JP6694153B2 - Light emitting device and lighting device - Google Patents

Description

  Embodiments of the present invention relate to a light emitting device and a lighting device.

  There is a light emitting device that includes a plurality of types of light emitting elements that emit different colors of light. Such a light emitting device can emit light of all colors (full color) by individually controlling the light emitting elements to be turned on. Here, in the case of irradiating full-color light, it is necessary to independently control the light emitting elements of a plurality of colors. Therefore, the wiring pattern on the substrate on which the light emitting element is mounted becomes complicated. This problem is particularly noticeable when many types of chips are packed in a narrow area. Therefore, it is conceivable to use a multilayer substrate, but since it is composed of a plurality of layers, it is difficult to transfer the heat generated in the light emitting element to a heat sink or the like via the substrate.

JP, 2013-73983, A

  A problem to be solved by the present invention is to provide a light emitting device capable of simplifying a wiring pattern on a substrate even when a plurality of types of light emitting elements are densely packed and suppressing a temperature rise of the light emitting elements, and It is to provide a lighting device.

A light emitting device according to an embodiment includes a first base; a second base provided on the first base; a third base provided on the second base; A fourth base provided on the third base; a first wiring part provided between the first base and the second base; the second base and the third base; A second wiring part provided between the third base part and the fourth base part; a third wiring part provided between the third base part and the fourth base part; A fourth wiring portion provided on a surface opposite to a side on which the base body is provided; and a first wiring portion provided on a surface opposite to a side of the fourth base body on which the third base body is provided . A first light emitting element which is irradiated with color light and is electrically connected to the first wiring portion; provided on a surface of the fourth base opposite to a side on which the third base is provided. It is, Serial irradiated with light of a second color different from the first color, and the second wiring portion and the third of the second light-emitting element which is one electrically connected to the wiring portion; the The third substrate is provided on a surface of the fourth substrate opposite to the side on which the third substrate is provided , and a third color light different from the first color and the second color is irradiated, A third light-emitting element electrically connected to the other of the second wiring part and the third wiring part; and a third light-emitting element on the opposite side of the fourth base on which the third base is provided. A surface provided on the surface, irradiated with light of a fourth color different from the first color, the second color, and the third color, and electrically connected to the fourth wiring portion. A light-emitting element of No. 4, a first conductive via penetrating the fourth substrate in the thickness direction and having one end electrically connected to the third wiring portion; And a second conductive via that penetrates the fourth substrate in the thickness direction and has one end electrically connected to the second wiring portion; the second substrate, the third substrate Of the first conductive member and one of the fourth conductive members are electrically connected to the first wiring portion, and a cross-sectional dimension in a direction perpendicular to the thickness direction is the first conductive material. And a third conductive via longer than the cross-sectional dimension of the via.

  According to the embodiments of the present invention, even when a plurality of types of light emitting elements are densely packed, the wiring pattern on the substrate can be simplified, and the temperature rise of the light emitting elements can be suppressed, and the illumination. A device can be provided.

FIG. 3 is a schematic cross-sectional view for illustrating the light emitting device 1 according to the present embodiment. It is a schematic cross section for illustrating the illuminating device 100 which concerns on this Embodiment.

The invention according to the embodiment includes a first base; a second base provided on the first base; a third base provided on the second base; and a third base. A fourth wiring body provided on the base body; a first wiring portion provided between the first base body and the second base body; the second base body and the third base body A second wiring part provided between the third base and the fourth base; a third wiring part provided between the third base and the fourth base; and a third base of the fourth base. to the side where is provided the fourth wiring portion and disposed on the opposite side; provided on a surface opposite to the side where the third base of the fourth substrate is provided, a first color A first light-emitting element that is electrically connected to the first wiring portion and is provided on a surface of the fourth base that is opposite to a side on which the third base is provided. , said 1 is irradiated with light of a second color different from the color, and the second of the second light-emitting element which is electrically connected to one of the wiring portion and the third wiring portion; the fourth Is provided on a surface of the base body opposite to the side on which the third base body is provided , and is irradiated with light of a third color different from the first color and the second color . A third light emitting element electrically connected to the other of the wiring part and the third wiring part; and on a surface of the fourth base opposite to the side on which the third base is provided. A fourth color element is provided, which radiates light of a fourth color different from the first color, the second color, and the third color, and which is electrically connected to the fourth wiring section. A light emitting element; a first conductive via penetrating the fourth base body in the thickness direction and having one end electrically connected to the third wiring portion; A body and a second conductive via penetrating the fourth base in the thickness direction and having one end electrically connected to the second wiring portion; the second base, the third base The base and the fourth base are pierced in the thickness direction, one end is electrically connected to the first wiring part, and the cross-sectional dimension in the direction orthogonal to the thickness direction is the first conductive via. And a third conductive via longer than the cross-sectional dimension of the light emitting device.
According to this light emitting device, even when a plurality of types of light emitting elements are densely packed, the temperature rise of the light emitting elements can be suppressed. Moreover, heat dissipation can be improved.

