JP2017063073A - Light emitting device and luminaire - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light emitting device and a luminaire that enable suppression of variation of light color and enhancement of heat radiation performance even when plural kinds of light emitting elements are congested.SOLUTION: A light emitting device includes a substrate, a flip-chip type first light emitting element which is provided to one surface of the substrate and applies red color type light, and an up-and-down electrode type second light emitting element that is provided to a surface of the substrate on which the first light emitting element is provided, has a wavelength converter which contains a phosphor material and is provided to the surface at the opposite side to the substrate side, and applies white color type light. A light emitting layer of the first light emitting element is provided on the substrate side inside the first light emitting element, and a light emitting layer of the second light emitting element is provided on the side opposite to the substrate side in the second light emitting element.SELECTED DRAWING: Figure 1

Description

  Embodiments described herein relate generally to a light emitting device and a lighting device.

  There is a light emitting device including a plurality of types of light emitting elements having different colors of light to be irradiated. Such a light emitting device can emit light of all colors (full color) by individually controlling the light emitting elements to be lit. Here, there are various types of light emitting elements. For example, types of light emitting chips include face-up type, upper and lower electrode type, and flip chip type. In addition, among light emitting elements that generate similar colors, there are ones that generate color by a single light emitting chip and those that generate color by a combination of a light emitting chip and a phosphor. These can be combined according to use and purpose.

JP 2013-73983 A

  The problem to be solved by the present invention is to provide a light emitting device and a lighting device capable of suppressing change in light color and improving heat dissipation even when a plurality of types of light emitting elements are densely packed. It is to be.

  A light emitting device according to an embodiment includes a substrate; a flip chip type first light emitting element that is provided on one surface of the substrate and emits red light; and the first light emitting element of the substrate is provided. An upper and lower electrode type second light emitting element that includes a phosphor and includes a wavelength conversion unit that is provided on a surface opposite to the substrate side and that emits white light; It has. The light emitting layer included in the first light emitting element is provided on the substrate side inside the first light emitting element, and the light emitting layer included in the second light emitting element is formed inside the second light emitting element. It is provided on the side opposite to the substrate side.

  According to the embodiments of the present invention, there are provided a light emitting device and a lighting device capable of suppressing a change in light color and improving heat dissipation even when a plurality of types of light emitting elements are densely packed. be able to.

1 is a schematic cross-sectional view for illustrating a light emitting device 1 according to an embodiment. It is a schematic cross section for illustrating the illuminating device 100 which concerns on this Embodiment.

The invention according to the embodiment includes a substrate; a flip chip type first light emitting element that is provided on one surface of the substrate and emits red light; and the first light emitting element of the substrate is provided. An upper and lower electrode type second light emitting element that includes a phosphor, includes a phosphor, has a wavelength conversion section provided on a surface opposite to the substrate side, and emits white light; The light emitting device. The light emitting layer included in the first light emitting element is provided on the substrate side inside the first light emitting element, and the light emitting layer included in the second light emitting element is formed inside the second light emitting element. It is provided on the side opposite to the substrate side.
According to this light-emitting device, even when a plurality of types of light-emitting elements are gathered together, it is possible to suppress changes in the color of light and improve heat dissipation. Moreover, it becomes difficult to irradiate light from the side surface of the second light emitting element. Therefore, it becomes difficult for light to enter the wavelength conversion unit provided in the adjacent light emitting element. As a result, the change in the color of light can be further suppressed. Furthermore, in the first light emitting element, the light emitting layer serving as a heat generation source can be brought close to the substrate. Therefore, the heat dissipation can be further improved. In this case, since red light has a long wavelength, even if red light is incident on a wavelength conversion unit provided in an adjacent light emitting element, there is little possibility that the color of the light changes.

The light emitting device may further include an upper and lower electrode type third light emitting element that is provided on a surface of the substrate on which the first light emitting element is provided and that emits blue light.
In this way, the types of colors to be irradiated can be increased.

