JP2012099545A - Light-emitting device and manufacturing method of the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light-emitting device capable of suppressing the degradation of adhesion between a base material formed with a conductive pattern on its surface, and resin for partially coating the base material, and capable of reducing electric resistance; and a manufacturing method of the same.SOLUTION: A light-emitting device 10 comprises: a pair of conductive patterns 2a and 2b; a light-emitting element 3 which is electrically connected to the pair of the conductive patterns 2a and 2b; and resin 5 which is provided around the light-emitting element and coats a part of the pair of the conductive patterns 2a, 2b, on an insulating base material 1. The pair of the conductive patterns 2a and 2b are respectively extended from resin coating portions coated by the resin 5 toward an outer edge of the base material 1. On at least the resin coating portions of the pair of the conductive patterns 2a and 2b, through-holes 6a and 6b having long shapes in the extending direction of the conductive patterns 2a and 2b and to which the surface of the base material 1 is exposed are provided.

Description

  The present invention relates to a light-emitting device in which a side surface of a light-emitting element is covered with a light-reflective resin and a method for manufacturing the same.

  Semiconductor light emitting elements such as light emitting diodes (LEDs) and laser diodes (LDs) are used as various light sources. Particularly in recent years, light-emitting diodes have attracted attention as next-generation lighting with lower power consumption and longer life as a light source for lighting instead of fluorescent lamps, and further improvements in light-emitting output and light-emitting efficiency are required. Yes. There is also a need for a light source that has a high luminance and a specific light distribution, for example, a hemispherical light distribution called a lambertian, such as a projector such as a headlight of a car or a floodlight. . In order to control the light distribution, a light emitting device in which the side surface of the light emitting element is covered with a light reflecting member has been proposed.

  As such a light-emitting device, for example, a light-emitting device 900 described in Patent Document 1 has been proposed, and a cross-sectional view of the light-emitting device 900 is shown in FIG. The light emitting device 900 includes an LED element 901 and a ceramic case 904 on which the LED element 901 is mounted. The case 904 has an opening on the light extraction side, and the LED element 901 is placed inside the opening. Further, the case 904 is filled with a coating material 903 containing light reflecting particles, and the outer surface area of the LED element 901 excluding the light extraction surface is covered with the coating material 903.

  In addition, a sheet-like phosphor layer 902 is disposed on the outer surface of the molded coating material 903 and on the light extraction surface. The phosphor layer 902 is made of a resin containing a phosphor such as YAG (Yttrium Aluminum Garnet) that emits wavelength-converted light (yellow light) when excited by receiving radiation light (blue light) from the LED element 901. Become. The phosphor layer 902 is configured to cover the entire light extraction surface of the LED element 901, and further has a light emitting surface exposed to the light extraction side. Thereby, the primary light (blue light) from the LED element 901 and the secondary light (yellow light) obtained by wavelength-converting a part of the primary light are mixed, and white light is obtained from the light emitting surface.

  Patent Documents 2 and 3 propose light emitting devices in which light emitting elements are mounted on a flat substrate. A light-emitting device 910 described in Patent Document 2 is shown in FIG. The light-emitting device 910 includes a light-transmitting member 912 including a phosphor that converts the wavelength of light from the light-emitting element 911 on the upper surface of the light-emitting element 911, and the side surfaces of the light-emitting element 911 and the light-transmitting member 912 are light-reflective materials. 913 is covered.

  Further, Patent Document 4 and Patent Document 5 propose a light-emitting device in which a frame surrounding a light-emitting element is formed with a white resin and a transparent sealing resin is filled in the frame.

JP 2007-19096 A WO 2009/069671 JP 2009-218274 A JP 05-29665 A JP 2009-182307 A

  As described above, Patent Documents 1 to 3 propose a method of forming a light-reflective resin that covers the side surface of a light-emitting element. However, as described in Patent Document 1, when an opening is provided in a ceramic case with good heat dissipation and the light reflective resin is filled in the opening, the opening is formed by partially removing the ceramic sheet. There is a need. This increases the number of processes, and the processing accuracy when forming the openings in the ceramics is not good, resulting in a decrease in yield and an increase in cost.

  Further, Patent Document 2 and Patent Document 3 propose a method of forming a light-reflective resin on a flat substrate without providing an opening, but the productivity is not sufficient. For example, when the frame body that dams the light-reflective resin is formed of the same material as that of the substrate, the yield may be reduced and the cost may be increased, as in the above-mentioned Patent Document 1. In addition, when a method of removing the frame body after molding the light reflective resin using the frame body, a part of the light reflective resin is peeled off from the substrate together with the frame body when the frame body is removed. There is a case.

  In addition, in Patent Documents 1 to 5 described above, a conductive pattern for causing a current to flow through a light emitting element covered with a white resin or a light emitting element surrounded by a white resin is proposed. Adhesion between the white resin and the substrate was not sufficient.

  Therefore, the present invention is a new technique capable of suppressing a decrease in adhesion between a base material having a conductive pattern formed on its surface and a resin partially covering the base material and capable of reducing electrical resistance. An object of the present invention is to provide a light emitting device and a manufacturing method thereof.

  In order to achieve the above object, a light-emitting device of the present invention includes a pair of conductive patterns, a light-emitting element electrically connected to the pair of conductive patterns, and a periphery of the light-emitting element on an insulating substrate. And a resin covering a part of the pair of conductive patterns, wherein the pair of conductive patterns respectively extend from the resin-coated portion coated with the resin toward the outer edge of the base material. In addition, at least the resin coating portion of the pair of conductive patterns has a through-hole having a long shape along the extending direction of the conductive pattern and exposing the surface of the base material.

The light emitting device described above can be combined with the following configurations.
A part of the through hole is exposed from the resin coating portion.
A plurality of the through holes are provided in each of the conductive patterns.
The through hole has a substantially rectangular shape with the extending direction of the conductive pattern as a longitudinal direction.
The pair of conductive patterns has a width greater than that of the light emitting element.
The base material is a ceramic substrate.

  Further, in the method for manufacturing a light emitting device of the present invention, a light emitting element connecting portion to which a light emitting element is connected is extended on the base material toward the outer edge of the base material, and along the extending direction. A conductive pattern forming step of forming a pair of conductive patterns having through holes in which the surface of the base material is exposed in a long shape, and electrically connecting the light emitting elements to the light emitting element connecting portions of the pair of conductive patterns A light emitting element connecting step, and a resin frame forming step of discharging a linear first resin so as to traverse the through hole and forming a resin frame surrounding the light emitting element around the light emitting element. .

