JP7181459B2 - light emitting device - Google Patents

Description

The present disclosure relates to light emitting devices.

For example, the light emitting device disclosed in Patent Document 1 includes a resin package having leads and a resin portion, a reflective layer (light reflecting member) provided on the inner wall of a recess of the resin package, and a light reflecting member disposed on the bottom of the recess. and a light emitting element.

JP 2014-158011 A

An object of the present invention is to provide a light-emitting device capable of improving adhesion between a resin package and a light-reflecting member.

A light emitting device according to the present disclosure is a resin package having a plurality of leads including a first lead and a second lead, and a resin body including a first resin portion, a second resin portion, a third resin portion, and a first resin connection portion. The first resin portion constitutes the outer side surface of the resin package, the plurality of leads and the inner wall surface of the first resin portion form a recess, and the first lead and the second lead are formed. The third resin portion is positioned between the recess, part of the upper surface of each of the first lead and the second lead and part of the upper surface of the third resin portion are positioned on the bottom surface of the recess, and a resin package in which a second resin portion is arranged around an element mounting area, and the first resin connection portion connects the first resin portion and the second resin portion; and the resin package is arranged in the element mounting area. light continuously covering at least a portion of the inner wall surface and the bottom surface of the recess located between the second resin portion and the light emitting element, separated from the light emitting element in the recess. a reflective member.

According to the light emitting device of the present disclosure, it is possible to obtain a light emitting device capable of improving the adhesion between the resin package and the light reflecting member.

1 is a schematic top view of a light emitting device according to a first embodiment; FIG. FIG. 2 is a schematic top view of a structure from which a light reflecting member is removed from the light emitting device according to the first embodiment; 1 is a schematic bottom view of a light emitting device according to a first embodiment; FIG. 1 is a schematic front view of a light emitting device according to a first embodiment; FIG. 1 is a schematic side view of a light emitting device according to a first embodiment; FIG. 1B is a schematic cross-sectional view of the light-emitting device taken along line 2A-2A shown in FIG. 1A; FIG. 1B is a schematic cross-sectional view of the light-emitting device taken along line 2B-2B shown in FIG. 1A; FIG. 1B is a schematic cross-sectional view of the light-emitting device taken along line 2C-2C shown in FIG. 1A; FIG. 1B is a schematic cross-sectional view of the light-emitting device taken along line 2D-2D shown in FIG. 1A; FIG. 4A and 4B are schematic top views of the first lead and the second lead of the light emitting device according to the first embodiment; FIG. 4 is a schematic bottom view of the first lead and the second lead of the light emitting device according to the first embodiment; FIG. FIG. 1B is a schematic cross-sectional view of the light-emitting device taken along line 2A-2A shown in FIG. 1A, and is a schematic cross-sectional view showing an example in which a protective layer is provided. FIG. 1B is a schematic cross-sectional view of the light-emitting device taken along line 2A-2A shown in FIG. 1A, and is a schematic cross-sectional view showing another example in which a protective layer is provided. FIG. 1C is a schematic cross-sectional view of the light-emitting device taken along line 2A-2A shown in FIG. 1A, and is a schematic cross-sectional view showing another example of the sealing member. FIG. 1C is a schematic cross-sectional view of the light-emitting device taken along line 2A-2A shown in FIG. 1A, and is a schematic cross-sectional view showing another example of the sealing member. It is a schematic top view of a light emitting device according to a second embodiment. FIG. 5 is a schematic top view of a structure from which a light reflecting member is removed from the light emitting device according to the second embodiment; 6C is a schematic cross-sectional view of the light-emitting device taken along line 6C-6C shown in FIG. 6A; FIG. It is a schematic top view of the modification of the light-emitting device which concerns on 2nd Embodiment. FIG. 11 is a schematic top view of a structure from which a light reflecting member is removed from the modified example of the light emitting device according to the second embodiment; 7C is a schematic cross-sectional view of the light-emitting device taken along line 7C-7C shown in FIG. 7A; FIG. It is a schematic top view of the modification of the light-emitting device which concerns on 2nd Embodiment. FIG. 11 is a schematic top view of a structure from which a light reflecting member is removed from the modified example of the light emitting device according to the second embodiment; 8C is a schematic cross-sectional view of the light-emitting device taken along line 8C-8C shown in FIG. 8A; FIG. It is a schematic top view of a light emitting device according to a third embodiment. FIG. 11 is a schematic top view of a structure from which a light reflecting member is removed from a light emitting device according to a third embodiment; 9C is a schematic cross-sectional view of the light-emitting device taken along line 9C-9C shown in FIG. 9A; FIG. FIG. 11 is a schematic top view of a structure in which a light reflecting member is removed from the modified example of the light emitting device according to the third embodiment; FIG. 11 is a schematic top view of a structure in which a light reflecting member is removed from the modified example of the light emitting device according to the third embodiment; FIG. 11 is a schematic top view of a structure in which a light reflecting member is removed from the modified example of the light emitting device according to the third embodiment; FIG. 11 is a schematic top view of a structure in which a light reflecting member is removed from the modified example of the light emitting device according to the third embodiment; FIG. 11 is a schematic top view of a structure in which a light reflecting member is removed from the modified example of the light emitting device according to the third embodiment;

2. Description of the Related Art There is a light-emitting device in which a light-reflecting member having a light-reflecting surface is formed in the vicinity of a light-emitting element in order to efficiently extract light emitted from the light-emitting element to the outside. In such a light-emitting device, further improvement in bonding strength between the resin package and the light-reflecting member is required. In view of such points, the light emitting device of the present disclosure aims to improve the bonding strength between the resin package and the light reflecting member.

Hereinafter, the light emitting device of the present disclosure will be described in detail with reference to the drawings. The light-emitting device of the present disclosure is an example, and is not limited to the light-emitting device described below. The following description may use terms that indicate specific directions or positions (eg, "upper", "lower" and other terms that include those terms). The terms use the relative orientations and positions in the referenced figures only for the sake of clarity. In addition, the sizes and positional relationships of components shown in the drawings may be exaggerated for the sake of clarity. It may not be reflected.

