KR100998560B1 - Light Emittion Diode module having radiant heat and reflection function - Google Patents

Light Emittion Diode module having radiant heat and reflection function Download PDF

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KR100998560B1
KR100998560B1 KR1020090010172A KR20090010172A KR100998560B1 KR 100998560 B1 KR100998560 B1 KR 100998560B1 KR 1020090010172 A KR1020090010172 A KR 1020090010172A KR 20090010172 A KR20090010172 A KR 20090010172A KR 100998560 B1 KR100998560 B1 KR 100998560B1
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heat dissipation
housing
led
dissipation member
lighting module
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KR1020090010172A
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Korean (ko)
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KR20100090938A (en
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마재광
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주식회사 에이엘
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00—Protecting lighting devices from damage
    • F21V15/01—Housings, e.g. material or assembling of housing parts
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/005—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by permanent fixing means, e.g. gluing, riveting or embedding in a potting compound
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0055—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by screwing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F21V31/005—Sealing arrangements therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/22—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Abstract

본 발명은 방열 및 반사기능이 구비된 엘이디 조명모듈에 관한 것으로서, 상부와 길이방향 양측이 개방된 직사각형체로, 내부 길이방향에는 외부로부터 케이블(C)이 관통되어 지지되는 케이블 지지관턱(11)이 하나 이상 형성되고, 개방된 측면 가장자리에 상호 대향되는 걸림턱(12)의 형성과 하부방향으로 삽입지지홈(13)이 형성된 하우징(10)과; 길이방향 양단은 상기 하우징(10)의 걸림턱(12)에 안내되어 지지되고, 밑단은 삽입지지홈(13)에 삽입되는 직각돌출부(21)가 양측에 대향되게 형성되는 한편, 상기 직각돌출부(21)로부터 하부로 직각되게 함몰 형성되어 케이블 지지관턱(11)에 안착되는 기판받침부(22)가 형성되고, 상기 기판받침부(22)에는 케이블 지지관턱(11)으로부터 고정되기 위한 결합공(22a)이 형성된 알루미늄 소재의 방열부재(20)와; 상기 방열부재(20)의 기판받침부(22)의 상면에 안착되는 양면접착테이프(30)와; 상기 양면접착테이프(30)에 의해 인쇄회로기판(41) 저면이 부착되고, 인쇄회로기판(41)상에 엘이디소자(42) 및 전기적인 회로구성요소들이 마련되며, 상기 결합공(22a)들과 일치되어 체결부재(S)로서 나사체결되는 엘이디 조명모듈(40)과; 상기 엘이디 조명모듈(40)이 안내 설치되는 하우징(10)의 상부에 도포되어 방수처리되는 에폭시경화수지(50);를 포함하여 구성된 것을 특징으로 하는바,The present invention relates to an LED lighting module having a heat dissipation and reflection function, the upper and the both sides in the longitudinal direction of the rectangular body, the cable support jaw (11) through which the cable (C) from the outside in the longitudinal direction is supported A housing (10) formed with at least one and formed with a locking projection (12) opposed to each other at an open side edge and an insertion support groove (13) formed in a lower direction; Both ends of the longitudinal direction are guided and supported by the locking jaw 12 of the housing 10, and the bottom end is formed with the right angle protrusions 21 inserted into the insertion support groove 13 opposite to both sides, while the right angle protrusions ( A substrate support 22 is formed to be recessed downwardly from the side 21 to be seated on the cable support 11, and a coupling hole for fixing from the cable support 11 is formed in the substrate support 22. 22a) formed of a heat dissipation member 20 of aluminum material; A double-sided adhesive tape 30 seated on an upper surface of the substrate support part 22 of the heat dissipation member 20; The bottom surface of the printed circuit board 41 is attached by the double-sided adhesive tape 30, an LED element 42 and electrical circuit components are provided on the printed circuit board 41, and the coupling holes 22a are provided. LED lighting module 40 to be screwed to match with the fastening member (S) and; The LED lighting module 40 is applied to the upper portion of the housing 10, the guide is installed, the epoxy cured resin 50 is waterproof;

