JP5445846B2 - Lighting device - Google Patents

Description

  The present invention relates to a lighting device using a semiconductor light emitting element as a light source.

  2. Description of the Related Art Conventionally, for example, some lighting devices such as spotlights used for illuminating exhibits have used LEDs as light sources.

  In such an illuminating device, a substrate on which a plurality of LEDs are mounted, a plurality of lenses that project light from each LED, a substrate and a main body that accommodates the lens, and the main body is supported from the ceiling side by an arm, The direction of the front surface of the main body that emits light can be adjusted in the rotational direction and the vertical direction with respect to the arm.

  The main body includes a heat radiating body to which the board is attached to the front surface, a cover that covers the whole, and the like, and an electric power supply wire from outside is drawn into the main body and electrically connected to the board (for example, a patent) Reference 1).

JP 2006-294526 A (page 3, FIG. 1-3)

  However, in the conventional lighting fixture, the heat generated when the semiconductor light emitting element emits light is not efficiently conducted from the substrate to the heat radiator.

  This invention is made | formed in view of such a point, and it aims at providing the illuminating device which can carry out the heat | fever which the semiconductor light-emitting element generate | occur | produces at the time of light emission efficiently from a board | substrate to a heat radiator.

The lighting device according to claim 1, wherein a plurality of semiconductor light emitting elements are mounted at least in a peripheral portion and a surface on which the semiconductor light emitting elements are mounted , and a connection portion is provided inside the semiconductor light emitting element mounted in the peripheral portion. A substrate formed with an electric wire led out from the connecting portion ; a substrate pressing member including a plurality of lenses corresponding to each of the plurality of semiconductor light emitting elements; and a heat dissipator at the front portion and the rear portion where the substrate is attached to the front portion In addition, the front portion is provided with an electric wire insertion portion for inserting the electric wire of the substrate into the rear portion through a gap formed between the lenses, and the substrate is interposed between the substrate pressing member and the front portion. And a main body to be sandwiched and fixed.
Examples of the semiconductor light emitting element include an LED chip element and an EL element.

  The substrate is made of, for example, a metal such as aluminum or a ceramic having thermal conductivity, and an insulating layer and a wiring pattern for mounting the semiconductor light emitting element are formed on the front surface. A connector may be provided.

The radiator is made of a metal such as aluminum, for example, and preferably has a front surface provided in a flat shape so that the substrate comes into surface contact and has high thermal conductivity, and a heat radiation structure is provided on the rear side. May be.
As the electric wire, for example, a covered electric wire is used, and the substrate is connected to a power source side such as a lighting device that lights the semiconductor light emitting element.

  A lighting device according to a second aspect is the lighting device according to the first aspect, wherein a plurality of heat radiation fins are provided at a rear portion of the heat radiating body, and an electric wire is led out from between the heat radiation fins adjacent to each other.

  The radiating fins are preferably formed along the vertical direction, and even if the vertical direction of the main body is changed, convection flows along the vertical direction between the radiating fins, and a high heat radiating effect can be maintained.

According to the lighting device of the first aspect, the substrate is brought into close contact with the front surface portion of the radiator, and the thermal conductivity from the substrate to the radiator is improved. The heat generated when the semiconductor light emitting element emits light is efficiently conducted from the substrate to the heat radiating body, and can be radiated from the heat radiating body to the air.
According to the illuminating device of claim 2, in addition to the effect of the illuminating device of claim 1, the electric wire can be led out from between the radiation fins adjacent to each other.

It is a disassembled perspective view of the illuminating device which shows one embodiment of this invention. It is the perspective view which looked at a part of illumination device same as the above from the front. It is the perspective view seen from the back of an illuminating device same as the above. It is a front view of the main body of an illuminating device same as the above. It is a perspective view of the installation state of an illuminating device same as the above.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

  As shown in FIG. 5, the lighting device 11 includes a lamp body (lighting device main body) 12, a support body 13 that supports the lamp body 12, and a power supply unit 14 to which the support body 13 is attached and that houses a lighting circuit (not shown). And an electric wire 15 for electrically connecting the lighting circuit of the power supply unit 14 and the lamp body 12 side.

