JP4973398B2 - LIGHT EMITTING DEVICE AND LIGHTING DEVICE HAVING THE SAME - Google Patents

Description

  The present invention relates to a light-emitting device that has a semiconductor light-emitting element such as an LED (light-emitting diode) and is used in the illumination field, display field, and the like, and an illumination device such as a lamp that includes the light-emitting device as a light source.

  Conventionally, as a lighting device that replaces a general incandescent bulb, an LED light source is provided in an opening provided on the side facing the base in a case provided with a base and a reflective shade, and input from a commercial power source is performed through the base. There is known a lighting device in which a power supply circuit that converts AC power to be converted into DC power and supplies it to an LED light source is provided in a case (see, for example, Patent Document 1).

The LED light source employed in this lighting device has a large number of LED bare chips mounted vertically and horizontally in a matrix on a metal-based substrate, and a reflector having a large number of holes for individually accommodating the LED bare chips. A hole formed in the reflector is filled with a light-transmitting sealing resin that seals the LED bare chip, and the LED bare chips are simultaneously emitted to be used as a planar light source. The metal-based substrate is formed by laminating a plurality of insulating layers on the surface of a metal plate and forming a conductor pattern on the surface of these insulating layers. The LED bare chip is mounted on a metal-based substrate by being connected to a conductor pattern by flip chip mounting.
Japanese Patent Laying-Open No. 2004-193357 (paragraphs 0012-0030 and FIGS. 1 to 8)

In the illumination device of Patent Document 1, a power supply circuit for lighting an LED light source is built in the case, and the LED light source is attached to the case separately from this circuit. For this reason, in addition to the trouble of handling the LED light source and the power supply circuit separately and attaching them to the case, an operation for electrically connecting the LED light source and the power supply circuit is necessary. The assembly of the device is troublesome.

  As an improvement plan for this point, it is conceivable to mount a power supply circuit on the LED light source. By the way, it is not possible to mount the electric parts of the power supply circuit directly on the metal plate of the LED light source having the metal-based substrate, so it is necessary to take some insulation measures. For these reasons, it is preferable to mount the electrical components constituting the power supply circuit on the insulating layer of the metal-based substrate on which a large number of LED bare chips are mounted in a matrix arrangement, since the insulation measures for the electrical components can be omitted.

  However, in this case, as a matter of course, the electrical components of the power supply circuit are arranged around the LED bare chip group arranged in a matrix shape, avoiding the arrangement area of many LED bare chips. Become. Therefore, if the LED light source with the power supply circuit becomes large or the size of the metal-based substrate does not change, the area for mounting the LED bare chip depends on the arrangement space of the electric parts of the power supply circuit. It cannot be denied that the emission area decreases as the size decreases.

  Moreover, it is necessary to consider the LED light source so that the temperature rise of the LED bare chip is suppressed and the light emission characteristics are not deteriorated. For this reason, heat radiation from the LED light source to the outside is important. However, Patent Document 1 does not describe a technique for radiating heat from the LED light source to the outside.

  An object of the present invention is to provide a lighting device that is integrated with a lighting device, is easy to handle, can ensure a large light emitting area without being restricted by the lighting device, and can efficiently dissipate heat from a semiconductor light emitting element, Another object of the present invention is to provide a lighting device including the light emitting device.

The light emitting device of the invention according to claim 1, a plurality of semiconductor light-emitting element; a device substrate having a Rutotomoni hollow portion is formed mainly of a core made of insulating material, laminated on the surface of the core A metal heat receiving layer, an element mounting portion stacked on the heat receiving layer and mounted with the semiconductor light emitting element, a metal heat dissipation layer stacked on the back surface of the core on the back side of the element mounting portion, and the heat dissipation layer It is formed in the laminated insulating material made of the cover layer to the heat radiation unit responsible for heat dissipation to the outside by heat conduction, and is formed together with the heat receiving layer, and wherein connected to the heat radiating portion and the element mounting portion An apparatus substrate having heat transfer means for transferring heat transferred from the semiconductor light emitting element to the element mounting portion to the heat dissipating section; and disposed independently of the heat transfer means in the hollow portion of the device substrate. Semiconductor light emitting device It is characterized by comprising a; lighting apparatus and to lit.

