JP7436828B2 - light emitting device - Google Patents

Description

The present disclosure relates to a light emitting device.

BACKGROUND ART Light emitting devices using light emitting elements such as LEDs can easily achieve high luminous efficiency and are therefore used in many devices including backlights for displays and other lighting equipment. Patent Document 1 discloses a light emitting device including a resin package having a pair of positive and negative leads and a recess, and a light emitting element placed on the bottom surface of the recess of the resin package.

Japanese Patent Application Publication No. 2013-125776

Since light emitting devices using light emitting elements such as LEDs are used for various purposes, there is a demand for improved mechanical strength. Therefore, an object of the embodiments of the present invention is to provide a light emitting device whose intensity can be improved.

The light emitting device of the present disclosure includes leads including a first lead and a second lead, and a resin part holding the leads, and a part of the first lead, the second lead, and the resin part is attached to a bottom surface. and a rectangular resin package having a recessed part with a part of the resin part as a side wall, a light emitting element disposed on the first lead at the bottom of the recessed part, and electrically connecting the light emitting element and the second lead. and a connecting wire, in top view, the side wall has a first long side wall and a second long side wall that extend in a first direction and face each other, and a second long side wall that extends in a second direction orthogonal to the first direction and face each other. a first short side wall and a second short side wall, and the resin part includes a holding resin part located between the first lead and the second lead on the bottom surface of the recess; a covering resin portion that covers a portion of the upper surface of at least one of the first lead and the second lead, a portion of the upper surface of the holding resin portion is exposed from the covering resin portion, and a portion of the upper surface of the holding resin portion is exposed from the covering resin portion. The exposed upper surface of the holding resin portion is located on the same plane as the upper surfaces of the first lead and the second lead.

According to the light emitting device of the present disclosure, it is possible to provide a light emitting device whose intensity can be improved.

FIG. 1A is a schematic top view of a light emitting device according to Embodiment 1. FIG. 1B is a schematic cross-sectional view taken along line 1B-1B in FIG. 1A. FIG. 1B is a schematic cross-sectional view taken along line 1C-1C in FIG. 1A. FIG. 1B is a schematic cross-sectional view taken along line 1D-1D in FIG. 1A. FIG. 2 is a schematic right side view of the light emitting device according to the first embodiment. FIG. 3 is a schematic bottom view of the light emitting device according to the first embodiment. FIG. 4A is a schematic top view of Modification 1 of the light emitting device according to Embodiment 1. FIG. 4B is a schematic cross-sectional view taken along line 4B-4B in FIG. 4A. FIG. 4C is a schematic cross-sectional view taken along line 4C-4C in FIG. 4A. FIG. 4D is a schematic cross-sectional view taken along line 4D-4D in FIG. 4A. FIG. 5 is a schematic top view of the resin package of Modification 1. FIG. 6A is a schematic top view of a resin package of Modification 2. FIG. FIG. 6B is a schematic cross-sectional view taken along line 6B-6B in FIG. 6A. FIG. 7A is a schematic top view of a resin package of Modification 3. FIG. 7B is a schematic cross-sectional view taken along line 7B-7B in FIG. 7A. FIG. 8A is a schematic top view of a light emitting device according to Embodiment 2. FIG. 8B is a schematic cross-sectional view taken along line 8B-8B in FIG. 8A. FIG. 9A is a schematic top view of a fourth modification of the light emitting device according to the second embodiment. FIG. 9B is a schematic cross-sectional view taken along line 9B-9B in FIG. 9A. FIG. 10A is a schematic top view of a fifth modification of the light emitting device according to the second embodiment. FIG. 10B is a schematic cross-sectional view taken along line 100B-100B in FIG. 10A. FIG. 11A is a schematic top view of a sixth modification of the light emitting device according to the second embodiment. FIG. 11B is a schematic cross-sectional view taken along line 110B-110B in FIG. 11A. FIG. 11C is a schematic cross-sectional view taken along line 110C-11CB in FIG. 11A. FIG. 11D is a schematic cross-sectional view taken along line 110D-110D in FIG. 11A. FIG. 11E is a schematic cross-sectional view of Modification Example 7 of the light emitting device according to Embodiment 2. FIG. 11F is a schematic cross-sectional view of Modification 8 of the light emitting device according to Embodiment 2. FIG. 12 is a schematic cross-sectional view of a ninth modification of the light emitting device according to the second embodiment. FIG. 13 is a schematic cross-sectional view of a tenth modification of the light emitting device according to the second embodiment. FIG. 14 is a schematic top view of the light emitting device according to Embodiment 2, with the covering member, the first reflecting member, and the second reflecting member removed.

Hereinafter, the light emitting device of the present disclosure will be described in detail with reference to the drawings. The light emitting device of the present disclosure is an example, and is not limited to the light emitting device described below. In the following description, terms indicating specific directions or positions (eg, "above", "below", and other terms including these terms) may be used. These terms are used only for ease of understanding and relative orientation and position in the referenced drawings. In addition, the sizes and positional relationships of the components shown in the drawings may be exaggerated for the sake of clarity, and may differ from the actual size of the light emitting device or the size relationship between the components of the actual light emitting device. It may not be reflected.

<Embodiment 1>
A light emitting device 1000 according to Embodiment 1 of the present invention will be described based on FIGS. 1A to 7B. In order to show the internal structure, the covering member 70 is shown as a transparent member in FIGS. 1A and 4A.

The light emitting device 1000 includes a resin package 10 and a light emitting element 50. The resin package 10 includes leads 20 and a resin portion 30. The lead 20 includes a first lead 21 and a second lead 22. When viewed from above, the resin package 10 has a rectangular shape. The resin package 10 has a recess 40 in which the first lead 21, the second lead 22, and a portion of the resin portion 30 serve as a bottom surface 41, and a portion of the resin portion serves as a side wall 42. In a top view, the side wall 42 includes a first long side wall 42A and a second long side wall 42B that extend in a first direction and face each other, and a first short side wall 42C and a second long side wall that extend in a second direction orthogonal to the first direction and face each other. 2 short side walls 42D. The first long side wall 42A includes a first portion 42A1 disposed on the first lead 21, and a second portion 42A2 disposed on the first lead and the second lead. In the second direction, the width w2 at the lower end 42K2 of the second portion 42A2 is larger than the width w1 at the lower end 42K1 of the first portion 42A1. In the bottom surface 41 of the recess 40, the lower end 42K1 of the first portion 42A1 and the lower end 42K2 of the second portion 42A2 extend in the first direction. The light emitting element 50 is placed on the first lead 21 on the bottom surface 41 of the recess 40 . The resin portion located between the first lead and the second lead on the bottom surface of the recess may be referred to as a bottom resin portion 41J. The number of light emitting elements is not particularly limited and may be one or more. Note that in this specification, extending in the first direction means that a variation within ±3° is allowed. Further, in this specification, orthogonal means that a variation within 90±3° is allowed. In this specification, parallel means that variations within ±3° are allowed. Further, in FIG. 1A, the first direction is the X-axis direction, and the second direction is the Y-axis direction.

The second long side wall 42B preferably includes a third portion 42B1 disposed on the first lead 21 and a fourth portion 42B2 disposed on the first lead and the second lead. In the second direction, the width w4 at the lower end of the fourth portion 42B2 is preferably larger than the width w3 at the lower end of the third portion 42B1. In the bottom surface 41 of the recess 40, the lower end 42K3 of the third portion 42B1 and the lower end 42K4 of the fourth portion 42B2 extend in the first direction.

