipation part that emits heat transferred via the board mounting part when the light source is driven; a connector part having a power feeding terminal connected to a board and a terminal holding part holding the power feeding terminal, a part having the board mounting part and the heat dissipation part is provided as a module main body, and the module main body is die-cast.
- the terminal holding portion is formed of a resin material.
- the module body including the board attachment part and the heat dissipation part is formed of a metal material
- the terminal holding part that holds the power supply terminal connected to the board is formed of a resin material
- the module body including the board mounting part and the heat dissipation part is formed of a metal material, and the terminal holding part that holds the power supply terminal connected to the board is formed of a resin material, so that heat dissipation is improved. This makes it possible to ensure high functionality.
- FIGS. 2 to 10 An embodiment of the present invention is shown together with FIGS. 2 to 10, and this figure is a sectional view of a vehicular lamp.
- It is a perspective view of a light source module.
- FIG. 3 is a rear view of the light source module.
- FIG. 3 is an exploded perspective view of the light source module.
- FIG. 3 is an enlarged perspective view showing a first retaining protrusion and a second retaining protrusion.
- FIG. 3 is an enlarged perspective view showing a first engagement protrusion and a second engagement protrusion.
- FIG. 6 is a diagram schematically showing a state in which the first retaining protrusion and the second retaining protrusion are engaged with the first engaging protrusion and the second engaging protrusion.
- FIG. 7 is a perspective view showing a light source module with another configuration.
- FIG. 3 is a cross-sectional view showing a configuration in which positioning pins are provided.
- FIG. 3 is a diagram showing a state in which the
- the optical axis direction of the light emitted from the light source module is the front-back direction
- the light emission direction is the front
- the front-rear, top-down, left-right, and front-back directions are shown. Note that the front, back, top, bottom, left and right directions shown below are for convenience of explanation, and the implementation of the present invention is not limited to these directions.
- the vehicular lamp 1 includes a lamp housing 2 having an opening at the front end and a cover 3 that closes the opening of the lamp housing 2 (see FIG. 1).
- the lamp housing 2 and the cover 3 constitute a lamp outer casing 4, and a space inside the lamp outer casing 4 is formed as a lamp chamber 5.
- the lamp housing 2 constitutes a part of the lamp outer casing 4 and also functions as a mounting member. Note that the vehicle lamp 1 may be provided with a reflector or the like other than the lamp housing 2 as a mounting member.
- a mounting hole 2a is formed in the lamp housing 2 and extends through the lamp housing 2 from front to back.
- a plurality of engagement grooves are formed in the lamp housing 2 around the mounting hole 2a so as to be spaced apart in the circumferential direction.
- a light guide 6 that functions as an optical member is arranged in the lamp chamber 5 and is made of, for example, a transparent resin material or glass material.
- a portion of the light guide 6 located directly in front of the mounting hole 2a is provided as an entrance portion 6a, and a portion on the tip side is provided as an output portion 6b.
- optical member arranged in the lamp chamber 5 is not limited to the light guide 6, and other optical members such as an inner lens may be arranged in the lamp chamber 5.
- a light source module 7 is removably attached to the lamp housing 2.
- the light source module 7 has a module main body 8 and a connector section 9 (see FIGS. 2 to 4).
- the heat dissipation section 10 includes a substantially disk-shaped base surface section 12 facing in the front-rear direction, a plurality of first heat dissipation fins 13 protruding rearward from the base surface section 12, and a pair of second heat dissipation fins 13 protruding rearward from the base surface section 12. It has fins 14.
- the first radiation fins 13 are, for example, arranged at equal intervals in the left-right direction.
- the second radiation fins 14 are located on both sides of the first radiation fins 13 and protrude from the base surface portion 12 in the same direction as the first radiation fins 13.
- the heat radiation section 10 has a large surface area.
- the surface of the heat dissipation section 10 may be alumite-treated or painted in a dark color such as black. By subjecting the surface of the heat radiating section 10 to an alumite treatment such as black or painting, the heat radiation efficiency can be improved.
- the surface of the board mounting portion 11 may also be subjected to blasting, alumite treatment such as black, painting, etc.
- the module main body 8 is formed with an insertion hole 17 extending from the front to the rear.
