WO2023243588A1 - Light source module - Google Patents

Light source module Download PDF

Info

Publication number
WO2023243588A1
WO2023243588A1 PCT/JP2023/021703 JP2023021703W WO2023243588A1 WO 2023243588 A1 WO2023243588 A1 WO 2023243588A1 JP 2023021703 W JP2023021703 W JP 2023021703W WO 2023243588 A1 WO2023243588 A1 WO 2023243588A1
Authority
WO
WIPO (PCT)
Prior art keywords
light source
board
source module
heat dissipation
connector
Prior art date
Application number
PCT/JP2023/021703
Other languages
French (fr)
Japanese (ja)
Inventor
哲也 鈴木
徹 伊東
篤 小澤
晃雄 庄司
Original Assignee
株式会社小糸製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社小糸製作所 filed Critical 株式会社小糸製作所
Publication of WO2023243588A1 publication Critical patent/WO2023243588A1/en

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F21S45/48—Passive cooling, e.g. using fins, thermal conductive elements or openings with means for conducting heat from the inside to the outside of the lighting devices, e.g. with fins on the outer surface of the lighting device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2102/00—Exterior vehicle lighting devices for illuminating purposes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to the technical field of a light source module that is used by being attached to a mounting member such as a lamp housing.
  • a vehicular lamp is provided with a light source module that is removable from a lamp housing made up of a lamp housing and a cover, and the light emitted from the light source of the light source module is transmitted through the cover to the outside.
  • a light source module that is removable from a lamp housing made up of a lamp housing and a cover, and the light emitted from the light source of the light source module is transmitted through the cover to the outside.
  • the light source module is provided with a heat radiating section such as a heat radiating fin for discharging heat generated when the light source is driven to the outside.
  • a heat radiating section such as a heat radiating fin for discharging heat generated when the light source is driven to the outside.
  • a plate-shaped member made of a metal material and functioning as a heat sink is provided, and the heat sink is covered with a resin material having thermal conductivity.
  • JP2021-57118A Japanese Patent Application Publication No. 2018-113234
  • a so-called derating function that suppresses the amount of current supplied to the light source when the light source is at high temperature during operation may be added. It may be necessary to incorporate it.
  • the light source module of the present invention aims to improve heat dissipation and ensure high functionality.
  • the light source module includes: a board on which a light source is mounted; a board mounting part to which the board is attached; a heat dissipation part that emits heat transferred via the board mounting part when the light source is driven; a connector part having a power feeding terminal connected to a board and a terminal holding part holding the power feeding terminal, a part having the board mounting part and the heat dissipation part is provided as a module main body, and the module main body is die-cast.
  • the terminal holding portion is formed of a resin material.
  • the module body including the board attachment part and the heat dissipation part is formed of a metal material
  • the terminal holding part that holds the power supply terminal connected to the board is formed of a resin material
  • the module body including the board mounting part and the heat dissipation part is formed of a metal material, and the terminal holding part that holds the power supply terminal connected to the board is formed of a resin material, so that heat dissipation is improved. This makes it possible to ensure high functionality.
  • FIGS. 2 to 10 An embodiment of the present invention is shown together with FIGS. 2 to 10, and this figure is a sectional view of a vehicular lamp.
  • It is a perspective view of a light source module.
  • FIG. 3 is a rear view of the light source module.
  • FIG. 3 is an exploded perspective view of the light source module.
  • FIG. 3 is an enlarged perspective view showing a first retaining protrusion and a second retaining protrusion.
  • FIG. 3 is an enlarged perspective view showing a first engagement protrusion and a second engagement protrusion.
  • FIG. 6 is a diagram schematically showing a state in which the first retaining protrusion and the second retaining protrusion are engaged with the first engaging protrusion and the second engaging protrusion.
  • FIG. 7 is a perspective view showing a light source module with another configuration.
  • FIG. 3 is a cross-sectional view showing a configuration in which positioning pins are provided.
  • FIG. 3 is a diagram showing a state in which the
  • the optical axis direction of the light emitted from the light source module is the front-back direction
  • the light emission direction is the front
  • the front-rear, top-down, left-right, and front-back directions are shown. Note that the front, back, top, bottom, left and right directions shown below are for convenience of explanation, and the implementation of the present invention is not limited to these directions.
  • the vehicular lamp 1 includes a lamp housing 2 having an opening at the front end and a cover 3 that closes the opening of the lamp housing 2 (see FIG. 1).
  • the lamp housing 2 and the cover 3 constitute a lamp outer casing 4, and a space inside the lamp outer casing 4 is formed as a lamp chamber 5.
  • the lamp housing 2 constitutes a part of the lamp outer casing 4 and also functions as a mounting member. Note that the vehicle lamp 1 may be provided with a reflector or the like other than the lamp housing 2 as a mounting member.
  • a mounting hole 2a is formed in the lamp housing 2 and extends through the lamp housing 2 from front to back.
  • a plurality of engagement grooves are formed in the lamp housing 2 around the mounting hole 2a so as to be spaced apart in the circumferential direction.
  • a light guide 6 that functions as an optical member is arranged in the lamp chamber 5 and is made of, for example, a transparent resin material or glass material.
  • a portion of the light guide 6 located directly in front of the mounting hole 2a is provided as an entrance portion 6a, and a portion on the tip side is provided as an output portion 6b.
  • optical member arranged in the lamp chamber 5 is not limited to the light guide 6, and other optical members such as an inner lens may be arranged in the lamp chamber 5.
  • a light source module 7 is removably attached to the lamp housing 2.
  • the light source module 7 has a module main body 8 and a connector section 9 (see FIGS. 2 to 4).
  • the heat dissipation section 10 includes a substantially disk-shaped base surface section 12 facing in the front-rear direction, a plurality of first heat dissipation fins 13 protruding rearward from the base surface section 12, and a pair of second heat dissipation fins 13 protruding rearward from the base surface section 12. It has fins 14.
  • the first radiation fins 13 are, for example, arranged at equal intervals in the left-right direction.
  • the second radiation fins 14 are located on both sides of the first radiation fins 13 and protrude from the base surface portion 12 in the same direction as the first radiation fins 13.
  • the heat radiation section 10 has a large surface area.
  • the surface of the heat dissipation section 10 may be alumite-treated or painted in a dark color such as black. By subjecting the surface of the heat radiating section 10 to an alumite treatment such as black or painting, the heat radiation efficiency can be improved.
  • the surface of the board mounting portion 11 may also be subjected to blasting, alumite treatment such as black, painting, etc.
  • the module main body 8 is formed with an insertion hole 17 extending from the front to the rear.
  • the insertion hole 17 is formed at a position extending from the attachment insertion portion 15 to the base surface portion 12, and has a front end opened to the attachment insertion portion 15 and a rear end opened to the base surface portion 12.
  • the first retaining protrusion 18 consists of a base part 20 formed in a substantially rectangular parallelepiped shape extending in the circumferential direction of the insertion hole 17 and a regulating protrusion 21 protruding rearward from one end of the base part 20, and as a whole. It is formed into an approximately L shape.
  • the connector portion 9 is inserted into the insertion hole 17 from the rear and attached to the module body 8.
  • the connector portion 9 is attached to the module body 8 by being inserted into the insertion hole 17 and rotated in the direction around the axis.
  • the first engagement protrusion 28 and the second engagement protrusion 29 are connected to the base part 20 of the first retaining protrusion 18 and the second engagement protrusion 29. It is engaged with the base portion 22 of the stop projection 19 in the front-rear direction (see FIG. 7). Therefore, the connector portion 9 is positioned relative to the module body 8 in the front-rear direction, and the connector portion 9 is prevented from falling out of the insertion hole 17.
  • the first engagement protrusion 28 and the second engagement protrusion 29 are connected to the regulation protrusion 21 of the first retaining protrusion 18 and the regulating protrusion 23 of the second retaining protrusion 19, respectively. is engaged in the circumferential direction, and the insertion protrusion 29a is inserted into the insertion recess 22a. Therefore, the connector portion 9 is positioned relative to the module body 8 in the axial direction.
  • the insertion hole 17 is filled with an adhesive (not shown) to perform so-called potting.
  • a portion of the connector portion 9 other than the front end portion of the power supply terminal 24 is covered with the adhesive.
  • a connector (not shown) connected to a power circuit (external power) (not shown) is inserted into the connector insertion space and connected to the connector connection part 27 of the connector part 9.
  • a power supply circuit is connected to the power supply terminal 24 via a connector.
  • the board 30 is attached to the board attachment part 11 using, for example, an insulating adhesive.
  • the board 30 is inserted into the placement recess 15a and is bonded to and attached to the board placement surface 15b.
  • a plurality of light sources 31 are mounted on the substrate 30 in a lined manner. However, the number of light sources 31 may be one.
  • the light source 31 for example, a light emitting diode (LED) is used.
  • a circuit pattern is formed on the substrate 30, and the front end portion of the power supply terminal 24 is joined to the terminal portion of the circuit pattern by, for example, soldering. Therefore, the light source 31 is connected to the power supply circuit via the circuit pattern, the power supply terminal 24, and the connector, and a driving current is supplied to the light source 31 from the power supply circuit.
  • the power supply terminal 24 may be connected to the terminal portion of the circuit pattern by a conductive wire or the like.
  • an annular gasket 32 is fitted onto the mounting insertion portion 15 of the board mounting portion 11 (see FIG. 1).
  • Gasket 32 is made of resin or rubber material.
  • the board mounting part 11 is inserted into the mounting hole 2a of the lamp housing 2 from the rear side, and is rotated in the circumferential direction so that the mounting protrusions 16 are engaged with the respective engagement grooves. and then attached to the lamp housing 2.
  • the gasket 32 prevents foreign matter such as moisture and dust from entering the lamp chamber 5 from the outside.
  • the adhesive filled into the insertion hole 17 by potting prevents foreign substances such as moisture and dust from entering the lamp chamber 5 from the insertion hole 17.
  • the light source module 7 When the light source module 7 is attached to the lamp housing 2 and the connector is connected to the connector connection part 27 of the connector part 9, when power is supplied from the power supply circuit to the light source 31 via the power supply terminal 24, light is emitted from the light source 31. is emitted.
  • the light emitted from the light source 31 enters from the entrance part 6a, is guided by the light guide 6, is emitted from the exit part 6b, is transmitted through the cover 3, and is irradiated to the outside.
  • the light source 31 When the light source 31 is driven (when emitting light), heat is generated in the light source 31 and the substrate 30, and the generated heat is transmitted from the substrate mounting part 11 to the heat dissipation part 10, and is mainly transmitted between the first heat dissipation fin 13 and the second heat dissipation fin 13. is emitted from the heat dissipation fins 14 of. Therefore, the temperature rise of the light source 31 is suppressed, and a good light emission state of the light source 31 is ensured.
  • the light source module 7 has a part that includes the board mounting part 11 to which the board 30 is attached and the heat dissipation part 10 that emits heat transmitted via the board mounting part 11 when the light source 31 is driven.
  • a module body 8 the module body 8 is formed by die casting, and the terminal holding portion 25 of the connector portion 9 is formed of a resin material.
  • the module main body 8 including the board mounting part 11 and the heat dissipation part 10 is formed of a metal material, and the terminal holding part 25 that holds the power supply terminal 24 connected to the board 30 is formed of a resin material, the heat dissipation is improved. It is possible to improve functionality and ensure high functionality.
  • the amount of luminous flux of light emitted from the light source 31 can be increased to ensure high brightness (illuminance), etc., and the amount of current supplied to the light source 31 can be increased.
  • the circuit structure formed on the substrate 30 does not become complicated, noise is less likely to occur, and functionality can be improved.
  • the light source module 7 can be made smaller and lighter by downsizing, and the structure can be simplified by not providing a heat dissipation fin. be able to.
  • the connector part 9 is provided with a first engagement protrusion 28 and a second engagement protrusion 29, and when the connector part 9 is inserted into the insertion hole 17 in the module main body 8, the first engagement protrusion 28 and the second engagement protrusion 29 are provided.
  • a first retaining protrusion 18 and a second retaining protrusion 19 are provided, with which the portion 28 and the second engaging protrusion 29 are engaged.
  • the connector part 9 when the connector part 9 is inserted into the insertion hole 17, the first engagement protrusion 28 and the second engagement protrusion 29 are connected to the first retaining protrusion 18 and the second retaining protrusion 19. Since the connector part 9 is held in the module main body 8 by being engaged with the connector part 9, it is possible to easily prevent the connector part 9 from falling off from the module main body 8 with a simple structure.
  • first retaining protrusion 18 and the second retaining protrusion 19 are provided with restricting protrusions 21 and 23 for regulating the rotation of the connector portion 9, respectively, the structure is simplified. In this way, high positional accuracy of the connector portion 9 relative to the module body 8 in the rotational direction can be ensured.
  • a regulating protrusion may be provided on either the first retaining protrusion 18 or the second retaining protrusion 19.
  • the board mounting portion 11 is provided with a mounting insertion portion 15 that is inserted into the mounting hole 2a of the lamp housing 2 and functions as a mounting member, and the outer peripheral surface of the mounting insertion portion 15 is coated with a resin. There is.
  • the coated portion comes into contact with the lamp housing 2, so that the heat generated when the light source 31 is driven is reduced. It is difficult for the heat to be transmitted from the board attachment part 11 to the lamp housing 2, and it is possible to prevent the lamp housing 2 from melting due to heat radiation from the module main body 8.
  • the diameter of the mounting insertion part 15 can be made smaller in advance and the structure can be simplified, and the die-casting material used to form the module body 8 can be reduced and the mold can be simplified. By increasing the number, the manufacturing cost of the light source module 7 can be reduced.
  • the light source module 7 for example, A configuration may also be provided in which heat dissipation fins 33 are provided that protrude rearward from a portion or the entirety (see FIG. 8). With such a configuration, it is possible to simplify the structure of the light source module 7 and improve heat dissipation.
  • a positioning pin 34 may be provided that protrudes from the outer circumference of the board placement surface 15b of the board mounting portion 11 (see FIGS. 9 and 10).
  • the positioning pins 34 each protrude forward from, for example, four corners of the outer periphery of the board placement surface 15b.
  • the positioning pin 34 may be formed integrally with the board mounting portion 11 and may be formed by die-casting, but may also be formed of, for example, a resin material with low thermal conductivity. Note that at least three positioning pins 34 may be provided.
  • positioning recess 36 are formed at each corner of the substrate 30, and a plurality of positioning recesses 36 are formed at the outer periphery of the incident portion 6a of the light guide 6. .
  • the bottom surface (rear surface) forming the positioning recess 36 is formed as a receiving surface 36a.
  • the substrate 30 is positioned with respect to the substrate mounting portion 11 in the direction perpendicular to the optical axis direction by positioning the positioning pins 34 corresponding to the positioning notches 35, respectively.
  • the light guide 6 is configured such that the positioning pins 34 are inserted into the positioning recesses 36 and the tip surfaces 34a of the positioning pins 34 are abutted against the receiving surfaces 36a, so that the light guide 6 can be operated in a direction perpendicular to the optical axis direction and in the optical axis direction. It is positioned relative to the light source 31.
  • the positioning pins 34 position the board 30 with respect to the board mounting portion 11, and also position the light guide 6, which functions as an optical member, with respect to the light source 31. Therefore, functionality can be improved while ensuring simplification of the structure.
  • the light emitted from the light source 31 is incident on the light guide 6, it is possible to ensure that the light emitted from the light source 31 enters the light guide 6 appropriately, and the light emitted from the light source 31 is emitted from the light guide 6. It is possible to make effective use of the light that is generated, and to ensure an appropriate light distribution state in the vehicular lamp 1.
  • the positioning pin 34 by forming the positioning pin 34 from a resin material with low thermal conductivity, it becomes even more difficult for heat to be transferred from the light source module 7 to the light guide 6, and the effect of preventing the light source module 7 from melting can be enhanced. .
  • Vehicle lamp Lamp housing (mounting member) 2a Mounting hole 6 Light guide (optical member) 7 Light source module 8 Module body 9 Connector part 10 Heat dissipation part 11 Board mounting part 15 Mounting insertion part 17 Insertion hole 18 First retaining protrusion 19 Second retaining protrusion 24 Power supply terminal 25 Terminal holding part 28 First Engagement protrusion 29 Second engagement protrusion 30 Board 31 Light source 34 Positioning pin

Abstract

The light source module according to the present invention comprises: a board on which a light source is mounted; a board attachment part to which the board can be attached; a heat dissipation unit that dissipates heat transmitted via the board attachment part when the light source is driven; and a connector part having a power feed terminal connected to the board and a terminal-holding unit that holds the power feed terminal. The part having the board attachment part and the heat dissipation unit is provided as the module body, the module body is formed by die casting, and the terminal-holding unit is formed using a resin material.

