CN211295144U - LED device, LED lamp and lighting equipment - Google Patents

Abstract

The utility model relates to a LED technical field especially relates to a LED device, LED lamp and lighting apparatus, wherein, the LED device includes the base plate, ultraviolet LED chip and inorganic transparent, the concave reflection cup that is equipped with on the base plate, ultraviolet LED chip mounting is in the bottom of reflection cup, inorganic transparent is used for encapsulating ultraviolet LED chip in the reflection cup, the interior wall ring shape of reflection cup sets up round step face, inorganic transparent installs on the step face, set up the viscose layer between step face and the inorganic transparent, the height of step face is less than the planar height at the rim of a cup place of reflection cup, the contact width between step face and the inorganic transparent is 0 mu m ~ 150 mu m. The contact width of the step surface and the inorganic transparent part is set to be 0-150 mu m, so that bubbles or channels generated in the curing process of the adhesive layer can be effectively reduced, the air tightness is improved, meanwhile, a certain blocking effect can be formed on the adhesive layer by the position close to the line contact, the adhesive layer is prevented from flowing into the bottom of the reflecting cup, and the performance of an LED device is ensured.

Description

LED device, LED lamp and lighting equipment

Technical Field

The utility model relates to a LED technical field especially relates to a LED device and contain the LED lamp of this LED device, still relates to a lighting apparatus who contains this LED lamp.

Background

Semiconductor lighting, as a new generation of lighting technology, has many advantages: energy conservation, environmental protection, long service life, quick response and the like, and the development is very rapid in recent years. The ultraviolet LED has the advantages of small volume, long service life, high efficiency and the like, and has wide application prospect. At present, an inorganic packaging method is adopted for packaging an ultraviolet LED device, as shown in fig. 1 and 2, the existing ultraviolet LED device includes an LED support 1 ', a reflective cup 11' with an upward opening is disposed on the LED support 1 ', a ring of step surfaces 12 is annularly disposed on an inner wall of the reflective cup 11', a lower end surface of a glass cover 2 'is adhered to the step surfaces 12' by an adhesive 3 ', the step surfaces 12' are horizontally disposed, a contact area between the glass cover 2 'and the step surfaces 12' is large, and a chip 13 'located at the bottom of the reflective cup 11' is packaged by cooperation of the glass cover 2 'and the adhesive 3'. The prior art has the following defects: 1. the glass cover 2 'and the LED support 1' are connected through the adhesive 3 'to form a closed cavity, the contact area between the glass cover 2' and the step surface 12 'is large, air in the cavity expands and overflows when heated in the thermosetting process of the adhesive, bubbles are formed in the adhesive 3', a through channel is formed under serious conditions, and the air tightness of an ultraviolet LED device is influenced; 2. the adhesive 3 'is distributed on the step surface 12' of the LED support 1 'through surface tension, but the step surface 12' of the existing LED support 1 'is small in width and has no inclination, the adhesive 3' easily flows to the bottom of the reflecting cup 11 ', the performance of the ultraviolet LED device is influenced, meanwhile, the consistency of the glue amount on the step surface 12' is poor, and the consistency of the height of the whole ultraviolet LED device is further influenced.

SUMMERY OF THE UTILITY MODEL

An embodiment of the utility model provides a LED device to solve above-mentioned technical problem.

In a first aspect, an LED device is provided, which comprises a substrate, an ultraviolet LED chip and an inorganic transparent part, wherein a reflection cup is concavely arranged on the substrate, the ultraviolet LED chip is arranged at the bottom of the reflection cup, the inorganic transparent part is used for packaging the ultraviolet LED chip in the reflection cup, a circle of step surface is annularly arranged on the inner wall of the reflection cup, the inorganic transparent part is arranged on the step surface, an adhesive layer is arranged between the step surface and the inorganic transparent part, the height of the step surface is smaller than that of a plane where a cup opening of the reflection cup is located, and the contact width between the step surface and the inorganic transparent part is 0-150 μm.

As a preferable mode of the LED device, the step surface is an inclined surface, the step surface has a first end connected to an inner wall of the reflective cup and a second end near a center of the reflective cup, the first end is at a distance H1 from a bottom of the reflective cup, the second end is at a distance H2 from the bottom of the reflective cup, wherein H1 is smaller than H2, and the second end abuts against the inorganic transparent member.

As a preferable scheme of the LED device, an included angle beta between the step surface and the inner wall of the reflecting cup is 0-90 degrees.

As a preferable scheme of the LED device, the second end is arranged at a distance from the plane where the cup opening of the reflecting cup is located.

Preferably, the step surface is provided with a protruding abutting portion, the abutting portion has a connecting end connected to the step surface and an abutting end for abutting against the inorganic transparent member, and the width of the abutting end is 0 μm to 150 μm.

