CN104832800A - Light source for illumination and lighting apparatus - Google Patents

Light source for illumination and lighting apparatus Download PDF

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Publication number
CN104832800A
CN104832800A CN201510053522.2A CN201510053522A CN104832800A CN 104832800 A CN104832800 A CN 104832800A CN 201510053522 A CN201510053522 A CN 201510053522A CN 104832800 A CN104832800 A CN 104832800A
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China
Prior art keywords
lamp holder
heat
led
framework
circuit block
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Granted
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CN201510053522.2A
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Chinese (zh)
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CN104832800B (en
Inventor
中村康一
高桥健治
木部真树
岩崎隆之
若宫彰人
北冈信一
八木裕司
北川浩规
畑冈真一郎
松本雅人
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Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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Publication of CN104832800A publication Critical patent/CN104832800A/en
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Abstract

The invention discloses a straight LED lamp (1) that can inhibit the LED elements worsening because of heating of the circuit part. The LED lamp comprises a thin and long frame (20); a luminescent module (100), and multiple LED elements (120) are set inside the frame (20); a lamp holder (30) that is set at the end of the frame (20) in length direction for receiving power that drives the multiple LED elements (120) luminescent; circuit parts (131, 132) that are set inside the lamp holder (30) and are used to supply the power received by the lamp holder (30) to the multiple LED elements (120); and a heat conductive member (60) that covers the circuit parts (131, 132) and is in contact with the circuit parts (131, 132) and the lamp holder (30).

Description

Illumination light source and lighting device
Technical field
The present invention relates to illumination light source and lighting device, such as, relate to the illumination light source and lighting device with light-emitting components such as light emitting diodes (LED:Light Emitting Diode).
Background technology
LED, owing to having efficient and the life-span is long, therefore waits in expectation and is used as the alternative source of light of the alternative various lamp such as in the past known fluorescent lamp or incandescent lamp.Wherein, the research and development that have employed the product of the lamp (LED) of LED are also constantly developing.
As this LED, such as, there is the LED (straight tube LED) (with reference to patent document 1) of the Straight of known alternative straight-pipe fluorescent lamp.
This straight tube LED lamp is standby: be arranged on the lamp holder at the both ends of the peripheral framework of elongate, LED module and for making the lamp circuit of LED module lighting.LED module such as possesses substrate and is installed in the multiple LED element on substrate.
(prior art document)
(patent document)
Patent document 1 Japanese Unexamined Patent Publication 2009-043447 publication
But, in above-mentioned straight tube LED in the past, in the side contrary with the face of installing LED element of LED-baseplate, be assembled the circuit substrate for mounting circuit parts.Therefore, circuit substrate and circuit block etc. become shadow, thus occur the part darker than other part in the peripheral framework of elongate.
Therefore, in order to make peripheral framework entirety can both be luminous, consider the formation be stored in by circuit block in lamp holder.But institute's produced problem is when being stored in lamp holder by circuit block, because the heating of this circuit block can cause going down of the luminous flux of LED element, thus cause the lost of life.That is, there is the problem causing LED element deterioration because of the heating of circuit block in straight tube LED in the past.
Summary of the invention
Therefore, the present invention is in order to solve above-mentioned problem, and object is to provide a kind of illumination light source and the lighting device that can suppress the deterioration causing LED element because of the heating of circuit block.
In order to reach above-mentioned object, the illumination light source involved by an embodiment of the invention, possesses: the framework of elongate; Light emitting module, has multiple light-emitting component, and is configured in described framework; Lamp holder, is configured in the end of the length direction of described framework, accepts the electric power for making described multiple light-emitting component luminescence; Circuit block, is configured in described lamp holder, and the electric power accepted by this lamp holder is supplied to described multiple light-emitting component; And heat-conduction component, be formed to cover described circuit block, and contact with described circuit block and described lamp holder.
Further, also can be that described heat-conduction component has the adhesive part of adhering to described framework and described lamp holder.
Further, also can be, described heat-conduction component be filled in described lamp holder.
Further, also can be, described light emitting module also has the module substrate having installed described multiple light-emitting component, and described circuit block is installed in described module substrate.
Further, also can be, described in the thermal conductivity ratio of described heat-conduction component, the pyroconductivity of module substrate be high.
And, also can be that described circuit block comprises power circuit component, the alternating current accepted by described lamp holder be converted to direct current by this power circuit component, described heat-conduction component is formed to cover described power circuit component, and contacts with this power circuit component.
Such as, also can be that described heat-conduction component is silicones.
Further, the lighting device involved by an embodiment of the invention possesses above-mentioned illumination light source.
By the present invention, the deterioration causing LED element because of the heating of circuit block can be suppressed.
Accompanying drawing explanation
Fig. 1 is the outward appearance oblique view of an example of the straight tube LED illustrated involved by embodiment 1.
Fig. 2 is the plane of a part for an example of the LED module illustrated involved by embodiment 1.
Fig. 3 is to the sectional view after the part cutting off an example of the straight tube LED involved by embodiment 1 with X-Y plane.
Fig. 4 is to the sectional view after the part cutting off an example of the straight tube LED involved by embodiment 1 with Y-Z plane.
Fig. 5 A is the sectional view of the comparative example for illustration of the heat-conduction component do not possessed involved by embodiment 1.
Fig. 5 B is the sectional view of an example of effect for illustration of the heat-conduction component involved by embodiment 1.
Fig. 6 is to the sectional view after a part for an example of the straight tube LED involved by the variation 1 cutting off embodiment 1 with Y-Z plane.
Fig. 7 is to the sectional view after a part for an example of the straight tube LED involved by the variation 2 cutting off embodiment 1 with Y-Z plane.
Fig. 8 is the outward appearance oblique view of an example of the lighting device illustrated involved by embodiment 2.