In the invention of claim 1, for example, a chip-like LED (light emitting diode) can be suitably used as the semiconductor light emitting element, and an organic EL element or the like can also be used. In the first aspect of the present invention, the device substrate can be preferably a multilayer substrate mainly composed of an insulating material such as resin or ceramic, and the insulating material forming the core of the device substrate is made of resin or ceramic. It can be used, and the core may be a single layer or multiple layers. In the first aspect of the present invention, the element mounting portion refers to a portion where a metal conductor electrically connected to the semiconductor light emitting element is provided in a predetermined pattern on the insulator, and the insulator of the element mounting portion Is preferably formed of a white-based insulator, and the back side of the element mounting portion more accurately refers to the back side of the surface on which the semiconductor light emitting element is mounted. In the first aspect of the present invention, the heat radiating portion can be preferably formed of a metal film, but it is also possible to form a thin insulating layer on the film. In the first aspect of the present invention, an insulating material such as resin or ceramic can be used for the cover layer. In the invention of claim 1, even if the cover layer of the heat radiating portion is the same size (area) as the heat radiating layer, and in order to make the heat conduction area of the heat radiating portion larger than that of the heat radiating layer, It may be provided so as to cover the part.

  In the invention of claim 1, the heat transfer means has a function of transferring heat by heat conduction from the surface side in the thickness direction of the device substrate to the back side, and is a metal having excellent heat conductivity, for example, Au, Ag. , Cu or the like. In the invention of claim 1, the lighting device mounted independently from the heat transfer means means that the lighting device and the heat transfer means are not electrically connected, and therefore the heat transfer means is charged. It is not a part but only responsible for heat transfer. In the invention of claim 1, it is preferable that the lighting device is mounted on the device substrate in such a manner that simplification of the configuration can be facilitated and handling is easy. It is possible to dispose some lighting device components in a place different from the device substrate, and mounting at least a part of the lighting device on the device substrate in this way promotes downsizing of the light emitting device. Suitable for cases where

  In the light-emitting device according to claim 1, since the device substrate is mainly made of an insulator, the lighting device can be mounted on the insulating portion thereof. It can be configured as an assembly in which a lighting device for lighting is mounted. Therefore, it is not necessary to handle the lighting device separately from the device substrate on which the semiconductor light emitting element is mounted in the assembly of the lighting device and the display including the light emitting device and the heat radiating member combined with the heat radiation portion so as to be able to conduct heat. In addition, it is not necessary to electrically connect the device substrate and the lighting device. Therefore, handling of the light emitting device is easy.

Further, in the light emitting device according to the first aspect, since the device substrate is mainly composed of an insulator, the lighting device can be mounted in the hollow portion of the device substrate without requiring any special insulation measures. Thereby, the area | region which arrange | positions a lighting device around a semiconductor light-emitting element group is not required for an element mounting part. Therefore, the device substrate does not become large, and a large light emitting area can be secured without being restricted by the arrangement of the lighting device. Moreover, in the invention of claim 1, since the lighting device is built in the device substrate, handling of the light emitting device can be facilitated as the lighting device is protected. Furthermore, since the insulating cover layer is laminated on the metal heat dissipation layer, the heat dissipation layer can be oxidized while the light emitting device is stored even when the heat dissipation layer is formed of low-cost Cu. Can be suppressed.

  The light-emitting device according to claim 1 is provided with a heat transfer means for moving the heat of the element mounting portion to the heat radiating portion on the back side of the device substrate. And can be released from the heat radiating portion by heat conduction. As described above, as the heat of each semiconductor light emitting element is favorably released to the back side of the device substrate, the temperature rise of each semiconductor light emitting element is suppressed and the light emission characteristics thereof are not deteriorated.

The light-emitting device according to a second aspect of the present invention is the light-emitting device according to the first aspect, wherein the heat transfer means includes a metal heat transfer post, and the heat transfer post connects the heat dissipation layer and the heat receiving layer in the core. It is characterized by extending in the thickness direction of the core.

In the second aspect of the present invention, the heat receiving layer and the heat transfer post are preferably formed of the same metal, and examples of usable metals include Au, Ag, and Cu. In the invention of claim 2, the heat receiving layer preferably has the same size (area) as the element mounting portion. In the invention of claim 2, the heat transfer post is formed in a solid column shape and provided independently of the lighting device.