Although the first portion 42A1 will be described below, the third portion 42B1 may also have a similar shape. Furthermore, although the second portion 42A2 will be described below, the fourth portion 42B2 may also have a similar shape. That is, the first long side wall and the second long side wall may be line symmetrical with respect to a line connecting the center of the first short side wall and the center of the second short side wall when viewed from above.

The expression that the lower end 42K1 of the first portion 42A1 extends in the first direction means that on the bottom surface 41 of the recess 40, at least a portion of the lower end 42K1 of the first portion is parallel to the first direction. The portion extending in the first direction at the lower end 42K1 of the first portion is a portion parallel to the first direction, and may be referred to as the first extended lower end 42S1. Similarly, the expression that the lower end 42K2 of the second portion 42A2 extends in the first direction means that at least a portion of the lower end 42K2 of the second portion 42A2 is parallel to the first direction on the bottom surface 41 of the recess 40. do. The portion extending in the first direction at the lower end 42K2 of the second portion is a portion parallel to the first direction, and may be referred to as a second extended lower end 42S2. In the second direction, the width w1 at the lower end 42K1 of the first part means the distance from the first extended lower end 42S1 to the outer surface of the first part. Similarly, in the second direction, the width w2 at the lower end 42K2 of the second part means the distance from the second extended lower end 42S2 to the outer surface of the second part.

The lower end 42K1 of the first portion 42A1 means the edge of the inner surface of the first portion 42A1 located on the bottom surface 41 of the recess 40, as shown in FIG. 1B. The lower end 42K2 of the second portion 42A2 means the edge of the inner surface of the second portion 42A2 located on the bottom surface 41 of the recess 40, as shown in FIG. 1C.

The first long side wall 42A extending in the first direction means that at least a portion of the outer surface of the first long side wall 42A is parallel to the first direction. The second long side wall 42B extending in the first direction means that at least a portion of the outer surface of the second long side wall 42B is parallel to the first direction. The first short side wall 42C extending in the second direction means that at least a portion of the outer surface of the first short side wall 42C is parallel to the second direction. The second short side wall 42D extending in the second direction means that at least a portion of the outer surface of the second short side wall 42D is parallel to the second direction.

The width w2 at the lower end of the second part disposed on the first lead and the second lead is larger than the width w1 at the lower end 42K1 of the first part 42A1, so that the second part 42A2 covers the first lead and the second lead. can be made larger. This improves the strength of the second portion, making it possible to provide a light emitting device with high strength. For example, by improving the strength of the second part that covers the first lead and the second lead, it is possible to suppress the occurrence of cracks in the bottom resin part 41J. Further, since the width w1 at the lower end of the first portion disposed on the first lead on which the light emitting element is disposed is small, the area of the first lead 21 exposed from the resin portion can be increased. Thereby, the size of the light emitting element can be increased, so that the light output of the light emitting device can be improved. Furthermore, since the area of the first lead 21 exposed from the resin portion is increased, the arrangement of the light emitting element becomes easier.

The resin package 10 has a rectangular shape when viewed from above, and the first long side wall extends in the first direction. That is, the outer surface of the first part and the outer surface of the second part are located on the same plane. Therefore, by extending the lower end of the first part in the first direction, it becomes easier to keep the width at the lower end of the first part constant in the second direction. Similarly, since the first long side wall extends in the first direction, the lower end of the second portion extends in the first direction, making it easier to keep the width at the lower end of the second portion constant in the second direction. Thereby, the width of the lower end of the first part and the width of the lower end of the second part in the second direction can be set narrow, taking into consideration the strength of the resin package. By setting the width of the lower end of the first part and the width of the lower end of the second part narrow in the second direction, it is possible to increase the area of the first lead 21 and the second lead 22 exposed from the resin part. This facilitates arrangement of the light emitting element 50 and/or the wire 60. When mounting the protection element 80 on the first lead 21 and/or the second lead 22, the arrangement of the protection element 80 becomes easy.

The first stretched lower end 42S1 and the second stretched lower end 42S2 may be connected by a part of the lower end 42K2 of the second portion 42A2 that is parallel to the second direction, and the second stretched lower end 42S2 that is inclined with respect to the second direction. may be connected by a part of the lower end 42K2. A part of the lower end 42K2 of the second portion 42A2 that connects the first extended lower end 42S1 and the second extended lower end 42S2 and is inclined with respect to the second direction is referred to as a first connecting lower end 42L1. That is, the second portion 42A2 includes a first connection portion having a first connection lower end 42L1. In the second direction, the width of the first connecting portion is larger than the width w1 at the lower end 42K1 of the first portion 42A1, and smaller than the width w2 at the lower end 42K2 of the second portion 42A2. As shown in FIG. 1A, it is preferable that the first connecting lower end 42L1 connects the first extending lower end 42S1 and the second extending lower end 42S2 without having a corner. That is, it is preferable that the first connection lower end 42L1 is curved. By doing so, stress is not concentrated at the corners, so it is possible to suppress the occurrence of cracks in the second portion 42A2. The first connection lower end 42L1 is located on the first lead, the second lead, and/or the bottom resin portion. For example, the first connection lower end 42L1 may be located on the first lead, the second lead, and the bottom resin part, or may be located on the first lead and the bottom resin part, and may be separated from the second lead. As shown in FIG. 1A, it is preferable that the first connection lower end 42L1 is located only on the first lead and is away from the second lead and the bottom resin part. By doing so, the length of the second stretched lower end in the first direction can be increased, so that the volume of the second portion 42A2 can be increased. Thereby, the strength of the second part can be improved.

In the second direction, it is preferable that the side surface of the light emitting element and the inner surface of the first portion 42A1 face each other, and the side surface of the light emitting element and the inner surface of the second part 42A2 do not face each other. The width at the lower end 42K1 of the first portion 42A1 is smaller than the width at the lower end 42K2 of the second portion 42A2. Therefore, since the side surface of the light emitting element and the inner surface of the first part are opposed to each other, the distance from the side surface of the light emitting element to the first long side wall 42A is smaller than when the side surface of the light emitting element and the inner surface of the second part 42A2 are opposed to each other. The distance can be increased. By increasing the distance from the side surface of the light emitting element to the first long side wall 42A, the arrangement of the light emitting element becomes easier.

It is preferable that the side surface of the light emitting element facing the first portion 42A1 is parallel to the first direction. By doing so, the minimum distance between the light emitting element and the side wall can be increased. This facilitates arrangement of the light emitting elements.

It is preferable that the second extended lower end 42S2 is located above the second lead 22 and the bottom resin portion 41J. Thereby, the second part, which is wider than the first part, is located on the second lead 22 and the bottom resin part 41J, so that the strength of the light emitting device can be improved. It is more preferable that the second stretched lower end 42S2 is located above the first lead 21, the second lead 22, and the bottom resin portion 41J. By doing so, the strength of the light emitting device can be further improved.

In the second direction, the width w2 at the lower end 42K2 of the second part is preferably 1.1 times or more and no more than 3 times the width w1 at the lower end 42K1 of the first part. When the width w2 at the lower end of the second part is 1.1 times or more the width w1 at the lower end of the first part, the strength of the light emitting device can be improved. Since the width w2 at the lower end of the second part is three times or less than the width w1 at the lower end of the first part, the area of the second lead exposed from the resin part becomes large, making it easier to manufacture the light emitting device. For example, it becomes easier to arrange wires, protective elements, etc. on the second lead.

