JP7364858B2 - light emitting device - Google Patents

Description

The present disclosure relates to a light emitting device.

For example, the light emitting device disclosed in Patent Document 1 includes a resin package having leads and a resin part, a reflective layer (light reflective member) provided on the inner wall of a recess of the resin package, and a reflective layer (light reflective member) disposed at the bottom of the recess. A light emitting element.

Japanese Patent Application Publication No. 2014-158011

There is a demand for improved light extraction efficiency in light emitting devices. Therefore, an object of the embodiments of the present invention is to provide a light emitting device that can improve light extraction efficiency.

The light emitting device of the present disclosure includes a resin package having a plurality of leads including a first lead and a second lead, and a resin body including a first resin part, a second resin part, a third resin part, and a first resin connection part. The first resin part constitutes an outer surface of the resin package, a recess is formed between the plurality of leads and an inner wall surface of the first resin part, and the first lead and the second lead are connected to each other. The third resin part is located between the recessed parts, a part of the upper surface of each of the first lead and the second lead, and a part of the upper face of the third resin part are located on the bottom surface of the recessed part, A second resin part is arranged around the element mounting area, and the first resin connection part is arranged in the element mounting area and a resin package connecting the first resin part and the second resin part. a first light-reflecting member located between the inner wall surface and the second resin part in the recess and separated from the light emitting element; a second light-reflective member located between the second resin portion and the first light-reflective member and separated from the light-emitting element;

According to the light emitting device of the present disclosure, it is possible to provide a light emitting device that can improve light extraction efficiency.

FIG. 1 is a schematic top view of a light emitting device according to a first embodiment. FIG. 2 is a schematic top view of the structure of the light emitting device according to the first embodiment, with the first light reflective member and the second light reflective member removed. FIG. 2 is a schematic bottom view of the light emitting device according to the first embodiment. FIG. 1 is a schematic front view of a light emitting device according to a first embodiment. FIG. 1 is a schematic side view of a light emitting device according to a first embodiment. FIG. 3 is a schematic top view of the structure of the light emitting device according to the first embodiment with the second light reflective member removed. 1A is a schematic cross-sectional view of the light emitting device taken along line 2A-2A shown in FIG. 1A. FIG. FIG. 1B is a schematic cross-sectional view of the light emitting device taken along line 2B-2B shown in FIG. 1A. 1A is a schematic cross-sectional view of the light emitting device taken along line 2C-2C shown in FIG. 1A. FIG. FIG. 2 is a schematic top view of a first lead and a second lead of the light emitting device according to the first embodiment. FIG. 3 is a schematic bottom view of a first lead and a second lead of the light emitting device according to the first embodiment. FIG. 2 is a schematic top view for explaining the method for manufacturing the light emitting device according to the first embodiment. FIG. 2 is a schematic top view for explaining the method for manufacturing the light emitting device according to the first embodiment. 1A is a schematic cross-sectional view of a modified example of the light emitting device taken along line 2B-2B shown in FIG. 1A. FIG. 1A is a schematic cross-sectional view of a modified example of the light emitting device taken along line 2B-2B shown in FIG. 1A. FIG.

Hereinafter, the light emitting device of the present disclosure will be described in detail with reference to the drawings. The light emitting device of the present disclosure is an example, and is not limited to the light emitting device described below. In the following description, terms indicating specific directions or positions (eg, "above", "below", and other terms including these terms) may be used. These terms are used only for ease of understanding and relative orientation and position in the referenced drawings. In addition, the sizes and positional relationships of the components shown in the drawings may be exaggerated for the sake of clarity, and may differ from the actual size of the light emitting device or the size relationship between the components of the actual light emitting device. It may not be reflected.

(First embodiment)
[Light emitting device 101]
A light emitting device 101 that is a first embodiment of the present disclosure will be described based on FIGS. 1A to 4B. In order to show the internal structure, the sealing member 75 is shown as a transparent member in FIG. 1A.

The light emitting device 101 includes a resin package 10, at least one light emitting element 40, a first light reflective member 51, and a second light reflective member 52. The light emitting device 101 may include a sealing member 75. Each component will be explained in detail below.

[Resin package 10]
The resin package 10 is a housing and has a recess 11. At least one light emitting element 40 , a first light reflective member 51 , and a second light reflective member 52 are arranged within the recess 11 . The resin package 10 includes a resin body 30 and a plurality of leads including a first lead 21 and a second lead 22. The resin body 30 is integrally formed with the first lead 21 and the second lead 22. The first lead 21 has an upper surface 21a and a lower surface 21b located on the opposite side to the upper surface 21a, and the second lead 22 has an upper surface 22a and a lower surface 22b located on the opposite side to the upper surface 22a. The lower surface 21b of the first lead 21 and the lower surface 22b of the second lead 22 are arranged so as to be located on substantially the same plane. A third resin portion 33 of the resin body 30 is located between the first lead 21 and the second lead 22.

The resin package 10 has an upper surface 10a and a lower surface 10b located on the opposite side of the upper surface 10a. In this embodiment, the resin package 10 has a substantially rectangular outer shape when viewed from above. Therefore, the resin package 10 has a first outer surface 10c, a second outer surface 10d located on the opposite side to the first outer surface 10c, and a third outer surface 10e adjacent to the first outer surface 10c and the second outer surface 10d. , and a fourth outer surface 10f located on the opposite side to the third outer surface 10e. In other words, the resin package 10 has a first outer surface 10c and a second outer surface 10d extending in a first direction (X direction), and a third outer surface 10e extending in a second direction (Y direction) perpendicular to the first direction. and a fourth outer surface 10f. Note that the outer shape of the resin package 10 when viewed from above is not limited to a square, and may have other shapes. Furthermore, the resin package 10 may have an anode mark or a cathode mark formed by chamfering one corner of the opening 11a when viewed from above. The anode mark or cathode mark functions as a mark indicating the polarity of the two leads. In this specification, the first outer surface 10c, the second outer surface 10d, the third outer surface 10e, and the fourth outer surface 10f may be respectively referred to as outer surfaces.

