JP2017016803A - Lighting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lighting device which achieves low component costs and a small number of assembly work hours.SOLUTION: A lighting device includes: a substrate 10 having a first region A11 in which LEDs 11 are disposed and a second region A12 in which a circuit element 12 for causing the LEDs 11 to emit light is disposed; a translucent cover 20 covering the LEDs 11; a device body 2 which supports the translucent cover 20 and houses the substrate 10 with the translucent cover 20; and a first substrate cover 40 which covers the second region A12 of the substrate 10 in a state where the first region A11 is exposed. A first connection part 51 connected with a lead wire 80 connected with an external power source is provided at the device body 2. A second connection part 13 connected with the first connection part 51 is provided at the second region A12 of the substrate 10.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a lighting device.

  Conventionally, a lighting device used as an outdoor street light or the like is known (for example, Patent Document 1). This type of lighting device includes a housing made of a translucent cover and an instrument body, an arm attached to a support such as a power pole and supporting the housing, and a power supply device and a light source unit housed in the housing.

  In the illumination device, the light source unit includes, for example, an LED (Light Emitting Diode) and a substrate on which the LED is mounted (LED substrate). The power supply device (power supply circuit) generates power for causing the LEDs to emit light based on power supplied from an external power supply such as a commercial power supply and supplies the power to the light source unit. The light source unit (LED) emits light by power supplied from the power supply device.

JP 2014-165139 A

  In the illumination device, another component such as a lead wire is used to electrically connect the light source unit and the power supply device. For example, the electrodes of the LED board and the circuit board of the power supply device are connected by lead wires. For this reason, in the conventional illuminating device, there exists a subject that component cost becomes high or the assembly man-hour at the time of assembling an illuminating device increases.

  The present invention has been made to solve such a problem, and an object of the present invention is to provide an illumination device that can keep component costs and assembly man-hours low.

  In order to achieve the above object, one embodiment of a lighting device according to the present invention includes a first region in which a light emitting element is disposed and a second region in which a circuit element for causing the light emitting element to emit light is disposed. A substrate, a translucent cover that covers the light-emitting element, an instrument body that supports the translucent cover, and houses the substrate with the translucent cover; and the first region is exposed. A first substrate cover that covers a second region, the instrument body is provided with a first connection portion to which a power line connected to an external power source is connected, and the second region includes the A second connection is provided that is coupled to the first connection.

  It is possible to realize an illumination device that can keep component costs and assembly man-hours low.

It is a figure which shows the state which attached the illuminating device which concerns on embodiment to the support | pillar. It is a disassembled perspective view of the illuminating device which concerns on embodiment. It is a disassembled perspective view of the components accommodated in the housing of the illuminating device which concerns on embodiment. In the illuminating device which concerns on embodiment, it is a perspective view when a board | substrate, a 1st board | substrate cover, and a 2nd board | substrate cover are combined. It is a disassembled perspective view (when it sees from diagonally upward) of the board | substrate, the 1st board | substrate cover, and the 2nd board | substrate cover in the illuminating device which concerns on embodiment. It is a disassembled perspective view (when it sees from diagonally downward) of the board | substrate, the 1st board | substrate cover, and the 2nd board | substrate cover in the illuminating device which concerns on embodiment. In the illuminating device which concerns on embodiment, it is sectional drawing which shows a mode (state before a combination) when combining a board | substrate, a 1st board | substrate cover, and a 2nd board | substrate cover. In the illuminating device which concerns on embodiment, it is sectional drawing which shows a mode (state after combining) when combining a board | substrate, a 1st board | substrate cover, and a 2nd board | substrate cover. It is a perspective view which shows a mode when the illuminating device which concerns on embodiment is assembled. It is a perspective view for demonstrating the conventional illuminating device.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. Each of the embodiments described below shows a preferred specific example of the present invention. Accordingly, numerical values, shapes, materials, components, arrangement positions and connection forms of components shown in the following embodiments are merely examples, and are not intended to limit the present invention. Therefore, among the constituent elements in the following embodiments, constituent elements that are not described in the independent claims showing the highest concept of the present invention are described as optional constituent elements.

  Each figure is a schematic diagram and is not necessarily illustrated strictly. Moreover, in each figure, the same code | symbol is attached | subjected to the substantially same structure, The overlapping description is abbreviate | omitted or simplified.

  In the present specification and drawings, the X axis, the Y axis, and the Z axis represent the three axes of the three-dimensional orthogonal coordinate system. The Z axis direction is the vertical direction, and the direction perpendicular to the Z axis (in the XY plane). (Parallel direction) is the horizontal direction. Note that the plus direction in the Z-axis direction is defined as a vertically downward direction.

(Embodiment)
The whole structure of the illuminating device 1 which concerns on embodiment is demonstrated using FIGS. 1-3. FIG. 1 is a diagram illustrating a state in which a lighting device 1 according to an embodiment is attached to a column 100. FIG. 2 is an exploded perspective view of the illumination device 1. FIG. 3 is an exploded perspective view of components housed in the housing 3 of the lighting device 1.

  The illuminating device 1 is an outdoor lighting fixture used as a street lamp, for example, outdoors. As shown in FIG. 1, the illuminating device 1 is attached to the support | pillar 100 (for example, a steel pipe pole, a utility pole) installed in roadsides, such as a roadway or a sidewalk, for example. The support | pillar 100 is an example of the installation location in which the illuminating device 1 is installed.

  As shown in FIGS. 1-3, the illuminating device 1 is the board | substrate 10 with which LED11 and the circuit element 12 are arrange | positioned, the translucent cover 20, the base member 30, the 1st board | substrate cover 40, and 2nd. Board cover 50, lens unit 60, and arm 70.