Description

光源モジュールlight source module
　本発明は、ランプハウジング等の取付部材に取り付けられて用いられる光源モジュールについての技術分野に関する。 TECHNICAL FIELD The present invention relates to the technical field of a light source module that is used by being attached to a mounting member such as a lamp housing.
　車輌用灯具には、例えば、ランプハウジングとカバーによって構成された灯具外筐に対して着脱可能とされた光源モジュールが設けられ、光源モジュールの光源から出射された光がカバーを透過されて外部へ向けて照射されるものがある（例えば、特許文献１及び特許文献２参照）。 For example, a vehicular lamp is provided with a light source module that is removable from a lamp housing made up of a lamp housing and a cover, and the light emitted from the light source of the light source module is transmitted through the cover to the outside. There are some that are irradiated toward the target (for example, see Patent Document 1 and Patent Document 2).
　光源モジュールには光源の駆動時に発生する熱を外部に放出するための放熱フィン等の放熱部が設けられている。このような光源モジュールにおいては、金属材料によって形成された放熱板として機能する板状の部材が設けられ、放熱板が熱伝導性を有する樹脂材料によって覆われる構成にされている。 The light source module is provided with a heat radiating section such as a heat radiating fin for discharging heat generated when the light source is driven to the outside. In such a light source module, a plate-shaped member made of a metal material and functioning as a heat sink is provided, and the heat sink is covered with a resin material having thermal conductivity.
　樹脂材料によって形成された部分の内部に放熱板が設けられることにより、光源の駆動時に発生する熱の良好な放熱性を確保することが可能になると共に強度の向上を図ることが可能にされている。 By providing a heat sink inside the part formed of resin material, it is possible to ensure good heat dissipation of the heat generated when the light source is driven, and it is also possible to improve the strength. There is.
特開２０２１－５７１１８号公報JP2021-57118A 特開２０１８－１１３２３４号公報Japanese Patent Application Publication No. 2018-113234
　ところで、近年、高い輝度（照度）を確保する等のために光束量を高めることが必要になる場合も多く、このような光源モジュールにおいては、光源の良好な駆動状態を確保するために一層高い放熱性が必要にされている。 Incidentally, in recent years, it has often become necessary to increase the amount of luminous flux in order to ensure high brightness (illuminance), etc., and in such light source modules, it has become necessary to increase the amount of luminous flux to ensure good driving conditions of the light source. Heat dissipation is required.
　一方、このような光源モジュールにおいて一層高い放熱性を確保することが困難な場合には、例えば、光源の駆動時に高温になった状態において光源に供給される電流量を抑制する所謂ディレーティング機能を組み込むことが必要になる場合もある。 On the other hand, if it is difficult to ensure even higher heat dissipation performance in such a light source module, for example, a so-called derating function that suppresses the amount of current supplied to the light source when the light source is at high temperature during operation may be added. It may be necessary to incorporate it.
　しかしながら、ディレーティング機能を組み込む場合には基板に形成される回路の構成が複雑になりノイズが発生し易くなって機能性の低下を来すおそれがある。 However, when a derating function is incorporated, the configuration of the circuit formed on the substrate becomes complicated, and noise is likely to occur, which may lead to a decrease in functionality.
　そこで、本発明光源モジュールは、放熱性の向上を図って高い機能性を確保することを目的とする。 Therefore, the light source module of the present invention aims to improve heat dissipation and ensure high functionality.
　本発明に係る光源モジュールは、光源が搭載された基板と、前記基板が取り付けられる基板取付部と、前記光源の駆動時に前記基板取付部を介して伝達される熱を放出する放熱部と、前記基板に接続される給電端子と前記給電端子を保持する端子保持部とを有するコネクター部とを備え、前記基板取付部と前記放熱部を有する部分がモジュール本体として設けられ、前記モジュール本体がダイキャストによって形成され、前記端子保持部が樹脂材料によって形成されたものである。 The light source module according to the present invention includes: a board on which a light source is mounted; a board mounting part to which the board is attached; a heat dissipation part that emits heat transferred via the board mounting part when the light source is driven; a connector part having a power feeding terminal connected to a board and a terminal holding part holding the power feeding terminal, a part having the board mounting part and the heat dissipation part is provided as a module main body, and the module main body is die-cast. The terminal holding portion is formed of a resin material.
　これにより、基板取付部と放熱部を含むモジュール本体が金属材料によって形成されると共に基板に接続される給電端子を保持する端子保持部が樹脂材料によって形成される。 As a result, the module body including the board attachment part and the heat dissipation part is formed of a metal material, and the terminal holding part that holds the power supply terminal connected to the board is formed of a resin material.
　本発明によれば、基板取付部と放熱部を含むモジュール本体が金属材料によって形成されると共に基板に接続される給電端子を保持する端子保持部が樹脂材料によって形成されるため、放熱性の向上を図って高い機能性を確保することができる。 According to the present invention, the module body including the board mounting part and the heat dissipation part is formed of a metal material, and the terminal holding part that holds the power supply terminal connected to the board is formed of a resin material, so that heat dissipation is improved. This makes it possible to ensure high functionality.
図２乃至図１０と共に本発明の実施の形態を示すものであり、本図は、車輌用灯具の断面図である。An embodiment of the present invention is shown together with FIGS. 2 to 10, and this figure is a sectional view of a vehicular lamp. 光源モジュールの斜視図である。It is a perspective view of a light source module. 光源モジュールの背面図である。FIG. 3 is a rear view of the light source module. 光源モジュールの分解斜視図である。FIG. 3 is an exploded perspective view of the light source module. 第１の抜け止め突部と第２の抜け止め突部を示す拡大斜視図である。FIG. 3 is an enlarged perspective view showing a first retaining protrusion and a second retaining protrusion. 第１の係合突部と第２の係合突部を示す拡大斜視図である。FIG. 3 is an enlarged perspective view showing a first engagement protrusion and a second engagement protrusion. 第１の抜け止め突部と第２の抜け止め突部が第１の係合突部と第２の係合突部に係合された状態を模式的に示す図である。FIG. 6 is a diagram schematically showing a state in which the first retaining protrusion and the second retaining protrusion are engaged with the first engaging protrusion and the second engaging protrusion. 別の構成の光源モジュールを示す斜視図である。FIG. 7 is a perspective view showing a light source module with another configuration. 位置決めピンが設けられた構成を示す断面図である。FIG. 3 is a cross-sectional view showing a configuration in which positioning pins are provided. 位置決めピンによって基板が位置決めされた状態を示す図である。FIG. 3 is a diagram showing a state in which the board is positioned by positioning pins.
　以下に、本発明を実施するための形態について添付図面を参照して説明する。以下の説明においては、光源モジュールから出射される光の光軸方向を前後方向とし光の出射方向を前方として前後上下左右の方向を示すものとする。尚、以下に示す前後上下左右の方向は説明の便宜上のものであり、本発明の実施に関しては、これらの方向に限定されることはない。 Embodiments for carrying out the present invention will be described below with reference to the accompanying drawings. In the following description, the optical axis direction of the light emitted from the light source module is the front-back direction, and the light emission direction is the front, and the front-rear, top-down, left-right, and front-back directions are shown. Note that the front, back, top, bottom, left and right directions shown below are for convenience of explanation, and the implementation of the present invention is not limited to these directions.
　車輌用灯具１は前端に開口を有するランプハウジング２とランプハウジング２の開口を閉塞するカバー３とを備えている（図１参照）。ランプハウジング２とカバー３によって灯具外筐４が構成され、灯具外筐４の内部の空間が灯室５として形成されている。 The vehicular lamp 1 includes a lamp housing 2 having an opening at the front end and a cover 3 that closes the opening of the lamp housing 2 (see FIG. 1). The lamp housing 2 and the cover 3 constitute a lamp outer casing 4, and a space inside the lamp outer casing 4 is formed as a lamp chamber 5.
