KR100643919B1 - Light emitting diode package with lens - Google Patents

Abstract

An LED package is provided to improve a light extraction efficiency by preventing the leak of a silicon resin using a screw connection structure composed of a male screw and a female screw. An LED package comprises a package body, an LED chip, a wire, a molding member, and a lens. The package body(220) includes one or more pairs of lead terminals(210a,210b). A molding member injected space is defined in the package body. A male screw portion(221) is formed at an outer periphery of the package body. The LED chip(230) is mounted on the lead terminal. The wire(240) is used for connecting electrically the LED chip with the lead terminals. The molding member(250) is injected into the package body to protect the LED chip and the wire. The lens(270) is formed on the resultant structure. The lens is composed of a light transmitting portion(270a) and a connecting portion(270b) with a female screw portion(271) corresponding to the male screw portion of the package body.

Description

Light emitting diode package with lens

1 is a cross-sectional view illustrating a problem of a light emitting diode package having a lens according to the prior art.

2 and 3 are cross-sectional views showing a light emitting diode package having a lens according to an embodiment of the present invention.

<Description of Symbols for Main Parts of Drawings>

210a, 210b: lead terminal 210: lead frame

220: package body 221: male part

230: LED chip 240: wire

250: molding material 260: silicone resin

270a: light transmitting portion 270b: coupling portion

270: lens 271: female thread

The present invention relates to a light emitting diode package having a lens, and more particularly, to a light emitting diode package having a lens capable of preventing leakage of silicon resin and improving light extraction efficiency.

In general, a light emitting diode (LED) is an electronic component that generates a small number of carriers (electrons or holes) injected by using a p-n junction structure of a semiconductor and emits light by recombination thereof. In other words, when a forward voltage is applied to a semiconductor of a specific element, electrons and holes move through the junction of the anode and the cathode and recombine with each other. Release.

Such a light emitting diode can be irradiated with high efficiency light at low voltage, and thus is used in home appliances, remote controls, electronic signs, indicators, and various automation devices.

In particular, according to the trend toward miniaturization and slimming of information and communication devices, various components such as resistors, capacitors, and noise filters are becoming more compact, and surface-mounted diodes are directly mounted on a printed circuit board (PCB). It is made of a device (Surface Mount Device, hereinafter referred to as SMD). Accordingly, LED lamps used as display elements have also been developed in SMD type. These SMDs can replace conventional simple lighting lamps, which are used as lighting indicators, character indicators, and image indicators of various colors.

As mentioned above, as the usage area of LEDs becomes wider, the amount of luminance required such as electric lamps used for living and electric lamps for rescue signals is gradually increasing. In recent years, high output light emitting diodes have been widely used.

1 is a cross-sectional view illustrating a problem of a light emitting diode package having a lens according to the prior art.

As shown in FIG. 1, a light emitting diode package having a lens according to the related art includes a lead frame 110 including at least one pair of lead terminals 110a and 110b and the lead frame 110 therein. A package body 120 formed of a synthetic resin material, an LED chip 130 mounted on one of the lead terminals 110a of the lead terminals 110a and 110b located inside the package body 120, and the Molding material for protecting the LED chip 130 and the wire 140 is filled in the wire 140 for energizing the LED chip 130 and the lead terminals (110a, 110b), and the package body 120. Made of 150.

Here, on the molding material 150, an adhesive 160 for attaching the lens 170 and the package body 120 to each other is applied by a dispensing method or the like, and the molding material coated with the adhesive 160 ( On the package body 120 including the 150, a lens 170 for dissipating light generated from the LED chip 130 with high light efficiency is coupled. At this time, as the adhesive 160, a liquid silicone resin is generally used, and the silicone resin is gradually cured over time.

However, when the liquid silicone resin used as the adhesive 160 is overcoated, in the process of bonding the lens 170 on the package body 120, the silicone resin is the lens 170 and the package body ( A phenomenon occurs that leaks into the space between 120 and overflows to the upper surface of the lens 170. The phenomenon causes a change in the path of light generated from the LED chip 130, thereby reducing the light extraction efficiency of the LED device. Problems arise.