  In the present embodiment, the instrument body 2 is configured by the base member 30 and the second substrate cover 50. The instrument body 2 supports the translucent cover 20 and houses the substrate 10 together with the translucent cover 20. Moreover, the instrument main body 2 accommodates the LED 11 and the circuit element 12 (power supply device). Specifically, the base member 30 supports the translucent cover 20, and the substrate 10 is accommodated in the housing 3 constituted by the base member 30 and the translucent cover 20. The housing 3 stores not only the substrate 10 but also the first substrate cover 40, the second substrate cover 50, and the lens unit 60. The housing 3 also houses a part of the arm 70.

  A substrate 10 and an arm 70 are disposed on the instrument body 2. In addition, the instrument body 2 is provided with a first connection portion 51 (first connector portion) to which a lead wire (primary side lead wire) 80 is connected. Specifically, the first connection portion 51 is provided on the second substrate cover 50 and is connected to the second connection portion 13 (second connector portion) provided on the substrate 10.

  In addition, as shown in FIG. 1, the illuminating device 1 in this Embodiment is such that the translucent cover 20 becomes the ground side (lower side) among the translucent cover 20 and the instrument main body 2 (base member 30). Placed in. That is, the illuminating device 1 irradiates illumination light toward the ground.

  Hereinafter, each structural member of the illuminating device 1 is demonstrated still in detail using FIGS. 4-9, referring FIGS. 1-3.

  4 is a perspective view when the substrate 10, the first substrate cover 40, and the second substrate cover 50 are combined in the lighting device 1 according to the embodiment, and FIGS. 5 and 6 are exploded perspective views thereof. FIG. 7 and 8 are cross-sectional views showing a state in which the substrate 10, the first substrate cover 40, and the second substrate cover 50 are combined. FIG. 7 shows a state before the combination, and FIG. 8 shows a state after the combination. Indicates the state. FIG. 9 is a perspective view showing a state when the lighting device 1 is assembled.

[substrate]
The substrate 10 is, for example, a resin substrate, a metal base substrate, a ceramic substrate, or the like. The shape of the substrate 10 is, for example, a rectangular shape, but is not limited thereto. In the present embodiment, the substrate 10 is a substantially rectangular resin substrate. Note that the substrate 10 is not limited to a rigid substrate, and may be a flexible substrate.

  As shown in FIGS. 2, 3, and 5, the substrate 10 has a first area A <b> 11 where the LEDs 11 are arranged and a second area A <b> 12 where the circuit elements 12 are arranged. The first area A11 is an LED mounting area in which the LEDs 11 are mounted, and the second area A12 is a power supply circuit area in which a power supply circuit that generates power for causing the LEDs 11 to emit light is provided. In the present embodiment, the first region A11 is one of the regions that bisect the substrate 10 in the longitudinal direction (Y-axis direction) of the substrate 10, and the second region A12 is the other region. It is.

  Thus, not only the LED 11 but also the circuit element 12 is mounted on the substrate 10. That is, in this embodiment, the substrate on which the LED 11 is mounted and the substrate on which the circuit element 12 is mounted are shared, and the LED 11 and the circuit element 12 are mounted on the same substrate 10. Therefore, the substrate 10 not only has a function as an LED substrate on which the LEDs 11 are mounted, but also has a function as a circuit substrate on which the circuit elements 12 are mounted. That is, the substrate 10, the LED 11, and the circuit element 12 can be regarded as a module in which the circuit element 12 (power supply circuit) is incorporated in an LED module (light source unit) configured by the substrate 10 and the LED 11.

  As shown in FIGS. 4 to 6, the substrate 10 includes a first main surface 10 a (front surface) facing the translucent cover 20 and a second surface on the opposite side of the first main surface 10 a. And a main surface 10b (back surface). LED11 is arrange | positioned at the 1st main surface 10a, and the circuit element 12 which is components with a lead is arrange | positioned at the 2nd main surface 10b. That is, the LED 11 and the main body of the circuit element 12 are located on different surfaces of the substrate 10. In the present embodiment, the first main surface 10a is a solder surface (printed wiring surface). Therefore, the LED 11 is soldered on the first main surface 10a in the first region A11. The circuit element 12 is soldered on the first main surface 10a in the second region A12. That is, on the first main surface 10a in the second region A12, the leads (legs) of the circuit elements 12 that penetrate the substrate 10 and are led out from the second main surface 10b are soldered. A circuit element that is a chip component may be mounted on the first main surface 10a of the substrate 10.

  Although not shown, metal wiring (for example, printed wiring) is formed on the first main surface 10a of the substrate 10 in a predetermined pattern. The metal wiring electrically connects the plurality of LEDs 11 mounted on the substrate 10, electrically connects the plurality of circuit elements 12 mounted on the substrate 10, and electrically connects the LEDs 11 and the circuit elements 12. Or connect.

  As shown in FIG. 5, the second connection portion 13 is provided in the second region A <b> 12 of the substrate 10. Specifically, the 2nd connection part 13 is provided in the 2nd main surface 10b in 2nd area | region A12.

  As shown in FIG. 6, the second connection portion 13 includes a pair of conductive terminal pins 13a (conductive pins) and a resin terminal block 13b that supports the pair of terminal pins 13a. One of the pair of terminal pins 13a is a high potential side power supply pin, and the other is a low potential side power supply pin.