  In the light emitting device according to the second aspect, the heat of the semiconductor light emitting element can be quickly released to the heat radiating portion through the metal heat conduction path. That is, the heat of the semiconductor light emitting element can be conducted from the heat receiving layer to the heat radiating layer through the heat transfer post. Therefore, as the heat of each semiconductor light emitting element is well released to the back side of the device substrate, the temperature rise of each semiconductor light emitting element can be suppressed and their light emission characteristics can be prevented from deteriorating.

A light-emitting device according to a third aspect of the present invention is the light-emitting device according to the first or second aspect, wherein the plurality of semiconductor light-emitting devices are arranged vertically and horizontally, and the heat dissipation portion is provided at a central portion of the device substrate. The lighting device is disposed around the heat radiating portion.

According to the third aspect of the present invention, the semiconductor light-emitting element disposed in the central portion of the device substrate is arranged around the semiconductor light-emitting element group because of the relationship in which the plurality of semiconductor light-emitting devices are aligned vertically and horizontally. Therefore, the temperature tends to rise. Nevertheless, since the lighting device is disposed around the heat radiating portion and this heat radiating portion is provided in the central portion of the device substrate, the heat of the semiconductor light emitting element group disposed in the central portion of the device substrate is transferred to the device substrate. It can be discharged well on the back side of the central part of. Thereby, it is possible to prevent the temperature rise of the semiconductor light emitting element group disposed in the central portion of the device substrate and to prevent the light emission characteristics from deteriorating.

A lighting device according to a fourth aspect of the present invention includes the light emitting device according to any one of the first to third aspects; and a heat transfer portion to which a heat radiating portion of the light emitting device is in close contact. A heat dissipating member for releasing the heat of the air into the atmosphere; and an attaching means for supporting the light emitting device on the heat dissipating member to keep the heat dissipating part in close contact with the heat transfer part. It is said.

In the invention of claim 4 , the heat radiating member is preferably formed of a metal such as aluminum or an alloy thereof, and a heat radiating fin for increasing the heat radiating area can be provided on the surface of the heat radiating member. In the invention of claim 4 , for example, a screw that penetrates the device substrate in the thickness direction and is screwed into the heat transfer portion can be suitably used as the attachment means, and is provided across the device substrate and the heat dissipation member. It is also possible to use a clamp or the like that presses the heat radiating portion of the device substrate against the heat transfer portion.

According to the invention of claim 4 , since the light emitting device according to any one of claims 1 to 3 is provided, the lighting device is integrally provided and is easy to handle and is not restricted by the lighting device. In addition, it is possible to provide a lighting device including a light emitting device that can secure a large light emitting area and can dissipate heat of a semiconductor light emitting element satisfactorily.

  According to the light emitting device of the first and second aspects of the invention, the lighting device is integrally provided and is easy to handle, and a large light emitting area can be secured without being restricted by the lighting device, and the heat of the semiconductor light emitting element can be radiated well. There is an effect that it is possible to do.

According to the invention of claim 3 , in the light emitting device of the invention of claim 1 or 2, there is an effect that heat of the semiconductor light emitting element disposed in the central portion of the device substrate can be radiated well. is there.

According to the invention of claim 4 , the lighting device is integrally provided and is easy to handle, and a large light emitting area can be secured without being restricted by the lighting device, and the heat of the semiconductor light emitting element can be radiated well. An illumination device including a light emitting device can be provided.

A first reference example of the present invention will be described with reference to FIGS.

  Reference numeral 1 in FIGS. 1 and 2 denotes a lighting device, for example, a light bulb type lamp. The lamp 1 includes a light emitting device 2, a support body 21 provided with a heat radiating member, attachment means such as a plurality of screws 41, and a lighting cover 45 as a light control body.

  As shown in FIGS. 4 and 5, the light emitting device 2 includes a device substrate 3, a plurality of semiconductor light emitting elements such as LEDs 11, and a lighting device 15.

  As shown in detail in FIG. 5, the device substrate 3 includes a core 4, a heat receiving layer 5, an element mounting portion 6, a heat radiating portion 7, and a plurality of heat transfer posts 8.

  The core 4 is made of a multilayer resin substrate made of an insulating material and has a circular shape, for example. The core 4 has a cavity 4a opened at the center of the back surface. A heat receiving layer 5 made of, for example, a Cu thin film is laminated on the surface of the core 4. The heat receiving layer 5 is the same size as the core 4 and covers the entire surface of the core 4.