　ランプハウジング２は灯具外筐４の一部を構成すると共に取付部材としても機能する。尚、車輌用灯具１においては、取付部材としてランプハウジング２以外のリフレクター等が設けられていてもよい。 The lamp housing 2 constitutes a part of the lamp outer casing 4 and also functions as a mounting member. Note that the vehicle lamp 1 may be provided with a reflector or the like other than the lamp housing 2 as a mounting member.
　ランプハウジング２には前後に貫通された取付孔２ａが形成されている。ランプハウジング２には取付孔２ａの周囲に図示しない複数の係合溝が周方向に離隔して形成されている。 A mounting hole 2a is formed in the lamp housing 2 and extends through the lamp housing 2 from front to back. A plurality of engagement grooves (not shown) are formed in the lamp housing 2 around the mounting hole 2a so as to be spaced apart in the circumferential direction.
　灯室５には、例えば、透明な樹脂材料やガラス材料によって形成された光学部材として機能する導光体６が配置されている。導光体６は取付孔２ａの真正面に位置する部分が入射部６ａとして設けられ、先端側の部分が出射部６ｂとして設けられている。導光体６において入射部６ａから光が入射されると入射された光が導かれて出射部６ｂから前方へ向けて出射され、カバー３を透過されて外部へ向けて照射される。 A light guide 6 that functions as an optical member is arranged in the lamp chamber 5 and is made of, for example, a transparent resin material or glass material. A portion of the light guide 6 located directly in front of the mounting hole 2a is provided as an entrance portion 6a, and a portion on the tip side is provided as an output portion 6b. When light enters the light guide 6 from the entrance section 6a, the incident light is guided and emitted forward from the exit section 6b, transmitted through the cover 3, and irradiated to the outside.
　尚、灯室５に配置される光学部材は導光体６に限られることはなく、灯室５にインナーレンズ等の他の光学部材が配置されていてもよい。 Note that the optical member arranged in the lamp chamber 5 is not limited to the light guide 6, and other optical members such as an inner lens may be arranged in the lamp chamber 5.
　ランプハウジング２には光源モジュール７が着脱可能にされている。光源モジュール７はモジュール本体８とコネクター部９を有している（図２乃至図４参照）。 A light source module 7 is removably attached to the lamp housing 2. The light source module 7 has a module main body 8 and a connector section 9 (see FIGS. 2 to 4).
　モジュール本体８はアルミニウムやマグネシウム等のダイキャストにより全体が一体に形成されている。モジュール本体８は放熱部１０と基板取付部１１を有している。 The entire module body 8 is integrally formed by die-casting of aluminum, magnesium, or the like. The module main body 8 has a heat dissipation section 10 and a board mounting section 11.
　放熱部１０は前後方向を向く略円板状のベース面部１２とベース面部１２から後方に突出された複数の第１の放熱フィン１３とベース面部１２から後方に突出された一対の第２の放熱フィン１４とを有している。 The heat dissipation section 10 includes a substantially disk-shaped base surface section 12 facing in the front-rear direction, a plurality of first heat dissipation fins 13 protruding rearward from the base surface section 12, and a pair of second heat dissipation fins 13 protruding rearward from the base surface section 12. It has fins 14.
　第１の放熱フィン１３は、例えば、左右方向において等間隔に並んで設けられている。第２の放熱フィン１４は第１の放熱フィン１３の両側に位置され、第１の放熱フィン１３と同じ向きでベース面部１２から突出されている。 The first radiation fins 13 are, for example, arranged at equal intervals in the left-right direction. The second radiation fins 14 are located on both sides of the first radiation fins 13 and protrude from the base surface portion 12 in the same direction as the first radiation fins 13.
　放熱部１０の表面の少なくとも一部には研磨材を打ち付けて行うブラスト加工による表面処理が施されている。従って、放熱部１０は表面積が大きくされている。尚、放熱部１０の表面には黒色等の暗色によるアルマイト処理や塗装等が施されていてもよい。放熱部１０の表面に黒色等のアルマイト処理や塗装等が施されることにより、熱の放射効率の向上が図られる。 At least a portion of the surface of the heat dissipating section 10 is subjected to surface treatment by blasting by applying an abrasive material. Therefore, the heat radiation section 10 has a large surface area. Note that the surface of the heat dissipation section 10 may be alumite-treated or painted in a dark color such as black. By subjecting the surface of the heat radiating section 10 to an alumite treatment such as black or painting, the heat radiation efficiency can be improved.
　また、光源モジュール７においては、ブラスト加工や黒色等のアルマイト処理や塗装等が基板取付部１１の表面に対しても施されていてもよい。 Furthermore, in the light source module 7, the surface of the board mounting portion 11 may also be subjected to blasting, alumite treatment such as black, painting, etc.
　基板取付部１１はベース面部１２の中央部から前方に突出され、外形が円形状に形成された取付用挿通部１５と取付用挿通部１５の前端部から外方に突出された複数の取付用突部１６とを有している。取付用突部１６は周方向に離隔して設けられている。 The board mounting part 11 projects forward from the center of the base surface part 12, and includes a mounting insertion part 15 having a circular outer shape and a plurality of mounting parts protruding outward from the front end of the mounting insertion part 15. It has a protrusion 16. The mounting protrusions 16 are provided spaced apart in the circumferential direction.
　取付用挿通部１５には前方に開口された配置凹部１５ａが形成されている。配置凹部１５ａは略矩形状に形成され、取付用挿通部１５において配置凹部１５ａを形成する前方を向く面が基板配置面１５ｂとして形成されている。取付用挿通部１５の外周面には取付用突部１６より後側の部分に樹脂のコーティングが施されている。コーティング用の樹脂としては、例えば、熱伝導性の低いポリエチレンテレフタレート（ＰＥＴ：Polyethylene terephthalate）が用いられている。 A placement recess 15a that is open toward the front is formed in the attachment insertion portion 15. The arrangement recess 15a is formed in a substantially rectangular shape, and the front facing surface forming the arrangement recess 15a in the attachment insertion portion 15 is formed as a board arrangement surface 15b. The outer circumferential surface of the attachment insertion portion 15 is coated with a resin at a portion on the rear side of the attachment protrusion 16 . As the coating resin, for example, polyethylene terephthalate (PET), which has low thermal conductivity, is used.
　モジュール本体８には前後に貫通された挿通孔１７が形成されている。挿通孔１７は取付用挿通部１５からベース面部１２に亘る位置に形成され、前端が取付用挿通部１５に開口され後端がベース面部１２に開口されている。 The module main body 8 is formed with an insertion hole 17 extending from the front to the rear. The insertion hole 17 is formed at a position extending from the attachment insertion portion 15 to the base surface portion 12, and has a front end opened to the attachment insertion portion 15 and a rear end opened to the base surface portion 12.
　放熱部１０には挿通孔１７を形成する周面からそれぞれ内方に突出された第１の抜け止め突部１８と第２の抜け止め突部１９が、例えば、二つずつ設けられている（図４及び図５参照）。第１の抜け止め突部１８と第２の抜け止め突部１９は周方向に交互に離隔して位置され、挿通孔１７の軸方向における位置が異なる状態にされている。 The heat dissipation section 10 is provided with, for example, two first retaining protrusions 18 and two second retaining protrusions 19, each of which protrudes inward from the circumferential surface forming the insertion hole 17. (See Figures 4 and 5). The first retaining protrusions 18 and the second retaining protrusions 19 are positioned alternately apart from each other in the circumferential direction, and the positions in the axial direction of the insertion hole 17 are different.
　第１の抜け止め突部１８は挿通孔１７の周方向に延びる略直方体状に形成されたベース部２０とベース部２０の一端部から後方に突出された規制突部２１とから成り、全体として略Ｌ字状に形成されている。 The first retaining protrusion 18 consists of a base part 20 formed in a substantially rectangular parallelepiped shape extending in the circumferential direction of the insertion hole 17 and a regulating protrusion 21 protruding rearward from one end of the base part 20, and as a whole. It is formed into an approximately L shape.
　第２の抜け止め突部１９は挿通孔１７の周方向に延びる略直方体状に形成されたベース部２２とベース部２２の一端部から前方に突出された規制突部２３とから成り、全体として略Ｌ字状に形成されている。ベース部２２には前方に開口された浅い挿入凹部２２ａが形成されている。 The second retaining protrusion 19 consists of a base part 22 formed in a substantially rectangular parallelepiped shape extending in the circumferential direction of the insertion hole 17 and a regulating protrusion 23 protruding forward from one end of the base part 22, and as a whole. It is formed into an approximately L shape. The base portion 22 is formed with a shallow insertion recess 22a that is open toward the front.