The resin package 10 is provided with a recess 11 having an opening 11a on the upper surface 10a. A portion of the upper surface 21 a of the first lead 21 and a portion of the upper surface 22 a of the second lead 22 are located on the bottom surface of the recess 11 . The shape of the recess 11 will be explained in detail when explaining the resin body 30.

As shown in FIG. 1C, on the lower surface 10b of the resin package 10, the lower surface 21b of the first lead 21 and the lower surface 22b of the second lead 22 are exposed from the resin package 10.

[First lead 21, second lead 22]
The first lead 21 and the second lead 22 are electrically conductive and function as electrodes for supplying power to the light emitting element 41 and heat dissipating members with high thermal conductivity. In this embodiment, a first lead 21 and a second lead 22 are provided as the plurality of leads. Further, the light emitting device 101 may include a third lead in addition to the first lead 21 and the second lead 22. When the plurality of leads include a first lead 21, a second lead 22, and a third lead, the first lead 21 may be located between the second lead 22 and the third lead. In this case, the first lead 21 may function as a heat radiating member, and the second lead 22 and third lead may function as electrodes. Note that the light emitting device 101 may include four or more leads.

As shown in FIGS. 3A and 3B, the first lead 21 has, for example, a substantially rectangular shape and side portions 21c, 21d, 21e, and 21f. The side portion 21d faces the second lead 22. Further, the side portion 21c is located on the opposite side to the side portion 21d. The side portion 21e and the side portion 21f are located on opposite sides and do not face the second lead 22.

As shown in FIG. 3B, the first lead 21 has a side edge groove 21g (indicated by hatching) on the lower surface 21b side of the side parts 21d, 21e, 21f along the side parts 21d, 21e, 21f. . The side edge groove portion 21g is recessed from the lower surface 21b of the first lead 21 toward the upper surface 21a. The side edge groove portion 21g can be formed by etching, pressing, or the like.

The extending portion 21h is located near the center of each of the side portions 21c, 21e, and 21f of the first lead 21 when viewed from above. The extending portion 21h is a part of the first lead 21. The end surfaces of the extending portions 21h located on the side portions 21c, 21e, and 21f are exposed from the resin body 30 at the outer surfaces 10c, 10e, and 10f of the resin package 10. For example, as shown in FIG. 1D, the end surface of the extending portion 21h is exposed from the resin body 30 at the outer surface 10c of the resin package 10. Further, as shown in FIG. 1E, the end surface of the extending portion 21h is exposed from the resin body 30 at the outer surface 10f of the resin package 10. On the outer surfaces 10c, 10e, and 10f of the resin package 10, the end surfaces of the extending portions 21h of the first leads 21 are substantially flush with the resin body 30. The extending portion 21h extends from the main body portion of the first lead 21 toward the outer surfaces 10c, 10e, and 10f of the resin package 10. The main body portion of the first lead 21 refers to a portion of the first lead 21 excluding the extension portion 21h. As shown in FIGS. 3A and 3B, the outer shape of the main body of the first lead is approximately square.

Penetration portions 25m and 25n are provided in side portions 21e and 21f of the first lead 21, respectively. The penetrating portions 25m and 25n are cavities (holes) penetrating from the upper surface 21a to the lower surface 21b of the first lead 21, and have openings (cuts) at the outer edges of the side portions 21e and 21f, respectively. The penetrating portions 25m and 25n can also be said to be cutouts provided in the side portions 21e and 21f, respectively. However, it is not necessary that the side parts 21e and 21f are formed by cutting out a part of them; for example, the side parts 21e and 21f and the through parts 25m and 25n can be formed at the same time by etching, press working, etc. Good too. The penetrating portions 25m and 25n and the side edge groove portion 21g are filled with a portion of the resin body 30. This improves the adhesion between the resin body 30 and the first lead.

The upper surface 21a of the first lead 21 is provided with a first groove 21j, second grooves 21m and 21n, and a third groove 21p. The first groove 21j is arranged in at least a portion of the periphery of the element placement area when viewed from above. The element mounting area is a portion of the upper surface 21a of the first lead 21 surrounded by a first portion 32c of the second resin portion 32, which will be described later. The light emitting element is placed in the element placement area. When the first groove 21j is arranged around at least a part of the periphery of the element mounting area in a top view, the first groove 21j may be arranged around the entire periphery of the element mounting area (entire circumference); It may be arranged in a part of the periphery of the element mounting area. A portion of the second resin portion 32 of the resin body 30 is filled in the first groove 21j.

The second groove 21m of the first lead 21 connects the penetrating portion 25m, the first groove 21j, and the third groove 21p. Similarly, the second groove 21n of the first lead 21 connects the through portion 25n, the first groove 21j, and the third groove 21p. The first resin connecting portions 35m, 35n of the resin body 30 are arranged in the second grooves 21m, 21n.

The third groove 21p is connected to the second grooves 21m and 21n, and is partially covered by the first resin portion 31 of the resin body 30. By partially covering the third groove 21p of the first lead 21 with the first resin portion 31 of the resin body 30, the adhesion between the first lead 21 and the resin body 30 is improved.

As shown in FIG. 3B, the second lead 22 has, for example, a substantially rectangular shape and includes side portions 22c, 22d, 22e, and 22f. The second lead 22 has side edge grooves 22g (shown by hatching) along side portions 22c, 22e, and 22f of the lower surface 22b. The extending portion 22h is located near the center of each of the side portions 22d, 22e, and 22f of the second lead 22 when viewed from above. The extending portion 22h is a part of the second lead 22. The end surfaces of the extending portions 22h located on the side portions 22d, 22e, and 22f are exposed from the resin body 30 at the outer surfaces 10d, 10e, and 10f of the resin package 10. On the outer surfaces 10d, 10e, and 10f of the resin package 10, the end surfaces of the extending portions 22h of the second leads 22 are substantially flush with the resin body 30. The extending portion 22h extends from the main body portion of the second lead 22 toward the outer surfaces 10d, 10e, and 10f of the resin package 10. The main body portion of the second lead 22 refers to a portion of the second lead 22 excluding the extension portion 22h. A fifth groove 22j is provided on the upper surface 22a of the second lead. By covering the fifth groove 22j with the resin body 30, the adhesion between the second lead 22 and the resin body 30 is improved. As shown in FIGS. 3A and 3B, the outer shape of the main body of the second lead is approximately square.

