JP2013051118A - Lighting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lighting device can attaining improvement of assemblability and suppressing temperature rise of light-emitting elements.SOLUTION: The lighting device includes a light source part 2 including a substrate 21 and light-emitting elements 22 mounted on the substrate 21, a translucent cover member 3 with insulating properties which holds the light source part 2, covers a front face side of the light source part 2, and has an opening part 31 with a rear face side opened, and a heat-radiating member 1 with thermal conductivity on which the cover member 3 is installed and to which the rear face side of the light source part 2 is thermally coupled through the opening part 31 of the cover member 3.

Description

  Embodiments described herein relate generally to a lighting device using a light emitting element such as a light emitting diode (hereinafter referred to as LED) as a light source.

  In recent years, along with higher output and higher efficiency of LEDs, lighting devices that can be used indoors or outdoors using LEDs as light sources have been developed. This illuminating device is obtained by mounting a plurality of LEDs on a substrate so as to obtain a predetermined brightness. For example, the illuminating device is used as a so-called direct-on type base illumination that is directly attached to a ceiling surface or the like.

  In such an illuminating device, a substrate on which an LED is mounted is attached to the apparatus main body by a fixing means such as a screw. Similarly, a translucent cover member that covers the front side of the substrate is attached to the apparatus main body. Accordingly, the substrate and the cover member are separately attached to the apparatus main body.

  On the other hand, as the temperature of a light emitting element such as an LED increases, the light output decreases and the useful life is shortened. For this reason, for a lighting device using a solid light emitting element such as an LED or an EL element as a light source, the temperature of the light emitting element is prevented from rising in order to extend the service life or improve characteristics such as light emission efficiency. It is necessary. For this reason, various heat dissipation structures that suppress the temperature rise of the light emitting element are employed.

JP 2010-73670 A JP 2011-23138 A

"LED Base Light" with a total efficiency of 100 lm / W or more launched | News Release 2010 | Panasonic Electric Works Co., Ltd. | panasonic [searched on August 18, 2011] Internet (http://panasonic-denko.co.jp/ corp / news / 1007 / 1007-5.htm)

  However, in the illumination device as described above, since the substrate on which the LED is mounted and the cover member are separately attached to the device main body, there is a problem that the assembly workability is not efficient.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide an illumination device that can improve the assembly workability and can suppress the temperature rise of the light emitting element.

An illumination device according to an embodiment of the present invention includes a light source unit including a substrate and a light emitting element mounted on the substrate, and holds the light source unit, covers the front side of the light source unit, and opens the back side. And a light-transmitting cover member having an insulating property.
In addition, at the same time as the cover member is attached, a heat radiating member having thermal conductivity is provided in which the back side of the light source unit is thermally coupled through the open part of the cover member.

  According to the embodiment of the present invention, it is possible to provide an illumination device that can improve the assembly workability and can suppress the temperature rise of the light emitting element.

It is a perspective view which shows the illuminating device which concerns on embodiment of this invention. FIG. 3 is a plan view showing the illumination device as viewed from the front side and showing one cover member in a transparent manner for explanation. It is a perspective view which decomposes | disassembles and shows the same illuminating device. FIG. 3 is a cross-sectional view taken along line YY in FIG. FIG. 5 is an enlarged sectional view showing a part A in FIG. 4. In the same illuminating device, it is a side view which removes and shows one side plate and packing. The positional relationship of the light source part and the holding groove | channel of a cover member in the same illuminating device is shown, (a) is a top view, (b) is a top view which abbreviate | omits the resist layer in a light source part, and mainly shows a wiring pattern layer. is there. It is a perspective view which shows the packing in the same illuminating device in relation to a cover member and a side plate.

  Hereinafter, an embodiment of a lighting device according to the present invention will be described with reference to FIGS. 1 to 8. In addition, illustration of wiring member relations, such as a lead wire, is abbreviate | omitted, the same code | symbol is attached | subjected to the same part in each figure, and the overlapping description is abbreviate | omitted.

  FIGS. 1 to 4 show a ceiling-mounted base light installed on a ceiling surface as a lighting device, and this lighting device is formed in a horizontally long, substantially rectangular shape.

