CN102130277A - Light-emitting diode package - Google Patents

Light-emitting diode package Download PDF

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Publication number
CN102130277A
CN102130277A CN2010106156301A CN201010615630A CN102130277A CN 102130277 A CN102130277 A CN 102130277A CN 2010106156301 A CN2010106156301 A CN 2010106156301A CN 201010615630 A CN201010615630 A CN 201010615630A CN 102130277 A CN102130277 A CN 102130277A
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China
Prior art keywords
protuberance
emitting diode
light
recess
arrangement portion
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CN2010106156301A
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Chinese (zh)
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CN102130277B (en
Inventor
吴承玄
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LUMENS (KUNSHAN) CO Ltd
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LUMENS (KUNSHAN) CO Ltd
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Priority to CN 201010615630 priority Critical patent/CN102130277B/en
Publication of CN102130277A publication Critical patent/CN102130277A/en
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Abstract

The invention relates to a light-emitting diode package, comprising a light-emitting diode chip and a pin frame unit, wherein the pin frame unit comprises an installing part and a peripheral part; the light-emitting diode chip is arranged on the upper surface of the installing part; the peripheral part encloses the light-emitting diode chip; the installing part is provided with a second medium which shields the light-emitting diode chip; the peripheral part is provided with a first medium which shields the whole installing part and a part of the peripheral part; the peripheral part is provided with a first convex part and a first concave part; the first convex part encloses a light-emitting diode; the first convex part and the first concave part are shielded by the first medium; and the distance D1 from the top of the first convex part to the upper surface of the installing part is larger than the distance D2 from the top of the first convex part to the bottom surface of the first concave part. In the light-emitting diode package, the flowing of an adhesive on the adhesive-coated surface in the light-emitting diode package can be effectively controlled, the influence of the adhesive over the specific range on the light-emitting diode chip can be avoided, the reject ratio of the light-emitting diode can be reduced and the service life of the light-emitting diode is prolonged.