The third groove 21p is connected to the second grooves 21m and 21n, and is partially covered by the first resin portion 31 of the resin body 30. By partially covering the third groove 21p of the first lead 21 with the first resin portion 31 of the resin body 30, the adhesion between the first lead 21 and the resin body 30 is improved.

The lead frame includes a frame, a plurality of connecting portions, and a main body portion that is a portion that becomes a plurality of pairs of first leads 21 and a main body portion that is a portion that becomes a second lead 22 that are connected by the plurality of connection portions. Then, the resin body 30 is integrally formed on the lead frame, and is then cut into individual pieces by cutting at the connecting portion. The extending portions 21h and 22h are part of a connecting portion that connects the main body portions that will become the first lead 21 and the second lead 22 to the frame. Therefore, the extending portions 21h and 22h, which were part of the connecting portion, are exposed on the outer surfaces 10c, 10d, 10e, and 10f of the resin package 10 in substantially the same plane as the resin body 30. After being singulated, the first lead 21 includes the main body portion and the extension portion 21h of the first lead 21. The same applies to the second lead 22, and the second lead 22 includes the main body portion and the extension portion 22h of the second lead 22.

The first lead 21 and the second lead 22 each have a base material and a metal layer covering the base material. The base material is preferably a plate-shaped member. The base material includes metals such as copper, aluminum, gold, silver, iron, nickel, or alloys thereof, phosphor bronze, and iron-containing copper. These may be a single layer or may have a laminated structure (for example, a cladding material). In particular, it is preferable to use copper, which is inexpensive and has high heat dissipation properties, for the base material. The metal layer includes, for example, silver, aluminum, nickel, palladium, rhodium, gold, copper, or an alloy thereof. Note that in the first lead 21 and the second lead 22, there may be a region where no metal layer is provided. Further, in the first lead 21 and the second lead 22, the metal layer formed on the upper surfaces 21a and 22a may be different from the metal layer formed on the lower surfaces 21b and 22b. For example, the metal layer formed on the upper surfaces 21a and 22a is a metal layer consisting of multiple layers including a nickel metal layer, and the metal layer formed on the lower surfaces 21b and 22b is a metal layer that does not include a nickel metal layer. It may be.

Furthermore, when a silver or silver alloy plating layer is formed on the outermost surfaces of the first lead 21 and the second lead 22, a protective layer such as silicon oxide may be provided on the surface of the silver or silver alloy plating layer. preferable. Thereby, discoloration of the silver or silver alloy plating layer due to sulfur components in the atmosphere can be suppressed. The protective layer can be formed by, for example, a vacuum process such as sputtering, but other known methods may also be used.

As shown in FIG. 1B, the resin body 30 is formed integrally with the first lead 21 and the second lead 22, and constitutes the resin package 10 together with the first lead 21 and the second lead 22. The resin body 30 includes a first resin part 31, a second resin part 32, a third resin part 33, and first resin connection parts 35m, 35n, and 35p.

The first resin portion 31 has four side surfaces, inner wall surfaces 31c, 31d, 31e, and 31f, and forms the recess 11 together with the first lead 21 and the second lead 22. The inner wall surface 31c and the inner wall surface 31d face each other, and the inner wall face 31e and the inner wall face 31f face each other.

The first resin portion 31 further constitutes outer surfaces 10c, 10d, 10e, and 10f of the resin package 10. The outer surfaces 10c, 10d, 10e, and 10f are located opposite the inner wall surfaces 31c, 31d, 31e, and 31f, respectively.

The second resin portion 32 is located on the bottom surface 11b of the recess 11, and is arranged around the element mounting area. At least a portion of the second resin portion 32 is in contact with the first light reflective member 51 . Thereby, the surface area where the resin package and the first light-reflecting member are in contact increases, and the adhesion between the resin package and the light-reflecting member can be improved. Further, as shown in FIGS. 2A and 2B, the second resin part 32 is disposed in the first groove 21j provided in the upper surface 21a of the first lead 21, and is located from a plane including the upper surface 21a of the first lead 21. A first portion 32c is located above the second portion 32d and above a plane including the upper surface 21a of the first lead 21. In this embodiment, the first portion 32c of the second resin portion 32 has an annular shape that seamlessly surrounds the element mounting area.

As shown in FIG. 2A, a part of the first portion 32c of the second resin part 32 is located on the upper surface 21a of the first lead 21, and the other part is located on the second resin part in the first groove 21j. It is located on the second portion 32d of the portion 32, and the remaining portion is located on the upper surface 33a of the third resin portion 33. The second resin portion 32 on the upper surface 21 a of the first lead 21 can prevent the resin body 30 from peeling off from the first lead 21 . In a cross section perpendicular to the direction in which the first portion of the second resin portion extends, as shown in FIG. 2B, the width of the first groove 21j of the first lead 21 is equal to It is preferable that the width is larger than the width of 32c. As a result, the contact area between the second resin portion 32 and the first lead 21 increases, and by reducing the width of the first portion 32c, a sufficient flow path is provided when the first light reflective member 51 is provided. can be secured.

The height h1 of the first portion 32c is preferably lower than the height h2 of the light emitting element 41. Thereby, the light emitted from the light emitting element 41 can be easily made to enter the inclined surface 52s of the second light reflective member 52, and the light from the light emitting element can be efficiently emitted to the outside. The height of the first portion is defined as the distance at the farthest first portion in the Z direction with respect to the bottom surface 11b of the recess 11 of the resin package 10. Further, the height of the light emitting element is defined as the distance at the farthest part of the light emitting element in the Z direction with respect to the bottom surface 11b of the recess 11 of the resin package 10.