As shown in FIG. 1A, the upper end 42T1 of the first part located on the inner surface and the upper end 42T2 of the second part located on the inner surface preferably extend in the first direction. By doing so, the opening of the resin package can be made larger, thereby improving the light extraction efficiency of the light emitting device. Moreover, it is preferable that the upper end 42T1 of the first part located on the inner surface and the upper end 42T2 of the second part located on the inner surface are located on the same straight line when viewed from above. By doing so, the opening of the resin package can be made larger, thereby improving the light extraction efficiency of the light emitting device. When the upper end 42T1 of the first part located on the inner surface and the upper end 42T2 of the second part located on the inner surface are located on the same straight line when viewed from above, the width of the upper surface of the first part in the second direction The width of the top surface of the second part is the same. The upper end 42T1 of the first part and the upper end 42T2 of the second part are located on the upper surface of the side wall 42. In a top view, the outer surface of the first part and the outer surface of the second part are located on the same plane. Note that in this specification, being located on the same straight line means that a variation within ±3° is allowed. Furthermore, in this specification, when the widths are the same, a variation within ±3% is allowed.

The interior angle between the bottom surface 41 of the recess and the inner surface of the first portion 42A1 is preferably larger than the interior angle between the bottom surface 41 of the recess and the inner surface of the second portion 42A2. By doing so, the area of the first lead 21 exposed from the resin portion can be increased. By increasing the area of the first lead 21 exposed from the resin portion, it becomes easier to arrange the light emitting element on the first lead.

As shown in FIGS. 1D and 2, the first lead 21 may include a first recess 21C that opens on the bottom and side surfaces of the light emitting device. The first recess 21C functions as a castellation. For example, when a light emitting device is soldered to a mounting board, the provision of the first recess 21C makes it easier to check the melted state of the solder. Furthermore, the second lead 22 may include a second recess 22C that opens on the lower and side surfaces of the light emitting device.

As shown in FIG. 3, it is preferable that the first lead 21 and the second lead 22 are exposed from the resin part 30 on the lower surface of the light emitting device. By doing so, heat from the light emitting device is easily transmitted from the first lead 21 and the second lead 22 to the mounting board on which the light emitting device is mounted. Therefore, the heat dissipation of the light emitting device can be improved.

The light emitting element 50 is placed on the first lead at the bottom of the recess. The light emitting element 50 is fixed to the first lead 21 using a known bonding member. The light emitting element 50 has positive and negative electrodes on the upper surface, one electrode is connected to the second lead 22 by a wire 60, and the other electrode is connected to the first lead 21 by a wire 60.

The light emitting device 1000 may include a translucent covering member 70 that covers the light emitting element 50. The covering member 70 is located within the recess 40 and covers the top and side surfaces of the light emitting element.

The covering member 70 may contain phosphor. By doing so, color adjustment of the light emitting device becomes easy. The covering member 70 may contain one or more types of phosphor. The phosphor contained in the covering member 70 may be dispersed or unevenly distributed. Known materials can be used for the phosphor. Examples of the phosphor include fluoride-based phosphors such as KSF-based phosphors, nitride-based phosphors such as CASN, YAG-based phosphors, β-sialon phosphors, and the like. KSF-based phosphors and CASN are examples of wavelength conversion members that convert blue light into red light, and YAG-based phosphors are examples of wavelength conversion members that convert blue light into yellow light. A β-sialon phosphor is an example of a wavelength conversion member that converts blue light into green light. The phosphor may be a quantum dot phosphor. The base material for dispersing particles such as phosphor may be silicone resin, modified silicone resin, epoxy resin, modified epoxy resin, urea resin, phenol resin, acrylic resin, urethane resin, or fluororesin, or two types of these resins. Resins containing the above can be used.

Like the light emitting device 1000A shown in FIGS. 4A and 4D, a first reflective member 81 that covers the side wall 42 may be provided in the recess. The first reflecting member 81 may be in contact with the light emitting element 50 or may be separated from it. Since the first reflective member is in contact with the light emitting element, the area where the first reflective member covers the lead increases, so that it is possible to suppress light from the light emitting element from being absorbed by the lead. By separating the first reflective member from the light emitting element, it becomes easier to extract light from the side surface of the light emitting element. The first reflecting member may be arranged so as to surround the entire circumference of the light emitting element, or the two first reflecting members 81 may be arranged so as to sandwich the light emitting element, as shown in FIG. 4A. When the two first reflecting members 81 sandwich the light emitting element 50, it is preferable that the two first reflecting members 81 sandwich the light emitting element 50 in the first direction. Since the resin package is rectangular, the distance between the first short side wall and the second short side wall and the light emitting element tends to be longer than the distance between the first long side wall and the second long side wall and the light emitting element. Therefore, when the two first reflecting members 81 sandwich the light emitting element 50 in the first direction, it becomes easier to form the first reflecting member 81 separated from the light emitting element. When the first reflective member is separated from the light emitting element, it is preferable that the first lead 21 has a groove 21G surrounding the light emitting element 50 on the upper surface, as shown in FIGS. 4B, 4D, and 5. The groove portion 21G is formed inside the side wall 42 and functions as a dam for preventing the first reflecting member 81 from reaching the side surface of the light emitting element 50. Although the groove portion 21G only needs to surround at least a portion of the light emitting element, it is preferable that the groove portion 21G surrounds the entire circumference of the light emitting element. By doing so, it becomes easier to prevent the first reflective member and the light emitting element from coming into contact with each other. When the light emitting device includes a protection element, it is preferable that at least a portion of the protection element be covered with the first reflective member as shown in FIG. 4C. By doing so, it is possible to suppress light from the light emitting element from being absorbed by the protective element.

When the first reflective member is separated from the light emitting element as in the light emitting device 1000A shown in FIGS. 4A and 4D, the second reflective member contacts the light emitting element 50 in the recess and covers the upper surface of the first lead. 82 is preferable. Since the light emitting device includes the second reflective member, the second reflective member 82 covers the upper surface of the first lead, so that it is possible to suppress light from the light emitting element from being absorbed by the first lead. . It is preferable that the second reflective member covers a part of the first reflective member. By doing so, the area of the upper surface of the first lead exposed from the first reflective member and/or the second reflective member can be reduced.

Since the light emitting device includes the first reflective member and the second reflective member, the thickness of the reflective member including the first reflective member and the second reflective member can be easily adjusted. For example, in the recess, it is desirable to form the reflective member covering the side wall thick in the Z direction so as to easily reflect light from the light emitting element. Further, it is desired that the reflective member in contact with the light emitting element be formed thin in the Z direction so as not to reflect light emitted from the side surface of the light emitting element. Although it is difficult to form a thick portion and a thin portion with one reflective member, it is easy to form a thick portion and a thin portion with two reflective members. In the recess, after forming a first reflective member that is desired to be thick because it covers the side wall away from the light emitting element, a second reflective member that is desired to be formed thin because it contacts the light emitting element and covers the upper surface of the first lead is formed. A reflective member having a desired thickness can be formed.

When the second reflective member includes a resin material and light-reflective particles contained in the resin material, it is preferable that the light-reflective particles contained in the resin material are unevenly distributed on the lead side. That is, in the second reflective member, it is preferable that the concentration of light-reflective particles in the lower part located on the lead side is higher than the concentration of light-reflective particles in the upper part located on the opening side. By doing so, since the lower part of the second reflective member has a high concentration of light reflective particles, it is possible to suppress light from the light emitting element from being absorbed by the first lead. Since the concentration of light-reflecting particles is low in the upper part of the second reflecting member, it becomes easier to extract light from the side surfaces of the light-emitting element. A known method can be used to make the light reflective particles contained in the resin material unevenly distributed on the lead side. For example, the light-reflecting particles can be unevenly distributed by forced sedimentation such as centrifugal sedimentation or natural sedimentation.

