JP2022046071A - Light emitting device - Google Patents

Abstract

To provide a light emitting device capable of improving mechanical strength.SOLUTION: The light emitting device includes: a first lead 11 and a second lead 12 arranged side by side in a first direction; a resin member 20 that holds the first lead and the second lead and has a resin recessed portion defined by a first side wall and a second side wall extending in the first direction and a third side wall and a fourth side wall extending in a second direction orthogonal to the first direction; and a light emitting element 30. The first lead has a first A projection portion 11A and a first B projection portion 11B. The second lead has a second A projection portion 12A and a second B projection portion 12B. The first A projection portion 11A and the second A projection portion 12A are covered with the first side wall. The first B projection portion 11B and the second B projection portion 12B are covered with the second side wall. The first A projection portion 11A is located outside the second A projection portion 12A. The second B projection portion 12B is located outside the first B projection portion 11B. At least part of the first A projection portion 11A and the second B projection portion 12B overlaps with each other in the second direction.SELECTED DRAWING: Figure 1A

Description

The present invention relates to a light emitting device.

Since a light emitting device using a light emitting element such as an LED can easily obtain high luminous efficiency, it is used in many devices including a backlight such as a display and a lighting fixture for lighting. Patent Document 1 discloses a light emitting device including a resin member having a pair of positive and negative leads and a recess, and a light emitting element mounted on the bottom surface of the recess of the resin member. Such a light emitting device is required to further improve the mechanical strength.

Japanese Unexamined Patent Publication No. 2013-125767

It is an object of the present invention to provide a light emitting device capable of improving mechanical strength.

The light emitting device of one embodiment is a resin member that holds the first lead and the second lead arranged side by side in the first direction, and the first lead and the second lead, and extends in the first direction. A resin member having resin recesses defined in a first side wall and a second side wall facing each other, and a third side wall and a fourth side wall extending in a second direction orthogonal to the first direction and facing each other, and the above. It comprises at least one light emitting element arranged in the resin recess, and the first lead includes a first main body portion, a first A convex portion extending from the first main body portion toward the second lead side, and a first B. The second lead has a second main body portion, and a second A convex portion and a second B convex portion extending from the second main body portion toward the first lead side. The first A convex portion and the second A convex portion are covered with the first side wall, the first B convex portion and the second B convex portion are covered with the second side wall, and the first A convex portion is the said. The second B convex portion is located outside the second A convex portion, the second B convex portion is located outside the first B convex portion, and at least a part of the first A convex portion and the second B convex portion in the second direction. Overlap.

According to the light emitting device according to the embodiment of the present invention, it is possible to provide a light emitting device capable of improving the mechanical strength.

It is a schematic top view of the light emitting device which concerns on this embodiment. FIG. 3 is a schematic cross-sectional view taken along the line IB-IB of FIG. 1A. It is a schematic bottom view of the light emitting device which concerns on this embodiment. It is a schematic top view of the lead which concerns on this embodiment. It is a schematic bottom view of the lead which concerns on this embodiment.

The light emitting device of the embodiment will be described in detail with reference to the drawings. The following embodiments are examples, and the light emitting device according to the present disclosure is not limited to the following embodiments. For example, the numerical values, shapes, materials, and the like shown in the following embodiments are merely examples, and various modifications can be made as long as there is no technical contradiction.

The dimensions, shapes, etc. of the components shown in the drawings may be exaggerated for the sake of clarity, and may not reflect the dimensions, shapes, and magnitude relationships between the components in an actual light emitting device. In addition, some elements may be omitted in order to prevent the drawings from becoming excessively complicated. In FIG. 1A, the translucent member 50 is omitted so that the inside of the resin recess 25 can be easily seen.

In the following description, components having substantially the same function are indicated by common reference numerals, and the description may be omitted. In addition, a term indicating a specific direction or position (for example, "top", "bottom" and another term including those terms) may be used. However, those terms are used only for clarity of relative orientation or position in the referenced drawings. If the relative directions or positional relationships in terms such as "top" and "bottom" in the referenced drawings are the same, the layout is not the same as the referenced drawings in drawings other than the present disclosure, actual products, etc. You may. As used herein, the term "parallel" includes the case where two straight lines, sides, planes, etc. are in the range of about 0 ° to ± 5 °, unless otherwise specified. Further, in the present specification, "orthogonal" or "vertical" includes the case where two straight lines, sides, planes, etc. are in the range of about 90 ° to ± 5 ° unless otherwise specified. Further, the positional relationship expressed as "above" includes the case where it is in contact and the case where it is not in contact but is located above.