The invention according to the embodiment includes: a substrate; provided on one surface of the substrate; a flip-chip type red light emitting element; provided on one surface of the substrate and including a phosphor, opposite to the substrate side An upper electrode type white light emitting element and an amber color light emitting element having a wavelength conversion portion provided on the side surface; an upper electrode type green light emitting element, a cyan color light emitting element, blue color provided on one surface of the substrate; A light emitting device comprising: a light emitting element;
According to this light-emitting device, even when a plurality of types of light-emitting elements are gathered together, it is possible to suppress changes in the color of light and improve heat dissipation.

The invention which concerns on embodiment is an illuminating device provided with said light-emitting device; The case in which the said light-emitting device is accommodated.
According to this illuminating device, even when a plurality of types of light emitting elements are densely packed, the temperature rise of the light emitting elements can be suppressed.

Hereinafter, embodiments will be illustrated with reference to the drawings. In addition, in each drawing, the same code | symbol is attached | subjected to the same component and detailed description is abbreviate | omitted suitably.
FIG. 1 is a schematic cross-sectional view for illustrating a light emitting device 1 according to the present embodiment.
As shown in FIG. 1, the light emitting device 1 includes a substrate 10, a light emitting unit 20, a frame unit 30, and a sealing unit 40.

The substrate 10 includes a base body 11a, a base body 11b, a base body 11c, a base body 11d, and wiring patterns 12a to 12d.
The bases 11a to 11d have a plate shape. The base body 11b is provided on one surface side of the base body 11a. The base 11c is provided on the side of the base 11b opposite to the side on which the base 11a is provided. The base 11d is provided on the side of the base 11c opposite to the side on which the base 11b is provided. That is, the bases 11a to 11d are stacked. The bases 11a to 11d are preferably formed using a material having high thermal conductivity. As a material having high thermal conductivity, for example, an inorganic material such as ceramics (for example, aluminum oxide or aluminum nitride) or a metal plate whose surface is covered with an insulating material can be used.
When the surface of the metal plate is covered with an insulating material, the insulating material may be made of an organic material or an inorganic material.

  The wiring pattern 12a includes a mounting pad 12a1, a conductive via 12a2, a wiring part 12a3, and an input terminal 12a4. The mounting pad 12a1 is provided on one surface of the substrate 10 (base 11d). The mounting pad 12 a 1 is provided inside the frame portion 30. The conductive via 12a2 penetrates the bases 11b to 11d in the thickness direction. One end of the conductive via 12a2 is electrically connected to the mounting pad 12a1 or the input terminal 12a4. The other end of the conductive via 12a2 is electrically connected to the wiring portion 12a3. One set of the mounting pad 12a1 and the conductive via 12a2 can be provided for one light emitting element 21 (corresponding to an example of a second light emitting element). The wiring part 12a3 is provided between the base body 11a and the base body 11b. In plan view, one end of the wiring portion 12 a 3 is provided inside the frame portion 30, and the other end of the wiring portion 12 a 3 is provided outside the frame portion 30. The input terminal 12a4 is provided on the surface of the substrate 10 (base 11d) on the side where the mounting pad 12a1 is provided. The input terminal 12a4 is provided outside the frame portion 30.

  The wiring pattern 12b includes a mounting pad 12b1, a conductive via 12b2, a wiring part 12b3, and an input terminal 12b4. The mounting pad 12b1 is provided on the surface of the substrate 10 (base 11d) on the side where the mounting pad 12a1 is provided. The mounting pad 12b1 is provided inside the frame portion 30. The conductive via 12b2 penetrates the bases 11c and 11d in the thickness direction. One end of the conductive via 12b2 is electrically connected to the mounting pad 12b1 or the input terminal 12b4. The other end of the conductive via 12b2 is electrically connected to the wiring portion 12b3. One set of the mounting pad 12b1 and the conductive via 12b2 can be provided for one light emitting element 22 (corresponding to an example of the first light emitting element). The wiring portion 12b3 is provided between the base body 11b and the base body 11c. In plan view, one end of the wiring portion 12 b 3 is provided inside the frame portion 30, and the other end of the wiring portion 12 b 3 is provided outside the frame portion 30. The input terminal 12b4 is provided on the surface of the substrate 10 (base 11d) on the side where the mounting pad 12b1 is provided. The input terminal 12b4 is provided outside the frame portion 30.

