WO2014019795A1

WO2014019795A1 - Method for producing an illuminant

Info

Publication number: WO2014019795A1
Application number: PCT/EP2013/064060
Authority: WO
Inventors: Stefan GRÖTSCH; Frank Singer
Original assignee: Osram Opto Semiconductors Gmbh
Priority date: 2012-07-31
Filing date: 2013-07-03
Publication date: 2014-02-06
Also published as: KR20150056082A; DE102012106982A1; US9551479B2; US20150167938A1; DE112013003816A5; JP2015528215A; JP6092388B2; DE112013003816B4

Abstract

A method for producing an illuminant is specified, in which a positioning device (3) holds an optoelectronic semiconductor component (1) inside a tolerance range (4) on the upper side of a connection carrier (2) during the mechanical fixation and electrical connecting of the optoelectronic semiconductor component (1) to the connection carrier (2).

Description

description

Method for producing a luminous means A method for producing a luminous means is specified.

An object to be solved is to provide a method for producing a luminous means, in which a luminous surface of the luminous means is particularly accurate in the

Illuminant can be positioned.

The illuminant is, for example, a luminous means which is suitable for use in a car headlight or an optical pro sktionsgerät, that is, the illuminant is particularly well suited for use in conjunction with optically imaging systems, as used in said components come. In accordance with at least one embodiment of the method, in the method initially an optoelectronic

Semiconductor device provided. The optoelectronic semiconductor component is, for example, a light-emitting diode.

The optoelectronic semiconductor component comprises

at least one LED chip, in particular a plurality of LED chips. For example, this includes

Optoelectronic semiconductor device at least two

LED chips in the optoelectronic component

electrically connected in series or in parallel. The light-emitting diode chips are, for example, light-emitting diode chips, as described in the document US 2010/0171135 are described. The disclosure of this document is hereby expressly incorporated by reference. For example, the light-emitting diode chips each have a light-emitting front which is free of electrical contact points such as bond pads. The risk of shading and / or absorption of a part of the emitted from an active zone of the LED chips in operation

electromagnetic radiation by the electrical

Contact points is reduced in this way. On complex process steps in connection with the production of such a contact point, such as the polishing of the front surface of the LED chips and / or the production of metal webs for current expansion, which have a large thickness but small lateral extent, and / or measures that the Stromin tion in Restrict or prevent regions of the LED chips below the electrical contact point, such as the formation of an electrically insulating layer, a Schottky barrier and / or a

Ion-implanted area below the contact point, for example, can be dispensed with advantage. The sum of the light-emitting front sides of all light-emitting diode chips forms the luminous surface of the light-emitting means.

The optoelectronic semiconductor component preferably comprises a housing body, on or in which the at least one

LED chip is arranged. For example, the housing body may be in the form of a flat plate, on the upper side of which the at least one light-emitting diode chip is arranged. Furthermore, it is possible that the housing body has at least one cavity in which the at least one light-emitting diode chip is arranged. The optoelectronic semiconductor component further comprises at least two electrical connection points which are located on a lower side of the optoelectronic semiconductor component

are arranged. The electrical connection points are electrically conductively connected to the at least one light-emitting diode chip. About a contact of the electrical

Connection points can be the LED chips of the

be operated optoelectronic device.

By way of example, the housing body of the optoelectronic semiconductor component is a so-called QFN housing body (also known as Quad Fiat No leads

package). In this case, the electrical

Connection points of the optoelectronic semiconductor device exclusively at the bottom of the optoelectronic

Semiconductor component and thus arranged, for example, on the underside of the housing body and the electrical

Connection points do not protrude beyond the housing body at any point in the lateral direction. The lateral directions are

those directions that lie in a plane that

for example, parallel to the main extension plane of the underside of the housing body. In accordance with at least one embodiment of the method, the method comprises a method step in which a

Connection carrier is provided. The connection carrier is, for example, a printed circuit board. The connection carrier comprises, for example, a base body on or in which electrical conductor tracks and / or contact points are structured. The connection carrier comprises, for example, at least two contact points which can be supplied with electric current. The contact points are at one Arranged top of the connection carrier. For example, the connection carrier is a