As shown in FIGS. 4B and 4D, when the light emitting device 1000A includes the second reflective member 82, the first lead has a groove 21G surrounding the light emitting element on the upper surface, and the second reflective member 82 is located inside the groove 21G. It is preferable to be located at . By locating the second reflective member within the groove, the adhesion between the second reflective member and the first lead is improved.

As shown in FIGS. 4B, 4D, and 5, it is preferable that a portion of the groove portion 21G overlaps with the light emitting element 50 when viewed from above. By doing so, for example, it becomes easier to form the first reflective member away from the light emitting element even in the vicinity of the light emitting element. Furthermore, since a portion of the groove overlaps with the light emitting element, the second reflective member is less likely to creep up the side surface of the light emitting element, making it easier to extract light from the side surface of the light emitting element. It is preferable that a portion of the groove overlaps with the light emitting element, the second reflective member is located within the groove, and the light reflective particles of the second reflective member 82 are unevenly distributed on the lead side. By doing so, the second reflective member has a higher concentration of light reflective particles in the groove, and the light reflective particles in the second reflective member that are in contact with the side surface of the light emitting element have a higher concentration of light reflective particles than in the groove. Since the concentration is lower, it becomes easier to extract light from the sides of the light emitting element. When the second reflective member is located in the groove and the light reflective particles of the second reflective member are unevenly distributed on the lead side, the concentration of the light reflective particles in the lower part located on the bottom side of the groove is lower than the concentration of the light reflective particles on the opening side of the groove. The concentration of light-reflecting particles is higher than the concentration of light-reflecting particles in the upper part located at .

As in the resin package 10B shown in FIGS. 6A and 6B, the first lead 21 and/or the second lead 22 may have a through hole 20T, and a portion of the resin portion 30 may be disposed within the through hole 20T. . By doing so, the adhesion between the first lead 21 and/or the second lead 22 and the resin portion 30 can be improved. Thereby, it is possible to suppress moisture or the like from entering the resin package from between the first lead and/or the second lead and the resin part. In a top view, the through hole 20T preferably overlaps the side wall 42. By doing so, it becomes easier to fill the resin part into the through hole. Although the number of through holes is not particularly limited, it is preferable that there be a plurality of through holes. When there are multiple through holes, it is preferable that the resin package has the through holes at each of the four corners. By doing so, it is possible to improve the adhesion between the first lead and/or the second lead and the resin part.

As in the resin package 10C shown in FIGS. 7A and 7B, the resin portion 30 may cover a portion of the upper surface of the first lead and/or the second lead within the recess. By doing so, it is possible to improve the adhesion between the first lead and/or the second lead and the resin part.

<Embodiment 2>
Light emitting devices 2000A, 2000B, 2000C, 2000A1, 2000A2, 2000A3, 2000B1, and 2000C1 according to Embodiment 2 of the present invention will be described based on FIGS. 8A to 14. In order to show the internal structure, the covering member 70 is shown as a transparent member in FIGS. 8A, 9A, 10A, and 11A.

The light emitting device 2000A includes a resin package 10D, a light emitting element 50, and a wire 60. The resin package 10D includes leads 20 and a resin portion 30. The lead 20 includes a first lead 21 and a second lead 22. When viewed from above, the resin package 10D has a rectangular shape. The resin package 10D has a recess 40 in which the first lead 21, the second lead 22, and a portion of the resin portion 30 serve as a bottom surface 41, and a portion of the resin portion serves as a side wall 42. In a top view, the side wall 42 includes a first long side wall 42A and a second long side wall 42B that extend in a first direction and face each other, and a first short side wall 42C and a second long side wall that extend in a second direction orthogonal to the first direction and face each other. 2 short side walls 42D. The resin portion 30 includes a holding resin portion 41H located between the first lead 21 and the second lead 22 on the bottom surface 41 of the recess 40, and a top surface of the holding resin portion 41H and at least one of the first lead 21 and the second lead 22. 41C of covering resin parts which cover a part of. A part of the upper surface of the holding resin part 41H is exposed from the covering resin part 41C, and the upper surface of the holding resin part 41H exposed from the covering resin part 41C is located on the same plane as the upper surfaces of the first lead 21 and the second lead 22. . The light emitting element 50 is placed on the first lead 21 on the bottom surface 41 of the recess 40 . The wire 60 electrically connects the light emitting element 50 and the second lead 22. In this specification, being located on the same plane means that a variation within ±10 μm is allowed.

In the light emitting device 2000A according to the second embodiment, the resin portion 30 has a holding resin portion 41H located between the first lead 21 and the second lead 22 on the bottom surface 41 of the recess 40, and a holding resin portion 41H and the first lead 21 and A covering resin part 41C that covers a part of the upper surface of at least one of the second leads 22, a part of the upper surface of the holding resin part 41H is exposed from the covering resin part 41C, and a holding resin part 41C is exposed from the covering resin part 41C. This is different from the light emitting device of the first embodiment in that the upper surface of the resin portion 41H is located on the same plane as the upper surfaces of the first lead 21 and the second lead 22. The light emitting device of Embodiment 2 configured as described above includes the covering resin portion 41C, so that the resin portion 30 can be made thicker by the thickness of the covering resin portion 41C. As the resin portion becomes thicker, the strength of the resin portion 30 is improved. Thereby, a light emitting device with high intensity can be obtained.

The holding resin portion 41H is a resin portion located between the first lead 21 and the second lead 22 on the bottom surface 41 of the recess 40 and located below in the third direction from the top surface of the first lead 21 and the second lead 22. This refers to section 30. Note that the third direction (Z-axis direction) is a direction perpendicular to the first direction (X-axis direction) and the second direction (Y-axis direction). A portion of the resin portion located on the same plane as the top surfaces of the first lead 21 and the second lead 22 on the bottom surface of the recess is included in the holding resin portion 41H. The upper surface of the first lead 21 means the surface of the first lead located at the top in the third direction. Similarly, the upper surface of the second lead 22 means the surface of the second lead located at the top in the third direction.

The covering resin part 41C covers a part of the upper surface of the holding resin part 41H and at least one of the first lead 21 and the second lead 22, and also covers the upper surface of the first lead 21 and the second lead 22 in the third direction (Z-axis direction). 2 refers to the resin portion 30 located above the top surface of the lead 22.

As in the light emitting device 2000A shown in FIGS. 8A and 8B, the covering resin portion 41C may cover a portion of the upper surface of the holding resin portion 41H and the second lead 22, and may be separated from the upper surface of the first lead 21. By separating the covering resin portion 41C from the upper surface of the first lead 21, the area of the upper surface of the first lead 21 exposed from the resin portion 30 can be increased. By increasing the area of the upper surface of the first lead 21 exposed from the resin portion 30, the size of the light emitting element 50 can be increased, so that the light output of the light emitting device can be improved. Furthermore, since the area of the upper surface of the first lead 21 exposed from the resin portion 30 is increased, the arrangement of the light emitting element 50 becomes easier. In the case where a wire is provided to connect the protective element 80 disposed on the second lead 22 and the first lead 21, the area of the upper surface of the first lead 21 exposed from the resin part 30 becomes large. It becomes easier to arrange the wire on the lead 21. Note that even when the light emitting element placed on the second lead is placed, the wire that electrically connects the light emitting element placed on the second lead and the first lead is placed on the first lead. It becomes easier.