　コネクター部９は前後方向に延びる形状に形成され、一対の給電端子２４と給電端子２４を保持する端子保持部２５とによって構成されている（図４及び図６参照）。コネクター部９は給電端子２４が金属材料によって形成され端子保持部２５が樹脂材料によって形成されている。 The connector part 9 is formed in a shape extending in the front-rear direction, and is composed of a pair of power supply terminals 24 and a terminal holding part 25 that holds the power supply terminals 24 (see FIGS. 4 and 6). In the connector portion 9, the power supply terminal 24 is formed of a metal material, and the terminal holding portion 25 is formed of a resin material.
　端子保持部２５は前側略半分の部分が連結軸部２６として設けられ後側略半分の部分がコネクター接続部２７として設けられ、連結軸部２６の外形がコネクター接続部２７の外形より小さくされている。 In the terminal holding part 25, approximately half of the front side is provided as a connecting shaft part 26, and approximately half of the rear part is provided as a connector connecting part 27, and the external shape of the connecting shaft part 26 is made smaller than the external shape of the connector connecting part 27. There is.
　連結軸部２６にはそれぞれ外方に突出された第１の係合突部２８と第２の係合突部２９が、例えば、二つずつ設けられている。第１の係合突部２８と第２の係合突部２９は周方向に交互に離隔して位置され、例えば、略直方体状に形成されている。第２の係合突部２９には後方に凸の挿入突部２９ａが設けられている。コネクター接続部２７には後方に開口された図示しないコネクター挿入空間が形成されている。 The connecting shaft portion 26 is provided with, for example, two first engagement protrusions 28 and two second engagement protrusions 29, each of which protrudes outward. The first engagement protrusions 28 and the second engagement protrusions 29 are positioned alternately apart from each other in the circumferential direction, and are formed, for example, in the shape of a substantially rectangular parallelepiped. The second engagement protrusion 29 is provided with an insertion protrusion 29a that is convex toward the rear. The connector connecting portion 27 has a rearwardly opened connector insertion space (not shown).
　コネクター部９は、例えば、給電端子２４と端子保持部２５がインサート成形によって一体に形成され、給電端子２４の前端部が連結軸部２６から前方に突出され、給電端子２４の後端部が連結軸部２６から後方に突出されてコネクター挿入空間に位置されている。 In the connector part 9, for example, the power supply terminal 24 and the terminal holding part 25 are integrally formed by insert molding, the front end of the power supply terminal 24 protrudes forward from the connecting shaft part 26, and the rear end of the power supply terminal 24 is connected. It projects rearward from the shaft portion 26 and is located in the connector insertion space.
　コネクター部９は挿通孔１７に後方から挿入されてモジュール本体８に取り付けられる。コネクター部９のモジュール本体８への取付は、挿通孔１７に挿入された状態で軸回り方向へ回転されることにより行われる。 The connector portion 9 is inserted into the insertion hole 17 from the rear and attached to the module body 8. The connector portion 9 is attached to the module body 8 by being inserted into the insertion hole 17 and rotated in the direction around the axis.
　コネクター部９がモジュール本体８に取り付けられた状態においては、第１の係合突部２８と第２の係合突部２９が第１の抜け止め突部１８のベース部２０と第２の抜け止め突部１９のベース部２２とに前後方向において係合される（図７参照）。従って、コネクター部９のモジュール本体８に対する前後方向における位置決めが行われると共にコネクター部９の挿通孔１７からの脱落が防止される。このとき、第１の係合突部２８と第２の係合突部２９がそれぞれ第１の抜け止め突部１８の規制突部２１と第２の抜け止め突部１９の規制突部２３とに周方向において係合されると共に挿入突部２９ａが挿入凹部２２ａに挿入される。従って、コネクター部９のモジュール本体８に対する軸回り方向における位置決めが行われる。 When the connector part 9 is attached to the module main body 8, the first engagement protrusion 28 and the second engagement protrusion 29 are connected to the base part 20 of the first retaining protrusion 18 and the second engagement protrusion 29. It is engaged with the base portion 22 of the stop projection 19 in the front-rear direction (see FIG. 7). Therefore, the connector portion 9 is positioned relative to the module body 8 in the front-rear direction, and the connector portion 9 is prevented from falling out of the insertion hole 17. At this time, the first engagement protrusion 28 and the second engagement protrusion 29 are connected to the regulation protrusion 21 of the first retaining protrusion 18 and the regulating protrusion 23 of the second retaining protrusion 19, respectively. is engaged in the circumferential direction, and the insertion protrusion 29a is inserted into the insertion recess 22a. Therefore, the connector portion 9 is positioned relative to the module body 8 in the axial direction.
　上記のようにコネクター部９がモジュール本体８に取り付けられた状態においては、挿通孔１７に図示しない接着剤が充填されて所謂ポッティングが行われる。接着剤によってコネクター部９における給電端子２４の前端部以外の部分が覆われる。 When the connector portion 9 is attached to the module main body 8 as described above, the insertion hole 17 is filled with an adhesive (not shown) to perform so-called potting. A portion of the connector portion 9 other than the front end portion of the power supply terminal 24 is covered with the adhesive.
　光源モジュール７がランプハウジング２に取り付けられた状態において、コネクター部９のコネクター接続部２７には図示しない電源回路（外部電力）に接続された図示しないコネクターがコネクター挿入空間に挿入されて接続され、電源回路がコネクターを介して給電端子２４に接続される。 When the light source module 7 is attached to the lamp housing 2, a connector (not shown) connected to a power circuit (external power) (not shown) is inserted into the connector insertion space and connected to the connector connection part 27 of the connector part 9. A power supply circuit is connected to the power supply terminal 24 via a connector.
　基板取付部１１には基板３０が、例えば、絶縁性の接着剤によって取り付けられる。基板３０は配置凹部１５ａに挿入された状態で基板配置面１５ｂに接合されて取り付けられる。基板３０には、例えば、複数の光源３１が並んだ状態で搭載されている。但し、光源３１は一つであってもよい。光源３１としては、例えば、発光ダイオード（ＬＥＤ：Light Emitting Diode）が用いられている。 The board 30 is attached to the board attachment part 11 using, for example, an insulating adhesive. The board 30 is inserted into the placement recess 15a and is bonded to and attached to the board placement surface 15b. For example, a plurality of light sources 31 are mounted on the substrate 30 in a lined manner. However, the number of light sources 31 may be one. As the light source 31, for example, a light emitting diode (LED) is used.
　基板３０には回路パターンが形成されており、回路パターンの端子部に、例えば、半田付けによって給電端子２４の前端部が接合される。従って、光源３１が回路パターンと給電端子２４とコネクターを介して電源回路に接続され、電源回路から光源３１に駆動電流が供給される。尚、給電端子２４は回路パターンの端子部に導電性ワイヤー等によって接続されていてもよい。 A circuit pattern is formed on the substrate 30, and the front end portion of the power supply terminal 24 is joined to the terminal portion of the circuit pattern by, for example, soldering. Therefore, the light source 31 is connected to the power supply circuit via the circuit pattern, the power supply terminal 24, and the connector, and a driving current is supplied to the light source 31 from the power supply circuit. Note that the power supply terminal 24 may be connected to the terminal portion of the circuit pattern by a conductive wire or the like.
　上記のように構成された光源モジュール７には、基板取付部１１の取付用挿通部１５に環状のガスケット３２が外嵌状に取り付けられる（図１参照）。ガスケット３２は樹脂材料又はゴム材料によって形成されている。 In the light source module 7 configured as described above, an annular gasket 32 is fitted onto the mounting insertion portion 15 of the board mounting portion 11 (see FIG. 1). Gasket 32 is made of resin or rubber material.
　光源モジュール７はガスケット３２が取り付けられた状態において、基板取付部１１がランプハウジング２の取付孔２ａに後側から挿入され、周方向に回転されて取付用突部１６がそれぞれ係合溝に係合されてランプハウジング２に取り付けられる。光源モジュール７がランプハウジング２に取り付けられた状態においては、ガスケット３２によって外部からの灯室５への水分や塵埃等の異物の侵入が防止される。また、挿通孔１７にポッティングにより充填された接着剤によって挿通孔１７から灯室５への水分や塵埃等の異物の侵入が防止される。 In the light source module 7, with the gasket 32 attached, the board mounting part 11 is inserted into the mounting hole 2a of the lamp housing 2 from the rear side, and is rotated in the circumferential direction so that the mounting protrusions 16 are engaged with the respective engagement grooves. and then attached to the lamp housing 2. When the light source module 7 is attached to the lamp housing 2, the gasket 32 prevents foreign matter such as moisture and dust from entering the lamp chamber 5 from the outside. Further, the adhesive filled into the insertion hole 17 by potting prevents foreign substances such as moisture and dust from entering the lamp chamber 5 from the insertion hole 17.