The manufacturing method of the above light emitting device can be combined with the following configurations.
After the resin frame forming step, the method further includes a resin filling step of filling a second resin inside the resin frame.
In the resin frame forming step, the first resin is formed so that the through hole is exposed from the first resin at least on the light emitting element side.
The first resin is a light reflective resin.
The second resin is a light-reflective resin having a viscosity lower than that of the first resin, and covers a side surface of the light emitting element in the resin filling step.
The second resin is a translucent resin.

  According to the present invention, it is possible to suppress a decrease in adhesion between a base material having a conductive pattern formed on the surface thereof and a resin partially covering the base material, and to reduce electric resistance. Light-emitting device and a method for manufacturing the same can be provided.

FIG. 1 is a schematic perspective view showing the light emitting device according to Embodiment 1. FIG. FIG. 2 is a schematic plan view showing the light emitting device according to the first embodiment. FIG. 3 is a schematic cross-sectional view taken along line AA in FIG. FIG. 4 is a schematic cross-sectional view illustrating the method for manufacturing the light emitting device according to Embodiment 1. FIG. 5 is a schematic cross-sectional view illustrating the method for manufacturing the light-emitting device according to Embodiment 1. FIG. 6 is a schematic plan view illustrating the method for manufacturing the light emitting device according to Embodiment 1. FIG. 7 is a schematic plan view illustrating the method for manufacturing the light emitting device according to Embodiment 1. FIG. 8 is a schematic cross-sectional view showing the light emitting device according to the second embodiment. FIG. 9 is a schematic cross-sectional view showing the light emitting device according to the third embodiment. FIG. 10 is a schematic cross-sectional view showing the light emitting device according to the fourth embodiment. FIG. 11 is a schematic plan view showing a light emitting device according to Embodiment 4. FIG. FIG. 12 is a schematic cross-sectional view showing a conventional light emitting device. FIG. 13 is a schematic cross-sectional view showing a conventional light emitting device.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. Each drawing is a schematic diagram, and the arrangement, dimensions, ratio, shape, and the like shown therein may be different from actual ones. Moreover, in each embodiment, the member using the same code | symbol as other embodiment represents the same or corresponding member, and may abbreviate | omit description.

  In this specification, the terms “upper” and “lower” are also used as terms indicating the side from which light emission of the light-emitting device is extracted and the opposite side. For example, “upward” refers to the direction in which the light emission of the light emitting device is extracted, and “downward” refers to the opposite direction. Further, the “upper surface” refers to the surface on the side from which light emission of the light emitting device is extracted, and the “lower surface” refers to the surface on the opposite side.

<Embodiment 1>
1 to 3 are schematic views showing the light emitting device 10 according to Embodiment 1 of the present invention. 1 is a schematic perspective view, FIG. 2 is a schematic plan view, and FIG. 3 is a schematic cross-sectional view taken along the line AA of FIG. The light-emitting device 10 includes a light-emitting element 3, a translucent member 4 provided on the upper surface of the light-emitting element 3, and a light-reflective resin that covers the side surfaces of the light-emitting element 3 and the translucent member 4. And 5. The upper surface of the translucent member 4 exposed from the light reflective resin 5 is the light emitting surface 4a of the light emitting device, and light is extracted from the light emitting surface 4a. The light-emitting device 10 can use the exposed portions of the conductive patterns 2a and 2b that are extended from the light-reflecting resin 5 as external connection portions that are connected to an external power source, and the light-emitting element 3 via the bumps 8a and 8b. In addition, a current is supplied to the protection element 7.

  A pair of positive and negative conductive patterns 2a and 2b are provided on the surface of the base material 1, and through holes 6a and 6b in which the base material 1 is exposed are provided in the conductive patterns 2a and 2b, respectively. The through holes 6a and 6b have a shape that is long along the extending direction of the conductive patterns 2a and 2b, that is, a shape that is long along the longitudinal direction of the substrate 1 in the present embodiment, and a part of the through holes 6a and 6b is light-reflective resin 5. In the through holes 6a and 6b, the surface of the substrate 1 and the light reflective resin 5 are in contact with each other. Further, a protective element 7 such as a Zener diode embedded in the light reflective resin 5 is provided on the substrate 1. In the present embodiment, the light-emitting element 3 and the protection element 7 are face-down elements in which a positive electrode and a negative electrode are formed on the same surface side, and the surface on which these electrodes are formed is mounted on a substrate. The bumps 8a and 8b are flip-chip mounted on the conductive patterns 2a and 2b on the surface of the substrate 1.

(Production method)
A method for manufacturing the light emitting device 10 of this embodiment will be described with reference to FIGS. 4 and 5 are schematic cross-sectional views illustrating a method for manufacturing a light-emitting device according to the present embodiment. FIGS. 6 and 7 are schematic plan views illustrating a method for manufacturing the light-emitting device according to the present embodiment. is there.

  First, as shown in FIGS. 4A and 6A, a pair of positive and negative conductive patterns 2 a and 2 b are formed on the substrate 1. In this embodiment, as shown in FIG. 6A, the cathode-side conductive pattern 2a and the anode-side conductive pattern 2b extend from the center of the substrate 1 on which the light-emitting element 3 is placed toward the outer edge. The external connection unit connected to the external power supply is configured. By making the conductive patterns 2 a and 2 b wide, a current from an external power source can be efficiently passed to the light emitting element 3, and preferably a width wider than the width of the light emitting element 3. Further, as shown in FIG. 6A, a conductive pattern 2c for relay is provided between the conductive patterns 2a and 2b, whereby four light emitting elements to be flip-chip mounted are connected in series. The

  Next, as shown in FIGS. 4B and 6B, the light emitting element 3 and the protective element 7 are flip-chip mounted on the conductive patterns 2a and 2b by the bumps 8a and 8b. The four light emitting elements 3 are arranged in a line and are connected in series by the conductive patterns 2a, 2b, and 2c as described above.

  Next, as shown in FIG. 4C and FIG. 6C, the translucent member 4 is bonded to the upper surface of the light emitting element 3. The light emitting element 3 and the translucent member 4 can be fixed via an adhesive (not shown). The adhesive is preferably made of a material that can effectively guide the light emitted from the light emitting element 3 to the translucent member 4 side and optically connect both members. For example, the translucent adhesive material such as silicone resin. Is used. Further, for bonding between the light emitting element 3 and the translucent member 4, crystal bonding by thermocompression bonding or the like can be employed.