Detailed description of the invention
Accompanying drawing is below utilized to be described in detail to the illumination light source involved by embodiments of the present invention and lighting device.Further, the embodiment that below will illustrate is a preferred concrete example of the present invention.Therefore, the configuration of the numerical value shown by following embodiment, shape, material, inscape, inscape and connected mode etc. are an example, are not to limit purport of the present invention.Therefore, for illustrating the inscape do not recorded in the independent claims of upper concept of the present invention in the inscape of following embodiment, illustrate as arbitrary inscape.
Further, each figure is ideograph, not rigorous diagram.Further, identical symbol is given for the identical component parts in each figure.
In the following embodiments, the straight tube LED of an embodiment as illumination light source and the lighting device citing that possesses this straight tube LED are described.
(embodiment 1)
First, the straight tube LED involved by embodiments of the present invention 1 is described.
Straight tube LED lamp involved by present embodiment is standby: the framework of elongate; To be configured in framework and there is the light emitting module of multiple light-emitting component; Be configured in the end of the length direction of framework and the lamp holder of electric power accepted for making multiple light-emitting component luminescence; To be configured in lamp holder and the electric power that this lamp holder accepts to be supplied to the circuit block of multiple light-emitting component; And cover circuit block and the heat-conduction component be formed in the mode contacted with circuit block and lamp holder.Further, the straight tube LED involved by present embodiment is an example of the straight tube LED of the straight-pipe fluorescent lamp substituted in the past.
[entirety of straight tube LED is formed]
First, the example of Fig. 1 to the formation of the straight tube LED involved by present embodiment is utilized to be described.
Fig. 1 is the outward appearance oblique view of an example of the straight tube LED 1 illustrated involved by embodiments of the present invention 1.As shown in Figure 1, straight tube LED 1 possesses: the framework 20 of LED module 10, elongate, the lamp holder 30 being separately fixed at the end of the length direction (tube axial direction) of framework 20 and lamp holder 40 and heat-conduction component 60, this heat-conduction component 60 covers the circuit block of the lamp circuit 130 forming LED module 10, and is formed in the mode contacted with circuit block and lamp holder 30.Straight tube LED 1 is such as the straight tube LED of 40 shapes, and lamp total length is about 1200mm.
Fig. 2 to Fig. 4 each component parts to straight tube LED 1 is below utilized to be described in detail.Fig. 2 is the plane of a part for an example of the LED module 10 illustrated involved by embodiments of the present invention 1, Fig. 3 is that Fig. 4 is to cut off the sectional view of a part for an example of the straight tube LED 1 involved by embodiment 1 with Y-Z plane with X-Y plane to the sectional view after the part cutting off an example of the straight tube LED 1 involved by embodiment 1.
[LED module]
As shown in Figure 1, LED module 10 is light sources of straight tube LED 1, is configured in framework 20.At this, LED module 10 is configured to end and stretches out from framework 20.
LED module 10 involved by present embodiment is light emitting modules of surface mount (SMD:Surface MountDevice) type, possesses: module substrate 110, be installed in module substrate 110 multiple LED element 120 and for making the lamp circuit 130 of multiple LED element 120 lighting.Further, although not shown, LED module 10 also possesses for making that multiple LED element 120 and lamp circuit 130 are electrically connected, be formed as regulation shape by pattern metal line.
[module substrate]
Module substrate 110 is configured in framework 20, it is a form of substrate, be such as rectangular substrate, its length direction (Y direction of Fig. 1) is parallel with the length direction of the framework 20 of straight tube-like, and short direction (X-direction of Fig. 1) is parallel with the short direction of framework 20.Module substrate 110 is such as fixed on the inner surface of framework 20 by sticker 220.Or module substrate 110 also can be placed in the wearing on the face of putting of radiator (base station) be fixed in framework 20.Sticker 220 for adhere module substrate 110 and framework 20 is such as silicones or cement.
Module substrate 110 such as length is 1150 to 1200mm (length direction), width is 5 to 25mm (short direction), thickness is 0.3 to 2.0mm.On the interarea of module substrate 110, lamp circuit 130 and multiple LED element 120 be arranged be configured in module substrate 110 length direction on.Further, module substrate 110 is longer than framework 20 in the longitudinal direction.
Specifically, module substrate 110 is the installation base plates for installing LED element 120.Module substrate 110 is such as the resin substrate based on resin, the metal substrate based on metal, the ceramic substrate be made up of pottery or the glass substrate etc. that is made up of glass.
Resin substrate be such as the substrate (FR-1 etc.) that forms of glass epoxy substrate (CEM-3, FR-4 etc.), paper phenolic aldehyde or paper epoxy resin that glass fibre and epoxy resin are formed or polyimides etc. form there is flexible flexible base board etc.Metal substrate is such as the aluminium alloy base plate, the ferroalloy substrate or copper alloy substrate etc. that are formed with dielectric film on surface.In the present embodiment, the double-sided substrate of CEM-3 is adopted as module substrate 110.
The end of one side of the length direction of module substrate 110 is covered by lamp holder 30.Such as, module substrate 110 is configured to its end and stretches out from framework 20, and at least this part of stretching out is covered by lamp holder 30.Such as, the end of module substrate 110 is until the part that covered by lamp holder 30 of lamp circuit 130 and being capped.
Further, in order to improve the light extraction efficiency of LED module 10, also (white protective layer) can be expected at the external coating Bai Se Tu of module substrate 110.White protective layer has higher light reflective, therefore, it is possible to improve the light extraction efficiency of LED module 10.Further, by forming white protective layer, thus the insulating properties (withstand voltage) of module substrate 110 can be improved, and the oxidation of metal line can be suppressed.
[LED element]
LED element 120 is forms for light-emitting component, is installed on module substrate 110.In the present embodiment, multiple LED element 120 is configured to the mode of row with wire, and is installed in along on the length direction of module substrate 110.Multiple LED element 120 respectively as shown in Figure 1, is configured to be spaced certain distance.
LED element 120 is after LED chip and fluorophor packedization, the light-emitting component of so-called SMD type.LED element 120 possesses: the seal member of packaging body, the LED chip being configured in packaging body and sealing LED chip.LED element 120 is such as the White LED element sending white light.
