KR20100024076A - Led package - Google Patents

Led package Download PDF

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Publication number
KR20100024076A
KR20100024076A KR1020080082760A KR20080082760A KR20100024076A KR 20100024076 A KR20100024076 A KR 20100024076A KR 1020080082760 A KR1020080082760 A KR 1020080082760A KR 20080082760 A KR20080082760 A KR 20080082760A KR 20100024076 A KR20100024076 A KR 20100024076A
Authority
KR
South Korea
Prior art keywords
lens
package
molding material
led
led package
Prior art date
Application number
KR1020080082760A
Other languages
Korean (ko)
Inventor
김경태
Original Assignee
삼성전기주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전기주식회사 filed Critical 삼성전기주식회사
Priority to KR1020080082760A priority Critical patent/KR20100024076A/en
Publication of KR20100024076A publication Critical patent/KR20100024076A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Abstract

The present invention relates to an LED package, comprising: a package mold accommodating a part of a lead frame therein and having a molding material injection space formed therein; A lens seating portion formed on an inner surface of the package mold in an upper portion of the molding material injection space, and formed of an uneven portion; An LED chip mounted on the lead frame inside the package mold; A lens supported by the convex portion of the lens seat and tightly coupled to the lens seat; And an encapsulant interposed on the bottom surface of the package mold and the lens.

Description

LED package {LED package}

The present invention relates to an LED package, and more particularly, to an LED package having a structure that can improve the light extraction efficiency by preventing leakage of the encapsulant when the package mold and the lens adhesion.

In general, a light emitting diode (LED) is an electronic component that generates a small number of carriers (electrons or holes) injected by using a p-n junction structure of a semiconductor and emits light by recombination thereof.

Such LEDs are used for home appliances, remote controls, electronic signs, indicators, and various automation devices because they can irradiate light with high efficiency at low voltage.

In particular, according to the trend toward miniaturization and slimming of information and communication devices, various components such as resistors, capacitors, and noise filters are becoming more miniaturized, and surface-mount devices for directly mounting LEDs on a printed circuit board (PCB). (Surface Mount Device, hereinafter referred to as SMD). Accordingly, LED lamps, which are used as display elements, have also been developed as SMDs. These SMDs can replace conventional simple lighting lamps, which are used as lighting indicators, character indicators, and image indicators of various colors.

1 is a cross-sectional view for explaining the problem of the LED package according to the prior art.

As shown in FIG. 1, the LED package 10 according to the related art includes a lead frame 11 including at least one pair of lead terminals and the lead frame 11 therein, and a molding material at a central portion thereof. A package body 12 having an injection space 15 formed therein, an LED chip 13 mounted on one of the lead terminals positioned inside the package body 12, the LED chip 13, A molding material filled in the wire 14 for energizing the lead frame 11 and the molding material injection space 15 of the package body 12 to protect the LED chip 13 and the wire 14 ( 16).

Here, on the molding material 16, an adhesive 17 for attaching the lens 18 and the package body 12 to each other is applied by a dispensing method or the like, and the molding material to which the adhesive 17 is applied ( On the package body 12 including the 16, a lens 18 for dissipating the light generated from the LED chip 13 with high light efficiency is coupled. At this time, as the adhesive 17, a liquid silicone resin is generally used, and the silicone resin is gradually cured over time.

However, when the liquid silicone resin used as the adhesive 17 is overcoated, in the process of bonding the lens 18 on the package body 12, the silicone resin is formed of the lens 18 and the package body ( Leakage into the interspace of 12) overflows the upper surface of the lens 18, or voids are generated. Due to this phenomenon, a path of light generated from the LED chip 13 is changed, thereby causing a problem that the light extraction efficiency of the LED chip 13 is lowered.

In addition, when the lens 18 is not properly fixed to the package body 12 by the silicone resin, and the lens 18 moves left and right, the optical axes of the lens 18 and the LED chip 13 do not coincide. If not, there is a problem that the durability of the LED package 10 may be lowered.

Accordingly, the present invention, when the lens is tightly coupled to the upper portion of the lens mounting portion having an uneven portion formed on the inner surface of the package mold, the sealing material leaks to the outside of the package mold through the discharge portion formed between the lens and the recess of the lens mounting portion, The purpose is to provide an LED package that can prevent the phenomenon from overflowing to the top surface.