(First embodiment)
[Light emitting device 101]
A light emitting device 101 that is a first embodiment of the present disclosure will be described based on FIGS. 1A to 5B. In order to show the internal structure, the sealing member 75 is shown as a transparent member in FIG. 1A.

A light emitting device 101 includes a resin package 10 , at least one light emitting element 41 , and a light reflecting member 50 . The light emitting device 101 may have a sealing member 75 . Each component will be described in detail below.

[Resin package 10]
The resin package 10 is a housing and has a recess 11 . A light emitting element 41 and a light reflecting member 50 are arranged in the recess 11 . The resin package 10 includes a resin body 30 and a plurality of leads including first leads 21 and second leads 22 . The resin body 30 is integrally formed with the first lead 21 and the second lead 22 . The first lead 21 has an upper surface 21a and a lower surface 21b opposite to the upper surface 21a, and the second lead 22 has an upper surface 22a and a lower surface 22b opposite to the upper surface 22a. The lower surface 21b of the first lead 21 and the lower surface 22b of the second lead 22 are arranged so as to be positioned substantially on the same plane. A third resin portion 33 of the resin body 30 is positioned between the first lead 21 and the second lead 22 .

Resin package 10 has an upper surface 10a and a lower surface 10b opposite to upper surface 10a. In this embodiment, the resin package 10 has a substantially rectangular outer shape when viewed from above. Therefore, the resin package 10 has an outer surface 10c, an outer surface 10d positioned opposite to the outer surface 10c, an outer surface 10e adjacent to the outer surfaces 10c and 10d, and an outer surface 10e positioned opposite to the outer surface 10e. It has four outer surfaces, the outer surface 10f. In addition, the outer shape of the resin package 10 when viewed from above is not limited to a square, and may have another shape. Further, the resin package 10 may have an anode mark or a cathode mark formed by chamfering one corner of the opening 11a when viewed from above. The anodic or cathodic marks serve as marks to indicate the polarity of the two leads.

The resin package 10 is provided with a concave portion 11 having an opening 11a in the upper surface 10a. A portion of the upper surface 21 a of the first lead 21 and a portion of the upper surface 22 a of the second lead 22 are located on the bottom surface of the recess 11 . The shape of the recess 11 will be described in detail when the resin body 30 is described.

As shown in FIG. 1C , the lower surface 21 b of the first lead 21 and the lower surface 22 b of the second lead 22 are exposed from the resin package 10 on the lower surface 10 b of the resin package 10 .

[First lead 21, second lead 22]
The first lead 21 and the second lead 22 are electrically conductive and function as electrodes for supplying power to the light emitting element 41 and as heat dissipating members having high thermal conductivity. In this embodiment, a first lead 21 and a second lead 22 are provided as the plurality of leads. Also, the light emitting device 101 may have a third lead in addition to the first lead 21 and the second lead 22 . If the plurality of leads includes a first lead 21, a second lead 22 and a third lead, the first lead 21 may be positioned between the second lead 22 and the third lead. In this case, the first lead 21 may function as a heat dissipation member, and the second lead 22 and the third lead may function as electrodes. Note that the light emitting device 101 may have four or more leads.

As shown in FIGS. 3A and 3B, the first lead 21 has, for example, a substantially rectangular shape and side portions 21c, 21d, 21e, and 21f. The side portion 21 d faces the second lead 22 . Moreover, the side portion 21c is located on the side opposite to the side portion 21d. Side portion 21 e and side portion 21 f are positioned opposite to each other and do not face second lead 22 .

As shown in FIG. 3B, the first lead 21 has side edge grooves 21g (indicated by hatching) along the side portions 21d, 21e, and 21f on the lower surface 21b side of the side portions 21d, 21e, and 21f. . The side edge groove portion 21g is recessed from the lower surface 21b of the first lead 21 toward the upper surface 21a. The side edge groove portion 21g can be formed by etching, pressing, or the like.

Extension portions 21h are located near the centers of the side portions 21c, 21e, and 21f of the first lead 21 when viewed from above. The extending portion 21 h is a portion of the first lead 21 . The end surfaces of the extended portions 21h on the side portions 21c, 21e, and 21f are exposed from the resin body 30 on the outer side surfaces 10c, 10e, and 10f of the resin package 10. As shown in FIG. For example, as shown in FIG. 1D, the end surface of the extended portion 21h is exposed from the resin body 30 on the outer surface 10c of the resin package 10. As shown in FIG. Further, as shown in FIG. 1E, the end surface of the extended portion 21h is exposed from the resin body 30 at the outer surface 10f of the resin package 10. As shown in FIG. On the outer side surfaces 10 c , 10 e , and 10 f of the resin package 10 , the end surfaces of the extending portions 21 h of the first leads 21 are substantially flush with the resin body 30 . The extending portion 21h extends from the main body portion of the first lead 21 toward the outer side surfaces 10c, 10e, and 10f of the resin package 10. As shown in FIG. The body portion of the first lead 21 refers to the portion of the first lead 21 excluding the extended portion 21h. As shown in FIGS. 3A and 3B, the outer shape of the main body of the first lead is substantially rectangular.

Side portions 21e and 21f of the first lead 21 are provided with through portions 25m and 25n, respectively. The penetrating portions 25m and 25n are cavities (holes) penetrating from the upper surface 21a to the lower surface 21b of the first lead 21, and have openings (cuts) at the outer edges of the side portions 21e and 21f, respectively. The penetrating portions 25m and 25n can also be said to be notches provided in the side portions 21e and 21f, respectively. However, it is not necessary to form the side portions 21e and 21f by partially notching them. good too. Penetration portions 25m and 25n and side edge groove portion 21g are partially filled with resin body 30 . This improves the adhesion between the resin body 30 and the first lead.

The upper surface 21a of the first lead 21 is provided with a first groove 21j, second grooves 21m and 21n, and a third groove 21p. The first groove 21j is arranged at least partly around the element mounting region when viewed from above. The element placement area is an area in which the light emitting element 41 is arranged. When the light emitting device is one light emitting element, the outer edge of the element mounting region and the outer edge of the light emitting element overlap when viewed from above. When the light-emitting device includes a plurality of light-emitting elements, the element mounting area is an area surrounding the plurality of light-emitting elements when viewed from above. In addition, the first groove 21j being arranged at least partly around the element mounting region when viewed from the top means that the first groove 21j is arranged all around the element mounting region (entire circumference). Alternatively, they may be arranged partly around the element mounting area. A part of the second resin portion 32 of the resin body 30 is filled in the first groove 21j.