Further, the area of the first wiring portion may be larger than the area of the third wiring portion.
With this, heat dissipation can be improved.

Further, the number of the first light emitting elements provided on the fourth base is larger than the number of the second and third light emitting elements, and the number of the fourth light emitting elements is the second and the third light emitting elements. It is possible to reduce the number of light-emitting elements to three.
By doing so, heat can be efficiently dissipated.

The invention according to the embodiment is a lighting device including the above-described light emitting device;
According to this lighting device, it is possible to suppress the temperature rise of the light emitting elements even when a plurality of types of light emitting elements are densely packed.

Embodiments will be exemplified below with reference to the drawings. In the drawings, the same components are designated by the same reference numerals, and detailed description thereof will be appropriately omitted.
FIG. 1 is a schematic cross-sectional view for illustrating a light emitting device 1 according to this embodiment.
As shown in FIG. 1, the light emitting device 1 is provided with a substrate 10, a light emitting section 20, a frame section 30, and a sealing section 40.

  The substrate 10 includes a base body 11a (corresponding to an example of a first base body), a base body 11b (corresponding to an example of a second base body), a base body 11c (corresponding to an example of a third base body), and a base body 11d (corresponding to an example of a third base body). 4), and wiring patterns 12a to 12d. The bases 11a to 11d have a plate shape. The base 11b is provided on one surface side of the base 11a. The base 11c is provided on the side of the base 11b opposite to the side on which the base 11a is provided. The base 11d is provided on the opposite side of the base 11c from the side on which the base 11b is provided. That is, the bases 11a to 11d are stacked. The bases 11a to 11d are preferably formed using a material having high thermal conductivity. The material having high thermal conductivity may be, for example, an inorganic material such as ceramics (for example, aluminum oxide or aluminum nitride), or a metal plate whose surface is coated with an insulating material. When the surface of the metal plate is covered with an insulating material, the insulating material may be made of an organic material or an inorganic material.

  The wiring pattern 12a has a mounting pad 12a1, a conductive via 12a2 (corresponding to an example of a third conductive via), a wiring portion 12a3 (corresponding to an example of a first wiring portion), and an input terminal 12a4. The mounting pad 12a1 is provided on one surface of the substrate 10 (base 11d). The mounting pad 12a1 is provided inside the frame portion 30. The conductive via 12a2 penetrates the bases 11b to 11d in the thickness direction. One end of the conductive via 12a2 is electrically connected to the mounting pad 12a1 or the input terminal 12a4. The other end of the conductive via 12a2 is electrically connected to the wiring portion 12a3. One set of the mounting pad 12a1 and the conductive via 12a2 can be provided for one light emitting element 21 (corresponding to an example of the first light emitting element). The wiring portion 12a3 is provided between the base 11a and the base 11b. In plan view, one end of the wiring portion 12a3 is provided inside the frame portion 30, and the other end of the wiring portion 12a3 is provided outside the frame portion 30. The input terminal 12a4 is provided on the surface of the substrate 10 (base 11d) on the side where the mounting pad 12a1 is provided. The input terminal 12a4 is provided outside the frame portion 30.

  The wiring pattern 12b has a mounting pad 12b1, a conductive via 12b2 (corresponding to an example of a second conductive via), a wiring portion 12b3 (corresponding to an example of a second wiring portion), and an input terminal 12b4. The mounting pad 12b1 is provided on the surface of the substrate 10 (base 11d) on the side where the mounting pad 12a1 is provided. The mounting pad 12b1 is provided inside the frame portion 30. The conductive via 12b2 penetrates the bases 11c and 11d in the thickness direction. One end of the conductive via 12b2 is electrically connected to the mounting pad 12b1 or the input terminal 12b4. The other end of the conductive via 12b2 is electrically connected to the wiring portion 12b3. One set of the mounting pad 12b1 and the conductive via 12b2 can be provided for one light emitting element 22 (corresponding to an example of the second light emitting element). The wiring portion 12b3 is provided between the base 11b and the base 11c. In plan view, one end of the wiring portion 12b3 is provided inside the frame portion 30, and the other end of the wiring portion 12b3 is provided outside the frame portion 30. The input terminal 12b4 is provided on the surface of the substrate 10 (base 11d) on the side where the mounting pad 12b1 is provided. The input terminal 12b4 is provided outside the frame portion 30.