LED package according to an embodiment of the present invention for achieving the above object is a package mold for receiving a portion of the lead frame therein, the molding material injection space is formed; A lens seating portion formed on an inner surface of the package mold in an upper portion of the molding material injection space, and formed of an uneven portion; An LED chip mounted on the lead frame inside the package mold; A lens supported by the convex portion of the lens seat and tightly coupled to the lens seat; And an encapsulant interposed on the bottom surface of the package mold and the lens.

In addition, the main portion of the lens mounting portion and the lens may be provided with a discharge portion formed spaced apart.

In addition, a wire for electrical connection between the LED chip and the leadframe may be further included.

In addition, a molding material may be filled in the molding material filling space to protect the LED chip.

In addition, the molding agent may further include a phosphor.

In addition, a dam for preventing the encapsulant flow may be formed at an outer circumference of the lens seating portion.

In addition, a lower convex portion may be formed under the lens.

As described above, the LED package according to the present invention, when the lens is tightly coupled to the upper portion of the lens mounting portion having an uneven portion formed on the inner surface of the package mold, the encapsulant is packaged through the discharge portion formed between the lens and the recess of the lens mounting portion By leaking outside the mold, it is possible to prevent the phenomenon overflowing to the upper surface of the lens and the generation of voids.

Therefore, the present invention can prevent the path of the light generated from the LED chip is changed, it is possible to improve the light extraction efficiency of the LED chip to improve the durability of the LED package.

Details regarding the operational effects including the technical configuration of the printed circuit board according to the present invention will be clearly understood by the following detailed description with reference to the drawings in which preferred embodiments of the present invention are shown.

2 and 3 will be described in detail with respect to the LED package module according to an embodiment of the present invention.

2 is an exploded perspective view of the LED package module according to an embodiment of the present invention, Figure 3 is a cross-sectional view of the LED package module cut along the line II 'shown in FIG.

As shown in FIGS. 2 and 3, the LED package 100 according to an exemplary embodiment of the present invention includes a lead frame 110 including a pair of lead terminals and a molding material injection space while accommodating the lead frame 110 therein. The package mold 120 having the 123 formed thereon, the LED chip 130 mounted on the lead frame 110 in the package mold 120, the lens 140 coupled to the package mold 120, and the package. It includes a mold 120 and the encapsulant 150 interposed on the bottom surface of the lens 140.

In this case, a conventional LED chip is applied to the LED chip 130, and preferably, a GaN-based LED chip may be used. In addition, the LED chip 130 and the lead frame 110 are electrically connected to each other by wire bonding. At this time, the wire 133 is preferably made of mainly gold (Au).

The package mold 120 is generally formed by pre-molding and is typically made of thermoplastic resin. At this time, as a thermoplastic resin, high heat resistant resins, such as a liquid crystal poly (LCP), a thermoplastic (PPS), and crystalline polystyrene, can be used.

In addition, at least two lens seating portions 125 formed of the uneven parts 125a and 125b are provided on the inner surface of the package mold 120 on the molding material injection space 123.

In addition, the molding material injection space 123 inside the package mold 120 is filled with a molding material 135 to protect the LED chip 130 and the wire 133. The molding material 135 is preferably made of a transparent epoxy, a silicone resin, or a mixed resin thereof, and a known process such as a dispensing process may be used as an injection process of the molding material 135.

In addition, the molding material 135 may further include at least one phosphor (not shown) so that the light source provided to the backlight unit appears as white light. The phosphor is a material that absorbs and emits light emitted from the LED chip 130 or absorbs and emits light emitted from another phosphor.

Therefore, the light of the R, G, B wavelength band generated by the difference in the semiconductor material constituting the LED chip 130 when the LED chip 130 is emitted by the phosphor contained in the molding material 135 The light may be converted into white light and emitted from the LED package 100 to provide a white light source.

The convex portion 125a of the lens seating portion 125 formed on the inner surface of the package mold 120 in which the molding material 135 is filled. The lens 140 for dissipating light generated from the LED chip 130 with high light efficiency is tightly coupled. In this case, the shape of the lens 140 may have various shapes such as concave shape, convex shape or hemispherical shape in order to increase the orientation angle. The lens 140 may be made of epoxy, silicone resin, urethane resin, or a mixture thereof, and may be manufactured through a mold.

Here, an encapsulant 150 is interposed between the bottom surface of the lens 140 and the package mold 120 including the molding material 135.

The encapsulant 150 is for adhering the lens 140 and the package mold 120 to each other. The encapsulant 150 is gradually cured over time after being applied to the molding material 135 by a dispensing method. The lens 140 and the package mold 120 are coupled to each other.

