CN210743970U

CN210743970U - Portable LED encapsulation

Info

Publication number: CN210743970U
Application number: CN201920910658.4U
Authority: CN
Inventors: 唐勇
Original assignee: YLin Electronics Co ltd
Current assignee: YLin Electronics Co ltd; Yonglin Electronics Co Ltd
Priority date: 2019-06-15
Filing date: 2019-06-15
Publication date: 2020-06-12
Anticipated expiration: 2029-06-15

Abstract

The utility model discloses a portable LED package, which comprises a heat dissipation bottom plate, wherein connecting grooves are symmetrically arranged on two sides of the bottom of the heat dissipation bottom plate, the middle part of the top end of the heat dissipation bottom plate is fixedly provided with a heat dissipation base, the middle part of the bottom end of the heat dissipation bottom plate is provided with heat dissipation holes at equal intervals at the corresponding positions of the heat dissipation base, the top end of the heat dissipation base is fixedly provided with a base plate, the middle end in the base plate is provided with a heat inlet through groove at the position corresponding to the heat dissipation base, the top surface in the base plate is provided with the glue applying groove, and the reflecting layer is bonded in the glue applying groove, the utility model has scientific and reasonable structure and safe and convenient use, the heat dissipation bottom plate, the connecting groove, the heat dissipation base, the heat dissipation holes and the heat inlet through groove can avoid the phenomenon that the heat generated by the aluminum coating layer when reflecting light is accumulated in the substrate and cannot be eliminated, and then can guarantee the temperature operation of LED chip and promote the life of LED chip with the quick exhaust base plate of heat.

Description

Portable LED encapsulation

Technical Field

The utility model relates to a LED encapsulates technical field, specifically is a portable LED encapsulation.

Background

LED (semiconductor light emitting diode) encapsulation is the encapsulation of luminous chip, it has great difference to compare the integrated circuit encapsulation, LED's encapsulation not only requires can protect the wick, but also can the printing opacity, so LED's encapsulation has special requirement to encapsulating material, traditional LED encapsulation is owing to in the in-service use process after the actual encapsulation, owing to lack the subassembly of heat dissipation heat conduction, the heat that produces when leading to LED chip operation can't be eliminated, and then be unfavorable for the permanent use of LED chip, the inside coating of current LED chip is direct coating on the face of applying glue simultaneously, and then lead to the transparent adhesive tape after the solidification easily to produce the phenomenon of separation between the LED encapsulation.

SUMMERY OF THE UTILITY MODEL

The utility model provides a portable LED encapsulation, can effectively solve traditional LED encapsulation that proposes in the above-mentioned background art because in the in-service use after the actual encapsulation, owing to lack the subassembly of heat dissipation heat conduction, the heat that leads to producing when LED chip moves can't be eliminated, and then be unfavorable for the permanent use of LED chip, the inside coating of LED chip that has now simultaneously generally is direct coating on the face of applying glue, and then lead to the problem that produces the phenomenon of separation between the easy LED encapsulation of transparent adhesive tape after the solidification.

In order to achieve the above object, the utility model provides a following technical scheme: a portable LED package comprises a heat dissipation bottom plate, wherein connecting grooves are symmetrically formed in two sides of the bottom of the heat dissipation bottom plate, a heat dissipation base is fixedly installed in the middle of the top end of the heat dissipation bottom plate, heat dissipation holes are formed in the middle of the bottom end of the heat dissipation bottom plate at equal intervals corresponding to the heat dissipation base, a base plate is fixedly installed at the top end of the heat dissipation base, a heat inlet through groove is formed in the middle of the inner portion of the base plate at a position corresponding to the heat dissipation base, a glue applying groove is formed in the top surface of the inner portion of the base plate, a reflecting layer is bonded in the glue applying groove, a positive electrode plate is installed on one side edge of the reflecting layer, a negative electrode plate is installed on the other side edge of the reflecting layer at a position corresponding to the positive electrode plate, an aluminum plated layer is fixedly, and the positive electrode plate and the negative electrode plate are connected with the LED chip through metal wires.

Preferably, the heat dissipation bottom plate is made of metal or graphite heat and electricity conducting materials.

Preferably, the inside of the glue applying groove is coated with transparent glue, and the reflecting layer is adhered to the cured transparent glue.

Preferably, the metal wire is a gold wire, the protective layer is transparent silica gel, and the fluorescent layer is made of a mixture of fluorescent powder and epoxy resin.

The side edge part middle end of the inner side of the substrate is provided with a connecting glue groove, a silica gel layer is filled in the connecting glue groove, the side edges of the two sides of the top end of the substrate are provided with mounting side plates, a connecting seat is embedded and bonded in the mounting side plates, and a lens is fixedly bonded at the top end of the connecting seat.

Preferably, the lens is fixedly bonded with the mounting side plate through the connecting seat, and is fixedly bonded with the mounting side plate through fixing glue.