  As shown in FIG. 1, the lamp body 12 includes a main body 23 having a front-side cover 21 and a heat radiating body 22 attached to the rear portion of the cover 21, a substrate 25 on which LEDs 24 are mounted as a plurality of semiconductor light emitting elements, A plurality of lenses 26 that project light emitted from the LED 24 forward of the lamp body 12 and a lens holder 27 that holds these lenses 26 between the cover 21 and the lens 26 are provided.

  The cover 21 is made of, for example, synthetic resin or metal, and includes a disk-shaped front plate 30 and a cylindrical cover portion 31 that protrudes rearward from the peripheral portion of the front plate 30. Both side portions of the support member 13 are supported by a horizontal axis so as to be adjustable in the vertical direction with respect to the support 13. The front plate 30 is formed with a plurality of lens fitting holes 32 into which the lenses 26 are fitted and arranged from the rear side.

Further, the radiator 22 is made of a metal such as aluminum, for example, and has a planar front surface portion 35 on which the substrate 25 is attached in a surface contact state, an outer surface portion 36 that is a peripheral surface adjacent to the front surface portion 35, and a rear side. Is provided with a heat radiating portion 37 protruding from the surface.
The front surface portion 35 is formed with a concave portion 35a into which the substrate 25 is fitted and positioned.

Near the center of the front portion 35, a screw mounting hole 39 into which a screw 38 for fastening the substrate 25 and the lens holder 27 together with the radiator 22 is fixed is formed, and a part for positioning the lens holder 27 is formed. A plurality of escape holes 40 are formed to allow entry of a ground, and a ground mounting boss 41 having a ground mounting hole 41a is projected. The projecting dimension of the ground mounting boss 41 from the front surface portion 35 is larger than the thickness dimension of the substrate 25.
A plurality of attachment portions 43 configured by grooves and holes through which a plurality of screws 42 (see FIG. 3) to be fixed to the cover 21 are inserted are formed in the peripheral portion of the front surface portion 35.

A wiring groove 44 that communicates from the outer surface portion 36 to the front surface portion 35 is formed in the outer surface portion 36 at the upper portion of the radiator 22. The wiring groove 44 is provided with an electric wire 15 that is drawn in from the outside of the main body 23 to be electrically connected to the substrate 25. As shown in FIGS. 1 to 3, the front surface portion 35 of the radiator 22 is disposed. A front opening 45 and a rear opening 46 opened to the rear of the radiator 22, and the entire outer surface of the wiring groove 44, that is, the entire upper surface is opened. The width of the wiring groove 44 is wider on the front side than on the rear side, and the shape of the wiring groove 44 is substantially L-shaped in plan view.
An electric wire holder 47 for holding the electric wires 15 arranged in the wiring grooves 44 is attached with screws 48 below the wiring grooves 44 on the rear surface of the radiator 22.

  The heat radiating portion 37 is formed with a plurality of heat radiating fins 49 arranged in the vertical direction at predetermined intervals in the horizontal direction. Between these radiation fins 49, it opens in the back and the up-down direction, respectively, and the distribution | circulation of air is possible.

  As shown in FIGS. 1 and 2, the LED 24 uses a SMD (Surface Mount Device) package with a connection terminal on which an LED chip is mounted. In this SMD package, for example, an LED chip that emits blue light is arranged in the package, and this LED chip is mixed with a yellow phosphor that emits yellow light by being excited by a part of the blue light from the LED chip. Sealed with a sealing resin such as silicone resin. Accordingly, the surface of the sealing resin becomes a light emitting surface, and white light is emitted from the light emitting surface. On the side surface of the SMD package, terminals to be soldered and connected to the substrate 25 are arranged.

  The substrate 25 is made of, for example, a metal such as aluminum or a ceramic having thermal conductivity, and a copper wiring pattern, for example, is formed on the insulating layer on the front surface. A connector 52 for connecting the LED 24 and the electric wire 15 is connected and arranged on the top.

  As shown in FIG. 4, the plurality of LEDs 24 mounted on the substrate 25 are arranged one at the center of the substrate 25 and plural at the periphery, and seven are arranged below the center of the substrate 25 ( The LEDs 24 are densely mounted in the lower half area) compared to the upper side (upper half area). In other words, the pitch in the circumferential direction of the plurality of LEDs 24 mounted on the periphery of the substrate 25 is narrower on the lower side than the center of the substrate 25 and wide on the upper side. There are four on the lower side from the center and three on the upper side, and the lower side has a larger relationship. Therefore, the value of the light beam emitted from the front surface of the cover 21 is larger on the lower side than on the upper side. ing.