<Embodiment>
The light emitting device 1000 according to the present embodiment will be described with reference to FIGS. 1A to 2B. The light emitting device 1000 includes a lead 10, a resin member 20, and at least one light emitting element 30. The lead 10 includes a first lead 11 and a second lead 12 arranged side by side in the first direction. The first lead 11 has a first main body portion 110, and a first A convex portion 11A and a first B convex portion 11B extending from the first main body portion 110 toward the second lead 12 side. The second lead 12 has a second main body portion 120, and a second A convex portion 12A and a second B convex portion 12B extending from the second main body portion 120 toward the first lead 11 side. The resin member 20 holds the first lead 11 and the second lead 12. The resin member 20 has a first side wall 21 and a second side wall 22 extending in the first direction and facing each other, and a third side wall 23 and a fourth side wall 24 extending in a second direction orthogonal to the first direction and facing each other. It has a defined resin recess 25. The first A convex portion 11A of the first lead 11 and the second A convex portion 12A of the second lead 12 are covered with the first side wall 21. The first B convex portion 11B of the first lead 11 and the second B convex portion 12B of the second lead 12 are covered with the second side wall 22. The first A convex portion 11A is located outside the second A convex portion 12A. The second B convex portion 12B is located outside the first B convex portion 11B. In the second direction, at least a part of the first A convex portion 11A and the second B convex portion 12B overlap. At least one light emitting element 30 is arranged in the resin recess 25 of the resin member 20. In FIG. 1, the first direction is the X direction, and the second direction is the Y direction. In the present specification, the first direction from the first lead 11 to the second lead 12 side may be referred to as an −X direction, and the first direction from the second lead 12 toward the first lead 11 side may be referred to as a + X direction. .. Further, the direction from the lower surface side of the lead 10 toward the upper surface side of the lead may be referred to as the + Z direction, and the direction from the upper surface side of the lead 10 toward the lower surface side of the lead may be referred to as the −Z direction.

In the present embodiment, at least a part of the first A convex portion 11A and the second B convex portion 12B, which are a part of the lead 10, overlap in the second direction. As a result, a part of the resin member 20 can be sandwiched between the first A convex portion 11A and the second B convex portion 12B in the second direction. Generally, since the lead 10 has higher mechanical strength than the resin member 20, a part of the resin member 20 is sandwiched between the first A convex portion 11A and the second B convex portion 12B, so that the resin member 20 is cracked by an external force. It can be suppressed from being chipped or chipped. Therefore, the mechanical strength of the light emitting device can be improved.

(Lead 10)
The lead 10 includes a first lead 11 and a second lead 12. The first lead 11 and the second lead 12 are members for electrically connecting to either the negative electrode or the positive electrode of the pair of electrodes of the light emitting element to energize the light emitting element. The first lead 11 and the second lead 12 are rolled, punched, extruded, and wet using, for example, copper, aluminum, gold, silver, iron, nickel, or a metal such as an alloy thereof, phosphor bronze, or copper containing iron. Alternatively, it can be formed into a predetermined shape by etching by dry etching or processing such as a combination thereof. These may be a single layer or a laminated structure (for example, a clad material). In particular, it is preferable to use copper, which is inexpensive and has high heat dissipation. The first lead 11 and the second lead 12 are partially formed of a single layer or a laminated structure, for example, with metal plating such as silver, aluminum, copper and gold as a reflective film for the purpose of improving the reflectance, if necessary. It may be applied to the surface or the entire surface. When a metal layer containing silver is formed on the outermost surfaces of the first lead 11 and the second lead 12, it is preferable to provide a protective layer such as silicon oxide on the surface of the metal layer containing silver. As a result, it is possible to prevent the metal layer containing silver from being discolored by the sulfur component in the atmosphere. Examples of the method for forming the protective layer include known methods such as a vacuum process such as sputtering.

The first lead 11 and the second lead 12 are usually formed from a plate-shaped lead frame. First, a plate-shaped lead frame is processed by punching or the like so that a plurality of units corresponding to a plurality of resin packages are repeatedly arranged vertically and / or horizontally. Next, each unit constituting one light emitting device is cut off. As a result, the first lead 11 and the second lead 12 are formed from the plate-shaped lead frame. Therefore, the first lead 11 and the second lead 12 constituting one unit extend from them a connecting portion for integrally connecting to the lead frame. The connecting portion is substantially flush with the resin member on the outer surface of the light emitting device and is exposed from the resin member. In the present application, when the shapes of the first lead 11 and the second lead 12 are described, the connecting portion S (see FIG. 2A) is not included in the shapes unless otherwise specified.