  The wiring pattern 12c includes a mounting pad 12c1, a conductive via 12c2, a wiring part 12c3, and an input terminal 12c4. The mounting pad 12c1 is provided on the surface of the substrate 10 (base 11d) on the side where the mounting pad 12a1 is provided. The mounting pad 12 c 1 is provided inside the frame portion 30. The conductive via 12c2 penetrates the base body 11d in the thickness direction. One end of the conductive via 12c2 is electrically connected to the mounting pad 12c1 or the input terminal 12c4. The other end of the conductive via 12c2 is electrically connected to the wiring portion 12c3. One set of the mounting pad 12c1 and the conductive via 12c2 can be provided for one light emitting element 23 (corresponding to an example of a second light emitting element). The wiring portion 12c3 is provided between the base body 11c and the base body 11d. In plan view, one end of the wiring portion 12 c 3 is provided inside the frame portion 30, and the other end of the wiring portion 12 c 3 is provided outside the frame portion 30. The input terminal 12c4 is provided on the surface of the substrate 10 (base 11d) on the side where the mounting pad 12c1 is provided. The input terminal 12c4 is provided outside the frame portion 30.

  The wiring pattern 12d has a mounting pad 12d1, a wiring part 12d3, and an input terminal 12d4. The mounting pad 12d1 is provided on the surface of the substrate 10 (base 11d) on the side where the mounting pad 12a1 is provided. The mounting pad 12d1 is provided inside the frame portion 30. One mounting pad 12d1 can be provided for one light emitting element 24 (corresponding to an example of a third light emitting element). The wiring portion 12d3 is provided on the surface of the substrate 10 (base 11d) on the side where the mounting pad 12a1 is provided. One end of the wiring portion 12d3 is electrically connected to each of the plurality of mounting pads 12a1 inside the frame portion 30. The other end of the wiring portion 12d3 is electrically connected to the input terminal 12d4 outside the frame portion 30. The input terminal 12d4 is provided on the surface of the substrate 10 (base 11d) on the side where the mounting pad 12d1 is provided. The input terminal 12d4 is provided outside the frame portion 30.

  A control device 112 provided outside the light emitting device 1 is electrically connected to the input terminals 12a4 to 12d4 (see, for example, FIG. 2). Therefore, by the control device 112, via the input terminals 12a4 to 12d4, a plurality of light emitting elements 21 electrically connected to the wiring pattern 12a, a plurality of light emitting elements 22 electrically connected to the wiring pattern 12b, and a wiring pattern Control can be performed for each of the plurality of light emitting elements 23 electrically connected to 12c and the plurality of light emitting elements 24 electrically connected to the wiring pattern 12d.

  The material of the wiring patterns 12a to 12d is not particularly limited as long as it is a conductive material. The material of the wiring patterns 12a to 12d can be a metal such as silver, copper, gold, or tungsten, for example. When the material of the bases 11a to 11d is ceramic, the substrate 10 can be formed using, for example, the LTCC (Low Temperature Co-fired Ceramics) method. For example, the board | substrate 10 can be formed by baking simultaneously the base | substrates 11a-11d and the wiring patterns 12a-12d at the temperature of 900 degrees C or less. When the material of the bases 11a to 11d is obtained by coating the surface of the metal plate with an insulating material, the substrate 10 uses, for example, the bases 11a to 11d on which the wiring patterns 12a to 12d are formed using an adhesive or the like. It can be formed by joining.

The light emitting unit 20 includes a light emitting element 21, a wiring 21a, a light emitting element 22, a light emitting element 23, a wiring 23a, a light emitting element 24, and a wiring 24a. The light emitting element 21 is mounted on the mounting pad 12a1 using a COB (Chip on Board) method. The light emitting element 21 may emit white light (for example, white or yellowish white).
The light emitting element 21 can include, for example, a blue light emitting element and a wavelength conversion unit including a phosphor that emits yellow fluorescence. In addition, a wavelength conversion part can be provided in the end surface on the opposite side to the board | substrate 10 side of a blue light emitting element. In this way, the blue light emitted from the blue light emitting element and the yellow light emitted from the phosphor are mixed together, so that white light is emitted from the light emitting element 21. In this case, the color of the irradiated light can be changed by adjusting the amount of the phosphor. For example, if the amount of the phosphor that emits yellow fluorescence is increased, yellowish white light can be irradiated.