As shown in FIG. 2C, the first resin connection part 35n is a part of the resin body 30 located between the second resin part 32 and the first resin part 31, and 1 resin part 31 is connected. In this embodiment, the first resin connection portion 35n is located within the second groove 21n of the first lead 21. Further, one end of the first resin connecting portion 35n is connected to the second portion 32d of the second resin portion 32. The other end of the first resin connection portion 35n is in contact with the inner wall surface 31f of the first resin portion 31, and is located closer to the lower surface 21b of the first lead 21 than the lower end of the inner wall surface 31f of the first resin portion 31. 1 resin part 31.

The upper surface of the first resin connecting portion and the first lead may be located at the same height, and as shown in FIG. 2B, the first resin connecting portion 35p is located above the upper surface 21a of the first lead 21. may be provided. Further, since a portion of the first resin connection portion 35p covers the upper surface 21a of the first lead 21, the adhesion between the resin body 30 and the first lead is improved. The "same height" in this specification allows variation within ±5 μm.

As shown in FIG. 2A, the third resin portion 33 is a portion of the resin body 30 located between the first lead 21 and the second lead 22. As shown in FIG. The third resin portion 33 has an upper surface 33a and a lower surface 33b, and the upper surface 33a is located on the bottom surface 11b of the recess 11. The upper surface 33a of the third resin part 33 is located at the same height as the upper surface 21a of the first lead 21 and the upper surface 22a of the second lead 22. The lower surface 33b of the third resin portion 33 is located on the lower surface 10b of the resin package 10. The third resin part 33 connects the wall part having the inner wall surface 31e of the first resin part 31 and the wall part having the inner wall surface 31f. For example, when the resin package includes a third lead, the third resin part 33 is also arranged between the first lead 21 and the second lead 22 and between the second lead 22 and the third lead.

A part of the first portion 32c of the second resin portion 32 is located on the upper surface 33a of the third resin portion 33. Because the second resin part 32 and the third resin part 33 have this positional relationship, when the uncured resin material that will become the resin body 30 flows into the mold by the molding method, it is possible to In this case, it becomes possible to introduce the resin material from the space where the third resin part 33 is formed into the space where the second resin part 32 is formed.

On the bottom surface 11b of the recess 11, the second portion 32d of the second resin portion 32 and the first resin portion 31 are connected by first resin connecting portions 35m and 35n. Further, a part of the first portion 32c of the second resin portion 32 is located on the upper surface 33a of the third resin portion 33, and is connected to the third resin portion 33. Therefore, peeling of the resin body 30 from the first lead 21 can be suppressed. Further, since the second portion 32d of the second resin part 32 and the first resin connection parts 35m, 35n are formed in the first groove 21j and the second grooves 21m, 21n of the first lead 21, the first lead 21 This increases the contact area and improves adhesion.

The resin body 30 can use thermosetting resin, thermoplastic resin, or the like as a resin material serving as a base material. Specifically, epoxy resin compositions, silicone resin compositions, modified epoxy resin compositions such as silicone-modified epoxy resins, modified silicone resin compositions such as epoxy-modified silicone resins, unsaturated polyester resins, saturated polyester resins, and polyimide resins. Compositions, cured products such as modified polyimide resin compositions, resins such as polyphthalamide (PPA), polycarbonate resins, polyphenylene sulfide (PPS), liquid crystal polymers (LCP), ABS resins, phenolic resins, acrylic resins, PBT resins, etc. Can be used. In particular, it is preferable to use a thermosetting resin such as an epoxy resin composition or a modified silicone resin composition. As described above, the first resin portion 31, the second resin portion 32, the third resin portion 33, and the first resin connection portions 35m, 35n, and 35p are integrally connected, and therefore may be formed of the same resin material. The resin body 30 preferably has a viscosity of 10 pa·s to 40 pa·s, more preferably 15 pa·s to 25 pa·s in an uncured state. This makes it possible to form the first resin part 31, second resin part 32, third resin part 33, and first resin connection parts 35m, 35n, and 35p with good fluidity even by a molding method using a metal mold. can.

Furthermore, in order to improve the contrast of the light emitting device, the resin body 30 may have a low light reflectance with respect to external light (sunlight in many cases) from the light emitting device. In this case, it is usually preferable that the color be black or a color similar to black. As fillers at this time, carbon such as acetylene black, activated carbon, and graphite, transition metal oxides such as iron oxide, manganese dioxide, cobalt oxide, and molybdenum oxide, or colored organic pigments may be used depending on the purpose. can.

[Light emitting element 40]
As the light emitting element 40, a semiconductor light emitting element such as a light emitting diode element can be used. In this embodiment, the light emitting device 101 includes two light emitting elements, the first light emitting element 41 and the second light emitting element 42, but the number of light emitting elements may be one. Further, the light emitting device may include three or more light emitting elements. It is particularly preferable that the light emitting element 40 includes a nitride semiconductor (In _x Al _y Ga _1-x-y N, 0≦x, 0≦y, x+y≦1) capable of emitting light in the ultraviolet to visible range. For example, the light emitting element 40 may emit blue light and green light, respectively. When the light emitting device includes two light emitting elements, a first light emitting element and a second light emitting element, the peak wavelength of the first light emitting element and the peak wavelength of the second light emitting element may be the same or different. When the difference between the peak wavelength of the first light emitting element and the peak wavelength of the second light emitting element is 10 nm or more, the color rendering properties of the light emitting device are improved. Alternatively, the first light emitting element may have a blue light having a peak wavelength in a range of 430 nm or more and less than 490 nm, and the second light emitting element may have a green light having a peak wavelength in a range of 490 nm or more and less than 570 nm. A plurality of light emitting elements may be connected in series or in parallel. Further, a plurality of light emitting elements may be electrically connected in a combination of series connection and parallel connection.

