CN102130277B - Light-emitting diode package - Google Patents

Light-emitting diode package Download PDF

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Publication number
CN102130277B
CN102130277B CN 201010615630 CN201010615630A CN102130277B CN 102130277 B CN102130277 B CN 102130277B CN 201010615630 CN201010615630 CN 201010615630 CN 201010615630 A CN201010615630 A CN 201010615630A CN 102130277 B CN102130277 B CN 102130277B
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China
Prior art keywords
protuberance
emitting diode
light
recess
arrangement section
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CN 201010615630
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Chinese (zh)
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CN102130277A (en
Inventor
吴承玄
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LUMENS (KUNSHAN) CO Ltd
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LUMENS (KUNSHAN) CO Ltd
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Abstract

The invention relates to a light-emitting diode package, comprising a light-emitting diode chip and a pin frame unit, wherein the pin frame unit comprises an installing part and a peripheral part; the light-emitting diode chip is arranged on the upper surface of the installing part; the peripheral part encloses the light-emitting diode chip; the installing part is provided with a second medium which shields the light-emitting diode chip; the peripheral part is provided with a first medium which shields the whole installing part and a part of the peripheral part; the peripheral part is provided with a first convex part and a first concave part; the first convex part encloses a light-emitting diode; the first convex part and the first concave part are shielded by the first medium; and the distance D1 from the top of the first convex part to the upper surface of the installing part is larger than the distance D2 from the top of the first convex part to the bottom surface of the first concave part. In the light-emitting diode package, the flowing of an adhesive on the adhesive-coated surface in the light-emitting diode package can be effectively controlled, the influence of the adhesive over the specific range on the light-emitting diode chip can be avoided, the reject ratio of the light-emitting diode can be reduced and the service life of the light-emitting diode is prolonged.