In addition, when the lens 140 is tightly coupled to the convex portion 125a of the lens seating part 125, the lens 140 and the recessed part 125b of the lens seating part 125 are spaced apart from each other to discharge the part 127. ) Is formed. The discharge part 127 is bonded to the lens 140 and the package mold 120 by the encapsulant 150, and the encapsulant 150 is connected to the package mold through the discharge part 127. (120) serves to leak to the outside.

In addition, an encapsulant flow prevention dam 129 having a predetermined depth is formed at an outer circumference of the lens seating part 125 so that the encapsulant 150 leaked through the discharge part 127 is the encapsulant flow prevention dam. Flowing to 129 prevents it from flowing out of the LED package 100.

The lower convex portion 143 formed of the same material as the lens 140 is formed under the lens 140. When the lens 140 is bonded to the package mold 120, that is, the bottom surface of the lens 140 is pressed on the molding material 135, the encapsulant 150 applied to the molding material 135. While spreading to both sides along the inclined surface of the convex portion 143 of the lens 140, it is possible to prevent the generation of voids generated when the lens 140 and the package mold 120 is bonded.

In addition, the encapsulant 150 generally uses a liquid silicone resin or a UV adhesive cured by UV irradiation. In addition, in addition to the UV adhesive, the encapsulant 150 may be applied to any encapsulant that is easily adhered between the lens 140 and the package mold 120.

As such, when the LED package 100 according to the embodiment of the present invention is closely coupled to the lens 140 on the lens seating portion 125 having the uneven parts 125a and 125b formed on the inner surface of the package mold 120, The encapsulant 150 leaks into the package mold 120 through the discharge part 127 formed between the lens 140 and the recessed portion 125b of the lens seating part 125. It is possible to prevent the phenomenon and voids overflowing to the upper surface of the).

Therefore, since the present invention can prevent the path of the light generated from the LED chip 130 from changing, it is possible to improve the light extraction efficiency of the LED chip 130 to improve the durability of the LED package 100.

Although the preferred embodiments of the present invention described above have been described in detail, those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom.

Accordingly, the scope of the present invention is not limited to the disclosed embodiments, and various modifications and modifications of those skilled in the art using the basic concept of the present invention as defined in the following claims also belong to the scope of the present invention.

1 is a cross-sectional view for explaining the problem of the LED package according to the prior art.

2 is an exploded perspective view of the LED package module according to an embodiment of the present invention.

3 is a cross-sectional view of the LED package module cut along the line II ′ shown in FIG. 2.

<Explanation of symbols for the main parts of the drawings>

100: LED package 110: lead frame

120: package mold 123: molding material injection space

125: lens seat 125a: convex

125b: main part 127: discharge part

129: dam for preventing the flow of encapsulant

130: LED chip 133: wire

135: molding material 140: lens

143: convex portion 150: molding material

Claims (7)

A package mold accommodating a part of the lead frame therein and having a molding material injection space formed therein; A lens seating portion formed on an inner surface of the package mold in an upper portion of the molding material injection space, and formed of an uneven portion; An LED chip mounted on the lead frame inside the package mold; A lens supported by the convex portion of the lens seat and tightly coupled to the lens seat; And An encapsulant interposed on the package mold and the bottom surface of the lens; LED package comprising a. The method of claim 1, The LED package having a discharge portion formed by separating the main portion of the lens mounting portion and the lens. The method of claim 1, The LED package further comprises a wire for the electrical connection of the LED chip and the leadframe. The method of claim 1, An LED package filled with a molding material to protect the LED chip in the molding material filling space. The method of claim 4, wherein The molding agent further comprises an LED package phosphor. The method of claim 1, LED package is formed on the outer periphery of the lens mounting portion dam for preventing the encapsulant flow. The method of claim 1, An LED package having a lower convex portion formed below the lens.
KR1020080082760A 2008-08-25 2008-08-25 Led package KR20100024076A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020080082760A KR20100024076A (en) 2008-08-25 2008-08-25 Led package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020080082760A KR20100024076A (en) 2008-08-25 2008-08-25 Led package

Publications (1)

Publication Number Publication Date
KR20100024076A true KR20100024076A (en) 2010-03-05

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080082760A KR20100024076A (en) 2008-08-25 2008-08-25 Led package

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102130277A (en) * 2010-12-31 2011-07-20 昆山琉明光电有限公司 Light-emitting diode package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102130277A (en) * 2010-12-31 2011-07-20 昆山琉明光电有限公司 Light-emitting diode package

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