Packaging body is by the shaping container such as white resin, has the recess (cavity) of inverse truncated cone shape.The medial surface of the recess of this packaging body tilts, and the light from LED chip can be made to reflect upward.
LED chip is installed in the bottom surface of the recess of packaging body.LED chip is the bare chip sending monochromatic visible light, by die bonding material (chip sticky material) the bonded bottom surface being arranged on the recess of packaging body.LED chip sends the blue LED die of blue light when being such as energising.
Seal member be containing the fluorophor as optical wavelength conversion body containing fluorophor resin, the light sent from LED chip is transformed to the wavelength (colour switching) of regulation.Further, seal member by sealing LED chip, to protect LED chip.Seal member is filled into the recess of packaging body, till being sealing into the opening surface of this recess.
The color (wavelength) that seal member comprises the light sent according to LED chip and the material that the color (wavelength) of light be required as light source is selected.Such as, when LED chip is blue LED die, in order to obtain white light, can adopt as seal member the yellow fluorophor particle dispersion that is by YAG (yttrium, aluminium, garnet) to silicones containing fluorophor resin.Like this, yellow fluorophor particle is encouraged by the blue light of blue LED die and releases sodium yellow, thus the blue light of energized sodium yellow and blue LED die becomes synthesis light, and releases white light from seal member.
Further, seal member also can be made to contain silica (SiO 2) etc. photodiffusion material.
The LED element 120 with above this formation has positive pole and these two electrode terminals of negative pole, and these electrode terminals are electrically connected with the metal line being formed on module substrate 110.
[lamp circuit]
Lamp circuit 130 is the LED point lamp circuit for making the lighting of multiple LED element 120.Lamp circuit 130 is made up of one or more circuit block 131 and 132.
The DC voltage that lamp circuit 130 such as will be transfused to by lead-in wire 50, is adjusted to the polarity of the regulation for making LED element 120 luminescence, and exports.The direct current exported from lamp circuit 130, such as via the metal line being formed on module substrate 110, and is fed into each LED element 120 of LED module 10.
Circuit block 131 and 132 utilizes the module substrate 110 of LED module 10, and is directly mounted to module substrate 110.Circuit block is such as rectification circuit, detects resistance or electrical fuse element etc.Also can be resistance, capacitor, coil, diode or transistor etc. according to other demand.At this, circuit block 131 and 132 is covered by heat-conduction component 60 described later.
Metal line comprises the metals such as copper (Cu), is formed in module substrate 110 with the shape predetermined by pattern.
Further, as described later, the confession electrical prongs for one end with lamp holder 30 of feeding electrical power to the lead-in wire 50 of LED element 120 is connected.The lead-in wire other end of 50 is connected with the tie point of first interarea (surface) of module substrate 110.Such as, the other end of lead-in wire 50 welds with tie point.
At this, tie point is the part be electrically connected with metal line.Such as, tie point is formed as the metal electrode of the shapes such as rectangle by pattern.Electric power, via lead-in wire 50 and metal line, is supplied to lamp circuit 130 and LED element 120 from outside.
Further, also can substituted metal electrode and adopt the splicing ear being configured to lamp holder type.Splicing ear is an example of tie point, is for the outside from LED module 10, accepts the galvanic external connection terminals (electrode terminal) making LED element 120 luminescence.Specifically, splicing ear has resinous lamp holder and the connector for accepting galvanic conductive part (pin).This conductive part is connected to lamp circuit 130 via metal line.Like this, the other end of lead-in wire 50 also can be connected to the interarea of module substrate 110 by connector.
Metal line comprises the metals such as copper (Cu), is formed in module substrate 110 with prespecified shape by pattern.
[framework]
Framework 20 is the frameworks of the elongate being configured with module substrate 110 in inside.Specifically, framework 20 is the diffusers with the elongate of light transmission of the part covering LED module 10.
Such as shown in Fig. 1, framework 20 is cylindrical shells that both ends have the elongate of opening.Specifically, framework 20 is outer tubes of straight tube-like, is made up of transparent resin material or glass.Framework 20 is the cross sections (XZ cross section) in short direction is circular cylinder.
Such as, framework 20 is the glass tube (Transparent lamp tube) of transparent fused silica for visible ray.In this case, be configured in LED module 10 in framework 20 can from the outside of framework 20 visual to.
Specifically, the soda-lime glass of the main component of framework 20 to be silicas be 70-72% is the glass tube (glass lamp) that pyroconductivity is about 1.0W/mK.Or framework 20 also can be the plastic tube comprising the resin material such as acrylic resin (PMMA) or Merlon (PC).
Further, in order to spread the light from LED module 10, framework 20 also can be made to have light diffusion function.Such as, light diffusion layer or optical diffusion film can be formed at the inner surface of framework 20 or outer surface.Specifically, by the resin containing the photodiffusion material such as silica or calcium carbonate (particulate) or Chinese white being attached to inner surface or the outer surface of framework 20, thus milky optical diffusion film can be formed.
Further, can by the inside of framework 20 or outer setting lens arrangement thing, or form recess or protuberance at the inner surface of framework 20 or outer surface, realize light diffusion function.Such as, by the inner surface of framework 20 or outer surface printing dot pattern, or a part for framework 20 is processed, realize light diffusion function.Or, also can directly be formed framework 20 by adopting by the resin material etc. being dispersed with photodiffusion material, thus realize light diffusion function.
Like this, by making framework 20 have light diffusion function, thus this light can be spread when the light transmission framework 20 radiated from LED module 10.Such as shown in present embodiment, if configure separated by a distance for the LED element 120 of SMD type, then there will be the spot sense (brightness uneven) of light.To this, by making framework 20 have light diffusion function, thus the spot sense of light can be suppressed.
[power supply lamp holder]
Lamp holder 30 is the power supply lamp holders for feeding electrical power to LED module 10.Lamp holder 30 is arranged on the end of a side of the length direction (Y direction) of framework 20 or module substrate 110.Lamp holder 30 accepts the electric power for making LED element 120 lighting from straight tube LED 1 outside.