The first groove 21j, the second grooves 21m, 21n, and the third groove 21p are provided so as not to overlap with the side edge groove portions 21g provided on the side portions 21d, 21e, and 21f of the first lead 21 when viewed from above. is preferred. Since the first groove 21j provided on the upper surface 21a of the first lead 21 and the side edge groove portion 21g provided on the lower surface 21b side do not overlap each other, portions that are thinner from the upper surface 21a side and the lower surface 21b side of the first lead 21 are provided. Therefore, the strength of the first lead is improved. Similarly, the second grooves 21m and 21n and the third groove 21p of the first lead 21 are provided so as not to overlap with the side edge groove 21g provided on the side portion 21d of the first lead 21 when viewed from above. The strength of the first lead is improved.

The second groove 21m of the first lead 21 connects the through portion 25m, the first groove 21j and the third groove 21p. Similarly, the second groove 21n of the first lead 21 connects the penetrating portion 25n, the first groove 21j and the third groove 21p. The first resin connection portions 35m, 35n of the resin body 30 are arranged in the second grooves 21m, 21n.

The third groove 21 p is connected to the second grooves 21 m and 21 n and partially covered with the first resin portion 31 of the resin body 30 . By partially covering the third groove 21p of the first lead 21 with the first resin portion 31 of the resin body 30, the adhesion between the first lead 21 and the resin body 30 is improved.

As shown in FIG. 3B, the second lead 22 has, for example, a substantially rectangular shape and side portions 22c, 22d, 22e, and 22f. The second lead 22 has side edge grooves 22g (indicated by hatching) along the sides 22c, 22e, 22f of the lower surface 22b. Extension portions 22h are positioned near the respective centers of the side portions 22d, 22e, and 22f of the second lead 22 when viewed from above. The extending portion 22 h is part of the second lead 22 . The end surfaces of the extended portions 22h on the side portions 22d, 22e, and 22f are exposed from the resin body 30 on the outer side surfaces 10d, 10e, and 10f of the resin package 10. As shown in FIG. On the outer side surfaces 10d, 10e, and 10f of the resin package 10, the end surfaces of the extending portions 22h of the second leads 22 are substantially flush with the resin body 30. As shown in FIG. The extending portion 22 h extends from the body portion of the second lead 22 toward the outer side surfaces 10 d, 10 e, and 10 f of the resin package 10 . The body portion of the second lead 22 refers to the portion of the second lead 22 excluding the extended portion 22h. As shown in FIGS. 3A and 3B, the outer shape of the main body of the second lead is substantially rectangular.

In the resin package 10 , the first lead 21 and the second lead 22 are positioned apart, and the side portion 21 d of the first lead 21 faces the side portion 22 c of the second lead 22 .

In this embodiment, the area of the first lead 21 is larger than the area of the second lead 22 when viewed from above. This is because the first lead 21 is provided with an element mounting region for arranging the light emitting element. However, the size relationship between the first lead 21 and the second lead 22 in top view is not limited to this. For example, the second lead 22 without the element mounting area may be made larger than the first lead 21 with the element mounting area. Further, when the element mounting region is provided on the second lead, the area of the second lead 22 may be larger than the area of the first lead 21 in top view. An element mounting region may be provided across the first lead 21 and the second lead. In this case, the areas of the first lead 21 and the area of the second lead 22 may be substantially equal when viewed from above. When the plurality of leads includes a first lead 21, a second lead 22 and a third lead, and the first lead 21 is positioned between the second lead 22 and the third lead, for example, when viewed from above, the The areas of the second lead 22 and the third lead may be substantially equal, and the area of the first lead 21 may be larger than the areas of the second lead 22 and the third lead.

The side edge groove portion 21g and the through portions 25m and 25n provided in the first lead 21 are provided to improve the adhesion between the resin body 30 and the first lead 21. As shown in FIG. Further, the side edge groove portion 22g provided in the second lead 22 is provided to improve the adhesion between the resin body 30 and the second lead 22. As shown in FIG.

The lead frame has a frame, a plurality of connecting portions, and a main body portion serving as a plurality of pairs of first leads 21 and a main body portion serving as second leads 22 connected by the plurality of connecting portions. Then, the resin body 30 is formed integrally with the lead frame, and then separated into individual pieces by cutting at the connecting portion. The extending portions 21h and 22h are parts of connecting portions that connect the main body portion of the portions that become the first lead 21 and the second lead 22 to the frame. Therefore, the extending portions 21h and 22h that were part of the connecting portion are exposed on the outer side surfaces 10c, 10d, 10e, and 10f of the resin package 10 on substantially the same plane as the resin body 30. FIG. After being singulated, the first lead 21 including the main body portion and the extension portion 21h of the first lead 21 is formed. The same applies to the second lead 22, and the second lead 22 including the main body portion and the extension portion 22h of the second lead 22 is formed.

The first lead 21 and the second lead 22 each have a base material and a metal layer covering the base material. The substrate is preferably a plate-like member. Substrates include, for example, metals such as copper, aluminum, gold, silver, iron, nickel, or alloys thereof, phosphor bronze, and copper with iron. These may be single layers or laminated structures (for example, clad materials). In particular, it is preferable to use copper, which is inexpensive and has high heat dissipation, as the base material. Metal layers include, for example, silver, aluminum, nickel, palladium, rhodium, gold, copper, or alloys thereof. Note that the first lead 21 and the second lead 22 may have regions where the metal layer is not provided. Moreover, in the first lead 21 and the second lead 22, the metal layers formed on the upper surfaces 21a and 22a may be different from the metal layers formed on the lower surfaces 21b and 22b. For example, the metal layers formed on the upper surfaces 21a and 22a are metal layers composed of a plurality of layers including a nickel metal layer, and the metal layers formed on the lower surfaces 21b and 22b are metal layers that do not include a nickel metal layer. is.