  The lighting device includes a device main body 1, a light source unit 2 disposed in the device main body 1, a milky white translucent cover member 3 that covers the light source unit 2, and a lighting device that controls lighting of the light source unit 2. 4, a center cover 5 disposed in the central portion of the apparatus main body 1, and a side plate 6. Such an illuminating device has a front side as a light irradiation surface and a back side as a mounting surface to the ceiling surface.

  As representatively shown in FIGS. 3 and 4, the apparatus main body 1 is a horizontally long and substantially rectangular chassis, and is formed by bending a metal plate having thermal conductivity such as a hot dip galvanized steel sheet. . The apparatus main body 1 has a function as a heat radiating member, and a flat top plate surface 11 is formed in the center portion along the longitudinal direction. A hook-like bent disposition portion 12 that protrudes toward the top is formed. The arrangement part 12 has a narrow flat surface along the longitudinal direction, and the light source part 2 is arranged therein.

  Further, a pair of mounting holes 11 a are formed on both end sides of the top plate surface 11 of the apparatus main body 1. A pair of mounting bolts provided in the ceiling structure passes through the mounting hole 11a from the back side, and the apparatus main body 1 is installed on the ceiling surface.

  The apparatus main body 1 corresponds to a chassis in the present embodiment. However, the apparatus main body 1 is referred to as a case, a reflector, or a base as long as it has thermal conductivity and functions as a heat dissipation member. It may be, and is not restrained by the name of the member. In general, it means a member or a part where the light source unit 2 is directly or indirectly arranged, and is not interpreted in a particularly limited manner.

  As representatively shown in FIGS. 2 to 4 and 7, the light source unit 2 includes a substrate 21, a plurality of light emitting elements 22 mounted on the substrate 21, and a phosphor layer 23 covering each light emitting element 22. It has. In FIG. 2, for the sake of explanation, one (upper and upper) cover member 3 is shown transparent, and in FIG. 7B, the wiring pattern layer 21a of the substrate 21 is mainly shown.

  The board | substrate 21 is formed in the elongate rectangular shape with materials, such as glass epoxy resin (FR-4) which is an insulating material. A wiring pattern layer 21a made of copper foil is applied on the front side (see FIG. 7B). A resist layer 21b is appropriately applied on the wiring pattern layer 21a. A plurality of substrates 21, specifically, three substrates 21 are arranged in a straight line in the longitudinal direction on the front side of the apparatus main body 1 via a cover member 3 described later. Therefore, the back surface side of the substrate 21 is in thermal contact with the flat surface of the arrangement portion 12 in the apparatus main body 1 in thermal contact.

  The material of the substrate 21 is a ceramic material, a synthetic resin material, or an insulating layer on one surface of a base plate that has good thermal conductivity such as aluminum and has excellent heat dissipation in order to enhance the heat dissipation of each light emitting element 22. Can be applied, and the material is not particularly limited.

  Specifically, as shown in FIG. 7B, the wiring pattern layer 21 a is formed, for example, in a substantially square shape, and a block-like pattern corresponding to each light emitting element 22 continues along the longitudinal direction of the substrate 21. Are arranged side by side. As a whole, it is formed in an elongated rectangular shape, and this is provided over two rows.

  The wiring pattern layer 21 a is a conductive layer that electrically connects each light emitting element 22, and also has a function as a heat dissipation layer that diffuses and dissipates heat generated from each light emitting element 22.

  Further, on the surface layer of the substrate 21, the white resist layer 21b having a high reflectance is laminated on almost the entire surface except for the mounting area of the light emitting element 22 and the mounting part of the components. As a result, among the light emitted from the light emitting element 22, the light directed in the lateral direction is reflected by the surface of the white resist layer 21b having a high reflectance and is emitted to the front side.

  The plurality of light emitting elements 22 are LED bare chips. For example, an LED bare chip that emits blue light in order to cause white light to be emitted from the light emitting unit is used. The bare chip of the LED is bonded onto the wiring pattern layer 21a using a silicone resin-based insulating adhesive, and is electrically connected to the wiring pattern layer 21a by a bonding wire.