Lamp holder 30 is configured to lid, to cover the end of a side of the length direction of framework 20.Such as, lamp holder 30 is adhered to the end of a side of framework 20 by sticker 210.In the present embodiment, lamp holder 30 is that a side has opening, and the opposing party has the cylinder of bottom surface.
Further, the sticker 210 for adhere lamp holder 30 and framework 20 is such as silicones.Such as, sticker 210 adopts and the material identical with the sticker 220 that framework 20 connects to module substrate 110.Now, end and the lamp holder 40 of the opposing party of the module substrate 110 stretched out from framework 20 can be fixed by sticker.
Lamp holder 30 possesses: cap body 310 and confession electrical prongs 320.Such as, cap body 310 is cap body of tubular, forms the periphery of lamp holder 30.Cap body 310 keeps for electrical prongs 320.
Specifically, cap body 310 is cap body of the tubular with opening and bottom surface.Cap body 310 is such as made up of resin materials such as polybutylene terephthalates (PBT).At this, lamp holder 30 is such as by being made into carrying out inlaying process shaping for electrical prongs 320 and resin material.Further, by the cap body 310 that will be pressed into for electrical prongs 320 as resin molded body, lamp holder 30 can be made.
For electrical prongs 320 specifically pair of conductive pin, accept the electric power for making LED module 10 luminescence from external equipments such as ligthing paraphernalias.Such as, be made up of metal materials such as brass for electrical prongs 320.By the carrier by being assembled to ligthing paraphernalia for electrical prongs 320, thus direct current can be accepted from the supply unit being built in ligthing paraphernalia for electrical prongs 320.Outstanding from the outwardly side of the bottom surface of cap body 310 for electrical prongs 320, and outstanding from the inner bottom surface of cap body 310 towards opening.For the part outstanding from the inner bottom surface of cap body 310 towards opening in electrical prongs 320, be connected to the tie point of module substrate 110 by lead-in wire 50.
Further, the lamp holder 30 involved by present embodiment is with the GX16t-5 lamp holder (L shape pin cap) in the JIS C 7709-1 straight tube LED that is standard, is therefore L-shaped for electrical prongs 320.
[non-powered lamp holder]
Lamp holder 40 is the lamp holders with non-powered side straight tube LED 1 being installed to the function of ligthing paraphernalia.Lamp holder 40 as shown in Figure 1, is arranged on the end of the opposing party of the length direction (Y direction) of framework 20 or module substrate 110.Further, lamp holder 40 also can be connected (ground wire) with the local ground of the regulation of LED module 10 via ligthing paraphernalia.
Lamp holder 40 is configured to lid, to cover the end of the opposing party of the length direction of framework 20.Such as, lamp holder 40 is adhered to the end of the opposing party of framework 20 by sticker.In the present embodiment, lamp holder 40 is that a side has opening, and the opposing party has the cylinder of bottom surface.
Lamp holder 40 possesses cap body 410 and non-powered pin 420.Such as, cap body 410 is cap body of tubular, forms the periphery of lamp holder 40.
Specifically, cap body 410 is cap body of the tubular with opening and bottom surface.Cap body 410 is such as made up of resin materials such as polybutylene terephthalates.At this, such as by adopting non-powered pin 420 and resin material, inlaying process is shaping to be made lamp holder 40.Further, by non-powered pin 420 being pressed into the cap body 410 as resin molded body, thus lamp holder 40 can be produced.
Non-powered pin 420 is such as the cross section be made up of metal materials such as brass is the conductive base pin of T-shaped.Non-powered pin 420 is configured to give prominence to outward from the bottom surface of cap body 410.Non-powered pin 420 does not expose from the inner surface side of cap body 410, but is embedded in cap body 410.Further, non-powered pin 420 also can be configured to the bottom surface of through cap body 410.
Further, lamp holder 40, when the region of the regulation of LED module 10 is ground connection, is connected with non-powered pin 420 and module substrate 110.
[heat-conduction component]
Heat-conduction component 60 is heat conductivity high heat conductivity parts than air, as shown in Figure 3 and 4, this heat-conduction component 60 is formed to cover the circuit block 131 and 312 forming lamp circuit 130, and contacts with 312 and lamp holder 30 with circuit block 131.This heat-conduction component 60 is such as the heat conductivity resins such as silicones.This heat-conduction component 60 is formed as follows in the manufacturing process of straight tube LED 1, a part such as to the inside of lamp holder 30 is filled after silicones, the end of the length direction of LED module 10 and framework 20 is inserted into the open end of lamp holder 30, makes silicones harden afterwards.
Like this, the heat-conduction component 60 contacted with 132 with circuit block 131 also contacts with lamp holder 30, like this, can guarantee the heat dissipation path of circuit block 131 and 132 via heat-conduction component 60 and lamp holder 30.Therefore, the heat occurred at circuit block 131 and 132 can easily be transmitted to lamp holder 30 via heat-conduction component 60.The heat being transmitted to lamp holder 30 is rejected heat to outside atmosphere by lamp holder 30, or rejects heat to outside atmosphere by the carrier being transmitted to ligthing paraphernalia.Therefore, the heat occurred at circuit block 131 and 132 can reject heat to outside atmosphere via heat-conduction component 60 and lamp holder 30.Therefore, it is possible to suppress the heat transfer occurred at circuit block 131 and 312 to LED element 120, thus, the deterioration of the LED element 120 caused because of this heat can be suppressed.
At this, the pyroconductivity of heat-conduction component 60 also can be higher than the pyroconductivity of the module substrate 110 of LED module 10.Accordingly, with the pyroconductivity of heat-conduction component 60 be module substrate 110 pyroconductivity below situation compared with, circuit block 131 and 132 occur heat can be transmitted to lamp holder 30 further.Therefore, it is possible to suppress the deterioration of LED element 120 further.