  The wiring pattern 12c has a mounting pad 12c1, a conductive via 12c2 (corresponding to an example of a first conductive via), a wiring portion 12c3 (corresponding to an example of a third wiring portion), and an input terminal 12c4. The mounting pad 12c1 is provided on the surface of the substrate 10 (base 11d) on the side where the mounting pad 12a1 is provided. The mounting pad 12c1 is provided inside the frame portion 30. The conductive via 12c2 penetrates the base 11d in the thickness direction. One end of the conductive via 12c2 is electrically connected to the mounting pad 12c1 or the input terminal 12c4. The other end of the conductive via 12c2 is electrically connected to the wiring portion 12c3. One set of the mounting pad 12c1 and the conductive via 12c2 can be provided for one light emitting element 23 (corresponding to an example of the third light emitting element). The wiring portion 12c3 is provided between the base 11c and the base 11d. In plan view, one end of the wiring portion 12c3 is provided inside the frame portion 30, and the other end of the wiring portion 12c3 is provided outside the frame portion 30. The input terminal 12c4 is provided on the surface of the substrate 10 (base 11d) on the side where the mounting pad 12c1 is provided. The input terminal 12c4 is provided outside the frame portion 30.

  The wiring pattern 12d has a mounting pad 12d1, a wiring portion 12d3 (corresponding to an example of a fourth wiring portion), and an input terminal 12d4. The mounting pad 12d1 is provided on the surface of the substrate 10 (base 11d) on the side where the mounting pad 12a1 is provided. The mounting pad 12d1 is provided inside the frame portion 30. One mounting pad 12d1 can be provided for each light emitting element 24 (corresponding to an example of the fourth light emitting element). The wiring portion 12d3 is provided on the surface of the substrate 10 (base 11d) on the side where the mounting pad 12a1 is provided. One end of the wiring portion 12d3 is electrically connected to each of the plurality of mounting pads 12a1 inside the frame portion 30. The other end of the wiring portion 12d3 is electrically connected to the input terminal 12d4 outside the frame portion 30. The input terminal 12d4 is provided on the surface of the substrate 10 (base 11d) on the side where the mounting pad 12d1 is provided. The input terminal 12d4 is provided outside the frame portion 30.

  A control device 112 provided outside the light emitting device 1 is electrically connected to the input terminals 12a4 to 12d4 (see, for example, FIG. 2). Therefore, the control device 112 causes the plurality of light emitting elements 21 electrically connected to the wiring pattern 12a, the plurality of light emitting elements 22 electrically connected to the wiring pattern 12b, and the wiring pattern via the input terminals 12a4 to 12d4. Control can be performed for each of the plurality of light emitting elements 23 electrically connected to the 12c and the plurality of light emitting elements 24 electrically connected to the wiring pattern 12d.

  The material of the wiring patterns 12a to 12d is not particularly limited as long as it is a conductive material. The material of the wiring patterns 12a to 12d can be, for example, a metal such as silver, copper, gold, or tungsten. When the material of the bases 11a to 11d is ceramics, the substrate 10 can be formed using, for example, the LTCC (Low Temperature Co-fired Ceramics) method. For example, the substrate 10 can be formed by simultaneously firing the bases 11a to 11d and the wiring patterns 12a to 12d at a temperature of 900 ° C. or lower. When the material of the bases 11a to 11d is a metal plate whose surface is covered with an insulating material, the substrate 10 uses, for example, an adhesive or the like for the bases 11a to 11d on which the wiring patterns 12a to 12d are formed. It can be formed by bonding.

  The light emitting unit 20 includes a light emitting element 21, a wiring 21a, a light emitting element 22, a light emitting element 23, a wiring 23a, a light emitting element 24, and a wiring 24a. The light emitting element 21 is mounted on the mounting pad 12a1 using a COB (Chip on Board) method. The light emitting element 21 can emit white light (for example, white or yellowish white). The light emitting element 21 may include, for example, a blue light emitting element and a wavelength conversion unit including a phosphor that emits yellow fluorescence. The wavelength conversion section can be provided on the end surface of the blue light emitting element opposite to the substrate 10 side. In this way, the blue light emitted from the blue light emitting element and the yellow light emitted from the phosphor are mixed, so that white light is emitted from the light emitting element 21. In this case, the color of the emitted light can be changed by adjusting the amount of phosphor. For example, by increasing the amount of the phosphor that emits yellow fluorescence, it is possible to irradiate yellowish white light.

  The light emitting element 21 can be a top and bottom electrode type light emitting element. The electrode (lower electrode) on the substrate 10 side of the light emitting element 21 is electrically connected to the mounting pad 12a1 via a conductive thermosetting material such as silver paste. One end of the wiring 21a is electrically connected to the electrode (upper electrode) of the light emitting element 21 on the side opposite to the substrate 10 side. The other end of the wiring 21a is electrically connected to the mounting pad 12a1. That is, the upper electrode of the light emitting element 21 is electrically connected to the mounting pad 12a1 via the wiring 21a. The wiring 21a can be electrically connected to the upper electrode of the light emitting element 21 and the mounting pad 12a1 by using, for example, a wire bonding method.