  The phosphor layer 23 is made of a translucent synthetic resin, for example, a transparent silicone resin, and contains an appropriate amount of a phosphor such as YAG: Ce. The phosphor layer 23 has a substantially cylindrical shape with a small height so as to cover each light emitting element 22 for each light emitting element 22. The phosphor is excited by light emitted from the light emitting element 22 and emits light having a color different from the color of light emitted from the light emitting element 22. In the present embodiment in which the light emitting element 22 emits blue light, a yellow phosphor that emits yellow light having a complementary color relationship with blue light is used for the phosphor so that white light can be emitted. Has been.

  The shape of the phosphor layer 23 is not particularly limited as long as the individual light emitting elements 22 can be covered, and a mountain shape or a line shape continuously covering the plurality of light emitting elements 22 may be applied. it can. Further, as the light emitting element, a surface mount type LED package may be used, and the mounting method and the type are not particularly limited.

  Furthermore, in the present embodiment, the wiring pattern layer 21a functions as a heat dissipation layer, but the wiring pattern layer 21a and the heat dissipation layer may be formed separately. In this case, the light-emitting element 22 is disposed on the heat-dissipating layer, but the heat-dissipating layer is not electrically connected, and serves mainly as a mounting pad for the light-emitting element 22 to promote the heat-dissipating action.

  As representatively shown in FIGS. 3 to 5, the cover member 3 is milky white and translucent from an insulating material such as an acrylic resin or a polycarbonate resin, and is made by extrusion molding. The cover member 3 is formed in a long case shape, has a cross-sectional shape that is bilaterally symmetric, and is disposed in the disposition portions 12 formed on both sides of the apparatus main body 1. Further, the light source unit 2 is held by the cover member 3.

  More specifically, the cover member 3 is configured as an open portion 31 such that the front side covers the light source unit 2 along the longitudinal direction and the back side is opened in a rectangular shape along the longitudinal direction. Further, both end portions in the longitudinal direction are formed as openings 32.

Further, a pair of holding grooves 33 that are opened opposite to each other are formed over the entire length of the edge portion along the longitudinal direction of the opening portion 31. The holding groove 33 is formed by a front side support part 33a and a back side support part 33b along the longitudinal direction.
In addition, a pair of locking portions 34 that are substantially U-shaped in cross section and open to the inside are formed in the outer direction of the holding groove 33 over the entire length in the longitudinal direction.

  In such a cover member 3, the light source unit 2 is disposed while being held in the holding groove 33. Specifically, as shown in FIG. 3, the substrate 21 is inserted into the holding groove 44 by being slid from one side of the opening 32 in the cover member 3. Thereby, the light source unit 2 is held by the cover member 3. In this way, the light source unit 2 is held by the cover member 3, and the cover member 3 and the light source unit 2 are integrated.

  Further, as shown in FIG. 8, packings 35 for closing the openings 32 are attached to the openings 32 at both ends of the cover member 3. The packing 35 is made of silicone rubber and has translucency. For this reason, it becomes possible to irradiate the light incident from the light source unit 2 to the outside through the packing 35. Further, the packing 35 is combined with a side plate 6 which will be described later and its position is regulated.

  Next, the attachment state of the cover member 3 holding the light source unit 2 to the apparatus main body 1 will be described mainly with reference to FIGS. 3 and 5. When attaching the cover member 3 to the apparatus main body 1, first, of the pair of engaging portions 34 having a substantially U-shaped cross section, the longitudinal direction of the apparatus main body 1 is placed on the U-shaped inner surface side of the outer engaging portion 34. An end edge portion 13 along the direction is inserted and disposed. Next, the outer surface side of the inner locking portion 34 is locked by the stopper member 36.

  The stopper member 36 is a stopper fitting bent in a key shape, and includes a locking piece portion 36a and a fixed piece portion 36b formed integrally with the locking piece portion 36a. Further, a screw through hole is formed in the fixed piece portion 36b. The locking piece 36a of the stopper member 36 is locked to the outer surface side of the locking portion 34 in the cover member 3, and the fixing piece 36b passes through the screw through hole and is screwed into the apparatus main body 1 by the mounting screw 36c. Fixed.