Description

A kind of LED package
Technical field
The present invention relates to a kind of LED package.
Background technology
Light-emitting diode (light emitting diode) is luminous to carry out after the electronics of the P-N semiconductor of electric current bonding (P-N junction) intersection and electron collision.At present, light-emitting diode long than other in luminous element life-span, electric weight that consume is little, and corresponding speed and resistance to impact are good, and have the characteristics of miniature, lightweight aspect, and therefore, its use field is more and more wider model also.Light-emitting diode is generally encapsulated after (Package) by light-emitting diode chip for backlight unit and consists of, and this LED package generally is arranged on printed circuit board (PCB), forms after the electrode generation current luminous from printed circuit board (PCB).LED package is the bonding formation encapsulation of various structural elements or medium, live various structural elements or medium can use adhesive for bonding, but, surface at coated adhesive, excessive can the generation of adhesive flowed, and flow to the coated scope that need not, like this, can make LED package produce bad, reduce its useful life.
Summary of the invention
The object of the invention is to provide a kind of LED package.
For achieving the above object, the technical solution used in the present invention is:
a kind of LED package, comprise light-emitting diode chip for backlight unit, the nead frame unit, described nead frame unit comprises arrangement section, be arranged on the periphery of described arrangement section surrounding, described arrangement section has upper surface and lower surface, described light-emitting diode chip for backlight unit is arranged on the upper surface of described arrangement section, described periphery is surrounded described light-emitting diode chip for backlight unit, be provided with second medium in described arrangement section, described second medium covers described light-emitting diode chip for backlight unit, be provided with first medium on described periphery, described first medium covers whole described arrangement section and the described periphery of part, described periphery has the first protuberance, the first recess that is connected with described the first protuberance and arranges, described the first protuberance is surrounded described light-emitting diode, described the first protuberance, the first recess is covered by described first medium, the top of described the first protuberance to the distance B 1 of the upper surface of described arrangement section greater than the top of described the first protuberance distance B 2 to the bottom surface of described the first recess.
Preferably, have the second protuberance on described periphery, described the second protuberance is connected by extension with the first recess, and described the second protuberance part is covered by described first medium.
Further preferably, what be connected with described the second protuberance on described periphery is provided with the second recess, and described the second recess is connected by extension with the first recess.Described extension has at least one horizontal segment, and the ratio of vertical height D4 of lower surface of described arrangement section is arrived more than or equal to 1, less than or equal to 2 in described horizontal segment surface to the vertical height D3 of the lower surface of described arrangement section and the bottom surface of described the first recess.Described extension is connected by ramp with the first recess.
Preferably, described first medium is connected with the second protuberance of periphery, described second medium be connected with the first protuberance of described periphery and the junction to the distance B 5 of the upper surface of described arrangement section less than the top of described the first protuberance distance B 1 to the upper surface of described arrangement section.
Preferably, described nead frame unit comprises nead frame, the mould that is provided with terminal, and described arrangement section is wholely set mutually with nead frame.
Further preferably, described periphery is wholely set mutually with nead frame.Be provided with at least one recess on described nead frame.
Because technique scheme is used, the present invention compared with prior art has following advantages and effect: the present invention can effectively control the flowing of adhesive of coated surface of pressure-sensitive adhesive in LED package, avoiding adhesive to exceed prescribed limit exerts an influence to the light-emitting diode die, reduce the fraction defective of light-emitting diode, increase its useful life.
Description of drawings
Accompanying drawing 1 is the structural representation of the embodiment of the present invention one;
Accompanying drawing 2 is the structural representation of nead frame unit in the embodiment of the present invention one;
Accompanying drawing 3 is III section enlarged drawing in accompanying drawing 1;
Accompanying drawing 4 is the structural representation of the embodiment of the present invention two;
Accompanying drawing 5 is V section enlarged drawing in accompanying drawing 4;
Accompanying drawing 6 is the structural representation of the embodiment of the present invention three.
Wherein: 1, LED package; 100, light-emitting diode chip for backlight unit; 200, nead frame unit; 300, arrangement section; 310, nead frame; 312, the first recess; 314, the second recess; 315, the 3rd recess; 316, terminal; 400, periphery; 410, mould; 412, the first protuberance; 414, the first recess; 416, the second protuberance; 418, the second recess; 419, extension; 420, ramp; 500, adhesive; 600, first medium; 700, second medium.
Embodiment
The invention will be further described below in conjunction with drawings and Examples:
Embodiment one:
As Fig. 1,2 described a kind of Light-Emitting Diodes encapsulation 1, light-emitting diode chip for backlight unit 100, nead frame unit 200.
Wherein: nead frame unit 200 comprises arrangement section 300, periphery 400.Arrangement section 300 has upper surface and lower surface, and light-emitting diode chip for backlight unit 100 is connected to the upper surface of arrangement section 300 and is positioned at its center.Periphery 400 is enclosed in light-emitting diode chip for backlight unit 100 wherein than arrangement section's 300 height.
Periphery 400 has the first protuberance 412, the first recess 414, the second protuberances 416 that arrange that are connected with the first protuberance 412, the second recess 418, the first recesses 416 that are connected setting with the second protuberance 416 are connected by extension 419 with the second recess 418.
Wherein, the first protuberance 412 is in the most inboard formation protruding upward of periphery 400, light-emitting diode chip for backlight unit 100 in arrangement section 300 is surrounded, and the first protuberance 412 is connected by the inclined-plane with arrangement section 300, and the light that light-emitting diode chip for backlight unit 100 sends is by this inclined-plane reflection ray that makes progress.The first recess 414 is recesses that the outer periphery of and then the first protuberance 412 forms.The top of the first protuberance 412 to the distance B 1 of the upper surface of arrangement section 300 greater than the top of the first protuberance 412 distance B 2 to the bottom surface of the first recess 418, i.e. D1-D2 0, as shown in Figure 3.