  The light emitting element 22 is mounted on the mounting pad 12b1 using the COB method. The light emitting element 22 may emit red-colored light (eg, red or amber). The light emitting element 22 can be, for example, a light emitting element that emits red light. Further, when irradiating with red light, the light emitting element 22 may include, for example, a blue light emitting element and a wavelength conversion unit including a phosphor that emits red fluorescence. When irradiating with amber light, the light emitting element 22 is assumed to have, for example, a blue light emitting element and a wavelength conversion unit including a phosphor that emits red fluorescence and a phosphor that emits yellow fluorescence. You can also The wavelength conversion section can be provided on the end surface of the blue light emitting element opposite to the substrate 10 side. In this case, the color of the emitted light can be changed by adjusting the amount of phosphor. For example, if the amount of the phosphor is increased, most of the blue light emitted from the blue light emitting element can be converted into red light or amber light.

  The light emitting element 22 may be a flip chip type light emitting element. In this case, the electrode is provided on the end surface of the light emitting element 22 on the substrate 10 side. The electrode of the light emitting element 22 is electrically connected to the mounting pad 12b1 via a conductive thermosetting material such as silver paste or solder.

  The light emitting element 23 is mounted on the mounting pad 12c1 using the COB method. The light emitting element 23 can emit green-based (for example, green or yellow-green) light. The light emitting element 23 can be, for example, a light emitting element that emits green light. Further, when irradiating with green light, the light emitting element 23 may include, for example, a blue light emitting element and a wavelength conversion unit including a phosphor that emits green fluorescence. When irradiating yellow-green light, the light-emitting element 23 includes, for example, a blue light-emitting element, a phosphor that emits green fluorescence, and a wavelength conversion unit that includes a phosphor that emits yellow fluorescence. You can also do it. The wavelength conversion section can be provided on the end surface of the blue light emitting element opposite to the substrate 10 side. In this case, the color of the emitted light can be changed by adjusting the amount of phosphor. For example, if the amount of the phosphor is increased, most of the blue light emitted from the blue light emitting element can be converted into green light or yellow-green light.

  The light emitting element 23 can be an upper and lower electrode type light emitting element. The electrode (lower electrode) on the substrate 10 side of the light emitting element 23 is electrically connected to the mounting pad 12c1 via a conductive thermosetting material such as silver paste. One end of the wiring 23a is electrically connected to the electrode (upper electrode) of the light emitting element 23 on the side opposite to the substrate 10 side. The other end of the wiring 23a is electrically connected to the mounting pad 12c1. That is, the upper electrode of the light emitting element 23 is electrically connected to the mounting pad 12c1 via the wiring 23a. The wiring 23a can be electrically connected to the upper electrode of the light emitting element 23 and the mounting pad 12c1 by using, for example, a wire bonding method.

  The light emitting element 24 is mounted on the mounting pad 12d1 by using the COB method. The light emitting element 24 can emit blue light (for example, blue light, cyan light, indigo light, or the like). The light emitting element 24 can be, for example, a light emitting element that emits blue light. Further, when irradiating with cyan light, the light emitting element 24 may include, for example, a blue light emitting element and a wavelength conversion unit including a phosphor that emits green fluorescence. The wavelength conversion section can be provided on the end surface of the blue light emitting element opposite to the substrate 10 side. In this case, the color of the emitted light can be changed by adjusting the amount of phosphor. For example, the amount of the phosphor can be adjusted so that cyan light is emitted by mixing the blue light emitted from the blue light emitting element and the green light emitted from the phosphor. .. The light emitting section is composed of, for example, 6 colors of a red light emitting element, a green light emitting element, a blue light emitting element, an amber color light emitting element, a cyan color light emitting element, a white light emitting element, and 7 colors in which a yellow green light emitting element is further added. be able to.

  The light emitting element 24 may be an upper and lower electrode type light emitting element. The electrode (lower electrode) on the substrate 10 side of the light emitting element 24 is electrically connected to the mounting pad 12d1 via a conductive thermosetting material such as silver paste. One end of the wiring 24a is electrically connected to an electrode (upper electrode) of the light emitting element 24 opposite to the substrate 10 side. The other end of the wiring 24a is electrically connected to the mounting pad 12d1. That is, the upper electrode of the light emitting element 24 is electrically connected to the mounting pad 12d1 via the wiring 24a. The wiring 24a can be electrically connected to the upper electrode of the light emitting element 24 and the mounting pad 12d1 by using, for example, a wire bonding method.

