JP2014158052A - Light emitting device and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light emitting device or the like which has excellent light output efficiency by suppressing absorption of light emitted from a light emitting element caused by a support body or another member.SOLUTION: A light emitting device comprises: a support body: a metal member provided on a surface of the support body and containing silver-containing metal; a light emitting element mounted on the support body; conductive wire for electrically connecting the metal member and the light emitting element; light reflecting resin provided on the support body for reflecting light emitted from the light emitting element; and an insulating member for covering at least a part of a surface of the metal member. The insulating member is provided in contact with a side surface of the light emitting element. Thereby, the light emitted from the light emitting element is suppressed from leaking from the support body, and thus the light emitting device having high light output efficiency is obtained.

Description

  The present invention relates to a light-emitting device that can be used for a display device, a lighting fixture, a display, a backlight light source of a liquid crystal display, and the like, and a manufacturing method thereof, and in particular, has excellent light extraction efficiency and high reliability. Regarding the method.

  In recent years, various light-emitting devices such as light-emitting diodes (LEDs) and laser diodes (LDs) using high-power semiconductor light-emitting elements (hereinafter also simply referred to as light-emitting elements) have been developed.

  In recent years, various electronic components have been proposed and put into practical use, and the performance required for them has increased. In particular, it is required to exhibit stable performance for a long time even under severe use environment. The same applies to light-emitting devices such as light-emitting diodes, and the performance required in the general lighting field, in-vehicle lighting field, and the like is increasing day by day, and in particular, high output and high reliability are required. Furthermore, it is required to supply at a low price while satisfying these characteristics.

  Generally, a light-emitting device has a base on which electronic components such as a semiconductor light-emitting element (hereinafter also referred to as a light-emitting element) and a protective element are mounted, and a conductive member for supplying electric power to the electronic components. Furthermore, it has a translucent sealing member for protecting the electronic component from the external environment.

  In order to increase the output, in addition to improving the output of the light emitting element itself to be used, it is effective to improve the light extraction efficiency depending on the material and shape of the substrate, conductive member, sealing member, etc. .

  For example, a metal member with good conductivity is used as the conductive member, and light from the light emitting element can be efficiently reflected by plating silver on the surface. As the sealing member, a resin that easily transmits light from the light-emitting element is suitable. In particular, the use of a silicone resin having excellent weather resistance and heat resistance can increase the life.

  However, silver tends to deteriorate due to sulfur components in the atmosphere. Therefore, for example, Patent Document 1 discloses the use of an organic silver discoloration inhibitor. In addition, it is disclosed that noble metal plating is performed on silver (Patent Document 2), and coating with sol-gel glass (Patent Document 3).

  In addition to light-emitting elements, light-emitting devices equipped with electronic components such as Zener diodes and submounts have been developed, whereby a light-emitting device with high reliability and long life can be obtained. Since these electronic components easily absorb light from the light emitting element, the loss of light is reduced by providing a reflective layer that covers them (for example, Patent Document 4).

JP 2004-207258 A JP 2006-303069 A JP 2007-324256 A JP 2005-26401 A

  However, when silver is coated with an organic substance, there is a problem with weather resistance, and thus it is likely to change over time. In addition, the plating of noble metal has no problem in weather resistance, but a decrease in reflectance is unavoidable, so a decrease in output is unavoidable compared to silver in the initial stage. In addition, the sol-gel glass has a problem that it is difficult to control the film thickness, which causes a problem in mass productivity and a problem in cost.

  The present invention has been made in view of such a conventional problem, and its main purpose is to suppress deterioration of silver used for a metal member or the like as an electrode, and to provide a high-output and highly reliable light-emitting device. And a manufacturing method thereof.

Means for Solving the Problems and Effects of the Invention

  In order to achieve the above object, according to the first light-emitting device of the present invention, a support, a metal member having a silver-containing metal provided on the surface of the support, and placed on the support A light-emitting element, a conductive wire that electrically connects the metal member and the light-emitting element, a light-reflecting resin that is provided on the support and reflects light from the light-emitting element, and a surface of the metal member An insulating member that covers at least a part of the light emitting element, and the insulating member can be provided in contact with a side surface of the light emitting element. Thereby, it is possible to suppress light from the light emitting element from leaking from the support and to obtain a light emitting device with high light extraction efficiency. In particular, light from the light emitting element can be prevented from leaking from the support, and a light reflecting resin that efficiently reflects light can be provided in the vicinity of the light emitting element, and deterioration of silver can be efficiently suppressed. Thus, a light emitting device with improved light extraction efficiency can be obtained. Moreover, when using with a conductive wire, a protective element, etc., the light absorption by them can be suppressed and the light-emitting device with little loss of light can be obtained easily.

  According to the second light emitting device, the support has a recess having a bottom surface and a side surface, and the recess includes a first recess in which the light emitting element is placed, and the first recess. And it has the 2nd crevice which has a bottom in a position lower than the 1st crevice, and can provide the light reflection resin on the metal member in the 2nd crevice.

  Further, according to the third light emitting device, the side surface of the second recess that is continuous with the first recess can be covered with the insulating member.

  Furthermore, according to the fourth light emitting device, the light reflecting resin can extend upward from the second recess and extend to a position higher than the first recess.

  Furthermore, according to the fifth light-emitting device, a support, a metal member having a silver-containing metal provided on the surface of the support, a light-emitting element placed on the support, and the metal member And a conductive wire that conducts between the light emitting element, a light reflecting resin that is provided on the support and reflects light from the light emitting element, and an insulating member that covers at least a part of the surface of the metal member; The insulating member can be provided such that the surface of the metal member and the upper surface of the light emitting element are continuous. Thereby, it is possible to suppress light from the light emitting element from leaking from the support and to obtain a light emitting device with high light extraction efficiency. In particular, light from the light emitting element can be prevented from leaking from the support, and a light reflecting resin that efficiently reflects light can be provided in the vicinity of the light emitting element, and deterioration of silver can be efficiently suppressed. Thus, a light emitting device with improved light extraction efficiency can be obtained. Moreover, when using with a conductive wire, a protective element, etc., the light absorption by them can be suppressed and the light-emitting device with little loss of light can be obtained easily.

  Furthermore, according to the sixth light emitting device, the insulating member is provided so as to be interposed between the metal member and the light reflecting resin, and the insulating member can be continuous with the upper surface of the light emitting element. it can.

  Furthermore, according to the seventh light emitting device, the insulating member is provided on the surface of the light reflecting resin, and the insulating member can be continuous with the upper surface of the light emitting element.

  Furthermore, according to the eighth light-emitting device, the insulating member can be provided so as to cover the surface of the conductive wire continuously from the upper surface of the light-emitting element.

  Furthermore, according to the ninth light emitting device, the insulating member can cover substantially the entire upper surface of the support.

  Furthermore, according to the tenth light emitting device, a sealing member that seals at least part of the light emitting element, the conductive wire, and the insulating member on the upper surface of the support can be further provided. .

  Furthermore, according to the eleventh light emitting device, the insulating member can have translucency.

  Furthermore, according to the twelfth light emitting device, the insulating member can be an inorganic compound.

According addition to the light-emitting device of the thirteenth, the insulating member may be a SiO _2.

  Furthermore, according to the fourteenth light emitting device, the light emitting element is placed on the metal member, and the metal member can function as an electrode.

  Furthermore, according to the fifteenth light emitting device manufacturing method, the first concave portion and the second concave portion having a bottom surface at a position lower than the first concave portion in the first concave portion are provided. A step of providing a support, a step of providing a metal member on the upper surface of the support, a step of providing a light emitting element on the upper surface of the metal member, and connecting the metal member and the light emitting element with a conductive wire, From the surface of the metal member covering the bottom surface in the second recess, the side surface continuous with the first recess, the surface of the metal member in the first recess, the surface of the light emitting element, and the conductive wire. Thus, the process of covering with an insulating member and the process of providing the light reflection resin which reflects the light from the said light emitting element in the said 2nd recessed part can be included. Thereby, it is possible to suppress light from the light emitting element from leaking from the support and to obtain a light emitting device with high light extraction efficiency. In particular, light from the light emitting element can be prevented from leaking from the support, and a light reflecting resin that efficiently reflects light can be provided in the vicinity of the light emitting element, and deterioration of silver can be efficiently suppressed. Thus, a light emitting device with improved light extraction efficiency can be obtained. Moreover, when using with a conductive wire, a protective element, etc., the light absorption by them can be suppressed and the light-emitting device with little loss of light can be obtained easily.

1 is a perspective view showing a light emitting device according to Embodiment 1. FIG. It is sectional drawing in the IB-IB 'cross section of the light-emitting device which concerns on FIG. 1A. 6 is a perspective view showing a light emitting device according to Embodiment 2. FIG. It is a top view which shows the inside of the light-emitting device which concerns on FIG. 2A. It is sectional drawing in the IIC-IIC 'cross section of the light-emitting device which concerns on FIG. 2A. 7 is a cross-sectional view of a light emitting device according to Embodiment 3. FIG. 7 is a cross-sectional view of a light emitting device according to Embodiment 4. FIG. 7 is a cross-sectional view of a light emitting device according to Embodiment 5. FIG. FIG. 10 is a cross-sectional view of a light emitting device according to a sixth embodiment.

  Hereinafter, embodiments and examples of the present invention will be described with reference to the drawings. However, the embodiments and the like described below exemplify the light emitting device and the manufacturing method thereof for embodying the technical idea of the present invention, and the present invention describes the light emitting device and the manufacturing method thereof as follows. Not specific. In particular, the members shown in the claims are not limited to the members of the embodiment and the like. In addition, the dimensions, materials, shapes, relative arrangements, and the like of the components described in the embodiments and the like are not intended to limit the scope of the present invention only to those unless otherwise specified. It is just an example.

  Note that the size, positional relationship, and the like of the members shown in each drawing may be exaggerated for clarity of explanation. Furthermore, in the following description, the same name and symbol indicate the same or the same members, and detailed description thereof will be omitted as appropriate. Furthermore, each element constituting the present invention may be configured such that a plurality of elements are constituted by the same member and the plurality of elements are shared by one member, and conversely, the function of one member is constituted by a plurality of members. It can also be realized by sharing. In addition, the contents described in some embodiments and the like can be used for other embodiments and examples. Further, in this specification, the term “upper” as used on the layer or the like is not necessarily limited to the case where the upper surface is formed in contact with the upper surface, but includes the case where the upper surface is formed apart. It is used to include the case where there is an intervening layer between them.