  The light emitting element 21 can be a top and bottom electrode type light emitting element. The electrode (lower electrode) on the substrate 10 side of the light emitting element 21 is electrically connected to the mounting pad 12a1 via a conductive thermosetting material such as silver paste. One end of the wiring 21 a is electrically connected to an electrode (upper electrode) on the opposite side of the light emitting element 21 from the substrate 10 side. The other end of the wiring 21a is electrically connected to the mounting pad 12a1. That is, the upper electrode of the light emitting element 21 is electrically connected to the mounting pad 12a1 through the wiring 21a. The wiring 21a can be electrically connected to the upper electrode of the light emitting element 21 and the mounting pad 12a1, for example, using a wire bonding method.

  The light emitting element 22 is mounted on the mounting pad 12b1 using the COB method. The light emitting element 22 may emit red light (for example, red or amber). The light emitting element 22 can be, for example, a light emitting element that emits red light. Moreover, when irradiating red light, the light emitting element 22 can also have a blue light emitting element and the wavelength conversion part containing the fluorescent substance which radiates | emits red fluorescence, for example. In the case of irradiating amber light, the light emitting element 22 includes, for example, a blue light emitting element, and a wavelength conversion unit including a phosphor that emits red fluorescence and a phosphor that emits yellow fluorescence. You can also. In addition, a wavelength conversion part can be provided in the end surface on the opposite side to the board | substrate 10 side of a blue light emitting element. In this case, the color of the irradiated light can be changed by adjusting the amount of the phosphor. For example, if the amount of the phosphor is increased, most of the blue light emitted from the blue light emitting element can be converted into red light or amber light.

  The light emitting element 22 can be a flip chip type light emitting element. In this case, the electrode is provided on the end surface of the light emitting element 22 on the substrate 10 side. The electrode of the light emitting element 22 is electrically connected to the mounting pad 12b1 via a conductive thermosetting material such as silver paste or solder.

  The light emitting element 23 is mounted on the mounting pad 12c1 using the COB method. The light emitting element 23 can emit green light (for example, green or yellowish green). The light emitting element 23 can be, for example, a light emitting element that emits green light. Moreover, when irradiating green light, the light emitting element 23 can also have a blue light emitting element and the wavelength conversion part containing the fluorescent substance which radiates | emits green fluorescence, for example. In the case of irradiating yellow-green light, the light-emitting element 23 includes, for example, a blue light-emitting element, a phosphor that emits green fluorescence, and a wavelength conversion unit that includes a phosphor that emits yellow fluorescence. You can also In addition, a wavelength conversion part can be provided in the end surface on the opposite side to the board | substrate 10 side of a blue light emitting element. In this case, the color of the irradiated light can be changed by adjusting the amount of the phosphor. For example, if the amount of the phosphor is increased, most of the blue light emitted from the blue light emitting element can be converted into green light or yellow-green light.

  The light emitting element 23 can be an upper and lower electrode type light emitting element. The electrode (lower electrode) on the substrate 10 side of the light emitting element 23 is electrically connected to the mounting pad 12c1 via a conductive thermosetting material such as silver paste. One end of the wiring 23 a is electrically connected to an electrode (upper electrode) on the side opposite to the substrate 10 side of the light emitting element 23. The other end of the wiring 23a is electrically connected to the mounting pad 12c1. That is, the upper electrode of the light emitting element 23 is electrically connected to the mounting pad 12c1 through the wiring 23a. The wiring 23a can be electrically connected to the upper electrode of the light emitting element 23 and the mounting pad 12c1, for example, using a wire bonding method.