As a preferable mode of the LED device, the abutting portion is located at a non-end position of the step surface.

As a preferable mode of the LED device, the abutting portion is annularly provided on the step surface along a center of the reflecting cup.

As a preferable mode of the LED device, the abutting portion has a first side surface facing the inner wall of the reflecting cup and a second side surface facing the center of the reflecting cup, and upper ends of the first side surface and the second side surface intersect to form the abutting end.

As a preferable scheme of the LED device, an inclination angle between the first side surface and the step surface is α 1, an inclination angle between the second side surface and the step surface is α 2, and α 1 is not more than α 2.

As a preferable scheme of the LED device, an inclination angle between the first side surface and the step surface is α 1, an inclination angle between the second side surface and the step surface is α 2, and α 1 > α 2.

As a preferable mode of the LED device, the abutting end does not protrude from a rim of the reflecting cup.

In a second aspect, an LED lamp is also provided, which includes the LED device.

In a third aspect, a lighting device is also provided, which comprises the LED lamp.

The utility model discloses beneficial effect of embodiment: the contact width between the step surface and the inorganic transparent part is set to be 0-150 mu m, so that the contact area of the step surface and the inorganic transparent part is extremely small and close to line contact, bubbles or channels generated in the curing process of the adhesive layer can be effectively reduced, the air tightness is improved, meanwhile, the position close to the line contact can also form a certain blocking effect on the adhesive layer, the adhesive layer is prevented from flowing into the bottom of the reflecting cup, and the performance of an LED device is ensured.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention or the related art, the drawings required to be used in the description of the embodiments or the related art will be briefly described below, it is obvious that the drawings in the following description are only simplified schematic diagrams of some embodiments of the present invention or the related art, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic cross-sectional view of a conventional LED device.

Fig. 2 is a schematic cross-sectional view of a conventional LED mount.

Fig. 3 is a schematic cross-sectional view of an LED device according to an embodiment of the present invention.

Fig. 4 is a schematic cross-sectional view of a substrate according to an embodiment of the present invention.

Fig. 5 is a schematic cross-sectional view of an LED device according to another embodiment of the present invention.

Fig. 6 is a schematic cross-sectional view of a substrate according to another embodiment of the present invention.

Fig. 7 is a schematic cross-sectional view of an LED device according to another embodiment of the present invention.

Fig. 8 is a schematic cross-sectional view of a substrate according to another embodiment of the present invention.

In fig. 1 and 2:

1', an LED bracket; 11', a reflection cup; 12', a step surface; 13', a chip; 2', a glass cover; 3' and an adhesive layer.

In fig. 3 to 8:

1. a substrate; 11. a reflective cup; 12. an ultraviolet LED chip; 13. a step surface; 131. a first end; 132. a second end; 14. an abutting portion; 141. a butting end; 142. a first side surface; 143. a second side surface; 2. an inorganic transparent member; 3. and (5) gluing the layers.

Detailed Description

The technical solutions of the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.

In the description of the embodiments of the present invention, unless explicitly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the embodiments of the present invention can be understood in specific cases by those skilled in the art.

In embodiments of the invention, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features through another feature not in direct contact. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

Referring to fig. 3 to 8, an embodiment of the present invention provides a LED device, including substrate 1, ultraviolet LED chip 12 and inorganic transparent member 2, concave reflection cup 11 is equipped with on substrate 1, ultraviolet LED chip 12 is installed the bottom of reflection cup 11, inorganic transparent member 2 is used for with ultraviolet LED chip 12 encapsulates in reflection cup 11, the annular inner wall of reflection cup 11 sets up round step face 13, inorganic transparent member 2 is installed on step face 13, step face 13 with set up viscose layer 3 between the inorganic transparent member 2, step face 13 highly be less than the planar height at the rim of a cup place of reflection cup 11, step face 13 with contact width between the inorganic transparent member 2 is 0 μm ~ 150 μm. The contact width between the step surface 13 and the inorganic transparent part 2 is set to be 0-150 mu m, so that the contact area of the step surface and the inorganic transparent part is extremely small and close to line contact, bubbles or channels generated in the curing process of the adhesive layer 3 can be effectively reduced, the air tightness is improved, meanwhile, the position close to the line contact can also form a certain blocking effect on the adhesive layer 3, the adhesive layer 3 is prevented from flowing into the bottom of the reflecting cup 11, and the performance of an LED device is ensured. Preferably, the contact width between the step surface 13 and the inorganic transparent member 2 is 0 μm to 50 μm.