  As shown in FIGS. 5 and 6, the pair of terminal pins 13 a penetrates the substrate 10. That is, each terminal pin 13a protrudes from the first main surface 10a of the substrate 10 toward the inner surface of the first substrate cover 40, and from the second main surface 10b of the substrate 10 to the second substrate cover 50. Projects toward the inner surface. The pair of terminal pins 13 a are connected to metal wiring formed on the first main surface 10 a of the substrate 10.

  The second connection portion 13 configured as described above is coupled to a first connection portion 51 provided on the second substrate cover 50. Specifically, as shown in FIGS. 7 and 8, the pair of terminal pins 13 a are coupled to the first connection portion 51 by being inserted into the insertion holes 52 provided in the first connection portion 51. .

  As shown in FIG. 2 to FIG. 6, a plurality of mounting holes 14 are formed on both sides along the longitudinal direction of the substrate 10 by cutting out a part of the substrate 10 into a semicircular shape. As shown in FIGS. 2, 3, and 9, the substrate 10 can be fixed to the arm 70 by superimposing each mounting hole 14 on each mounting hole 74 of the arm 70 and tightening with the mounting screw S <b> 1.

  The LED 11 is an example of a light emitting element. The LED 11 is a light source of the illumination device 1, and a plurality of LEDs 11 are arranged on the first main surface 10 a in the first region A <b> 11 of the substrate 10 as shown in FIG. 5. As shown in FIG. 3, in the present embodiment, eight LEDs 11 are arranged in two rows in a staggered arrangement at a predetermined interval. The plurality of LEDs 11 mounted on the substrate 10 are connected in series, parallel, or series-parallel by metal wiring formed on the substrate 10.

  The LED 11 is an LED element having a surface mount (SMD) structure. The LED 11 includes, for example, a white resin package (container) having a recess, an LED chip mounted on a bottom surface of the recess of the package, and a sealing member sealed in the recess of the package. The sealing member is made of a translucent resin material such as silicone resin. The sealing member may be a phosphor-containing resin containing a wavelength conversion material such as a phosphor.

  The LED chip is an example of a semiconductor light emitting element that emits light with a predetermined DC power, and is a bare chip that emits monochromatic visible light. The LED chip is, for example, a blue LED chip that emits blue light when energized. In this case, in order to obtain white light, the sealing member contains a yellow phosphor such as YAG (yttrium, aluminum, garnet) that emits fluorescence using blue light from the blue LED chip as excitation light.

  Thus, LED11 in this Embodiment is a BY type white LED light source comprised with the blue LED chip and the yellow fluorescent substance. Specifically, the yellow phosphor absorbs a part of the blue light emitted from the blue LED chip and is excited to emit yellow light, and the yellow light and the blue light not absorbed by the yellow phosphor are mixed. White light.

  As shown in FIGS. 5 and 6, a plurality of circuit elements 12 (circuit element groups) for causing the LEDs 11 to emit light are mounted on the substrate 10. The plurality of circuit elements 12 constitute a power supply circuit that generates electric power for causing the LED 11 to emit light, and performs lighting control of the LED 11. The plurality of circuit elements 12 together with the substrate 10 constitute a power supply device (power supply unit).

  The power supply circuit (circuit element group) is a lighting circuit that controls the lighting of the LED 11. For example, AC power from an external power source such as a commercial power source is converted into DC power of a predetermined level by rectification, smoothing, step-down, etc. The DC power is supplied to the LED 11. For example, AC power from an external power source is supplied to the power supply circuit via the lead wire 80, the first connection portion 51, and the second connection portion 13, converted into DC power, and formed on the substrate 10. It is supplied to the LED 11 through wiring. As a result, the LED 11 emits light (lights up).

  The circuit element 12 (electronic component) is, for example, a capacitor element such as an electrolytic capacitor or a ceramic capacitor, a resistor element such as a resistor, a rectifier circuit element, a coil element, a choke coil (choke transformer), a noise filter, a diode, or an integrated circuit element And the like. The circuit element 12 is not limited to a component with leads, and the circuit element 12 may include a chip component. The circuit element 12 which is a leaded component is disposed so that the main body portion is located on the second main surface 10b of the substrate 10 and is soldered on the first main surface 10a. On the other hand, the circuit element 12 which is a chip component is disposed on the first main surface 10a of the substrate 10 and soldered on the first main surface 10a. Note that a dimmer circuit, a booster circuit, or the like may be combined with the power supply device (power supply circuit).

  In the present embodiment, the substrate 10 is also provided with an optical sensor (for example, an illuminance sensor), and the power output from the power supply device to the LED 11 is controlled by a detection signal from the optical sensor. For example, the optical sensor detects the amount of natural light guided into the second substrate cover 50 via a cylindrical daylighting portion 53 (see FIG. 5) formed on the second substrate cover 50, and supplies power. A detection signal is output to the device. By this detection signal, for example, when the sun goes down and the surroundings become dark, each LED 11 is automatically turned on, and when the sun rises and the surroundings become bright, each LED 11 is automatically turned off.

[Translucent cover]
The translucent cover 20 is a cover having translucency. As shown in FIG. 2, the translucent cover 20 covers the LEDs 11. In the present embodiment, the translucent cover 20 is an outer cover of the lighting device 1, and the light of the LED 11 incident from the inner surface of the translucent cover 20 is transmitted through the translucent cover 20 and emitted to the outside. To do.

  The translucent cover 20 is a semi-cylindrical resin molded product made of a translucent resin material such as acrylic (PMMA) or polycarbonate (PC). The translucent cover 20 is attached to the base member 30 to close the opening of the base member 30. The material of the translucent cover 20 is not limited to the resin material, and may be other translucent materials such as a glass material.