Metal core board. In accordance with at least one embodiment of the method for

Producing a luminous means, the method comprises a step in which a positioning device

is provided, which is in direct contact with the connection carrier and / or the optoelectronic semiconductor device. The positioning device is suitable and provided for, the optoelectronic semiconductor device during a mechanical fastening and electrical

Connecting to the connection carrier in a specific

Position to hold relative to the connection carrier. The

Positioning device does not have to be an exact adjustment of the optoelectronic semiconductor device relative to

Connection carrier allow, but it may be sufficient that the positioning device, the relative

Position of connection carrier and optoelectronic

Defines semiconductor device within a certain tolerance range.

In accordance with at least one embodiment of a method for producing a luminous means, the method comprises a method step in which a connection means is provided between the connection points of the optoelectronic semiconductor component and the contact points of the connection carrier. The connecting means may be, for example, an electrically conductive adhesive or a

Lot material act. By means of the connecting means, the optoelectronic semiconductor component is fixed mechanically fixed and electrically conductive on the connection carrier.

For example, the connecting means is merely between opposing connection points of the optoelectronic semiconductor component and contact points of the connection carrier. In accordance with at least one embodiment of the method for

To produce a luminous means, the method comprises a method step in which a mechanical fastening and electrical connection of the optoelectronic

Semiconductor device on the connection carrier by means of

Connecting agent takes place. This can be done, for example

Curing and / or solidification of the bonding agent done.

According to at least one embodiment of the method for producing a luminous means, the

Positioning device the optoelectronic

Semiconductor device during the mechanical fastening and electrical connection within a tolerance range at the top of the connection carrier. That is, at the upper side of the connection carrier facing the optoelectronic semiconductor component, there is a region which

Tolerance range within which the optoelectronic

Semiconductor component to be fastened to the connection carrier. The tolerance range may be a predetermined, in particular virtual, ie not physically marked at the connection carrier area, within which the optoelectronic semiconductor device according to the

Fixing to the connection carrier to be located.

In other words, the positioning device keeps the optoelectronic semiconductor ^component within the tolerance range during the fastening and connecting process with a certain amount of play. The tolerance in any direction in the plane in which the tolerance range is for example, at most 10%, in particular at most 5% or at most 3%, preferably at most 1% of the extent of the optoelectronic semiconductor component in this direction. The tolerance is for example at most +/- 75 pm, in particular at most +/- 50 pm.

According to at least one embodiment of the method for producing a luminous means, the method comprises the following steps:

- Providing an optoelectronic semiconductor device comprising a housing body, at least one

LED chip, which is arranged in the housing body, and at least two electrical connection points, which on a lower side of the optoelectronic semiconductor device

are arranged

Providing a connection carrier having at least two contact points, which are arranged on an upper side of the connection carrier,

- Providing a positioning device with the connection carrier and / or the optoelectronic

Semiconductor device is in direct contact,

- Providing a means of connection between the

Connection points of the optoelectronic semiconductor component and the contact points of the connection carrier,

- Mechanical fixing and electrically connecting the optoelectronic semiconductor device to the connection carrier by means of the connecting means, wherein

- The positioning device, the optoelectronic

Holds semiconductor device during mechanical fastening and electrical connection within a tolerance range at the top of the connection carrier. By means of the method described here, it is possible, the optoelectronic semiconductor device particularly accurate to

Connection carrier and thus also to other components, such as optical components to adjust the light source. When using the bulb in

Imaging systems, such as a car headlight or an optical Pro ektionsgeräts, the light source must be mounted with high precision to the light systems downstream optical systems. When fixing a

Optoelectronic semiconductor device to a

Connection carrier, for example by soldering or gluing, however, it comes to a "blurring" of

optoelectronic semiconductor device compared to the

Connection points of the connection carrier. In addition, the

Connection points usually already have a relatively high inaccuracy in terms of their positioning relative to reference structures, such as fitting holes, on, in turn, for the mechanical adjustment and / or attachment of other components, such as an optical