  In addition, when the light emitting element 3 is flip-chip mounted on the conductive pattern (metal plating) formed on the base material 1 via the conductive member such as a bump, the light emitting element mounting portion of the substrate, It is preferable to dispose an underfill material (not shown) in the gap with the light emitting element. Thereby, the stress by the difference of the thermal expansion coefficient of a light emitting element and a board | substrate can be absorbed, or heat dissipation can be improved. By using a light-reflective member such as a white resin, the underfill material can reflect light emitted from the light emitting element toward the substrate, and can increase the luminous flux.

  When the underfill material is made of a material having lower elasticity or lower linear expansion than the second light-reflecting resin 5b formed by coating these in a later step, the resin expansion at the joint between the light emitting element and the substrate is performed. This is preferable because the shrinkage stress can be relaxed and the electrical bonding reliability is improved. Such an underfill material is preferably, for example, JIS-A hardness (rubber hardness) of 10 or less. In this case, a material having high mechanical strength is used for the second light reflective resin 5b, and the underfill material is completely covered with the second light reflective resin 5b so that the underfill material is not exposed to the outside. It is preferable. Thereby, durability with respect to the external stress of the light emitting element 3 and an underfill material part is securable. When the underfill material and the second light reflective resin 5b are made of different materials as described above, it is preferable to cure the underfill material before filling the second light reflective resin 5b. Thereby, since it can prevent that mutual resin mixes, the performance of each other resin is not impaired.

  Next, as shown in FIGS. 5A and 7A, a frame-shaped first light-reflecting resin 5a (first resin) surrounding the light-emitting element 3 and the protective element 7 is formed. The first light-reflective resin 5a can be formed using, for example, a resin discharge device that can discharge liquid resin continuously or in a dot shape by the pressure of air. The first light reflecting resin 5a is preferably formed so as to cross the through holes 6a and 6b. Thereby, the base material 1 exposed inside the through holes 6a and 6b can be in contact with the first light reflective resin 5a, and the adhesion between the first light reflective resin 5a and the base material 1 can be improved. . The surface of the base material 1 exposed in the through holes 6a and 6b is preferably in contact with a resin (second light reflective resin 5b) filled inside the frame made of the first light reflective resin 5a. Further, in consideration of a shift during manufacture, the formation position of the first light-reflecting resin 5a is preferably near the center of the through holes 6a and 6b or on the outer edge side of the substrate 1 more than that.

  The first light-reflecting resin 5a is preferably formed so that its height is approximately the same as or lower than the upper surface of the translucent member 4 serving as a light-emitting surface from which light is extracted. By forming in this way, the side surfaces of the light-emitting element 3 and the translucent member 4 can be covered by using the creeping of the low-viscosity second light-reflecting resin 5b to be formed in a later step. It can be suppressed that the light-reflecting resin 5b rides on the upper surface of the translucent member 4 and inhibits light emission. In addition, if the first light-reflecting resin 5a is formed to be high, the amount of the resin increases and the width becomes wide. From this point of view, the height of the first light-reflecting resin 5a is determined by the translucent member. It is preferable that the height is equal to or lower than the upper surface of 4. Thus, it is preferable that the height of the first light-reflecting resin 5a be equal to or lower than the light emitting surface of the light emitting device. In addition, the height of the first light-reflecting resin 5a is set high enough that the second light-reflecting resin 5b that covers the light-emitting element 3 and the translucent member 4 does not overflow. Preferably, it is at least half of the height from the surface of the substrate 1 or the conductive patterns 2a, 2b to the light emitting surface 4a.

  By increasing the viscosity of the first light-reflecting resin 5a, it is possible to suppress the increase in width and increase the height, but on the other hand, the productivity decreases when the viscosity increases. In particular, when the first light-reflective resin 5a is formed by discharging a liquid resin using a resin discharge device, a frame is formed by overlapping the start point and end point of the discharged resin. If it is high, a gap is left in the overlapping portion, or a difference occurs in the overlapping state. For example, as shown in FIG. 5A, the viscosity of the first light-reflecting resin 5 a is such that the cross-sectional shape is a substantially semicircular shape, and the base spreads wet on the substrate 1.

  Before curing the first light-reflecting resin 5a, as shown in FIGS. 5B and 7B, the first light-reflecting resin 5a is placed inside the frame made of the first light-reflecting resin 5a. The second light-reflecting resin 5b (second resin) having a lower viscosity than the conductive resin 5a is filled. As shown in FIG. 5B, the second light reflective resin 5b covers the side surfaces of the light emitting element 3 and the light transmissive member 4 and is exposed from the second light reflective resin 5b. The upper surface of 4 is a light emitting surface 4 a of the light emitting device 10. Further, the lowest part of the surface of the second light reflective resin 5b is the first light reflective resin so that the second light reflective resin 5b does not overflow from the frame of the first light reflective resin 5a. The second light-reflecting resin 5b is filled so as to be the same as or lower than the height of 5a. The filling amount of the second light reflective resin 5b is adjusted so that the side surfaces of the light emitting element 3 and the translucent member 4 are almost completely covered. Although depending on the surface state of each member and the viscosity of the second light-reflecting resin 5b, for example, the surface of the substrate 1 or the height from the conductive patterns 2a, 2b to the light emitting surface 4a is at least half. In order to prevent light leakage, it is preferable to form the second light-reflecting resin 5b thick on the side surface of the light-emitting element 3 that is a light-emitting source. For this reason, the first light reflective resin 5a is formed at least higher than the upper surface of the light emitting element 3 so that the lowest part of the surface of the second light reflective resin 5b is higher than the upper surface of the light emitting element 3. It is preferable to adjust the filling amount of the second light reflective resin 5b.

  Further, in order to prevent light absorption by the protection element 7, the protection element 7 is completely covered with the second light-reflecting resin 5b. At this time, the first light-reflecting resin 5a and the second light-reflecting resin 5b cover portions where the pair of positive and negative conductive patterns 2a and 2b face each other, such as the vicinity of the light emitting element 3 and the vicinity of the protective element 7. It is preferable to form so that a short circuit due to dust adhesion or the like can be prevented.