하우징 내에 방열부재를 안착하되, 엘이디 조명모듈을 구성하는 인쇄회로기판의 후면이 받쳐지는 형태로 설치하여 엘이디소자의 점등에 의해 발생하는 열을 하우징의 외부에 노출된 방열부재의 직각돌출부에 열 전이 되도록 하여 공기와의 외부접촉에 의한 효율적인 방열효과로 갖으며, 에폭시경화수지로서 방수효과와 함께 방열부재의 외표면을 유광 혹은 미러와 같은 반사막 처리하여 외부 빛의 흡수를 방지하는 한편, 반사효과를 가지게 하여 빛의 밝기효율을 최대로 높일 수 있는 효과가 있다.The heat dissipation member is mounted in the housing, and the rear surface of the printed circuit board constituting the LED lighting module is installed so that the heat generated by the lighting of the LED element is transferred to the right angle protrusion of the heat dissipating member exposed to the outside of the housing. Efficient heat dissipation effect by external contact with air.Epoxy-cured resin, with waterproof effect, external surface of heat dissipation member is treated with reflective film such as gloss or mirror to prevent absorption of external light and It has the effect of increasing the brightness efficiency of light to the maximum.

엘이디, 방열, 반사, 하우징 LED, Heat Resistant, Reflective, Housing

Description

방열 및 반사기능이 구비된 엘이디 조명모듈{Light Emittion Diode module having radiant heat and reflection function}Light emitting diode module having radiant heat and reflection function

본 발명은 방열 및 반사기능이 구비된 엘이디 조명모듈에 관한 것으로서, 좀더 상세하게는 엘이디 소자의 구동에 따라 발생하는 열을 효율적으로 방열과 반사기능을 갖추어 엘이디 조명모듈의 성능을 높임은 물론, 수명을 연장시킬 수 있도록 한 것이다. The present invention relates to an LED lighting module having a heat dissipation and reflection function, and more particularly, to effectively heat dissipation and reflection of heat generated by driving an LED element, thereby improving the performance of the LED lighting module as well as the lifespan. It is to be extended.

일반적으로 사용되고 있는 조명램프의 종류는 백열전구, 형광등, 할로겐 램프, 삼파장램프, 고휘도 엘이드(LED) 등을 이용한 제품 등으로 실, 내외 측에 조명기구로 설치하여 사용되고 있다.Commonly used lighting lamps are incandescent lamps, fluorescent lamps, halogen lamps, three-wavelength lamps, and high-brightness LEDs. These lamps are used as lighting fixtures inside and outside.

실내 조명등으로는 거실등, 방등, 주방등, 화장실등이 있으며, 이들은 백열전구, 형광등을 사용하고 있다. 이외에 조명간판에 사용되는 광원으로도 형광등을 보편적으로 많이 사용하고 있다.Indoor lighting includes living room light, room light, kitchen light and toilet light, which use incandescent lamps and fluorescent lamps. In addition, as a light source used for lighting signs, fluorescent lamps are commonly used.

지금까지도 사용되고 있는 필라멘트 발열타입의 백열전구에서부터 형광체를 이용한 형광등 및 삼파장램프, 엘이디 조명등이 다양한 형태로 설치되어 조명산업에 발전을 거듭하고 있다.The filament heating type incandescent lamp, which is still used, has been developed in the lighting industry by installing various types of fluorescent lamps, three-wavelength lamps, and LED lights.

한편, 상기한 삼파장 램프에 비해 현재에는 기존 광원에 비해 에너지 절감 효과가 뛰어나고, 거의 반영구적으로 사용할 수 있는 차세대 광원인 발광다이오드(LED(엘이디):Light Emittion Diode)가 서서히 그 빛을 발하고 있다. On the other hand, compared to the three-wavelength lamp, the light emitting diode (LED: LED), which is a next generation light source which is more energy-saving than the existing light source and can be used almost semi-permanently, is gradually emitting its light.

엘이디소자를 이용한 조명의 한계였던 휘도(밝기) 문제가 최근 크게 개선되면서 응용시장이 산업 전반으로 확산, 본격적인 엘이디 시대를 예고하고 있다. As the brightness (brightness) problem, which was the limitation of lighting using LED devices, has been greatly improved recently, the application market is spreading to the entire industry, thereby foretelling a full-fledged LED era.