As shown in FIGS. 2A and 2B, the first lead 11 and the second lead 12 are arranged side by side in the first direction. The first lead 11 has a first main body portion 110, a first A convex portion 11A, and a first B convex portion 11B. The first A convex portion 11A extends in the −X direction from the first main body portion 110. The first B convex portion 11B extends in the −X direction from the first main body portion 110. The second lead 12 has a second main body portion 120, a second A convex portion 12A, and a second B convex portion 12B. The second A convex portion 12A extends in the + X direction from the second main body portion 120. The second B convex portion 12B extends in the + X direction from the second main body portion 120. The first A convex portion 11A is located outside the second A convex portion 12A. The fact that the first A convex portion 11A is located outside the second A convex portion 12A means that the portion of the first A convex portion 11A farthest from the center of the light emitting device is from the portion of the second A convex portion 12A farthest from the center of the light emitting device. Also means that it is located outside the center of the light emitting device. In the present specification, the "center of the light emitting device" means the geometric center of gravity of the light emitting device in a top view. For example, when the shape of the light emitting device in the top view is rectangular, the center of the light emitting device means the intersection of the diagonal lines of the light emitting device. The second B convex portion 12B is located outside the first B convex portion 11B. The fact that the second B convex portion 12B is located outside the first B convex portion 11B means that the portion of the second B convex portion 12B farthest from the center of the light emitting device is larger than the portion of the first B convex portion 11B farthest from the center of the light emitting device. It means that it is located outside the center of the light emitting device. The first A convex portion 11A and the second A convex portion 12A are covered with the first side wall 21 of the resin member 20. By covering the first side wall 21 with the first A convex portion 11A and the second A convex portion 12A, the adhesion between the resin member 20 and the lead 10 is improved. Further, since the first side wall 21 is covered with the first A convex portion 11A and the second A convex portion 12A, the first side wall 21 is not covered with the first A convex portion 11A and the second A convex portion 12A. It becomes easy to increase the volume of the lead 10 located below the 21. As a result, the volume of the lead 10 having a higher strength than that of the resin member 20 increases on the lower side of the first side wall 21, so that the mechanical strength of the light emitting device can be easily improved. The first B convex portion 11B and the second B convex portion 12B are covered with the second side wall 22 of the resin member 20. This improves the adhesion between the resin member 20 and the lead 10. In the second direction, the first A convex portion 11A located outside the second A convex portion 12A and the second B convex portion 12B located outside the first B convex portion 11B overlap. This makes it easier to increase the distance from the first A convex portion 11A to the second B convex portion 12B in the second direction. Therefore, it becomes easy to increase the volume of the resin member 20 sandwiched between the first A convex portion 11A and the second B convex portion 12B, so that it becomes easy to prevent the resin member 20 from cracking or chipping due to an external force.

At least a part of the first B convex portion 11B and the second A convex portion 12A may overlap in the second direction, and if the first B convex portion 11B and the second A convex portion 12A overlap in the second direction as shown in FIG. 2A. It does not have to be. By overlapping the first B convex portion 11B and the second A convex portion 12A in the second direction, it is possible to suppress the occurrence of cracks and chips in the resin member 20 sandwiched between the first B convex portion 11B and the second A convex portion 12A. can. Since the first B convex portion 11B and the second A convex portion 12A do not overlap in the second direction, the length from the first B convex portion 11B to the second lead 12 in the first direction and / or the second A in the first direction. The length from the convex portion 12A to the first lead 11 can be increased. This makes it difficult for the first lead 11 and the second lead 12 to come into contact with each other, so that a short circuit of the light emitting device can be suppressed.

The first A convex portion 11A and the second A convex portion 12A do not have to overlap in the second direction, and at least a part of the first A convex portion 11A and the second A convex portion 12A overlap in the second direction as shown in FIG. 2A. May be. Since the first A convex portion 11A and the second A convex portion 12A do not overlap in the second direction, the length from the first A convex portion 11A to the second lead 12 in the first direction and / or the second A in the first direction. The length from the convex portion 12A to the first lead 11 can be increased. As a result, it becomes difficult for the first lead and the second lead to come into contact with each other, so that a short circuit of the light emitting device can be suppressed. In the second direction, at least a part of the first A convex portion 11A and the second A convex portion 12A overlaps with each other, so that the resin member 20 sandwiched between the first A convex portion 11A and the second A convex portion 12A is cracked or chipped. Can be suppressed. Thereby, the mechanical strength of the light emitting device can be improved. Similarly, the first B convex portion 11B and the second B convex portion 12B do not have to overlap in the second direction, and as shown in FIG. 2A, at least one of the first B convex portion 11B and the second B convex portion 12B in the second direction. The parts may overlap.