Elements, serve. The tolerance chain for the positioning of the luminous surface of the illuminant, ie the

Light emitting front sides of the LED chips, in terms of optical elements is characterized very long. By the method described here, in particular by

Use of the positioning device, a more accurate attachment of the optoelectronic semiconductor device relative to the connection carrier and thus also relative to downstream systems, as was previously possible. The "blurring" of the optoelectronic device is caused by the

Positioning device on a relatively small

Tolerance range restricted. However, there is no rigid adjustment before mechanical fastening and electrical connection through the connecting means, whereby a strain relief in cyclic stress, ie heating and

Cooling of the bulb, takes place. Furthermore, the

reduced mechanical shear stress of the connection between the optoelectronic semiconductor device and connection carrier. The connections between the optoelectronic semiconductor component and the connection carrier are thus spared during operation of the luminous means. In accordance with at least one embodiment of the method, the tolerance range lies completely in a plane which is parallel to the main extension plane of the connection carrier

facing bottom of the optoelectronic

Semiconductor device runs. In other words, the tolerance range refers to the lateral directions, for example, at least in places parallel to the

Run terminal carrier facing the bottom of the semiconductor device. In the vertical direction, for example perpendicular to the main extension plane of the bottom side of the optoelectronic semiconductor component facing the connection carrier, no tolerance range is then predetermined by the positioning device during the mechanical fastening and electrical connection, for example. According to at least one embodiment of the method, the tolerance range has an area that is greater than the maximum cross-sectional area of the optoelectronic

Semiconductor device on the terminal carrier facing the bottom of the optoelectronic semiconductor device in a plane parallel to the plane in which the tolerance range is located. In other words, the tolerance range

in terms of its area larger than the pad of the optoelectronic semiconductor device. For example, the Tolerance range by at most 10%, in particular at most 5%, preferably at most 1% greater than the pad of the optoelectronic semiconductor device. The tolerance is for example at most +/- 100 pm, in particular at most +/- 50 pm, in particular at most +/- 30 pm.

In accordance with at least one embodiment of the method, the positioning device comprises at least two components which are connected to the connection carrier and / or to the optoelectronic component

Semiconductor component is formed and / or fixed. For example, the components may be pens

act, so to three-dimensional body with a

Main extension direction, about rod-shaped bulges, for example, have a circular, square, rectangular, oval or other cross-section.

Furthermore, it is possible for the components to be recesses such as, for example, holes or bores in the connection carrier and / or in the optoelectronic

Semiconductor device acts. The components of

Positioning device can be integral with the

Connection carrier and / or the optoelectronic

Be executed semiconductor device and, for example, already in the manufacture of the connection carrier and / or the

be produced optoelectronic semiconductor device. Furthermore, it is possible that the components of

Positioning device are attached to the connection carrier and / or on the optoelectronic semiconductor device. It is also possible in particular that the components of the positioning device at least partially from

Connection carrier and / or optoelectronic semiconductor device can be detached after a mechanical and

electrically conductive connection between the connection carrier and the optoelectronic semiconductor chip has been produced.

In accordance with at least one embodiment of the method, the positioning device comprises at least three pins, which are in direct contact with the connection carrier and are mechanically fixedly connected to the connection carrier. The pins may for example be inserted into corresponding recesses of the connection carrier and be mechanically connected by a press fit with the connection carrier. Furthermore, it is possible that the pins are an integral part of the

Connection carrier are and are produced, for example, together with the connection carrier. The pins protrude beyond the connection carrier at its optoelectronic

Semiconductor device side facing. That is, at the

Top of the connection carrier protrude the pins from the

Connection carrier in the direction of the optoelectronic

Semiconductor device. The pins limit the case

Tolerance range in lateral direction.

