JP2017199584A - Bulb type lighting device and manufacturing method of the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a bulb type lighting device which can effectively radiate heat generated by LEDs to the outside.SOLUTION: A bulb type lighting device includes: a luminous body; a cover member covering the luminous body; a heat radiation body to which the luminous body is attached; and a mouth piece attached to the heat radiation body. The luminous body, the cover member, the heat radiation body, and the mouth piece are thermally coupled through a curable material.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a bulb-type illumination device, and more particularly, to a bulb-type illumination device having a light emitter including a semiconductor light-emitting element such as an LED (Light Emitting Diode) and a method for manufacturing the same.

A light bulb-type lighting device having a light emitter equipped with a semiconductor light emitting element such as an LED has a longer life than an incandescent light bulb,
In recent years, it has attracted attention because it can save energy. On the other hand, it is known that the LED has a light emitting efficiency that decreases as the temperature rises, and the lifetime is shortened, and it is necessary to release heat generated by the LED to the outside.

  For example, Patent Document 1 discloses that heat from an LED is efficiently conducted to a heat radiating plate through an LED substrate, and a part of the heat is radiated as it is from the peripheral portion of the heat radiating plate to the air outside the lighting device, and the remaining heat. Describes that heat is efficiently conducted from the heat radiating plate to the heat radiating portion and radiated from the heat radiating portion to the air outside the lighting device.

  Furthermore, Patent Document 1 describes that a heat conductive sheet or heat conductive grease is interposed between the heat radiating plate and the heat radiating portion.

JP 2011-228125 A

  In order to suppress a decrease in the luminous efficiency of the LED and a shortening of the lifetime, it is desired to effectively release the heat generated in the LED to the outside.

  This invention is made | formed in view of such a situation, and it aims at providing the lightbulb-type illuminating device which can discharge | release the heat | fever which generate | occur | produces with LED effectively outside.

  In order to achieve the above object, the present invention is characterized by having a light emitter, a cover member that covers the light emitter, a heat radiator to which the light emitter is attached, and a base attached to the heat radiator. And the said light-emitting body, the said cover member, the said heat radiating body, and the said nozzle | cap | die are couple | bonded thermally via a curable material.

  ADVANTAGE OF THE INVENTION According to this invention, the lightbulb-type illuminating device which can discharge | release the heat | fever which generate | occur | produces with LED outside effectively can be provided.

It is an external appearance front view of the lightbulb-shaped illuminating device which concerns on embodiment of this invention. It is a perspective view of the state which removed the cover member from the lightbulb-type illuminating device shown by FIG. It is a disassembled perspective view of the lightbulb-type illuminating device shown by FIG. (A) It is a longitudinal cross-sectional view of the lightbulb-type illuminating device shown by FIG. (B) It is a partially enlarged view of (a).

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings as appropriate.

  FIG. 1 is an external front view of a light bulb-type lighting device according to an embodiment of the present invention. FIG. 2 is a perspective view showing a state where a cover member is removed from the light bulb-type lighting device shown in FIG. 1. FIG. 3 is an exploded perspective view of the bulb-type lighting device shown in FIG. 4A is a longitudinal sectional view of the light bulb-type lighting device shown in FIG. 1, and FIG. 4B is a partially enlarged view of FIG.

  As shown in FIG. 1, the cover member 13, the radiator 15, and the base 16 can be confirmed from the appearance of the light bulb-type lighting device 10. As shown in FIG. 2, when the cover member 13 is removed from the light bulb-type lighting device 10, the light emitter 12, the power circuit board 20, the curable material 18, and the screw 25 can be confirmed.

  The cover member 13 is translucent, for example, milky white, made of glass or resin such as PC (polycarbonate). The cover member 13 is formed in a substantially spherical shape. The cover member 13 has an opening end portion 13a that forms an opening.

  The cover member 13 may contain a light diffusion member that diffuses light from the light emitter 12. The light from the LED 11 of the light emitter 12 is highly directional. By including the light diffusing member in the cover member 15, the light from the LED 11 of the light emitter 12 is diffused when passing through the cover member 15, and the light distribution is widened.

  The opening end portion 13a of the cover member 13 is locked via a curable material 18 having higher thermal conductivity than air. By adopting such a locking configuration, the cover member 13 can be attached without considering the alignment, so that the assemblability can be improved. The curable material 18 is preferably a curable material (for example, a silicone resin) having elasticity in order to reduce distortion generated at the opening end portion 13a of the cover member due to thermal expansion or contraction.