<Embodiment 1>
A light-emitting device 100 of the present embodiment is shown in FIGS. 1A and 1B. 1A is a perspective view of the light emitting device 100, and FIG. 1B is a cross-sectional view of the light emitting device 100 shown in FIG. 1A taken along the line IB-IB ′. In the present embodiment, the light emitting device 100 includes a substantially rectangular support body 101 having metal members 103A, 103B, and 103C disposed on an upper surface, and a plurality of metal members 103A provided on the support body 101. A light-emitting element 104. The metal members 103A and 103B used as electrodes are electrically connected (electrically connected) directly or indirectly via the light emitting element 104 and the conductive wire 105. The metal member 103C is made of the same material as the metal members 103A and 103B functioning as electrodes, but is not electrically connected, and is provided as a mark (cathode mark / anode mark) indicating the polarity of the light emitting device.

  In this embodiment, a light reflecting resin 102 that reflects light from the light emitting element is provided around the light emitting element 104, and the insulating member 107 is interposed between the metal members 103A and 103B and the light reflecting resin 102. The insulating member 107 is provided so as to continue up to the top of the light emitting element 104. Further, a light-transmitting sealing member 106 is filled in a recess formed with the light reflecting resin 102 as a side wall to protect the light emitting element 104 and the like from the outside. With such a configuration, it is possible to suppress deterioration of silver plating of the metal member by the insulating member and light leakage from the support exposed between the positive and negative electrodes where silver cannot be structurally provided. It can be efficiently reflected by the reflective resin.

(Light reflecting resin)
The light reflecting resin is a member that can efficiently reflect light from the light emitting element. In this embodiment, the light reflecting resin is provided so as to surround the light emitting element 104 as shown in FIGS. 1A and 1B. These light reflecting resins are provided so as to cover a part of the metal members 103 </ b> A and 103 </ b> B, and the insulating member 107 provided between the light reflecting resin and the metal member continues to the top of the light emitting element 104. It is provided as follows. Such a configuration can be easily provided by placing the light emitting element on the metal member, providing the insulating member 107 on the entire surface of the support 101, and then forming the light reflecting resin 102 after that. By doing in this way, since an insulating member can be provided also on the metal member buried in the light reflecting resin, the discoloration of silver can be more effectively suppressed. Further, the insulating member 107 functions as a passivation film, and Ag migration can be suppressed. Moreover, the adhesive force with resin parts, such as the light reflection resin 102, can be raised depending on a structural member.

As a specific material constituting the light reflecting resin, an insulating member is preferable, and a member that hardly transmits or absorbs light from the light emitting element, external light, or the like is preferable. Moreover, it has a certain amount of strength, and a thermosetting resin, a thermoplastic resin, or the like can be used. More specifically, a phenol resin, an epoxy resin, a BT resin, PPA, a silicone resin, or the like can be given. A powder such as a reflecting member (for example, TiO ₂ , Al ₂ O ₃ , ZrO ₂ , MgO) that hardly absorbs light from the light-emitting element and has a large refractive index difference with respect to the base resin. By dispersing, light can be reflected efficiently.

  Such a light reflecting resin can be formed using a potting method, a printing method, a drawing method, or the like. For example, as shown in FIG. 1A, when the light emitting element is provided on a substantially flat support so as to surround the light emitting element, the viscosity is somewhat high so that the light reflecting resin has a higher horizontal plane than the light emitting element after curing. A resin is used to form a light reflecting resin in a straight line while ejecting it from the nozzle tip, and then a plurality of light emitting devices are drawn by drawing so as to eject the light reflecting resin in a direction intersecting the straight line. Can be formed.

(Insulating material)
The insulating member is provided between the light reflecting resin and the metal member, and is provided so as to continue to the top of the light emitting element. Here, “provided so as to be continuous” means a state in which a powder-like or needle-like insulating member is provided almost entirely with a gap, as shown in FIG. 1B and the like. Including, for example, a film (layer) made of inorganic powder formed by sputtering or vapor deposition. And the gas, the water | moisture content, etc. which have an alteration effect with respect to silver provided in the metal member surface by these insulating members can be interrupted | blocked. Therefore, in the light emitting device whose output efficiency is increased by the light reflecting resin, it is possible to efficiently suppress the deterioration of silver that may lower the excellent effect. In addition, by providing an insulating member after connecting the conductive wire to the metal member, an insulating member can be formed continuously on the conductive wire 105 as shown in FIG. 1B. Thereby, the adhesiveness with an electroconductive wire, a sealing member, light reflection resin, etc. can be improved.

As a material for the insulating member, a light-transmitting material is preferable, and it is preferable to mainly use an inorganic compound. _{Specifically, SiO 2, Al 2 O 3} , TiO 2, ZrO 2, ZnO 2, Nb 2 O 5, MgO, SrO, In 2 O 3, TaO 2, HfO, SeO, oxidation, such as Y ₂ O ₃ And nitrides such as SiN, AlN, and AlON, and fluorides such as MgF ₂ . These may be used alone or in combination. Or you may make it laminate | stack.

  As for the film thickness of the insulating member, it is preferable to make it thin so as not to cause light loss due to multiple reflection at each interface of the sealing member, insulating member, metal member, etc. Thickness is also required. The preferred film thickness varies somewhat depending on the material used, but is preferably about 1 nm to 100 nm. In the case of multiple layers, it is preferable that the film thickness of the entire layer be within this range. In addition, it is preferable to form a dense film so that a gas such as sulfur hardly passes.

(Support)
The support has an opening of a concave portion on the upper surface, and is an insulating substantially plate-like member on which a metal member as a conductor wiring is arranged and on which a light emitting element, a protection element, and the like can be placed. Specific examples of the material include ceramics, epoxy resin, and polyimide resin. In particular, by using ceramics as a main material, a support having excellent weather resistance and heat resistance can be obtained.

  As the ceramic, alumina, aluminum nitride, mullite, silicon carbide, silicon nitride, or the like can be used. In the case of producing these as main components, for example, in the case of alumina, about 90 to 96% by weight of alumina is used as a raw material powder, and clay, talc, magnesia, calcia, silica or the like is used as a sintering aid. Ceramics obtained by sintering about 1% to about 1500 ° C. to 1700 ° C. can be used. Alternatively, a material powder containing about 40 to 60% by weight of alumina and about 60 to 40% by weight of borosilicate glass, cordierite, forsterite, mullite or the like as a sintering aid is added to about 800 ° C to 1200 ° C. Ceramics sintered in the temperature range can be used.

  Also, a ceramic green sheet obtained by molding a ceramic powder and a material obtained by mixing a binder resin into a sheet shape may be laminated and fired to form a support having a desired shape. Or it can be set as the support body which has a recessed part by forming and laminating | stacking through-hole of various magnitude | sizes in a ceramic green sheet. The metal member disposed on such a support is fired by applying a conductive paste containing fine particles of a refractory metal such as tungsten or molybdenum in a predetermined pattern at an unfired ceramic green sheet stage. Can be obtained. Furthermore, after firing the ceramic green sheet, a metal member previously formed can be plated with nickel, gold, silver or the like.

  As described above, the support made of ceramic is formed by integrally forming the metal member (conductor wiring) and the insulating member (ceramic), and also forming the metal member on a pre-fired ceramic plate. You can also

  When a glass epoxy resin is used as the support, a copper plate is attached to a prepreg obtained by semi-curing an epoxy resin containing glass cloth or an epoxy resin and thermally cured. Thereafter, it can be formed by patterning copper into a desired shape using a photolithography method.

(Metal member)
In the present embodiment, the metal member has a silver-containing metal, is formed on the upper surface of the support, is provided so as to continue to the back via the inside or the surface of the support, and is electrically connected to the outside. It has a function that allows easy connection. Various sizes and shapes of the metal member can be selected, and the metal member can be formed large so that the end portion is embedded in the light reflecting resin 102. Preferably, in the region surrounded by the light reflecting resin, it is preferable that the support is not exposed, that is, the metal member is formed on the entire surface inside the light reflecting resin. Thereby, it can suppress that light leaks from the support bodies, such as a ceramic, to the back surface side. Moreover, the thing which has no electrical connection with the outside and functions as a light reflecting material is also included. Specifically, in addition to the silver-containing metal, copper, aluminum, gold, white silver, tungsten, iron, nickel and other metals or iron-nickel alloys, phosphor bronze, iron-containing copper, etc., these are single, Alternatively, it can be formed in a plurality of layers. In particular, it is preferable to form a silver-containing metal on the surface, and further, silver plated on the surface is preferable.

(Sealing member)
The sealing member is a member that fills the recess (region surrounded by the light reflecting resin) and protects electronic components such as the light emitting element, the protective element, and the conductive wire from dust, moisture, external force, and the like. It is. Further, it is preferable to have a light-transmitting property capable of transmitting light from the light-emitting element and to have a light resistance that is not easily deteriorated by them. Specific examples of the material include a silicone resin composition, a modified silicone resin composition, an epoxy resin composition, a modified epoxy resin composition, and an acrylic resin composition. A composition can be mentioned. Furthermore, a silicone resin, an epoxy resin, a urea resin, a fluororesin, and a hybrid resin containing at least one of these resins can also be used. Furthermore, not only these organic substances but also inorganic substances such as glass and silica gel can be used. In addition to such materials, a colorant, a light diffusing agent, a filler, a wavelength conversion member (fluorescent member), and the like can be included as desired. The filling amount of the sealing member may be an amount that covers the electronic component.

  Further, the shape of the surface of the sealing resin can be variously selected according to the light distribution characteristics and the like. For example, the directivity can be adjusted by using a convex lens shape, a concave lens shape, a Fresnel lens shape, or the like. In addition to the sealing member, a lens member may be provided.