As in the light emitting device 2000B shown in FIGS. 9A and 9B, the covering resin part 41C may cover the holding resin part 41H and a part of the upper surface of the first lead 21, and may be separated from the upper surface of the second lead 22. By separating the covering resin portion 41C from the upper surface of the second lead 21, the area of the upper surface of the second lead 22 exposed from the resin portion 30 can be increased. By increasing the area of the upper surface of the second lead 22 exposed from the resin portion 30, it becomes easier to arrange the wire 60 electrically connecting the light emitting element 50 and the second lead 22 on the second lead 22. When the protective element 80 and/or the light-emitting element are disposed on the second lead 22, the area of the upper surface of the second lead exposed from the resin portion is increased, so that the protective element 80 and/or the light-emitting element are disposed on the second lead 22. becomes easier.

Like the light emitting device 2000C shown in FIGS. 10A and 10B, the covering resin portion 41C may include a first covering resin portion 41C1 and a second covering resin portion 41C2. The first covering resin portion 41C1 covers a portion of the upper surface of the holding resin portion 41H and the first lead 21. The second covering resin portion 41C2 covers a portion of the upper surface of the holding resin portion 41H and the second lead 22. A holding resin part 41H exposed from the covering resin part 41C is located between the first covering resin part 41C1 and the second covering resin part 41C2, and the upper surface of the holding resin part 41H is the upper surface of the first lead 21 and the second lead 22. located on the same plane as By providing the light emitting device 2000C with the first covering resin part 41C1 and the second first covering resin part 41C2, the resin part 30 is made thicker by the thickness of the first covering resin part 41C1 and the second first covering resin part 41C2. be able to. As the resin portion becomes thicker, the strength of the resin portion 30 is improved. Thereby, a light emitting device with high intensity can be obtained. In addition, if the upper surface of the holding resin part is located on the same plane as the upper surfaces of the first lead and the second lead, the upper surface of the holding resin part is located below the upper surfaces of the first lead and the second lead. It is possible to suppress the strength of the resin portion from decreasing more than the above. Furthermore, since the covering resin part 41C includes the first covering resin part 41C1 and the second covering resin part 41C2, the area where the covering member 70 and the resin part 30 are in contact increases, so that the adhesion between the covering member 70 and the resin part 30 is improved. can be improved. Furthermore, in the case where the light emitting device includes a first reflective member in contact with the first coated resin part and/or the second coated resin part, the area in which the first reflective member and the resin part are in contact increases, so that the first reflective member and the resin The adhesion of the parts can be improved.

As shown in FIGS. 8B and 9B, in the first direction, the width w5 of the covering resin portion 41C that covers a part of the upper surface of at least one of the first lead 21 and the second lead 22 covers the holding resin portion 41H. It is preferable that the width w6 of the covering resin portion 41C of the portion is shorter than the width w6. Since the width w5 of the covering resin portion 41C of the portion that covers a part of the upper surface of at least one of the first lead 21 and the second lead 22 is short, the first lead 21 and/or the second lead 22 exposed from the resin portion is small. The area of the upper surface can be increased. Further, since the width w6 of the covering resin portion of the portion that covers the holding resin portion is long, the area of the resin portion 30, which becomes thicker due to being covered with the covering resin portion, can be increased. Thereby, the strength of the resin portion 30 can be improved. Further, as shown in FIG. 10B, the covering resin part 41C includes a first covering resin part 41C1 that covers a part of the upper surface of the first lead 21, and a second covering resin part 41C2 that covers a part of the upper surface of the second lead 22. In the first direction, the width w51 of the first covering resin part 41C1 in the part that covers a part of the upper surface of the first lead 21 is equal to the width w61 of the first covering resin part in the part covering the holding resin part 41H. It is preferable that it be shorter than . Similarly, it is preferable that the width w52 of the second covering resin portion 41C2 covering a portion of the upper surface of the second lead 22 is shorter than the width w62 of the second covering resin portion covering the holding resin portion 41H. By doing so, while increasing the area of the upper surface of the first lead 21 and/or the second lead 22 exposed from the resin part 30, the upper surface area of the first lead 21 and/or the second lead 22 exposed from the resin part 30 is increased, and the area is thickened by being covered with the first covering resin part and the second covering resin part. Therefore, the area of the resin portion 30 can be increased.

As shown in FIGS. 8B and 9B, the width w7 of the covering resin portion 41C is preferably shorter than the width w8 of the holding resin portion 41H exposed from the covering resin portion 41C in the first direction. Since the width w7 of the covering resin part 41C is short, the degree of freedom in forming a loop of the wire that is separated from the covering resin part 41C and straddling the covering resin part 41C can be increased. In other words, since the width w7 of the covering resin part 41C is short, it is possible to suppress the wire that straddles the covering resin part 41C from coming into contact with the covering resin part. Thereby, wire breakage can be suppressed. Further, as shown in FIG. 10B, the covering resin part 41C includes a first covering resin part 41C1 that covers a part of the upper surface of the first lead 21, and a second covering resin part 41C2 that covers a part of the upper surface of the second lead 22. In the first direction, the width w71 of the first covering resin portion 41C1 is preferably shorter than the width w8 of the holding resin portion 41H exposed from the covering resin portion 41C. Since the width w71 of the first resin coating portion 41C1 is short, the degree of freedom in the loop shape of the wire that is separated from the first resin coating portion 41C1 and straddles the first resin coating portion 41C1 can be increased. Similarly, in the first direction, the width w72 of the second covering resin portion 41C2 is preferably shorter than the width w8 of the holding resin portion 41H exposed from the covering resin portion 41C.

As shown in FIG. 8A, it is preferable that the covering resin portion 41C connects the first long side wall 42A and the second long side wall 42B. Thereby, the strength of the resin portion 30 between the first long side wall and the second long side wall can be improved.

As shown in FIG. 8B, the height of the covering resin portion 41C is preferably lower than the height of the light emitting element 50. Thereby, even if the wire 60 electrically connecting the light emitting element 50 and the second lead 22 is formed across the covering resin part 41C, it is possible to prevent the wire 60 from coming into contact with the covering resin part 41C. Note that the height of the covering resin portion 41C refers to the maximum distance from the top surface of the first lead to the top surface of the covering resin portion in the third direction (Z-axis direction). Further, the height of the light emitting element refers to the maximum distance from the top surface of the first lead to the top surface of the light emitting element in the third direction (Z-axis direction).

Similar to the light emitting device of Embodiment 1, in the light emitting device 2000A of Embodiment 2, the first long side wall 42A is arranged on the first lead 21, and on the first lead and the second lead. a second portion 42A2 disposed, in the second direction, a width w2 at a lower end 42K2 of the second portion 42A2 is larger than a width w1 at a lower end 42K1 of the first portion 42A1; It is preferable that the lower end 42K1 of the first part 42A1 and the lower end 42K2 of the second part 42A2 extend in the first direction. By doing so, the strength of the second portion is improved, so that a light emitting device with high strength can be obtained. However, in the light emitting device 2000A of the second embodiment, the width w2 at the lower end 42K2 of the second portion 42A2 may not be larger than the width w1 at the lower end 42K1 of the first portion 42A1 in the second direction, and the bottom surface 41 of the recess 40 In this case, the lower end 42K1 of the first portion 42A1 and the lower end 42K2 of the second portion 42A2 do not need to extend in the first direction.