  The radiator 15 includes a space V filled with a curable material 18 to be described later, a light emitter attachment portion 15a, a power circuit board storage portion 15b, a heat radiation member attachment portion 15c, an outer cylinder portion 15d, a heat radiator end portion 15e, and a communication portion. 15f, and a substantially cylindrical member having an opening communicating from one end side to the other end side. A substantially bottomed cylindrical power circuit board housing part 15c is positioned inside a substantially cylindrical outer cylinder part 15d that forms the appearance of the radiator 15, and is located between the outer cylinder part 15d and the power circuit board housing part 15c. There are four communication portions 15f so as to connect the two. The light emitter attachment portion 15a refers to one end (upper end) of the communication portion 15f. The heat dissipating member mounting portion 15b is a recess provided in the communication portion 15f, and a cylindrical heat dissipating member 19 can be inserted from one end side (upper side) of the heat dissipating body 15. The radiator end portion 15e refers to the other end side (lower side) of the outer cylinder portion.

  In the radiator 15, the upper surface of the power circuit board housing portion 15 c is located above the surface on which the light emitter mounting portion 15 a is provided. Moreover, the upper surface of the outer cylinder part of the heat radiator 15 is located above the surface on which the light emitter mounting part 15a is provided.

  In this embodiment, the heat radiator 15 is formed from an insulating material. Examples of the material of the radiator 15 include a resin material such as polybutylene terephthalate. Polybutylene terephthalate is preferable because it is excellent in flame retardancy and heat aging resistance. Further, the heat radiator 15 may have a plurality of heat radiating fins on the outer peripheral surface of the heat radiator in order to enhance heat radiation. Further, as the heat radiating body 15, a structure in which a metal material and a resin material are integrated may be used.

  In the present embodiment, the light emitter 12 has a hollow substantially circular substrate 17, and a plurality of LEDs 11 (modules) are arranged in a substantially circumferential shape on a mounting surface that is one surface of the substrate 17. Has been implemented. The substrate 17 has a thickness of 1 to 2 mm.

  The other surface of the substrate 17 is attached to the light emitter 12 on the light emitter attachment portion 15a via the curable material 18. In order to improve the adhesion between the light emitter 15 and the curable material 18, the light emitter 12 is preferably attached at a stage where the curable material 18 is uncured. The light emitter 12 may be fixed to the heat radiator 15 with screws 25 so that the inclination of the light emitter 12 with respect to the heat radiator 15 is reduced.

  The power circuit board 20 is obtained by mounting a plurality of electronic components (not shown) on the board. The power supply circuit board 20 includes, for example, a circuit that rectifies AC power from a commercial power source into DC power, a circuit that adjusts the voltage of the DC power after rectification, and the like.

  The base 16 is a member that is formed of a metal such as aluminum and is electrically connected to a commercial power source by being screwed into a socket for a general lighting bulb installed outside the ceiling or the like in the room. In the present embodiment, the base 16 is attached to the radiator end 15 e of the radiator 15 by caulking or the like.

  The base 16, the power circuit board 20, and the light emitter 12 are electrically connected.

  By filling the space V of the radiator 15 with a curable material 18 having a higher thermal conductivity than air, the light emitter 12 passes through the curable material 18 with the radiator 15, the cover member 13, the base 16, and the heat. Combined. Since the curable material 18 transmits heat more efficiently as the adhesiveness with the radiator 15, the light emitter 12, the cover member 13, and the base 16 is higher, it is preferable that the curable material 18 has less volume shrinkage before and after curing. . The curable material 18 is, for example, a silicone resin that is a highly elastic material.

  The curable material 18 may include a heat dissipation material having a higher thermal conductivity than the curable material. Examples of the heat dissipation material include metal materials such as aluminum (including an alloy). As the heat dissipation material, a powdered material, a linear material such as steel wool, or a material formed like the heat dissipation member 19 may be used.

  The curable material 18 is disposed so as to surround the heat radiating member 19 having a higher thermal conductivity than the curable material 18. In Embodiment 1, heat dissipation is improved by filling the curable material 18 so as to surround the cylindrical heat dissipation member 19.

  In the state as shown in FIG. 1, the opening end portion 13 a of the cover member 13 is located between the communication portions 15 f and the cover member 13 covers the light emitter 12. The heat generated by the LED 11 is efficiently conducted from the substrate 17 to the cover member 13, the radiator 15, and the base 16 via the curable material 18, and is released from the outer peripheral surface of the radiator 15 to the outside air. Become.

  Next, a method for assembling the bulb-type lighting device 10 will be described.

  As a first step, as shown in FIG. 3, the power supply circuit board 20 is inserted into the power supply circuit board storage portion 15c with the longitudinal direction thereof being set vertically, and is engaged with the engaging portion in the power supply circuit board storage portion 15c. Store. At this time, the leading end (not shown) of the lead wire connected in advance to the power circuit board 20 is pulled out from the power circuit board housing portion 15c downward.

  Subsequently, as a second step, an input lead wire (not shown) connected in advance to the power circuit board 20 is connected to a predetermined portion of the base 16. Then, the base 16 is fitted and attached to the radiator end 15d.

  Subsequently, as the third step (step A), the curable material 18 is filled into the space V provided inside the heat radiator 15. At this time, the curable material 18 is filled until it covers the light emitter attachment portion 15a.