Description

A kind of LED package
Technical field
The present invention relates to a kind of LED package.
Background technology
Light-emitting diode (light emitting diode) is luminous to carry out behind the electronics of the P-N semiconductor of electric current bonding (P-N junction) intersection and the electron collision.At present, light-emitting diode electric weight long than other luminous element life-span, that consume is little, and corresponding speed and resistance to impact are good, and have characteristics miniature, the lightweight aspect, therefore, and the also more and more wider model in its use field.Light-emitting diode generally encapsulates (Package) back by light-emitting diode chip for backlight unit and constitutes, and this LED package generally is installed on the printed circuit board (PCB), forms electrode from printed circuit board (PCB) and produces behind the electric current luminous.LED package is the bonding formation encapsulation of various structural elements or medium, live various structural elements or medium can use adhesive for bonding, but, surface at coated adhesive, excessive can the generation of adhesive flowed, and flow to the coated scope that need not, like this, can make LED package produce bad, reduce its useful life.
Summary of the invention
The object of the invention provides a kind of LED package.
For achieving the above object, the technical solution used in the present invention is:
A kind of LED package, comprise light-emitting diode chip for backlight unit, the nead frame unit, described nead frame unit comprises arrangement portion, be arranged on described arrangement portion periphery all around, described arrangement portion has upper surface and lower surface, described light-emitting diode chip for backlight unit is arranged on the upper surface of described arrangement portion, described periphery is surrounded described light-emitting diode chip for backlight unit, described arrangement portion is provided with second medium, described second medium covers described light-emitting diode chip for backlight unit, described periphery is provided with first medium, described first medium covers whole described arrangement portion and the described periphery of part, described periphery has first protuberance, first recess that is connected and is provided with described first protuberance, described first protuberance is surrounded described light-emitting diode, described first protuberance, first recess is covered by described first medium, the top of described first protuberance to the distance D 1 of the upper surface of described arrangement portion greater than the top of described first protuberance distance D 2 to the bottom surface of described first recess.
Preferably, have second protuberance on the described periphery, described second protuberance is connected by extension with first recess, and described second protuberance part is covered by described first medium.
Further preferably, what be connected with described second protuberance on the described periphery is provided with second recess, and described second recess is connected by extension with first recess.Described extension has at least one horizontal segment, and the ratio of vertical height D4 of lower surface of described arrangement portion is arrived more than or equal to 1, smaller or equal to 2 in described horizontal segment surface to the vertical height D3 of the lower surface of described arrangement portion and the bottom surface of described first recess.Described extension is connected by tiltedly broken portion with first recess.
Preferably, described first medium is connected with second protuberance of periphery, described second medium be connected with first protuberance of described periphery and the junction to the distance D 5 of the upper surface of described arrangement portion greater than the top of described first protuberance distance D 1 to the upper surface of described arrangement portion.
Preferably, described nead frame unit comprises nead frame, the mould that is provided with terminal, and described arrangement portion is wholely set mutually with nead frame.
Further preferably, described periphery is wholely set mutually with nead frame.Described nead frame is provided with at least one recess.
Because technique scheme utilization, the present invention compared with prior art has following advantage and effect: the present invention can effectively control the flowing of adhesive of coated surface of pressure-sensitive adhesive in the LED package, avoid adhesive overshoot scope that the light-emitting diode die is exerted an influence, reduce the fraction defective of light-emitting diode, increase its useful life.
Description of drawings
Accompanying drawing 1 is the structural representation of the embodiment of the invention one;
Accompanying drawing 2 is the structural representation of nead frame unit in the embodiment of the invention one;
Accompanying drawing 3 is an III portion enlarged drawing in the accompanying drawing 1;
Accompanying drawing 4 is the structural representation of the embodiment of the invention two;
Accompanying drawing 5 is a V portion enlarged drawing in the accompanying drawing 4;
Accompanying drawing 6 is the structural representation of the embodiment of the invention three.
Wherein: 1, LED package; 100, light-emitting diode chip for backlight unit; 200, nead frame unit; 300, arrangement portion; 310, nead frame; 312, first recess; 314, second recess; 315, the 3rd recess; 316, terminal; 400, periphery; 410, mould; 412, first protuberance; 414, first recess; 416, second protuberance; 418, second recess; 419, extension; 420, ramp; 500, adhesive; 600, first medium; 700, second medium.
Embodiment
Below in conjunction with drawings and Examples the present invention is further described:
Embodiment one:
As Fig. 1,2 described a kind of Light-Emitting Diode encapsulation 1, light-emitting diode chip for backlight unit 100, nead frame unit 200.
Wherein: nead frame unit 200 comprises arrangement portion 300, periphery 400.Arrangement portion 300 has upper surface and lower surface, and light-emitting diode chip for backlight unit 100 is connected the upper surface of arrangement portion 300 and is positioned at its center.Periphery 400 is enclosed in light-emitting diode chip for backlight unit 100 wherein than arrangement portion's 300 height.
Periphery 400 has first protuberance 412, second recess, 418, the first recesses 416 of first recess, 414, the second protuberances 416 that are provided with of being connected with first protuberance 412, the setting that is connected with second protuberance 416 are connected by extension 419 with second recess 418.
Wherein, first protuberance 412 is in periphery 400 the most inboard formation protruding upward, light-emitting diode chip for backlight unit in the arrangement portion 300 100 is surrounded, and first protuberance 412 and arrangement portion 300 are connected by the inclined-plane, and the light that light-emitting diode chip for backlight unit 100 sends is by this inclined-plane reflection ray that makes progress.First recess 414 is recesses that the outer periphery of and then first protuberance 412 forms.The top of first protuberance 412 to the distance D 1 of the upper surface of arrangement portion 300 greater than the top of first protuberance 412 distance D 2, i.e. D1-D2 to the bottom surface of first recess 418 0, as shown in Figure 3.