(Die bond member)
The die bond member is a bonding member for mounting a light emitting element, a protection element, or the like on a support or a metal member, and selects either a conductive die bond member or an insulating die bond member depending on the substrate of the element to be mounted. be able to. For example, in the case of a semiconductor light emitting device in which a nitride semiconductor layer is laminated on sapphire, which is an insulating substrate, the die bond member can be used either insulative or conductive, and when using a conductive substrate such as a SiC substrate, Conductivity can be achieved by using a conductive die bond member. As the insulating die bond member, an epoxy resin, a silicone resin, or the like can be used. When these resins are used, a metal layer having a high reflectance such as an Al film can be provided on the back surface of the semiconductor light emitting element in consideration of deterioration from light or heat from the semiconductor light emitting element. In this case, a method such as vapor deposition, sputtering, or bonding a thin film can be used. In addition, as the conductive die bond member, a conductive paste such as silver, gold, or palladium, solder such as Au—Sn eutectic, or a brazing material such as a low melting point metal can be used. Further, among these die bond members, in particular, when a translucent die bond member is used, a fluorescent member that absorbs light from the semiconductor light emitting element and emits light of a different wavelength can be included therein.

(Conductive wire)
Examples of the conductive wire that connects the electrode of the light-emitting element and the metal member (conductive member) provided on the support include metals such as gold, copper, platinum, and aluminum, and conductive wires using alloys thereof. In particular, it is preferable to use gold having excellent thermal resistance. As shown in FIG. 1B and the like, the conductive wire 105 can be provided so as to be continuous between the light emitting elements 104, or can be provided so as to be connected to the conductive member of the support for each light emitting element. .

(Wavelength conversion member)
The sealing member / lens member may contain a fluorescent member that emits light having a different wavelength by absorbing at least a part of light from the semiconductor light emitting element as the wavelength conversion member.

  As the fluorescent member, it is more efficient to convert the light from the semiconductor light emitting element into a longer wavelength. The fluorescent member may be formed of a single type of fluorescent material or the like, or may be formed of a single layer in which two or more types of fluorescent material are mixed, or contains one type of fluorescent material, etc. Two or more single layers may be stacked, or two or more single layers each of which is mixed with two or more kinds of fluorescent substances may be stacked.

Any fluorescent member may be used as long as it absorbs light from a semiconductor light emitting device having a nitride semiconductor as a light emitting layer and converts the light to light of a different wavelength. For example, nitride phosphors / oxynitride phosphors mainly activated by lanthanoid elements such as Eu and Ce, lanthanoid phosphors such as Eu, and alkalis mainly activated by transition metal elements such as Mn Earth halogen apatite phosphor, alkaline earth metal borate halogen phosphor, alkaline earth metal aluminate phosphor, alkaline earth silicate, alkaline earth sulfide, alkaline earth thiogallate, alkaline earth silicon nitride At least selected from organic and organic complexes mainly activated by lanthanoid elements such as germanate or lanthanoid elements such as Ce, rare earth aluminate, rare earth silicate or Eu Any one or more are preferable. Preferably, Y ₃ Al ₅ O ₁₂ : Ce, (Y _0.8 Gd _0.2 ) ₃ Al ₅ O ₁₂ : Ce, Y ₃ (which is a rare earth aluminate phosphor mainly activated by a lanthanoid element such as Ce. This is a YAG-based phosphor represented by a composition formula of Al _0.8 Ga _0.2 ) ₅ O ₁₂ : Ce, (Y, Gd) ₃ (Al, Ga) ₅ O ₁₂ . Further, there are Tb ₃ Al ₅ O ₁₂ : Ce, Lu ₃ Al ₅ O ₁₂ : Ce, etc. in which a part or all of Y is substituted with Tb, Lu, or the like. Furthermore, phosphors other than the above phosphors and having the same performance, function, and effect can be used.

(Semiconductor light emitting device)
In the present invention, it is preferable to use a light emitting diode as the semiconductor light emitting element.

A semiconductor light emitting device having an arbitrary wavelength can be selected. For example, as blue and green light-emitting elements, those using ZnSe, nitride-based semiconductors (In _X Al _Y Ga _1-XY N, 0 ≦ X, 0 ≦ Y, X + Y ≦ 1), or GaP are used. it can. As the red light emitting element, GaAlAs, AlInGaP, or the like can be used. Furthermore, a semiconductor light emitting element made of a material other than this can also be used. The composition, emission color, size, number, and the like of the light-emitting element to be used can be appropriately selected depending on the purpose.

In the case of a light emitting device having a fluorescent material, a nitride semiconductor (In _X Al _Y Ga _1-XY N, 0≤X, 0≤Y, X + Y≤, which can emit light of a short wavelength and can efficiently excite the fluorescent substance). 1) is preferable. Various emission wavelengths can be selected depending on the material of the semiconductor layer and the degree of mixed crystal.

  Further, a light-emitting element that outputs not only light in the visible light region but also ultraviolet rays and infrared rays can be obtained. Furthermore, a light receiving element or the like can be mounted together with the semiconductor light emitting element.

<Embodiment 2>
A light emitting device 200 according to Embodiment 2 is shown in FIGS. 2A, 2B, and 2C. 2A is a perspective view of the light emitting device 200, FIG. 2B is a plan view showing a state in which the sealing member 206 of the light emitting device 200 shown in FIG. 2A is transparent, and FIG. 2C is an IIC of the light emitting device 200 shown in FIG. 2A. Cross-sectional views in the −IIC ′ cross-section are respectively shown. In Embodiment 2, the light-emitting device 200 includes a support 201 provided with a recess having a bottom surface and a side surface, a plurality of light-emitting elements 204 placed on a metal member 203A provided on the bottom surface of the recess, It has a conductive wire 205 for electrically connecting the metal member 203B and the light emitting element 204, and a sealing member 106 covering the light emitting element 104, the conductive wire, and the like. The concave portion includes a first concave portion 208 on which the light emitting element 204 is placed, and a second concave portion 209 having a bottom surface in the first concave portion 208 at a position lower than the bottom surface of the first concave portion. Have. The light reflecting resin 202 is provided so as to cover the metal member 203B provided on the bottom surface of the second recess 209, and the insulating member 207 provided between the metal member 203B and the light reflecting resin 202 emits light. It is provided so as to continue up to the element 204. Thereby, the insulating member 207 functions as a passivation film, and Ag migration can be suppressed. Moreover, the adhesive force with resin parts, such as light reflection resin 202, can be raised depending on a structural member.

  The second embodiment is different from the first embodiment in that a concave portion is formed in the support, and the same members as those in the first embodiment can be used as the members to be used. Hereinafter, differences from the first embodiment will be described in detail.

(Concave)
In the light emitting device 200 according to the second embodiment, the recess has a first recess 208 in which the light emitting element is placed, and a first bottom within the first recess and at a position lower than the bottom of the first recess. Two recesses 209 are provided. Hereinafter, each concave portion will be described in detail.

(First recess)
The first recess is provided with a metal member on the bottom surface, on which the light emitting element is placed. And it has the 2nd recessed part which has a bottom face in a position lower than the bottom face of the 1st recessed part. In other words, the concave portion of this embodiment has a two-step concave portion, and a shape in which a second concave portion having a smaller opening diameter is formed in the first concave portion having a larger opening diameter. have.

  The bottom surface of the first recess only needs to have a width that can secure an area necessary for mounting the light emitting element in a region other than the second recess, and the light emitting element is connected to the second recess. It is only necessary to have a continuous region that has an area equal to or larger than the bottom area of the light emitting element so as not to overlap (so as not to block the opening of the second recess). For example, as illustrated in FIG. 2B and the like, the light-emitting device 200 has nine light-emitting elements 204 mounted thereon, and has a bottom surface that has an area on which all the light-emitting elements 204 can be placed. Thus, when mounting a some light emitting element, it is preferable to mount all the light emitting elements on the continuous metal member. Moreover, when mounting a light emitting element on another member, such as a submount, it is sufficient if the submount has a region having an area where the submount can be mounted. A plurality of first recesses may be provided. For example, the light emitting element may be placed in each of the two first recesses, and each may have a second recess.

  The metal member provided on the bottom surface of the first recess can be used as a lead electrode for feeding power to the light emitting element. Moreover, you may use as a member which has the function of improving the reflectance of light or improving heat dissipation, without supplying with electricity.

  In particular, when ceramics are used as the support, the metal member is preferably provided on the entire bottom surface of the first recess (the entire surface excluding the second recess). As a result, the support can be prevented from being exposed, and light leakage can be reduced. For example, as shown in FIG. 2B and the like, the metal member 203A is provided on almost the entire bottom surface of the first recess 208. The conductive wire 205 is connected to the metal member 203B on the bottom surface of the second recess, and here, the metal member 203B is used as an electrode (conductive member). The metal member 203A provided on the bottom surface of the first recess is a member that does not contribute to energization, and is mainly used as a reflecting member that efficiently reflects light.

  The shape of the bottom surface of the first recess is not limited to a substantially square shape as shown in FIG. 2B, but can be any shape such as a circle or an ellipse. , Can be any shape. Further, the shape of the bottom surface of the first recess and the shape of the opening are similar here, but are not necessarily limited to this, for example, the shape of the opening is substantially circular as a substantially rectangular bottom. It can also be a shape.

  The side surface of the first recess can be a surface that is perpendicular or inclined with respect to the bottom surface, and can also be provided so as to be continuous with a part of the side surface of the second recess. Alternatively, as shown in FIG. 2C, the second recess may be provided at a position in contact with the side surface of the first recess. Further, the side surface of the first recess may have a step. Furthermore, a metal member can also be provided on the side surface of the first recess 208.

(Second recess)
The second recess is a recess further provided in the first recess, and has a bottom surface at a position lower than the bottom surface of the first recess. In the second embodiment, the metal member is provided on the bottom surface of the second recess, and the second recess is filled with light reflecting resin. An insulating member is provided between the metal member and the light reflecting resin, and the insulating member is provided so as to continue up to the light emitting element.