  The second light reflective resin 5b selects a resin material having a viscosity lower than that of the first light reflective resin 5a in order to reliably cover the side surfaces of the light emitting element 3 and the translucent member 4. When only a high-viscosity resin is used as the resin constituting the light-reflective resin, it is difficult to crawl along the side surfaces of the light emitting element 3 and the translucent member 4, and it is difficult to completely cover the side surfaces. On the other hand, when only a low-viscosity resin is used, the base of the resin is unnecessarily widened and the size of the light emitting device is increased. If a mold that dams the resin is used to prevent this, the resin may be pulled when the mold is peeled off, and the resin may be peeled off from the substrate. For this reason, in this embodiment, a high-viscosity resin is used as the first light-reflecting resin 5a, and a low-viscosity resin is used as the second light-reflecting resin 5b. The first light-reflective resin 5a is made of a resin having a higher viscosity than the second light-reflective resin 5b, so that the second light-reflective resin 5b having a low viscosity is blocked even before the resin is cured. It can function as a stopping dam. The viscosity can be adjusted by, for example, the viscosity of the resin itself as a base material. In this case, the same filler may be used for the first light-reflecting resin 5a and the second light-reflecting resin 5b as the filler contained in the base material.

  After filling the second light reflective resin 5b, as shown in FIGS. 5C and 7C, the first light reflective resin 5a and the second light reflective resin 5b are cured, The light-reflective resin 5 is used. Since the first light-reflecting resin 5a and the second light-reflecting resin 5b are formed in close contact on the same substrate 1 as described above, they can be cured in the same process. Although these resins are preferably cured substantially simultaneously, the start of curing and the completion of curing need not be simultaneous. Thereby, an interface is not formed at the boundary between the first light reflective resin and the second light reflective resin, and they are integrated. Accordingly, the adhesion between the first light-reflecting resin and the second light-reflecting resin can be improved and peeling can be suppressed, so that a light-emitting device with improved reliability can be obtained. Preferably, the base material of the first light reflective resin 5a and the second light reflective resin 5b is set so that the first light reflective resin 5a and the second light reflective resin 5b are cured under the same conditions. A resin having substantially the same curing conditions is used.

  Below, each member and structure of the light-emitting device 10 in this embodiment are demonstrated.

(Substrate 1)
Examples of the substrate 1 include a substrate made of an insulating member such as glass epoxy, resin, or ceramic. Moreover, the metal which formed the insulating member may be used, and the metal member may be formed with the insulating member. In particular, in this embodiment, since the frame can be formed of the first light-reflecting resin 5a and the second light-reflecting resin 5b or other resin can be filled inside, the base material 1 is a substrate on a flat plate. It is preferable to do. Moreover, what can form the conductor wiring (conductive pattern) for connecting with the light emitting element 3 on the surface is preferable, and it is preferable that such a material consists of ceramics with high heat resistance and high weather resistance. . As the ceramic material, alumina, aluminum nitride, mullite and the like are preferable. Moreover, it is preferable to use a ceramic material also from the point of adhesiveness with the light reflective resin 5, and it is preferable to use a ceramic substrate. The ceramic material has higher adhesion to the light reflective resin 5 than the conductive pattern made of a metal material, and furthermore, since the difference in thermal expansion coefficient with the light reflective resin 5 is small, the thermal stress can be relaxed. Become. Thereby, sealing hermeticity of the light emitting device is improved, peeling of the light reflecting resin due to thermal stress during a temperature cycle is prevented, and improvement in reliability of the light emitting device can be expected. In addition, the base material 1 preferably has a thermal conductivity of 150 W / m · K or more in order to appropriately dissipate heat from the light emitting element 3.

  Further, in the present embodiment, four light emitting elements 3 are mounted on the substrate 1, but the number of light emitting elements 3 is not limited to this, and the size and necessity of a desired light emitting device are not limited. It can be appropriately changed according to the luminance.

(Conductive pattern 2a, 2b)
The pair of positive and negative conductive patterns 2 a and 2 b are formed on the base material 1 in a shape extending from the resin coating portion covered with the light-reflective resin 5 (resin) toward the outer edge of the base material 1. By making the conductive patterns 2 a and 2 b wide, a current from an external power source can be efficiently passed to the light emitting element 3, and preferably a width wider than the width of the light emitting element 3. As a material for the conductive patterns 2a and 2b, a material that can be formed on the surface of the substrate 1 and can be used as the positive electrode and the negative electrode of the light emitting device is selected. For example, the same Au as the bump is used. The conductive patterns 2a and 2b can be formed by electrolytic plating, electroless plating, vapor deposition, sputtering, or the like. In addition, the conductive patterns 2a and 2b of the present embodiment extend from the resin coating portion coated with the light reflecting resin 5 toward the outer edge of the base material 1, and further at the position where the outer edge of the base material 1 is substantially reached. It extends continuously along the outer edge of the material 1. As a result, the external connection portion connected to the external power source can have a large area, and the light emitting device can be easily connected to the external power source. Further, since the metal material used for the conductive patterns 4a and 4b easily reflects extraneous light, as shown in FIG. 2, the positions of the lower ends in FIG. Is preferably substantially the same as the position of the lower end of the light emitting surface 4a in FIG. Thereby, the reflection from the external light can be suppressed below the lower end of the light emitting surface 4a in FIG. 2, and a desired irradiation pattern can be obtained.

(Through holes 6a, 6b)
The conductive patterns 2a and 2b are provided with through holes 6a and 6b, respectively, which are long in the extending direction of the conductive patterns 2a and 2b and from which the base material 1 is exposed. The extending direction of the conductive patterns 2a and 2b is a direction in which the conductive patterns 2a and 2b extend from the resin coating portion coated with the light-reflective resin 5 toward the outer edge of the base material 1, and in this embodiment, the base material 1 coincides with the longitudinal direction. The through holes 6a and 6b can be formed by arranging a predetermined mask pattern when forming the conductive patterns 2a and 2b, for example. The through holes 6a and 6b are provided at least at positions where the through holes 6a and 6b are covered with the light reflective resin 5, and the base 1 and the light reflective resin 5 are in contact with each other inside the through holes 6a and 6b. In the manufacturing process, the through holes 6a and 6b are preferably formed at the position where the first light-reflecting resin 5a is formed, both of the first light-reflecting resin 5a and the second light-reflecting resin 5b. It is formed at the position to be done. Thus, by arranging each member so that both the first light reflective resin 5a and the second light reflective resin 5b cover the common through holes 6a and 6b, the first light reflective resin 5a and the second light reflective resin 5b are disposed. The adhesion between the resin 5a and the base material 1 of the second light-reflecting resin 5b can be improved, and peeling can be suppressed.