Compared with the prior art, the beneficial effects of the utility model are that: the utility model has the advantages of being scientific and reasonable in structure, convenience safe in utilization:

1. through heat dissipation bottom plate, spread groove, heat dissipation base, louvre and advance hot logical groove can avoid the layer of aluminizing to produce when the reflection light heat accumulation in the base plate cause the phenomenon that can't eliminate, can guarantee the operation of LED chip and promote the life of LED chip with the quick discharge base plate of heat.

2. Through applying gluey groove, connecting gluey groove, silica gel layer, installation sideboard, connecting seat and lens can be convenient for the packing on cellophane and silica gel layer, reduced the degree of difficulty of applying gluey, further avoid producing the phenomenon that the separation drops between the clear glue after the solidification and silica gel and the base plate, utilize installation sideboard and connecting seat to install lens simultaneously, improved the convenience of lens installation, and then make the installation of lens convenient more fast.

3. Make the LED chip can possess more superior reflection of light effect when the actual operation through the reflection stratum, aluminize the layer, fluorescent layer and protective layer, and then avoid the lower use that influences the LED chip of the light extraction efficiency of LED chip, and the protective layer can provide the protection to fluorescent layer and LED chip, and then avoid damaging.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention.

In the drawings:

fig. 1 is a schematic structural diagram of the present invention;

fig. 2 is a cross-sectional view of the present invention;

FIG. 3 is a schematic view of the structure of the heat dissipation holes of the present invention;

reference numbers in the figures: 1. a heat dissipation base plate; 2. connecting grooves; 3. a heat dissipation base; 4. heat dissipation holes; 5. a substrate; 6. a heat inlet through groove; 7. a glue applying groove; 8. a reflective layer; 9. a positive electrode plate; 10. a negative electrode plate; 11. plating an aluminum layer; 12. an LED chip; 13. a protective layer; 14. a fluorescent layer; 15. a metal wire; 16. connecting a glue groove; 17. a silica gel layer; 18. installing a side plate; 19. a connecting seat; 20. a lens.

Detailed Description

The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are presented herein only to illustrate and explain the present invention, and not to limit the present invention.

Example (b): as shown in FIGS. 1-3, the utility model provides a technical solution, a portable LED package, comprising a heat dissipation bottom plate 1, wherein the bottom of the heat dissipation bottom plate 1 is symmetrically provided with connecting grooves 2 at both sides, the heat dissipation bottom plate 1 is made of metal or graphite heat-conducting and electricity-conducting material, so that the heat dissipation bottom plate 1 has a higher heat dissipation effect in the practical application process, the middle part of the top end of the heat dissipation bottom plate 1 is fixedly provided with a heat dissipation base 3, the middle part of the bottom end of the heat dissipation bottom plate 1 is provided with heat dissipation holes 4 at equal intervals corresponding to the heat dissipation base 3, the top end of the heat dissipation base 3 is fixedly provided with a base plate 5, the middle part of the inside of the base plate 5 is provided with a heat inlet through groove 6, the top surface of the inside of the base plate 5 is provided with a glue applying groove 7, the inside of the glue applying groove 7 is provided with a reflecting layer 8, the inside of the, the actual reflection effect of the reflection layer 8 is improved, a positive electrode plate 9 is installed on one side edge plate of the reflection layer 8, a negative electrode plate 10 is installed at the position, corresponding to the positive electrode plate 9, of the other side edge portion of the reflection layer 8, an aluminum-plated layer 11 is fixedly bonded on the top surface of the reflection layer 8, an LED chip 12 is fixedly bonded on the top surface of the aluminum-plated layer 11, a protection layer 13 is bonded on the top surface of the LED chip 12, a fluorescent layer 14 is coated on the top surface of the protection layer 13, the positive electrode plate 9 and the negative electrode plate 10 are connected with the LED chip 12 through a metal wire 15, the metal wire 15 is a gold wire, the positive electrode plate 9, the negative electrode plate 10 and the LED chip 12 are connected and then have better conductivity, the protection layer 13 is made of transparent silica gel, the protection layer 13 does not influence the light transmittance of the LED chip 12 when having the protection capability, the fluorescent layer 14 has a higher.

The inboard limit portion middle-end of base plate 5 has all been seted up and has been connected gluey groove 16, it has silica gel layer 17 to connect the inside packing in

gluey groove

16, 5 top both sides limit portion of base plate all installs installation sideboard 18, the inside embedding of installation sideboard 18 bonds has connecting seat 19, the fixed lens 20 that bonds in connecting seat 19 top, lens 20 passes through fixed bonding between connecting seat 19 and the installation sideboard 18, and bond through fixed gluing between connecting seat 19 and the installation sideboard 18, be convenient for the fixed bonding between lens 20 and the installation sideboard 18, and guarantee the compactness of lens 20 after bonding.