- the insertion hole 17 is formed at a position extending from the attachment insertion portion 15 to the base surface portion 12, and has a front end opened to the attachment insertion portion 15 and a rear end opened to the base surface portion 12.
- the first retaining protrusion 18 consists of a base part 20 formed in a substantially rectangular parallelepiped shape extending in the circumferential direction of the insertion hole 17 and a regulating protrusion 21 protruding rearward from one end of the base part 20, and as a whole. It is formed into an approximately L shape.
- the connector portion 9 is inserted into the insertion hole 17 from the rear and attached to the module body 8.
- the connector portion 9 is attached to the module body 8 by being inserted into the insertion hole 17 and rotated in the direction around the axis.
- the first engagement protrusion 28 and the second engagement protrusion 29 are connected to the base part 20 of the first retaining protrusion 18 and the second engagement protrusion 29. It is engaged with the base portion 22 of the stop projection 19 in the front-rear direction (see FIG. 7). Therefore, the connector portion 9 is positioned relative to the module body 8 in the front-rear direction, and the connector portion 9 is prevented from falling out of the insertion hole 17.
- the first engagement protrusion 28 and the second engagement protrusion 29 are connected to the regulation protrusion 21 of the first retaining protrusion 18 and the regulating protrusion 23 of the second retaining protrusion 19, respectively. is engaged in the circumferential direction, and the insertion protrusion 29a is inserted into the insertion recess 22a. Therefore, the connector portion 9 is positioned relative to the module body 8 in the axial direction.
- the insertion hole 17 is filled with an adhesive (not shown) to perform so-called potting.
- a portion of the connector portion 9 other than the front end portion of the power supply terminal 24 is covered with the adhesive.
- a connector (not shown) connected to a power circuit (external power) (not shown) is inserted into the connector insertion space and connected to the connector connection part 27 of the connector part 9.
- a power supply circuit is connected to the power supply terminal 24 via a connector.
- the board 30 is attached to the board attachment part 11 using, for example, an insulating adhesive.
- the board 30 is inserted into the placement recess 15a and is bonded to and attached to the board placement surface 15b.
- a plurality of light sources 31 are mounted on the substrate 30 in a lined manner. However, the number of light sources 31 may be one.
- the light source 31 for example, a light emitting diode (LED) is used.
- a circuit pattern is formed on the substrate 30, and the front end portion of the power supply terminal 24 is joined to the terminal portion of the circuit pattern by, for example, soldering. Therefore, the light source 31 is connected to the power supply circuit via the circuit pattern, the power supply terminal 24, and the connector, and a driving current is supplied to the light source 31 from the power supply circuit.
- the power supply terminal 24 may be connected to the terminal portion of the circuit pattern by a conductive wire or the like.
- an annular gasket 32 is fitted onto the mounting insertion portion 15 of the board mounting portion 11 (see FIG. 1).
- Gasket 32 is made of resin or rubber material.
- the board mounting part 11 is inserted into the mounting hole 2a of the lamp housing 2 from the rear side, and is rotated in the circumferential direction so that the mounting protrusions 16 are engaged with the respective engagement grooves. and then attached to the lamp housing 2.
- the gasket 32 prevents foreign matter such as moisture and dust from entering the lamp chamber 5 from the outside.
- the adhesive filled into the insertion hole 17 by potting prevents foreign substances such as moisture and dust from entering the lamp chamber 5 from the insertion hole 17.
- the light source module 7 When the light source module 7 is attached to the lamp housing 2 and the connector is connected to the connector connection part 27 of the connector part 9, when power is supplied from the power supply circuit to the light source 31 via the power supply terminal 24, light is emitted from the light source 31. is emitted.
- the light emitted from the light source 31 enters from the entrance part 6a, is guided by the light guide 6, is emitted from the exit part 6b, is transmitted through the cover 3, and is irradiated to the outside.
- the light source 31 When the light source 31 is driven (when emitting light), heat is generated in the light source 31 and the substrate 30, and the generated heat is transmitted from the substrate mounting part 11 to the heat dissipation part 10, and is mainly transmitted between the first heat dissipation fin 13 and the second heat dissipation fin 13. is emitted from the heat dissipation fins 14 of. Therefore, the temperature rise of the light source 31 is suppressed, and a good light emission state of the light source 31 is ensured.