Fig. 5 A is the sectional view of the comparative example for illustration of the heat-conduction component 60 not involved by present embodiment.Further, Fig. 5 B is the sectional view of an example of effect in order to the heat-conduction component 60 involved by present embodiment is described.Further, the black arrow of Fig. 5 A and Fig. 5 B represents that the heat occurred at circuit block 131 and 132 carries out the situation of conducting.
Straight tube LED involved by comparative example is not owing to possessing heat-conduction component 60, and therefore, the heat occurred at circuit block 131 and 132 is conducted to LED element 120 via module substrate 110.Like this, the luminous flux of LED element 120 will go down, and the life-span also can shorten.That is, there will be the situation of LED element 120 deterioration.
To this, the straight tube LED 1 involved by present embodiment is owing to possessing heat-conduction component 60, therefore, it is possible to as Fig. 5 B Suo Shi, the heat occurred at circuit block 131 and 132 can be transmitted to lamp holder 30.In other words, be situated between by heat-conduction component 60 and be between circuit block 131 and 132 and lamp holder 30, thus be not easy to be transmitted to LED element 120 in the heat that circuit block 131 and 132 occurs, but be transmitted to lamp holder 30.
Like this, in the straight tube LED 1 involved by present embodiment, the heat occurred at circuit block 131 and 132 is not easy to be transmitted to LED element 120, but conduction is to lamp holder 30, therefore, compared with the straight tube LED involved by comparative example, the heat being transmitted to LED element 120 can be suppressed.Therefore, it is possible to suppress going down of the luminous flux of the LED element 120 caused because of the heating occurred at circuit block 131 and 132, thus short service life can be suppressed.That is, the deterioration of LED element 120 can be suppressed.
Further, heat-conduction component 60 also can be cover circuit block 131 and 132 at least partially.That is, although also can be and circuit block 131 and 132 contact at least partially, but contact area is more more can easily dispel the heat.Therefore, as shown in FIG. 2 and 3, preferably contact with 132 entirety with circuit block 131.
Further, heat-conduction component 60 not limit by above-mentioned silicones, such as, also can be binder resin and the main component contained by this binder resin is the inorganic material of insulating properties.Like this, powder or fibrous inorganic material combine each other by binder resin, therefore identical with the situation that have employed silicones as heat-conduction component 60, can freely make the shape of heat-conduction component 60 be out of shape.That is, by binder resin, the free degree of the position forming heat-conduction component 60 can be improved.Accordingly, can be formed and cover circuit block 131 and 132, and the heat-conduction component 60 contacted with 132 and lamp holder 30 with circuit block 131.
As the inorganic material contained by binder resin, such as can adopt the countless nonmetallic particulate (powder) be made up of the particle diameter specified, such as, can be ceramic material.
Because ceramic material has heat resistance and fire resistance, therefore, even if when circuit block 131 and 132 occurs abnormal heating and becomes high temperature, catching fire of circuit block 131 and 132 also can be suppressed.That is, by adopting ceramic material to be used as heat-conduction component 60, thus the deterioration of the LED element 120 caused because of the heating of circuit block 131 and 132 can either be suppressed, the straight tube LED with good reliability and security can be realized again.
Such as the ceramic powders such as alumina powder or glass powder can be adopted as ceramic material.
Alumina powder, owing to having higher pyroconductivity in ceramic powders, therefore, by the main component of heat-conduction component 60 is adopted alumina powder, thus easily can reduce the heat of circuit block 131 and 132.That is, due to the thermal diffusivity of circuit block 131 and 132 can be improved further, therefore, it is possible to suppress the deterioration of the LED element 120 caused because of the heating of circuit block 131 and 132 further.
Further, due to ceramic powders or glass powder less expensive, therefore, it is possible to realize low cost and inhibit the straight tube LED 1 of the deterioration of the LED element 120 caused because of the heating of circuit block 131 and 132.
Be the heat-conduction component 60 that alumina powder is formed as main component, can adopt by Al 2o 3(89%), SiO 2(2 ~ 4%), Fe 2o 3(1 ~ 1.5%) and TiO in addition 2, CaO, MgO form, pyroconductivity be about 0.035W/ (mK), particle diameter is the dusty material A of 0.075mm.
Further, as the heat-conduction component 60 that main component is formed with alumina powder, can adopt by Al 2o 3(99.5%) SiO and in addition 2, Fe 2o 3, Na 2that O is formed, that pyroconductivity is about 25W/ (mK), particle diameter is 0.003mm dusty material B.
Further, be the heat-conduction component 60 that glass powder is formed as main component, can adopt by SiO 2(98.6%) Al and in addition 2o 3, Fe 2o 3, Na 2o, K 2that O is formed, that pyroconductivity is about 1.1W/ (mK), particle diameter is 0.08mm dusty material C.
Further, as the inorganic material contained by binder resin, not limitting by above-mentioned powdery type inorganic material, also can be the fiber-like inorganic material be made up of the ceramic fibre of countless wire.As this fiber-like inorganic material, such as, can adopt the mineral wool formed with glass fibre.
[effect etc.]
As previously discussed, the straight tube LED 1 involved by present embodiment possesses: the framework 20 of elongate; To be configured in framework 20 and there is the LED module 10 (light emitting module) of multiple LED element 120 (light-emitting component); Be configured in the end of the length direction of framework 20 and the lamp holder 30 of electric power accepted for making the luminescence of multiple LED element 120; To be configured in lamp holder 30 and the electric power accepted by this lamp holder 30 to be supplied to the circuit block 131 and 132 of multiple LED element 120; And to cover the mode and the heat-conduction component 60 be formed that circuit block 131 contacts with 132 and lamp holder 30 with 132 and with circuit block 131.
Accordingly, the ratio of specific heat occurred at circuit block 131 and 132 plays LED element 120, can easily be transmitted to lamp holder 30, therefore, compared with not possessing the situation of heat-conduction component 60, can suppress the heat being transmitted to LED element 120.Therefore, it is possible to suppress going down of the luminous flux of the LED element 120 caused because of the heating of circuit block 131 and 132, and short service life can be suppressed.That is, the deterioration of LED element 120 can be suppressed.