  The metal member provided on the bottom surface of the second recess functions as an electrode for supplying power to the light emitting element, and is embedded with a part of the conductive wire with a light reflecting resin. A metal member may be provided as a pair of positive and negative electrodes as shown in FIG. 2B in one second recess or in each of the plurality of second recesses, or a metal member as either positive or negative electrode may be provided. It may be provided. When a metal member is provided in the second recess as either positive or negative electrode, the other electrode is a metal member provided on the bottom surface of the first recess, or the bottom surface of another second recess. It can be set as the metal member provided in. Alternatively, one of the conductive wires from the light emitting element is connected to a metal member (positive electrode) provided on the bottom surface of the first recess, and the other is connected to a metal member (negative electrode) provided in the second recess. Thus, conduction may be achieved.

  One or more of the second recesses can be provided on the bottom surface of the first recess, and the size of the opening is a size (opening diameter) that does not hinder the placement of the light emitting element. To do. The position to be provided can be arbitrarily selected. For example, as shown in FIG. 2B and the like, the second of the substantially track-shaped (elliptical) opening shape is formed on the two sides of the bottom surface of the substantially rectangular first recess 208. Each of the recesses 209 can be provided in total, and two second recesses 209 can be provided. Here, the two second recesses have the same size and shape, and are provided at symmetrical positions as shown in FIG. 2B. However, the present invention is not limited to this, and the second recesses have different opening areas, different sizes, etc. It is good. Moreover, although the metal member 203B is similarly provided in any of the second recesses 209, it is not necessary to use all of them for conduction.

  In addition, when the protective element 210 is placed in the second concave portion 209 as shown in FIG. 2B, it is necessary to use a second concave portion and a metal member having a bottom area larger than the bottom area of the protective element 210, When bonding the conductive wire 205, etc., it is necessary to make the width of the opening that allows the wire bonder device to enter the recess.

(Metal member)
In Embodiment 2, the metal member is provided on the bottom surface of the first recess and the bottom surface of the second recess. In particular, it is preferably provided on almost the entire bottom surface of the first recess, whereby light can be prevented from entering the support and light loss can be reduced. In this case, by using the metal member on the bottom surface of the second recess as a pair of electrodes, the metal member provided on the bottom surface of the first recess does not need to function as an electrode. It can be used as a member that functions as a high heat dissipation member. Deterioration can be suppressed by covering the metal member provided in such a large area with an insulating member through which gas hardly permeates. As a preferable material, the same material as in Embodiment Mode 1 can be given. The metal member 203 </ b> A provided in the first recess and the metal member 203 </ b> B provided on the second bottom surface may use the same material or preferably use different materials. The metal member 203A provided in the position where most of the light from the light emitting element is irradiated, that is, the first recess, is preferably made of silver or a silver-containing metal, and particularly preferably silver.

  In the second embodiment, the light reflecting resin is filled in the second recess 209 as shown in FIG. 2C. Here, the second concave portion 209 is filled so as to have a concave curved surface in a cross-sectional view, and is provided so as to reach the upper side surface of the first concave portion, that is, the upper surface of the support 201, Thereby, it is possible to prevent light from leaking from the support 201. The light-reflecting resin having such a shape is formed by dripping a predetermined amount of a liquid resin whose viscosity is adjusted, and scooping up the side surface of the support, and is formed by a relatively easy method. can do.

  The light-reflecting resin is preferably provided so as to cover not only the bottom surface of the second recess but also the substantially entire side surface, and more preferably so as to cover most of the side surface of the first recess. Furthermore, when it has several 2nd recessed part, for example, as shown to FIG. 2B, when it has 2nd recessed part mutually spaced apart, the light reflection resin with which they are filled continues in the 1st recessed part bottom face It is preferable to form as follows. Further, the continuously formed light reflecting resin is preferably formed so as to reach from the bottom surface of the first recess to the top surface of the support. At this time, the film thickness of the light reflecting resin on the side surface of the second recess may be a film thickness that can reflect (difficult to transmit) the light from the light emitting element, depending on the transmittance of the light reflecting resin itself. The minimum film thickness can be defined. Moreover, it is not necessary to have the same film thickness over the entire side surface of the second recess. For example, the film thickness may be gradually reduced toward the upper side of the second recess. Specific materials that constitute the light-reflecting resin include the same materials as those described in the first embodiment.

(Insulating material)
In the second embodiment, as in the first embodiment, the insulating member is provided between the light reflecting resin and the metal member, and is provided so as to continue up to the light emitting element. As shown in FIG. 2C, the insulating member is also formed on the side surface of the first concave portion and the side surface of the second concave portion, and further provided on the upper surface of the support 201. The insulating member, which is a dense film that hardly allows gas to pass through, covers the surface of the support made of a material having a relatively large amount of voids, such as ceramic, so that the side surface of the support, Gas permeation from the upper surface or the like can be suppressed. In many cases, it is difficult to uniformly form the insulating member on the bottom surface or the side surface of the second recess to the same thickness as the bottom surface of the first recess. For example, in the dry method such as sputtering or vapor deposition, the inside of the second recess is easily shaded and thinned. On the contrary, in the wet method using a liquid coating agent, cracks and peeling occur at the site where the liquid has accumulated and becomes too thick. There is a case. However, since the second recess is filled with the light reflecting resin, it is not always necessary to form an insulating member in the entire interior of the second recess. Temporarily, the discoloration of the silver-containing metal (silver plating) occurs in the second recess. There is no effect even if it occurs. Therefore, in order to form the insulating member, the simplest means may be selected from various methods.

<Embodiment 3>
A cross-sectional view of the light-emitting device 300 of Embodiment 3 is shown in FIG. In Embodiment 3, the appearance of the light-emitting device 300 has the same shape as that of the light-emitting device 100 shown in FIG. 1A. The difference is the position where the insulating member 307 is formed. That is, in Embodiment 3, the support body 301 having the metal member 303 (303A, 303B, 303C) having a silver-containing metal on the surface, the light-emitting element 304 placed on the support body, and the metal member 303B. A conductive wire 305 that conducts the light from the light emitting element 304, a sealing member 306 filled in a recessed region surrounded by the light reflecting resin 302, and light from the light emitting element 304 provided on the support 301. A light reflecting resin 302 to be reflected and an insulating member 307 are provided on the surface of the light reflecting resin 302. The insulating member 307 is provided so as to continue up to the top of the light emitting element 304. With such a configuration, it is possible to suppress deterioration of silver plating of the metal member, and the insulating member 307 functions as a passivation film, thereby suppressing Ag migration. Moreover, the adhesive force with resin parts, such as the light reflection resin 302, can be raised depending on a structural member. In particular, even when the base resin of the light reflecting resin 302 is made of a resin that is easily deteriorated or colored by oxidation, the insulating member 307 blocks oxygen, so that deterioration and coloring of the light reflecting resin 302 can be suppressed. .

<Embodiment 4>
A cross-sectional view of the light-emitting device 400 of Embodiment 4 is shown in FIG. In Embodiment Mode 4, the appearance and internal structure of the light emitting device 400 have the same shape as the light emitting device 200 shown in FIGS. 2A and 2B, and the difference is the position where the insulating member 407 is formed. That is, in the fourth embodiment, the support 401 having a metal member 403 (403A, 403B) having a silver-containing metal on the surface, the light emitting element 404 placed on the support, the metal member 403B, It has a conductive wire 405 for conducting the light emitting element 404 and a sealing member 406 filled in a recessed region surrounded by the light reflecting resin 402. The recess includes a first recess 408 on which the light emitting element 404 is placed, and a second recess 409 having a bottom surface in the first recess 408 and lower than the bottom surface of the first recess. Have. A light reflecting resin 402 is provided so as to cover the metal member 403B provided on the bottom surface of the second recess 409, and an insulating member 407 is provided on the surface of the light reflecting resin 402, and the insulating member 407 is a light emitting element. It is provided to continue up to 404. With such a structure, it is possible to suppress deterioration of silver plating of the metal member, and the insulating member 407 functions as a passivation film, thereby suppressing Ag migration. Moreover, the adhesive force with resin parts, such as the light reflection resin 402, can be raised depending on a structural member. In particular, even when a resin that easily deteriorates and colors due to oxidation is used as the base resin of the light reflecting resin 402, the insulating member 407 blocks oxygen, so that deterioration and coloring of the light reflecting resin 402 can be suppressed. .

<Embodiment 5>
A cross-sectional view of the light-emitting device 300 of Embodiment 5 is shown in FIG. In Embodiment Mode 5, the appearance of the light-emitting device 500 has the same shape as that of the light-emitting device 100 shown in FIG. 1A, and the difference is the position where the insulating member 507 is formed. That is, in Embodiment 5, the support body 501 in which the metal member 503 (503A, 503B, 503C) having a silver-containing metal is arranged on the surface, the light emitting element 504 placed on the support body, and the metal member 503B. A conductive wire 505 for conducting the light emitting element 504 with the top, a sealing member 506 filled in a recessed region surrounded by the light reflecting resin 502, and light from the light emitting element 504 provided on the support 501. A light reflecting resin 502 to be reflected, and an insulating member 507 is provided between the metal member 503 and the light reflecting resin 502. The insulating member 507 is provided so as to be continuous with the light emitting element 504. In Embodiment 5, the insulating member is not provided over the light-emitting element, but is provided so as to be in contact with the side surface of the light-emitting element. With such a configuration, deterioration of the silver plating of the metal member can be suppressed, and the insulating member 507 can function as a passivation film, thereby suppressing Ag migration. Moreover, the adhesive force with resin parts, such as light reflection resin 502, can be raised depending on a structural member.

<Embodiment 6>
A cross-sectional view of the light-emitting device 600 of Embodiment 6 is shown in FIG. In Embodiment 6, the appearance and internal structure of the light-emitting device 600 have the same shape as that of the light-emitting device 200 shown in FIGS. 2A and 2B, and the difference is the position where the insulating member 607 is formed. That is, in the sixth embodiment, a support body 601 having a metal member 603 (603A, 603B) having a silver-containing metal on its surface, a light emitting element 604 placed on the support body, and a metal member 603B It has a conductive wire 605 that conducts to the light emitting element 604 and a sealing member 606 that fills a recessed region surrounded by the light reflecting resin 602. The recess includes a first recess 608 on which the light emitting element 604 is placed, and a second recess 609 having a bottom surface at a position lower than the bottom surface of the first recess in the first recess 608. Have. The light reflecting resin 602 is provided so as to cover the metal member 603B provided on the bottom surface of the second recess 609. The light reflecting resin 602 has an insulating member 607 on the surface, and the insulating member 607 is a light emitting element. It is provided so as to be in contact with 604. In Embodiment 6, the insulating member is not provided over the light-emitting element, but is provided so as to be in contact with the side surface of the light-emitting element. With such a structure, the silver plating of the metal member can be prevented from deteriorating, and the insulating member 607 can function as a passivation film, thereby suppressing Ag migration. Moreover, the adhesive force with resin parts, such as the light reflection resin 602, can be raised depending on a structural member.