  Here, according to the knowledge obtained by the present inventors, when the light emitting device 1 irradiates full-color light, the number of the light emitting elements 21 irradiating white light is the largest. The number of the light emitting elements 22 that emit red light and the number of the light emitting elements 23 that emit green light are the second largest. The number of light emitting elements 24 that emit blue light is the smallest. Therefore, the total amount of heat generated in the plurality of light emitting elements 21 is the largest. The total amount of heat generated in the plurality of light emitting elements 22 or the plurality of light emitting elements 23 is the second largest. The total amount of heat generated in the plurality of light emitting elements 24 is the smallest. In this case, the surface of the substrate 10 (base 11a) opposite to the side on which the light emitting unit 20 is provided is attached to the lamp case 111 of the lighting device 100. Therefore, the heat generated in the light emitting elements 21 to 24 is mainly radiated to the outside from the surface of the substrate 10 (base 11a) opposite to the side on which the light emitting section 20 is provided.

  According to the present embodiment, a part of the heat generated in the plurality of light emitting elements 21 and having the largest total amount is transferred to the base 11a via the mounting pad 12a1, the conductive via 12a2, and the wiring portion 12a3, It is released to the outside via 11a. Since the mounting pad 12a1, the conductive via 12a2, and the wiring portion 12a3 are formed of metal or the like, their thermal conductivity is lower than that of the bases 11b to 11d. Therefore, the heat generated in the plurality of light emitting elements 21 can be efficiently radiated to the outside.

  A part of the heat generated in the plurality of light emitting elements 22 and having the second largest total amount is transmitted to the base body 11b through the mounting pad 12b1, the conductive via 12b2, and the wiring portion 12b3, and through the base body 11b and the base body 11a. Is released to the outside. Since the mounting pad 12b1, the conductive via 12b2, and the wiring portion 12b3 are made of metal or the like, their thermal conductivity is lower than that of the bases 11c and 11d. Therefore, the heat generated in the plurality of light emitting elements 22 can be efficiently radiated to the outside.

  A part of the heat generated in the plurality of light emitting elements 23 and having the second largest total amount is transmitted to the base 11c via the mounting pad 12c1, the conductive via 12c2, and the wiring portion 12c3, and the base 11c, the base 11b, and It is released to the outside through the base 11a. Since the mounting pad 12c1, the conductive via 12c2, and the wiring portion 12c3 are made of metal or the like, their thermal conductivity is lower than that of the base 11d. Therefore, the heat generated in the plurality of light emitting elements 23 can be efficiently radiated to the outside.

  A part of the heat generated in the plurality of light emitting elements 24 and having the smallest total amount is radiated to the outside through the bases 11a to 11d.

  The total amount of heat generated by the plurality of light emitting elements 23 is substantially the same as the total amount of heat generated by the plurality of light emitting elements 22. Therefore, from the viewpoint of heat dissipation only, the plurality of light emitting elements 22 may be connected to the wiring pattern 12c and the plurality of light emitting elements 23 may be connected to the wiring pattern 12b.

  Here, in the case where the light emitting element 22 is a light emitting element that emits red light, the light emission efficiency is reduced and the color is changed as the temperature rises. In the case where the light emitting element 23 is a light emitting element that emits green light, the color changes as the temperature rises. Therefore, in order to reduce the change in brightness, it is preferable to connect the light emitting element 22 having a larger decrease in light emission efficiency to the wiring pattern 12b. Also, humans perceive the change in color of green light to be larger than the change in color of red light. Therefore, in order to suppress the change in the color of light, it is preferable to connect the light emitting element 23 that feels the change in the color of light to the wiring pattern 12b.

  In the case where the light emitting element 24 is a light emitting element that emits blue light, there is little change in color due to temperature rise. Further, a light emitting element that emits blue light has high emission efficiency. Therefore, even if the heat generated in the plurality of light emitting elements 24 is dissipated through the bases 11a to 11d, there is less possibility that a defect will occur.

  Further, as shown in FIG. 1, the cross-sectional dimension (thickness) of the conductive via 12a2 in the direction orthogonal to the thickness direction of the base can be maximized. The cross-sectional dimension of the conductive via 12b2 can be made the second longest. The cross-sectional dimension of the conductive via 12c2 can be made third longest. Note that the conductive via 12a2 may have the longest cross-sectional dimension, and the conductive via 12b2 and the conductive via 12c2 may have approximately the same cross-sectional dimension. That is, it suffices that the conductive via 12a2 has the longest cross-sectional dimension. The area of the wiring portion 12a3 can be maximized by increasing the line width of the wiring portion 12a3. The area of the wiring portion 12b3 can be second largest. The area of the wiring portion 12c3 can be made third largest. The area of the wiring portion 12a3 may be the largest, and the area of the wiring portion 12b3 and the area of the wiring portion 12c3 may be approximately the same. That is, it suffices if the area of the wiring portion 12a3 is the largest. By doing so, a part of the heat generated in the plurality of light emitting elements 21 and having the largest total amount can be efficiently radiated to the outside.