The light emitting element 40 is located in the element mounting area of the first lead 21 and is bonded to the first lead 21 by a bonding member. Examples of bonding members include resins including the resin materials exemplified in the resin body 30, tin-bismuth-based, tin-copper-based, tin-silver-based, and gold-tin-based solders, and conductive materials such as silver, gold, and palladium. A conductive paste, a bump, an anisotropic conductive material, a brazing material such as a low melting point metal, etc. can be used. In this embodiment, the light emitting element 40 is electrically connected to the first lead 21 and the second lead 22 by a wire 43. Known materials can be used for the wire. For example, gold, silver, and alloys thereof can be used as the wire material. By containing silver in the material of the wire, light from the light emitting element can be suppressed from being absorbed by the wire.

[First light reflective member 51]
The first light reflective member 51 is a member that reflects light emitted from the light emitting element. The first light reflective member 51 may have a reflectance of 60% or more, preferably 70% or more with respect to light from the light emitting element. The first light reflective member 51 is located between the inner wall surfaces 31c, 31d, 31e, and 31f of the recess 11 and the second resin portion 32, and is away from the light emitting element. By separating the first light-reflective member and the light-emitting element, it is possible to suppress light from the light-emitting element from being confined within the light-emitting element. The first light reflective member 51 may have a ring shape that seamlessly surrounds the light emitting element when viewed from above, or may not surround the light emitting element. When viewed from above, the first light reflective member 51 has an annular shape that seamlessly surrounds the light emitting element, which makes it easier to reflect the light emitted from the light emitting element 40 toward the opening 11a, so that light can be extracted from the light emitting device 101. Efficiency can be increased. For example, the first light reflective member 51 does not overlap the light emitting element in the first direction (X direction) or the second direction (Y direction), and the first light reflective member 51 surrounds the light emitting element when viewed from above. You don't have to. Even in such a case, the first light reflective member 51 reflects the light emitted from the light emitting element toward the opening 11a, thereby increasing the light extraction efficiency of the light emitting device. Further, the widths of the first light reflective member 51 in a top view may be the same or different. For example, as shown in FIG. 1F, when viewed from above, the minimum width w1 of the first light reflective member in the first direction (X direction) is the minimum width w1 of the first light reflective member in the second direction (Y direction). It may be smaller than w2. Note that the width of the first light reflective member in the first direction (X direction) refers to the width of the first light reflective member in the first direction (X direction) when there are multiple first light reflective members separated from each other in the first direction (X direction). means the width of the sexual member. When a plurality of first light reflective members are spaced apart in the first direction (X direction), for example, as shown in FIG. This means that the reflective member 51 is located. Similarly, the width of the first light reflective member in the second direction (Y direction) means that if there are multiple first light reflective members separated in the second direction (Y direction), each of the first light reflective members Refers to the width of the reflective member.

The first light reflective member may be separated from the element mounting area, or may cover a part of the element mounting area. Since the first light-reflective member is located away from the element mounting area, contact between the light-emitting element and the first light-reflective member can be suppressed. In other words, by moving the first light reflective member away from the region surrounded by the first portion 32c of the second resin portion 32, contact between the light emitting element and the first light reflective member can be suppressed. Moreover, since the first light reflective member covers a part of the element mounting area, the first light reflective member can be provided near the light emitting element, thereby improving the light extraction efficiency of the light emitting device. In other words, by positioning the first light-reflective member within the region surrounded by the first portion 32c of the second resin portion 32, the first light-reflective member can be provided near the light-emitting element, so that the light-emitting device The light extraction efficiency is improved.

The first light reflective member 51 may be completely covered by the second light reflective member 52, and the first light reflective member 51 may have a portion exposed from the second light reflective member 52. . When the first light reflective member 51 has a portion exposed from the second light reflective member 52, as shown in FIG. It is preferable to have a first inclined surface 51s that widens to . Thereby, the first light reflective member 51 can reflect the light emitted from the light emitting element 40 toward the opening 11a, thereby increasing the light extraction efficiency of the light emitting device 101. The first inclined surface 51s of the first light reflective member 51 may have a flat surface, a concave curved surface, or a convex curved surface. In other words, in cross-sectional view, the first inclined surface 51s may have a straight line, a concave curve, or a convex curve. As shown in FIG. 2A, in cross-sectional view, it is preferable that the first inclined surface 51s is a concave curve concave toward the bottom surface 11b of the recess 11. By doing so, it is possible to suppress the light from the light emitting element 40 from being reflected by the first light reflective member 51 and being absorbed by the light emitting element 40.

The first light reflective member 51 is preferably a member that hardly transmits or absorbs light from a light emitting element or external light. It is preferable that the first light reflective member 51 has a white color. For example, thermosetting resin, thermoplastic resin, etc. can be used as the base resin of the first light reflective member 51, and more specifically, phenol resin, epoxy resin, BT resin, PPA, silicone resin, etc. etc. can be used. These base resins are coated with light-reflecting particles that are difficult to absorb light from light-emitting elements and have a large refractive index difference with respect to the base resin (e.g., titanium oxide, zinc oxide, silicon oxide, zirconium oxide, aluminum oxide, etc.). By dispersing light-scattering particles such as aluminum nitride, light can be reflected efficiently. The viscosity of the first light reflective member 51 in an uncured state is preferably lower than the viscosity of the resin body 30 in an uncured state. For example, the viscosity of the first light reflective member 51 in an uncured state is preferably 1 pa·s to 20 pa·s, more preferably 5 pa·s to 15 pa·s. Thereby, the first light-reflective member 51 spreads well in the recess 11, and the possibility that the first light-reflective member 51 becomes insufficiently filled can be suppressed.

The first light reflective member 51 may be formed, for example, by discharging an uncured first light reflective member from a plurality of nozzles and then curing the uncured first light reflective member. The position of the nozzle that discharges the uncured first light reflective member is not particularly limited. For example, as shown in FIG. 4A, even if three nozzles 50n aligned in the first direction (X direction) are located in the Y ₊ direction and Y _- direction of the light emitting element 40 when discharging the first light reflective member, good. Note that the nozzle 50n is located above the resin package in the Z direction so as not to come into contact with the resin package. In FIG. 4A, the Y ₊ direction means upward, and the Y _- direction means downward. Furthermore, as shown in FIG. 4B, the nozzles 50n may be located in the X ₊ direction and the X _- direction of the light emitting element 40. In FIG. 4A, the X ₊ direction means the right direction, and the X _- direction means the left direction. The number of multiple nozzles is not particularly limited, and may be two or more. Moreover, the size of the inner diameter of the nozzle is also not particularly limited. The inner diameters of the plurality of nozzles may be the same or different.