  The element mounting portion 6 thinner than the core 4 is formed of an insulating layer 6a having the same size as the core 4 and a conductor foil 6b provided in a predetermined pattern on the surface of the insulating layer 6a. The insulating layer 6 a is made of the same kind of insulating material as the core 4 and is laminated on the heat receiving layer 5 with a thickness approximately the same as that of the heat receiving layer 5. The insulating layer 6a is preferably formed of a white resin in order to obtain light reflection performance on the surface. The conductor foil 6b is made of copper foil, for example, and is provided over substantially the entire surface of the insulating layer 6a.

  The heat dissipating part 7 thinner than the core 4 is provided on the back surface of the core 4 on the back side of the element mounting part 6, and is formed of a heat dissipating layer 7a and a cover layer 7b. The heat radiating portion 7 is provided in an annular shape surrounding the cavity 4a. Specifically, the heat radiation layer 7a is laminated on the entire back surface of the annular portion around the cavity 4a of the core 4, and the cover layer 7b is laminated on the heat radiation layer 7a. The heat radiating layer 7 a is made of, for example, a Cu thin film like the heat receiving layer 5, and the thickness thereof is approximately the same as that of the heat receiving layer 5. The cover layer 7b has an annular shape of the same size as the heat dissipation layer 7a, and is made of the same kind of insulating material as the core 4, and its surface is flat.

  By laminating a cover layer 7b made of an insulating material on the metal heat dissipation layer 7a, the heat dissipation layer 7a is oxidized in a state where the light emitting device 2 is stored even when the heat dissipation layer 7a is formed of low-cost Cu. Can be suppressed.

  The heat transfer post 8 is provided in the core 4 so as to extend in the thickness direction. One end of the heat transfer post 8 is integrally connected to the heat receiving layer 5 and the other end is integrally connected to the heat radiation layer 7a. The heat transfer post 8 is made of metal, for example, copper, and has a solid column shape rather than a hollow shape. A plurality of heat transfer posts 8 are provided. The heat transfer post 8 and the heat receiving layer 5 form a heat transfer means for transferring the heat generated in the LED 11 by heat conduction from the surface of the device substrate 3 to the back surface. This heat transfer means is not electrically connected to a conductor pattern described later of the lighting device 15 and is independent of the lighting device 15.

  The device substrate 3 configured as described above can also be referred to as a cavity substrate. The device substrate 3 is a multilayer substrate manufactured by a build-up method. As shown in FIG. 2 and FIGS. 4A and 4C, fixing holes 9 are provided in a plurality of locations around the device substrate 3 so as to penetrate in the thickness direction.

  Each LED 11 emits white illumination light, for example, a transparent material mixed with a yellow phosphor that mainly emits yellow light that is excited by blue light emitted from a blue LED chip and has a complementary color relationship with blue. An LED in which a blue LED chip is sealed with a light-sensitive resin is used. These LEDs 11 are connected to the conductor foil 6 b and mounted on the element mounting portion 6. As shown in FIG. 4C, the mounted LEDs 11 are arranged in a matrix so as to be aligned vertically and horizontally over substantially the entire area excluding the peripheral portion of the device substrate 3. As shown in FIGS. 2 and 4A and 4C, fixing holes 9 are provided at a plurality of positions on the peripheral portion of the apparatus substrate 3 so as to avoid the LEDs 11.

  As shown in FIG. 5, the lighting device 15 is formed of a conductor pattern 16 and a plurality of electrical components 17. The lighting device 15 is mounted on the back side of the element mounting portion 6, specifically, in the cavity 4 a of the device substrate 3. Specifically, the conductor pattern 16 is provided on the bottom surface of the cavity 4a. The conductor pattern 16 is provided at the same time as the apparatus substrate 3 is built up, and is made of, for example, copper foil. The electrical component 17 is connected to the conductor pattern 16 and mounted on the back surface of the central portion of the device substrate 3, and is disposed in the cavity 4 a of the device substrate 3 so as not to protrude from the cavity 4 a.

  As shown in FIGS. 1 and 3, the support 21 is formed by connecting a base 28 to the heat dissipation member 22 via an insulating member 27.