저전력 소모량 등의 뛰어난 특성으로 엘이디는 p형와 n형이 접합된 반도체 양쪽에 전극 단자를 만들고 단자간에 전압을 가하면 전류가 흘러 p-n접합 부근에서 빛을 방출하는 소자로서, 고휘도의 광도를 얻을 수 있는 단계까지 발전되어 왔다.The LED is a device that emits light in the vicinity of the pn junction when current is flowed by making an electrode terminal on both sides of a p-type and n-type semiconductor and applying a voltage between the terminals due to excellent characteristics such as low power consumption. Has been developed.

이런 엘이디 광원소자는 크게 SMD(Surface Mount Device)타입으로 램프형으로 제작 사용되고 있으며, 비교적 두께가 얇게 제작됨으로써, 조명간판을 구성하는 광원으로도 보급 사용되고 있다. The LED light source device is largely used in the form of a SMD (Surface Mount Device) type as a lamp type, and is relatively thin in thickness, and thus is widely used as a light source constituting a lighting signboard.

그러나, 고휘도 엘이디 소자를 이용한 램프용도는 그 설치되는 수에 따라 엘이디 소자가 설치된 인쇄회로기판 후면에서 고도의 열이 발생하며, 이러한 열의 방열을 위해 별도의 방열부재를 추가 구성하여 엘이디 조명모듈이 설치되는 하우징으로부터 방열이 효과적으로 이루어져야 한다.However, lamps using high brightness LED elements generate high heat from the back of the printed circuit board on which the LED elements are installed, and an LED lighting module is installed by additionally configuring a separate heat dissipation member for heat dissipation. The heat dissipation from the housing should be effective.

보통 엘이디 모듈을 수용 설치하기 위한 하우징은 개방된 상부를 통해 엘이디 모듈을 수용 설치하며, 하우징의 후면을 관통시켜 공기와의 접촉으로 방열효과를 가질 수 있도록 하고 있으나, 실외에 설치되는 경우에는 습기나, 빗물의 유입방 지를 위해 방수기능을 가져야 한다. 따라서 상기와 같은 하우징 타입은 실외용으로 적절하지 못한 단점이 있었다.Usually, the housing for accommodating and installing the LED module accommodates and installs the LED module through the open upper part, and penetrates the rear of the housing to have a heat dissipation effect by contact with air. For example, it should be waterproof to prevent the inflow of rainwater. Therefore, such a housing type has a disadvantage that is not suitable for outdoor use.

상기와 같은 점을 감안하여 알루미늄이나 동판 소재로 제작된 방열부재를 하우징의 내부에서 인쇄회로기판과 접촉하여 외부로 향하도록 설계하고, 방열부재가 외부로 향하는 부분은 에폭시수지로서 방수처리하여 사용하도록 한 예도 있다.In consideration of the above, the heat dissipation member made of aluminum or copper plate material is designed to be in contact with the printed circuit board from the inside of the housing to the outside, and the heat dissipation member facing outward is waterproofed with epoxy resin for use. There is an example.

그러나, 상기와 같은 타입은 방열부재가 하우징의 후면에 위치하여 방열효과를 갖도록 하였으나, 엘이디 조명모듈이 설치되는 대상물로부터 하우징의 밀착 설치될 경우, 공기와 접촉되는 부분이 매우 적기 때문에 방열효과가 떨어지는 단점이 있었다.However, in the type as described above, the heat dissipation member is located at the rear of the housing to have a heat dissipation effect. However, when the LED light module is installed in close contact with the housing, the heat dissipation effect is inferior because there is very little contact with the air. There was a downside.

본 발명은 상기와 같이 제반되는 종래의 문제점을 해결하기 위하여 안출된 것으로서, 엘이디 소자의 구동에 따라 발생하는 열을 효율적으로 방열기능과 함께 빛을 효율적으로 반사시켜 빛의 밝기를 조금이라도 더 높일 수 있는 반사기능을 갖추어 엘이디 조명모듈의 성능을 높임은 물론, 오랜 사용이 가능하도록 하는데 그 목적이 있다.The present invention has been made to solve the conventional problems as described above, by efficiently reflecting the heat generated by the drive of the LED element with the heat dissipation function can effectively increase the brightness of the light even a little more Its purpose is to increase the performance of the LED lighting module and to make it possible to use it for a long time.