The first A convex portion 11A and the second A convex portion 12A do not have to overlap in the first direction, and at least a part of the first A convex portion 11A and the second A convex portion 12A overlap in the first direction as shown in FIG. 2A. May be. Since the first A convex portion 11A and the second A convex portion 12A do not overlap in the first direction, it becomes difficult for the first lead and the second lead to come into contact with each other. Since at least a part of the first A convex portion 11A and the second A convex portion 12A overlaps in the first direction, cracks or chips of the resin member 20 sandwiched between the first A convex portion 11A and the second A convex portion 12A are generated. It can be suppressed. Further, since at least a part of the first A convex portion 11A and the second A convex portion 12A overlap in the first direction, the first A convex portion 11A and the second A convex portion 12A are separated from each other in the first direction. , It becomes easy to shorten the maximum length L1 from the outer edge of the first A convex portion 11A to the outer edge of the second A convex portion 12A in the second direction. Therefore, it becomes easy to miniaturize the light emitting device in the second direction. Similarly, the first B convex portion 11B and the second B convex portion 12B do not have to overlap in the first direction, and as shown in FIG. 2A, at least one of the first B convex portion 11B and the second B convex portion 12B in the first direction. The parts may overlap.

In top view, it is preferable that the outer edge 111 of the facing first A convex portion 11A and the outer edge 121 of the second A convex portion 12A are parallel to each other. By doing so, it is possible to partially prevent the distance from the first A convex portion 11A to the second A convex portion 12A to be too far or too close. For example, if the distance from the first A convex portion 11A to the second A convex portion 12A is not too long, the volume of the resin member located between the first A convex portion 11A and the second A convex portion 12A can be reduced. This makes it easier to improve the mechanical strength of the light emitting device. Further, since the distance from the first A convex portion 11A to the second A convex portion 12A is not too short, it becomes difficult for the first lead 11 and the second lead 12 to come into contact with each other. As a result, a short circuit of the light emitting device can be suppressed. Similarly, in top view, it is preferable that the outer edge 112 of the facing first B convex portion 11B and the outer edge 122 of the second B convex portion 12B are parallel to each other.

In top view, it is preferable that the outer edge 111 of the first A convex portion 11A and the outer edge 121 of the second A convex portion 12A, which are parallel to each other, extend in the third direction tilted by 10 ° or more and 80 ° or less with respect to the first direction. By doing so, it becomes easy to arrange so that at least a part of the first A convex portion 11A and the second A convex portion 12A overlap in the first direction and / or the second direction. This facilitates miniaturization of the light emitting device in the first direction and / or the second direction. In the present specification, the angle at which the third direction is tilted with respect to the first direction means the angle formed by the first direction and the third direction, which is the acute angle. Similarly, in top view, it is preferable that the outer edge 112 of the first B convex portion 11B and the outer edge 122 of the second B convex portion 12B, which are parallel to each other, extend in the fourth direction tilted by 10 ° or more and 80 ° or less with respect to the first direction. Further, it is preferable that the third direction and the fourth direction are the same direction. By doing so, the design of the first A convex portion 11A, the first B convex portion 11B, the second A convex portion 12A, and the second B convex portion 12B becomes easy.

As shown in FIG. 2A, the first main body 110 of the first lead may have a first recess 113 recessed in the + X direction. It is preferable that at least a part of the first concave portion 113 and the second B convex portion 12B overlap in the first direction. By doing so, it is possible to prevent the first lead 11 and the second lead 12 from coming into contact with each other. Further, it is preferable that the first concave portion 113 and the first B convex portion 11B are continuous. By doing so, it becomes easy to miniaturize the light emitting device in the second direction. It is preferable that the outer edge 131 of the first concave portion 113 and the outer edge 112 of the first B convex portion 11B are on the same straight line. By doing so, it is possible to prevent the first lead 11 from being deformed at the Sakai of the first concave portion 113 and the first B convex portion 11B. Similarly, the second main body 120 of the second lead may have a second recess 123 recessed in the −X direction. It is preferable that at least a part of the second concave portion 123 and the first A convex portion 11A overlap in the first direction. It is preferable that the second concave portion 123 and the first B convex portion 11B are continuous. It is preferable that the outer edge 132 of the second concave portion 123 and the outer edge 121 of the second A convex portion 12A are on the same straight line.