  The translucent cover 20 may further have light diffusibility. That is, the translucent cover 20 may not be a transparent cover but a diffusion cover having translucency and light diffusibility. In this case, the translucent cover 20 can be a milky white diffusion cover in which a light diffusion material is dispersed. Such a diffusion cover can be produced by molding a translucent resin material mixed with a light diffusing material into a predetermined shape. Light reflecting fine particles can be used as the light diffusing material.

  The diffusion cover may be produced by forming a milky white light diffusion film containing the light diffusion material or the like on the surface (inner surface or outer surface) of the transparent cover, instead of dispersing the light diffusion material inside. Further, the diffusion cover may be configured to have light diffusibility by performing diffusion processing instead of using a light diffusing material. For example, it may be configured to have light diffusibility by forming fine irregularities on the surface of the transparent cover by applying a surface treatment such as embossing or printing a dot pattern on the surface of the transparent cover. Good. Even in the case of diffusion processing, a light diffusing material may be further added in order to improve light diffusibility.

  As described above, by providing the light transmissive cover 20 with the light diffusing function, the light from the LED 11 incident on the light transmissive cover 20 is diffused (scattered) by the light transmissive cover 20 and the light transmissive cover 20 is formed. Transmits and exits. Thereby, the collapse feeling (brightness difference) of the light radiate | emitted from several LED11 can be suppressed, and the luminance uniformity in the translucent cover 20 can be improved. In addition, you may give light diffusivity to a part of translucent cover 20 instead of the whole translucent cover 20. FIG. Further, the degree of diffusion may be partially changed. In the translucent cover 20 according to the present embodiment, the portion facing the first substrate cover 40 is subjected to a graining process, and the degree of diffusion of this portion is increased.

  As shown in FIG. 2, a concave portion 21 that is recessed in the direction along the thickness direction (Z-axis direction) is provided at the base end in the longitudinal direction (Y-axis direction) of the translucent cover 20. As shown in FIGS. 2 and 3, the recess 21 is provided with a mounting hole 22 penetrating in the thickness direction. The mounting hole 22 is used to fix the translucent cover 20 to the arm 70 using the mounting screw S2. The translucent cover 20 can be fixed to the arm 70 by overlapping the mounting hole 22 and the mounting hole 75 of the arm 70 and tightening with the mounting screw S2.

  In the present embodiment, a seal member 90 is attached to the base end of the translucent cover 20. The seal member 90 is a packing disposed so as to fill a gap between the translucent cover 20 and the arm 70. The seal member 90 is made of an elastic resin material such as an elastomer. By disposing the seal member 90 between the translucent cover 20 and the arm 70, dust, rainwater, and the like enter the interior of the housing 3 (the space surrounded by the translucent cover 20 and the base member 30). Can be suppressed.

  In addition, a pair of hooks 23 are provided at the longitudinal end of the translucent cover 20. By hooking the hook 23 on the shaft 38 of the base member 30, the translucent cover 20 can be rotated about the shaft 38 as a fulcrum. That is, the hook 23 of the translucent cover 20 and the shaft 38 of the base member 30 constitute a hinge, and the translucent cover 20 can be opened and closed with respect to the base member 30 (the instrument body 2). .

[Base member]
The base member 30 is a body of the lighting device 1, and the arm 70 and the translucent cover 20 are attached to the base member 30. The base member 30 is a box-shaped resin molded product made of a resin material such as acrylonitrile styrene acrylate (ASA).

  As shown in FIG. 3, the base member 30 includes a main portion 31 and a wall portion 32 that falls along the thickness direction over the entire circumference of the main portion 31. The main portion 31 is a bottom portion of the base member 30. The wall part 32 is comprised by the outer wall 32a and the inner wall 32b which fall along the thickness direction from the main part 31 in the mutually parallel form. In the groove portion between the outer wall 32a and the inner wall 32b, an end portion constituting the opening frame of the translucent cover 20 is inserted.

  An opening for allowing the lead wire 80 to pass through is provided at one end (the column 100 side) of the base member 30 in the longitudinal direction (Y-axis direction). The lead wire 80 can be pulled out from the inside of the base member 30 through the opening.

  A second substrate cover 50 is disposed at the end of the base member 30 on the other side in the longitudinal direction (the side opposite to the column 100 side). That is, a power supply device (power supply circuit) is disposed at the longitudinal end of the base member 30.

  The base member 30 has a first wire support portion 33 that supports the lead wire 80. In the present embodiment, the first line support portion 33 is provided in the main portion 31. The first wire support portion 33 sandwiches the lead wire 80 with the second wire support portion 73 provided on the arm 70.

  Further, the base member 30 includes a line guide groove 34 for guiding the lead wire 80 and a line pressing portion 35 for pressing the lead wire 80. In the present embodiment, the line guide groove 34 and the line pressing portion 35 are provided at one end of the base member 30 in the longitudinal direction.

  Further, the base member 30 has a plurality of ribs 36. In the present embodiment, the plurality of ribs 36 are provided between the first line support portion 33 and the second substrate cover 50.

  Thus, the lead wire 80 is easily positioned within the base member 30 by drawing the lead wire 80 using the first wire support portion 33, the wire guide groove 34, the wire pressing portion 35, and the rib 36. be able to. Further, the tension of the lead wire 80 can be stopped.