  The light emitting element 24 is mounted on the mounting pad 12d1 using the COB method. The light emitting element 24 can emit blue light (for example, blue, cyan, indigo, etc.). The light emitting element 24 can be, for example, a light emitting element that emits blue light. In the case of irradiating cyan light, the light emitting element 24 may include, for example, a blue light emitting element and a wavelength conversion unit including a phosphor that emits green fluorescence. In addition, a wavelength conversion part can be provided in the end surface on the opposite side to the board | substrate 10 side of a blue light emitting element. In this case, the color of the irradiated light can be changed by adjusting the amount of the phosphor. For example, the amount of phosphor can be adjusted so that blue light emitted from the blue light emitting element and green light emitted from the phosphor are mixed to emit cyan light. . For example, the light emitting unit is configured with seven colors including a red light emitting element, a green light emitting element, a blue light emitting element, an amber light emitting element, a cyan light emitting element, a white light emitting element, and a yellow green light emitting element. be able to.

  The light emitting element 24 can be a top and bottom electrode type light emitting element. The electrode (lower electrode) on the substrate 10 side of the light emitting element 24 is electrically connected to the mounting pad 12d1 via a conductive thermosetting material such as silver paste. One end of the wiring 24 a is electrically connected to an electrode (upper electrode) on the side opposite to the substrate 10 side of the light emitting element 24. The other end of the wiring 24a is electrically connected to the mounting pad 12d1. That is, the upper electrode of the light emitting element 24 is electrically connected to the mounting pad 12d1 through the wiring 24a. The wiring 24a can be electrically connected to the upper electrode of the light emitting element 24 and the mounting pad 12d1, for example, using a wire bonding method.

  Here, according to the knowledge obtained by the present inventors, when the light-emitting device 1 emits full-color light, the number of light-emitting elements 21 that emit white light is the largest. The number of light emitting elements 22 that emit red light and the number of light emitting elements 23 that emit green light are the second largest. The number of light emitting elements 24 that emit blue light is the smallest. Therefore, the total amount of heat generated in the plurality of light emitting elements 21 is the largest. The total amount of heat generated in the plurality of light emitting elements 22 or the plurality of light emitting elements 23 is second largest. The total amount of heat generated in the plurality of light emitting elements 24 is the smallest. In this case, the surface of the substrate 10 (base 11 a) opposite to the side where the light emitting unit 20 is provided is attached to the lamp case 111 of the lighting device 100. Therefore, the heat generated in the light emitting elements 21 to 24 is released to the outside mainly from the surface of the substrate 10 (base 11a) opposite to the side where the light emitting unit 20 is provided.

  According to the present embodiment, a part of the heat generated in the plurality of light emitting elements 21 and having the largest total amount is transmitted to the base body 11a via the mounting pad 12a1, the conductive via 12a2, and the wiring part 12a3. It is discharged to the outside through 11a. Since the mounting pad 12a1, the conductive via 12a2, and the wiring portion 12a3 are made of metal or the like, their thermal conductivities are lower than the thermal conductivities of the substrates 11b to 11d. Therefore, the heat generated in the plurality of light emitting elements 21 can be efficiently released to the outside.

  A part of the heat generated in the plurality of light emitting elements 22 and having the second largest amount is transmitted to the base body 11b through the mounting pad 12b1, the conductive via 12b2, and the wiring part 12b3, and is transmitted through the base body 11b and the base body 11a. Released to the outside. Since the mounting pad 12b1, the conductive via 12b2, and the wiring portion 12b3 are made of metal or the like, their thermal conductivities are lower than the thermal conductivities of the substrates 11c and 11d. Therefore, heat generated in the plurality of light emitting elements 22 can be efficiently released to the outside.

  Part of the heat generated in the plurality of light emitting elements 23 and having the second largest amount is transmitted to the base 11c via the mounting pad 12c1, the conductive via 12c2, and the wiring portion 12c3, and the base 11c, the base 11b, and It is discharged to the outside through the substrate 11a. Since the mounting pad 12c1, the conductive via 12c2, and the wiring portion 12c3 are made of metal or the like, their thermal conductivity is lower than that of the base 11d. Therefore, the heat generated in the plurality of light emitting elements 23 can be efficiently released to the outside.