For example, if the positioning device comprises four pins, the pins can make a rectangular one

Tolerance range in lateral directions to be limited. For mechanical fastening and electrical connection of the optoelectronic semiconductor component to the connection carrier, the optoelectronic semiconductor component is introduced into the region between the pins, that is to say the tolerance range. After mechanical fastening and electrical connection, the optoelectronic semiconductor device is in direct contact with at most two of the pins. That is, that

Optoelectronic semiconductor device may, for example, when connecting such on the connecting means "Blurs" that it is on pins of the

Positioning device abuts. However, the distance of the pins of the positioning device is so large

It is chosen that the optoelectronic semiconductor component can not be in contact with all the pins and in particular not more than two pins at the same time.

In other words, the optoelectronic

Semiconductor device not held by the positioning device at a certain point and clamped there, but can be attached with a certain tolerance. The pins on the connection carrier only prevent excessive blurring of the optoelectronic

Semiconductor device.

In accordance with at least one embodiment of the method, the positioning device comprises at least two pins and at least two recesses. Each pen is one

Recess uniquely assigned. That is, for each pin in a component of the bulb, for example in

Connection carrier, there is a corresponding recess in the other component, for example in the optoelectronic semiconductor device, in which the pin can engage. For example, one of the pens stands with the

optoelectronic semiconductor device in direct contact and is mechanically fixed to the optoelectronic

Connected semiconductor device and the associated recess is arranged in the connection carrier or one of the pins is in direct contact with the connection carrier and is

mechanically firmly connected to the connection carrier and the associated recess is in the optoelectronic

Semiconductor component arranged. At least one pair of pin and associated recess is formed such that the recess at least

in places a larger diameter than the pin

having. In other words, the pin does not fit precisely into the recess, but the pin has a certain amount of play in the recess. The play of the pin in the recess then specifies the tolerance range within which the

Positioning device the optoelectronic

Semiconductor device during mechanical fastening and electrical connection at the top of the connection carrier holds.

In accordance with at least one embodiment of the method, the positioning device comprises a frame that supports the frame

Connection carrier at its the optoelectronic

Projecting semiconductor component facing top, wherein the frame limits the tolerance range in lateral directions. For this purpose, the frame comprises, in particular, a spring element via which the semiconductor component during the mechanical

Fastening and electrical connection within one

Tolerance at the top of the connection carrier is held. For example, the frame includes inner surfaces at its side surfaces of the semiconductor device

Spring element over which the tolerance range is determined. The spring element pushes the semiconductor device in a defined position and eliminates the tolerance of the opening of the frame to the semiconductor device. The spring element may for example be formed with an elastic material such as a rubber or comprise at least one metal spring. The spring element can also be an integral part of the

Be frame. For example, the frame is mechanically fixed to the connection carrier or in the connection carrier

integrated. Within the frame, the optoelectronic semiconductor device is arranged and held during the mechanical and electrical connection. In other words, the frame is a kind of solder mask that

for example, can be plugged onto the connection carrier. The optoelectronic semiconductor components are inserted and fixed in the frame with exact position. The frame can be removed again after the mechanical and electrical connection and in particular reused for the production of a further, similar luminous means.

According to at least one embodiment of the method, at least one component of the positioning device, for example a pin or a frame, or the entire

Positioning device after mechanical fixing and electrical connection of the optoelectronic

Semiconductor component on the connection carrier removed. It is possible that only a single component of

Positioning device is removed. That is, it will be at least part of the

Positioning device or at least a component of the positioning device removed. That's it

especially possible that the positioning device or the component of the positioning device is destroyed by the removal. Furthermore, it is possible that the positioning device or the component of

Positioning device before removing integral

Component of the connection carrier or the optoelectronic semiconductor device was. According to at least one embodiment of the method, the component of the positioning device is mechanically fixed to the connection carrier or the

connected optoelectronic semiconductor device and the

The connection carrier or the optoelectronic semiconductor component have, after removal, separation traces which originate from the removal of the component of the positioning device. In other words, the component of the

Positioning device, for example, already in the

Manufacture of the optoelectronic semiconductor device formed integrally with the optoelectronic semiconductor device. For example, the component of the

Positioning device and the housing body of the

Optoelectronic semiconductor device manufactured in one and the same injection process. After removing the component of the positioning device, the optoelectronic semiconductor component, for example on the outside of its housing body, then traces of the separation of the component of the positioning device. The fact that the component of the positioning device is connected to it, for example, already during the production of the connection carrier or the optoelectronic semiconductor device, is the

Positioning device particularly precisely to the components of these elements, such as the LED chips positioned.