Further, circuit block 131 and 132 is installed in the module substrate 110 of LED module 10.
Circuit block 131 and 132 is being installed in the formation of the substrate different from the module substrate 110 of the installation base plate as LED element 120, the formation being installed to module substrate 110 with circuit block 131 and 132 is compared, and the heat occurred at circuit block 131 and 132 is not easy to be transmitted to LED element 120.But, in this formation, need the operation carrying out being connected with the installation base plate of circuit block 131 and 132 module substrate 110 in the fabrication process.Further, easily there is the problems such as the bad connection between substrate, thus cause the reduction of yield rate.
To this, by the circuit block 131 and 132 contacted with lamp holder 30 via heat-conduction component 60 being installed to the module substrate 110 of LED module 10, thus manufacturing process can be made to simplify, and, the reduction of yield rate can not only be suppressed, the deterioration of the LED element 120 that the heating because of circuit block 131 and 132 can also be suppressed to cause.
Further, the pyroconductivity of heat-conduction component 60 also can be higher than the pyroconductivity of the module substrate 110 of LED module 10.
Accordingly, the heat occurred at circuit block 131 and 132 can more easily be transmitted to lamp holder 30, thus can suppress the deterioration of LED element 120 further.
(variation 1 of embodiment 1)
Then, the straight tube LED involved by the variation 1 of embodiment 1 is described.Fig. 6 is to the sectional view after a part for an example of the straight tube LED involved by the variation 1 cutting off embodiment 1 with Y-Z plane.
The basic comprising of the straight tube LED 1A in this variation is identical with the formation of the straight tube LED in the embodiment 1 shown in Fig. 1.Therefore, in this variation by with embodiment 1 difference centered by be described.
As shown in Figure 6, the heat-conduction component 60a in this variation is compared with the heat-conduction component 60 in embodiment 1, and difference is also possess the adhesive part 210a adhered to framework 20 and lamp holder 30.
Namely, the difference of the straight tube LED 1A involved by this variation is, as the sticker of adhering to framework 20 and lamp holder 30, instead of the sticker 210 of the straight tube LED 1 involved by embodiment 1, but have employed the adhesive part 210a of heat-conduction component 60a.As heat-conduction component 60a, such as, silicones can be adopted.This heat-conduction component 60a is such as formed as follows in the manufacturing process of straight tube LED 1A, namely, while the part for inside silicones being filled into lamp holder 30, silicones is applied to the internal face of the open end of lamp holder 30, after this, the end of the length direction of LED module 10 and framework 20 is inserted into the open end of lamp holder 30, afterwards, silicones is hardened.Accordingly, adhered by the silicones after hardening in the end of the open end of lamp holder 30 and the length direction of framework 20.That is, the outer wall of the end of the inwall of the open end of lamp holder 30 and the length direction of framework 20, is adhered by the adhesive part 210a of heat-conduction component 60a.
As previously discussed, the effect same with the straight tube LED 1 involved by embodiment 1 can also be realized in the straight tube LED 1A involved by this variation.That is, the deterioration of the LED element 120 caused because of the heating of circuit block 131 and 132 can be suppressed.
Further, the heat occurred at circuit block 131 and 132 can be transmitted to framework 20 via lamp holder 30 by the straight tube LED 1A involved by this variation.That is, by make to cover circuit block 131 with 132 mode and the heat-conduction component 60 formed contact with framework 20, thus the heat dissipation path of circuit block 131 and 132 and framework 20 can be guaranteed via heat-conduction component 60.Therefore, the heat occurred at circuit block 131 and 132 can be easily transmitted to framework 20 via heat-conduction component 60.The heat being transmitted to framework 20 is rejected heat in outside air via framework 20.
Like this, the heat occurred at circuit block 131 and 132, compared with the straight tube LED 1 involved by embodiment 1, can reject heat to via framework 20 in outside air by straight tube LED 1A involved by this variation further.In other words, the heat occurred at circuit block 131 and 132 via lamp holder 30, just need not can be transmitted to framework 20.
Therefore, straight tube LED 1A involved by this variation is compared with the straight tube LED 1 involved by embodiment 1, going down of the luminous flux of the LED element 120 caused because of the heating of circuit block 131 and 132 can be suppressed further, thus short service life can be suppressed further.That is, the deterioration of LED element 120 can be suppressed further.
(variation 2 of embodiment 1)
Then, the straight tube LED involved by the variation 2 of embodiment 1 is described.Fig. 7 is to the sectional view of a part for an example of the straight tube LED involved by the variation 1 cutting off embodiment 1 with Y-Z plane.
The basic comprising of the straight tube LED 1B in this variation is identical with the formation of the straight tube LED in the variation of the embodiment 1 shown in Fig. 6.Therefore, in this variation, by the variation from embodiment 1 different among centered by be described.
As shown in Figure 7, the heat-conduction component 60b in this variation, compared with the heat-conduction component 60a in the variation of embodiment 1, is filled into lamp holder 30 for difference.
Specifically, the heat-conduction component 60a in the variation of embodiment 1 is filled into a part for the inside of lamp holder 30, and the heat-conduction component 60b in this variation is filled into the whole inside of lamp holder 30.
And, straight tube LED 1B involved by this variation is identical with the heat-conduction component 60a in the variation of embodiment 1, as the sticker of adhering to framework 20 and lamp holder 30, the sticker 210 of the straight tube LED 1 involved by alternate embodiments 1 adopts the adhesive part 210b of heat-conduction component 60b.That is, heat-conduction component 60b has the adhesive part 210b adhered to framework 20 and lamp holder 30.As heat-conduction component 60b, such as, silicones can be adopted.This heat-conduction component 60b is such as formed as follows in the manufacturing process of straight tube LED 1B, namely, after silicones being filled up the inside of lamp holder 30, the end of the length direction of LED module 10 and framework 20 is inserted into the open end of lamp holder 30, makes silicones harden afterwards.Accordingly, adhered by the silicones after hardening in the end of the open end of lamp holder 30 and the length direction of framework 20.That is, the outer wall of the end of the inwall of the open end of lamp holder 30 and the length direction of framework 20 is adhered by the adhesive part 210b of heat-conduction component 60b.