[Second light reflective member 52]
The second light reflective member 52 is a member that reflects the light emitted from the light emitting element to the opening 11a. The second light reflective member 52 may be any member having a reflectance of 60% or more, preferably 70% or more with respect to light from the light emitting element. The second light reflective member 52 is at least partially located between the inner wall surface and the second resin portion, covers the first light reflective member 51, and is separated from the light emitting element. By separating the second light-reflective member and the light-emitting element, it is possible to suppress light from the light-emitting element from being confined within the light-emitting element. Since the light emitting device includes the second reflective member that covers the first light reflective member 51, the first reflective member and the second reflective member reflect the light emitted from the light emitting element 40 toward the opening 11a. be able to. Thereby, the light extraction efficiency of the light emitting device 101 can be further improved. By including the second reflective member in the light emitting device, the volume of the reflective members including the first reflective member and the second reflective member located in the recess 11 of the resin package 10 increases. Light extraction efficiency can be further improved. Furthermore, the presence of a plurality of reflective members, the first light reflective member and the second light reflective member, makes it easier to form the inclined surface of the reflective member into an arbitrary shape than when there is only one reflective member. Thereby, it is possible to suppress the first reflective member and/or the second reflective member from coming into contact with the light emitting element.

The second light reflective member may be separated from the element mounting area, or may cover a part of the element mounting area. By separating the second light-reflective member from the element mounting area, it is possible to prevent the light-emitting element from coming into contact with the second light-reflective member. In other words, by moving the second light-reflective member away from the region surrounded by the first portion of the second resin portion, it is possible to prevent the light-emitting element and the first light-reflective member from coming into contact with each other. Moreover, since the second light reflective member covers a part of the element mounting area, the second light reflective member can be provided near the light emitting element, thereby improving the light extraction efficiency of the light emitting device. In other words, by positioning the second light-reflective member within the region surrounded by the first portion of the second resin portion, the first light-reflective member can be provided near the light-emitting element, so that the light from the light-emitting device is The extraction efficiency is improved.

The second light reflective member 52 may have a ring shape that seamlessly surrounds the light emitting element when viewed from above, or may not necessarily surround the light emitting element. For example, when viewed from above, a portion of the first light reflective member having a small width may be exposed from the second light reflective member. That is, as shown in FIG. 1A, at least a portion of the minimum width w1 of the first light reflective member in the first direction (X direction) may be separated from the second light reflective member. Since the second light reflective member is not formed on at least a portion of the narrow portion of the first light reflective member, even if the uncured second light reflective member wets and spreads on the first light reflective member. The uncured second reflective member becomes difficult to wet and spread to the element mounting area. Thereby, contact between the light emitting element and the second reflective member can be suppressed.

As shown in FIG. 2A, the second light reflective member 52 has a second inclined surface 52s that extends from the bottom surface 11b of the recess 11 toward the opening 11a. Thereby, the second light reflective member 52 can reflect the light emitted from the light emitting element 40 toward the opening 11a, so that the light extraction efficiency of the light emitting device 101 can be increased. As shown in FIG. 2A, in cross-sectional view, it is preferable that the second inclined surface 52s is a concave curve concave toward the bottom surface 11b of the recess 11. By doing so, it is possible to suppress the light from the light emitting element 40 from being reflected by the second light reflective member 52 and being absorbed by the light emitting element 40.

The reflectance of the second light reflective member at the peak wavelength of the light emitting element is preferably higher than the reflectance of the first light reflective member. The high reflectance of the second light reflective member makes it easier to reflect the light emitted from the light emitting element toward the aperture 11a, thereby increasing the light extraction efficiency of the light emitting device 101. In addition, when there are multiple light emitting elements, it is preferable that the reflectance of the second light reflective member is higher than the reflectance of the first light reflective member at the peak wavelength of one of the light emitting elements.

A member similar to the first light reflective member 51 can be used for the second light reflective member 52. For example, the first light reflective member 51 may include a base resin and light reflective particles, and the second light reflective member 52 may include a base resin and light reflective particles. When the first light reflective member 51 and the second light reflective member 52 contain light reflective particles, the concentration of the light reflective particles contained in the first light reflective member is equal to that contained in the second light reflective member. It is preferable that the concentration is lower than the concentration of light-reflecting particles. By doing so, the viscosity of the first light-reflecting member 51 in an uncured state can be lowered, so that the first light-reflecting member 51 can spread well in the recess 11. Thereby, the possibility that the first light reflective member 51 becomes insufficiently filled can be suppressed. Furthermore, as the concentration of light-reflecting particles included in the second light-reflecting member increases, the reflectance of the second light-reflecting member increases, so that the light extraction efficiency of the light-emitting device 101 can be increased. The concentration of light-reflecting particles contained in the first light-reflecting member is preferably 3% or more lower than the concentration of light-reflecting particles contained in the second light-reflecting member, and more preferably 5% or more lower. By doing so, the first light reflective member 51 can be wetted and spread well. Further, the difference between the concentration of light reflective particles contained in the first light reflective member and the concentration of light reflective particles contained in the second light reflective member is preferably within 30%, and preferably within 10%. More preferred. By doing so, it is possible to suppress a decrease in the reflectance of the first light-reflective member, thereby increasing the light extraction efficiency of the light-emitting device 101.