　一方、光源モジュール７が周方向において上記とは反対方向へ回転されると、取付用突部１６の係合溝に対する係合が解除され、光源モジュール７をランプハウジング２から取り外すことができる。 On the other hand, when the light source module 7 is rotated in the circumferential direction in the opposite direction to the above, the engagement of the mounting protrusion 16 with the engagement groove is released, and the light source module 7 can be removed from the lamp housing 2.
　光源モジュール７がランプハウジング２に取り付けられコネクター部９のコネクター接続部２７にコネクターが接続された状態において、電源回路から給電端子２４を介して光源３１に電源が供給されると、光源３１から光が出射される。光源３１から出射された光は入射部６ａから入射され導光体６で導かれて出射部６ｂから出射されカバー３を透過されて外部へ向けて照射される。 When the light source module 7 is attached to the lamp housing 2 and the connector is connected to the connector connection part 27 of the connector part 9, when power is supplied from the power supply circuit to the light source 31 via the power supply terminal 24, light is emitted from the light source 31. is emitted. The light emitted from the light source 31 enters from the entrance part 6a, is guided by the light guide 6, is emitted from the exit part 6b, is transmitted through the cover 3, and is irradiated to the outside.
　光源３１の駆動時（発光時）には光源３１及び基板３０において熱が発生するが、発生した熱は基板取付部１１から放熱部１０に伝達され、主として、第１の放熱フィン１３と第２の放熱フィン１４から放出される。従って、光源３１の温度上昇が抑制され、光源３１の良好な発光状態が確保される。 When the light source 31 is driven (when emitting light), heat is generated in the light source 31 and the substrate 30, and the generated heat is transmitted from the substrate mounting part 11 to the heat dissipation part 10, and is mainly transmitted between the first heat dissipation fin 13 and the second heat dissipation fin 13. is emitted from the heat dissipation fins 14 of. Therefore, the temperature rise of the light source 31 is suppressed, and a good light emission state of the light source 31 is ensured.
　以上に記載した通り、光源モジュール７にあっては、基板３０が取り付けられる基板取付部１１と光源３１の駆動時に基板取付部１１を介して伝達される熱を放出する放熱部１０とを有する部分がモジュール本体８として設けられ、モジュール本体８がダイキャストによって形成され、コネクター部９の端子保持部２５が樹脂材料によって形成されている。 As described above, the light source module 7 has a part that includes the board mounting part 11 to which the board 30 is attached and the heat dissipation part 10 that emits heat transmitted via the board mounting part 11 when the light source 31 is driven. is provided as a module body 8, the module body 8 is formed by die casting, and the terminal holding portion 25 of the connector portion 9 is formed of a resin material.
　従って、基板取付部１１と放熱部１０を含むモジュール本体８が金属材料によって形成されると共に基板３０に接続される給電端子２４を保持する端子保持部２５が樹脂材料によって形成されるため、放熱性の向上を図って高い機能性を確保することができる。 Therefore, since the module main body 8 including the board mounting part 11 and the heat dissipation part 10 is formed of a metal material, and the terminal holding part 25 that holds the power supply terminal 24 connected to the board 30 is formed of a resin material, the heat dissipation is improved. It is possible to improve functionality and ensure high functionality.
　特に、放熱性の向上が図られるため、高い輝度（照度）を確保する等のために光源３１から出射される光の光束量を高めることが可能になり、光源３１に供給される電流量を抑制するディレーティング機能を組み込む必要がなく、基板３０に形成される回路の構成が複雑にならずノイズが発生し難くなり機能性の向上を図ることができる。 In particular, since heat dissipation is improved, the amount of luminous flux of light emitted from the light source 31 can be increased to ensure high brightness (illuminance), etc., and the amount of current supplied to the light source 31 can be increased. There is no need to incorporate a derating function to suppress the noise, the circuit structure formed on the substrate 30 does not become complicated, noise is less likely to occur, and functionality can be improved.
　また、光源モジュール７における放熱性が向上するため、その分、光源モジュール７の小型化や小型化による軽量化を図ることができると共に放熱フィンを設けない構造にすることによる構造の簡素化を図ることができる。 In addition, since the heat dissipation performance of the light source module 7 is improved, the light source module 7 can be made smaller and lighter by downsizing, and the structure can be simplified by not providing a heat dissipation fin. be able to.
　さらに、放熱部１０にブラスト加工による表面処理が施されているため、表面処理により放熱部１０の表面積が増加し、光源モジュール７における放熱性の一層の向上を図ることができる。 Furthermore, since the heat dissipation part 10 is surface-treated by blasting, the surface area of the heat dissipation part 10 is increased by the surface treatment, and the heat dissipation performance of the light source module 7 can be further improved.
　さらに、コネクター部９に第１の係合突部２８と第２の係合突部２９が設けられ、モジュール本体８にコネクター部９が挿通孔１７に挿通された状態において第１の係合突部２８と第２の係合突部２９が係合される第１の抜け止め突部１８と第２の抜け止め突部１９が設けられている。 Furthermore, the connector part 9 is provided with a first engagement protrusion 28 and a second engagement protrusion 29, and when the connector part 9 is inserted into the insertion hole 17 in the module main body 8, the first engagement protrusion 28 and the second engagement protrusion 29 are provided. A first retaining protrusion 18 and a second retaining protrusion 19 are provided, with which the portion 28 and the second engaging protrusion 29 are engaged.
　従って、コネクター部９が挿通孔１７に挿通された状態において第１の抜け止め突部１８と第２の抜け止め突部１９に第１の係合突部２８と第２の係合突部２９が係合されてコネクター部９がモジュール本体８に保持されるため、コネクター部９のモジュール本体８からの脱落を簡素な構造によって容易に防止することができる。 Therefore, when the connector part 9 is inserted into the insertion hole 17, the first engagement protrusion 28 and the second engagement protrusion 29 are connected to the first retaining protrusion 18 and the second retaining protrusion 19. Since the connector part 9 is held in the module main body 8 by being engaged with the connector part 9, it is possible to easily prevent the connector part 9 from falling off from the module main body 8 with a simple structure.
　特に、車輌用灯具１においては、コネクター部９のコネクター接続部２７に対してコネクターが着脱されるときに前後方向においてコネクター部９に負荷が付与されるが、第１の抜け止め突部１８と第２の抜け止め突部１９の間に第１の係合突部２８と第２の係合突部２９が位置された状態でコネクター部９がモジュール本体８に保持されている。従って、コネクター部９に付与される負荷に拘わらずコネクター部９のモジュール本体８からの脱落を防止することができる。 In particular, in the vehicle lamp 1, when the connector is attached to and detached from the connector connecting portion 27 of the connector portion 9, a load is applied to the connector portion 9 in the front-rear direction. The connector portion 9 is held in the module body 8 with the first engagement protrusion 28 and the second engagement protrusion 29 positioned between the second retaining protrusion 19 . Therefore, regardless of the load applied to the connector section 9, the connector section 9 can be prevented from falling off from the module main body 8.
　さらにまた、第１の抜け止め突部１８と第２の抜け止め突部１９にそれぞれコネクター部９の回転を規制する規制突部２１、２３が設けられているため、構造の簡素化を確保した上でコネクター部９のモジュール本体８に対する回転方向における高い位置精度を確保することができる。 Furthermore, since the first retaining protrusion 18 and the second retaining protrusion 19 are provided with restricting protrusions 21 and 23 for regulating the rotation of the connector portion 9, respectively, the structure is simplified. In this way, high positional accuracy of the connector portion 9 relative to the module body 8 in the rotational direction can be ensured.