상기 목적을 달성하기 위한 본 발명에 의하면, 상부와 길이방향 양측이 개방된 직사각형체로, 내부 길이방향에는 외부로부터 케이블이 관통 되어 지지되는 케이블 지지관턱이 하나 이상 형성되고, 개방된 측면 가장자리에 상호 대향되는 걸림턱의 형성과 하부방향으로 삽입지지홈이 형성된 하우징과; 길이방향 양단은 상기 하우징의 걸림턱에 안내되어 지지되고, 밑단은 삽입지지홈에 삽입되는 직각돌출부가 양측에 대향되게 형성되는 한편, 상기 직각돌출부로부터 하부로 직각되게 함몰 형성되어 케이블 지지관턱에 안착되는 기판받침부가 형성되고, 상기 기판받침부에는 케이블 지지관턱으로부터 고정되기 위한 결합공이 형성된 알루미늄 소재의 방열부재와; 상기 방열부재의 기판받침부측 상면에 안착되는 양면접착테이프와; 상기 양면접착테이프에 의해 인쇄회로기판 저면이 부착되고, 인쇄회로기판상에 엘이디소자 및 전기적인 회로구성요소들이 마련되며, 상기 결합공들과 일치되어 체결부재로 서 나사체결되는 엘이디 조명모듈과; 상기 엘이디 조명모듈이 안내 설치되는 하우징의 상부에 도포되어 방수처리되는 에폭시경화수지;를 포함하여 구성된 것을 특징으로 한다.According to the present invention for achieving the above object, the upper side and the longitudinal side both sides are open rectangular, at least one cable support pipe through which the cable is penetrated from the outside is formed in the inner longitudinal direction, mutually opposed to the open side edge A housing having a locking jaw formed therein and an insertion support groove formed downward; Both ends of the longitudinal direction are guided and supported by the locking jaw of the housing, and the bottom end is formed to face the right angle protrusions inserted into the insertion support grooves on both sides, and is formed to be recessed perpendicularly downward from the right angle protrusions to be seated on the cable support jaw. A heat dissipation member formed of an aluminum material, wherein a substrate support part is formed, and the substrate support part has a coupling hole for fixing from a cable support jaw; A double-sided adhesive tape seated on the upper surface of the substrate support side of the heat dissipation member; An LED lighting module to which a bottom surface of the printed circuit board is attached by the double-sided adhesive tape, and an LED element and electrical circuit components are provided on the printed circuit board, and screwed together as a fastening member in accordance with the coupling holes; And an epoxy cured resin coated on the upper part of the housing in which the LED lighting module is guided and waterproofed.

본 발명에 따른 엘이디 조명모듈은 하우징 내에 방열부재를 안착하되, 엘이디 조명모듈을 구성하는 인쇄회로기판의 후면이 받쳐지는 형태로 설치하여 엘이디소자의 점등에 의해 발생하는 열을 하우징의 외부에 노출된 방열부재의 직각돌출부에 열 전이 되도록 하여 공기와의 외부접촉에 의한 효율적인 방열효과로 갖으며, 에폭시경화수지로서 방수효과와 함께 방열부재의 외표면을 유광 혹은 미러와 같은 반사막 처리하여 외부 빛의 흡수를 방지하는 한편, 반사효과를 가지게 하여 빛의 밝기효율을 최대로 높일 수 있는 효과가 있다.LED lighting module according to the present invention is installed in a shape that the heat radiating member is mounted in the housing, the back of the printed circuit board constituting the LED lighting module is exposed to the outside of the housing heat generated by the lighting of the LED element Heat transfer is applied to the right angle projecting part of the heat dissipation member, so it has an efficient heat dissipation effect by external contact with air, and it is an epoxy hardening resin, which is waterproof and absorbs external light by treating the outer surface of the heat dissipation member with a glossy or mirror-like reflective film. On the other hand, to have a reflection effect has the effect of maximizing the brightness efficiency of light.

이하, 본 발명에 따라 첨부된 도면을 참조하여 더욱 상세히 설명하면 다음과 같다.Hereinafter, described in more detail with reference to the accompanying drawings in accordance with the present invention.

첨부된 도 1은 본 발명인 엘이디 모듈을 분리하여 도시한 사시도이고, 도 2 및 도 3은 본 발명에 따른 엘이디 모듈을 절개하여 도시한 종단면도이며, 도 4는 엘이디 조명모듈을 다수개 연결된 상태를 도시한 평면도이다.1 is a perspective view showing the separated LED module of the present invention, Figures 2 and 3 is a longitudinal cross-sectional view showing the LED module according to the present invention, Figure 4 is a state in which a plurality of LED lighting module is connected It is a top view shown.