The light emitting device of Embodiment 2 may have various features of the light emitting device of Embodiment 1. For example, as shown in FIG. 11A, FIG. 11B, FIG. 11C, FIG. 12, and FIG. Good too. The resin package 10D of the light emitting device 2000A1 has the same shape as the resin package 10D of the light emitting device 2000A. The resin package 10E of the light emitting device 2000B1 has the same shape as the resin package 10E of the light emitting device 2000B. The resin package 10F of the light emitting device 2000C1 has the same shape as the resin package 10F of the light emitting device 2000C.

In a top view, a portion of the groove may overlap the light emitting element, or a portion of the groove may be separated from the light emitting element. As shown in FIG. 14, at least a portion of the inner edge of the groove portion 21G (indicated by hatching) may be separated from the outer edge of the light emitting element 50 when viewed from above. By doing so, the area of the groove portion 21G overlapping with the light emitting element 50 can be reduced when viewed from above. By reducing the area of the groove 21G that overlaps with the light emitting element 50, even if the groove 21G is formed on the first lead 21, the volume of the first lead 21 located below the light emitting element 50 can be prevented from becoming smaller. . This can prevent the heat dissipation of the light emitting device from deteriorating. Further, when viewed from above, the groove portion 21G and the light emitting element 50 do not need to have an overlapping portion. In other words, all the outer edges of the light emitting element 50 may be separated from all the inner edges of the groove portion 21G when viewed from above. By doing so, it is possible to further prevent the heat dissipation of the light emitting device from deteriorating.

As shown in FIGS. 11B and 14, it is preferable that at least a portion of the outer edge of the light emitting element 50 is located on the same plane as at least a portion of the inner edge of the groove portion 21G when viewed from above. By doing so, the groove portion can be formed near the light emitting element while suppressing a decrease in heat dissipation performance of the light emitting device. By forming the groove near the light emitting element, the first reflective member can be provided near the light emitting element. This makes it easier for the first reflective member to extract light from the light emitting element, thereby improving the light extraction efficiency of the light emitting device.

The wire 60 electrically connecting the light emitting element 50 and the second lead 22 may have a plurality of bent portions 63 as shown in FIG. 11D, or may have only one bent portion 63 as shown in FIG. 11E. You can leave it there. In particular, it is preferable that the wire 60 electrically connecting the light emitting element 50 and the second lead 22 has a plurality of bent portions 63. That is, the wire 60 that electrically connects the light emitting element 50 and the second lead 22 has a first connection part 61 that connects to the light emitting element 50, a second connection part 62 that connects to the second lead 22, and a first connection part 61 that connects the light emitting element 50 and the second lead 22. It is preferable to have a plurality of bent portions 63 between the portion 61 and the second connecting portion 62. Since the wire 60 that electrically connects the light emitting element 50 and the second lead 22 has a plurality of bends 63, the positions of the plurality of bends 63 can be set as appropriate. This increases the degree of freedom in the loop shape of the wire, making it easier to prevent the wire 60 from coming into contact with the covering resin portion 41C. The height of each of the plurality of bent portions 63 is preferably higher than the height of the covering resin portion 41C. By doing so, it is possible to further prevent the wire 60 from coming into contact with the covering resin portion 41C. In this specification, the bent portion refers to a portion located between the first connecting portion 61 and the second connecting portion 62, where the direction in which the wire extends changes by ±10° or more. Furthermore, in this specification, the height of the bent portion 63C refers to the maximum distance from the upper surface of the first lead to the upper surface of the bent portion in the third direction (Z-axis direction).

As shown in FIG. 11D, the height of each of the plurality of bent portions 63 may be higher than the height of the light emitting element, and as shown in FIG. 11F, the height of at least one of the plurality of bent portions 63 The height may be lower than the height of the light emitting element. The phrase "the height of each of the plurality of bent parts 63 is higher than the height of the light emitting element" means that the height of all the plurality of bent parts 63 is higher than the height of the light emitting element. By doing so, it is possible to prevent the wire 60 from coming into contact with the outer surface of the light emitting element 50 and the coating resin portion 41C. In this specification, the outer surface of the light emitting device 50 means the top surface of the light emitting device that does not include the positive and negative electrodes and the side surface of the light emitting device. Furthermore, when the height of at least one of the plurality of bends 63 is lower than the height of the light emitting element, the volume of the covering member 70 located below the wire 60 can be reduced. Therefore, even if the covering member 70 expands or contracts, it is possible to suppress the force from the covering member 70 from being applied to the wire. Thereby, deformation of the wire can be suppressed.

The plurality of bent portions 63 may include a first bent portion 63A, a second bent portion 63B, and a third bent portion 63C. The wire 60 that electrically connects the light emitting element 50 and the second lead 22 has a first connecting portion 61, a first bent portion 63A, a second bent portion 63B, and a third bent portion 63C in this order. In this case, the height h3 of the third bent portion 63C is preferably higher than the height h3 of the second bent portion 63B. By increasing the height h3 of the third bent portion 63C, the inclination angle of the wire 60 located between the third bent portion 63C and the second connection portion 62 can be increased. Thereby, it is possible to prevent the wire 60 and the covering resin portion 41C from coming into contact with each other. In this specification, the inclination angle refers to an angle of 90° or less among the angles with respect to a plane set by the first direction (X-axis direction) and the second direction (Y-axis direction). It is preferable that the height h2 of the second bent portion 63B and the height h3 of the third bent portion 63C are lower than the height h1 of the first bent portion 63A. By doing so, the length of the wire 60 can be shortened, making it easier to suppress variations in the loop shape of the wire. Further, since the height h1 of the first bent part 63A is higher than the height h2 of the second bent part 63B and the height h3 of the third bent part 63C, the distance between the first bent part 63A and the second bent part 63B is The inclination angle of the wire 60 located at the position can be increased. Thereby, it is possible to prevent the wire 60 and the outer surface of the light emitting element 50 from coming into contact with each other.

As shown in FIG. 11D, when the height h2 of the second bent part 63B is lower than the height h1 of the first bent part 63A and the height h2 of the third bent part 63C, the second bent part 63B is It is preferable that the portion 63B and the covering resin portion 41C do not overlap. By doing so, it becomes easier to prevent the wire 60 from coming into contact with the covering resin portion 41C. Further, when the height h2 of the second bent portion 63B is lower than the height h1 of the first bent portion 63A and the height h2 of the third bent portion 63C, the second bent portion 63B and the light emitting element are It is preferable that the numbers 50 and 50 do not overlap. By doing so, it becomes easier to prevent the wire 60 and the light emitting element 50 from coming into contact with each other.

In the first direction (X-axis direction), the third bent portion 63C may be located closer to the first connecting portion 61 than the covering resin portion 41C, or may be located farther from the first connecting portion 61. good. In particular, in the first direction, the third bent portion 63C is preferably arranged closer to the first connecting portion 61 than the covering resin portion 41C. In this specification, the phrase "the third bent part 63C is disposed closer to the first connecting part 61 than the covering resin part 41C in the first direction" means that the third bent part 63C in the first direction is located closer to the first connecting part 61 than the covering resin part 41C. This means that the shortest distance to the portion 61 is shorter than the shortest distance from the covering resin portion 41C to the first connecting portion 61 in the first direction. Since the shortest distance from the third bent portion 63C to the first connecting portion 61 in the first direction is short, variations in the loop shape of the wire from the first connecting portion 61 to the third bent portion 63C can be easily suppressed. This suppresses variations in the positions of the first bent portion 63A, the second bent portion 63B, and the third bent portion 63C, making it easier to prevent the wire 60 from coming into contact with the covering resin portion 41C.