Second protuberance 416 is in the formation protruding upward of periphery 400 outermost, and second protuberance 416 is connected by the inclined-plane with second recess, and the light that light-emitting diode chip for backlight unit 100 sends is by this inclined-plane reflection ray that makes progress.Second recess 418 is to follow second protuberance, the 416 inboard recesses that form on every side.
Extension 419 is between first recess 412 and second recess 418, both are coupled together, extension 419 at least a portion are formed at horizontal segment, and extension 419 also can be formed with the state of constant slope, have between the extension 419 and first recess 414 by ramp 420 to connect.The ratio of vertical height D4 of lower surface of arrangement portion 300 is arrived more than or equal to 1, smaller or equal to 2 in the horizontal segment of extension 419 surface to the vertical height D3 of the lower surface of arrangement portion 300 and the bottom surface of first recess 412, i.e. 1＜=D3/D4＜=2.
Arrangement portion 300 is provided with second medium, 700, the second media 700 light-emitting diode chip for backlight unit 100 is encapsulated in wherein, and periphery 400 is provided with first medium, 600, the first media 600 whole arrangement portion 300 and part periphery 400 are encapsulated in wherein.First medium 600 is the resin of transparent material, waits such as silicon (Silicone) resin and forms, and the light that first medium 600 sends from light-emitting diode chip for backlight unit 100 is up assembled or spread.Be encapsulated on the LED package 1 by adhesive 500 at coated adhesive 500, the first media 600 on the periphery 600.Second medium 700 comprises fluorescent material, and this fluorescent material is that silicate (Silicate) is fluorescent material or nitride based fluorescent material.The outer periphery of second medium 700 is near around the inboard of first protuberance 412, that is to say that second medium 700 wrapped by first protuberance 412, overflows toward periphery 400 in the time of can preventing 700 encapsulation of second medium.The junction of second medium 700 and first protuberance 412 to the distance D 5 of the upper surface of arrangement portion greater than the top of first protuberance 412 distance D 1, i.e. D1 – D5 to the upper surface of arrangement portion 300 0.
Adhesive 500 is on periphery 400, and adhesive 500 has flowability, so might flow down from extension 419, gather in first recess 414 in the adhesive 500 that flows down and the outside inboard and second recess 418 at extension 419, and just reduced from the possibility that periphery 400 flows out, promptly prevent the situation of adhesive 500, reduce fraction defective from flowing out by periphery 400.Consider the situation that adhesive 500 flows out, the width of first recess 414 and second recess 418 arrives 0.35mm at 0.05mm.Simultaneously, arranged the stopping of first protuberance 412 of first recess, 414 inboards, the adhesive of assembling at first recess 414 500 flows to arrangement portion 300 by first protuberance 412 or situation about flowing on second medium 700 can be controlled.In addition, if extension 419 is arranged to horizontal segment, also can reduce the possibility that adhesive 500 flows.
In the present embodiment, extension 419 is connected by tiltedly broken portion 420 with first recess 414, and in the time of excessive the overflowing of 500 liquid such as grade of the adhesive on the extension 419, these liquid flow down along ramp 420, accumulate in first recess 414.The light that shines ramp 420 surfaces in addition can reflect, and can improve the light diffuser efficiency of LED package 1.
Nead frame unit 200 comprises nead frame 310, mould 410.Arrangement portion 300 is wholely set and is provided with in the middle with nead frame 310, and nead frame 310 is provided with the plural terminals 316 that receives power supply.Periphery 400 belongs to the part of mould 410.
Nead frame 310 is provided with first recess 312 and second recess 314.First recess 312 is arranged on the bottom of extension 419, will center on around the arrangement portion 300.Second recess 314 is arranged on second protuberance, 416 bottoms, and promptly second recess 314 is arranged between second protuberance, 416 bottoms and the terminal 316.First recess 312 and second recess 314 can increase the contact area of mould 410 and nead frame 310, and mould 410 can be more stable touches nead frame 310.Because of the cause of first recess 312 and second recess 314, the route of moisture or foreign matter infiltration is elongated, effectively prevents the moisture or the foreign matter that permeate in the gap of mould 410 and nead frame 310.First recess 312 effectively prevents the foreign matter of arrangement portion 300 infiltrations of nead frame 310, and second recess 314 prevents the moisture or the foreign matter of terminal 316 infiltrations of nead frame 310.So because of the fraction defective of the cause LED package 1 of first recess 312 and second recess 314 reduces.
Embodiment two:
A kind of LED package 1 as shown in Figure 4, present embodiment and embodiment one are basic identical, the top that difference is first protuberance 412 to the distance D 1 of the upper surface of arrangement portion 300 greater than the upper surface of arrangement portion 300 distance D 6 to extension 419 surfaces, be D1-D6〉0, as shown in Figure 5.Like this, can prevent that the adhesive 500 on the extension 419 from penetrating into the situation of chip placing portion 300 by first protuberance 412.
Embodiment three:
A kind of LED package 1 as shown in Figure 6, present embodiment and embodiment one are basic identical, and difference is that periphery 400 and nead frame 310 are wholely set.Be that nead frame 310 mid portions form arrangement portion 300, form periphery 400 around the arrangement portion 300 of nead frame 310.The upside of the periphery of being made up of nead frame 310 400 has first protuberance 312 and first recess 314.In addition, be that with embodiment one difference mould 410 forms second protuberance 416.
The nead frame 310 of second protuberance, 416 bottoms has gap permeation of moisture or the foreign matter that the 3rd recess 315, the three recesses 315 prevent 410 on nead frame 310 and mould, can improve the bonding strength of nead frame 310 and mould 410.
Nead frame 310 is to be made of metal material, and face also is that metal material constitutes around the inboard of periphery 400, can improve the luminous reflecting effect of light-emitting diode chip for backlight unit 100.
The foregoing description only is explanation technical conceive of the present invention and characteristics, and its purpose is to allow the personage who is familiar with this technology can understand content of the present invention and enforcement according to this, can not limit protection scope of the present invention with this.All equivalences that spirit is done according to the present invention change or modify, and all should be encompassed within protection scope of the present invention.