  Part of the heat generated in the plurality of light emitting elements 24 and having the smallest total amount is released to the outside through the bases 11a to 11d.

  Note that the total amount of heat generated in the plurality of light emitting elements 23 is substantially the same as the total amount of heat generated in the plurality of light emitting elements 22. Therefore, from the standpoint of heat dissipation, the plurality of light emitting elements 22 may be connected to the wiring pattern 12c and the plurality of light emitting elements 23 may be connected to the wiring pattern 12b.

  Here, in the case where the light emitting element 22 is a light emitting element that emits red light, as the temperature rises, the light emission efficiency decreases and the color changes. In the case where the light emitting element 23 is a light emitting element that emits green light, a color change occurs as the temperature rises. For this reason, in order to reduce the change in brightness, it is preferable to connect the light emitting element 22 having a greater decrease in light emission efficiency to the wiring pattern 12b. In addition, humans feel a change in the color of green light greater than a change in the color of red light. Therefore, in order to suppress the change in the color of light, it is preferable to connect the light emitting element 23 that feels the change in the color of light to the wiring pattern 12b.

  Note that when the light emitting element 24 is a light emitting element that emits blue light, there is little change in color due to a temperature rise. In addition, a light-emitting element that emits blue light has high emission efficiency. For this reason, there is little risk of occurrence of trouble even if heat generated in the plurality of light emitting elements 24 is radiated through the bases 11a to 11d.

  Moreover, as shown in FIG. 1, the cross-sectional dimension (thickness) in the direction orthogonal to the thickness direction of a base | substrate of the conductive via 12a2 can be made the longest. The cross-sectional dimension of the conductive via 12b2 can be increased second. The cross-sectional dimension of the conductive via 12c2 can be increased to the third. The cross-sectional dimension of the conductive via 12a2 may be the longest, and the cross-sectional dimension of the conductive via 12b2 and the cross-sectional dimension of the conductive via 12c2 may be approximately the same. That is, the conductive via 12a2 only needs to have the longest cross-sectional dimension. Further, the area of the wiring part 12a3 can be maximized by increasing the line width of the wiring part 12a3. The area of the wiring part 12b3 can be increased second. The area of the wiring part 12c3 can be increased third. The area of the wiring part 12a3 may be the largest, and the area of the wiring part 12b3 and the area of the wiring part 12c3 may be approximately the same. That is, it is only necessary that the area of the wiring portion 12a3 is the largest. In this way, a part of the heat generated in the plurality of light emitting elements 21 and having the largest total amount can be efficiently released to the outside.

  As described above, according to the present embodiment, the wiring pattern 12a on the substrate 10 can be simplified and the light emitting elements 21 to 24 can be simplified even when a plurality of types of light emitting elements 21 to 24 are densely packed. Temperature rise can be suppressed.

  In the upper and lower electrode type light emitting element, the light emitting layer for generating light can be provided on the side (upper side) opposite to the substrate 10 side in the light emitting element. In the flip-chip type light emitting element, a light emitting layer for generating light can be provided on the substrate 10 side (lower side) inside the light emitting element. In this case, the light emitting layer serves as a heat source. Therefore, from the viewpoint of heat dissipation, a flip-chip light emitting element is preferable.

However, when the light emitting layer is provided on the substrate 10 side inside the light emitting element, light is easily irradiated from the side surface of the light emitting element. When light is irradiated from the side surface of the light emitting element, the light may be incident on the wavelength conversion unit provided in the adjacent light emitting element, and the color of the light irradiated from the adjacent light emitting element may change. Then, as the plurality of light emitting elements are densely packed, for example, the total number of light emitting elements mounted on the area of the sealing portion 40 is 0.25 / mm ² or more, particularly 0.35 / mm ² or more. In this case, since the distance between the adjacent light emitting elements becomes narrow, the light of the adjacent light emitting elements is likely to enter the phosphor layer, and the change in the color of the light may be increased.
In this case, since the upper and lower electrode type light emitting elements are provided with the light emitting layer on the upper side inside the light emitting elements, it is difficult to irradiate light from the side surfaces of the light emitting elements. Therefore, from the viewpoint of suppressing a change in the color of light, it is preferable that the light emitting element is an upper and lower electrode type.