In sum, even if the straight tube LED 1B involved by this variation, the effect same with the straight tube LED 1A involved by the variation 1 of embodiment 1 also can be realized.That is, the deterioration of the LED element 120 caused because of the heating of circuit block 131 and 132 can be suppressed.
And, in straight tube LED 1B involved by this variation, because the heat occurred at circuit block 131 and 132 just need not can be transmitted to framework 20 via lamp holder 30, therefore same with the straight tube LED 1A involved by the variation 1 of embodiment 1, the deterioration of LED element 120 can be suppressed further.
And, in straight tube LED 1B involved by this variation, because heat-conduction component 60b is filled the whole inside of lamp holder 30, therefore, it is possible to guarantee the contact area of larger heat-conduction component 60b and lamp holder 30 and the contact area of heat-conduction component 60b and framework 20.Therefore, it is possible to the thermal capacitance occurred at circuit block 131 and 132 is changed places be transmitted to lamp holder 30 and framework 20 further.Therefore, compared with straight tube LED 1A involved by the variation 1 of the straight tube LED 1B involved by this variation and embodiment 1, going down of the luminous flux of the LED element 120 caused because of the heating of circuit block 131 and 132 can be suppressed further, thus short service life can be suppressed further.That is, the deterioration of LED element 120 can be suppressed further.
(embodiment 2)
Lighting device involved by embodiments of the present invention 2 is the lighting device with above-mentioned illumination light source.Such as, the lighting device involved by embodiment 2 possesses the straight tube LED 1 involved by embodiment 1.
Fig. 8 is the outward appearance oblique view of an example of the lighting device 9 illustrated involved by embodiments of the present invention 2.As shown in Figure 8, the lighting device 9 involved by embodiment 2 is basis illuminations, possesses straight tube LED 1 and ligthing paraphernalia 900.
Straight tube LED 1 is the straight tube LED 1 involved by embodiment 1, and the illumination light source as lighting device 9 uses.Further, the lighting device 9 involved by present embodiment possesses two straight tube LED 1 as an example.
Ligthing paraphernalia 900 is electrically connected with straight tube LED 1, and possesses for keeping a pair carrier 910 of straight tube LED 1 and the appliance body 920 for installing carrier 910.
Appliance body 920 such as comes shaping by carrying out punch process etc. to aluminium steel plate.Further, its surface has the function that the light making to send from straight tube LED 1 reflects the reflecting surface in the direction (such as, below) to regulation.
Ligthing paraphernalia 900 is such as installed to ceiling etc. by fixture etc.Further, the built-in circuit etc. having lighting for controlling straight tube LED 1 in ligthing paraphernalia 900, and, the cap assembly covering straight tube LED 1 also can be set.
As previously discussed, the lighting device 9 involved by present embodiment can realize the effect identical with embodiment 1 and its variation.That is, the deterioration of the LED element 120 caused because of the heating of circuit block 131 and 132 can be suppressed.Specifically, circuit block 131 and 132 occur heat via heat-conduction component 60, be easily transmitted to lamp holder 30.Be transmitted to lamp holder 30 heat and rejected heat to outside air from lamp holder 30, or, be transmitted to the carrier 910 of ligthing paraphernalia 900 and reject heat in outside atmosphere.Therefore, by conducting the heat to lamp holder 30 via the heat-conduction component 60 contacted with lamp holder 30, thus heat can be suppressed to be transmitted to LED element 120, like this, the deterioration of the LED element 120 caused because of the heating of circuit block 131 and 132 can be suppressed.
(other)
Be illustrated illumination light source involved in the present invention and lighting device according to above embodiment above, but, the present invention not limit by above-mentioned embodiment.
Such as, in the above-described embodiment, be that the situation of the LED module of the SMD type that have employed the LED element after packedization is illustrated to LED module, but, be not limited by this.LED module also can adopt the LED module of COB (Chip On Board: chip on board) type, that is, substrate directly installs multiple LED chip, and utilization seals multiple LED chip in the lump containing fluorophor resin.
Further, the substrate (LED module) be configured in framework also can be more than two pieces and row arrangement.In this case, can be connected the metal line be arranged on each substrate by splicing ear.
Further, framework such as also can be made up of the diffuser of the elongate of covering LED module and base station.In this case, LED module is such as placed in base station.That is, framework can need not to be into the framework be integrated, and can be to be split into multiple framework such as diffuser and framework.
Further, in the above-described embodiment, be that the roughly homogeneous cylinder of external diameter is illustrated to cap body.In other words, the shape being the cross section parallel with its opening surface or bottom surface to cap body is that roughly homogeneous cylinder is illustrated.But, as long as cap body tubular, such as it can comprise footpath major part and footpath fraction in forming, that is, the side of cap body can have step.Or cap body also can be the shape in the cross section parallel with its opening surface or bottom surface is roughly homogeneous angle cylinder.
Further, cap body also can not have bottom surface.That is, cap body can be the cylindrical shell that two ends have opening.
Further, the end of framework also can cover lamp holder.That is, the external diameter of lamp holder can be less than the internal diameter of the end of framework.
Further, although be illustrated, but framework and lamp holder may not be cylinder the situation that framework, lamp holder are cylinder.Such as, framework and lamp holder also can be angle cylinders.
And, such as in the above-described embodiment, only carry out the one-sided power supply mode of powering from power supply lamp holder side to all LED in framework although have employed, but the lamp holder of bilateral also can be adopted to be for bilateral power supply modes such as the G13 lamp holder of electrical prongs and L shape lamp holders.In this case, the confession electrical prongs of side and the confession electrical prongs of opposite side can be all the pin of 1 pin.Or the confession electrical prongs of side and the confession electrical prongs of opposite side for electrical prongs, accept electric power from bilateral as a pair.Further, not limit by bar-shaped metal for electrical prongs or non-powered pin, also can be made up of flat metal etc. for a pair.