As shown in FIG. 2A, the inclination angle formed by the straight line connecting the upper end and the lower end of the second inclined surface 52s formed by the second light reflective member 52 and the bottom surface 11b of the recess 11 is It is preferable that the angle of inclination is larger than the angle of inclination formed by the straight line connecting the upper end and the lower end of the first inclined surface 51s formed by the single-light reflective member 51 and the bottom surface 11b of the recess 11. When the second light reflective member is in contact with the inner wall surface of the first resin portion, it is possible to prevent the second light reflective member from being formed in the vicinity of the light emitting element. Thereby, contact between the second light reflective member and the light emitting element can be suppressed. In order to increase the inclination angle formed by the straight line connecting the upper end and the lower end of the second inclined surface 52s formed by the second light reflective member 52 and the bottom surface 11b of the recess 11, the second light reflective member 52 is It is preferable that the member is difficult to wet and spread. For this reason, it is preferable that the concentration of light-reflecting particles contained in the second light-reflecting member is higher than the concentration of light-reflecting particles contained in the first light-reflecting member.

The second light reflective member 52 may or may not cover the wire. Preferably, the second light reflective member 52 covers the wire. By doing so, it is possible to suppress light from the light emitting element from being absorbed by the wire. As shown in FIG. 2A, the wire 43 is preferably covered with a first light reflective member 51 and a second light reflective member 52. By doing so, it is possible to suppress light from the light emitting element from being absorbed by the wire.

The second light reflective member 52 discharges an uncured second light reflective member from a plurality of nozzles similarly to the first light reflective member, and then hardens the uncured second light reflective member. It may be formed by The position of the nozzle that discharges the uncured second light reflective member is not particularly limited. For example, as shown in FIG. 4A, even if three nozzles 50n aligned in the first direction (X direction) are located in the Y ₊ direction and Y _- direction of the light emitting element 40 when discharging the second light reflective member, good.

[Protective element 60]
The light emitting device 101 may include a protection element 60 to improve electrostatic withstand voltage. As the protection element 60, various protection elements mounted on general light emitting devices can be used. For example, a Zener diode can be used as the protection element 60. In the light emitting device, the protection element and the light emitting element are connected in parallel.

As shown in FIG. 1B, the protection element 60 may be provided on the upper surface 22a of the second lead 22. Preferably, the protective element 60 is embedded within the first light reflective member 51 . Thereby, light from the light emitting element 40 can be suppressed from being absorbed by the protection element 60.

One of the two terminals of the protection element 60 is electrically connected to the upper surface 22a of the second lead 22 by a bonding member. Bonding materials include, for example, tin-bismuth-based, tin-copper-based, tin-silver-based, and gold-tin-based solders, conductive pastes such as silver, gold, and palladium, bumps, anisotropic conductive materials, and low melting point solders. A brazing material such as metal can be used. Further, the other terminal of the protection element 60 is connected to the upper surface 21a of the first lead 21 by, for example, a wire.

[Sealing member 75]
The light emitting device 101 may include a sealing member 75. The sealing member 75 is located within the recess formed by the first light reflective member and the second reflective member within the recess 11 and covers the light emitting element 40 located at the bottom of the recess 11 . The sealing member 75 can protect the light emitting element 40 from external force, dust, moisture, and the like.

The sealing member 75 preferably transmits 60% or more of the light emitted from the light emitting element 40, and more preferably transmits 70% or more. As the material of the sealing member 75, the resin material used in the resin body 30 can be used, and as the base resin, a thermosetting resin, a thermoplastic resin, etc. can be used. For example, silicone resin, epoxy resin, etc. , an acrylic resin, or a resin containing one or more of these can be used. Although the sealing member 75 can be formed from a single layer, it can also be formed from multiple layers. Furthermore, light scattering particles such as titanium oxide, silicon oxide, zirconium oxide, and aluminum oxide may be dispersed in the sealing member 75.

The sealing member 75 may include a material (phosphor, etc.) that converts the wavelength of light from the light emitting element 40. Specifically, the phosphors include yttrium aluminum garnet activated with cerium, lutetium aluminum garnet activated with cerium, and nitrogen-containing calcium aluminosilicate (calcium monomer) activated with europium and/or chromium. Sialon activated with europium, silicate activated with europium, strontium aluminate activated with europium, potassium fluorosilicate activated with manganese, etc. can be used.

The content of the light scattering particles and/or the phosphor is preferably about 10 to 100% by weight based on the total weight of the sealing member 75, for example.

[Coated member]
The light emitting device may include a covering member 80. The covering member 80 is located on the upper surface of the light emitting element 40 and is covered with the sealing member 75. The covering member 80 may cover the upper surface and side surfaces of the light emitting element 40, or, as shown in FIG. 5A, may cover only the upper surface of the light emitting element 41 and not the side surfaces of the light emitting element 41. For example, the covering member may contain a phosphor that emits long-wave light, and the sealing member 75 may contain a phosphor that emits short-wave light. As a result, by arranging a phosphor that emits long-wave light on the upper surface (light-emitting surface) side of the light-emitting element 40, which has a high light intensity, most of the light emitted from the light-emitting element 40 is transferred to the phosphor that emits long-wave light. It can be absorbed efficiently. As a result, light absorption between the phosphor contained in the covering member and the phosphor contained in the covering member can be suppressed. For example, the covering member 80 may contain a red phosphor, and the sealing member 75 may contain at least one of a yellow phosphor, a green phosphor, and a blue phosphor.

As shown in FIG. 5A, when the light emitting device 102 includes the first light emitting element 41 and the second light emitting element 42, the first covering member 81 is located on the first light emitting element 41, and the second light emitting element A second covering member 82 may be located on 42. For example, the concentration of the phosphor in the first covering member 81 and the second covering member 82 may be the same, and the concentration of the phosphor contained in the first covering member and the concentration of the phosphor contained in the second covering member may be different. You can leave it there. Further, the first covering member may contain a phosphor, and the second covering member may not contain a phosphor. The phosphors contained in the first covering member and the second covering member may be the same or different. For example, the first covering member may contain a phosphor that emits long-wave light, and the second covering member may contain a phosphor that emits short-wave light. As the material of the covering member, the same material as that used for the sealing member can be used.