  Here, since red light has a long wavelength, even if red light is incident on a wavelength conversion unit provided in an adjacent light emitting element, there is little possibility that the color of the light changes. Therefore, the light-emitting element 22 that emits red light that easily changes in brightness due to temperature rise is a flip-chip light-emitting element. The light emitting elements 21, 23, and 24 that emit light of other colors are upper and lower electrode type light emitting elements. In this way, it is possible to improve heat dissipation in the light emitting device 1 and to suppress changes in the color of light.

  The frame part 30 has a frame shape. The frame part 30 is provided on the surface of the substrate 10 (base 11d) on the side where the light emitting part 20 is provided. The frame part 30 is provided so as to surround the light emitting part 20. The frame portion 30 can be formed of, for example, a resin such as PBT (polybutylene terephthalate) or PC (polycarbonate), ceramics, or the like.

  When the material of the frame part 30 is a resin, particles made of titanium oxide or the like can be mixed to improve the reflectance with respect to the light emitted from the light emitting elements 21 to 24. Note that the particles are not limited to titanium oxide particles, and particles made of a material having a high reflectivity with respect to light emitted from the light emitting elements 21 to 24 may be mixed. Moreover, the frame part 30 can also be formed from white resin, for example. That is, the frame part 30 can have both the function of defining the region where the sealing part 40 is formed and the function of the reflector. In addition, the shape of the frame part 30 is not necessarily limited to what was illustrated, and can be changed suitably.

  The sealing part 40 is provided inside the frame part 30. The sealing unit 40 is provided so as to cover the light emitting unit 20. The sealing part 40 is formed from a material having translucency. The sealing part 40 can be formed from, for example, a silicone resin. The sealing part 40 can be formed by filling the inside of the frame part 30 with resin, for example. The filling of the resin can be performed using, for example, a liquid dispensing apparatus such as a dispenser.

Next, the illumination device 100 according to the present embodiment is illustrated.
FIG. 2 is a schematic cross-sectional view for illustrating the lighting device 100 according to the present embodiment.
The lighting device 100 illustrated in FIG. 2 is a projector installed in a building or a stadium. In addition, the illuminating device 100 which concerns on this Embodiment is not necessarily limited to a projector. The illuminating device 100 should just be what can irradiate full color light. As shown in FIG. 2, the illumination device 100 is provided with an irradiation unit 110 and a light source unit 120.

  The irradiation unit 110 includes a housing 111 and a reflector 112. The casing 111 has a box shape. The casing 111 can be formed from, for example, an aluminum alloy. The end of the casing 111 opposite to the light source 120 side is open. This opening is closed by a translucent cover (not shown). A hole 111 a is provided at the end of the housing 111 on the light source unit 120 side.

  The reflector 112 is provided inside the housing 111. A flange 112a protruding outward is provided at the end of the reflector 112 opposite to the light source 120 side. The flange 112 a is fixed to a mounting plate (not shown) provided on the inner wall of the housing 111.

  The reflector 112 can be a cylindrical body having both ends opened. The reflector 112 has a form in which the cross-sectional dimension gradually decreases toward the light source unit 120 side. The inner surface of the reflector 112 is a mirror surface. The end of the reflector 112 on the light source unit 120 side is provided inside the hole 111a. The end of the reflector 112 on the light source unit 120 side is provided at a position facing the light emitting device 1. Note that, for example, a hemispherical lens may be disposed in the light output portion of the light emitting device 1 to the reflector 112. Thereby, the light incident efficiency of the emitted light of the light-emitting device 1 can be improved. In addition, the light emission surface of the lens can be diffused or a diffusion sheet can be attached to diffuse the light emitted from the light emitting elements of a plurality of colors that are spaced apart on the substrate, thereby suppressing color unevenness. be able to.