The second protuberance 416 is in periphery 400 outermost formation protruding upward, and the second protuberance 416 is connected by the inclined-plane with the second recess, and the light that light-emitting diode chip for backlight unit 100 sends is by this inclined-plane reflection ray that makes progress.The second recess 418 is to follow the second inboard recess that forms of protuberance 416 on every side.
Extension 419 is between the first recess 412 and the second recess 418, both are coupled together, extension 419 at least a portion are formed at horizontal segment, and extension 419 also can be formed with the state of constant slope, have between extension 419 and the first recess 414 by ramp 420 to connect.The ratio of vertical height D4 of lower surface of arrangement section 300 is arrived more than or equal to 1, less than or equal to 2 in the horizontal segment of extension 419 surface to the vertical height D3 of the lower surface of arrangement section 300 and the bottom surface of the first recess 412, i.e. 1＜=D3/D4＜=2.
Be provided with second medium 700 in arrangement section 300, second medium 700 is encapsulated in light-emitting diode chip for backlight unit 100 wherein, is provided with first medium 600 on periphery 400, and first medium 600 is encapsulated in whole arrangement section 300 and part periphery 400 wherein.First medium 600 is the resin of transparent material, and such as silicon (Silicone) resin etc. forms, first medium 600 is up assembled or spreads from the light that light-emitting diode chip for backlight unit 100 sends.Coated adhesive 500 on periphery 600, first medium 600 is encapsulated on LED package 1 by adhesive 500.Second medium 700 comprises fluorescent material, and this fluorescent material is that silicate (Silicate) is fluorescent material or nitride based fluorescent material.The outer periphery of second medium 700 is near around the inboard of the first protuberance 412, that is to say that second medium 700 wrapped by the first protuberance 412, overflows toward periphery 400 in the time of can preventing second medium 700 encapsulation.The junction of second medium 700 and the first protuberance 412 to the distance B 5 of the upper surface of arrangement section less than the top of the first protuberance 412 distance B 1 to the upper surface of arrangement section 300, i.e. D1 – D5 0.
Adhesive 500 is on periphery 400, and adhesive 500 has mobility, so might flow down from extension 419, gather in first recess 414 in the adhesive 500 that flows down and the outside inboard at extension 419 and the second recess 418, and just reduced from the possibility that periphery 400 flows out, namely prevent the situation of adhesive 500 from flowing out by periphery 400, reduce fraction defective.Consider the situation that adhesive 500 flows out, the width of the first recess 414 and the second recess 418 arrives 0.35mm at 0.05mm.Simultaneously, arranged the stopping of the first protuberance 412 of the first recess 414 inboards, the adhesive 500 of assembling at the first recess 414 flows to arrangement section 300 by the first protuberance 412 or situation about flowing on second medium 700 can be controlled.In addition, if extension 419 is arranged to horizontal segment, also can reduce the possibility that adhesive 500 flows.
In the present embodiment, extension 419 is connected by ramp 420 with the first recess 414, and in the time of adhesive 500 excessive the overflowing such as liquid such as grade on extension 419, these liquid flow down along ramp 420, are gathered in the first recess 414.The light that shines in addition ramp 420 surfaces can reflect, and can improve the light diffuser efficiency of LED package 1.
Nead frame unit 200 comprises nead frame 310, mould 410.Arrangement section 300 is wholely set and arranges in the middle with nead frame 310, and nead frame 310 is provided with the plural terminals 316 that receives power supply.Periphery 400 belongs to the part of mould 410.
Nead frame 310 is provided with the first recess 312 and the second recess 314.The first recess 312 is arranged on the bottom of extension 419, with around arrangement section 300 around.The second recess 314 is arranged on the second protuberance 416 bottoms, and namely the second recess 314 is arranged between the second protuberance 416 bottoms and terminal 316.The first recess 312 and the second recess 314 can increase the contact area of mould 410 and nead frame 310, and mould 410 can be more stable touches nead frame 310.Because of the cause of the first recess 312 and the second recess 314, the route of moisture or foreign matter infiltration is elongated, effectively prevents the moisture or the foreign matter that permeate in the gap of mould 410 and nead frame 310.The first recess 312 effectively prevents the foreign matter of arrangement section 300 infiltrations of nead frame 310, and the second recess 314 prevents moisture or the foreign matter of terminal 316 infiltrations of nead frame 310.So because the fraction defective of the cause LED package 1 of the first recess 312 and the second recess 314 reduces.
Embodiment two:
A kind of LED package 1 as shown in Figure 4, the present embodiment and embodiment one are basic identical, the top that difference is the first protuberance 412 to the distance B 1 of the upper surface of arrangement section 300 greater than the upper surface of arrangement section 300 distance B 6 to extension 419 surfaces, be D1-D6〉0, as shown in Figure 5.Like this, can prevent that the adhesive 500 on extension 419 from penetrating into the situation of chip placing section 300 by the first protuberance 412.
Embodiment three:
A kind of LED package 1 as shown in Figure 6, the present embodiment and embodiment one are basic identical, and difference is that periphery 400 and nead frame 310 are wholely set.Be that nead frame 310 mid portions form arrangement section 300, form periphery 400 around the arrangement section 300 of nead frame 310.The upside of the periphery 400 that is comprised of nead frame 310 has the first protuberance 312 and the first recess 314.In addition, be that with embodiment one difference mould 410 forms the second protuberance 416.
The nead frame 310 of the second protuberance 416 bottoms has gap permeation of moisture or the foreign matter that the 3rd recess 315, the three recesses 315 prevent 410, nead frame 310 and mould, can improve the bonding strength of nead frame 310 and mould 410.
Nead frame 310 is to be made of metal material, and around the inboard of periphery 400, face is also that metal material consists of, and can improve the luminous reflecting effect of light-emitting diode chip for backlight unit 100.
Above-described embodiment only is explanation technical conceive of the present invention and characteristics, and its purpose is to allow person skilled in the art scholar can understand content of the present invention and implement according to this, can not limit protection scope of the present invention with this.All equivalences that Spirit Essence is done according to the present invention change or modify, within all should being encompassed in protection scope of the present invention.