  Since the light-reflecting resin 5 has better adhesion to the base material 1 (particularly resin or ceramics) than the conductive patterns 2a and 2b (metal), a part of the surface of the base material 1 is formed by the through holes 6a and 6b. By exposing, the adhesiveness of the base material 1 and the light reflective resin 5 can be improved, and peeling of the light reflective resin 5 can be suppressed. Furthermore, since the through holes 6a and 6b have a long shape along the extending direction of the conductive pattern, the current flowing through the conductive patterns 2a and 2b is not easily inhibited, and the adhesion area with the light reflective resin 5 can be increased. . Further, by providing such through holes 6a and 6b, it is possible to suppress a decrease in adhesion between the base material 1 and the light-reflecting resin 5 due to the widening of the conductive patterns 2a and 2b. A light-emitting device which can be provided wide, can easily flow current, and has low electric resistance can be obtained.

  The through holes 6a and 6b are preferably long in a direction substantially parallel to the extending direction of the conductive patterns 2a and 2b, and more preferably, the extending direction of the conductive patterns 2a and 2b is long as shown in FIG. The direction is a substantially rectangular shape. Moreover, as shown in FIG.5 (d), it is preferable that the through-holes 6a and 6b are long in the orthogonal | vertical direction with respect to the extending | stretching direction of the frame-shaped 1st light reflective resin 5a. The width of the through-holes 6a and 6b in the short direction may be at least as long as the base material 1 and the light-reflective resin 5 can be in contact with each other in the through-holes 6a and 6b, and the current flow in the conductive patterns 2a and 2b. It is preferable to make it narrow so that it is difficult to inhibit. The width in the short direction of the through holes 6a and 6b can be made smaller than the width of the light emitting element 3, and can be made smaller than the width of the first light reflective resin 5a. The width in the short direction of the through holes 6a, 6b is preferably about 5% to 20% of the width of the conductive patterns 2a, 2b in the portion where the through holes 6a, 6b are arranged. The total width of the plurality of through holes 6a is preferably less than half of the conductive pattern 2a, more preferably about 20% to 40%. By providing a plurality of such through-holes 6a and 6b, the bonding area between the base material 1 and the light-reflecting resin 5 can be increased so as not to inhibit the flow of current. Can improve adhesion. The plurality of through-holes 6a and 6b are preferably arranged at substantially the same interval, and it is preferable that the same number is similarly arranged in the pair of positive and negative conductive patterns 2a and 2b. For example, in the present embodiment, as shown in FIG. 6A, four through holes 6a and 6b are provided in each of the pair of positive and negative conductive patterns 2a and 2b.

(Light emitting element 3)
As the light emitting element 3, it is preferable to use a light emitting diode. A light emitting element having an arbitrary wavelength can be selected. For example, the blue, the green light emitting element, ZnSe and nitride semiconductor _{(In X Al Y Ga 1-} X-Y N, 0 ≦ X, 0 ≦ Y, X + Y ≦ 1), used after using GaP be able to. As the red light emitting element, GaAlAs, AlInGaP, or the like can be used. Furthermore, a semiconductor light emitting element made of a material other than this can also be used. The composition, emission color, size, number, and the like of the light emitting element to be used can be appropriately selected according to the purpose. In the case of a light-emitting device having a phosphor, a nitride semiconductor (In _X Al _Y Ga _1- XYN, 0 ≦ X, 0 ≦ Y, X + Y ≦ 1) is preferable. Various emission wavelengths can be selected depending on the material of the semiconductor layer and the degree of mixed crystal. When the protective element 7 is provided, the light-emitting surface 4 a can be made higher than the upper surface of the protective element 7 by providing the translucent member 4, and the protective element 7 can be completely buried with the light reflective resin 5. Therefore, light absorption by the protective element 7 can be prevented.

  The light-emitting element 3 according to Embodiment 1 has a pair of positive and negative electrodes on the same surface side, and the pair of electrodes is flip-chip mounted on the conductive patterns 2a and 2b of the substrate 1 via bumps 8a. The upper surface opposite to the lower surface on which is formed is the main light emitting surface. Since such a light emitting element 3 is electrically connected to the conductive patterns 2a and 2b using a conductive member such as a bump 8a or a conductive paste, it is compared with a face-up type light emitting element connected with a metal wire or the like. Thus, the connection area with the conductive patterns 2a and 2b can be increased. Accordingly, it is possible to easily flow the current to the light emitting element 3 without hindering the current caused by the wide conductive patterns 2a and 2b. For this reason, the light emitting element 3 is preferably a flip chip mounted light emitting element, for example, a face down type light emitting element having a pair of positive and negative electrodes on the conductive pattern side.

  The light-emitting element 3 is, for example, a light-emitting element formed by laminating a nitride semiconductor on a light-transmitting sapphire substrate. The sapphire substrate is the upper surface side of the light-emitting element 3, Become. The growth substrate may be removed, for example, by polishing, LLO (Laser Lift Off), or the like. Such a growth substrate is not limited to the sapphire substrate, and can be changed as appropriate. The light emitting element 3 may be plural or singular.

(Translucent member 4)
The translucent member 4 is a material that can transmit light emitted from the light emitting element 3 and emit the light to the outside. The light transmissive member 4 is a light diffusing material or fluorescent light that can convert at least a part of incident light. The body may be included. Specifically, for example, the phosphor powder mixed with a phosphor ingot such as a phosphor single crystal, polycrystal, or phosphor powder sintered body, resin, glass, inorganic, etc. is sintered. The thing which was done is mentioned. Although the thickness of the translucent member 4 is not specifically limited and can be changed suitably, For example, it is about 50-300 micrometers. By providing the translucent member 4 on the upper surface of the light emitting element 3, the distance from the surface of the substrate 1 or the conductive patterns 2a and 2b to the light emitting surface 4a of the light emitting device can be made larger than the light emitting element 3 alone. Covering the light emitting surface 4a with the reflective resin 5 can be suppressed.

  A suitable combination with a blue light emitting element can emit white mixed light, and typical phosphors used for the wavelength conversion member include, for example, YAG (Yttrium Aluminum Garnet), BOS (Barium ortho-Silicate) ) And other phosphors are preferably used. In the case of a light emitting device capable of emitting white light, the white light is adjusted depending on the concentration of the phosphor contained in the translucent member 4. The concentration of the phosphor is, for example, about 5 to 50%. The light extraction efficiency is improved when the thickness of the translucent member 4 is thin. However, since the strength decreases as the thickness decreases, and the distance from the surface of the substrate 1 to the light emitting surface 4a decreases, it is preferable to adjust as appropriate. . Furthermore, by including a red phosphor in the adhesive that joins the translucent member 4 containing the wavelength conversion member and the blue light emitting element, a light emitting device that emits light in a light bulb color so as to comply with the JIS standard. Can do.