  Subsequently, as a fourth step, the heat radiating member 19 is inserted into the heat radiating member mounting portion 15 b provided inside the heat radiating body 15. At this time, the shape of the heat radiating member 19 may not be cylindrical. Through this step, the heat radiating member 19 and the heat radiating body 15 are thermally coupled by the curable material 18.

  Subsequently, as a fifth step (step B), the light emitter 12 is attached to the light emitter attachment portion 15 a and is in close contact with the curable material 18. At this time, it is desirable to fix the light emitter 12 and the radiator 15 with screws 25 or the like so that the light emitter 12 is horizontal with respect to the light emitter attachment portion 15a. Since the effect material 18 is filled in the third step until it covers the light emitter attachment portion 15a, when the light emitter 12 is attached to the light emitter attachment portion 15a in the fifth step, the effect material 18 is attached via the curable material 18. It will be. Through this step, the light emitter 12, the heat radiating member 19, and the heat radiating body 15 are thermally coupled by the curable material 18.

  Subsequently, as a sixth step, a lead wire (not shown) drawn out from the power supply circuit board housing portion 15c is connected to the LED 11 of the light emitter 12 by soldering, a connector, or the like.

  Subsequently, as a seventh step (step C), the cover member 13 is attached to the curable material 18 in the radiator 15 so as to cover the light emitter 12. At this time, the cover member 13, the light emitter 12, the heat radiating member 19, and the heat radiating body 15 are thermally transferred by the curable material 18 by attaching the cover member so that the opening end portion 13 a is buried in the curable material 18. Combined.

  Finally, as the eighth step, the curable material 18 filled in the radiator 15 is cured, and the assembly of the bulb-type lighting device 10 is completed. However, the method of assembling the bulb-type lighting device 10 is not limited to the above-described method, and can be changed.

  Thus, the light emitter 12 (LED 11) is thermally coupled to the cover member 13, the radiator 15, the radiator member 19, and the base 16 via the curable material 18.

  That is, the light emitter 12, the cover member 13 that covers the light emitter 12, the heat radiator 15 to which the light emitter 12 is attached, and the base 16 that is attached to the heat radiator 15, the light emitter 12 and the cover member 13. The heat sink 15 and the base 16 are thermally coupled via the curable material 18 so that the heat generated in the light emitter 12 (LED 11) can be effectively released. The lighting device 10 can be provided.

  As mentioned above, although this invention was demonstrated based on embodiment, this invention is not limited to the structure described in the said embodiment, It includes selecting suitably combining the structure described in each embodiment. The configuration can be changed as appropriate without departing from the spirit of the invention.

  For example, in the said embodiment, although several LED11 is arrange | positioned at the substantially circumference shape, you may arrange | position in other shapes, such as radial shape. Moreover, the light from the light emitter 12 is not limited to white, and can be set to a desired color using LEDs or phosphors having different emission colors. Furthermore, the mounting method of the LED 11 is not limited to the above-described embodiment, and the light emitter 12 may be any one provided with one or more LEDs 11.

  Moreover, although LED11 used by this embodiment is a thing of COB, other semiconductor light emitting elements, such as SMD, CSP, and EL (Electro-Luminescence), depending on the shape of the board | substrate 17, and the design which the lightbulb-shaped illuminating device 10 requires | requires May be provided.

10 Light Bulb Lighting Device 11 LED (Semiconductor Light Emitting Element)
DESCRIPTION OF SYMBOLS 12 Light emitter 13 Cover member 13a Open end 15 Radiator 15a Light emitter attachment 15b Radiator attachment 15c Power supply circuit board storage part 15d Outer cylinder part 15e Radiator end 15f Communication part 16 Base 17 Substrate 18 Curing material 19 Heat dissipation member 20 Power circuit board 25 Screw

Claims (4)

A light emitter, a cover member that covers the light emitter, a heat radiator to which the light emitter is attached, and a base attached to the heat radiator,
The light bulb-type lighting device in which the light emitter, the cover member, the heat radiator, and the base are thermally coupled via a curable material.   The light bulb-type lighting device according to claim 1, wherein an opening end of the cover member is fixed by the curable material. A light emitter, a cover member that covers the light emitter, a heat radiator to which the light emitter is attached, and a base attached to the heat radiator, the light emitter, the cover member, and the heat radiator. A method of manufacturing a bulb-type lighting device in which the base is thermally coupled with a curable material,
Step A of filling the curable material up to the light emitter mounting portion on which the light emitter can be mounted in the heat radiator, and Step B of attaching the light emitter to the light emitter mounting portion after Step A, A method of manufacturing a bulb-type lighting device comprising:   The manufacturing method of the lightbulb-shaped illuminating device of Claim 3 provided with the process C which embeds the opening edge part of the said cover member in the said curable material after the process B.

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