When a silver or silver alloy plated layer is formed on the outermost surface of the first lead 21 and the second lead 22, a protective layer such as silicon oxide may be provided on the surface of the silver or silver alloy plated layer. preferable. As a result, discoloration of the plated layer of silver or a silver alloy due to sulfur components or the like in the air can be suppressed. The protective layer can be formed by a vacuum process such as sputtering, but other known methods may be used. As shown in FIG. 4A, the protective layer 70 may be formed after the light emitting elements 41 are mounted and connected with wires and before the light reflecting member 50 is formed. Alternatively, as shown in FIG. 4B, the protective layer 70 may be formed after the light-emitting element 41 is mounted and connected by wires to form the light-reflecting member 50 .

As shown in FIG. 1B, the resin body 30 is integrally formed with the first lead 21 and the second lead 22, and constitutes the resin package 10 together with the first lead 21 and the second lead 22. As shown in FIG. The resin body 30 has a first resin portion 31, a second resin portion 32, a third resin portion 33, and first resin connection portions 35m, 35n, and 35p.

The first resin portion 31 has four side surfaces of inner wall surfaces 31 c, 31 d, 31 e, and 31 f, and forms the recess 11 together with the first lead 21 and the second lead 22 . The inner wall surface 31c and the inner wall surface 31d face each other, and the inner wall surface 31e and the inner wall surface 31f face each other.

The first resin portion 31 also forms outer side surfaces 10 c , 10 d , 10 e , and 10 f of the resin package 10 . The outer side surfaces 10c, 10d, 10e and 10f are located opposite the inner wall surfaces 31c, 31d, 31e and 31f, respectively.

As shown in FIG. 1B, adjacent two of the inner wall surfaces 31c, 31d, 31e, and 31f are connected to form a curved surface, and no clear boundary is formed between the inner wall surfaces. The opening 11a of the concave portion 11 has a substantially quadrangular outer shape when viewed from above, and has four rounded corners. The outer edge of the bottom surface 11b of the recess 11 is rounded at four corners to draw an arc with a larger radius than the four corners of the outer edge of the opening 11a when viewed from above.

The second resin portion 32 is positioned on the bottom surface 11b of the recess 11 and arranged around the element mounting region. At least part of the second resin portion 32 is covered with the light reflecting member 50 . This increases the surface area of the light reflecting member 50 covering the second resin portion 32 of the resin package. Therefore, the adhesion between the resin package and the light reflecting member can be improved. As shown in FIGS. 2A and 2B, the second resin portion 32 is arranged in the first groove 21j provided in the upper surface 21a of the first lead 21, and extends from the plane including the upper surface 21a of the first lead 21. and a first portion 32c located above the second portion 32d and above the plane including the upper surface 21a of the first lead 21. As shown in FIG. In the present embodiment, the first portion 32c of the second resin portion 32 has a height h1 and a width w1 from the upper surface 21a of the first lead 21, and has a ring shape that surrounds the element mounting area without discontinuity.

As shown in FIG. 2B, a portion of the first portion 32c of the second resin portion 32 is located on the top surface 21a of the first lead 21, and the other portion is located on the second resin portion 32c in the first groove 21j. It is located on the second portion 32 d of the portion 32 and the remaining portion is located on the upper surface 33 a of the third resin portion 33 . Separation of the resin body 30 from the first lead 21 can be suppressed by the second resin portion 32 on the upper surface 21 a of the first lead 21 . It is preferable that the width w2 of the first groove 21j of the first lead 21 is larger than the width w1 of the first portion 32c of the second resin portion 32 . As a result, the contact area between the second resin portion 32 and the first lead 21 is increased, and the width w1 of the first portion 32c is reduced, so that the flow path when the light reflecting member 50 is provided can be made sufficiently large. can be secured. Further, by reducing the width w1 of the first portion 32c, the light reflecting surface (inclined surface 50s) of the light reflecting member 50 can be easily inclined. As a result, the light emitted from the light emitting element 41 can be efficiently extracted upward.

The height h1 of the first portion 32c is preferably lower than the height h2 of the light emitting element 41. Accordingly, the light emitted from the light emitting element 41 can be easily incident on the inclined surface 50s of the light reflecting member 50, and the light from the light emitting element can be efficiently emitted to the outside. The height of the first portion is the distance of the first portion that is the farthest in the Z direction with respect to the bottom surface 11b of the concave portion 11 of the resin package 10 . Further, the height of the light emitting element is the distance of the farthest part of the light emitting element in the Z direction with the bottom surface 11b of the concave portion 11 of the resin package 10 as a reference.

As shown in FIGS. 2C and 2D, the first resin connection portions 35m and 35n are portions of the resin body 30 located between the second resin portion 32 and the first resin portion 31, The resin portion 32 and the first resin portion 31 are connected. In the present embodiment, the first resin connection portions 35m, 35n are positioned inside the second grooves 21m, 21n of the first lead 21 . One ends of the first resin connection portions 35m and 35n are connected to the second portion 32d of the second resin portion 32. As shown in FIG. The other ends of the first resin connection portions 35m and 35n are in contact with the inner wall surfaces 31e and 31f of the first resin portion 31, respectively, and are positioned closer to the first lead 21 than the lower ends of the inner wall surfaces 31e and 31f of the first resin portion 31. It is connected to the portion of the first resin portion 31 located on the lower surface 21b side.

The upper surface of the first resin connection portion and the first lead may be positioned at substantially the same height, and as shown in FIG. A portion 35p may be provided. In addition, since a part of the first resin connection portion 35p covers the upper surface 21a of the first lead 21, the adhesion between the resin body 30 and the first lead is improved.