  The light-emitting device and the manufacturing method thereof according to the present invention have a structure in which light from the light-emitting element hardly leaks from the support, thereby obtaining a light-emitting device capable of reducing light loss and increasing output. Can do. These light emitting devices can be used for various display devices, lighting fixtures, displays, backlight light sources for liquid crystal displays, and image reading devices and projector devices in facsimiles, copiers, scanners, and the like.

100, 200, 300, 400, 500, 600 ... Light emitting device 101, 201, 301, 401, 501, 601 ... Support body 102, 202, 302, 402, 502, 602 ... Light reflecting resin 103, 103A, 103B, 103C , 203, 203A, 203B, 303, 303A, 303B, 303C, 403, 403A, 403B, 503, 503A, 503B, 503C, 603, 603A, 603B ... metal members 104, 204, 304, 404, 504, 604 ... light emission. Elements 105, 205, 305, 405, 505, 605 ... Conductive wires 106, 206, 306, 406, 506, 606 ... Sealing members 107, 207, 307, 407, 507, 607 ... Insulating members 208, 408, 608 ... 1st recessed part 209,409,609 ... 2nd recessed part 210 ... protection element

  The present invention relates to a light-emitting device that can be used for a display device, a lighting fixture, a display, a backlight light source of a liquid crystal display, and the like, and a manufacturing method thereof, and in particular, has excellent light extraction efficiency and high reliability. Regarding the method.

  In recent years, various light-emitting devices such as light-emitting diodes (LEDs) and laser diodes (LDs) using high-power semiconductor light-emitting elements (hereinafter also simply referred to as light-emitting elements) have been developed.

  In recent years, various electronic components have been proposed and put into practical use, and the performance required for them has increased. In particular, it is required to exhibit stable performance for a long time even under severe use environment. The same applies to light-emitting devices such as light-emitting diodes, and the performance required in the general lighting field, in-vehicle lighting field, and the like is increasing day by day, and in particular, high output and high reliability are required. Furthermore, it is required to supply at a low price while satisfying these characteristics.

  Generally, a light-emitting device has a base on which electronic components such as a semiconductor light-emitting element (hereinafter also referred to as a light-emitting element) and a protective element are mounted, and a conductive member for supplying electric power to the electronic components. Furthermore, it has a translucent sealing member for protecting the electronic component from the external environment.

  In order to increase the output, in addition to improving the output of the light emitting element itself to be used, it is effective to improve the light extraction efficiency depending on the material and shape of the substrate, conductive member, sealing member, etc. .

  For example, a metal member with good conductivity is used as the conductive member, and light from the light emitting element can be efficiently reflected by plating silver on the surface. As the sealing member, a resin that easily transmits light from the light-emitting element is suitable. In particular, the use of a silicone resin having excellent weather resistance and heat resistance can increase the life.

  However, silver tends to deteriorate due to sulfur components in the atmosphere. Therefore, for example, Patent Document 1 discloses the use of an organic silver discoloration inhibitor. In addition, it is disclosed that noble metal plating is performed on silver (Patent Document 2), and coating with sol-gel glass (Patent Document 3).

  In addition to light-emitting elements, light-emitting devices equipped with electronic components such as Zener diodes and submounts have been developed, whereby a light-emitting device with high reliability and long life can be obtained. Since these electronic components easily absorb light from the light emitting element, the loss of light is reduced by providing a reflective layer that covers them (for example, Patent Document 4).

JP 2004-207258 A JP 2006-303069 A JP 2007-324256 A JP 2005-26401 A

  However, when silver is coated with an organic substance, there is a problem with weather resistance, and thus it is likely to change over time. In addition, the plating of noble metal has no problem in weather resistance, but a decrease in reflectance is unavoidable, so a decrease in output is unavoidable compared to silver in the initial stage. In addition, the sol-gel glass has a problem that it is difficult to control the film thickness, which causes a problem in mass productivity and a problem in cost.

  The present invention has been made in view of such a conventional problem, and its main purpose is to suppress deterioration of silver used for a metal member or the like as an electrode, and to provide a high-output and highly reliable light-emitting device. And a manufacturing method thereof.

Means for Solving the Problems and Effects of the Invention

In order to achieve the above object, according to the first light-emitting device of the present invention, a support, a metal member having a silver-containing metal provided on the surface of the support, and placed on the support A light-emitting element, a conductive wire that electrically connects the metal member and the light-emitting element, a light-reflecting resin that is provided on the support and reflects light from the light-emitting element, and a surface of the metal member An insulating member that covers at least a part of the light emitting element , and the light emitting element is mounted on the metal member on the support that functions as a light reflecting material that is not electrically connected to the outside. The metal member is formed on the entire surface inside the region surrounded by the light-reflective resin, and the insulating member can be provided so as to cover the surface of the conductive wire . Thereby, it is possible to suppress light from the light emitting element from leaking from the support and to obtain a light emitting device with high light extraction efficiency. In particular, light from the light emitting element can be prevented from leaking from the support, and a light reflecting resin that efficiently reflects light can be provided in the vicinity of the light emitting element, and deterioration of silver can be efficiently suppressed. Thus, a light emitting device with improved light extraction efficiency can be obtained. Moreover, when using with a conductive wire, a protective element, etc., the light absorption by them can be suppressed and the light-emitting device with little loss of light can be obtained easily.

Further, according to the second light emitting device, the insulating member can be continuously provided on the light emitting element .

Furthermore, according to the third light emitting device, the insulating member can cover substantially the entire upper surface of the support .

According addition to the fourth light emitting device, the insulating member may be a SiO _2.

Furthermore, according to the fifth light emitting device, the thickness of the insulating member can be set to 1 nm to 100 nm .

1 is a perspective view showing a light emitting device according to Embodiment 1. FIG. It is sectional drawing in the IB-IB 'cross section of the light-emitting device which concerns on FIG. 1A. 6 is a perspective view showing a light emitting device according to Embodiment 2. FIG. It is a top view which shows the inside of the light-emitting device which concerns on FIG. 2A. It is sectional drawing in the IIC-IIC 'cross section of the light-emitting device which concerns on FIG. 2A. 7 is a cross-sectional view of a light emitting device according to Embodiment 3. FIG. 7 is a cross-sectional view of a light emitting device according to Embodiment 4. FIG. 7 is a cross-sectional view of a light emitting device according to Embodiment 5. FIG. FIG. 10 is a cross-sectional view of a light emitting device according to a sixth embodiment.

  Hereinafter, embodiments and examples of the present invention will be described with reference to the drawings. However, the embodiments and the like described below exemplify the light emitting device and the manufacturing method thereof for embodying the technical idea of the present invention, and the present invention describes the light emitting device and the manufacturing method thereof as follows. Not specific. In particular, the members shown in the claims are not limited to the members of the embodiment and the like. In addition, the dimensions, materials, shapes, relative arrangements, and the like of the components described in the embodiments and the like are not intended to limit the scope of the present invention only to those unless otherwise specified. It is just an example.

  Note that the size, positional relationship, and the like of the members shown in each drawing may be exaggerated for clarity of explanation. Furthermore, in the following description, the same name and symbol indicate the same or the same members, and detailed description thereof will be omitted as appropriate. Furthermore, each element constituting the present invention may be configured such that a plurality of elements are constituted by the same member and the plurality of elements are shared by one member, and conversely, the function of one member is constituted by a plurality of members. It can also be realized by sharing. In addition, the contents described in some embodiments and the like can be used for other embodiments and examples. Further, in this specification, the term “upper” as used on the layer or the like is not necessarily limited to the case where the upper surface is formed in contact with the upper surface, but includes the case where the upper surface is formed apart. It is used to include the case where there is an intervening layer between them.

<Embodiment 1>
A light-emitting device 100 of the present embodiment is shown in FIGS. 1A and 1B. 1A is a perspective view of the light emitting device 100, and FIG. 1B is a cross-sectional view of the light emitting device 100 shown in FIG. 1A taken along the line IB-IB ′. In the present embodiment, the light emitting device 100 includes a substantially rectangular support body 101 having metal members 103A, 103B, and 103C disposed on an upper surface, and a plurality of metal members 103A provided on the support body 101. A light-emitting element 104. The metal members 103A and 103B used as electrodes are electrically connected (electrically connected) directly or indirectly via the light emitting element 104 and the conductive wire 105. The metal member 103C is made of the same material as the metal members 103A and 103B functioning as electrodes, but is not electrically connected, and is provided as a mark (cathode mark / anode mark) indicating the polarity of the light emitting device.

  In this embodiment, a light reflecting resin 102 that reflects light from the light emitting element is provided around the light emitting element 104, and the insulating member 107 is interposed between the metal members 103A and 103B and the light reflecting resin 102. The insulating member 107 is provided so as to continue up to the top of the light emitting element 104. Further, a light-transmitting sealing member 106 is filled in a recess formed with the light reflecting resin 102 as a side wall to protect the light emitting element 104 and the like from the outside. With such a configuration, it is possible to suppress deterioration of silver plating of the metal member by the insulating member and light leakage from the support exposed between the positive and negative electrodes where silver cannot be structurally provided. It can be efficiently reflected by the reflective resin.