According to at least one embodiment of the method, the removal of the at least one component of the

Positioning device exposed at least one recess in the optoelectronic semiconductor device or in the connection carrier. The recess is, for example, another component of the positioning device, for example a pin of the Positioning device associated with recess. The at least one exposed recess can subsequently be used for the adjustment and / or mechanical fastening of an optical element. The optical element is, for example, a reflector and / or a reflector

Lens holding the LED chips in their

Main emission is followed by.

In accordance with at least one embodiment of the method, in a further method step, a heat sink is produced

provided. The heat sink is

For example, to a metal plate, which is adapted to receive the heat generated during operation in the LED chips and dissipate on an enlarged area. In the method, a mechanical fastening of the

Connection carrier at its the optoelectronic

Semiconductor component facing away bottom on the heat sink. That is, the lighting means then includes the heat sink, at the top of the connection carrier is arranged. At the top of the connection carrier facing away from the

Terminal carrier is again the optoelectronic

Semiconductor component arranged.

In accordance with at least one embodiment of the method, the mechanical attachment of the connection carrier to the heat sink takes place at least partially by means of at least one component of the positioning device. For example, the

Heatsink after the mechanical and electrical connection of the optoelectronic semiconductor device to the connection carrier by means of a recess and / or a pin of the

Positioning device adjusted relative to the connection carrier and / or mechanically fixed. That is, one Pin of the positioning device can be brought into direct contact with the heat sink.

In accordance with at least one embodiment of the method, the optoelectronic semiconductor component and / or the

Connection carrier and / or the heat sink in addition to the components of the positioning device at least one fastening means which is adjusted to the positioning device, wherein by means of the fastening means, an optical element is mechanically fixed relative to the semiconductor device and / or the connection carrier and / or the heat sink. The fact that the fastener for

Positioning device is adjusted, can after the defined mechanical attachment of the optoelectronic semiconductor device to the connection carrier a particularly accurate

Nachorder example of an optical element done. The optoelectronic semiconductor device is characterized by the

Positioning device within the tolerance particularly well, for example, relative to the connection carrier, positioned. In the connection carrier are again arranged very precisely to the tolerance range adjusted recesses in which pins are arranged, via which the optical element can be attached to the connection carrier. In the following, the method described here will be explained in more detail on the basis of exemplary embodiments and the associated figures.

Figures 1A, 1B, IC, 2A, 2B, 3A, 3B, 4A, 4B, 5A, 5B, 5C,

5D, 5E, 5F, 6A, 6B, 7A, 7B, 7C, 7D, 7E show

Method steps of exemplary embodiments of the method described here with reference to schematic

Representations. The same, similar or equivalent elements are provided in the figures with the same reference numerals. The figures and the proportions in the figures

Elements shown with each other are not as

to scale. Rather, individual elements for better presentation and / or for better

Comprehensibility must be exaggerated. A first exemplary embodiment of a method described here is explained in more detail in conjunction with the schematic representations of FIGS. 1A to 1C. In the method, an optoelectronic semiconductor device 1

provided. The optoelectronic semiconductor component 1 comprises a housing body 11. In the present case, the housing body 11 has a cavity in which five light-emitting diode chips 12 are arranged. The LED chips 12 are with

electrical connection points 14 electrically conductive

connected. Via contact wires 13, the light-emitting diode chips 12 of the optoelectronic semiconductor component 1 are connected in series.

The optoelectronic semiconductor device 1 is on the

Connection carrier 2 is arranged. The connection carrier 2 is, for example, a metal core board. The connection carrier 2 has a metallic main body 21. In places, an insulating layer 22 made of an electrically insulating material is applied to the metallic base body 21. On the insulating layer 22, in turn, on the side facing away from the main body 21 at least one conductor track 23rd

formed, which is electrically connected to contact points 24. The optoelectronic semiconductor device 1 is arranged with its the top la remote from the bottom lb at the top 2a of the connection carrier 2.