  The heat radiating member 22 is made of a metal having excellent thermal conductivity such as aluminum. The base 28 and the end opposite to the base 28 of the heat radiating member 22 are used as a heat transfer part 22a (see FIGS. 2 and 3) having a larger diameter than the end close to the base 28. A plurality of screw holes 23 (see FIG. 2) are provided in the heat transfer section 22a. As shown in FIGS. 2 and 3, the heat radiating member 22 is provided with a ring-shaped annular wall 24 integral therewith so as to surround the heat transfer portion 22a. The annular wall 24 has a male screw portion on the outer peripheral surface thereof. The height of the annular wall 24 is higher than the entire thickness of the light emitting device 2, and the inner diameter of the annular wall 24 is larger than the diameter of the light emitting device 2.

  A through hole 25 extending in the axial direction is formed in the central portion of the heat dissipation member 22. The through hole 25 is located at the center of the heat transfer portion 22a and opens to the one end in the axial direction of the heat radiating member 22, and opens to the other end in the axial direction of the hole and the heat radiating member 22. It consists of a small-diameter hole. The large-diameter hole is a space that secures an insulation distance between the heat dissipation member 22 and the lighting device 15, and the diameter thereof is substantially equal to the diameter of the cavity 4a. An insulation-coated electric wire 26 that electrically connects the base 28 and the lighting device 15 is wired in the through hole 25.

  The light emitting device 2 is supported as a light source of the lamp 1 on the heat transfer portion 22a. The light emitting device 2 is housed inside the annular wall 24 so that the heat radiating portion 7 is in contact with the heat transfer portion 22a, and then the screw 41 is passed through the fixing hole 9 of the device substrate 3 so that the heat transfer portion 22a. It is attached to and supported by the support body 21 by screwing into the screw hole 23 and tightening. The cover layer 7b of the heat radiating portion 7 is held in close surface contact with the surface of the heat transfer portion 22a by the tightening force of the screws 41, and the cavity 4a and the large-diameter hole portion of the through hole 25 face each other. Communicate.

  The protruding height of the light emitting device 2 supported by the support 21 with respect to the heat transfer portion 22 a is lower than the height of the annular wall 24. Therefore, when the support 21 to which the light emitting device 2 is attached is temporarily placed with the annular wall 24 as a leg, the light emitting device 2 is prevented from touching the mounting surface and the LED 11 is subjected to external force, and the LED 11 Can also be prevented from becoming dirty.

  The illumination cover 45 is formed from a light transmissive material, for example, a diffuse light transmissive material. Thereby, the brightness | luminance of several LED11 can be reduced and they can be prevented from being visually recognized as a luminescent spot. The illumination cover 45 has a female screw portion that is detachably screwed to the annular wall 24 at the inner periphery of the opening. The illumination cover 45 is screwed onto the annular wall 24 and attached to the support 21 to cover the light emitting device 2.

  The lamp 1 supplies power to the lighting device 15 through the base 28 and the insulation-coated electric wire 26 so that each LED 11 is turned on by the lighting device 15, so that the white light projected by the lamp 1 is diffused and transmitted through the illumination cover 45. To be served.

  Each LED 11 generates heat in accordance with this illumination, but the heat is conducted to the heat radiating member 22 and released into the atmosphere, so that the temperature rise of each LED 11 is suppressed.

  That is, the heat generated by each LED 11 is first transmitted from the element mounting portion 6 having an area slightly larger than the area where the LEDs 11 are disposed to the heat receiving layer 5 having the same area. Next, the heat passes through each heat transfer post 8 having one end connected to the heat receiving layer 5 and is transferred to the heat dissipation layer 7a of the heat radiating portion 7 to which the other end of the heat transfer post 8 is connected. The heat is transmitted from the cover layer 7b of the heat radiating section 7 laminated on 7a to the heat transfer section 22a of the heat radiating member 22 in close contact with the cover layer 7b. Further, the heat conducted to the heat transfer portion 22a is transmitted to the entire heat radiating member 22 and released from the outer surface of the heat radiating member 22 to the atmosphere.

  The main part of the heat radiation path from the light emitting device 2 to the heat radiation member 22 is formed by a heat conduction path including the metal heat receiving layer 5, the heat transfer post 8, and the heat radiation layer 7a. The heat of the light emitting device 2 is quickly transmitted to the heat radiating layer 7a of the heat radiating portion 7 through this path, so that the heat of each LED 11 can be released well to the back side of the device substrate 3. Accordingly, the temperature rise of each LED 11 is suppressed, and the light emission characteristics thereof can be prevented from deteriorating.