The third resin portion 33 is a portion of the resin body 30 located between the first lead 21 and the second lead 22 . The third resin portion 33 has an upper surface 33 a and a lower surface 33 b , and the upper surface 33 a is located on the bottom surface 11 b of the recess 11 . The upper surface 33a of the third resin portion 33 is located at substantially the same height as the upper surface 21a of the first lead 21 and the upper surface 22a of the second lead 22. As shown in FIG. The lower surface 33 b of the third resin portion 33 is positioned on the lower surface 10 b of the resin package 10 . The third resin portion 33 connects the wall portion having the inner wall surface 31e and the wall portion having the inner wall surface 31f of the first resin portion 31 . For example, if the resin package has a third lead, the third resin portion 33 is also arranged between the first lead 21 and the second lead 22 and between the second lead 22 and the third lead.

A portion of the first portion 32c of the second resin portion 32 is located on the upper surface 33a of the third resin portion 33. As shown in FIG. Since the second resin portion 32 and the third resin portion 33 have this positional relationship, when the uncured resin material that becomes the resin body 30 is flowed into the mold by a molding method, , the resin material can be introduced from the space forming the third resin portion 33 to the space forming the second resin portion 32 .

At the bottom surface 11b of the recess 11, the second portion 32d of the second resin portion 32 and the first resin portion 31 are connected by first resin connection portions 35m and 35n. A portion of the first portion 32 c of the second resin portion 32 is located on the upper surface 33 a of the third resin portion 33 and connected to the third resin portion 33 . Therefore, it is possible to prevent the resin body 30 from peeling off from the first lead 21 . Further, since the second portion 32d and the first resin connection portions 35m and 35n of the second resin portion 32 are formed in the first groove 21j and the second grooves 21m and 21n of the first lead 21, the first lead 21 The contact area with is increased and the adhesion is improved.

The resin body 30 can use a thermosetting resin, a thermoplastic resin, or the like as a resin material serving as a base material. Specifically, epoxy resin compositions, silicone resin compositions, modified epoxy resin compositions such as silicone-modified epoxy resins, modified silicone resin compositions such as epoxy-modified silicone resins, unsaturated polyester resins, saturated polyester resins, and polyimide resins. Compositions, cured products such as modified polyimide resin compositions, resins such as polyphthalamide (PPA), polycarbonate resin, polyphenylene sulfide (PPS), liquid crystal polymer (LCP), ABS resin, phenol resin, acrylic resin, PBT resin, etc. can be used. In particular, it is preferable to use a thermosetting resin such as an epoxy resin composition or a modified silicone resin composition. As described above, the first resin portion 31, the second resin portion 32, the third resin portion 33, and the first resin connection portions 35m, 35n, and 35p are integrally connected, and therefore can be made of the same resin material. The resin body 30 preferably has a viscosity of 10 pa·s to 40 pa·s, more preferably 15 pa·s to 25 pa·s in an uncured state. As a result, the first resin portion 31, the second resin portion 32, the third resin portion 33, and the first resin connection portions 35m, 35n, and 35p can be formed with good fluidity even by a molding method using a mold. can.

Moreover, in order to improve the contrast of the light-emitting device, the resin body 30 may have a low light reflectance with respect to external light (sunlight in many cases) of the light-emitting device. In this case, it is usually preferred that the color is black or a color close thereto. As a filler at this time, carbon such as acetylene black, activated carbon and graphite, transition metal oxides such as iron oxide, manganese dioxide, cobalt oxide and molybdenum oxide, or colored organic pigments can be used depending on the purpose. can.

[Light emitting element 41]
A semiconductor light emitting element such as a light emitting diode element can be used for the light emitting element 41 . Although the light-emitting device 101 includes one light-emitting element in this embodiment, it may include two or more light-emitting elements. The light emitting element 41 preferably contains a nitride semiconductor (InxAlyGa1-xyN, 0≤x, 0≤y, x+y≤1) capable of emitting light in the ultraviolet to visible range. For example, the light emitting elements 41 may emit blue light and green light, respectively. When the light-emitting device includes three light-emitting elements, the three light-emitting elements may emit blue light, green light, and red light, respectively. A plurality of light emitting elements may be connected in series or in parallel. Also, a plurality of light emitting elements may be electrically connected by combining series connection and parallel connection.

The light emitting element 41 is positioned in the element mounting region of the first lead 21 and is joined to the first lead 21 by a joining member. As the joining member, for example, a resin including the resin material exemplified for the resin body 30, tin-bismuth-based, tin-copper-based, tin-silver-based, gold-tin-based solder, and conductive materials such as silver, gold, and palladium are used. A conductive paste, a bump, an anisotropic conductive material, a brazing material such as a low melting point metal, or the like can be used. In this embodiment, the light emitting element 41, the first lead 21 and the second lead 22 are electrically connected by wires 43a and 43b.

[Light reflective member 50]
The light reflecting member 50 reflects the light emitted from the light emitting element 41 toward the opening 11a. In the recess 11, the light-reflecting member 50 is separated from the light emitting element 41, and at least one of the inner wall surface of the first resin portion 31 and the bottom surface 11b of the recess 11 positioned between the second resin portion 32 and the light emitting element 41 is provided. Cover the part continuously. Since the light-reflecting member 50 is separated from the light-emitting element 41 , it is possible to suppress the light from the light-emitting element 41 from being reflected by the light-reflecting member and being absorbed by the light-emitting element 41 . By covering at least part of the bottom surface 11 b of the recess 11 located between the light emitting elements with the light reflecting member 50 , the light reflecting member 50 can be provided even in the vicinity of the light emitting elements 41 . This improves the light extraction efficiency of the light emitting device. Further, the light reflecting member 50 continuously covers the inner wall surface and at least a part of the bottom surface 11b of the recess 11 located between the second resin portion 32 and the light emitting element 41, so that the light reflecting member 50 is made of resin. The surface area covering the package can be increased. This improves the adhesion between the resin package and the light reflecting member.

The light reflecting member 50 has an inclined surface 50s extending from the bottom surface 11b side of the recess 11 to the opening 11a. The light-reflecting member 50 can reflect the light emitted from the light-emitting element 41 toward the opening 11a, and can improve the external extraction efficiency of the light-emitting device 101. FIG. The inclined surface of the light reflecting member 50 may have a flat surface, a concave curved surface, or a convex curved surface. In other words, in a cross-sectional view, the inclined surface of the light reflecting member 50 may have a straight line, a concave curve, or a convex curve. As shown in FIG. 2A , in a cross-sectional view, the inclined surface 50s of the light reflecting member 50 is preferably a concave curve that is concave toward the bottom surface 11b of the concave portion 11 . By doing so, it is possible to suppress the light from the light emitting element 41 from being reflected by the light reflecting member and being absorbed by the light emitting element 41 .