  A plurality of, specifically three, stopper members 36 are provided along the longitudinal direction of the cover member 3 (see FIG. 3). The stopper members 36 and the inner surfaces of the outer locking portions 34 are provided. The movement of the cover member 3 in the fore-and-aft direction (the vertical direction in the drawing) is regulated by the edge portion 13 of the apparatus main body 1 inserted on the side.

  Further, in the attached state of the cover member 3, the back surface side of the light source unit 2, that is, the back surface side of the substrate 21 is in surface contact with the flat arrangement portion 12 of the apparatus main body 1 through the open portion 31 of the cover member 3. Thermally coupled. In other words, since the cover member 3 has the opening portion 31, the arrangement portion 12 protruding toward the front side is arranged so as to face the opening portion 31, and thus the arrangement portion 12 and the substrate 21. Can be thermally coupled. Further, this thermal coupling is performed simultaneously with the attachment of the cover member 3 to the apparatus main body 1.

  In addition, the disposition portion 12 that protrudes to the front surface side of the apparatus main body 1 fits and supports the extension wall 33 c that extends to the back surface side of the back surface side support portion 33 b in which the side wall forms the holding groove 33. It has become. For this reason, the movement of the cover member 3 in the left-right direction is restricted by the arrangement portion 12 of the apparatus main body 1.

As shown in FIGS. 3 and 6, the lighting device 4 is attached to the front side of the top plate portion 11 in the device main body 1. The lighting device 4 controls the lighting of the light source unit 2 and is configured by housing a circuit board and circuit components mounted on the board in a box-like case, and is connected to a commercial AC power supply AC. In response to this AC power supply AC, a DC output is generated. The lighting device 4 is configured, for example, by connecting a smoothing capacitor between output terminals of a full-wave rectifier circuit, and connecting a DC voltage conversion circuit and current detection means to the smoothing capacitor. Therefore, the lighting device 4 is connected to the light emitting element 22 via the substrate 21, supplies the direct current output to the light emitting element 22, and controls the lighting of the light emitting element 22.
A terminal block 7 is attached to the front side of the top plate 11. The terminal block 7 is connected to wiring members such as a power supply line, a feed line, and a dimming signal line.

  As shown in FIGS. 1 to 6, the center cover 5 is disposed in the central portion on the front side of the apparatus main body 1. The center cover 5 is formed from a metal plate such as a hot-dip galvanized steel sheet, and the side surface has a V shape. Further, at least the surface side is painted white.

  A plurality of attachment tongues 52 are formed on an edge 51 (see FIG. 3) along the longitudinal direction in which the center cover 5 expands. On the other hand, on the side of the apparatus main body 1 facing the mounting tongue piece 52, there is formed an insertion hole 14 formed by being slightly bulged and deformed to the front side by cutting.

  The center cover 5 is capable of reducing the width dimension to be expanded by elastically deforming the expanding edge in the width direction around the V-shaped top. Therefore, when attaching the center cover 5 to the apparatus main body 1, the center cover 5 is elastically deformed so as to reduce the width dimension for expanding the center cover 5, and the attachment tongue piece 52 is aligned with the position of the insertion hole 14 to solve the elastic deformation. To return to the original state. Thereby, the attachment tongue piece 52 is inserted into the insertion hole 14, and the center cover 5 is attached to the apparatus main body 1.

When the center cover 5 is attached, the edge 51 of the center cover 5 comes into contact with the fixed piece 36b of the stopper member 36. Therefore, for example, even if the mounting screw 36c of the stopper member 36 is loosened due to vibration with time or the like, the stopper member 36 can be prevented from being detached or excessively moved. Thereby, it can be expected that the thermal coupling between the apparatus main body 1 and the substrate 21 is ensured.
In addition, the lighting device 4, the terminal block 7, the wiring member and the like are covered with the center cover 5 and cannot be visually recognized from the outside, and the appearance can be improved.
The side plate 6 is made of a synthetic resin material, and is attached so as to close both ends of the apparatus main body 1 in the longitudinal direction.