- the light source module 7 has a part that includes the board mounting part 11 to which the board 30 is attached and the heat dissipation part 10 that emits heat transmitted via the board mounting part 11 when the light source 31 is driven.
- a module body 8 the module body 8 is formed by die casting, and the terminal holding portion 25 of the connector portion 9 is formed of a resin material.
- the module main body 8 including the board mounting part 11 and the heat dissipation part 10 is formed of a metal material, and the terminal holding part 25 that holds the power supply terminal 24 connected to the board 30 is formed of a resin material, the heat dissipation is improved. It is possible to improve functionality and ensure high functionality.
- the amount of luminous flux of light emitted from the light source 31 can be increased to ensure high brightness (illuminance), etc., and the amount of current supplied to the light source 31 can be increased.
- the circuit structure formed on the substrate 30 does not become complicated, noise is less likely to occur, and functionality can be improved.
- the light source module 7 can be made smaller and lighter by downsizing, and the structure can be simplified by not providing a heat dissipation fin. be able to.
- the connector part 9 is provided with a first engagement protrusion 28 and a second engagement protrusion 29, and when the connector part 9 is inserted into the insertion hole 17 in the module main body 8, the first engagement protrusion 28 and the second engagement protrusion 29 are provided.
- a first retaining protrusion 18 and a second retaining protrusion 19 are provided, with which the portion 28 and the second engaging protrusion 29 are engaged.
- the connector part 9 when the connector part 9 is inserted into the insertion hole 17, the first engagement protrusion 28 and the second engagement protrusion 29 are connected to the first retaining protrusion 18 and the second retaining protrusion 19. Since the connector part 9 is held in the module main body 8 by being engaged with the connector part 9, it is possible to easily prevent the connector part 9 from falling off from the module main body 8 with a simple structure.
- first retaining protrusion 18 and the second retaining protrusion 19 are provided with restricting protrusions 21 and 23 for regulating the rotation of the connector portion 9, respectively, the structure is simplified. In this way, high positional accuracy of the connector portion 9 relative to the module body 8 in the rotational direction can be ensured.
- a regulating protrusion may be provided on either the first retaining protrusion 18 or the second retaining protrusion 19.
- the board mounting portion 11 is provided with a mounting insertion portion 15 that is inserted into the mounting hole 2a of the lamp housing 2 and functions as a mounting member, and the outer peripheral surface of the mounting insertion portion 15 is coated with a resin. There is.
- the coated portion comes into contact with the lamp housing 2, so that the heat generated when the light source 31 is driven is reduced. It is difficult for the heat to be transmitted from the board attachment part 11 to the lamp housing 2, and it is possible to prevent the lamp housing 2 from melting due to heat radiation from the module main body 8.
- the diameter of the mounting insertion part 15 can be made smaller in advance and the structure can be simplified, and the die-casting material used to form the module body 8 can be reduced and the mold can be simplified. By increasing the number, the manufacturing cost of the light source module 7 can be reduced.
- the light source module 7 for example, A configuration may also be provided in which heat dissipation fins 33 are provided that protrude rearward from a portion or the entirety (see FIG. 8). With such a configuration, it is possible to simplify the structure of the light source module 7 and improve heat dissipation.
- a positioning pin 34 may be provided that protrudes from the outer circumference of the board placement surface 15b of the board mounting portion 11 (see FIGS. 9 and 10).
- the positioning pins 34 each protrude forward from, for example, four corners of the outer periphery of the board placement surface 15b.
- the positioning pin 34 may be formed integrally with the board mounting portion 11 and may be formed by die-casting, but may also be formed of, for example, a resin material with low thermal conductivity. Note that at least three positioning pins 34 may be provided.
- positioning recess 36 are formed at each corner of the substrate 30, and a plurality of positioning recesses 36 are formed at the outer periphery of the incident portion 6a of the light guide 6. .
- the bottom surface (rear surface) forming the positioning recess 36 is formed as a receiving surface 36a.