본 발명은, 하우징(10)과, 방열부재(20)와, 양면접착테이프(30)와, 엘이디 조명모듈(40)과, 에폭시경화수지(50)으로 나뉘어 구성된다.The present invention is composed of a housing 10, a heat dissipation member 20, a double-sided adhesive tape 30, LED lighting module 40, and an epoxy cured resin (50).

상기 하우징(10)은 합성수지 소재로 상부와 길이방향 양측이 개방된 직사각형체를 갖으며, 내부 길이방향에는 외부로부터 케이블(C)이 관통 되어 지지되는 케이블 지지관턱(11)이 하나 이상 형성되고, 개방된 측면 가장자리에 상호 대향되는 걸림턱(12)의 형성과 하부방향으로 삽입지지홈(13)이 형성된다. The housing 10 is made of a synthetic resin material having a rectangular body with both the upper side and the longitudinal direction open, at least one cable support jaw (11) is formed in the inner longitudinal direction is supported through the cable (C) from the outside, An opening supporting groove 13 is formed in the lower direction and the formation of the locking step 12 opposite to the open side edge.

상기 방열부재(20)는 박판의 알루미늄 또는 열전도가 높은 동판으로 제작되며, 길이방향 양단은 상기 하우징(10)의 걸림턱(12)에 안내되어 지지되고, 밑단은 삽입지지홈(13)에 삽입되는 직각돌출부(21)가 양측에 대향되게 형성되는 한편, 상기 직각돌출부(21)로부터 하부로 직각되게 함몰 형성되어 케이블 지지관턱(11)에 안착되는 기판받침부(22)가 형성되고, 상기 기판받침부(22)에는 케이블 지지관턱(11)으로부터 고정되기 위한 결합공(22a)이 형성된다.The heat dissipation member 20 is made of thin aluminum or copper plate with high thermal conductivity, and both ends in the longitudinal direction are guided and supported by the locking jaw 12 of the housing 10, and the bottom end is inserted into the insertion support groove 13. The right angle protrusion 21 is formed opposite to both sides, while the base support portion 22 is formed to be recessed downward from the right angle protrusion 21 to be seated on the cable support jaw 11, and the substrate The receiving portion 22 is formed with a coupling hole (22a) for fixing from the cable support jaw (11).

또한, 상기 방열부재(20)의 외표면은 빛 반사를 위해 유광 및 미러(Mirror)처리되도록 한다.In addition, the outer surface of the heat dissipation member 20 is polished and mirrored to reflect light.

상기 양면접착테이프(30)는 방열부재(20)의 기판받침부(22) 상면에 엘이디 조명모듈(40)을 안착시켜 부착하기 위해 선 부착된다.The double-sided adhesive tape 30 is pre-attached to seat and attach the LED lighting module 40 to the upper surface of the substrate support 22 of the heat dissipation member 20.

상기 엘이디 조명모듈(40)은 인쇄회로기판(41)상에 엘이디소자(42) 및 전기적인 회로구성요소들이 마련되며, 상기 결합공(22a)들과 일치되어 체결부재(S)로서 나사체결된다. 여기서 상기 체결부재(S)는 일단이 뾰족하게 형성되어 케이블 지지관턱(11)을 통해 그 내측으로 관통하는 케이블(C)을 침입하여 내측 배선과 기판상에 해당하는 엘이디 소자를 구동하기 위한 접점이 이루어지도록 하기 위함이다. The LED lighting module 40 is provided with the LED element 42 and the electrical circuit components on the printed circuit board 41, is matched with the coupling holes (22a) is screwed as a fastening member (S) . Wherein the fastening member (S) has a pointed end is penetrated into the cable (C) penetrating inward through the cable support jaw (11) is a contact for driving the LED element corresponding to the inner wiring and the substrate To make it happen.