There is also a positioning device 3

provided. In the present case, the

Positioning device 3 pins 31 and recesses 32. The pins 31, in particular dowel pins, which are mechanically fixed with recesses 32, for example, mating holes, connected in the connection carrier 2. In the present case, the

Positioning device 3 four pins, the one

Define tolerance range 4 at the top 2a of the connection carrier 2. The highly accurate at defined points of the

Connection carrier 2 mounted pins 31 prevent excessive blurring of the optoelectronic

Semiconductor device 1 during the mechanical and

electrically connecting the contact points 24 with the

Connection points 14 via the connecting means 8, which is for example a solder material. FIG. 1B shows a sectional view along the line AA, which extends through the optoelectronic semiconductor component 1. FIG. 1C shows a side view of the FIG

Connection carrier 2 with the positioning device 3 before applying the optoelectronic semiconductor device 1. Optionally, the connection carrier 2 fastening means 6, in the present case in the form of recesses or

Justagereferenzbohrungen show, the highly accurate to

Positioning device 3 and thus the pins 31 are adjusted. For example, the tolerance is at

Distance of the pins 31 to the attachment means 6 at most +/- 25 μιη. In conjunction with the schematic representations of FIGS. 2A and 2B, a further exemplary embodiment of a method described here is described. In this

Embodiment, the optoelectronic

Semiconductor component 1 at its the connection carrier. 2

facing bottom lb pins 31, which constitute adjustment pins. For example, the pins 31 can not

illustrated insertion bevels, over which they

particularly simple in corresponding recesses 32 in the connection carrier 2 can be introduced. The pins 31 are, for example, integral components of the housing body 11, which can be adjusted with high precision to the recesses 32 of the connection carrier 2 during the manufacture of the housing body 11, for example during a molding process.

At least one of the pins 31 may have a smaller diameter D than the diameter d of the recess. In this way, a tolerance range 4 in the attachment of the optoelectronic semiconductor device 1 on the

Connection carrier 2 is formed.

In the embodiment of Figures 2A and 2B

For example, the pin 31 shown in the figures on the right side not circular, but oval, so that in its positioning in the

corresponding recess 32 in the connection carrier 2 results in a certain play, which ensures the tolerance range 4 when connecting the optoelectronic semiconductor device 1 and connection carrier 2.

On the upper side of the optoelectronic semiconductor component 1 fastening means 6, for example in the form of circular or slot-like design Justagevertiefungen or recesses may be formed, which can accommodate, for example, the Justagepins an optical element (see, for example, Figure 5F).

In contrast to the embodiment of Figures 2A and 2B, an embodiment is shown in connection with the embodiment of Figures 3A and 3B, wherein the

Fastener 6 at the top of the 1A

Optoelectronic semiconductor device 1 is designed as a pin and not as a recess. The pins can be made together with the housing body 11. The pins may be oval or cross-shaped pins extending from the surface of the top of the

Optoelectronic semiconductor device 1 protrude and in adjustment recesses or holes of an optical

Elements can intervene to adjust

accomplish. In connection with the exemplary embodiment of FIGS. 4A and 4B, a method for the production of a luminous means is described in which on the lower side 2b of FIG

Connection carrier a heat sink 5 is arranged. In this case, the pins 31 of the positioning device 3 are used to position the arrangement of connection carrier 2 and the optoelectronic semiconductor component 1 with high precision on the heat sink 5. The heat sink in turn can fastening means 6, in this case in the form of

Recesses, which are adjusted to the recesses into which the pin 31 of the positioning device 3 is inserted. In this way, for example, a

optical element in a defined manner relative to

optoelectronic semiconductor device 1 are arranged. The arrangement of connection carrier 2 and optoelectronic semiconductor component 1 can, for example, as in

Compound be described with the figures 1A to IC described.