  As the lamp 1 is turned on, some of the electrical components 17 included in the lighting device 15 also generate heat. Since this heat is transmitted to the heat receiving layer 5 and the heat transfer post 8 through the core 4 of the device substrate 3 and then to the heat radiating layer 7a, it is finally released into the atmosphere from the heat radiating member 22 in the same manner as the heat of the LED 11. Is done. Such heat dissipation can also suppress the temperature rise of the lighting device 15.

  Moreover, since the heat radiating portion 7 is provided around the lighting device 15 when the light emitting device 2 is viewed from the back side, it is easy to ensure a large area of the heat radiating portion 7. Therefore, it is easy to transfer heat from the light emitting device 2 to the heat radiating member 22, and it is easy to suppress the temperature rise of each LED 11.

  Further, since the device substrate 3 of the light emitting device 2 is mainly composed of the core 4 made of an insulator, the lighting device 15 can be mounted on the core 4 without requiring any special insulation measures. Accordingly, the light emitting device 2 can be configured as an assembly in which a plurality of LEDs 11 and a lighting device 15 for lighting these LEDs 11 are mounted on the front and back of the device substrate 3.

  Therefore, in handling the light emitting device 2 in assembling the lamp 1 having the heat radiating member 22 combined with the heat radiating portion 7 of the light emitting device 2 so as to conduct heat, the lighting device 15 is replaced with the device substrate 3 on which the LEDs 11 are mounted. There is no need to handle it separately. At the same time, the lighting device 15 mounted on the back side of the device substrate 3 and the LEDs 11 mounted on the surface of the device substrate 3 are electrically connected to assemble the light emitting device 2. In handling the light-emitting device 2, it is not necessary to electrically connect the device substrate 3 and the lighting device 15.

  Therefore, handling of the light emitting device 2 is easy. In addition, the lamp 1 in which the light emitting device 2 is provided outside the support 21 does not require the trouble of assembling the lighting device 15 into the support 21, so that the lamp 1 can be easily assembled in this respect.

  Further, as described above, since the device substrate 3 of the light emitting device 2 is mainly composed of the core 4 made of an insulator, the lighting device 15 can be mounted on the back side of the element mounting portion 6 without requiring any special insulation measures. Thereby, the area | region which arrange | positions the electrical component 17 of the lighting device 15 around LED11 group mounted in the surface of the apparatus substrate 3 is not required for the element mounting part 6. FIG. Therefore, the device substrate 3 does not become large, and the light emitting area of the light emitting device 2 can be secured large without being restricted by the lighting device 15.

An embodiment of the present invention will be described with reference to FIGS. Since one embodiment except the matters described below is the same as the first reference example, in the following description, the same components as in the first reference example will be omitted given the same reference numerals as the first reference example .

In one embodiment , the device substrate 3 of the light emitting device 2 provided in the lamp 1 has a hollow portion 3a. The hollow portion 3 a is located at the center of the device substrate 3 and is formed on the back side of the element mounting portion 6. A cover portion 3b made of an insulating material with the hollow portion 3a closed from the back side of the device substrate 3 is formed integrally and flush with the surrounding cover layer 7b, and the heat transfer surface to the heat radiating member 22 is the same as the cover layer 7b. It is supposed to function as. The lighting device 15 is built in the hollow portion 3a. Therefore, the device substrate 3 of one embodiment forms a component built-in substrate. In addition, the hole 10 for letting the insulation coating electric wire 26 pass is made in the cover part 3b. The configuration other than the points described above is the same as that of the first reference example .

Accordingly, for the reasons already described in the first reference example even in this embodiment can solve the problem of the present invention. In addition, since the light emitting device 2 includes the device substrate 3 in which the lighting device 15 is incorporated, the light emitting device 2 can be handled more easily as the electrical component 17 is protected by the cover portion 3b.

  Furthermore, since the lighting device 15 is covered with the insulating cover part 3b, electrical insulation between the lighting device 15 and the metal heat radiating member 22 can be more reliably performed. Accordingly, as shown in FIG. 6, the through hole 25 provided in the heat radiating member 22 that faces the hole 10 and communicates does not have a large-diameter hole portion or can have a small diameter. In addition, since the cover layer 7b and the cover part 3b integral with the cover layer 7b are in close surface contact with the heat transfer portion 22a, the device substrate 3 is connected to the heat transfer portion 22a of the heat radiating member 22. A large heat conduction area is secured, and the heat of the LED 11 can be quickly released to the heat radiating member 22.