  The translucent member 4 has a lower surface that is a surface on which light from the light emitting element is incident and an upper surface (a light emitting surface 4a in FIG. 3) that is a surface that emits light from the light emitting element. The upper surface and the lower surface of the translucent member 4 may be flat surfaces that are substantially parallel to each other, a structure having an uneven shape on the flat surface, or a curved surface. For example, the translucent member 4 may be in the shape of a lens, or the side surface of the lens-like translucent member 4 may be covered with the light reflective member 5. Preferably, the translucent member 4 is formed in a plate shape whose side surface is easily covered with the light reflecting member 5 and whose upper surface is difficult to be covered.

  In the case where a plurality of light emitting elements 3 are mounted, a light transmissive member may be bonded to each of the light emitting elements 3, or as shown in FIG. One translucent member 4 may be joined. Further, like the light emitting device 20 according to Embodiment 2 shown in FIG. 8 described later, the light-transmitting member can be omitted and the upper surface of the light emitting element 3 can be used as the light emitting surface 3a of the light emitting device.

(Light Reflective Resin 5, First Light Reflective Resin 5a, Second Light Reflective Resin 5b)
In the present embodiment, the light-reflecting resin 5 covers the side surfaces of the light-emitting element 3 and the translucent member 4. The first light reflective resin 5a (first resin) is formed, and the second light reflective resin 5b (second resin) is formed between the first light reflective resin 5a, the light emitting element 3, and the translucent member 4. Resin), and these are cured. At this time, at least the upper surface (light extraction surface) of the light emitting element 3 is formed so as to allow light to enter the light transmissive member 4 by being exposed from the light reflective resin 5. The light reflecting resin 5 is made of a member that can reflect light from the light emitting element 3, and includes an interface between the light emitting element 3 and the light reflecting resin 5, and an interface between the light transmitting member 4 and the light reflecting resin 5. Thus, the light from the light emitting element 3 is reflected in the light emitting element 3 and the translucent member 4. Thus, light propagates in the light emitting element 3 and the translucent member 4 and is finally emitted from the upper surface 4a of the translucent member 4 to the outside.

  The upper surface of the light reflective resin 5 is preferably lower than the height of the upper surface of the translucent member 4 that is the light emitting surface 4a of the light emitting device. The light emitted from the light emitting surface 4a also spreads in the lateral direction. When the upper surface of the light reflecting resin 5 is higher than the height of the light emitting surface 4a, the light emitted from the light emitting surface 4a hits the light reflecting resin 5 and is reflected, resulting in variations in light distribution. Therefore, the emitted light can be directly taken out by reducing the height of the light-reflective resin 5 covering the outer periphery of the side surface while covering the side surface of the translucent member 4 with the light-reflective resin 5. Therefore, it is preferable.

As the light reflective resin 5, a reflective material is contained in a base material made of a resin such as a silicone resin, a modified silicone resin, an epoxy resin, a modified epoxy resin, an acrylic resin, or a hybrid resin containing at least one of these resins. Can be formed. As a material of the reflective substance, an oxide containing any of Ti, Zr, Nb, Al, and Si, AlN, MgF, or the like can be used. Preferably, titanium oxide (TiO ₂ ) is used. Preferably, particles having a refractive index different from that of the base material are dispersed in the base material as the reflective material. Since the amount of light reflection and transmission varies depending on the concentration and density, the concentration and density may be adjusted as appropriate according to the shape and size of the light-emitting device. For example, in the case of a relatively small light emitting device, it is necessary to reduce the thickness of the first light reflecting member, and in order to suppress light leakage at the thin portion, the concentration of the reflective substance is increased. Is preferred. On the other hand, in the manufacturing process such as application and molding of the light-reflective resin 5, if there is a manufacturing difficulty when the concentration of the reflective material increases, the concentration is adjusted as appropriate. For example, the content concentration of the reflective substance (particles) is preferably 30 wt% or more and the thickness thereof is preferably 20 μm or more.

  The first light-reflecting resin 5a and the second light-reflecting resin 5b are preferably a high-viscosity resin and a low-viscosity resin, respectively. Things can be used. The viscosity of the first light reflecting resin 5a is preferably 200 to 1200 Pa · s, more preferably 200 to 900 Pa · s, and 350 to 400 Pa · s. The viscosity of the second light reflective resin 5b is preferably 20 Pa · s or less, preferably 4 Pa · s or more, and more preferably 4 to 8 Pa · s. Further, the viscosity of the first light reflective resin 5a is 200 Pa · s or more larger than the viscosity of the second light reflective resin 5b, and the first light reflective resin 5a and the second light reflective resin are used. The viscosity difference with the resin 5b is, for example, about 400 Pa · s. Moreover, the viscosity of resin changes by containing a reflective substance. When the first light-reflecting resin 5a and the second light-reflecting resin 5b each contain about 30 wt% titanium oxide particles, the viscosity of the first light-reflecting resin 5a is 230 to 270 Pa · It is preferable to use a resin having a viscosity of 2.7 to 5.3 Pa · s as a base material of the second light-reflecting resin 5b. It is preferable to use the same resin material for the first light-reflecting resin 5a and the second light-reflecting resin 5b, whereby the first light-reflecting resin 5a and the second light-reflecting resin 5b are in close contact with each other. Can be improved, and can be cured under substantially the same conditions. Since some of the same resin materials have different viscosities, for example, a high-viscosity dimethyl silicone resin is used as the base material of the first light-reflecting resin 5a, and a low-viscosity dimethyl silicone resin is used as the second light-reflecting material. Used as a base material for the conductive resin 5b. From the viewpoint of heat resistance, it is preferable to use a silicone resin. Different fillers such as a reflective substance to be contained in the base material can be used for the first light-reflecting resin 5a and the second light-reflecting resin 5b, but preferably the same one is used. For example, dimethyl silicone resins having different viscosities and containing 30 wt% titanium oxide particles can be used as the first light reflecting resin 5a and the second light reflecting resin 5b. Moreover, it replaces with the 1st light reflective resin 5a, a frame is formed using the translucent resin material which does not contain a reflective substance, and the 2nd light reflective resin 5b is filled inside the frame. You can also However, when the frame is made of a light-transmitting first resin, the reflective material in the second light-reflective resin 5b diffuses to the first resin, and the reflective material in the second light-reflective resin 5b The density may decrease, and the reflectance of the second light reflective resin 5b may decrease. For this reason, the frame is preferably made of a light-reflective resin (first light-reflective resin 5a). In addition, by using a light-reflective resin for the frame, the boundary between the exposed areas of the conductive patterns 2a and 2b and the resin can be easily distinguished, and the areas that can be connected to the external power source of the conductive patterns 2a and 2b can be easily specified. it can.