Each component in the light emitting device according to the embodiment of the present invention will be described below.

(Resin package 10)
The resin package 10 is a member on which a light emitting element is placed. The resin package 10 includes at least leads 20 and a resin portion 30.

(Lead 20)
The lead 20 is a member that has conductivity and supplies power to the light emitting element. As the base material of the lead 20, for example, metals such as copper, aluminum, gold, silver, iron, nickel, or alloys thereof, phosphor bronze, and iron-containing copper can be used. These may be a single layer or may have a laminated structure (for example, a cladding material). In particular, it is preferable to use copper, which is inexpensive and has high heat dissipation properties, as the base material. Further, the lead 20 may have a metal layer on the surface of the base material. The metal layer includes, for example, silver, aluminum, nickel, palladium, rhodium, gold, copper, or an alloy thereof. Note that the metal layer may be provided over the entire surface of the lead 20 or may be provided partially. Further, the metal layer can be formed in different layers in a region formed on the top surface of the lead and a region formed on the bottom surface of the lead. For example, the metal layer formed on the top surface of the lead is a metal layer consisting of multiple layers including nickel and silver metal layers, and the metal layer formed on the bottom surface of the lead is a metal layer that does not include a nickel metal layer. It is. Further, for example, a metal layer such as silver formed on the upper surface of the lead can be made thicker than a metal layer such as silver formed on the lower surface of the lead.

When a metal layer containing silver is formed on the outermost surface of the lead 20, it is preferable to provide a protective layer such as silicon oxide on the surface of the metal layer containing silver. Thereby, it is possible to suppress discoloration of the metal layer containing silver due to sulfur components in the atmosphere. The protective layer can be formed by, for example, a vacuum process such as sputtering, but other known methods may also be used.

The lead 20 includes at least a first lead 21 and a second lead 22. The number of leads provided in the lead 20 may be two or more, and may be three or four. A light emitting element 50 is placed on the first lead 21 .

(Resin part 30)
The resin part 30 is a member that holds the first lead 21 and the second lead 22. The resin portion 30 can use thermosetting resin, thermoplastic resin, or the like as a resin material serving as a base material. Specifically, epoxy resin compositions, silicone resin compositions, modified epoxy resin compositions such as silicone-modified epoxy resins, modified silicone resin compositions such as epoxy-modified silicone resins, unsaturated polyester resins, saturated polyester resins, and polyimide resins. Compositions, cured products such as modified polyimide resin compositions, resins such as polyphthalamide (PPA), polycarbonate resins, polyphenylene sulfide (PPS), liquid crystal polymers (LCP), ABS resins, phenolic resins, acrylic resins, PBT resins, etc. Can be used. In particular, it is preferable to use a thermosetting resin such as an epoxy resin composition or a modified silicone resin composition.

It is preferable that the resin part 30 contains a light-reflecting substance in the resin material serving as the above-mentioned base material. As the light-reflecting substance, it is preferable to use a member that is difficult to absorb light from the light-emitting element and has a large difference in refractive index with respect to the base resin material. Examples of such light-reflective substances include titanium oxide, zinc oxide, silicon oxide, zirconium oxide, aluminum oxide, and aluminum nitride.

The resin portion 30 may contain a filler that has a low light reflectance to external light (sunlight in many cases) from the light emitting device in order to improve the contrast of the light emitting device. In this case, the resin portion 30 is, for example, black or a color similar to black. As the filler, carbon such as acetylene black, activated carbon, and graphite, transition metal oxides such as iron oxide, manganese dioxide, cobalt oxide, and molybdenum oxide, or colored organic pigments can be used depending on the purpose.

(Light emitting element 50)
The light emitting element is a semiconductor element that emits light by itself when a voltage is applied, and a known semiconductor element made of a nitride semiconductor or the like can be used. An example of the light emitting element is an LED chip. A light emitting device includes at least a semiconductor layer, and often further includes a device substrate. When viewed from above, the light emitting element preferably has a rectangular shape, particularly a square shape or a rectangular shape elongated in the first direction, but it may have another polygonal shape such as a hexagonal shape. The light emitting element has positive and negative electrodes on the top surface. The positive and negative electrodes can be made of gold, silver, tin, platinum, rhodium, titanium, aluminum, tungsten, palladium, nickel, or an alloy thereof. It is preferable to use a nitride semiconductor as the semiconductor material. Nitride semiconductors are mainly represented by the general formula In _x Al _y Ga _1-xy N (0≦x, 0≦y, x+y≦1). In addition, InAlGaAs-based semiconductors, InAlGaP-based semiconductors, zinc sulfide, zinc selenide, silicon carbide, etc. can also be used. The element substrate of the light emitting element is mainly a crystal growth substrate capable of growing semiconductor crystals constituting the semiconductor stack, but it may also be a bonding substrate that is bonded to a semiconductor element structure separated from the crystal growth substrate. . Examples of the base material of the element substrate include sapphire, gallium nitride, aluminum nitride, silicon, silicon carbide, gallium arsenide, gallium phosphorus, indium phosphorus, zinc sulfide, zinc oxide, zinc selenide, and diamond. Among them, sapphire is preferred. The thickness of the element substrate can be selected as appropriate, and is, for example, 0.02 mm or more and 1 mm or less, and preferably 0.05 mm or more and 0.3 mm or less from the viewpoint of the strength of the element substrate and/or the thickness of the light emitting device. .

(Wire 60)
The wire 60 is a member for electrically connecting the light emitting element and the lead. As the wire 60, for example, a wire made of metal such as gold, copper, silver, platinum, aluminum, palladium, or an alloy containing one or more of these can be used. When the material of the wire 60 contains gold, a wire with excellent thermal resistance etc. and less likely to break due to stress from the coating member 70 can be obtained, and when the material of the wire 60 contains silver, a wire with high light reflectance can be obtained. This is advantageous because it provides a wire that exhibits . In particular, it is advantageous to use wires containing both gold and silver. When the wire 60 is a wire containing both gold and silver, the content ratio of silver is, for example, 15% to 20%, 45% to 55%, 70% to 90%, or 95% to 99%. It can be a range. In particular, when the content ratio of silver is 45% or more and 55% or less, the possibility of sulfidation can be reduced while obtaining a high light reflectance. The wire diameter of the wire can be selected as appropriate, and can be, for example, 5 μm or more and 50 μm or less. The diameter of the wire is more preferably 10 μm or more and 40 μm or less, even more preferably 15 μm or more and 30 μm or less.

(Coating member 70)
The covering member 70 is a member that protects the light emitting element from external stress. As the covering member 70, a known resin material can be used. Examples of the material for the covering member 70 include silicone resin, epoxy resin, phenol resin, polycarbonate resin, acrylic resin, or modified resins thereof. Among these, silicone resins and modified silicone resins are preferred because they have excellent heat resistance and light resistance.

The covering member 70 may contain a known phosphor. Further, the covering member 70 may contain diffusion particles. Examples of the diffusion particles include silicon oxide, aluminum oxide, zirconium oxide, and zinc oxide. The diffusion particles may contain one type of these, or may use a combination of two or more of these. Particularly preferred is silicon oxide, which has a small coefficient of thermal expansion. Further, by using nanoparticles as the diffusion particles, scattering of light emitted by the light emitting element can be increased, and the amount of phosphor used can also be reduced. Note that nanoparticles are particles with a particle size of 1 nm or more and 100 nm or less. Moreover, the "particle size" in this specification is defined, for example, by _D50 .