　尚、光源モジュール７においては、第１の抜け止め突部１８と第２の抜け止め突部１９の何れか一方に規制突部が設けられていてもよい。 Note that in the light source module 7, a regulating protrusion may be provided on either the first retaining protrusion 18 or the second retaining protrusion 19.
　加えて、基板取付部１１には取付部材として機能するランプハウジング２の取付孔２ａに挿通される取付用挿通部１５が設けられ、取付用挿通部１５の外周面に樹脂のコーティングが施されている。 In addition, the board mounting portion 11 is provided with a mounting insertion portion 15 that is inserted into the mounting hole 2a of the lamp housing 2 and functions as a mounting member, and the outer peripheral surface of the mounting insertion portion 15 is coated with a resin. There is.
　従って、取付用挿通部１５が取付孔２ａに挿通されて光源モジュール７がランプハウジング２に取り付けられた状態において、コーティングされた部分がランプハウジング２に接するため、光源３１の駆動時に発生する熱が基板取付部１１からランプハウジング２に伝達され難く、モジュール本体８からの放熱によるランプハウジング２の溶融を防止することができる。 Therefore, when the attachment insertion portion 15 is inserted into the attachment hole 2a and the light source module 7 is attached to the lamp housing 2, the coated portion comes into contact with the lamp housing 2, so that the heat generated when the light source 31 is driven is reduced. It is difficult for the heat to be transmitted from the board attachment part 11 to the lamp housing 2, and it is possible to prevent the lamp housing 2 from melting due to heat radiation from the module main body 8.
　また、コーティングを行う分、取付用挿通部１５の径を予め小さく、簡易的な構造にすることが可能になり、モジュール本体８を形成するダイキャストの材料の低減や金型の簡易化による取り数の増加により、光源モジュール７の製造コストの低減を図ることができる。 In addition, since the coating is applied, the diameter of the mounting insertion part 15 can be made smaller in advance and the structure can be simplified, and the die-casting material used to form the module body 8 can be reduced and the mold can be simplified. By increasing the number, the manufacturing cost of the light source module 7 can be reduced.
　上記には、放熱部１０にそれぞれ複数の第１の放熱フィン１３と第２の放熱フィン１４が設けられた構成の例を示したが、光源モジュール７は、例えば、ベース面部１２の外周部の一部又は全体から後方に突出された放熱フィン３３が設けられた構成にされていてもよい（図８参照）。このような構成にされることにより光源モジュール７の構造の簡素化を図った上で放熱性の向上を図ることができる。 Although the example of the configuration in which the heat dissipation section 10 is provided with a plurality of first heat dissipation fins 13 and a plurality of second heat dissipation fins 14 has been shown above, the light source module 7, for example, A configuration may also be provided in which heat dissipation fins 33 are provided that protrude rearward from a portion or the entirety (see FIG. 8). With such a configuration, it is possible to simplify the structure of the light source module 7 and improve heat dissipation.
　また、光源モジュール７においては、基板取付部１１における基板配置面１５ｂの外周部から突出される位置決めピン３４が設けられていてもよい（図９及び図１０参照）。 Furthermore, in the light source module 7, a positioning pin 34 may be provided that protrudes from the outer circumference of the board placement surface 15b of the board mounting portion 11 (see FIGS. 9 and 10).
　位置決めピン３４は、例えば、基板配置面１５ｂにおける外周部の四つの角部からそれぞれ前方に突出されている。位置決めピン３４は基板取付部１１と一体に形成されダイキャストによって形成されていてもよいが、例えば、熱伝導性の低い樹脂材料によって形成されていてもよい。尚、位置決めピン３４は少なくとも三つが設けられていればよい。 The positioning pins 34 each protrude forward from, for example, four corners of the outer periphery of the board placement surface 15b. The positioning pin 34 may be formed integrally with the board mounting portion 11 and may be formed by die-casting, but may also be formed of, for example, a resin material with low thermal conductivity. Note that at least three positioning pins 34 may be provided.
　位置決めピン３４が設けられる場合には、基板３０の角部にそれぞれ円弧状の位置決め用切欠３５が形成され、導光体６における入射部６ａの外周部に複数の位置決め用凹部３６が形成される。位置決め用凹部３６を形成する底面（後面）は受け面３６ａとして形成される。 When the positioning pins 34 are provided, arc-shaped positioning notches 35 are formed at each corner of the substrate 30, and a plurality of positioning recesses 36 are formed at the outer periphery of the incident portion 6a of the light guide 6. . The bottom surface (rear surface) forming the positioning recess 36 is formed as a receiving surface 36a.
　基板３０は位置決め用切欠３５にそれぞれ位置決めピン３４が対応して位置されることにより、光軸方向に直交する方向において基板取付部１１に対して位置決めされる。また、導光体６は位置決め用凹部３６にそれぞれ位置決めピン３４が挿入され受け面３６ａにそれぞれ位置決めピン３４の先端面３４ａが突き当てられることにより、光軸方向に直交する方向及び光軸方向において光源３１に対して位置決めされる。 The substrate 30 is positioned with respect to the substrate mounting portion 11 in the direction perpendicular to the optical axis direction by positioning the positioning pins 34 corresponding to the positioning notches 35, respectively. In addition, the light guide 6 is configured such that the positioning pins 34 are inserted into the positioning recesses 36 and the tip surfaces 34a of the positioning pins 34 are abutted against the receiving surfaces 36a, so that the light guide 6 can be operated in a direction perpendicular to the optical axis direction and in the optical axis direction. It is positioned relative to the light source 31.
　このように光源モジュール７に位置決めピン３４が設けられることにより、位置決めピン３４によって基板３０の基板取付部１１に対する位置決めが行われると共に光学部材として機能する導光体６の光源３１に対する位置決めが行われるため、構造の簡素化を確保した上で機能性の向上を図ることができる。特に、導光体６に光源３１から出射された光が入射される場合に、光源３１から出射される光の導光体６への適正な入射状態を確保することができ、光源３１から出射される光の有効活用を図ることができると共に車輌用灯具１における適正な配光状態を確保することができる。 By providing the positioning pins 34 on the light source module 7 in this manner, the positioning pins 34 position the board 30 with respect to the board mounting portion 11, and also position the light guide 6, which functions as an optical member, with respect to the light source 31. Therefore, functionality can be improved while ensuring simplification of the structure. In particular, when the light emitted from the light source 31 is incident on the light guide 6, it is possible to ensure that the light emitted from the light source 31 enters the light guide 6 appropriately, and the light emitted from the light source 31 is emitted from the light guide 6. It is possible to make effective use of the light that is generated, and to ensure an appropriate light distribution state in the vehicular lamp 1.
　また、基板３０及び光源３１と導光体６の光軸方向における距離を一定以上に保持することが可能になり、光源３１の駆動時に発生する熱が導光体６に伝達され難く、光源モジュール７の溶融を防止することができる。 In addition, it is possible to maintain the distance between the substrate 30 and the light source 31 and the light guide 6 in the optical axis direction to a certain value or more, so that the heat generated when driving the light source 31 is difficult to be transmitted to the light guide 6, and the light source module 7 can be prevented from melting.
　尚、位置決めピン３４が熱伝導性の低い樹脂材料によって形成されることにより、光源モジュール７から導光体６に熱が一層伝達され難くなり、光源モジュール７の溶融の防止効果を高めることができる。 Note that by forming the positioning pin 34 from a resin material with low thermal conductivity, it becomes even more difficult for heat to be transferred from the light source module 7 to the light guide 6, and the effect of preventing the light source module 7 from melting can be enhanced. .
１　　　車輌用灯具
２　　　ランプハウジング（取付部材）
２ａ　　取付孔
６　　　導光体（光学部材）
７　　　光源モジュール
８　　　モジュール本体
９　　　コネクター部
１０　　放熱部
１１　　基板取付部
１５　　取付用挿通部
１７　　挿通孔
１８　　第１の抜け止め突部
１９　　第２の抜け止め突部
２４　　給電端子
２５　　端子保持部
２８　　第１の係合突部
２９　　第２の係合突部
３０　　基板
３１　　光源
３４　　位置決めピン 1 Vehicle lamp 2 Lamp housing (mounting member)
2a Mounting hole 6 Light guide (optical member)
7 Light source module 8 Module body 9 Connector part 10 Heat dissipation part 11 Board mounting part 15 Mounting insertion part 17 Insertion hole 18 First retaining protrusion 19 Second retaining protrusion 24 Power supply terminal 25 Terminal holding part 28 First Engagement protrusion 29 Second engagement protrusion 30 Board 31 Light source 34 Positioning pin