  As described above, according to the present embodiment, the wiring pattern 12a on the substrate 10 can be simplified and the light emitting elements 21 to 24 can be simplified even when a plurality of types of light emitting elements 21 to 24 are densely packed. It is possible to suppress the temperature rise.

  Further, in the upper and lower electrode type light emitting element, the light emitting layer for generating light can be provided inside the light emitting element on the side (upper side) opposite to the substrate 10 side. In the flip-chip type light emitting device, the light emitting layer that generates light can be provided on the substrate 10 side (lower side) inside the light emitting device. In this case, the light emitting layer becomes a heat source. Therefore, from the viewpoint of heat dissipation, it is preferable to use a flip-chip type light emitting element.

However, when the light emitting layer is provided on the substrate 10 side inside the light emitting element, light is easily irradiated from the side surface of the light emitting element. When the light is emitted from the side surface of the light emitting element, the light may be incident on the wavelength conversion section provided in the adjacent light emitting element, and the color of the light emitted from the adjacent light emitting element may change. As the plurality of light emitting elements are densely packed, for example, the total number of light emitting elements mounted on the area of the sealing portion 40 is 0.25 / mm ² or more, and particularly 0.35 / mm ² or more. In this case, since the distance between the adjacent light emitting elements is narrowed, the light of the adjacent light emitting elements is likely to enter the phosphor layer, and the color change of the light may be increased.
In this case, in the upper and lower electrode type light emitting element, since the light emitting layer is provided on the upper side inside the light emitting element, it is difficult for the side surface of the light emitting element to be irradiated with light. Therefore, from the viewpoint of suppressing the change in color of light, it is preferable to use the upper and lower electrode type light emitting elements.

  Here, since the red light has a long wavelength, even if the red light is incident on the wavelength conversion section provided in the adjacent light emitting element, the color of the light is unlikely to change. Therefore, the light emitting element 22 that emits reddish light whose brightness is apt to change due to temperature rise is a flip chip type light emitting element. The light emitting elements 21, 23, 24 for irradiating light of other colors are upper and lower electrode type light emitting elements. By doing so, it is possible to improve the heat dissipation of the light emitting device 1 and suppress the change in the color of light.

  The frame portion 30 has a frame shape. The frame portion 30 is provided on the surface of the substrate 10 (base body 11d) on the side where the light emitting portion 20 is provided. The frame section 30 is provided so as to surround the light emitting section 20. The frame portion 30 can be formed of, for example, a resin such as PBT (polybutylene terephthalate) or PC (polycarbonate), or ceramics.

  When the material of the frame portion 30 is resin, particles such as titanium oxide can be mixed to improve the reflectance with respect to the light emitted from the light emitting elements 21 to 24. Note that the particles are not limited to titanium oxide particles, and particles made of a material having a high reflectance with respect to the light emitted from the light emitting elements 21 to 24 may be mixed. The frame portion 30 can also be formed of, for example, white resin. That is, the frame portion 30 can have both the function of defining the region where the sealing portion 40 is formed and the function of the reflector. It should be noted that the shape of the frame portion 30 is not limited to the illustrated one, and can be appropriately changed.

  The sealing section 40 is provided inside the frame section 30. The sealing section 40 is provided so as to cover the light emitting section 20. The sealing portion 40 is made of a light-transmitting material. The sealing section 40 can be formed of, for example, a silicone resin. The sealing portion 40 can be formed, for example, by filling the inside of the frame portion 30 with resin. The filling of the resin can be performed using, for example, a liquid constant-volume discharge device such as a dispenser.

Next, the illumination device 100 according to the present embodiment will be illustrated.
FIG. 2 is a schematic cross-sectional view for illustrating the lighting device 100 according to the present embodiment.
The lighting device 100 illustrated in FIG. 2 is a floodlight installed in a building, a stadium, or the like. Note that the lighting device 100 according to the present embodiment is not limited to the floodlight. The illumination device 100 may be any device that can emit full-color light.
As shown in FIG. 2, the illumination device 100 is provided with an irradiation unit 110 and a light source unit 120.

  The irradiation unit 110 has a housing 111 and a reflector 112. The housing 111 has a box shape. The housing 111 can be formed of, for example, an aluminum alloy. The end of the housing 111 opposite to the light source 120 side is open. This opening is closed by a transparent cover (not shown). A hole 111a is provided at the end of the housing 111 on the light source 120 side.