  The base member 30 has a notch 37 (locking hole) in which the claw piece 77 of the arm 70 is locked. The cutout portion 37 is provided in the wall portion 32. Specifically, a plurality of pairs of notches 37 are provided on the inner wall 32 b with a pair of both end portions in the width direction of the base member 30 along the longitudinal direction of the base member 30. In the present embodiment, each notch 37 is formed so as to cut out the inner wall 32b in an L shape.

  A pair of shafts 38 is provided at the tip of the base member 30. A hook 23 of the translucent cover 20 is hooked on the shaft 38.

[Board cover]
As shown in FIGS. 4 to 6, the first substrate cover 40 and the second substrate cover 50 cover the second region A12 of the substrate 10 with the first region A11 exposed. Specifically, the first substrate cover 40 covers the first main surface 10a in the second region A12 of the substrate 10, and the second substrate cover 50 is in the second region A12 of the substrate 10. The second main surface 10b is covered. Thus, the first substrate cover 40 and the second substrate cover 50 are a substrate protection cover that covers the substrate 10 and a circuit element protection cover that covers the circuit element 12 (power supply device).

  As shown in FIG. 4, the first substrate cover 40 and the second substrate cover 50 are combined. That is, the first substrate cover 40 and the second substrate cover 50 are combined with each other to form a protective case that covers the substrate 10 and the circuit element 12. For example, each of the first substrate cover 40 and the second substrate cover 50 is provided with a locking claw or a locking hole, and by locking the locking claw and the locking hole with a snap-in, The first substrate cover 40 and the second substrate cover 50 can be connected and fixed.

  Further, the first substrate cover 40 and the substrate 10, for example, lock the locking claws formed on the inner surface of the first substrate cover 40 to the end portion of the substrate 10, and the first substrate cover 40. The protrusions formed on the bottom surface of the substrate 10 are fixed by being fitted into holes formed in the substrate 10. The first substrate cover 40 and the substrate 10 are also fixed by a potting material. The potting material is a resin curing agent made of, for example, a silicone resin.

  In the present embodiment, the first substrate cover 40 and the second substrate cover 50 are made of an insulating material. Specifically, the first substrate cover 40 and the second substrate cover 50 are box-shaped resin molded products made of an insulating resin material such as polybutylene terephthalate (PBT) or polybutene (PB).

  As shown in FIGS. 5 and 6, the second connection cover 51 is provided on the second substrate cover 50. The first connecting portion 51 is a protruding portion that protrudes toward the second main surface 10b of the substrate 10, and is integrally formed with the second substrate cover 50 in the present embodiment. The first connecting portions 51 are provided as a pair in accordance with the pair of lead wires 80.

  Each first connection portion 51 is provided with an insertion hole 52 into which the terminal pin 13a of the second connection portion 13 is inserted. That is, a pair of insertion holes 52 are also provided. As shown in FIGS. 7 and 8, a connector portion 81 provided at one end of each lead wire 80 is also inserted into each insertion hole 52. In each insertion hole 52, the second connection portion 13 (terminal pin 13 a) and the lead wire 80 are inserted by inserting the second connection portion 13 (terminal pin 13 a) and the connector portion 81 of the lead wire 80 into the insertion hole 52. The connector portion 81 is connected to the inside of the insertion hole 52. Thereby, the 2nd connection part 13 (terminal pin 13a) and the lead wire 80 are electrically and physically connected.

  Further, each insertion hole 52 is provided with a locking hole 51a for locking a hook portion 81a provided in the connector portion 81 of each lead wire 80.

  As shown in FIGS. 2 and 5, the second substrate cover 50 is formed with a cylindrical daylighting portion 53 for guiding natural light (sunlight) to the inside of the second substrate cover 50. . Light from the daylighting unit 53 is detected by an optical sensor provided in the second region A12 of the substrate 10.

[Lens unit]
As shown in FIGS. 2 and 3, the lens unit 60 includes a plurality of (eight in the present embodiment) lenses 61 corresponding to each of the plurality of LEDs 11 and a mounting plate that connects the lenses 61 together. 62.

  Each lens 61 is an optical component that determines the light distribution of the light emitted from the corresponding LED 11. In the present embodiment, since the lighting device 1 is installed on the roadside column 100, the lens 61 may be formed to have a light distribution that spreads in a wide angle along the traveling direction of the vehicle on the road. Further, the lens 61 may be formed so as to have a light distribution that suppresses light irradiation outside the road in the width direction of the road in order to avoid unnecessary light irradiation.

  The lens unit 60 is a resin molded product made of a translucent resin material such as acrylic (PMMA). The lens 61 and the mounting plate 62 are integrally formed.

  The lens unit 60 is disposed so as to cover the first main surface 10a in the first region A11 of the substrate 10 so that the lenses 61 and the LEDs 11 correspond one to one. Specifically, a plurality of mounting holes 63 are formed on both sides along the longitudinal direction of the mounting plate 62 by partially cutting the mounting plate 62 into a semicircular shape. The lens unit 60 can be fixed to the arm 70 by superimposing the mounting holes 63 on the mounting holes 74 of the arm 70 and tightening with the mounting screws S1.

[arm]
As shown in FIGS. 1 to 3, the arm 70 is attached to the instrument body 2. In the present embodiment, the arm 70 is attached to the central portion of the base member 30. Specifically, the arm 70 is provided with a mounting hole. The mounting hole is overlapped with the screw hole provided in the central portion of the base member 30 and the mounting screw is screwed into the screw hole, whereby the arm 70 is mounted. It is fixed to the base member 30.