A further exemplary embodiment of a method for producing a luminous means described here is explained in conjunction with FIGS. 5A to 5F. The

Positioning device 3 includes in this

Embodiment Pins 31, which are an integral part of the optoelectronic semiconductor device 1, for example, the housing body 11, are. In this case, 11 separation regions 9 are present in the housing body, for example, as

Constrictions in the material of the housing body 11 are executed. After connecting optoelectronic

Semiconductor component 1 and connection carrier 2, which takes place, for example, as described in connection with Figures 1A to IC, this arrangement can be connected via the pins 31 with a heat sink 5, via the pins 31, an adjustment of the heat sink 5 to the connection carrier 2.

Due to the constrictions in the region of the separation areas 9, the pins 31 as a component of

Positioning device 3 subsequently detachable (compare to Figure 5D). Due to the detachment of the pins 31, the recess in the heat sink 5 is exposed and can as

Fixing means 6 are used, for example, for the subsequent assembly of an optical element 7. In the exemplary embodiment of FIG. 5F, the optical element 7 is a reflector which guides the light of the light-emitting diode chips 2 to a coupling-out surface 7a. In this exemplary embodiment of the method, the removal of the pins 31 of the positioning device 3 thus exposes at least one recess in the connection carrier 2 and the at least one exposed recess is used for the adjustment and / or mechanical fastening of an optical element 7. By removing the pins 31, so a component of the positioning device 3, which is

Arrangement less strongly mechanically strained and thus particularly robust especially when exposed to temperature.

In conjunction with Figures 6A and 6B is a

Embodiment of a method described here, in which the positioning device 3 comprises a frame 33 which projects beyond the connection carrier 2 on its upper side 2a facing the optoelectronic semiconductor component. The frame 33 limits the tolerance range 4 on the upper side 2A of the connection carrier 2 in lateral

Direction. After the mechanical and electrical connection of the semiconductor component 1 and the connection carrier 2, the frame 33 and thus a component of the positioning device 3 can be removed. The frame 33 may be

For example, to act a kind Lötschablone that can be used after removal from the connection carrier 2 on. In this case, the frame 33 comprises an inner surface facing the side surfaces 1c of the semiconductor component 1

Spring element over which the tolerance range 4 is determined. The spring element allows a certain clearance in the assembly of the semiconductor device 1. In conjunction with Figures 7A to 7E is another

Embodiment of a method described here explained in more detail. In contrast to the method described in connection with FIGS. 5A to 5F, the assembly of the optical element 7 relative to the connection carrier 2, to

Heatsink 5 and the optoelectronic component 1 by a fastening means 6, which is given in the form of pins which protrude from the heat sink 5 through the connection carrier 2 through into corresponding recesses in the optical element 7.

The invention is not limited by the description based on the embodiments of these. Rather, the invention encompasses every new feature as well as every combination of features, which in particular includes any combination of features in the patent claims, even if this feature or this combination itself is not explicitly described in the claims

Claims or embodiments is given.

This patent application claims the priority of German Patent Application 102012106982.4, the disclosure of which is hereby incorporated by reference.

Claims

claims

1. A method of producing a luminous means, comprising the steps of:

- Providing an optoelectronic semiconductor device

(1) comprising a housing body (11), at least one

Light-emitting diode chip (12) which is arranged in the housing body (11), and at least two electrical connection points (14) on an underside (lb) of the optoelectronic

Semiconductor device (1) are arranged,

- Providing a connection carrier (2) with at least two contact points, which on an upper side of the connection carrier

(2) are arranged

- Providing a positioning device (3) with the connection carrier (2) and / or the optoelectronic

Semiconductor component (1) is in direct contact,

- Providing a means of connection between the

Connection points (14) of the optoelectronic

Semiconductor component (1) and the contact points (24) of the

Connection carrier (2),

- Mechanical fixing and electrically connecting the optoelectronic semiconductor device (1) on the connection carrier (2) by means of the connecting means (8), wherein

- The positioning device (3) holds the optoelectronic semiconductor device (1) during the mechanical fastening and electrical connection within a tolerance range (4) at the top of the connection carrier (2).