Claims (7)

1. LED package, comprise light-emitting diode chip for backlight unit, the nead frame unit, described nead frame unit comprises arrangement section, be arranged on the periphery of described arrangement section surrounding, described arrangement section has upper surface and lower surface, described light-emitting diode chip for backlight unit is arranged on the upper surface of described arrangement section, described periphery is surrounded described light-emitting diode chip for backlight unit, be provided with second medium in described arrangement section, described second medium covers described light-emitting diode chip for backlight unit, be provided with first medium on described periphery, described first medium covers whole described arrangement section and the described periphery of part, it is characterized in that: described periphery has the first protuberance, the first recess that is connected with described the first protuberance and arranges, described the first protuberance is surrounded described light-emitting diode, described the first protuberance, the first recess is covered by described first medium, the top of described the first protuberance to the distance B 1 of the upper surface of described arrangement section greater than the top of described the first protuberance distance B 2 to the bottom surface of described the first recess, has the second protuberance on described periphery, described the second protuberance is connected by extension with the first recess, described the second protuberance part is covered by described first medium, described extension has at least one horizontal segment, and the ratio of vertical height D4 of lower surface of described arrangement section is arrived more than or equal to 1, less than or equal to 2 in described horizontal segment surface to the vertical height D3 of the lower surface of described arrangement section and the bottom surface of described the first recess.
2. a kind of LED package according to claim 1 is characterized in that: what be connected with described the second protuberance on described periphery is provided with the second recess, and described the second recess is connected by extension with the first recess.
3. a kind of LED package according to claim 1, it is characterized in that: described extension is connected by ramp with the first recess.
4. a kind of LED package according to claim 1, it is characterized in that: described first medium is connected with the second protuberance of periphery, described second medium be connected with the first protuberance of described periphery and the junction to the distance B 5 of the upper surface of described arrangement section less than the top of described the first protuberance distance B 1 to the upper surface of described arrangement section.
5. a kind of LED package according to claim 1 is characterized in that: described nead frame unit comprises nead frame, the mould that is provided with terminal, and described arrangement section is wholely set mutually with nead frame.
6. a kind of LED package according to claim 5, it is characterized in that: described periphery is wholely set mutually with nead frame.
7. a kind of LED package according to claim 5, is characterized in that: be provided with at least one recess on described nead frame.
CN 201010615630 2010-12-31 2010-12-31 Light-emitting diode package Active CN102130277B (en)

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Application Number Priority Date Filing Date Title
CN 201010615630 CN102130277B (en) 2010-12-31 2010-12-31 Light-emitting diode package

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Application Number Priority Date Filing Date Title
CN 201010615630 CN102130277B (en) 2010-12-31 2010-12-31 Light-emitting diode package

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CN102130277B true CN102130277B (en) 2013-06-05

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Publication number Priority date Publication date Assignee Title
CN103649619B (en) * 2011-07-29 2015-07-22 东芝照明技术株式会社 Light-emitting device and illumination device
CN103165762A (en) * 2011-12-12 2013-06-19 展晶科技(深圳)有限公司 Manufacturing method of light-emitting diode
KR101997247B1 (en) * 2012-11-14 2019-07-08 엘지이노텍 주식회사 Light emitting device and light apparatus having thereof
CN104701438B (en) * 2015-03-18 2017-11-03 青岛杰生电气有限公司 Deep ultraviolet light source and its method for packing
JP2018148110A (en) * 2017-03-08 2018-09-20 スタンレー電気株式会社 Light-emitting device and manufacturing method therefor

Citations (4)

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Publication number Priority date Publication date Assignee Title
CN1684278A (en) * 2004-04-15 2005-10-19 联欣光电股份有限公司 Packaging structure of light emitting diode and its packaging method
CN201307605Y (en) * 2008-12-05 2009-09-09 弘凯光电(深圳)有限公司 LED packaging structure
CN101533884A (en) * 2008-03-12 2009-09-16 财团法人工业技术研究院 Light emitting diode packaging structure and manufacturing method thereof
CN201936917U (en) * 2010-12-31 2011-08-17 昆山琉明光电有限公司 Light-emitting diode packaging structure

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200447448Y1 (en) * 2007-11-29 2010-01-25 (주)솔라루체 Lead Frame Package for LED Device and LED Package using the same
KR20100024076A (en) * 2008-08-25 2010-03-05 삼성전기주식회사 Led package

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1684278A (en) * 2004-04-15 2005-10-19 联欣光电股份有限公司 Packaging structure of light emitting diode and its packaging method
CN101533884A (en) * 2008-03-12 2009-09-16 财团法人工业技术研究院 Light emitting diode packaging structure and manufacturing method thereof
CN201307605Y (en) * 2008-12-05 2009-09-09 弘凯光电(深圳)有限公司 LED packaging structure
CN201936917U (en) * 2010-12-31 2011-08-17 昆山琉明光电有限公司 Light-emitting diode packaging structure

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