  The reflector 112 is provided inside the housing 111. A flange 112a that projects outward is provided at an end of the reflector 112 opposite to the light source 120 side. The flange 112a is fixed to a mounting plate (not shown) provided on the inner wall of the housing 111.

  The reflector 112 can be a tubular body with both ends open. The reflector 112 has a form in which the cross-sectional dimension gradually decreases toward the light source unit 120 side. The inner surface of the reflector 112 is a mirror surface. The end of the reflector 112 on the light source 120 side is provided inside the hole 111a. An end of the reflector 112 on the light source 120 side is provided at a position facing the light emitting device 1. Note that a hemispherical lens, for example, may be arranged at the light emitting portion of the light emitting device 1 to the reflector 112. As a result, it is possible to improve the efficiency of entering the light emitted from the light emitting device 1. Further, by diffusing the light emitting surface of the lens or attaching a diffusion sheet, it is possible to diffuse the emitted light of the light emitting elements of each color arranged on the substrate so as to suppress the occurrence of color unevenness. be able to.

  The light source section 120 includes the light emitting device 1, a housing 121, a mounting section 122, a heat radiating section 123, a packing 124, a heat radiating fin 125, and a heat pipe 126. The housing 121 has a box shape. The housing 121 can be formed of, for example, an aluminum alloy. A hole is provided at the end of the housing 121 on the irradiation unit 110 side. Inside the hole, the light emitting device 1 attached to the attaching portion 122 is provided. That is, the light emitting device 1 is housed in the housing 121.

  The mounting portion 122 has a plate shape. The mounting portion 122 can be formed of, for example, an aluminum alloy. The attachment portion 122 is attached to the heat dissipation portion 123 using a fastening member such as a screw. A recess is provided on the end surface of the mounting portion 122 on the irradiation portion 110 side. The light emitting device 1 is mounted inside the recess.

  The heat dissipation part 123 has a plate shape. The heat dissipation part 123 can be formed of, for example, an aluminum alloy. The heat dissipation part 123 is attached to the inside of the housing 121 using a fastening member such as a screw (not shown). The packing 124 has an annular shape. The packing 124 is provided between the heat dissipation portion 123 and the inner wall surface of the housing 121.

  The heat radiation fin 125 has a thin plate shape. A plurality of heat radiation fins 125 are provided. The radiation fin 125 can be formed of, for example, an aluminum alloy. The radiating fins 125 are provided on the surface of the radiating portion 123 opposite to the side on which the mounting portion 122 is provided.

  The heat pipe 126 is provided between the heat dissipation portion 123 and the heat dissipation fin 125. A plurality of heat pipes 126 can be provided. In addition, a control device (not shown) for controlling the light emitting device 1 can be provided. For example, the control device controls the electric power supplied to each of the light emitting elements 21 to 24 to control the light emission output of each of the light emitting elements 21 to 24. Further, the control device controls lighting and extinguishing of each of the light emitting elements 21 to 24.

  Although some embodiments of the present invention have been illustrated above, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the spirit of the invention. These embodiments and their modifications are included in the scope and gist of the invention, and are also included in the invention described in the claims and the scope equivalent thereto. Further, the above-described respective embodiments can be implemented in combination with each other.

  1 light emitting device, 10 substrate, 11a to 11d base, 12a to 12d wiring pattern, 12a1 mounting pad, 12a2 conductive via, 12a3 wiring part, 12a4 input terminal, 12b1 mounting pad, 12b2 conductive via, 12b3 wiring part, 12b4 input terminal, 12c1 mounting pad, 12c2 conductive via, 12c3 wiring part, 12c4 input terminal, 12d1 mounting pad, 12d3 wiring part, 12d4 input terminal, 20 light emitting part, 21 light emitting element, 21a wiring, 22 light emitting element, 23 light emitting element, 23a wiring, 24 light emitting element, 24a wiring, 30 frame part, 40 sealing part, 100 lighting device, 110 irradiation part, 120 light source part, 121 case

Claims (7)