The covering member may have a single layer or multiple layers. For example, as shown in FIG. 5B, the first covering member 81 is located on the top surface of the first light emitting element 41, and is located on the top surface of the first light transmitting portion 81a that does not contain phosphor and the first light transmitting portion. However, it may also include a second light-transmitting portion 81b containing phosphor. It is preferable that the refractive index of the resin material that becomes the base material of the second light-transmitting part 81b is higher than the refractive index of the resin material that becomes the base material of the first light-transmitting part 81a. As a result, among the light emitted from the first light emitting element 41, the light that travels from the first light transmitting section 81a to the second light transmitting section 81b is transmitted through the interface between the first light transmitting member and the second light transmitting section. Cheap. Light traveling from the second light-transmitting part to the first light-transmitting part is likely to be reflected at the interface between the first light-transmitting part and the second light-transmitting member. Thereby, the proportion of light that returns to the light emitting element side can be reduced, and the light extraction efficiency of the light emitting device 103 can be improved. The difference between the refractive index of the resin material that is the base material of the second transparent part 81b and the refractive index of the resin material that is the base material of the first transparent part 81a is, for example, 0.02 to 0.3. , preferably 0.05 to 0.1. For example, the refractive index of the resin material that is the base material of the first transparent part is 1.3 to 1.5, and the refractive index of the resin material that is the base material of the second transparent part is 1.4 to 1. .6. The refractive index in this case is measured, for example, using a refractive index measuring device by the minimum deviation angle method, the critical angle method, the V-block method, or the like.

As shown in FIG. 5B, the second covering member 82 is located on the upper surface of the first light emitting element 41, and is located on the upper surface of the third light transmitting part 82a that does not contain phosphor, and the third light transmitting part 82a, It may have a fourth light-transmitting part 82b containing phosphor. It is preferable that the refractive index of the resin material serving as the base material of the fourth transparent part 82b is higher than the refractive index of the resin material serving as the base material of the third transparent part 82a. Thereby, the light extraction efficiency of the light emitting device 103 can be improved.

The refractive index of the resin material that is the base material of the sealing member 75 is preferably the same as or higher than the refractive index of the resin material that is the base material of the second transparent portion 81b. Thereby, light traveling from the second light-transmitting portion 81b to the sealing member 75 is easily transmitted through the interface between the second light-transmitting portion and the sealing member. On the other hand, light that travels from the sealing member to the second light-transmitting part is likely to be reflected at the interface between the second light-transmitting part and the second light-transmitting part. Thereby, the light extraction efficiency of the light emitting device 103 can be improved.

The light emitting device according to an embodiment of the present invention is applicable to various lighting equipment, backlight devices for liquid crystal displays, large displays, various display devices such as advertisements and destination guides, projector devices, digital video cameras, facsimiles, and copy machines. It can be used in image reading devices such as , scanners, etc.

10 resin package 10a upper surface 10b lower surface 10c, 10d, 10e, 10f outer surface 11 recess 11b bottom surface 11a opening 30 resin body 31 first resin portion 31c, 31d, 31e, 31f inner wall surface 32 second resin portion 32c first portion 32d 2 parts 33 3rd resin part 33a Upper surface 35m, 35n, 35p 1st resin connection part 21 1st lead 21a Upper surface 21j 1st groove 21m, 21n 2nd groove 21p 3rd groove 21q 4th groove 21b Lower surface 21c, 21d, 21e , 21f Side portion 25m, 25n Penetrating portion 22 Second lead 22a Upper surface 22b Lower surface 22c, 22d, 22e, 22f Side portion 22h Extension portion 40 Light emitting element 51 First light reflective member 52 Second light reflective member 60 Protective element 75 Sealing member 80 Covering member

Claims (5)

A resin package having a plurality of leads including a first lead and a second lead, and a resin body including a first resin part, a second resin part, a third resin part, and a first resin connection part, The upper surface of the lead includes an element mounting area, the first resin part constitutes an outer surface of the resin package, a recess is formed by the plurality of leads and an inner wall surface of the first resin part, and the first resin part constitutes an outer surface of the resin package. The third resin part is located between the lead and the second lead, and a part of the top surface of each of the first lead and the second lead and a part of the top surface of the third resin part are located on the bottom surface of the recess. the second resin part includes a first part located above the upper surface of the first lead and surrounding the element mounting area, and the first resin connection part includes a first part located above the upper surface of the first lead and surrounding the element mounting area; a resin package connecting the resin part and the second resin part;
a light emitting element arranged in the element mounting area;
a first light reflective member located within the recess between the inner wall surface and the second resin portion and separated from the light emitting element;
a second light reflective member, at least a portion of which is located between the inner wall surface and the second resin portion, covers the first light reflective member, and is spaced from the light emitting element and the element mounting area; , comprising;
The reflectance of the second light reflective member at the peak wavelength of the light emitting element is higher than the reflectance of the first light reflective member,
The first light reflective member has a first slope that extends from the bottom side of the recess toward the opening of the recess,
The second light reflective member has a second inclined surface extending from the bottom side of the recess toward the opening of the recess,
In a cross-sectional view, the inclination angle formed by the straight line connecting the upper end and the lower end of the second slope and the bottom surface of the recess is the same as the straight line connecting the upper and lower ends of the first slope. , and the bottom surface of the recessed portion . The first light-reflecting member includes a resin and light-reflecting particles,
The second light-reflecting member includes a resin and light-reflecting particles,
The light emitting device according to claim 1 , wherein the concentration of the light reflective particles included in the first light reflective member is lower than the concentration of the light reflective particles included in the second light reflective member. The first resin part has a first outer surface and a second outer surface extending in a first direction, and a third outer surface and a fourth outer surface extending in a second direction perpendicular to the first direction,
the first lead, the third resin part, and the second lead are arranged in line in the second direction;
The minimum width of the first light reflective member in the first direction is smaller than the minimum width of the first light reflective member in the second direction when viewed from above from the top side of the first lead. Item 2. The light-emitting device according to item 1 or 2 . The light emitting device according to claim 3, wherein at least a portion of the minimum width portion of the first light reflective member in the first direction is separated from the second light reflective member. 5. The device according to claim 1, further comprising a wire electrically connecting the light emitting element and the second lead, the wire being covered by the first light reflective member and the second light reflective member. The light emitting device described.

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