  The arm 70 is made of sheet metal, and is formed into a predetermined shape by bending a metal plate such as a steel plate. As shown in FIG. 1, the arm 70 is attached to the support | pillar 100, and supports the instrument main body 2 (base member 30). As shown in FIGS. 2 and 3, the arm 70 includes a long main plate portion 71 and a pair of side plate portions 72 (wall portions). Each of the pair of side plate portions 72 rises along the thickness direction from both sides along the longitudinal direction of the main plate portion 71.

  When the arm 70 is attached to the support column 100, the arm 3 is curved so that the housing 3 is inclined at a certain angle with respect to the horizontal plane. Specifically, the main plate portion 71 and the side plate portion 72 are curved.

  The arm 70 has a second wire support portion 73 that supports the lead wire 80. In the present embodiment, the second line support portion 73 is formed by cutting and raising a part of the metal plate constituting the main plate portion 71 toward the base member 30 side.

  As shown in FIGS. 3 and 9, the arm 70 includes a support portion 70 a that is a portion that supports the instrument main body 2 (base member 30) and an attachment portion 70 b that is a portion attached to the support column 100. The support portion 70 a of the arm 70 is accommodated in the housing 3. That is, the support part 70a is accommodated in a region surrounded by the translucent cover 20 and the instrument main body 2 (base member 30). On the other hand, the mounting portion 70 b of the arm 70 is not housed in the housing 3 and is exposed from the housing 3.

  The substrate 10 is placed on the main plate portion 71 in the support portion 70a. The main plate portion 71 in the support portion 70a is provided with mounting holes 74 (four in the present embodiment) penetrating in the thickness direction. The mounting hole 74 is used to fix the substrate 10 and the lens unit 60 to the arm 70 using the mounting screw S1. Further, the main plate portion 71 in the support portion 70a is provided with an attachment hole 75 (one in the present embodiment) penetrating in the thickness direction. The mounting hole 75 is used to fix the translucent cover 20 to the arm 70 using the mounting screw S2.

  On the other hand, the main plate portion 71 in the attachment portion 70b is provided with an attachment hole 76 penetrating in the thickness direction. The mounting hole 76 is used to fix the arm 70 to the support column 100 using the mounting screw S3.

  As shown in FIG. 1, when attaching the arm 70 to the support | pillar 100, first, the belt 200 is wound around the support | pillar 100 and the attachment bracket 300 is fixed. Thereafter, the three attachment holes provided in the attachment fitting 300 and the three attachment holes 76 provided in the attachment portion 70b of the arm 70 are overlapped and tightened with the attachment screw S3. As a result, the arm 70 can be fixed to the support column 100 via the mounting bracket 300. In addition, a slit for passing the belt 200 is provided in each side plate 72 portion of the mounting portion 70b of the arm 70.

  Further, as shown in FIG. 3, each side plate portion 72 of the support portion 70 a of the arm 70 is provided with a claw piece 77 (locking claw) that is locked to the notch portion 37 provided in the base member 30. Yes. The claw piece 77 is formed by cutting and raising a part of the metal plate. When the claw piece 77 and the cutout portion 37 are locked, the position of the arm 70 and the base member 30 in the thickness direction (Z-axis direction) is regulated.

  In the present embodiment, the arm 70 is movable in the direction of the power supply device side of the base member 30. Specifically, the arm 70 can be slid along the Y-axis direction in the direction toward the power supply device of the base member 30 with the claw piece 77 inserted into the notch 37 of the base member 30.

[Lead wire 80]
The lead wire 80 is a power line for supplying power from the external power source to the lighting device 1. The lead wire 80 is electrically connected to the power supply device (circuit element 12), and is drawn out of the lighting device 1. That is, the lead wire 80 is a primary-side lead wire that connects the input unit of the power supply device and the external power supply, and supplies, for example, AC power from a commercial power supply to the power supply device.

  In the present embodiment, the lead wire 80 is connected to the second connection portion 13 (terminal pin 13a) of the substrate 10 through the first connection portion 51 of the second substrate cover 50, as shown in FIG. Has been.

  In the present embodiment, the lead wires 80 are a pair. That is, two lead wires 80 are used. One of the pair of lead wires 80 is a high potential side power line, and the other of the pair of lead wires 80 is a low potential side power line.

  As shown in FIGS. 7 and 8, a connector portion 81 is provided at one end of each of the pair of lead wires 80 (the end on the side connected to the first connection portion 51). The connector portion 81 is a conductive piece provided at the tip of the core wire (conductive wire) of the lead wire 80, and is formed in a leaf spring shape.

  With the connector part 81 inserted into the insertion hole 52 of the first connection part 51, the terminal pin 13 a of the second connection part 13 provided on the substrate 10 is inserted into the insertion hole, so that the terminal pin 13 a leads Contact the connector portion 81 of the wire 80. At this time, the terminal pin 13 a is elastically held by the spring restoring force of the connector portion 81. Thereby, the lead wire 80 is electrically connected to the power supply device (circuit element 12) through the second connection portion 13 (terminal pin 13a).

  The connector portion 81 is formed with a hook portion 81a. The hook portion 81a is locked in a lock hole 51a provided in the first connection portion 51, so that the connector portion 81 is the first connection portion. 51 is fixed. As a result, the lead wire 80 cannot be pulled out from the first connection portion 51, and the lead wire 80 is locked to the first connection portion 51.

  The lead wire 80 is sandwiched between the first wire support portion 33 of the base member 30 and the second wire support portion 73 of the arm 70. As a result, the lead wire 80 can be tensioned and the lead wire 80 can be fixed to the base member 30.

[Assembly method of lighting device]
Next, a method for assembling lighting device 1 in the present embodiment will be described with reference to FIGS.