A first substrate;
A second substrate provided on the first substrate;
A third substrate provided on the second substrate;
A fourth substrate provided on the third substrate;
A first wiring portion provided between the first base and the second base;
A second wiring portion provided between the second base and the third base;
A third wiring portion provided between the third base and the fourth base;
A fourth wiring portion provided on the surface of the fourth base opposite to the side on which the third base is provided;
The first base is provided on the surface of the fourth base opposite to the side on which the third base is provided , emits light of the first color, and is electrically connected to the first wiring portion. With a light emitting element of;
It is provided on a surface of the fourth base opposite to the side on which the third base is provided , irradiates light of a second color different from the first color, and the second wiring portion and A second light emitting element electrically connected to one of the third wiring portions;
Is provided on a surface of the fourth base opposite to the side on which the third base is provided , and irradiates light of a third color different from the first color and the second color, A third light emitting element electrically connected to the other of the second wiring portion and the third wiring portion;
A fourth color that is provided on the surface of the fourth base opposite to the side on which the third base is provided , and that is different from the first color, the second color, and the third color. And a fourth light emitting element electrically connected to the fourth wiring part;
A first conductive via penetrating the fourth substrate in the thickness direction and having one end electrically connected to the third wiring portion;
A second conductive via that penetrates the third base and the fourth base in the thickness direction and has one end electrically connected to the second wiring portion;
A direction that penetrates the second base, the third base, and the fourth base in the thickness direction, and has one end electrically connected to the first wiring part and orthogonal to the thickness direction. A third conductive via whose cross-sectional dimension at is longer than the cross-sectional dimension of the first conductive via;
A light-emitting device including. A first substrate;
A second substrate provided on the first substrate;
A third substrate provided on the second substrate;
A fourth substrate provided on the third substrate;
A first wiring portion provided between the first base and the second base;
A second wiring portion provided between the second base and the third base;
A third wiring portion provided between the third base and the fourth base;
A fourth wiring part provided on the surface of the fourth base opposite to the side on which the third base is provided;
The first base is provided on the surface of the fourth base opposite to the side on which the third base is provided , emits light of the first color, and is electrically connected to the first wiring portion. With a light emitting element of;
It is provided on a surface of the fourth base opposite to the side on which the third base is provided , irradiates light of a second color different from the first color, and the second wiring portion and Second light-emitting elements that are electrically connected to any one of the third wiring portions and are smaller in number than the first light-emitting elements;
Is provided on a surface of the fourth base opposite to the side on which the third base is provided , and irradiates light of a third color different from the first color and the second color, A third light emitting element electrically connected to the other of the second wiring portion and the third wiring portion, the number of third light emitting elements being smaller than the number of the first light emitting elements;
A fourth color that is provided on the surface of the fourth base opposite to the side on which the third base is provided , and that is different from the first color, the second color, and the third color. irradiated with light, and the fourth is electrically connected to the wiring portion, the number of second light emitting element, and the third number less than the number of light emitting elements of the fourth light-emitting element;
A light-emitting device including. A first substrate;
A second substrate provided on the first substrate;
A third substrate provided on the second substrate;
A fourth substrate provided on the third substrate;
A first wiring portion provided between the first base and the second base;
A second wiring portion provided between the second base and the third base;
A third wiring portion provided between the third base and the fourth base;
A fourth wiring portion provided on the surface of the fourth base opposite to the side on which the third base is provided;
A first light-emitting element which is irradiated with light of a first color and is provided on the surface of the fourth base opposite to the side on which the third base is provided;
A second light-emitting element that emits light of a second color different from the first color, and is provided on the surface of the fourth base opposite to the side on which the third base is provided;
The third color light different from the first color and the second color is irradiated, and the light is provided on the surface of the fourth base opposite to the side on which the third base is provided. A third light emitting element;
The side of the fourth base opposite to the side on which the third base is provided by irradiating light of a fourth color different from the first color, the second color, and the third color. A fourth light emitting element provided on the surface of;
Equipped with,
Of the four types of light emitting elements, the first light emitting element, the second light emitting element, the third light emitting element, and the fourth light emitting element, the light emitting element having the largest number is the first wiring. Electrically connected to the
Of the remaining three types of light emitting elements, one of the two types of light emitting elements whose luminous efficiency further decreases with temperature rise or whose color changes more with temperature rise is electrically connected to the second wiring portion. And the other is electrically connected to the third wiring portion,
A light emitting device in which the remaining one type of light emitting element is electrically connected to the fourth wiring portion. A first conductive via that penetrates the fourth base in the thickness direction and has one end electrically connected to the third wiring portion;
A second conductive via that penetrates the third base and the fourth base in the thickness direction and has one end electrically connected to the second wiring portion;
A direction that penetrates the second base, the third base, and the fourth base in the thickness direction, and has one end electrically connected to the first wiring part and orthogonal to the thickness direction. A third conductive via whose cross-sectional dimension at is longer than the cross-sectional dimension of the first conductive via;
The light emitting device according to claim 2 , further comprising: The light emitting device according to claim 1, wherein an area of the first wiring portion is larger than an area of the third wiring portion. The number of the first light emitting elements provided on the fourth base is larger than the number of the second and third light emitting elements, and the number of the fourth light emitting elements is the number of the second and third light emitting elements. The light emitting device according to claim 1 , wherein the number of light emitting elements is less than the number of light emitting elements. A light emitting device according to any one of claims 1 to 6;
A housing for housing the light emitting device;
A lighting device equipped with.

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