  The board 25 is formed with a screw insertion hole 53 through which a screw 38 for fixing the board 25 and the lens holder 27 together with the front surface portion 35 of the radiator 22 is fixed, and an earth mounting boss 41 of the radiator 22 is formed. A boss insertion hole 54 to be inserted is formed, and a plurality of positioning holes 55 for positioning the lens holder 27 are formed.

A plurality of screw insertion grooves 56 through which screws 42 for fixing the cover 21 and the heat radiating body 22 are inserted are formed in the periphery of the substrate 25. An electric wire insertion groove 57 is formed in the upper part of the substrate 25 so as to face and communicate with the wiring groove 44 of the radiator 22, and a side portion of the electric wire insertion groove 57 is closed to face the wiring groove 44 of the radiator 22. A cover part (light-shielding part) 58 is formed. The wire insertion groove 57 is disposed at a position not facing the rear opening 46 of the wiring groove 44, and the cover 58 is disposed at a position facing the rear opening 46 of the wiring groove 44. Accordingly, the front opening 45 of the wiring groove 44 is configured as a substantial front opening 45 through which the electric wire 15 passes through a portion corresponding to the wire insertion groove 57 of the substrate 25, and the front opening 45 and the rear opening 46 of the wiring groove 44 Are configured not to face each other directly.

The lens 26 is formed of, for example, a transparent synthetic resin or glass, and is formed on the rear surface as an incident surface on which light emitted from the LED 24 enters the lens 26. The light passing through the lens 26 is forward on the front surface. It is formed as an exit surface that emits light. At the periphery of the lens 26, a flange 60 is formed that is sandwiched and held between the lens fitting hole 32 of the cover 21 and the lens holder 27.
The lens holder 27 has a base portion 63 attached to the front surface of the substrate 25 and a plurality of cylindrical holder portions 64 provided integrally with the base portion 63.

A screw insertion hole through which a screw 38 for fixing the lens holder 27 and the substrate 25 together with the heat radiating body 22 is fixed to the base portion 63 around the central holder portion 64 and between the holder portion 64 in the peripheral portion. A screw mounting boss 66 having 65, a connector connection opening 69 that opens to face the connector 52 of the board 25, and an opening to face the ground mounting boss 41 of the radiator 22 inserted through the boss insertion hole 54 of the board 25 An opening 70 for ground attachment is formed. Further, on the upper part of the lens holder 27, between the electric wire insertion groove 57 of the substrate 25 and the connector 52 and between the adjacent holder portions 64 of the lens holder 27, the front surface of the lens holder 27 is connected from the electric wire insertion groove 57 to the connector 52. An electric wire holding groove 71 is formed in which the electric wire 15 wired through the side is fitted and held.
On the rear surface of the base 63 facing the substrate 25, a plurality of positioning projections (not shown) for fitting and positioning in the positioning holes 55 of the substrate 25 are provided.

  The holder portions 64 of the lens holder 27, the lens fitting holes 32 of the cover 21, and the lenses 26 are arranged at positions where their centers (optical axes) correspond to the center positions of the LEDs 24 of the substrate 25 described above. Has been.

Next, the support 13 has a cylindrical shaft 74 and an arm 75 attached to the lower end of the cylindrical shaft 74 so as to be rotatable in the horizontal direction. The lamp body 12 is mounted on both ends of the arm 75 with the horizontal axis. Supports the angle adjustment in the vertical direction.
An electric wire 15 connected to the power supply unit 14 is inserted into the cylindrical shaft 74, and the electric wire 15 drawn from the lower end of the cylindrical shaft 74 is connected to the lamp body 12 side.

  Next, the power supply unit 14 incorporates a lighting circuit that supplies a constant current to the LED 24 through the electric wire 15, for example. The electric wire unit 14 is directly attached to the ceiling surface and is supplied with power to the lighting circuit by a power line, or is attached by a wiring rail attached to the ceiling in advance and is supplied to the lighting circuit.