(Protective element 80)
The protection element 80 is a member for improving electrostatic withstand voltage. Various protection elements mounted on general light emitting devices can be used as the protection element. For example, a Zener diode can be used as a protection element. In the light emitting device, the protection element and the light emitting element are connected in parallel.

(First reflecting member 81)
The first reflecting member 81 is a member disposed within the recess. It is preferable that the first reflective member contains a light reflective substance in the base resin material, similar to the resin part. As the material of the first reflective member, the same material as that of the resin part can be used.

(Second reflective member 82)
The second reflective member 82 is a member disposed within the recess. It is preferable that the second reflective member contains a light reflective substance in the base resin material, similar to the resin part. As the material of the second reflective member, the same material as that of the resin part can be used.

The light emitting device according to an embodiment of the present invention is a backlight device for a liquid crystal display, various lighting equipment, large displays, various display devices such as advertisements and destination guides, projector devices, digital video cameras, facsimiles, and copy machines. It can be used in image reading devices such as , scanners, etc.

1000, 1000A, 2000A, 2000B, 2000C, 2000A1, 2000A2, 2000A3, 2000B1, 2000C1 Light emitting device 10, 10A, 10B, 10C, 10D, 10E, 10F Resin package 20 Lead 21 1st lead 22 2nd lead 30 Resin part 42A First long side wall
42A1 Part 1
42A2 2nd part 42B 2nd long side wall
42B1 Part 3
42B2 Fourth part 42C First short side wall 42D Second short side wall 50 Light emitting element 60 Wire 70 Covering member 80 Protective element 81 First reflecting member 82 Second reflecting member

Claims (17)

It has a lead including a first lead and a second lead, and a resin part that holds the lead, and the first lead, the second lead, and a part of the resin part serve as a bottom surface, and a part of the resin part a rectangular resin package having a concave portion with a side wall;
a light emitting element disposed on the first lead on the bottom surface of the recess;
A wire electrically connecting the light emitting element and the second lead,
In a top view, the side wall includes a first long side wall and a second long side wall extending in a first direction and facing each other, and a first short side wall and a second short side wall extending in a second direction orthogonal to the first direction and facing each other. having a side wall;
The resin part includes a holding resin part located between the first lead and the second lead on the bottom surface of the recess, and a part of the top surface of the holding resin part and at least one of the first lead and the second lead. a covering resin part that covers the part;
A part of the upper surface of the holding resin part is exposed from the covering resin part, and the upper surface of the holding resin part exposed from the covering resin part is located on the same plane as the upper surfaces of the first lead and the second lead. ,
In the first direction, the width of the covering resin portion is shorter than the width of the holding resin portion exposed from the covering resin portion . It has a lead including a first lead and a second lead, and a resin part that holds the lead, and the first lead, the second lead, and a part of the resin part serve as a bottom surface, and a part of the resin part a rectangular resin package having a concave portion with a side wall;
a light emitting element disposed on the first lead on the bottom surface of the recess;
A wire electrically connecting the light emitting element and the second lead,
In a top view, the side wall includes a first long side wall and a second long side wall extending in a first direction and facing each other, and a first short side wall and a second short side wall extending in a second direction orthogonal to the first direction and facing each other. having a side wall;
The resin part includes a holding resin part located between the first lead and the second lead on the bottom surface of the recess, and a part of the top surface of the holding resin part and at least one of the first lead and the second lead. a covering resin part that covers the part;
A part of the upper surface of the holding resin part is exposed from the covering resin part, and the upper surface of the holding resin part exposed from the covering resin part is located on the same plane as the upper surfaces of the first lead and the second lead. ,
A light emitting device in which the covering resin portion connects the first long side wall and the second long side wall . It has a lead including a first lead and a second lead, and a resin part that holds the lead, and the first lead, the second lead, and a part of the resin part serve as a bottom surface, and a part of the resin part a rectangular resin package having a concave portion with a side wall;
a light emitting element disposed on the first lead on the bottom surface of the recess;
A wire electrically connecting the light emitting element and the second lead,
In a top view, the side wall includes a first long side wall and a second long side wall extending in a first direction and facing each other, and a first short side wall and a second short side wall extending in a second direction orthogonal to the first direction and facing each other. having a side wall;
The resin part includes a holding resin part located between the first lead and the second lead on the bottom surface of the recess, and a part of the top surface of the holding resin part and at least one of the first lead and the second lead. a covering resin part that covers the part;
A part of the upper surface of the holding resin part is exposed from the covering resin part, and the upper surface of the holding resin part exposed from the covering resin part is located on the same plane as the upper surfaces of the first lead and the second lead. ,
The first lead has a groove portion surrounding the light emitting element on the upper surface,
In the light-emitting device , a portion of the groove portion overlaps with the light-emitting element when viewed from above . The light emitting device according to any one of claims 1 to 3, further comprising a second reflective member in contact with the light emitting element in the recess. 5. The light emitting device according to claim 4 when dependent on claim 3, wherein the second reflective member is located within the groove. The first lead has a groove portion surrounding the light emitting element on the upper surface,
The light emitting device according to claim 1 or 2, wherein at least a part of the inner edge of the groove is separated from the outer edge of the light emitting element when viewed from above. The first long side wall has a first part disposed on the first lead, and a second part disposed on the first lead and the second lead,
In the second direction, the width at the lower end of the second part is larger than the width at the lower end of the first part,
7. The light emitting device according to claim 1, wherein a lower end of the first part and a lower end of the second part extend in the first direction on the bottom surface of the recess. The second long side wall has a third portion disposed on the first lead, and a fourth portion disposed on the first lead and the second lead,
In the second direction, the width at the lower end of the fourth part is larger than the width at the lower end of the third part,
8. The light emitting device according to claim 7, wherein a lower end of the third part and a lower end of the fourth part extend in the first direction on the bottom surface of the recess. The light emitting device according to claim 7 or 8, wherein a lower end of the second portion extends in the first direction on the resin portion located on the bottom surface. The light emitting device according to any one of claims 7 to 9 , wherein the width at the lower end of the second portion is 1.1 times or more and 3 times or less the width at the lower end of the first portion in the second direction. The light emitting device according to any one of claims 7 to 10, wherein the upper end of the first part located on the inner surface and the upper end of the second part located on the inner surface are located on the same straight line. The light emitting device according to any one of claims 1 to 11 , further comprising a first reflective member disposed within the recess and covering the side wall away from the light emitting element. In the first direction, a width of a portion of the covering resin portion that covers a portion of an upper surface of at least one of the first lead and the second lead is shorter than a width of a portion of the covering resin portion that covers the holding resin portion. The light emitting device according to any one of claims 1 to 12. The light emitting device according to any one of claims 1 to 13 , wherein the height of the coating resin portion is lower than the height of the light emitting element. The wire includes a first connection part that connects to the light emitting element, a second connection part that connects to the second lead, and a plurality of bent parts between the first connection part and the second connection part. have,
The light emitting device according to claim 1 , wherein the height of each of the plurality of bent portions is higher than the height of the covering resin portion. The plurality of bending parts include, in order from the first connection part side, a first bending part, a second bending part, and a third bending part,
The light emitting device according to claim 15 , wherein a height of the third bent portion is higher than a height of the second bent portion. 17. The light emitting device according to claim 16 , wherein the third bent portion is closer to the first connecting portion than the covering resin portion in the first direction.

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