When viewed from above, the end portion 50a of the light reflecting member 50 tends to be parallel to the upper end portion of the first portion 32c of the second resin portion 32 . This is because the uncured light reflective member 50 is pulled by the first portion 32c of the second resin portion 32 due to surface tension. For example, as shown in FIG. 1A, when the first portion 32c of the second resin portion 32 has a straight portion 32f longer than half of the side 41a of the light emitting element 41 in top view, the straight portion The end portion 50a of the light reflecting member 50 covering 32f tends to be parallel to the straight portion 32f. The linear portion 32f is positioned at the upper end portion of the first portion 32c of the second resin portion 32. As shown in FIG. Therefore, it is preferable that the straight portion 32f of the second resin portion 32 and the side 41a of the light emitting element 41 are parallel. By doing so, the end portion 50 a of the light reflecting member 50 can be easily made parallel to the side 41 a of the light emitting element 41 , so that the light reflecting member 50 can be easily formed near the light emitting element 41 .

The light reflecting member 50 may cover the entire first portion 32c of the second resin portion 32, and as shown in FIG. It may be exposed from the elastic member 50 . It is preferable that the first portion 32 c of the second resin portion 32 closest to the light emitting element 41 is exposed from the light reflecting member 50 when viewed from above. When the light reflecting member 50 covers the entire first portion 32c of the second resin portion 32 at the location where the distance from the light emitting element 41 to the first portion 32c of the second resin portion 32 is the shortest in top view, the light is reflected. This makes it easier for the optical member and the light emitting element to come into contact with each other. Therefore, by exposing the first portion 32c of the second resin portion 32 closest to the light emitting element 41 from the light reflecting member 50 in top view, the light reflecting member 50 and the light emitting element 41 are brought into contact with each other. can be suppressed.

The inclination angle formed by the straight line connecting the upper and lower ends of the inclined surface 50s formed by the light reflecting member 50 and the bottom surface 11b of the recess 11 is the upper end of the inclined surface of the inner wall surface of the resin package 10. and the bottom end of the recess 11 and the bottom surface 11 b of the recess 11 . This is because the light reflective member 50 can be formed even in the vicinity of the light emitting element, so that the light emitted from the light emitting element 41 can be efficiently reflected toward the opening 11a. The inclination angle formed by the straight line connecting the upper end and the lower end of the inclined surface 50s formed by the light reflecting member 50 and the bottom surface 11b of the concave portion 11 is not particularly limited, but is 10° or more and 70° or less. , and more preferably 20° or more and 60° or less. By doing so, it becomes easier to reflect the light emitted from the light emitting element 41 toward the opening 11a.

The light-reflecting member 50 is preferably a member that hardly transmits or absorbs light from the light-emitting element or external light. Preferably, the light reflecting member 50 has a white color. For example, a thermosetting resin, a thermoplastic resin, or the like can be used as the base resin of the light reflecting member 50. More specifically, phenol resin, epoxy resin, BT resin, PPA, silicone resin, or the like can be used. can be used. Reflective materials (e.g., titanium oxide, zinc oxide, silicon oxide, zirconium oxide, aluminum oxide, aluminum nitride, etc.) that do not easily absorb light from the light-emitting element and have a large difference in refractive index with respect to the base resin are added to these base resins. Light can be efficiently reflected by dispersing light scattering particles such as aluminum). The viscosity of the light reflecting member 50 in an uncured state is preferably lower than the viscosity of the resin body 30 in an uncured state. For example, the uncured viscosity of the light reflecting member 50 is preferably 1 pa·s to 20 pa·s, more preferably 5 pa·s to 15 pa·s. This makes it easier for the light reflecting member 50 to wet and spread in the concave portion 11 . It is preferable that the light reflecting member 50 has high thixotropy in an uncured state.

The light reflecting member 50 preferably has a higher light reflectance than the resin body 30 . For example, the content of the light reflective substance (eg, titanium oxide) contained in the light reflective member 50 is greater than the content of the light reflective substance contained in the resin body 30 . Specifically, the content of the light-reflecting substance contained in the light-reflecting member 50 is preferably 1.5 times or more the content of the light-reflecting substance contained in the resin body 30. It is more preferably 2.5 times or more, further preferably 2.5 times or more. For example, the light reflecting member 50 contains 40% by weight of titanium oxide in the total weight of the uncured resin material, and the resin body 30 contains titanium oxide in the total weight of the uncured resin material. It contains 15 to 20% by weight.

[Protection element 60]
The light-emitting device 101 may include a protective element 60 to improve electrostatic withstand voltage. As the protective element 60, various protective elements mounted on general light-emitting devices can be used. For example, a Zener diode can be used as the protection element 60 . In the light-emitting device, the protective element and the light-emitting element are connected in parallel.

As shown in FIG. 1B, the protective element 60 may be provided on the upper surface 22a of the second lead 22. As shown in FIG. The protective element 60 is preferably embedded within the light reflecting member 50 . Thereby, it is possible to prevent the light from the light emitting element 41 from being absorbed by the protective element 60 .

One of the two terminals of the protective element 60 is electrically connected to the upper surface 22a of the second lead 22 by a joining member. Examples of bonding materials include tin-bismuth-based, tin-copper-based, tin-silver-based, and gold-tin-based solders, conductive pastes such as silver, gold, and palladium, bumps, anisotropic conductive materials, and low melting points. A brazing material such as metal can be used. The other terminal of the protective element 60 is connected to the upper surface 21a of the first lead 21 by a wire 61, for example.

[Sealing member 75]
The light emitting device 101 may have a sealing member 75 . The sealing member 75 is located in the recess formed by the inclined surface 50 s of the light reflecting member 50 inside the recess 11 and covers the light emitting element 41 located at the bottom of the recess 11 . The sealing member 75 can protect the light emitting element 41 from external force, dust, moisture, and the like.