상기 에폭시경화수지(50)는 엘이디 조명모듈(40)이 하우징(10)에 안내 설치되는 하우징(10)의 상부로부터 상기 엘이디소자의 상면이 드러나고 나머지는 잠기는 형태로 도포되어 방수처리되어 외부로부터 습기와 빗물의 유입을 차단할 수 있게 된다. 상기 에폭시경화수지(50)가 도포처리된 상태는 첨부도면 도 2 및 도 3에와 같이 방열부재(20)의 직각돌출부(21)의 상부측과 측면측은 외부에 드러난 상태로 된다.The epoxy cured resin 50 is exposed to the upper surface of the LED element from the upper portion of the housing 10, the LED lighting module 40 is installed in the housing 10, the rest is coated in a shape that is waterproof to be treated with moisture from the outside It is possible to block the inflow of rain and rainwater. The epoxy cured resin 50 is coated in a state where the upper side and side surfaces of the right angle protrusion 21 of the heat dissipation member 20 are exposed to the outside as illustrated in FIGS. 2 and 3.

이와 같이 구성된 본 발명인 엘이디 모듈은 도 4에서 도시한 바와 같이 일정간격으로 다수개 설치하여 사용되며, 도시된 엘이디 모듈은 조명간판에 적용되는 일 예로서 설명한다.The LED module of the present invention configured as described above is used to be installed in plurality at regular intervals as shown in FIG. 4, and the illustrated LED module will be described as an example applied to a lighting sign.

상기 케이블(C)을 통해 전기적으로 접점 연결 설치된 각 엘이디 조명모듈(40)의 엘이디소자(42)가 점등되고, 설정된 릴레이회로(도면에서 생략함)에 의해 점멸이 반복적으로 이루어지는 구동상태에서는 인쇄회로기판의 후면측에 열이 발생한다.In the driving state in which the LED elements 42 of each of the LED lighting modules 40 electrically connected and connected through the cable C are turned on, and flashing is repeatedly performed by a set relay circuit (not shown in the drawing). Heat is generated on the back side of the substrate.

상기 인쇄회로기판(41)은 방열부재(20)의 기판받침부(22)에 안착된 형태로서 열의 전이작용으로 하우징(10)의 외부로 드러난 방열부재(20)의 직각돌출부(21) 표면으로부터 공기와 접촉하여 방열작용을 갖도록 하여 구동 중 인쇄회로기판(41)상의 전기적인 회로의 구성을 보호할 수 있게 된다.The printed circuit board 41 is seated on the substrate support part 22 of the heat dissipation member 20, and is formed from the surface of the right angle protrusion 21 of the heat dissipation member 20 exposed to the outside of the housing 10 due to heat transfer. It is possible to protect the configuration of the electrical circuit on the printed circuit board 41 during operation by having a heat radiation action in contact with the air.

상기와 같이 방열부재(20)의 직각돌출부(21)가 설치되는 하우징(10)의 위치에 따라 전면이나 평면부위와 각 측면부위가 노출된 이유에서 외부 공기와의 접촉으로 인한 방열작용은 더욱 효과적으로 작용하므로, 전면 위치로 엘이디 조명모듈 이 설치되는 조명간판 등에서 더욱 효과적인 설치와 구동이 가능해진다. As described above, according to the position of the housing 10 in which the right angle protrusion 21 of the heat dissipation member 20 is installed, the heat dissipation action due to contact with the outside air is more effective because the front or flat portions and the respective side portions are exposed. As a result, the front panel can be installed and driven more effectively in the lighting signboard where the LED lighting module is installed.

아울러, 상기 방열부재(20)의 외표면은 에폭시경화수지(50)로서 몰딩처리된 이외의 표면은 유광 혹은 미러와 같이 외부 빛의 흡수를 방지하는 한편, 반사효과를 가지게 하여 빛의 밝기효율을 최대로 높일 수 있는 이중 역할을 한다.In addition, the outer surface of the heat dissipation member 20 is an epoxy hardening resin 50, the surface other than the molding treatment prevents the absorption of external light, such as glossy or mirror, while having a reflection effect to improve the brightness efficiency of light It plays a dual role to the maximum.

도 1은 본 발명인 엘이디 모듈을 분리하여 도시한 사시도,1 is a perspective view showing a separate LED module of the present invention,

도 2 및 도 3은 본 발명에 따른 엘이디 모듈을 절개하여 도시한 종단면도, 2 and 3 is a longitudinal cross-sectional view showing the led module according to the present invention cut;

도 4는 엘이디 조명모듈을 다수개 연결된 상태를 도시한 평면도.Figure 4 is a plan view showing a state in which a plurality of LED lighting module is connected.