<Embodiment 2>
FIG. 8 is a schematic cross-sectional view of the light emitting device 20 according to the second embodiment. The light emitting device 20 according to the second embodiment is different from the light emitting device 10 according to the first embodiment in that a light transmissive member is not provided and the upper surface of the light emitting element 3 is the light emitting surface 3a of the light emitting device. Thus, the translucent member can be omitted.

  The manufacturing method of the light emitting device 20 of the second embodiment can use the same method as that of the first embodiment except that the translucent member is omitted. When the light reflective resin 5 is formed, the height of the first light reflective resin surrounding the light emitting element 3 is approximately equal to or higher than the upper surface of the light emitting element 3 serving as the light emitting surface 3a of the light emitting device. It is preferable to make it low. As a result, the side surface of the light emitting element 3 can be covered by using the creeping of the low-viscosity second light-reflecting resin that is formed in a later step, and the second light-reflecting resin rides on the light-emitting surface 3a and emits light. It is possible to suppress obstructing the emission of the light. This also saves the amount of resin of the first light reflective resin.

  Thus, the height of the first light-reflecting resin is preferably about the same as or lower than the light emitting surface of the light emitting device. By forming in this way, as shown in FIG. 8, the height of the light reflective resin 5 can be made lower than the light emitting surface 3a. In addition, the height of the first light-reflecting resin is increased to such an extent that the second reflecting resin that covers the light-emitting element 3 does not overflow. Preferably, it is at least half of the height from the surface of the substrate 1 or the conductive patterns 2a, 2b to the light emitting surface 3a.

<Embodiment 3>
FIG. 9 shows a schematic plan view of the light emitting device 30 according to the third embodiment. In the light emitting device 30 according to the third embodiment, a pair of positive and negative conductive patterns 32 a and 32 b are extended from the resin coating portion coated with the light reflecting resin 5 toward the outer edge of the base material 1, and are almost formed on the outer edge of the base material 1. It differs from the light-emitting device 10 of Embodiment 1 in that it is terminated at the reached position. In this way, the pair of positive and negative conductive patterns only need to be extended from the resin coating portion toward the outer edge of the base material so as to be connected to at least an external power source.

<Embodiment 4>
10 and 11 are a schematic cross-sectional view and a schematic plan view of the light emitting device 40 according to the fourth embodiment. In the light emitting device 40 of the fourth embodiment, the second resin is not a second light-reflective resin but a light-transmitting seal inside the frame-shaped first light-reflective resin 5a (first resin). The point that the resin 9 is filled is different from the light emitting device 10 of the first embodiment.

  At this time, as shown in FIG. 10, the side surface and the upper surface of the light emitting element 3 can be covered with a translucent sealing resin 9. The translucent sealing resin 9 may contain a phosphor that converts the wavelength of light emitted from the light emitting element 3. As shown in FIG. 11, the first light-reflecting resin 5a is preferably formed across the through holes 6a and 6b, similarly to the light-emitting device 10 of the first embodiment. Further, the manufacturing method of the light emitting device 40 of the fourth embodiment can use the same method as that of the first embodiment, but the translucent sealing resin 9 is cured of the first light reflective resin 5a. It is preferable to fill later. As a result, the boundary between the first light-reflecting resin 5a and the sealing resin 9 becomes clear, and the surface of the first light-reflecting resin 5a can be used as a light reflecting surface that reflects light from the light emitting element 3. As shown in FIG. 11, the first light-reflecting resin 5a and the sealing resin 9 are preferably provided so as to cover the common through holes 6a and 6b, thereby the first light-reflecting resin 5a. The adhesion between the sealing resin 9 and the base material 1 can be improved, and peeling can be suppressed. Although a translucent resin can be used instead of the first light reflective resin 5a, it is preferable to use a light reflective resin in order to efficiently extract light from the light emitting element 3 upward. In addition, by using the light-reflective resin as a frame in this way, the boundary between the exposed regions of the conductive patterns 2a and 2b and the resin can be easily determined, and the region connectable to the external power source can be easily specified.

Hereinafter, examples according to the present invention will be described in detail according to the production method of the present invention. Needless to say, the present invention is not limited to the following examples.

  As an example, the light emitting device shown in FIGS. 1 to 3 is manufactured by the method shown in FIGS. 1 to 7 show individual light-emitting devices. At the time of manufacture, the following steps are performed on the collective substrate, and finally the individual light-emitting devices are created by dividing into individual pieces.

  First, the base material 1 having the conductive patterns 2a, 2b, and 2c formed on the surface is prepared. In this embodiment, a flat aluminum nitride substrate is used as the base material 1. The base material 1 is formed by baking an aluminum nitride plate material having a thermal conductivity of about 170 W / m · K, and Ti, Pt, and Au are sequentially deposited thereon to make electrical connection with the light emitting element 3. Conductive patterns 2a, 2b, and 2c for taking are formed. Through holes 6a and 6b are provided in the pair of positive and negative conductive patterns 2a and 2b, respectively. As for the size of the substrate 1, the length and width in FIG. 2 are about 6.5 mm and about 12 mm, respectively, and the thickness is about 1 mm. The conductive patterns 2a, 2b, and 2c have a thickness of about 0.9 μm, and the width of the portion where the through holes 6a and 6b are arranged in FIG. 6A is about 2.2 μm. The through holes 6a and 6b have a width of about 0.15 mm and a length of about 1 mm, and the width of the through holes 6a and 6b is about 6.8% of the width of the conductive patterns 2a and 2b. Eight through holes 6a and 6b are arranged in the conductive patterns 2a and 2b, each having the same size, four equally spaced, and the total width of the four through holes 6a is the width of the conductive pattern 2a. About 27%.