The sealing member 75 preferably transmits 60% or more, more preferably 90% or more, of the light emitted from the light emitting element 41 . As the material of the sealing member 75, the resin material used in the resin body 30 can be used, and as the base resin, a thermosetting resin, a thermoplastic resin, or the like can be used. , an acrylic resin, or a resin containing one or more of these can be used. Although the sealing member 75 can be formed from a single layer, it can also be constructed from multiple layers. Further, light scattering particles such as titanium oxide, silicon oxide, zirconium oxide, and aluminum oxide may be dispersed in the sealing member 75 .

The sealing member 75 may contain a material (phosphor or the like) that converts the wavelength of light from the light emitting element 41 . Specific examples of phosphors include cerium-activated yttrium-aluminum garnet, cerium-activated lutetium-aluminum garnet, europium- and/or chromium-activated nitrogen-containing calcium aluminosilicate (one of calcium part can be replaced with strontium), europium-activated sialon, europium-activated silicate, europium-activated strontium aluminate, and manganese-activated potassium fluorosilicate.

It is preferable that the content of the light scattering particles and/or the phosphor is, for example, about 10 to 100% by weight with respect to the total weight of the sealing member 75 .

The sealing member 75 may have multiple sealing portions. For example, as shown in FIG. 5A, the sealing member 75 may have a first sealing portion 75a and a second sealing portion 75b. The first sealing portion 75 a covers the upper surface and side surfaces of the light emitting element 41 . The second sealing portion 75b is arranged on the first sealing portion 75a. In such a sealing member 75, for example, the first sealing portion 75a contains a phosphor that emits long-wave light, and the second sealing portion 75b contains a phosphor that emits short-wave light. Absorption of light between bodies can be suppressed. For example, the first sealing portion 75a contains a red phosphor, and the second sealing portion 75b contains a yellow phosphor, a green phosphor, and/or a blue phosphor.

As shown in FIG. 5B, the sealing member 75 may have a first sealing portion 75a and a second sealing portion 75b. The first sealing portion 75 a covers only the upper surface of the light emitting element 41 and does not cover the side surfaces of the light emitting element 41 . The second sealing portion 75 b is arranged on the first sealing portion 75 a and covers the upper surface of the first sealing portion 75 a and the side surface of the light emitting element 41 . In such a sealing member 75, for example, the first sealing portion 75a contains a phosphor that emits long-wave light, and the second sealing portion 75b contains a phosphor that emits short-wave light. By arranging a phosphor emitting long-wave light on the upper surface (light-emitting surface) side of the light-emitting element 41 with high light intensity, most of the light emitted from the light-emitting element 41 can be effectively converted to a phosphor emitting long-wave light. can be absorbed. As a result, light absorption between the phosphors contained in the first sealing portion 75a and the phosphor contained in the second sealing portion 75b can be suppressed. For example, the first sealing portion 75a contains a red phosphor, and the second sealing portion 75b contains a yellow phosphor, a green phosphor, and/or a blue phosphor.

(Second embodiment)
Light-emitting devices 102, 103, and 104, which are the second embodiment of the present disclosure, will be described based on FIGS. 6A to 8C. The light-emitting devices 102, 103, and 104 according to the second embodiment of the present disclosure are different from the light-emitting device 101 according to the first embodiment in that the fourth groove 21k is provided between the second resin portion and the light-emitting element. differ. Other than that, the configuration is similar to that of the light emitting device 101 according to the first embodiment.

As shown in FIG. 6B, the light emitting device 102 is provided with a fourth groove 21k between the second resin portion 32 and the light emitting element 41. As shown in FIG. Thereby, as shown in FIGS. 6A and 6C, the light reflecting member can be easily blocked by the fourth groove 21k. Therefore, contact between the light reflecting member 50 and the light emitting element 41 can be suppressed. Since the light-reflecting member 50 is separated from the light-emitting element 41 , it is possible to suppress the light from the light-emitting element 41 from being reflected by the light-reflecting member and being absorbed by the light-emitting element 41 .

When the light emitting element 41 is arranged on the upper surface 21a of the first lead 21, it is preferable that the upper surface of the upper surface 21a of the first lead 21 is provided with the fourth groove 21k. By doing so, the light reflecting member 50 can be provided even in the vicinity of the light emitting element 41 . This improves the light extraction efficiency of the light emitting device.

As shown in FIG. 7B, one fourth groove 21k may be provided near each side of the light emitting element, and as shown in FIG. 6B, a plurality of fourth grooves 21k may be provided near each side of the light emitting element. may be provided. Even when one fourth groove 21k is provided near each side of the light emitting element, the light reflecting member can be easily blocked by the fourth groove 21k as shown in FIGS. 7A and 7C. When a plurality of fourth grooves 21k are provided in the vicinity of each side of the light emitting element, the light reflective member is arranged in a higher position than in the case of providing one fourth groove 21k in the vicinity of each side of the light emitting element. The four grooves 21k facilitate damming.

As shown in FIGS. 6B and 7B, one side of the light emitting element may be parallel to the fourth groove 21k located near the one side of the light emitting element. , may be perpendicular to the fourth groove 21k located near one side of the light emitting element. When one side of the light emitting element is parallel to the fourth groove 21k located near the one side of the light emitting element, the light reflecting member is easily blocked by the fourth groove 21k. When one side of the light emitting element is perpendicular to the fourth groove 21k located near the one side of the light emitting element, as shown in FIGS. 8A and 8C, the light reflecting member is easily blocked by the third groove 21k. Become. Further, when one side of the light emitting element is perpendicular to the fourth groove 21k located near the one side of the light emitting element, the light reflecting member is formed in the fourth groove 21k. can be easily formed in the vicinity of the light emitting element.

(Third embodiment)
A light emitting device 105, which is a third embodiment of the present disclosure, will be described based on FIGS. 9A to 10E. A light emitting device 105 according to the third embodiment of the present disclosure differs from the light emitting device 101 according to the first embodiment in that a resin frame 80 is provided between the first portion of the second resin portion and the light emitting element. do. Other than that, the configuration is similar to that of the light emitting device 101 according to the first embodiment.