2. Method according to the preceding claim,

wherein the tolerance range (4) lies completely in a plane parallel to the main extension plane of the

Connection carrier (2) facing bottom (lb) of the

Optoelectronic semiconductor device (1) extends.

3. The method according to any one of the preceding claims,

wherein the tolerance range (4) has an area which is greater than the maximum cross-sectional area of the

Optoelectronic semiconductor device (1) at the

Connection carrier (2) facing the bottom of the

Optoelectronic semiconductor device (1) in a plane parallel to the plane in which the tolerance range (4).

4. Method according to one of the preceding claims,

in which

- The positioning device (3) at least two

Components comprises, which are formed and / or attached to the connection carrier (2) and / or on the optoelectronic semiconductor device (1).

5. Method according to one of the preceding claims,

in which

- The positioning device (3) comprises at least three pins (31) which are in direct contact with the connection carrier (2) and mechanically fixedly connected to the connection carrier (2),

- The pins (31) the connection carrier (2) at its the optoelectronic semiconductor device (1) facing

Overhang the top,

- The pins (31) the tolerance range (4) in lateral

Limit directions (1), and

- The optoelectronic semiconductor device (1) after mechanical fastening and electrical connection with at most two of the pins (31) is in direct contact.

6. The method according to any one of the preceding claims,

in which the positioning device (3) comprises at least two pins (31) and at least two recesses (32),

- Each pin (31) a recess (32) one-to-one

is assigned, where

- One of the pins (31) with the optoelectronic

Semiconductor component (1) is in direct contact and

mechanically fixed to the optoelectronic semiconductor device (1) is connected and the associated recess (32) in the connection carrier (2) is arranged, or one of the pins (31) with the connection carrier (2) is in direct contact and mechanically fixed to the connection carrier ( 2) is connected and the associated recess (32) in the optoelectronic semiconductor device (1) is arranged, and

- At least for a pair of pin (31) and associated recess (32) the recess (32) at least in places a larger diameter (d) than the pin (31).

7. The method according to any one of the preceding claims,

in which

- The positioning device (3) comprises a frame (33), the connection carrier (2) at its the

optoelectronic semiconductor device (1) facing

Overhanging top (2a),

- The frame (33) comprises a spring element which is in contact with the optoelectronic semiconductor device (1), and

- The frame limits the tolerance range (4) in lateral directions (1).

8. The method according to any one of the preceding claims,

in which

- At least one component of the positioning device (3) after the mechanical fastening and electrical Connecting the optoelectronic semiconductor device (1) on the connection carrier (2) is removed.

9. Method according to the preceding claim,

in which

- The at least one component positioning device (3) prior to removal mechanically fixed to the connection carrier (2) or the optoelectronic semiconductor device (1) is connected, and

- The connection carrier (2) or the optoelectronic

Semiconductor component (1) after removal of separation marks (34), which stem from removing the at least one component of the positioning device (3).

10. The method according to one of the two preceding claims, wherein

- By removing the at least one component

Positioning device (3) at least one recess in the optoelectronic semiconductor component (1) or in

Connection carrier (2) is exposed, and

- The at least one exposed recess for adjusting and / or mechanical attachment of an optical element (7) is used.

11. The method according to any one of the preceding claims with the further steps:

- Providing a heat sink (5), and

- Mechanical attachment of the connection carrier (2) on its the optoelectronic semiconductor device (1) facing away from the bottom of the heat sink.

12. Method according to the preceding claim,

in which - The mechanical fastening of the connection carrier (2) on the heat sink (5) at least partially by means of at least one component of the positioning device (3).

13. Method according to the preceding claim,

wherein a pin of the positioning device (3) is brought into direct contact with the heat sink (5).

14. The method according to any one of the preceding claims,

in which

- The optoelectronic semiconductor device (1) and / or the connection carrier (2) and / or the heat sink (5) in addition to the components of the positioning device (3) comprises at least one fastening means, the

Positioning device (3) is adjusted, wherein by means of the fastening means, an optical element (7) is mechanically fixed relative to the semiconductor device (1) and / or relative to the connection carrier (2) and / or relative to the heat sink (5).