  First, the base member 30 is placed in the work space with its opening facing up. Then, the second substrate cover 50 in a state where the lead wire 80 is connected to the first connecting portion 51 is disposed on the base member 30, and the lead wire 80 is disposed at a predetermined position on the base member 30. At this time, the lead wire 80 is disposed at a predetermined position in the base member 30 using the first wire support portion 33, the wire guide groove 34, the wire pressing portion 35, and the rib 36. Route around.

  Next, the arm 70 is disposed on the base member 30 so as to cover the lead wire 80. At this time, the claw piece 77 of the arm 70 is inserted into the notch 37 of the base member 30, and the arm 70 is slid in the direction of the power supply device along the longitudinal direction (Y-axis direction) of the base member 30. Thereafter, the arm 70 is fixed to the base member 30 by screwing the arm 70 and the base member 30 with screws.

  Next, the first substrate cover 40 is fixed to the substrate 10 on which the LEDs 11 and the circuit elements 12 are already mounted with a potting material. For example, the potting material is applied to the first main surface 10a of the substrate 10 and the first substrate cover 40 is covered to cure the potting material.

  Next, the first substrate cover 40 to which the substrate 10 is fixed is disposed on the base member 30 so that the mounting hole 74 of the substrate 10 and the mounting hole 63 of the lens unit 60 are superimposed on the mounting hole 74 of the arm 70. The second substrate cover 50 is bonded. At this time, the second connection portion 13 (terminal pin 13 a) provided on the substrate 10 is coupled to the insertion hole 52 of the first connection portion 51 of the second substrate cover 50. That is, by connecting the first substrate cover 40 and the second substrate cover 50, the connection between the lead wire 80 (primary-side lead wire) and the second connection portion 13 (terminal pin 13a) is completed. Thereafter, the mounting screw S1 is inserted into the mounting hole 74 of the arm 70, the mounting hole 14 of the substrate 10 and the mounting hole 63 of the lens unit 60 and tightened to fix the substrate 10 and the lens unit 60 to the arm 70.

  Next, each hook 23 of the translucent cover 20 is hooked on the shaft 38 of the base member 30 with the seal member 90 attached to the base end of the translucent cover 20. Then, by rotating the translucent cover 20 with the shaft 38 as a fulcrum, the opening of the base member 30 is closed by the translucent cover 20.

  Finally, the translucent cover 20 is fixed to the arm 70 by inserting and tightening the mounting screw S2 into the mounting hole 22 of the translucent cover 20 and the mounting hole 75 of the arm 70.

[effect]
Next, the effect of the illumination device 1 according to the present embodiment will be described with reference to FIG. 10 including the background to the present invention. FIG. 10 is a perspective view for explaining a conventional lighting device 1000.

  As shown in FIG. 10, in the conventional lighting device 1000, a lead wire 1080 (primary side lead wire) is used to supply power from an external power source to a power supply device (circuit board) 1012. A lead wire 1085 (secondary lead wire) is used to electrically connect the LED module (LED substrate) 1011 and the power supply device (circuit board) 1012. As described above, in the conventional lighting device 1000, the worker uses the two lead wires 1080 and 1085 to make a connector connection. For this reason, in the conventional illuminating device 1000, parts cost becomes high or the assembly man-hour at the time of assembling the illuminating device 1000 increases.

  In contrast, the lighting device 1 according to the present embodiment includes the substrate 10 having the first region A11 in which the LEDs 11 are disposed and the second region A12 in which the circuit elements 12 for causing the LEDs 11 to emit light are disposed. Have. Thereby, since the board | substrate which arrange | positions LED11 and the board | substrate which arrange | positions the circuit element 12 can be shared by the one board | substrate 10, the lead wire 1085 (secondary side lead wire) in the conventional illuminating device 1000 becomes unnecessary.

  Furthermore, in the lighting device 1 according to the present embodiment, the fixture body 2 is provided with a first connection portion 51 to which the lead wire 80 connected to the external power source is connected, and the second region of the substrate 10 is provided. A 12 is provided with a second connection portion 13 connected to the first connection portion 51. Thereby, the lead wire 80 and the second connection portion 13 of the substrate 10 can be connected only by connecting the lead wire 80 (primary side lead wire) to the first connection portion 51 of the instrument body 2. Therefore, the illumination device 1 can be easily assembled. In addition, the assembly of the lighting device 1 can be automated.

  As mentioned above, according to the illuminating device 1 which concerns on this Embodiment, component cost and an assembly man-hour can be restrained low.

  Moreover, in this Embodiment, LED11 is arrange | positioned at the 1st main surface 10a of the board | substrate 10, and the circuit element 12 and the 2nd connection part 13 are arrange | positioned at the 2nd main surface 10b of the board | substrate 10. FIG. ing.

  Thereby, the solder connection part of LED11 and the solder connection part of the circuit element 12 can be made into the same 1st main surface 10a. Moreover, the 2nd connection part 13 can be made into the opposite side to the surface where LED11 is arrange | positioned. Therefore, since the board | substrate 10 can be integrated in the instrument main body 2 more easily, an assembly man-hour can be restrained further lower.

  Further, the first area A11 (area where the LED 11 is mounted) of the substrate 10 is exposed, and the second area A12 (area where the circuit element 12 is mounted) of the board 10 is exposed by the first substrate cover 40. By covering, the circuit element 12 can be protected while causing the LED 11 to emit light. Thereby, since weather resistance can be improved, the illuminating device suitable for the outdoors can be implement | achieved.