As shown in FIG. 9B, the light emitting device 105 is provided with a resin frame 80 (indicated by hatching) between the first portion 32c of the second resin portion 32 and the light emitting element 41. As shown in FIG. Thereby, the light reflecting member 50 can be blocked by the resin frame 80 as shown in FIGS. 9A and 9C. Therefore, contact between the light reflecting member 50 and the light emitting element 41 can be suppressed. Since the light-reflecting member 50 is separated from the light-emitting element 41 , it is possible to suppress the light from the light-emitting element 41 from being reflected by the light-reflecting member and being absorbed by the light-emitting element 41 .

When the light emitting element 41 is arranged on the upper surface 21 a of the first lead 21 , it is preferable that the resin frame 80 is provided on the upper surface of the upper surface 21 a of the first lead 21 . By doing so, the light reflecting member 50 can be easily provided in the vicinity of the light emitting element 41, so that the light extraction efficiency of the light emitting device can be easily improved.

Although the height of the resin frame 50 in the Z direction is not particularly limited, it is preferably higher than the first portion of the second resin portion. By doing so, it becomes easier to block the light reflecting member 50 . Also, the height of the resin frame 50 in the Z direction is preferably lower than the upper surface of the light emitting element. Accordingly, the light emitted from the light emitting element 41 can be easily incident on the inclined surface 50s of the light reflecting member 50, and the light from the light emitting element can be efficiently emitted to the outside.

As shown in FIG. 9B, the resin frame 80 may be parallel to one side of the light emitting element 41, and as shown in FIGS. 10A and 10B, the resin frame 80 may not be parallel to one side of the light emitting element. Since the resin frame 80 is parallel to one side of the light emitting element, it becomes easier to form the resin frame 80 near the light emitting element 41 . This makes it easier to improve the light extraction efficiency of the light emitting device.

As shown in FIG. 9B, the resin frame 80 may be in contact with the first portion 32c of the second resin portion 32, and as shown in FIGS. It may be spaced apart from the portion 32c. Since the resin frame 80 is in contact with the first portion 32 c of the second resin portion 32 , the light reflecting member 50 is easily blocked by the resin frame 80 . When the resin frame 80 is separated from the first portion 32c of the second resin portion 32, the resin frame is not positioned above the first portion 32c of the second resin portion 32, so the light emitting device can be made thinner in the Z direction. easier.

As shown in FIG. 10C, the resin frame 80 may cover the inner and outer edges of the first portion 32c of the second resin portion 32. As shown in FIG. By covering the inner and outer edges of the first portion 32c of the second resin portion 32 with the resin frame 80, the surface area of the resin package covered by the resin frame 80 can be increased. This improves the adhesion between the resin package and the resin frame.

As shown in FIG. 10D, the resin frame 80 may be bent in a direction away from the wire 43b. By doing so, contact between the resin frame 80 and the wire 43b can be suppressed. By separating the resin frame 80 and the wire 43b, deformation of the wire by the resin frame 80 can be suppressed. The resin frame 80 can be formed using, for example, a dispensing nozzle. Specifically, the uncured resin frame material is moved while being discharged from the dispensing nozzle in liquid or paste form, and after the uncured resin frame material is placed, the resin frame material is cured by heating or the like. Thus, a resin frame can be formed. Since the resin frame is bent in the direction away from the wire, contact between the wire and the dispensing nozzle can be suppressed, so deformation of the wire can be suppressed. Incidentally, the resin frame and the wire may be in contact with each other.

A resin frame 80 may surround the light emitting element 41 as shown in FIG. 10E. By doing so, it becomes easier for the resin frame 80 to block the light reflecting member.

The light-emitting device according to one embodiment of the present invention includes various types of lighting fixtures, backlight devices for liquid crystal displays, large displays, various display devices for advertisements and destination information, projector devices, digital video cameras, facsimiles, and copiers. , an image reading device such as a scanner.

resin package 10
upper surface 10a
Lower surface 10b
Outer surfaces 10c, 10d, 10e, 10f
recess 11
Bottom surface 11b
Opening 11a
Resin body 30
First resin portion 31
Inner wall surfaces 31c, 31d, 31e, 31f
Second resin portion 32
First portion 32c, second portion 32d
Third resin portion 33
Upper surface 33a
First resin connection portions 35m, 35n, 35p
first lead 21
Upper surface 21a
First groove 21j, second grooves 21m, 21n, third groove 21p, fourth groove 21q
Lower surface 21b
Sides 21c, 21d, 21e, 21f
Through parts 25m, 25n
Second lead 22
Upper surface 22a
Lower surface 22b
Sides 22c, 22d, 22e, 22f
Extended portion 22h
light emitting element 41
Light reflecting member 50
Inclined surface 50s
protective element 60
Sealing member 75
First sealing portion 75a, second sealing portion 75b

Claims (4)

A resin package having a plurality of leads including a first lead and a second lead, and a resin body including a first resin portion, a second resin portion, a third resin portion and a first resin connection portion, wherein the first The resin portion constitutes the outer surface of the resin package, the plurality of leads and the inner wall surface of the first resin portion form a concave portion, and the third resin portion is formed between the first lead and the second lead. a portion of the top surface of each of the first lead and the second lead and a portion of the top surface of the third resin portion are located on the bottom surface of the recess; a resin package arranged around the placement area, the first resin connecting portion connecting the first resin portion and the second resin portion;
a light emitting element arranged in the element mounting region;
a light reflective member that continuously covers at least a portion of a bottom surface of the recess located between the inner wall surface and the second resin portion and the light emitting element, separated from the light emitting element in the recess;
with
the second resin portion has a first portion positioned above a plane including the upper surface of the first lead;
The light reflecting member is a light emitting device covering at least part of the first portion . When viewed from above, the first portion has a linear portion longer than half of one side of the light emitting element,
2. The light emitting device according to claim 1, wherein the end of said light reflecting member covering said straight portion is parallel to said straight portion. 3. The light emitting device according to claim 1, wherein a portion of said first portion is exposed from said light reflecting member. 4. The light emitting device according to claim 1, further comprising a groove between said second resin portion and said light emitting element.

Images