  In the lighting apparatus configured as described above, the light source unit 2 is held by the cover member 3, and the cover member 3 is attached to the apparatus main body 1 that is a heat radiating member. The back side of the substrate 21 is in surface contact with the arrangement portion 12 of the apparatus main body 1 and is thermally coupled. Therefore, the assembly workability is good, the heat dissipation of the substrate 21 can be improved, and the temperature rise of the light emitting element 22 can be suppressed. Further, the end edge portion 13 along the longitudinal direction of the apparatus main body 1 is inserted into the U-shaped inner surface side of the locking portion 34 and is covered with the locking portion 34. Without processing, the danger resulting from the sharpness of the edge portion 13 can be avoided, and the safety of assembly workability can be ensured.

  Further, as shown in FIG. 6, the cover member 3 and the lighting device 4 holding the light source unit 2 are laterally arranged so as not to overlap the front side of the apparatus main body 1 in the frontal direction (the vertical direction in the drawing). Further, the lighting device can be made thin because it is arranged so as not to form a useless internal space.

  When power is supplied to the lighting device 4 in the installed state of the lighting device, a direct current output is supplied to the light source unit 2, the light emitting element 22 is energized through the substrate 21, and each light emitting element 22 is lit. The light emitted from the light emitting element 22 is transmitted through the phosphor layer 23, diffused through the milky white translucent cover member 3, and is emitted mainly downward to illuminate a predetermined light distribution range.

  Further, as shown in FIG. 5, the locking portion 34 of the cover member 3 is extended outward from the end edge portion 13 of the apparatus main body 1. Part of the light emitted from 22 in the lateral direction is emitted to the outside. Further, part of the light emitted from the light emitting element 22 in the lateral direction at both ends in the longitudinal direction is emitted from the light-transmitting packing 35 to the outside. Since the light emitted to the outside irradiates the ceiling surface C, the brightness of the illumination can be increased.

  When each light emitting element 22 is turned on, heat is generated. The heat generated from each light emitting element 22 is transmitted to the wiring pattern layer 21a, and is mainly conducted from the back side of the substrate 21 to the arrangement portion 12 of the apparatus main body 1 and further conducted to the entire apparatus main body 1 to be radiated. Thereby, the temperature rise of the light emitting element 22 can be suppressed.

  In this case, as shown in FIGS. 7A and 7B, the means for holding the light source part 2 in the cover member 3, that is, the front side support part 33a forming the holding groove 33 in the cover member 3, is a heat dissipation layer. The wiring pattern layer 21a is located outside the region where the wiring pattern layer 21a is formed. Therefore, the influence of the heat conducted to the wiring pattern layer 21a on the front side support portion 33a is alleviated, and the thermal deformation of the cover member 3 can be suppressed.

  As described above, according to the present embodiment, the cover member 3 holding the light source unit 2 is attached and at the same time the light source unit 2 is thermally coupled to the apparatus main body 1 (heat radiating member). It is possible to provide an illuminating device that can be improved and can effectively suppress the temperature rise of the light emitting element 22.

  In addition, this invention is not limited to the structure of the said embodiment, A various deformation | transformation is possible in the range which does not deviate from the summary of invention. Moreover, the said embodiment is shown as an example and is not intending limiting the range of invention. For example, the light emitting element can be a solid light emitting element such as an LED or an organic EL.

DESCRIPTION OF SYMBOLS 1 ... Main body (heat radiating member), 2 ... Light source part,
3 ... cover member, 4 ... lighting device,
5 ... Center cover, 6 ... Side plate,
21... Substrate, 21a .. wiring pattern layer (heat radiation layer),
21b ... resist layer, 22 ... light emitting element (LED),
23 ... phosphor layer, 31 ... open part,
33a ... Front side support section (means for holding light source section)

Claims (3)

A light source unit having a substrate and a light emitting element mounted on the substrate;
A light-transmitting cover member having an insulating property that holds the light source part and covers the front side of the light source part and has an open part that opens the back side;
A heat dissipating member having thermal conductivity in which the back side of the light source unit is thermally coupled through the open part of the cover member at the same time that the cover member is attached;
An illumination device comprising:   The heat dissipation layer is formed in the said board | substrate, The means to hold | maintain the light source part in the said cover member is located corresponding to the outside of the area | region in which the heat dissipation layer was formed. The lighting device described.   The lighting device according to claim 1, wherein the heat radiating member has a function of restricting movement of the cover member in the left-right direction.

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