In one embodiment, as shown in fig. 3 and 4, the step surface 13 is an inclined surface, the step surface 13 has a first end 131 connecting the inner wall of the reflector cup 11 and a second end 132 near the center of the reflector cup 11, the first end 131 is at a distance H1 from the bottom of the reflector cup 11, the second end 132 is at a distance H2 from the bottom of the reflector cup 11, wherein H1 is smaller than H2, and the second end 132 abuts against the inorganic transparent member 2. By arranging the whole step surface 13 to be an inclined structure, and the second end 132 of the step surface 13 is higher than the first end 131, so that the step surface 13 and the inner wall of the reflecting cup 11 form a groove structure, the adhesive layer 3 can be effectively prevented from flowing to the bottom of the reflecting cup 11, the problem of light attenuation caused by organic materials such as the adhesive layer 3 is reduced, meanwhile, the consistency of the amount of the adhesive layer 3 on the step surface 13 of each LED device and the consistency of the height of each LED device after curing are ensured, and the second end 132 can form an approach line contact with the inorganic transparent member 2, so that the contact area between the step surface 13 and the inorganic transparent member 2 is effectively reduced, and bubbles and channels in the adhesive layer 3 are prevented from being generated.

In this embodiment: the included angle beta between the step surface 13 and the inner wall of the reflecting cup 11 is 0-90 degrees. Preferably, an included angle β between the step surface 13 and the inner wall of the reflector cup 11 is 30 ° to 60 °, which can satisfy both the processing difficulty of the substrate 1 and the position size of the step surface 13 of the substrate 1.

Further, the second end 132 is spaced from the plane of the rim of the reflective cup 11. This design can make inorganic transparency 2 can partially insert in reflection cup 11, utilizes the inner wall of reflection cup 11 to lead and spacing, reduces the installation degree of difficulty, increases the leakproofness simultaneously, because this design can make the area that viscose layer 3 pasted increase.

In another embodiment, as shown in fig. 5 to 8, an abutting portion 14 is convexly disposed on the step surface 13, the abutting portion 14 has a connecting end connected to the step surface 13 and an abutting end 141 for abutting the inorganic transparent member 2, the connecting end has a width larger than that of the abutting end 141, and the abutting end 141 has a width of 0 μm to 150 μm. The abutting end 141 can not only meet the requirement of approaching line contact with the inorganic transparent part 2 to prevent the generation of bubbles and channels in the adhesive layer 3, but also block the adhesive layer 3 to effectively prevent the adhesive layer 3 from flowing into the bottom of the reflecting cup 11.

In the present embodiment, the abutting portion 14 is annularly provided on the step surface 13 along the center of the reflecting cup 11. The annularly arranged abutting part 14 can improve the supporting stability, and the effect of the anti-sticking glue layer 3 flowing into the bottom of the reflecting cup 11 is better.

Of course, in other embodiments, a plurality of abutting portions 14 may be disposed at intervals along the center of the reflective cup 11, and the abutting portions 14 protrude from the step surface 13 at the same height and are all abutted against the inorganic transparent member 2.

Further, the abutting portion 14 has a first side 142 facing the inner wall of the reflector cup 11 and a second side 143 facing the center of the reflector cup 11, and the upper ends of the first side 142 and the second side 143 intersect to form the abutting end 141. The obliquely arranged first and second side surfaces 142, 143 facilitate the formation of abutting ends 141 that are in close line contact with the inorganic transparent member 2.

As shown in fig. 5 and 6, the first side surface 142 is inclined at an angle α 1 with respect to the step surface 13, and the second side surface 143 is inclined at an angle α 2 with respect to the step surface 13, where α 1 is α 2.

Of course, the inclination angle between the first side surface 142 and the step surface 13 is not limited to be equal to the inclination angle between the second side surface 143 and the step surface 13, and the inclination angle between the first side surface 142 and the step surface 13 may also be set to be smaller than the inclination angle between the second side surface 143 and the step surface 13 (as shown in fig. 7 and 8), that is, α 1 < α 2, or the inclination angle between the first side surface 142 and the step surface 13 may be set to be larger than the inclination angle between the second side surface 143 and the step surface 13, that is, α 1 > α 2.

As shown in fig. 5 and 6, the abutting portion 14 is located at a non-end position of the step surface 13. In the present embodiment, the abutting portion 14 is located at the center in the width direction of the step surface 13.

In other embodiments, as shown in fig. 7 and 8, the abutting portion 14 may be adjacent to one end of the step surface 13 close to the inner wall of the reflective cup 11, and the lower end of the first side surface 142 extends directly to a position where the inner wall of the reflective cup 11 intersects with the step surface 13.

Further, the abutting end 141 does not protrude from the rim of the reflecting cup 11. This design can make inorganic transparency 2 can partially insert in reflection cup 11, utilizes the inner wall of reflection cup 11 to lead and spacing, reduces the installation degree of difficulty, increases the leakproofness simultaneously, because this design can make the area that viscose layer 3 pasted increase.