(Light reflecting resin)
The light reflecting resin is a member that can efficiently reflect light from the light emitting element. In this embodiment, the light reflecting resin is provided so as to surround the light emitting element 104 as shown in FIGS. 1A and 1B. These light reflecting resins are provided so as to cover a part of the metal members 103 </ b> A and 103 </ b> B, and the insulating member 107 provided between the light reflecting resin and the metal member continues to the top of the light emitting element 104. It is provided as follows. Such a configuration can be easily provided by placing the light emitting element on the metal member, providing the insulating member 107 on the entire surface of the support 101, and then forming the light reflecting resin 102 after that. By doing in this way, since an insulating member can be provided also on the metal member buried in the light reflecting resin, the discoloration of silver can be more effectively suppressed. Further, the insulating member 107 functions as a passivation film, and Ag migration can be suppressed. Moreover, the adhesive force with resin parts, such as the light reflection resin 102, can be raised depending on a structural member.

As a specific material constituting the light reflecting resin, an insulating member is preferable, and a member that hardly transmits or absorbs light from the light emitting element, external light, or the like is preferable. Moreover, it has a certain amount of strength, and a thermosetting resin, a thermoplastic resin, or the like can be used. More specifically, a phenol resin, an epoxy resin, a BT resin, PPA, a silicone resin, or the like can be given. A powder such as a reflecting member (for example, TiO ₂ , Al ₂ O ₃ , ZrO ₂ , MgO) that hardly absorbs light from the light-emitting element and has a large refractive index difference with respect to the base resin. By dispersing, light can be reflected efficiently.

  Such a light reflecting resin can be formed using a potting method, a printing method, a drawing method, or the like. For example, as shown in FIG. 1A, when the light emitting element is provided on a substantially flat support so as to surround the light emitting element, the viscosity is somewhat high so that the light reflecting resin has a higher horizontal plane than the light emitting element after curing. A resin is used to form a light reflecting resin in a straight line while ejecting it from the nozzle tip, and then a plurality of light emitting devices are drawn by drawing so as to eject the light reflecting resin in a direction intersecting the straight line. Can be formed.

(Insulating material)
The insulating member is provided between the light reflecting resin and the metal member, and is provided so as to continue to the top of the light emitting element. Here, “provided so as to be continuous” means a state in which a powder-like or needle-like insulating member is provided almost entirely with a gap, as shown in FIG. 1B and the like. Including, for example, a film (layer) made of inorganic powder formed by sputtering or vapor deposition. And the gas, the water | moisture content, etc. which have an alteration effect with respect to silver provided in the metal member surface by these insulating members can be interrupted | blocked. Therefore, in the light emitting device whose output efficiency is increased by the light reflecting resin, it is possible to efficiently suppress the deterioration of silver that may lower the excellent effect. In addition, by providing an insulating member after connecting the conductive wire to the metal member, an insulating member can be formed continuously on the conductive wire 105 as shown in FIG. 1B. Thereby, the adhesiveness with an electroconductive wire, a sealing member, light reflection resin, etc. can be improved.

As a material for the insulating member, a light-transmitting material is preferable, and it is preferable to mainly use an inorganic compound. _{Specifically, SiO 2, Al 2 O 3} , TiO 2, ZrO 2, ZnO 2, Nb 2 O 5, MgO, SrO, In 2 O 3, TaO 2, HfO, SeO, oxidation, such as Y ₂ O ₃ And nitrides such as SiN, AlN, and AlON, and fluorides such as MgF ₂ . These may be used alone or in combination. Or you may make it laminate | stack.

  As for the film thickness of the insulating member, it is preferable to make it thin so as not to cause light loss due to multiple reflection at each interface of the sealing member, insulating member, metal member, etc. Thickness is also required. The preferred film thickness varies somewhat depending on the material used, but is preferably about 1 nm to 100 nm. In the case of multiple layers, it is preferable that the film thickness of the entire layer be within this range. In addition, it is preferable to form a dense film so that a gas such as sulfur hardly passes.

(Support)
The support has an opening of a concave portion on the upper surface, and is an insulating substantially plate-like member on which a metal member as a conductor wiring is arranged and on which a light emitting element, a protection element, and the like can be placed. Specific examples of the material include ceramics, epoxy resin, and polyimide resin. In particular, by using ceramics as a main material, a support having excellent weather resistance and heat resistance can be obtained.

  As the ceramic, alumina, aluminum nitride, mullite, silicon carbide, silicon nitride, or the like can be used. In the case of producing these as main components, for example, in the case of alumina, about 90 to 96% by weight of alumina is used as a raw material powder, and clay, talc, magnesia, calcia, silica or the like is used as a sintering aid. Ceramics obtained by sintering about 1% to about 1500 ° C. to 1700 ° C. can be used. Alternatively, a material powder containing about 40 to 60% by weight of alumina and about 60 to 40% by weight of borosilicate glass, cordierite, forsterite, mullite or the like as a sintering aid is added to about 800 ° C to 1200 ° C. Ceramics sintered in the temperature range can be used.

  Also, a ceramic green sheet obtained by molding a ceramic powder and a material obtained by mixing a binder resin into a sheet shape may be laminated and fired to form a support having a desired shape. Or it can be set as the support body which has a recessed part by forming and laminating | stacking through-hole of various magnitude | sizes in a ceramic green sheet. The metal member disposed on such a support is fired by applying a conductive paste containing fine particles of a refractory metal such as tungsten or molybdenum in a predetermined pattern at an unfired ceramic green sheet stage. Can be obtained. Furthermore, after firing the ceramic green sheet, a metal member previously formed can be plated with nickel, gold, silver or the like.

  As described above, the support made of ceramic is formed by integrally forming the metal member (conductor wiring) and the insulating member (ceramic), and also forming the metal member on a pre-fired ceramic plate. You can also

  When a glass epoxy resin is used as the support, a copper plate is attached to a prepreg obtained by semi-curing an epoxy resin containing glass cloth or an epoxy resin and thermally cured. Thereafter, it can be formed by patterning copper into a desired shape using a photolithography method.

(Metal member)
In the present embodiment, the metal member has a silver-containing metal, is formed on the upper surface of the support, is provided so as to continue to the back via the inside or the surface of the support, and is electrically connected to the outside. It has a function that allows easy connection. Various sizes and shapes of the metal member can be selected, and the metal member can be formed large so that the end portion is embedded in the light reflecting resin 102. Preferably, in the region surrounded by the light reflecting resin, it is preferable that the support is not exposed, that is, the metal member is formed on the entire surface inside the light reflecting resin. Thereby, it can suppress that light leaks from the support bodies, such as a ceramic, to the back surface side. Moreover, the thing which has no electrical connection with the outside and functions as a light reflecting material is also included. Specifically, in addition to the silver-containing metal, copper, aluminum, gold, white silver, tungsten, iron, nickel and other metals or iron-nickel alloys, phosphor bronze, iron-containing copper, etc., these are single, Alternatively, it can be formed in a plurality of layers. In particular, it is preferable to form a silver-containing metal on the surface, and further, silver plated on the surface is preferable.

(Sealing member)
The sealing member is a member that fills the recess (region surrounded by the light reflecting resin) and protects electronic components such as the light emitting element, the protective element, and the conductive wire from dust, moisture, external force, and the like. It is. Further, it is preferable to have a light-transmitting property capable of transmitting light from the light-emitting element and to have a light resistance that is not easily deteriorated by them. Specific examples of the material include a silicone resin composition, a modified silicone resin composition, an epoxy resin composition, a modified epoxy resin composition, and an acrylic resin composition. A composition can be mentioned. Furthermore, a silicone resin, an epoxy resin, a urea resin, a fluororesin, and a hybrid resin containing at least one of these resins can also be used. Furthermore, not only these organic substances but also inorganic substances such as glass and silica gel can be used. In addition to such materials, a colorant, a light diffusing agent, a filler, a wavelength conversion member (fluorescent member), and the like can be included as desired. The filling amount of the sealing member may be an amount that covers the electronic component.

  Further, the shape of the surface of the sealing resin can be variously selected according to the light distribution characteristics and the like. For example, the directivity can be adjusted by using a convex lens shape, a concave lens shape, a Fresnel lens shape, or the like. In addition to the sealing member, a lens member may be provided.

(Die bond member)
The die bond member is a bonding member for mounting a light emitting element, a protection element, or the like on a support or a metal member, and selects either a conductive die bond member or an insulating die bond member depending on the substrate of the element to be mounted. be able to. For example, in the case of a semiconductor light emitting device in which a nitride semiconductor layer is laminated on sapphire, which is an insulating substrate, the die bond member can be used either insulative or conductive, and when using a conductive substrate such as a SiC substrate, Conductivity can be achieved by using a conductive die bond member. As the insulating die bond member, an epoxy resin, a silicone resin, or the like can be used. When these resins are used, a metal layer having a high reflectance such as an Al film can be provided on the back surface of the semiconductor light emitting element in consideration of deterioration from light or heat from the semiconductor light emitting element. In this case, a method such as vapor deposition, sputtering, or bonding a thin film can be used. In addition, as the conductive die bond member, a conductive paste such as silver, gold, or palladium, solder such as Au—Sn eutectic, or a brazing material such as a low melting point metal can be used. Further, among these die bond members, in particular, when a translucent die bond member is used, a fluorescent member that absorbs light from the semiconductor light emitting element and emits light of a different wavelength can be included therein.

(Conductive wire)
Examples of the conductive wire that connects the electrode of the light-emitting element and the metal member (conductive member) provided on the support include metals such as gold, copper, platinum, and aluminum, and conductive wires using alloys thereof. In particular, it is preferable to use gold having excellent thermal resistance. As shown in FIG. 1B and the like, the conductive wire 105 can be provided so as to be continuous between the light emitting elements 104, or can be provided so as to be connected to the conductive member of the support for each light emitting element. .

(Wavelength conversion member)
The sealing member / lens member may contain a fluorescent member that emits light having a different wavelength by absorbing at least a part of light from the semiconductor light emitting element as the wavelength conversion member.

  As the fluorescent member, it is more efficient to convert the light from the semiconductor light emitting element into a longer wavelength. The fluorescent member may be formed of a single type of fluorescent material or the like, or may be formed of a single layer in which two or more types of fluorescent material are mixed, or contains one type of fluorescent material, etc. Two or more single layers may be stacked, or two or more single layers each of which is mixed with two or more kinds of fluorescent substances may be stacked.