Next, the electric wire 15 is, for example, an electric wire in which a pair of electric power supply wires 78 and an earth wire 79 are combined into one, and a connector 80 connected to the connector 52 of the substrate 25 at the tip of the pair of electric power supply wires 78. And a ground terminal 81 is attached to the tip of the ground wire 79. The ground terminal 81 is connected and fixed to a ground mounting boss 41 protruding to the front side of the substrate 25 with a screw 82. An electric wire holder 47 is attached to the electric wire 15 at a predetermined length position from the tip.
Next, assembly of the lamp body 12 of the lighting device 11 will be described.

  With the front surface portion 35 of the heat radiating body 22 facing upward, the substrate 25 on which the LEDs 24 and the like are mounted is positioned on the front surface portion 35 of the heat radiating body 22. At this time, the ground mounting boss 41 protruding from the front surface portion 35 of the radiator 22 is passed through the boss insertion hole 54 of the substrate 25, and the substrate 25 is fitted and positioned in the recess 35a of the front surface portion 35 of the radiator 22.

  The lens holder 27 is disposed on the substrate 25 disposed on the front surface portion 35 of the radiator 22. At this time, a plurality of positioning protrusions protruding from the lens holder 27 are inserted into the positioning holes 55 of the substrate 25, and the lens holder 27 is positioned with respect to the substrate 25 and the radiator 22.

  The screw 38 is inserted into the screw mounting boss 66 of the lens holder 27 and screwed into the screw mounting hole 39 of the radiator 22 through the screw insertion hole 65 of the screw mounting boss 66 and the screw insertion hole 53 of the substrate 25. And the substrate 25 is fastened and fixed to the radiator 22 together. As a result, the rear surface of the substrate 25 is brought into close contact with the front surface portion 35 of the radiator 22 in a surface contact state, and the thermal conductivity from the substrate 25 to the radiator 22 is improved.

  In this state, the electric wire insertion groove 57 and the cover portion 58 of the substrate 25 are disposed at positions facing the front surface of the wiring groove 44 of the radiator 22, and a substantial front surface that is a portion corresponding to the electric wire insertion groove 57 of the substrate 25. A wiring groove 44 is formed so that the opening 45 and the rear surface opening 46 do not directly face each other. Further, the connector connection opening 69 of the lens holder 27 faces the connector 52 of the substrate 25, and the ground attachment opening 70 faces the ground attachment boss 41 protruding from the front surface of the substrate 25.

The connector 80 of the electric wire 15 is connected to the connector 52 of the substrate 25 from the connector connection opening 69 of the lens holder 27, and the ground terminal 81 of the ground wire 79 is screwed from the ground mounting opening 70 of the lens holder 27 to the ground mounting boss 41. Secure the connection with. The tip end side of the electric wire 15 is inserted into the electric wire holding groove 71 from the front of the lens holder 27 to be positioned and held, and further, the electric wire 15 is inserted from the outside of the radiator 22 while being bent along the wiring groove 44, and arranged. The electric wire holder 47 is fixed to the rear surface of the radiator 22 with screws 48.
On the other hand, each lens 26 is disposed in each lens fitting hole 32 of the cover 21 with the rear surface of the cover 21 facing upward.

  The heat sink 22 with the substrate 25, the lens holder 27, and the electric wire 15 attached is covered from above on the cover 21 on which the lens 26 is disposed, and each lens 26 is fitted to each holder portion 64 of the lens holder 27. Combine with radiator 22 Each screw 42 is fastened and fixed to the cover 21 through the mounting portion 43 of the radiator 22.

  Thereby, each lens 26 is sandwiched and held between the cover 21 and the lens holder 27, and the electric wire 15 is pulled out from between the upper part of the cover 21 and the radiator 22 to complete the assembly of the lamp body 12. .

  Thus, when the lamp body 12 is assembled, the outer surface portion 36 of the radiator 22 is provided with the wiring groove 44 that communicates from the outer surface portion 36 to the front surface portion 35. Is only required to be arranged in the wiring groove 44 from the outside of the heat radiating body 22, so that the time-consuming work of passing the electric wire through the electric wire insertion hole as in the prior art becomes unnecessary, and the assembling workability can be improved.