The utility model discloses a theory of operation and use flow: in the actual packaging process of the portable LED package, firstly, the heat dissipation base plate 1 is connected with a packaging instrument by utilizing the connecting grooves 2 on two sides of the bottom of the heat dissipation base plate 1, then the base plate 5 is connected and fixed with the heat dissipation base plate 1 through the heat dissipation base 3, and when the heat dissipation base plate 1 is connected with the base plate 5, the consistency between the heat dissipation holes 4 on the bottom of the heat dissipation base plate 1 and the heat inlet through grooves 6 in the base plate 5 can be ensured, so that the heat generated when the bottom aluminum coating layer 11 of the LED chip 12 is reflected when the LED chip 12 operates can be discharged through the structure, and further the heat is prevented from being accumulated in the base plate 5, thereby influencing the operation of the LED chip 12 and prolonging the actual service;

after the position of the substrate 5 is established, a layer of transparent silica gel is coated in the adhesive coating groove 7 in the top surface of the substrate, then the reflecting layer 8 is adhered in the adhesive coating groove 7, then the aluminum coating layer 11 and the reflecting layer 8 are fixedly adhered by the transparent adhesive, after the aluminum coating layer 11 is fixedly adhered, the top surface of the LED chip 12 is adhered, after the LED chip 12 is adhered, the positive electrode plate 9 and the negative electrode plate 10 are respectively adhered on two sides of the LED chip 12, the LED chip 12 is respectively connected with the positive electrode plate 9 and the negative electrode plate 10 through the metal wire 15, the metal wire 15 is a gold wire, further the LED chip 12 has higher conductivity with the positive electrode plate 9 and the negative electrode plate 10, after the LED chip 12 is respectively connected with the positive electrode plate 9 and the negative electrode plate 10, finally a protective layer 13 is coated on the top surface of the LED chip 12 to protect the LED chip 12, a fluorescent layer 14 is coated on the top surface of the protective layer 13, and the fluorescent layer 14 is a mixture of fluorescent powder and epoxy resin, so that the top surface of the LED chip 12 has higher light transmittance;

after the LED chip 12 is filled, the connecting glue groove 16 on the inner side edge of the substrate 5 is filled with the silica gel layer 17, so that the packaging structure inside the substrate 5 is integrally protected, and finally, the lens 20 is fixedly bonded and connected with the mounting side plate 18 through the connecting seat 19 at the bottom end of the lens 20, and the lens 20 is mounted by using the mounting side plate 18 and the connecting seat 19, so that the mounting convenience of the lens 20 is improved, and the lens 20 is further mounted more quickly and conveniently.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A portable LED package, includes heat dissipation bottom plate (1), its characterized in that: the heat dissipation base plate comprises a heat dissipation base plate (1), connecting grooves (2) are symmetrically formed in two sides of the bottom of the heat dissipation base plate (1), a heat dissipation base (3) is fixedly installed in the middle of the top end of the heat dissipation base plate (1), heat dissipation holes (4) are formed in the middle of the bottom end of the heat dissipation base plate (1) and are equidistant from the corresponding positions of the heat dissipation base (3), a base plate (5) is fixedly installed at the top end of the heat dissipation base plate (3), a heat inlet through groove (6) is formed in the middle of the inner portion of the base plate (5) and corresponds to the heat dissipation base (3), a glue applying groove (7) is formed in the top surface of the base plate (5), a reflecting layer (8) is bonded in the glue applying groove (7), an anode electrode plate (9) is installed on one side of the reflecting layer (8), a cathode electrode plate (10) is installed on, the LED lamp is characterized in that an LED chip (12) is fixedly bonded on the top surface of the aluminum-plated layer (11), a protective layer (13) is bonded on the top surface of the LED chip (12), a fluorescent layer (14) is coated on the top surface of the protective layer (13), and the positive electrode plate (9) and the negative electrode plate (10) are connected with the LED chip (12) through metal wires (15).

2. The portable LED package of claim 1, wherein: the heat dissipation bottom plate (1) is made of metal or graphite heat and electricity conducting materials.

3. The portable LED package of claim 1, wherein: transparent adhesive is coated inside the adhesive applying groove (7), and the reflecting layer (8) is pasted on the cured transparent adhesive.

4. The portable LED package of claim 1, wherein: the metal wire (15) is a gold wire, the protective layer (13) is transparent silica gel, and the fluorescent layer (14) is made of a mixture of fluorescent powder and epoxy resin.

5. The portable LED package of claim 1, wherein: the utility model discloses a glass lamp, including base plate (5), inboard limit portion middle-end of base plate (5) has all been seted up and has been connected gluey groove (16), it has silica gel layer (17) to connect gluey groove (16) inside packing, installation sideboard (18) are all installed to base plate (5) top both sides limit portion, installation sideboard (18) inside embedding bonds has connecting seat (19), connecting seat (19) top is fixed to bond has lens (20).

6. The portable LED package of claim 5, wherein: the lens (20) is fixedly bonded with the mounting side plate (18) through the connecting seat (19), and the connecting seat (19) is fixedly bonded with the mounting side plate (18) through the fixing glue.