Any fluorescent member may be used as long as it absorbs light from a semiconductor light emitting device having a nitride semiconductor as a light emitting layer and converts the light to light of a different wavelength. For example, nitride phosphors / oxynitride phosphors mainly activated by lanthanoid elements such as Eu and Ce, lanthanoid phosphors such as Eu, and alkalis mainly activated by transition metal elements such as Mn Earth halogen apatite phosphor, alkaline earth metal borate halogen phosphor, alkaline earth metal aluminate phosphor, alkaline earth silicate, alkaline earth sulfide, alkaline earth thiogallate, alkaline earth silicon nitride At least selected from organic and organic complexes mainly activated by lanthanoid elements such as germanate or lanthanoid elements such as Ce, rare earth aluminate, rare earth silicate or Eu Any one or more are preferable. Preferably, Y ₃ Al ₅ O ₁₂ : Ce, (Y _0.8 Gd _0.2 ) ₃ Al ₅ O ₁₂ : Ce, Y ₃ (which is a rare earth aluminate phosphor mainly activated by a lanthanoid element such as Ce. This is a YAG-based phosphor represented by a composition formula of Al _0.8 Ga _0.2 ) ₅ O ₁₂ : Ce, (Y, Gd) ₃ (Al, Ga) ₅ O ₁₂ . Further, there are Tb ₃ Al ₅ O ₁₂ : Ce, Lu ₃ Al ₅ O ₁₂ : Ce, etc. in which a part or all of Y is substituted with Tb, Lu, or the like. Furthermore, phosphors other than the above phosphors and having the same performance, function, and effect can be used.

(Semiconductor light emitting device)
In the present invention, it is preferable to use a light emitting diode as the semiconductor light emitting element.

A semiconductor light emitting device having an arbitrary wavelength can be selected. For example, as blue and green light-emitting elements, those using ZnSe, nitride-based semiconductors (In _X Al _Y Ga _1-XY N, 0 ≦ X, 0 ≦ Y, X + Y ≦ 1), or GaP are used. it can. As the red light emitting element, GaAlAs, AlInGaP, or the like can be used. Furthermore, a semiconductor light emitting element made of a material other than this can also be used. The composition, emission color, size, number, and the like of the light-emitting element to be used can be appropriately selected depending on the purpose.

In the case of a light emitting device having a fluorescent material, a nitride semiconductor (In _X Al _Y Ga _1-XY N, 0≤X, 0≤Y, X + Y≤, which can emit light of a short wavelength and can efficiently excite the fluorescent substance). 1) is preferable. Various emission wavelengths can be selected depending on the material of the semiconductor layer and the degree of mixed crystal.

  Further, a light-emitting element that outputs not only light in the visible light region but also ultraviolet rays and infrared rays can be obtained. Furthermore, a light receiving element or the like can be mounted together with the semiconductor light emitting element.

<Embodiment 2>
A light emitting device 200 according to Embodiment 2 is shown in FIGS. 2A, 2B, and 2C. 2A is a perspective view of the light emitting device 200, FIG. 2B is a plan view showing a state in which the sealing member 206 of the light emitting device 200 shown in FIG. 2A is transparent, and FIG. 2C is an IIC of the light emitting device 200 shown in FIG. 2A. Cross-sectional views in the −IIC ′ cross-section are respectively shown. In Embodiment 2, the light-emitting device 200 includes a support 201 provided with a recess having a bottom surface and a side surface, a plurality of light-emitting elements 204 placed on a metal member 203A provided on the bottom surface of the recess, It has a conductive wire 205 for electrically connecting the metal member 203B and the light emitting element 204, and a sealing member 106 covering the light emitting element 104, the conductive wire, and the like. The concave portion includes a first concave portion 208 on which the light emitting element 204 is placed, and a second concave portion 209 having a bottom surface in the first concave portion 208 at a position lower than the bottom surface of the first concave portion. Have. The light reflecting resin 202 is provided so as to cover the metal member 203B provided on the bottom surface of the second recess 209, and the insulating member 207 provided between the metal member 203B and the light reflecting resin 202 emits light. It is provided so as to continue up to the element 204. Thereby, the insulating member 207 functions as a passivation film, and Ag migration can be suppressed. Moreover, the adhesive force with resin parts, such as light reflection resin 202, can be raised depending on a structural member.

  The second embodiment is different from the first embodiment in that a concave portion is formed in the support, and the same members as those in the first embodiment can be used as the members to be used. Hereinafter, differences from the first embodiment will be described in detail.

(Concave)
In the light emitting device 200 according to the second embodiment, the recess has a first recess 208 in which the light emitting element is placed, and a first bottom within the first recess and at a position lower than the bottom of the first recess. Two recesses 209 are provided. Hereinafter, each concave portion will be described in detail.

(First recess)
The first recess is provided with a metal member on the bottom surface, on which the light emitting element is placed. And it has the 2nd recessed part which has a bottom face in a position lower than the bottom face of the 1st recessed part. In other words, the concave portion of this embodiment has a two-step concave portion, and a shape in which a second concave portion having a smaller opening diameter is formed in the first concave portion having a larger opening diameter. have.

  The bottom surface of the first recess only needs to have a width that can secure an area necessary for mounting the light emitting element in a region other than the second recess, and the light emitting element is connected to the second recess. It is only necessary to have a continuous region that has an area equal to or larger than the bottom area of the light emitting element so as not to overlap (so as not to block the opening of the second recess). For example, as illustrated in FIG. 2B and the like, the light-emitting device 200 has nine light-emitting elements 204 mounted thereon, and has a bottom surface that has an area on which all the light-emitting elements 204 can be placed. Thus, when mounting a some light emitting element, it is preferable to mount all the light emitting elements on the continuous metal member. Moreover, when mounting a light emitting element on another member, such as a submount, it is sufficient if the submount has a region having an area where the submount can be mounted. A plurality of first recesses may be provided. For example, the light emitting element may be placed in each of the two first recesses, and each may have a second recess.

  The metal member provided on the bottom surface of the first recess can be used as a lead electrode for feeding power to the light emitting element. Moreover, you may use as a member which has the function of improving the reflectance of light or improving heat dissipation, without supplying with electricity.

  In particular, when ceramics are used as the support, the metal member is preferably provided on the entire bottom surface of the first recess (the entire surface excluding the second recess). As a result, the support can be prevented from being exposed, and light leakage can be reduced. For example, as shown in FIG. 2B and the like, the metal member 203A is provided on almost the entire bottom surface of the first recess 208. The conductive wire 205 is connected to the metal member 203B on the bottom surface of the second recess, and here, the metal member 203B is used as an electrode (conductive member). The metal member 203A provided on the bottom surface of the first recess is a member that does not contribute to energization, and is mainly used as a reflecting member that efficiently reflects light.

  The shape of the bottom surface of the first recess is not limited to a substantially square shape as shown in FIG. 2B, but can be any shape such as a circle or an ellipse. , Can be any shape. Further, the shape of the bottom surface of the first recess and the shape of the opening are similar here, but are not necessarily limited to this, for example, the shape of the opening is substantially circular as a substantially rectangular bottom. It can also be a shape.

  The side surface of the first recess can be a surface that is perpendicular or inclined with respect to the bottom surface, and can also be provided so as to be continuous with a part of the side surface of the second recess. Alternatively, as shown in FIG. 2C, the second recess may be provided at a position in contact with the side surface of the first recess. Further, the side surface of the first recess may have a step. Furthermore, a metal member can also be provided on the side surface of the first recess 208.

(Second recess)
The second recess is a recess further provided in the first recess, and has a bottom surface at a position lower than the bottom surface of the first recess. In the second embodiment, the metal member is provided on the bottom surface of the second recess, and the second recess is filled with light reflecting resin. An insulating member is provided between the metal member and the light reflecting resin, and the insulating member is provided so as to continue up to the light emitting element.

  The metal member provided on the bottom surface of the second recess functions as an electrode for supplying power to the light emitting element, and is embedded with a part of the conductive wire with a light reflecting resin. A metal member may be provided as a pair of positive and negative electrodes as shown in FIG. 2B in one second recess or in each of the plurality of second recesses, or a metal member as either positive or negative electrode may be provided. It may be provided. When a metal member is provided in the second recess as either positive or negative electrode, the other electrode is a metal member provided on the bottom surface of the first recess, or the bottom surface of another second recess. It can be set as the metal member provided in. Alternatively, one of the conductive wires from the light emitting element is connected to a metal member (positive electrode) provided on the bottom surface of the first recess, and the other is connected to a metal member (negative electrode) provided in the second recess. Thus, conduction may be achieved.

  One or more of the second recesses can be provided on the bottom surface of the first recess, and the size of the opening is a size (opening diameter) that does not hinder the placement of the light emitting element. To do. The position to be provided can be arbitrarily selected. For example, as shown in FIG. 2B and the like, the second of the substantially track-shaped (elliptical) opening shape is formed on the two sides of the bottom surface of the substantially rectangular first recess 208. Each of the recesses 209 can be provided in total, and two second recesses 209 can be provided. Here, the two second recesses have the same size and shape, and are provided at symmetrical positions as shown in FIG. 2B. However, the present invention is not limited to this, and the second recesses have different opening areas, different sizes, etc. It is good. Moreover, although the metal member 203B is similarly provided in any of the second recesses 209, it is not necessary to use all of them for conduction.

  In addition, when the protective element 210 is placed in the second concave portion 209 as shown in FIG. 2B, it is necessary to use a second concave portion and a metal member having a bottom area larger than the bottom area of the protective element 210, When bonding the conductive wire 205, etc., it is necessary to make the width of the opening that allows the wire bonder device to enter the recess.

(Metal member)
In Embodiment 2, the metal member is provided on the bottom surface of the first recess and the bottom surface of the second recess. In particular, it is preferably provided on almost the entire bottom surface of the first recess, whereby light can be prevented from entering the support and light loss can be reduced. In this case, by using the metal member on the bottom surface of the second recess as a pair of electrodes, the metal member provided on the bottom surface of the first recess does not need to function as an electrode. It can be used as a member that functions as a high heat dissipation member. Deterioration can be suppressed by covering the metal member provided in such a large area with an insulating member through which gas hardly permeates. As a preferable material, the same material as in Embodiment Mode 1 can be given. The metal member 203 </ b> A provided in the first recess and the metal member 203 </ b> B provided on the second bottom surface may use the same material or preferably use different materials. The metal member 203A provided in the position where most of the light from the light emitting element is irradiated, that is, the first recess, is preferably made of silver or a silver-containing metal, and particularly preferably silver.