In addition, when the lens 170 is not properly fixed to the package body 120 by the silicone resin, and the lens 170 moves left and right, the optical axes of the lens 170 and the LED chip 130 do not coincide. There is a problem that may not be, and the durability of the package may be reduced.

Accordingly, the present invention has been made to solve the above problems, and an object of the present invention is to effectively fix the lens and the package body while preventing the leakage of silicone resin, thereby improving the light extraction efficiency of the LED element, and at the same time, the lens And to provide a light emitting diode package having a lens that can match the optical axis of the LED chip, and improve the durability of the package.

A light emitting diode package having a lens according to the present invention for achieving the above object,

A package body accommodating one or more lead terminals therein and defining a molding material injection space, the male body having a male screw portion formed on an outer circumferential surface thereof;

An LED chip mounted on the lead terminal inside the package body;

A wire for electrical connection between the LED chip and the lead terminal;

A molding material injected into the package body to protect the LED chip and the wire; And

And a lens including a light transmitting portion coupled to the package body including the molding material, and integrally formed with the light transmitting portion, a female thread formed on an inner circumferential surface thereof, and a coupling portion screwed to a male screw portion on an outer circumferential surface of the package body. do.

Here, the coupling portion of the lens, characterized in that extending from both the lower portion to the lower side of the light transmitting portion.

And, it characterized in that it further comprises a silicone resin interposed between the light transmitting portion of the lens and the package body including the molding material.

The light transmitting portion of the lens may be a convex lens or a Fresnel lens of a predetermined form.

In addition, the Fresnel lens is characterized in that the center is made of a convex lens shape, and the concave-convex shape that is symmetrical around the convex lens.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention.

2 and 3 are cross-sectional views showing a light emitting diode package having a lens according to an embodiment of the present invention, Figure 2 shows a light emitting diode package having a convex lens, Figure 3 is a light emission having a Fresnel lens Shown is a diode package.

First, as shown in FIG. 2, a light emitting diode package having a lens according to an exemplary embodiment of the present invention includes a lead frame 210 including at least one pair of lead terminals 210a and 210b and the lead frame 210. The inside of the package body 220 formed by pre-molding to define the molding material injection space while receiving the inside, and the lead terminal 210a of any one of the lead terminals 210a and 210b located inside the package body 220. The LED chip 230 mounted thereon and a wire 240 for energizing the LED chip 230 and the lead terminals 210a and 210b.

Here, the LED chip of the conventional method is applied to the LED chip 230, preferably a GaN-based LED chip may be used. In addition, the wire 240 is mainly made of gold (Au).

In addition, a male screw portion 221 is formed on an outer circumferential surface of the package body 220 formed by pre-molding, and the package body 220 on which the male screw portion 221 is formed is mainly made of plastic or the like.

In addition, a molding material 250 for protecting the LED chip 230 and the wire 240 is injected into the molding material injection space inside the package body 220, and a package in which the molding material 250 is injected. On the body 220, a light transmitting portion 270a of the lens 270 is configured to emit light generated from the LED chip 230 with high light efficiency through the silicon resin 260.

The molding material 250 may be made of any one selected from the group consisting of a transparent epoxy, silicon, and phosphor mixture. In addition, the silicone resin 260 is applied on the molding material 250 to adhere the lens 270 and the package body 220 to each other, which is gradually cured over time.

In this case, the lens 270 is further provided with an engaging portion 270b formed integrally with the light transmitting portion 270a and having an internal thread portion 271 formed therein. The coupling part 270b extends downward from both of the light transmitting part 270a and the female screw part 271 formed on the inner circumferential surface of the coupling part 270b is a male screw formed on the outer circumferential surface of the package body 220. It is screwed with the part 221.

As described above, the LED package including the lens according to the embodiment of the present invention includes a male screw portion 221 formed on the outer circumferential surface of the package body 220 and a light emitting portion 270a of the lens 270. Since the female screw portion 271 formed on the inner circumferential surface of the coupling portion 270b extending to both lower sides thereof is coupled to each other by screwing, the package body 220 including the molding material 250 and the light transmitting portion of the lens 270. Even if the silicone resin 260 formed between the 270a is overcoated in the coating process, it may be prevented from leaking to the outside of the package.