  Moreover, in this Embodiment, the instrument main body 2 has the 2nd board | substrate cover 50 arrange | positioned at the base member 30 and the base member 30, and covers 2nd area | region A12 of the board | substrate 10, and is a 1st board | substrate cover. 40 covers the first main surface 10 a of the substrate 10, and the second substrate cover 50 covers the second main surface 10 b of the substrate 10. The first connection portion 51 is provided on the second substrate cover 50.

  Thereby, the 1st connection part 51 and the 2nd connection part 13 can be simply connected only by combining the board | substrate 10, the 1st board | substrate cover 40, and the 2nd board | substrate cover 50. FIG. Therefore, since the lighting device 1 can be easily further assembled, the number of assembly steps can be further reduced.

  In the present embodiment, the second substrate cover 50 is made of an insulating material.

  Thereby, the circuit element 12 can be insulated and protected by the second substrate cover 50 covering the circuit element 12. Therefore, it is possible to realize a lighting device that has an excellent withstand voltage.

  In the present embodiment, the first substrate cover 40 and the second substrate cover 50 are combined.

  Thus, when the first substrate cover 40 and the second substrate cover 50 are coupled, the first connection portion 51 of the second substrate cover 50 and the second connection portion 13 of the substrate 10 are coupled. It becomes possible. Therefore, the number of assembling steps when assembling the lighting device 1 can be further reduced.

  In the present embodiment, the first substrate cover 40 and the substrate 10 are fixed by a potting material.

  Thus, the first substrate cover 40 and the circuit element 12 are easily insulated from each other before connecting the first substrate cover 40 to the second substrate cover 50 while insulating the first substrate cover 40 and the circuit element 12. Can be fixed. Thereby, the illuminating device 1 can be assembled further easily.

  Moreover, in this Embodiment, the illuminating device 1 is further provided with the arm 70 attached to the support | pillar 100 installed on the ground, and a part of arm 70 is enclosed with the translucent cover 20 and the instrument main body 2. FIG. Stored in the area.

  Thereby, the outdoor illuminating device attached to the support | pillar 100 is realizable.

(Other variations)
As mentioned above, although the illuminating device 1 which concerns on this invention was demonstrated based on embodiment, this invention is not limited to the said embodiment.

  For example, in the above embodiment, the LED 11 having the SMD structure is used as the light source, but the light source may have a COB (Chip On Board) structure. Specifically, an LED chip may be directly mounted on the substrate 10 as the LED 11, and the LED chip may be sealed with a sealing member (phosphor-containing resin).

  In the above embodiment, the LED 11 is a BY type white LED light source that emits white light using a blue LED chip and a yellow phosphor. However, the present invention is not limited to this. For example, a red phosphor and a green phosphor may be used and combined with a blue LED chip to emit white light. In addition to the yellow phosphor, a red phosphor or a green phosphor may be further mixed for the purpose of improving color rendering. Alternatively, an LED chip that emits a color other than blue may be used. For example, an RGB chip that emits ultraviolet light using an LED chip that emits ultraviolet light is used to emit fluorescent light (blue phosphor, green). The phosphor may be configured to emit white light by a red phosphor. Moreover, you may comprise so that white light may be discharge | released by the red LED chip which emits red light, the green LED chip which emits green light, and the blue LED chip which emits blue light, without using fluorescent substance.

  Moreover, although LED was illustrated as a light emitting element in the said embodiment, you may use other solid light emitting elements, such as a semiconductor laser or organic EL (Electro Luminescence).

  In addition, it is realized by arbitrarily combining the components and functions in the embodiments without departing from the scope of the present invention, and the forms obtained by subjecting each embodiment to various modifications conceived by those skilled in the art. This form is also included in the present invention.

DESCRIPTION OF SYMBOLS 1 Illuminating device 2 Appliance main body 10 Board | substrate 10a 1st main surface 10b 2nd main surface 11 LED (light emitting element)
DESCRIPTION OF SYMBOLS 12 Circuit element 13 2nd connection part 20 Translucent cover 30 Base member 40 1st board | substrate cover 50 2nd board | substrate cover 51 1st connection part 70 Arm 100 support | pillar A11 1st area | region A12 2nd area | region

Claims (7)

A substrate having a first region in which a light emitting element is disposed and a second region in which a circuit element for causing the light emitting element to emit light is disposed;
A translucent cover covering the light emitting element;
An instrument body that supports the light-transmitting cover and stores the substrate with the light-transmitting cover;
A first substrate cover covering the second region with the first region exposed;
The instrument body is provided with a first connection portion to which a power line connected to an external power source is connected,
The second region is provided with a second connection portion coupled to the first connection portion. The substrate has a first main surface facing the translucent cover, and a second main surface opposite to the first main surface,
The light emitting element is disposed on the first main surface,
The circuit element is disposed on the second main surface,
The lighting device according to claim 1, wherein the second connection portion is provided on the second main surface. The instrument body has a base member and a second substrate cover disposed on the base member and covering a second region of the substrate,
The first substrate cover covers the first main surface,
The second substrate cover covers the second main surface;
The lighting device according to claim 2, wherein the first connection portion is provided on the second substrate cover. The lighting device according to claim 3, wherein the second substrate cover is made of an insulating material. The lighting device according to claim 3, wherein the first substrate cover and the second substrate cover are combined. The lighting device according to any one of claims 1 to 5, wherein the first substrate cover and the substrate are fixed by a potting material. In addition, it has an arm that can be attached to a pillar installed on the ground,
The lighting device according to any one of claims 1 to 6, wherein a part of the arm is housed in a region surrounded by the translucent cover and the instrument body.

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