- the substrate 30 is positioned with respect to the substrate mounting portion 11 in the direction perpendicular to the optical axis direction by positioning the positioning pins 34 corresponding to the positioning notches 35, respectively.
- the light guide 6 is configured such that the positioning pins 34 are inserted into the positioning recesses 36 and the tip surfaces 34a of the positioning pins 34 are abutted against the receiving surfaces 36a, so that the light guide 6 can be operated in a direction perpendicular to the optical axis direction and in the optical axis direction. It is positioned relative to the light source 31.
- the positioning pins 34 position the board 30 with respect to the board mounting portion 11, and also position the light guide 6, which functions as an optical member, with respect to the light source 31. Therefore, functionality can be improved while ensuring simplification of the structure.
- the light emitted from the light source 31 is incident on the light guide 6, it is possible to ensure that the light emitted from the light source 31 enters the light guide 6 appropriately, and the light emitted from the light source 31 is emitted from the light guide 6. It is possible to make effective use of the light that is generated, and to ensure an appropriate light distribution state in the vehicular lamp 1.
- the positioning pin 34 by forming the positioning pin 34 from a resin material with low thermal conductivity, it becomes even more difficult for heat to be transferred from the light source module 7 to the light guide 6, and the effect of preventing the light source module 7 from melting can be enhanced. .
- Vehicle lamp Lamp housing (mounting member) 2a Mounting hole 6 Light guide (optical member) 7 Light source module 8 Module body 9 Connector part 10 Heat dissipation part 11 Board mounting part 15 Mounting insertion part 17 Insertion hole 18 First retaining protrusion 19 Second retaining protrusion 24 Power supply terminal 25 Terminal holding part 28 First Engagement protrusion 29 Second engagement protrusion 30 Board 31 Light source 34 Positioning pin
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
La présente invention concerne un module de source de lumière qui comprend : une carte sur laquelle une source de lumière est montée ; une partie de fixation de carte à laquelle la carte peut être fixée ; une unité de dissipation de chaleur qui dissipe la chaleur transmise par le biais de la partie de fixation de carte lorsque la source de lumière est excitée ; et une partie connecteur ayant une borne d'alimentation électrique raccordée à la carte et une unité de maintien de borne qui maintient la borne d'alimentation électrique. La partie ayant la partie de fixation de carte et l'unité de dissipation de chaleur est fournie en tant que corps de module, le corps de module est formé par coulée sous pression, et l'unité de maintien de borne est formée à l'aide d'un matériau de résine.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2022-097904 | 2022-06-17 | ||
JP2022097904 | 2022-06-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2023243588A1 true WO2023243588A1 (fr) | 2023-12-21 |
Family
ID=89191218
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2023/021703 WO2023243588A1 (fr) | 2022-06-17 | 2023-06-12 | Module de source de lumière |
Country Status (1)
Country | Link |
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WO (1) | WO2023243588A1 (fr) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011222368A (ja) * | 2010-04-12 | 2011-11-04 | Sosuke Naito | Ledモジュールおよびそれを用いたled照明器具 |
JP2015176707A (ja) * | 2014-03-14 | 2015-10-05 | パナソニックIpマネジメント株式会社 | 照明器具 |
US20170146199A1 (en) * | 2014-07-09 | 2017-05-25 | Osram Gmbh | Semiconductor Lamp |
JP2020004688A (ja) * | 2018-07-02 | 2020-01-09 | 株式会社小糸製作所 | 灯具ユニット及び車両用灯具並びに灯具ユニット製造方法 |
-
2023
- 2023-06-12 WO PCT/JP2023/021703 patent/WO2023243588A1/fr unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011222368A (ja) * | 2010-04-12 | 2011-11-04 | Sosuke Naito | Ledモジュールおよびそれを用いたled照明器具 |
JP2015176707A (ja) * | 2014-03-14 | 2015-10-05 | パナソニックIpマネジメント株式会社 | 照明器具 |
US20170146199A1 (en) * | 2014-07-09 | 2017-05-25 | Osram Gmbh | Semiconductor Lamp |
JP2020004688A (ja) * | 2018-07-02 | 2020-01-09 | 株式会社小糸製作所 | 灯具ユニット及び車両用灯具並びに灯具ユニット製造方法 |
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