Claims (5)

  1. 　光源が搭載された基板と、
    　前記基板が取り付けられる基板取付部と、
    　前記光源の駆動時に前記基板取付部を介して伝達される熱を放出する放熱部と、
    　前記基板に接続される給電端子と前記給電端子を保持する端子保持部とを有するコネクター部とを備え、
    　前記基板取付部と前記放熱部を有する部分がモジュール本体として設けられ、
    　前記モジュール本体がダイキャストによって形成され、
    　前記端子保持部が樹脂材料によって形成された
    　光源モジュール。     A board equipped with a light source,
    a board mounting part to which the board is mounted;
    a heat dissipation section that releases heat transferred via the board mounting section when the light source is driven;
    a connector part having a power supply terminal connected to the board and a terminal holding part that holds the power supply terminal;
    A part having the board mounting part and the heat dissipation part is provided as a module main body,
    the module body is formed by die-casting,
    A light source module in which the terminal holding portion is formed of a resin material.
  2. 　前記放熱部にブラスト加工による表面処理が施された
    　請求項１に記載の光源モジュール。     The light source module according to claim 1, wherein the heat dissipation section is subjected to surface treatment by blasting.
  3. 　前記モジュール本体に前記コネクター部が挿通される挿通孔が形成され、
    　前記コネクター部に係合突部が設けられ、
    　前記モジュール本体に前記コネクター部が前記挿通孔に挿通された状態において前記係合突部が係合される抜け止め突部が設けられた
    　請求項１に記載の光源モジュール。     An insertion hole through which the connector portion is inserted is formed in the module main body,
    The connector portion is provided with an engaging protrusion,
    The light source module according to claim 1, wherein the module main body is provided with a retaining protrusion that is engaged with the engagement protrusion when the connector portion is inserted into the insertion hole.
  4. 　前記基板取付部には取付部材の取付孔に挿通される取付用挿通部が設けられ、
    　前記取付用挿通部の外周面に樹脂のコーティングが施された
    　請求項１に記載の光源モジュール。     The board mounting part is provided with a mounting insertion part that is inserted into the mounting hole of the mounting member,
    The light source module according to claim 1, wherein an outer circumferential surface of the attachment insertion portion is coated with a resin.
  5. 　前記基板取付部から突出された位置決めピンが設けられ、
    　前記位置決めピンの軸方向における一端部によって前記基板の前記基板取付部に対する位置決めが行われ、
    　前記位置決めピンの軸方向における他端部によって光学部材の前記光源に対する位置決めが行われる
    　請求項１、請求項２、請求項３又は請求項４に記載の光源モジュール。     A positioning pin protruding from the board mounting part is provided,
    One end of the positioning pin in the axial direction positions the board with respect to the board mounting part,
    The light source module according to Claim 1, Claim 2, Claim 3, or Claim 4, wherein the optical member is positioned with respect to the light source by the other end in the axial direction of the positioning pin.
PCT/JP2023/021703 2022-06-17 2023-06-12 Light source module WO2023243588A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022097904 2022-06-17
JP2022-097904 2022-06-17