  In the second embodiment, the light reflecting resin is filled in the second recess 209 as shown in FIG. 2C. Here, the second concave portion 209 is filled so as to have a concave curved surface in a cross-sectional view, and is provided so as to reach the upper side surface of the first concave portion, that is, the upper surface of the support 201, Thereby, it is possible to prevent light from leaking from the support 201. The light-reflecting resin having such a shape is formed by dripping a predetermined amount of a liquid resin whose viscosity is adjusted, and scooping up the side surface of the support, and is formed by a relatively easy method. can do.

  The light-reflecting resin is preferably provided so as to cover not only the bottom surface of the second recess but also the substantially entire side surface, and more preferably so as to cover most of the side surface of the first recess. Furthermore, when it has several 2nd recessed part, for example, as shown to FIG. 2B, when it has 2nd recessed part mutually spaced apart, the light reflection resin with which they are filled continues in the 1st recessed part bottom face It is preferable to form as follows. Further, the continuously formed light reflecting resin is preferably formed so as to reach from the bottom surface of the first recess to the top surface of the support. At this time, the film thickness of the light reflecting resin on the side surface of the second recess may be a film thickness that can reflect (difficult to transmit) the light from the light emitting element, depending on the transmittance of the light reflecting resin itself. The minimum film thickness can be defined. Moreover, it is not necessary to have the same film thickness over the entire side surface of the second recess. For example, the film thickness may be gradually reduced toward the upper side of the second recess. Specific materials that constitute the light-reflecting resin include the same materials as those described in the first embodiment.

(Insulating material)
In the second embodiment, as in the first embodiment, the insulating member is provided between the light reflecting resin and the metal member, and is provided so as to continue up to the light emitting element. As shown in FIG. 2C, the insulating member is also formed on the side surface of the first concave portion and the side surface of the second concave portion, and further provided on the upper surface of the support 201. The insulating member, which is a dense film that hardly allows gas to pass through, covers the surface of the support made of a material having a relatively large amount of voids, such as ceramic, so that the side surface of the support, Gas permeation from the upper surface or the like can be suppressed. In many cases, it is difficult to uniformly form the insulating member on the bottom surface or the side surface of the second recess to the same thickness as the bottom surface of the first recess. For example, in the dry method such as sputtering or vapor deposition, the inside of the second recess is easily shaded and thinned. On the contrary, in the wet method using a liquid coating agent, cracks and peeling occur at the site where the liquid has accumulated and becomes too thick. There is a case. However, since the second recess is filled with the light reflecting resin, it is not always necessary to form an insulating member in the entire interior of the second recess. Temporarily, the discoloration of the silver-containing metal (silver plating) occurs in the second recess. There is no effect even if it occurs. Therefore, in order to form the insulating member, the simplest means may be selected from various methods.

<Embodiment 3>
A cross-sectional view of the light-emitting device 300 of Embodiment 3 is shown in FIG. In Embodiment 3, the appearance of the light-emitting device 300 has the same shape as that of the light-emitting device 100 shown in FIG. 1A. The difference is the position where the insulating member 307 is formed. That is, in Embodiment 3, the support body 301 having the metal member 303 (303A, 303B, 303C) having a silver-containing metal on the surface, the light-emitting element 304 placed on the support body, and the metal member 303B. A conductive wire 305 that conducts the light from the light emitting element 304, a sealing member 306 filled in a recessed region surrounded by the light reflecting resin 302, and light from the light emitting element 304 provided on the support 301. A light reflecting resin 302 to be reflected and an insulating member 307 are provided on the surface of the light reflecting resin 302. The insulating member 307 is provided so as to continue up to the top of the light emitting element 304. With such a configuration, it is possible to suppress deterioration of silver plating of the metal member, and the insulating member 307 functions as a passivation film, thereby suppressing Ag migration. Moreover, the adhesive force with resin parts, such as the light reflection resin 302, can be raised depending on a structural member. In particular, even when the base resin of the light reflecting resin 302 is made of a resin that is easily deteriorated or colored by oxidation, the insulating member 307 blocks oxygen, so that deterioration and coloring of the light reflecting resin 302 can be suppressed. .

<Embodiment 4>
A cross-sectional view of the light-emitting device 400 of Embodiment 4 is shown in FIG. In Embodiment Mode 4, the appearance and internal structure of the light emitting device 400 have the same shape as the light emitting device 200 shown in FIGS. 2A and 2B, and the difference is the position where the insulating member 407 is formed. That is, in the fourth embodiment, the support 401 having a metal member 403 (403A, 403B) having a silver-containing metal on the surface, the light emitting element 404 placed on the support, the metal member 403B, It has a conductive wire 405 for conducting the light emitting element 404 and a sealing member 406 filled in a recessed region surrounded by the light reflecting resin 402. The recess includes a first recess 408 on which the light emitting element 404 is placed, and a second recess 409 having a bottom surface in the first recess 408 and lower than the bottom surface of the first recess. Have. A light reflecting resin 402 is provided so as to cover the metal member 403B provided on the bottom surface of the second recess 409, and an insulating member 407 is provided on the surface of the light reflecting resin 402, and the insulating member 407 is a light emitting element. It is provided to continue up to 404. With such a structure, it is possible to suppress deterioration of silver plating of the metal member, and the insulating member 407 functions as a passivation film, thereby suppressing Ag migration. Moreover, the adhesive force with resin parts, such as the light reflection resin 402, can be raised depending on a structural member. In particular, even when a resin that easily deteriorates and colors due to oxidation is used as the base resin of the light reflecting resin 402, the insulating member 407 blocks oxygen, so that deterioration and coloring of the light reflecting resin 402 can be suppressed. .

<Embodiment 5>
A cross-sectional view of the light-emitting device 300 of Embodiment 5 is shown in FIG. In Embodiment Mode 5, the appearance of the light-emitting device 500 has the same shape as that of the light-emitting device 100 shown in FIG. 1A, and the difference is the position where the insulating member 507 is formed. That is, in Embodiment 5, the support body 501 in which the metal member 503 (503A, 503B, 503C) having a silver-containing metal is arranged on the surface, the light emitting element 504 placed on the support body, and the metal member 503B. A conductive wire 505 for conducting the light emitting element 504 with the top, a sealing member 506 filled in a recessed region surrounded by the light reflecting resin 502, and light from the light emitting element 504 provided on the support 501. A light reflecting resin 502 to be reflected, and an insulating member 507 is provided between the metal member 503 and the light reflecting resin 502. The insulating member 507 is provided so as to be continuous with the light emitting element 504. In Embodiment 5, the insulating member is not provided over the light-emitting element, but is provided so as to be in contact with the side surface of the light-emitting element. With such a configuration, deterioration of the silver plating of the metal member can be suppressed, and the insulating member 507 can function as a passivation film, thereby suppressing Ag migration. Moreover, the adhesive force with resin parts, such as light reflection resin 502, can be raised depending on a structural member.

<Embodiment 6>
A cross-sectional view of the light-emitting device 600 of Embodiment 6 is shown in FIG. In Embodiment 6, the appearance and internal structure of the light-emitting device 600 have the same shape as that of the light-emitting device 200 shown in FIGS. 2A and 2B, and the difference is the position where the insulating member 607 is formed. That is, in the sixth embodiment, a support body 601 having a metal member 603 (603A, 603B) having a silver-containing metal on its surface, a light emitting element 604 placed on the support body, and a metal member 603B It has a conductive wire 605 that conducts to the light emitting element 604 and a sealing member 606 that fills a recessed region surrounded by the light reflecting resin 602. The recess includes a first recess 608 on which the light emitting element 604 is placed, and a second recess 609 having a bottom surface at a position lower than the bottom surface of the first recess in the first recess 608. Have. The light reflecting resin 602 is provided so as to cover the metal member 603B provided on the bottom surface of the second recess 609. The light reflecting resin 602 has an insulating member 607 on the surface, and the insulating member 607 is a light emitting element. It is provided so as to be in contact with 604. In Embodiment 6, the insulating member is not provided over the light-emitting element, but is provided so as to be in contact with the side surface of the light-emitting element. With such a structure, the silver plating of the metal member can be prevented from deteriorating, and the insulating member 607 can function as a passivation film, thereby suppressing Ag migration. Moreover, the adhesive force with resin parts, such as the light reflection resin 602, can be raised depending on a structural member.

  The light-emitting device and the manufacturing method thereof according to the present invention have a structure in which light from the light-emitting element hardly leaks from the support, thereby obtaining a light-emitting device capable of reducing light loss and increasing output. Can do. These light emitting devices can be used for various display devices, lighting fixtures, displays, backlight light sources for liquid crystal displays, and image reading devices and projector devices in facsimiles, copiers, scanners, and the like.

100, 200, 300, 400, 500, 600 ... Light emitting device 101, 201, 301, 401, 501, 601 ... Support body 102, 202, 302, 402, 502, 602 ... Light reflecting resin 103, 103A, 103B, 103C , 203, 203A, 203B, 303, 303A, 303B, 303C, 403, 403A, 403B, 503, 503A, 503B, 503C, 603, 603A, 603B ... metal members 104, 204, 304, 404, 504, 604 ... light emission. Elements 105, 205, 305, 405, 505, 605 ... Conductive wires 106, 206, 306, 406, 506, 606 ... Sealing members 107, 207, 307, 407, 507, 607 ... Insulating members 208, 408, 608 ... 1st recessed part 209,409,609 ... 2nd recessed part 210 ... protection element

Claims (1)

A support;
A metal member having a silver-containing metal provided on the surface of the support;
A light emitting element mounted on the support;
A conductive wire for conducting the metal member and the light emitting element;
A light reflecting resin that is provided on the support and reflects light from the light emitting element;
An insulating member covering at least a part of the surface of the metal member;
Have
The light-emitting device, wherein the insulating member is provided in contact with a side surface of the light-emitting element.

Images