  In the lighting device 11 using the lamp body 12, the power supply unit 14 is attached to the ceiling side, and the lamp body 12 is supported by the cylindrical shaft 74 and the arm 75 with respect to the power supply unit 14.

  By supplying power to the lighting circuit of the power supply unit 14, power is supplied from the lighting circuit to the LED 24 through the electric wire 15. As a result, each LED 24 emits light, and light from each LED 24 is projected from the front of the lamp body 12 through each lens 26.

  When the lamp body 12 is turned on, the wiring groove 44 is provided in the heat radiating body 22, so light leakage from the wiring groove 44 can be considered, but the front opening 45 and the rear opening 46 of the wiring groove 44 are connected to each other. Since they are provided at positions that do not oppose each other in the front-rear direction, light leakage from the wiring groove 44 can be reduced.

In particular, in order to prevent the front opening 45 and the rear opening 46 of the wiring groove 44 from facing each other in the front-rear direction, the wiring groove 44 of the heat radiator 22 is manufactured when only the heat radiator 22 is formed. Although the mold becomes complicated and the cost of the radiator 22 increases, the radiator 22 is provided with a wiring groove 44 in a substantially L shape, and the front surface of the wiring groove 44 is covered with a cover portion 58 of the substrate 25. Thus, the radiator 22 can be formed at low cost without complicating the mold for manufacturing the wiring groove 44 of the radiator 22.
Further, the heat generated when the LED 24 emits light is mainly efficiently conducted from the substrate 25 to the heat radiating body 22, and is radiated from the plurality of heat radiating fins 49 of the heat radiating body 22 into the air.
Further, the support 13 can be adjusted by changing the direction of the front surface of the lamp body 12, that is, the light irradiation direction in the horizontal direction and the vertical direction.
In this case, since the wiring groove 44 is provided in the upper part of the radiator 22, even if the vertical angle of the lamp body 12 is variably adjusted with respect to the support body 13, the electric wire 15 drawn from the wiring groove 44 is not Interference with the radiating fins 49 provided at the rear portion of the radiator 22 can be prevented.
Furthermore, since the radiation fins 49 of the radiator 22 are provided along the vertical direction, even if the vertical angle of the lamp body 12 is variably adjusted with respect to the support 13, the vertical direction between the radiation fins 49 can be increased. The convection which flows along arises and can maintain a high heat dissipation effect.
In addition, when used to illuminate a lighting object such as a wall surface with the front surface of the lamp body 12 of the lighting device 11 arranged at a high position on the ceiling side facing obliquely downward, the front surface of the lamp body 12 and the illumination The distance from the object is shorter on the upper side of the illumination object, and the lower side is longer than the upper side, so that the lower side of the illumination object tends to be dark. In the illumination device 11 of the present embodiment, the LEDs 24 are densely mounted on the lower side of the substrate 25 as compared with the upper side, and the luminous flux emitted from the lower side of the front surface of the lamp body 12 to the lower side of the illumination object Since the value becomes larger than the value of the luminous flux emitted from the upper side to the upper side of the lighting object, the lower side of the lighting object having a long distance to the lamp body 12 can be brightened, and the upper and lower positions of the lighting object The illuminance can be made uniform.

11 Lighting equipment
15 Electric wire
22 radiator
23 Body
24 LED as semiconductor light emitting device
25 substrate
26 Lens
27 Lens holder as substrate pressing member
35 Front
44 Wiring groove as wire insertion part
49 Radiating fin

Claims (2)

A plurality of semiconductor light emitting elements are mounted on at least the peripheral portion and the surface on which the semiconductor light emitting element is mounted , and a connection portion is formed on the inner side of the semiconductor light emitting device mounted on the peripheral portion. A substrate from which is derived;
A substrate pressing member including a plurality of lenses corresponding to each of the plurality of semiconductor light emitting elements;
A heat radiator is provided on the front and rear parts where the board is attached to the front part, and a wire insertion part is provided on the front part for inserting the electric wires of the board into the rear part through a gap formed between the lenses. A body for sandwiching and fixing the substrate between the substrate pressing member and the front surface portion;
An illumination device comprising: The lighting device according to claim 1, wherein a plurality of heat radiation fins are provided at a rear portion of the heat radiator, and an electric wire is led out from between the heat radiation fins adjacent to each other.

Images