Claims (9)

1. LED package, comprise light-emitting diode chip for backlight unit, the nead frame unit, described nead frame unit comprises arrangement portion, be arranged on described arrangement portion periphery all around, described arrangement portion has upper surface and lower surface, described light-emitting diode chip for backlight unit is arranged on the upper surface of described arrangement portion, described periphery is surrounded described light-emitting diode chip for backlight unit, described arrangement portion is provided with second medium, described second medium covers described light-emitting diode chip for backlight unit, described periphery is provided with first medium, described first medium covers whole described arrangement portion and the described periphery of part, it is characterized in that: described periphery has first protuberance, first recess that is connected and is provided with described first protuberance, described first protuberance is surrounded described light-emitting diode, described first protuberance, first recess is covered by described first medium, the top of described first protuberance to the distance D 1 of the upper surface of described arrangement portion greater than the top of described first protuberance distance D 2 to the bottom surface of described first recess.
2. a kind of LED package according to claim 1, it is characterized in that: have second protuberance on the described periphery, described second protuberance is connected by extension with first recess, and described second protuberance part is covered by described first medium.
3. a kind of LED package according to claim 2 is characterized in that: what be connected with described second protuberance on the described periphery is provided with second recess, and described second recess is connected by extension with first recess.
4. a kind of LED package according to claim 2, it is characterized in that: described extension has at least one horizontal segment, and the ratio of vertical height D4 of lower surface of described arrangement portion is arrived more than or equal to 1, smaller or equal to 2 in described horizontal segment surface to the vertical height D3 of the lower surface of described arrangement portion and the bottom surface of described first recess.
5. a kind of LED package according to claim 2 is characterized in that: described extension is connected by tiltedly broken portion with first recess.
6. a kind of LED package according to claim 1, it is characterized in that: described first medium is connected with second protuberance of periphery, described second medium be connected with first protuberance of described periphery and the junction to the distance D 5 of the upper surface of described arrangement portion greater than the top of described first protuberance distance D 1 to the upper surface of described arrangement portion.
7. a kind of LED package according to claim 1 is characterized in that: described nead frame unit comprises nead frame, the mould that is provided with terminal, and described arrangement portion is wholely set mutually with nead frame.
8. a kind of LED package according to claim 7 is characterized in that: described periphery is wholely set mutually with nead frame.
9. a kind of LED package according to claim 7 is characterized in that: described nead frame is provided with at least one recess.
CN 201010615630 2010-12-31 2010-12-31 Light-emitting diode package Active CN102130277B (en)