  The light source unit 120 includes the light emitting device 1, the housing 121, the mounting unit 122, the heat radiating unit 123, the packing 124, the heat radiating fins 125, and the heat pipe 126. The housing 121 has a box shape. The housing 121 can be formed from, for example, an aluminum alloy. A hole is provided at the end of the housing 121 on the irradiation unit 110 side. Inside the hole portion, the light emitting device 1 attached to the attachment portion 122 is provided. That is, the light emitting device 1 is housed in the housing 121.

  The attachment portion 122 has a plate shape. The attachment portion 122 can be formed from, for example, an aluminum alloy. The attachment portion 122 is attached to the heat dissipation portion 123 using a fastening member such as a screw. A concave portion is provided on the end surface of the mounting portion 122 on the irradiation unit 110 side. The light emitting device 1 is attached inside the recess.

  The heat dissipation part 123 has a plate shape. The heat dissipation part 123 can be formed from, for example, an aluminum alloy. The heat radiating part 123 is attached to the inside of the housing 121 using a fastening member such as a screw (not shown). The packing 124 has an annular shape. The packing 124 is provided between the heat radiating portion 123 and the inner wall surface of the housing 121.

  The radiation fin 125 has a thin plate shape. A plurality of radiating fins 125 are provided. The heat radiation fins 125 can be formed from, for example, an aluminum alloy. The heat radiating fins 125 are provided on the surface of the heat radiating portion 123 opposite to the side on which the mounting portion 122 is provided.

  The heat pipe 126 is provided between the heat radiating part 123 and the heat radiating fins 125. A plurality of heat pipes 126 can be provided. In addition, a control device (not shown) for controlling the light emitting device 1 can be provided. For example, the control device controls the power supplied to each of the light emitting elements 21 to 24 to control the light emission output for each of the light emitting elements 21 to 24. Moreover, a control apparatus controls lighting and light extinction for every light emitting elements 21-24.

  As mentioned above, although several embodiment of this invention was illustrated, these embodiment is shown as an example and is not intending limiting the range of invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, changes, and the like can be made without departing from the spirit of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and equivalents thereof. Further, the above-described embodiments can be implemented in combination with each other.

  DESCRIPTION OF SYMBOLS 1 Light-emitting device, 10 board | substrate, 11a-11d base | substrate, 12a-12d wiring pattern, 12a1 mounting pad, 12a2 conductive via, 12a3 wiring part, 12a4 input terminal, 12b1 mounting pad, 12b2 conductive via, 12b3 wiring part, 12b4 input terminal, 12c1 mounting pad, 12c2 conductive via, 12c3 wiring part, 12c4 input terminal, 12d1 mounting pad, 12d3 wiring part, 12d4 input terminal, 20 light emitting part, 21 light emitting element, 21a wiring, 22 light emitting element, 23 light emitting element, 23a wiring, 24 light emitting element, 24a wiring, 30 frame part, 40 sealing part, 100 illumination device, 110 irradiation part, 120 light source part, 121 housing

Claims (4)

A substrate;
A flip-chip type first light emitting element that is provided on one surface of the substrate and emits red light;
Upper and lower surfaces that are provided on a surface of the substrate on which the first light emitting element is provided, include a phosphor, have a wavelength conversion unit provided on a surface opposite to the substrate side, and irradiate white light. An electrode-type second light-emitting element;
Comprising
The light-emitting layer of the first light-emitting element is provided on the substrate side inside the first light-emitting element,
The light emitting layer which the said 2nd light emitting element has is a light emitting device provided in the opposite side to the said substrate side inside the said 2nd light emitting element.   2. The light emitting device according to claim 1, further comprising an upper and lower electrode type third light emitting element that is provided on a surface of the substrate on which the first light emitting element is provided and irradiates blue light. A substrate;
A flip-chip type red light emitting element provided on one surface of the substrate;
An upper and lower electrode type white light-emitting element and amber light-emitting element provided on one surface of the substrate, including a phosphor, and having a wavelength conversion portion provided on a surface opposite to the substrate;
An upper and lower electrode type green light emitting element, cyan light emitting element, and blue light emitting element provided on one surface of the substrate;
A light emitting device comprising: A light emitting device according to any one of claims 1 to 3;
A housing for storing the light emitting device;
A lighting device comprising:

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