< 도면의 주요부분에 대한 부호설명><Explanation of Signs of Major Parts of Drawings>

10: 하우징 11: 케이블 지지관턱10: housing 11: cable support jaw

12: 걸림턱 13: 삽입지지홈12: engaging jaw 13: insertion support groove

20: 방열부재 21: 직각돌출부20: heat dissipation member 21: right angle protrusion

22: 기판받침부 30: 양면접착테이프22: substrate support portion 30: double-sided adhesive tape

40: 엘이디 조명모듈 41: 인쇄회로기판40: LED lighting module 41: printed circuit board

42: 엘이디 소자 50: 에폭시경화수지42: LED element 50: epoxy cured resin

C: 케이블 S: 체결부재 C: cable S: fastening member

Claims (2)

상부와 길이방향 양측이 개방된 직사각형체로, 내부 길이방향에는 외부로부터 케이블(C)이 관통 되어 지지되는 케이블 지지관턱(11)이 하나 이상 형성되고, 개방된 측면 가장자리에 상호 대향되는 걸림턱(12)의 형성과 하부방향으로 삽입지지홈(13)이 형성된 하우징(10)과;A rectangular body having both the upper side and the longitudinal side open, and at least one cable support pipe 11 is formed in the inner longitudinal direction to support the cable C from the outside, and the locking step 12 opposite to the open side edge. And a housing 10 in which an insertion support groove 13 is formed in the lower direction; 길이방향 양단은 상기 하우징(10)의 걸림턱(12)에 안내되어 지지되고, 밑단은 삽입지지홈(13)에 삽입되는 직각돌출부(21)가 양측에 대향되게 형성되는 한편, 상기 직각돌출부(21)로부터 하부로 직각되게 함몰 형성되어 케이블 지지관턱(11)에 안착되는 기판받침부(22)가 형성되고, 상기 기판받침부(22)에는 케이블 지지관턱(11)으로부터 고정되기 위한 결합공(22a)이 형성된 알루미늄 소재의 방열부재(20)와;Both ends of the longitudinal direction are guided and supported by the locking jaw 12 of the housing 10, and the bottom end is formed with the right angle protrusions 21 inserted into the insertion support groove 13 opposite to both sides, while the right angle protrusions ( A substrate support 22 is formed to be recessed downwardly from the side 21 to be seated on the cable support 11, and a coupling hole for fixing from the cable support 11 is formed in the substrate support 22. 22a) formed of a heat dissipation member 20 of aluminum material; 상기 방열부재(20)의 기판받침부(22)측 상면에 안착되는 양면접착테이프(30)와;A double-sided adhesive tape 30 seated on an upper surface of the substrate support part 22 side of the heat dissipation member 20; 상기 양면접착테이프(30)에 의해 인쇄회로기판(41) 저면이 부착되고, 인쇄회로기판(41)상에 엘이디소자(42) 및 전기적인 회로구성요소들이 마련되며, 상기 결합공(22a)들과 일치되어 체결부재(S)로서 나사체결되는 엘이디 조명모듈(40)과;The bottom surface of the printed circuit board 41 is attached by the double-sided adhesive tape 30, an LED element 42 and electrical circuit components are provided on the printed circuit board 41, and the coupling holes 22a are provided. LED lighting module 40 to be screwed to match with the fastening member (S) and; 상기 엘이디 조명모듈(40)이 안내 설치되는 하우징(10)의 상부에 도포되어 방수처리되는 에폭시경화수지(50);를 포함하여 구성된 것을 특징으로 하는 방열 및 반사기능이 구비된 엘이디 모듈.LED module with a heat dissipation and reflection function, characterized in that it comprises a; the LED lighting module 40 is applied to the upper portion of the housing 10 is installed to guide the waterproofing epoxy curing resin (50). 제1항에 있어서, 상기 방열부재(20)의 외표면은 빛 반사를 위해 유광 및 미러처리 된 것을 특징으로 하는 방열 및 반사기능이 구비된 엘이디 모듈.The LED module of claim 1, wherein the outer surface of the heat dissipation member 20 is polished and mirrored to reflect light.
KR1020090010172A 2009-02-09 2009-02-09 Light Emittion Diode module having radiant heat and reflection function KR100998560B1 (en)

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