  Next, the light emitting element 3 and the protection element 7 are placed on the base material 1. The conductive pattern 2a, 2b, which is the wiring of the aluminum nitride substrate, is formed by laminating a semiconductor layer on a sapphire substrate using a bump 8a made of Au, and the planar shape is a substantially square of about 1 mm square, Flip chip mounting is performed by arranging four light emitting elements 3 having a thickness of about 0.11 mm in a row so that the sapphire substrate side is a light emitting surface. Similarly to the light-emitting element 3, the protective element 7 is flip-chip mounted on the conductive patterns 2a and 2b using bumps 8b made of Au.

  Next, the translucent member 4 is bonded to the upper surface of the light emitting element 3. In the present embodiment, a silicone resin is used as an adhesive, and the light-transmitting member 4 and the sapphire substrate of the light-emitting element 3 are bonded to each other by thermosetting. The translucent member 4 in the present embodiment is a phosphor plate having a thickness of about 0.18 mm in which YAG is dispersed in glass. The area of the lower surface of the translucent member 4 is formed to be larger than the area of the upper surface of the light emitting element 3, and the translucent member 4 is bonded so as to have an exposed surface exposed from the bonding surface.

  Next, a frame-shaped first light-reflecting resin 5 a surrounding the light-emitting element 3, the translucent member 4, and the protective element 7 is formed. In the present embodiment, the first light-reflecting resin 5a is obtained by containing about 30 wt% of titanium oxide particles in a dimethyl silicone resin. The first light-reflective resin 5a is discharged using a resin discharge device, and the height thereof is about 0.23 mm. The difference from the height of about 0.3 mm from the surface of the substrate 1 to the light emitting surface 4a is about The height of the first light reflective resin 5a is about 77% of the height from the surface of the substrate 1 to the light emitting surface 4a. When the first light-reflecting resin 5a is measured with a cone plate type rotational viscometer (E type viscometer), the viscosity of the dimethyl silicone resin used as a base material is about 270 Pa · s, and the viscosity after containing titanium oxide particles Is about 400 Pa · s.

  Next, the inside of the frame formed of the first light reflecting resin 5a is filled with the second light reflecting resin 5b, and the side surfaces of the light emitting element 3 and the translucent member 4 are integrally covered. The protective element 7 is completely buried with the second light reflective resin 5b. The second light-reflecting resin 5b is obtained by containing about 30 wt% of titanium oxide particles in a dimethyl silicone resin having a viscosity of about 4 Pa · s measured with a cone plate type rotational viscometer (E type viscometer). The viscosity of the second light reflective resin 5b after containing the titanium oxide particles is about 6 Pa · s.

  Then, the first light reflective resin 5a and the second light reflective resin 5b are cured. In the present embodiment, the first light-reflecting resin 5a and the second light-reflecting resin 5b are cured and integrated almost simultaneously by housing and heating the substrate 1 that has undergone the above steps in a heating furnace. The light reflecting resin 5 is used. The light emitting device 10 thus obtained has a thickness of about 1.3 mm including the translucent member 4 and the light reflective member 5.

  By manufacturing the light emitting device 10 in this way, the first light reflective resin 5a and the second light reflective resin 5b are integrally formed. Therefore, the first light reflective resin 5a and the second light reflective resin 5b are formed. The adhesion of the light-reflective resin 5b can be improved. In addition, the adhesion between the first light-reflective resin 5a and the second light-reflective resin 5b and the base material can be improved, the peeling of each member can be suppressed, and the light emitting device 10 with improved reliability can be manufactured at low cost. can do. Moreover, by using the conductive patterns 2a and 2b in which the through holes 6a and 6b are arranged, it is possible to easily flow current, and it is possible to suppress a decrease in the adhesion between the light reflective resin 5 and the substrate 1.

  The present invention can be used for various light sources such as an illumination light source, various indicator light sources, an in-vehicle light source, a display light source, a liquid crystal backlight light source, a traffic light, an in-vehicle component, and a signboard channel letter.

DESCRIPTION OF SYMBOLS 1 Base material 2a, 2b, 2c, 32a, 32b Conductive pattern 3 Light emitting element 3a, 4a Light emission surface 4 Translucent member 5 Light reflective resin 5a 1st light reflective resin 5b 2nd light reflective resin 6a, 6b Through hole 7 Protection element 8a, 8b Bump 9 Translucent sealing resin 10, 20, 30, 40 Light emitting device

Claims (12)

A pair of conductive patterns, a light emitting element electrically connected to the pair of conductive patterns, and a part of the pair of conductive patterns are provided on an insulating base material and provided around the light emitting element. A resin,
Each of the pair of conductive patterns extends from the resin coating portion coated with the resin toward the outer edge of the base material,
The light-emitting device which has a through-hole which is a long shape along the extending direction of the said conductive pattern, and the surface of the said base material was exposed to at least the said resin coating part of a pair of said conductive pattern.   The light emitting device according to claim 1, wherein a part of the through hole is exposed from the resin coating portion.   The light emitting device according to claim 1, wherein a plurality of the through holes are provided in each of the conductive patterns.   The light-emitting device according to claim 1, wherein the through-hole has a substantially rectangular shape with the extending direction of the conductive pattern as a longitudinal direction.   The light emitting device according to claim 1, wherein a width of the pair of conductive patterns is larger than a width of the light emitting element.   The light-emitting device according to claim 1, wherein the base material is a ceramic substrate. On the base material, it extends from the light emitting element connecting portion to which the light emitting element is connected toward the outer edge of the base material, and the surface of the base material is exposed in a long shape along the extending direction. A conductive pattern forming step of forming a pair of conductive patterns having through holes,
A light emitting element connecting step of electrically connecting a light emitting element to the light emitting element connecting portion of the pair of conductive patterns;
A method for manufacturing a light emitting device, comprising: a resin frame forming step of discharging a first linear resin so as to cross the through hole and forming a resin frame surrounding the light emitting element around the light emitting element.   The method for manufacturing a light emitting device according to claim 7, further comprising a resin filling step of filling a second resin inside the resin frame after the resin frame forming step.   The method of manufacturing a light emitting device according to claim 8, wherein, in the resin frame forming step, the first resin is formed so that the through hole is exposed from the first resin at least on the light emitting element side.   The method for manufacturing a light emitting device according to claim 7, wherein the first resin is a light reflective resin.   The method for manufacturing a light-emitting device according to claim 10, wherein the second resin is a light-reflective resin having a lower viscosity than the first resin, and covers a side surface of the light-emitting element in the resin filling step.   The method of manufacturing a light emitting device according to claim 10, wherein the second resin is a translucent resin.

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