A second reference example of the present invention will be described with reference to FIGS. Since the second reference example, except the matters described below is the same as the first reference example, in the following description, the same components as in the first reference example not be described with the same reference numerals as the first reference example To do.

In the second reference example , the device substrate 3 of the light emitting device 2 does not have the already described cavity or hollow portion, and the heat radiating portion 7 is laminated on the flat back surface of the core 4. Therefore, the heat radiating part 7 has the same area as the element mounting part 6. A conductive pattern 16 of the lighting device 15 is provided on the insulating cover layer 7 b of the heat radiating unit 7, and an electrical component 17 is connected to the conductive pattern 16. Therefore, in the second reference example , the LED 11 is mounted on the surface of the device substrate 3, and the lighting device 15 is mounted on the back surface of the device substrate 3 parallel to the surface of the device substrate 3. In a state where the light emitting device 2 is screwed to the support 21, the electrical component 17 of the lighting device 15 is accommodated in the large diameter hole portion of the through hole 25 of the heat radiating member 22 so as not to contact the inner surface of the hole. The configuration other than the points described above is the same as that of the first reference example .

Therefore, even in the second reference example , the problem of the present invention can be solved for the reason already described in the first reference example .

A third reference example of the present invention will be described with reference to FIGS. Since the third reference example, except the matters described below is the same as the first reference example, in the following description, the same components as in the first reference example not be described with the same reference numerals as the first reference example To do.

In the third reference example , a stepped circuit mounting portion 3c is formed in the peripheral portion of the device substrate 3 so as to be recessed from the back surface of the device substrate 3 to the front surface side instead of the cavity opened to the back surface of the central portion of the device substrate 3. Has been. At the same time, the heat dissipating part 7 is laminated on the back surface central part 3d of the device substrate 3 located inside the circuit attaching part 3c. For this reason, the circuit mounting portion 3 c is provided around the heat radiating portion 7 when the device substrate 3 is viewed from the back side. The lighting device 15 is mounted on the circuit mounting portion 3c.

Furthermore, in the third reference example , the heat transfer portion 22a is formed at the center of the heat radiating member 22 so as to correspond to the back surface structure of the device substrate 3 described above, and an annular shape is formed around the heat transfer portion 22a. A groove 22b is formed. The annular groove 22 b faces the circuit attachment portion 3 c and is continuous with the inner surface of the annular wall 24 of the heat dissipation member 22. The electrical component of the lighting device 15 is insulated from the metal heat dissipation member 22 by the annular groove 22b.

In addition, a plurality of screw receiving projections 22c (only one is shown in FIG. 12) provided integrally with the heat radiating member 22 are provided in the annular groove 22b, and the device substrate 3 is screwed on these screw receiving projections 22c. 41 is fixed. Thereby, the back surface central portion 3c of the device substrate 3 is held in close surface contact with the heat transfer portion 22a. The configuration other than the points described above is the same as that of the first reference example .

Therefore, even in the third reference example , the problem of the present invention can be solved for the reason already described in the first reference example .

  By the way, the plurality of LEDs 11 mounted on the surface of the device substrate 3 are arranged vertically and horizontally. As a result, heat dissipation to the periphery of the LED 11 group disposed in the center of the front surface of the device substrate 3 corresponding to the back surface central portion 3 d of the device substrate 3 is suppressed by the other LED 11 groups disposed around these LEDs 11. The For this reason, the temperature of the LED 11 group disposed in the center of the surface of the device substrate 3 tends to increase easily.

Nevertheless, in the third reference example , the lighting device 15 is disposed around the heat radiating portion 7 as described above, and the heat radiating portion 7 is provided in the central portion 3d on the back surface of the device substrate 3. The heat of the LED 11 group disposed in the center of the front surface of the device substrate 3 corresponding to the back surface central portion 3d can be quickly released from the back surface central portion 3d of the device substrate 3 to the heat dissipation member 22. Thereby, while the temperature rise of LED11 group arrange | positioned in the center part of the apparatus board | substrate 3 is suppressed, those light emission characteristics can be prevented from falling, and LED11 group arrange | positioned in the center part of the apparatus board | substrate 3 in connection with it. And uneven color of illumination light with the surrounding LED group can be suppressed.