Publications (1)

Publication Number Publication Date
WO2023243588A1 true WO2023243588A1 (en) 2023-12-21

Family

ID=89191218

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2023/021703 WO2023243588A1 (en) 2022-06-17 2023-06-12 Light source module

Country Status (1)

Country Link
WO (1) WO2023243588A1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011222368A (en) * 2010-04-12 2011-11-04 Sosuke Naito Led module, and led luminaire using the same
JP2015176707A (en) * 2014-03-14 2015-10-05 パナソニックＩｐマネジメント株式会社 Lighting device
US20170146199A1 (en) * 2014-07-09 2017-05-25 Osram Gmbh Semiconductor Lamp
JP2020004688A (en) * 2018-07-02 2020-01-09 株式会社小糸製作所 Lighting fixture unit and vehicular lighting fixture and lighting fixture unit manufacturing method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011222368A (en) * 2010-04-12 2011-11-04 Sosuke Naito Led module, and led luminaire using the same
JP2015176707A (en) * 2014-03-14 2015-10-05 パナソニックＩｐマネジメント株式会社 Lighting device
US20170146199A1 (en) * 2014-07-09 2017-05-25 Osram Gmbh Semiconductor Lamp
JP2020004688A (en) * 2018-07-02 2020-01-09 株式会社小糸製作所 Lighting fixture unit and vehicular lighting fixture and lighting fixture unit manufacturing method

Similar Documents

Publication Publication Date Title
WO2016158423A1 (en) Light source unit and vehicle lamp fitting
US8950917B2 (en) Vehicular lamp
US9644809B2 (en) Light source unit
WO2013180178A1 (en) Vehicular lighting instrument semiconductor light source light source unit and vehicular lighting instrument
US9035346B2 (en) Light source module
US9441803B2 (en) Vehicular headlamp
JP2011171277A (en) Light source unit for semiconductor type light source of vehicle lighting device, and vehicle lighting device
JP4566061B2 (en) Lamp
JP2018029037A (en) Vehicular lighting system and vehicular lighting tool
JP2019220424A (en) Vehicular lighting device and vehicular lighting fixture
JP2015220034A (en) Led module and vehicle lamp fitting including the same
JP6713904B2 (en) Light source module for vehicle lamp and vehicle lamp
JP2015220035A (en) Led module and vehicle lamp fitting including the same
WO2023243588A1 (en) Light source module
JP2020187837A (en) Vehicular lighting device and vehicular lighting fixture
US10253938B2 (en) Lighting arrangement with exact positioning of an optical element
JP6536327B2 (en) Vehicle lamp
JP2013045717A (en) Lamp fitting for vehicle
JP2015041454A (en) Led module and vehicle light including led module
JP2021182523A (en) Vehicular lighting device and vehicular lighting fixture
CN112577018B (en) Light source unit and vehicle lamp
JP2021079899A (en) Vehicular lighting device and vehicular lighting fixture
WO2024090272A1 (en) Light source module
WO2023074674A1 (en) Vehicular lamp
JP7433326B2 (en) Vehicle lights and light units

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 23823878

Country of ref document: EP

Kind code of ref document: A1