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Application Number Priority Date Filing Date Title
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Application Number Priority Date Filing Date Title
CN 201010615630 CN102130277B (en) 2010-12-31 2010-12-31 Light-emitting diode package

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CN102130277A true CN102130277A (en) 2011-07-20
CN102130277B CN102130277B (en) 2013-06-05

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103165762A (en) * 2011-12-12 2013-06-19 展晶科技(深圳)有限公司 Manufacturing method of light-emitting diode
CN103649619A (en) * 2011-07-29 2014-03-19 东芝照明技术株式会社 Light-emitting device and illumination device
KR20140061797A (en) * 2012-11-14 2014-05-22 엘지이노텍 주식회사 Light emitting device and light apparatus having thereof
WO2016146068A1 (en) * 2015-03-18 2016-09-22 青岛杰生电气有限公司 Deep ultraviolet light source and packaging method therefor
JP2018148110A (en) * 2017-03-08 2018-09-20 スタンレー電気株式会社 Light-emitting device and manufacturing method therefor

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1684278A (en) * 2004-04-15 2005-10-19 联欣光电股份有限公司 Packaging structure of light emitting diode and its packaging method
CN201307605Y (en) * 2008-12-05 2009-09-09 弘凯光电(深圳)有限公司 LED packaging structure
CN101533884A (en) * 2008-03-12 2009-09-16 财团法人工业技术研究院 Light emitting diode packaging structure and manufacturing method thereof
KR200447448Y1 (en) * 2007-11-29 2010-01-25 (주)솔라루체 Lead Frame Package for LED Device and LED Package using the same
KR20100024076A (en) * 2008-08-25 2010-03-05 삼성전기주식회사 Led package
CN201936917U (en) * 2010-12-31 2011-08-17 昆山琉明光电有限公司 Light-emitting diode packaging structure

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1684278A (en) * 2004-04-15 2005-10-19 联欣光电股份有限公司 Packaging structure of light emitting diode and its packaging method
KR200447448Y1 (en) * 2007-11-29 2010-01-25 (주)솔라루체 Lead Frame Package for LED Device and LED Package using the same
CN101533884A (en) * 2008-03-12 2009-09-16 财团法人工业技术研究院 Light emitting diode packaging structure and manufacturing method thereof
KR20100024076A (en) * 2008-08-25 2010-03-05 삼성전기주식회사 Led package
CN201307605Y (en) * 2008-12-05 2009-09-09 弘凯光电(深圳)有限公司 LED packaging structure
CN201936917U (en) * 2010-12-31 2011-08-17 昆山琉明光电有限公司 Light-emitting diode packaging structure

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103649619A (en) * 2011-07-29 2014-03-19 东芝照明技术株式会社 Light-emitting device and illumination device
CN103649619B (en) * 2011-07-29 2015-07-22 东芝照明技术株式会社 Light-emitting device and illumination device
CN103165762A (en) * 2011-12-12 2013-06-19 展晶科技(深圳)有限公司 Manufacturing method of light-emitting diode
KR20140061797A (en) * 2012-11-14 2014-05-22 엘지이노텍 주식회사 Light emitting device and light apparatus having thereof
KR101997247B1 (en) * 2012-11-14 2019-07-08 엘지이노텍 주식회사 Light emitting device and light apparatus having thereof
WO2016146068A1 (en) * 2015-03-18 2016-09-22 青岛杰生电气有限公司 Deep ultraviolet light source and packaging method therefor
JP2018148110A (en) * 2017-03-08 2018-09-20 スタンレー電気株式会社 Light-emitting device and manufacturing method therefor

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