The side view which shows the lamp | ramp which concerns on the 1st reference example of this invention. Sectional drawing which expands and shows a part of lamp | ramp of FIG. 1 roughly. The perspective view which shows the support body with which the lamp | ramp of FIG. 1 is provided. (A) is a back view which shows the light-emitting device with which the lamp | ramp of FIG. 1 is provided. (B) is a side view showing the light emitting device. (C) is a front view showing the light-emitting device. Sectional drawing which expands and shows the F5 part in FIG.4 (B) in detail. Sectional drawing which expands and shows a part of lamp | ramp which concerns on one Embodiment of this invention roughly. (A) is a back view which shows the light-emitting device with which the lamp | ramp of FIG. 6 is provided. (B) is a side view showing the light emitting device. (C) is a front view showing the light-emitting device. Sectional drawing which expands and shows in detail F8 part in FIG.7 (B). Sectional drawing which expands and shows a part of lamp | ramp which concerns on the 2nd reference example of this invention roughly. (A) is a back view which shows the light-emitting device with which the lamp | ramp of FIG. 9 is provided. (B) is a side view showing the light emitting device. (C) is a front view showing the light-emitting device. Sectional drawing which expands and shows in detail F11 part in FIG.10 (B). Sectional drawing which expands and shows a part of lamp | ramp which concerns on the 3rd reference example of this invention roughly. (A) is a back view which shows the light-emitting device with which the lamp | ramp of FIG. 12 is provided. (B) is a side view showing the light emitting device. (C) is a front view showing the light-emitting device. Sectional drawing which expands and shows the F14 part in FIG.13 (B) in detail.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Lamp (illuminating device), 2 ... Light-emitting device, 3 ... Device board | substrate, 3a ... Hollow part, 3b ... Cover part, 3c ... Circuit attachment part, 4 ... Core, 5 ... Heat receiving layer (heat transfer means), 6 ... Element mounting part, 7 ... Radiation part, 7a ... Radiation layer, 7b ... Cover layer, 8 ... Heat transfer post (heat transfer means), 9 ... Fixed hole, 11 ... LED (semiconductor light emitting element), 15 ... Lighting device, 16 DESCRIPTION OF SYMBOLS ... Conductor pattern, 17 ... Electrical component, 21 ... Support body, 22 ... Heat radiating member, 22a ... Heat-transfer part, 23 ... Screw hole, 41 ... Screw (attachment means)

Claims (4)

A plurality of semiconductor light emitting devices;
A device substrate having a Rutotomoni hollow portion is formed mainly of a core made of insulating material, a metallic heat layer laminated on the surface of the core, the semiconductor light emitting device while being laminated on the heat-receiving layer Is formed by a metal heat dissipation layer laminated on the back surface of the core on the back side of the element mounting portion and a cover layer made of an insulating material laminated on the heat dissipation layer. radiating unit responsible for heat dissipation to the outside, and is formed together with the heat receiving layer, and the heat transmitted to the element mounting portion from the semiconductor light emitting element is connected to the heat radiating portion and the element mounting portion to the heat radiating portion An apparatus substrate having heat transfer means for movement;
A lighting device that is disposed independently of the heat transfer means in the hollow portion of the device substrate and lights the semiconductor light emitting element;
A light emitting device comprising: Characterized in that said heat transfer means comprises a heat transfer posts made of metal, it is provided to extend the heat transfer posts to connect the heat receiving layer and the heat dissipation layer in the core in the thickness direction of the core The light-emitting device according to claim 1. The plurality of semiconductor light emitting devices are arranged in vertical and horizontal directions, the heat dissipating part is provided in a central part of the device substrate, and the lighting device is disposed around the heat dissipating part. The light-emitting device according to claim 1 or 2. A light emitting device according to any one of claims 1 to 3;
A heat-dissipating member having a heat-transfer portion to which the heat-dissipation portion of the light-emitting device is in close contact, and releasing the heat of the heat-transfer portion to the atmosphere;
Mounting means for supporting the light emitting device on the heat radiating member and holding the heat radiating portion in close contact with the heat transfer portion;
An illumination device comprising:

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