Therefore, according to the exemplary embodiment of the present invention, the silicon resin 260 may be prevented from overflowing to the upper surface of the lens 270, and is generated from the LED chip 230 by the silicon resin leaking to the surface of the lens 270. It is possible to prevent the path of the light to be changed. As a result, the light extraction efficiency of the LED device can be prevented from being lowered.

In addition, according to the embodiment of the present invention, as described above, the light-transmitting portion 270a of the lens 270 is coupled to the upper portion of the package body 220 by an adhesive such as the silicone resin 260, Since the lens 270 and the package body 220 are coupled to each other by screwing the male screw part 221 formed on the outer circumferential surface of the package body 220 and the female screw part 271 formed on the inner circumferential surface of the coupling part 270b. By preventing the left and right movement of the lens 270, the lens 270 may be more effectively fixed to the package body 220. Therefore, by matching the optical axis of the lens 270 and the LED chip 230, there is an effect that can improve the light extraction efficiency, and improve the durability of the package.

On the other hand, as shown in FIG. 2, the light transmitting part 270a of the lens 270 may be a convex lens, but as shown in FIG. 3, a Fresnel lens of a predetermined form may be used.

At this time, the shape of the Fresnel lens, as shown in Figure 3, the center is a convex lens shape, and is made of a concave-convex shape symmetrically around the convex lens, the height of the concave-convex shape is the height of the convex lens Similar.

Fresnel lens having such a shape has the advantage that the height is reduced compared to the convex lens as shown in Figure 2, can reduce the volume of the package, and maintain the same brightness.

Although the preferred embodiments of the present invention have been described in detail above, those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom. Accordingly, the scope of the present invention is not limited thereto, and various modifications and improvements of those skilled in the art using the basic concept of the present invention as defined in the following claims also fall within the scope of the present invention.

As described above, according to the light emitting diode package having a lens according to the present invention, a male screw portion formed on the outer circumferential surface of the package body and a female screw portion formed on the inner circumferential surface of the coupling portion extending to both lower sides of the light transmitting portion of the lens are mutually screwed together. As a result, the silicone resin formed between the package body including the molding material and the light transmitting portion of the lens may be prevented from leaking to the outside of the package. Therefore, the present invention can prevent the silicon resin from leaking to the lens surface, thereby preventing the path of light generated from the LED chip from changing, thereby preventing the light extraction efficiency of the LED device from being lowered.

In addition, the lens resin is coupled to the upper portion of the package body by the silicone resin, and the male screw portion formed on the outer circumferential surface of the package body and the female screw portion formed on the inner circumferential surface of the coupling portion to interconnect the lens and the package body. By combining, by preventing the left and right movement of the lens, it is possible to more effectively fix the lens to the package body. Therefore, by matching the optical axis of the lens and the LED chip, the light extraction efficiency can be improved, there is an effect that can improve the durability of the package.

Claims (5)

A package body having a male screw portion formed on an outer circumferential surface thereof while accommodating one or more lead terminals therein and defining a molding material injection space; An LED chip mounted on the lead terminal inside the package body; A wire for electrical connection between the LED chip and the lead terminal; A molding material injected into the package body to protect the LED chip and the wire; And And a lens including a light transmitting portion coupled to the package body including the molding material, and integrally formed with the light transmitting portion, a female thread formed on an inner circumferential surface thereof, and a coupling portion screwed to a male screw portion on an outer circumferential surface of the package body. A light emitting diode package provided with a lens. The method of claim 1, The coupling portion of the lens, the light emitting diode package having a lens, characterized in that extending from the light emitting portion to both lower sides. The method of claim 1, And a silicon resin interposed between the light transmitting portion of the lens and the package body including the molding material. The method of claim 1, The light emitting part of the lens is a light emitting diode package having a lens, characterized in that the convex lens or a predetermined type Fresnel lens. The method of claim 4, wherein The Fresnel lens is a convex lens in the center, the light emitting diode package having a lens, characterized in that the concave-convex shape is symmetrical around the convex lens.

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