And, the form that straight tube LED involved in the present invention is following can be listed from above power supply mode.Namely, can be such as, the one-sided power supply mode that the lamp holder of to take side as L shape lamp holder and opposite side be non-powered pin is formed, with bilateral be L shape lamp holder form bilateral power supply mode, take bilateral as one-sided power supply mode, the bilateral power supply mode formed with G13 lamp holder and the one-sided power supply mode etc. formed with G13 lamp holder that L shape lamp holder is formed.
And, although the mode accepting electric power of the straight tube LED involved by above-mentioned embodiment accepts galvanic mode from external power source, but, also by built-in power circuit (AC-DC translation circuit), the mode of alternating current can be accepted from external power source.That is, circuit block can comprise the alternating current accepted at lamp holder is converted to galvanic power circuit component, and heat-conduction component can be formed to cover power circuit component, and contacts with power circuit component and lamp holder.Such power circuit component be such as transformer, adjuster and, bridge diode etc.These power circuit component are compared with being supplied to the circuit block of LED element by direct current, the heat of generation is larger.Therefore, by being formed as, covering power circuit component by heat-conduction component and this heat-conduction component is contacted with power circuit component and lamp holder, thus the deterioration of the LED element that can suppress the heat in power circuit component generation and cause.
Further, also can be that the thermal conductivity ratio module substrate of heat-conduction component is high, as shown in FIG. 2 and 3, contact with a part for module substrate.Specifically, the circuit block in module substrate and LED element Contact.Accordingly, be transmitted to the heat of conducting via module substrate among the heat of LED element from circuit block, easily can be transmitted to heat-conduction component.Therefore, it is possible to suppress the heat occurred at circuit block to be transmitted to LED element further.That is, the deterioration of the LED element caused because of the heat of circuit block generation can be suppressed further.
Further, in the above-described embodiment, although lamp holder and framework are fixed by sticker, but, be not limited by this.Such as, also can be fixed by screw, or be fixed by lamp holder is screwed up in framework.
Further, in the above-described embodiment, although the formation of LED module is for release white light by blue LED die and yellow fluorophor, but be not limited by this.Such as, also can adopt containing red-emitting phosphors and green-emitting phosphor containing fluorophor resin, and itself and blue LED die are combined to release white light.And, also the LED chip of the light of the color sent beyond blueness can be adopted, such as, the blue light adopting the wavelength ratio blue LED die of the light of releasing to release short, release the UV LED chip of ultraviolet light, it is formed mainly by by uv light induction, thus releases white light by releasing the blue emitting phophor particle of blue light, red light and green light, green-emitting phosphor particle and red-emitting phosphors particle.
Further, in the above-described embodiment, show LED as light-emitting component citing, but also can be the light-emitting component such as the semiconductor light-emitting elements such as semiconductor laser, organic EL (Electro Luminescence: electroluminescent) or inorganic EL.
Further, in the above-described embodiment, module substrate is the inner surface that is secured in framework by multiple position by substrate sticker, and but, the fixing of module substrate is not limited by this.Such as, module substrate also can by the length direction along framework continuously coated substrates sticker be fixed.
In addition, by performing various distortion and the form obtained that those skilled in the art can expect for each embodiment and being all included in the present invention the form that the inscape in each embodiment and function at random combine and realize in the scope not exceeding purport of the present invention.
symbol description
1,1A, 1B straight tube LED (illumination light source)
9 lighting devices
10 LED modules
20 frameworks
30,40 lamp holders
50 lead-in wires
60,60a, 60b heat-conduction component
110 module substrates (substrate)
120 LED element (light-emitting component)
130 lamp circuits
131,132 circuit blocks
210,220 stickers
210a, 210b adhesive part
310,410 cap body
320 for electrical prongs
420 non-powered pins
900 ligthing paraphernalias
910 carriers
920 appliance bodies

Claims (8)

1. an illumination light source, possesses:
The framework of elongate;
Light emitting module, has multiple light-emitting component, and is configured in described framework;
Lamp holder, is configured in the end of the length direction of described framework, accepts the electric power for making described multiple light-emitting component luminescence;
Circuit block, is configured in described lamp holder, and the electric power accepted by this lamp holder is supplied to described multiple light-emitting component; And
Heat-conduction component, is formed to cover described circuit block, and contacts with described circuit block and described lamp holder.
2. illumination light source as claimed in claim 1,
Described heat-conduction component has the adhesive part of adhering to described framework and described lamp holder.
3. illumination light source as claimed in claim 1 or 2,
Described heat-conduction component is filled in described lamp holder.
4. illumination light source as claimed in claim 1 or 2,
Described light emitting module also has the module substrate having installed described multiple light-emitting component,
Described circuit block is installed in described module substrate.
5. illumination light source as claimed in claim 4,
Described in the thermal conductivity ratio of described heat-conduction component, the pyroconductivity of module substrate is high.
6. illumination light source as claimed in claim 1 or 2,
Described circuit block comprises power circuit component, and the alternating current accepted by described lamp holder is converted to direct current by this power circuit component,
Described heat-conduction component is formed to cover described power circuit component, and contacts with this power circuit component.
7. illumination light source as claimed in claim 1 or 2, described heat-conduction component is silicones.
8. a lighting device, possesses the illumination light source described in any one of claim 1 to 7.
CN201510053522.2A 2014-02-07 2015-02-02 Light source for illumination and lighting apparatus Expired - Fee Related CN104832800B (en)

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Application Number Priority Date Filing Date Title
JP2014022571A JP6252758B2 (en) 2014-02-07 2014-02-07 Illumination light source and illumination device
JP2014-022571 2014-02-07

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CN104832800B CN104832800B (en) 2017-04-12

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