In addition, a rough layer is formed on the step surface 13. The arrangement of the rough layer can enhance the bonding strength between the step surface 13 and the adhesive layer 3, and prevent the adhesive layer 3 from being separated from the step surface 13.

The inorganic transparent member 2 is glass, and further may be quartz glass, because quartz glass is the most preferable of all ultraviolet ray-emitting materials. The ultraviolet transmittance of the inorganic transparent member 2 is not less than 90%.

The cross section of the inorganic transparent member 2 is rectangular or hemispherical.

The substrate 1 is a ceramic substrate or a metal substrate, and in this embodiment, a ceramic substrate with better heat dissipation performance is preferred. The ceramic substrate comprises an upper surface circuit layer and a lower surface circuit layer which are electrically connected with the ultraviolet LED chip 12, and a conductive through hole which is communicated with the upper surface circuit layer and the lower surface circuit layer, wherein metal materials are partially or completely filled in the conductive through hole, and the metal materials in the upper surface circuit layer, the lower surface circuit layer and the conductive through hole are the same material, preferably copper in the embodiment. In a preferred embodiment, the surfaces of the upper surface circuit layer and the lower surface circuit layer can be plated with a layer of silver or gold, so as to improve the reflectivity and the welding performance of the device.

In other embodiments, the substrate 1 may also be a metal substrate, the metal substrate includes a first electrode and a second electrode, an insulating layer is disposed between the first electrode and the second electrode, and further, the inorganic transparent member 2 is filled between the first electrode and the second electrode.

In an embodiment of the present invention, there is further provided an LED lamp including the LED device of any of the above embodiments.

In the embodiment of the utility model provides an in, still provide a lighting apparatus, including the LED lamp of above-mentioned embodiment.

In the description herein, references to the description of "an embodiment," "an example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The technical principle of the present invention is described above with reference to specific embodiments. The description is made for the purpose of illustrating the principles of the invention and should not be construed in any way as limiting the scope of the invention. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without any inventive effort, which would fall within the scope of the present invention.

Claims (13)

1. The utility model provides a LED device, includes base plate, ultraviolet LED chip and inorganic transparent, the concave reflection cup that is equipped with on the base plate, the ultraviolet LED chip is installed the bottom of reflection cup, inorganic transparent is used for with the ultraviolet LED chip encapsulate in the reflection cup, its characterized in that: the reflecting cup is characterized in that a circle of step surface is annularly arranged on the inner wall of the reflecting cup, the inorganic transparent piece is installed on the step surface, an adhesive layer is arranged between the step surface and the inorganic transparent piece, the height of the step surface is smaller than that of a plane where the cup opening of the reflecting cup is located, and the contact width between the step surface and the inorganic transparent piece is 0-150 mu m.

2. The LED device of claim 1, wherein: the step surface is an inclined surface and is provided with a first end connected with the inner wall of the reflecting cup and a second end close to the center of the reflecting cup, the distance from the first end to the cup bottom of the reflecting cup is H1, the distance from the second end to the cup bottom of the reflecting cup is H2, H1 is smaller than H2, and the second end is abutted to the inorganic transparent piece.

3. The LED device of claim 2, wherein: the included angle beta between the step surface and the inner wall of the reflecting cup is 0-90 degrees.

4. The LED device of claim 2, wherein: the second end and the plane where the cup opening of the reflection cup is located are arranged at intervals.

5. The LED device of claim 1, wherein: the step surface is convexly provided with an abutting part, the abutting part is provided with a connecting end connected with the step surface and an abutting end used for abutting against the inorganic transparent piece, and the width of the abutting end is 0-150 mu m.

6. The LED device of claim 5, wherein: the abutting portion is located at a non-end position of the step surface.

7. The LED device of claim 5, wherein: the abutting part is annularly arranged on the step surface along the center of the reflecting cup.

8. The LED device of claim 5, wherein: the abutting part is provided with a first side surface facing the inner wall of the reflecting cup and a second side surface facing the center of the reflecting cup, and the upper ends of the first side surface and the second side surface are intersected to form the abutting end.

9. The LED device of claim 8, wherein: the inclination angle between the first side surface and the step surface is alpha 1, the inclination angle between the second side surface and the step surface is alpha 2, and alpha 1 is not more than alpha 2.

10. The LED device of claim 8, wherein: the inclination angle between the first side surface and the step surface is alpha 1, the inclination angle between the second side surface and the step surface is alpha 2, and alpha 1 is larger than alpha 2.

11. The LED device of claim 8, wherein: the abutting end does not protrude out of the cup opening of the reflection cup.

12. An LED lamp comprising the LED device according to any one of claims 1 to 11.

13. An illumination device, characterized by: comprising the LED lamp of claim 12.

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