As shown in FIG. 2A, the first lead 11 may have a first A recess 41A and / or a first B recess 41B on a part of the upper surface thereof. The first A recessed portion 41A and / or the first B recessed portion 41B is recessed in the −Z direction. For example, the first A recessed portion 41A and the first B recessed portion 41B are recessed from the upper surface of the first lead 11 by 10% or more and 50% or less of the maximum thickness of the first lead 11. As shown in FIG. 2B, it is preferable that the resin member 20 is located in the first A recess 41A and / or the first B recess 41B. As a result, the adhesion between the first lead 11 and the resin member 20 is improved. The first A recessed portion 41A is preferably covered with the first side wall 21, the second side wall 22 and the third side wall 23. By doing so, the adhesion between the first side wall 21, the third side wall 23, the fourth side wall 24, and the first lead 11 is improved. As shown in FIG. 1B, the first B recessed portion 41B is preferably located adjacent to a region on the upper surface of the first lead 11 on which the light emitting element 30 can be placed. When the upper surface of the first lead 11 has a region on which a plurality of light emitting elements can be mounted, the first B recess 41B is located adjacent to the region on which the plurality of light emitting elements can be mounted. May be good. By locating the resin member 20 in the first B recess 41B, the area of the upper surface of the first lead 11 exposed from the resin member 20 can be reduced. Thereby, even when the metal layer containing silver is formed on the outermost surface of the first lead 11, the area where the metal layer containing silver is discolored can be reduced. As a result, it is possible to suppress a decrease in the light extraction efficiency of the light emitting device. Further, when the reflectance of the resin member 20 with respect to the peak wavelength of the light emitting element is higher than the reflectance of the first lead 11, the area of the upper surface of the first lead 11 exposed from the resin member 20 becomes smaller, so that light is emitted. The light extraction efficiency of the device can be improved. When the light emitting device includes a plurality of light emitting elements having different peak wavelengths, the reflectance of the resin member 20 with respect to the peak wavelength of at least one light emitting element may be higher than the reflectance of the first lead 11. Further, it is preferable that at least a part of the outer edge of the first B recessed portion 41B overlaps with the outer edge of the first lead 11. By doing so, it becomes easy to arrange the resin member 20 in the first B recess 41B by a known method such as injection molding. Similarly, the second lead 12 may have a second A recess 42A and / or a second B recess 42B on a part of the upper surface thereof. The second A recess 42A and / or the second B recess 42B is recessed in the −Z direction. As shown in FIG. 2B, it is preferable that the resin member 20 is located in the second A recess 42A and / or the second B recess 42B. The second A recessed portion 42A is preferably covered with the first side wall 21, the second side wall 22 and the fourth side wall 24. As shown in FIG. 1B, the second B recessed portion 42B is preferably located adjacent to the region on the upper surface of the second lead 12 on which the light emitting element can be placed. It is preferable that at least a part of the outer edge of the second B recessed portion 42B overlaps with the outer edge of the second lead 12.

As shown in FIG. 2B, the first lead 11 and the second lead 12 may have a third recess 43 on the lower surface thereof. The third recessed portion 43 is recessed in the + Z direction. For example, the third recessed portion 43 is recessed from the lower surfaces of the first lead 11 and the second lead 12 by 10% or more and 50% or less of the maximum thickness of the first lead 11 and / or the second lead. The resin member 20 is located in the third recess 43. This improves the adhesion between the lead 10 and the resin member 20. In the bottom view, the third recessed portion 43 preferably overlaps with the first A convex portion 11A, the first B convex portion 11B, the second A convex portion 12A and / or the second B convex portion 12B. By doing so, the adhesion between the first A convex portion 11A, the first B convex portion 11B, the second A convex portion 12A and / or the second B convex portion 12B and the resin member 20 is improved. As shown in FIG. 1C, it is preferable that the lower surfaces of the first lead 11 and the second lead 12 are exposed from the resin member 20. As a result, electricity can be supplied from the lower surfaces of the first lead 11 and the second lead 12. The first A recess 41A, the first B recess 41B, the second A recess 42A, the second B recess 42B and / or the third recess 43 can be formed by a known method such as press working or half etching.

(Resin member 20)
The resin member 20 is a member that holds the first lead 11 and the second lead 12. The resin member 20 includes a first side wall 21, a second side wall 22, a third side wall 23, and a fourth side wall 24. The first side wall 21 and the second side wall 22 extend in the first direction and face each other. The third side wall 23 and the fourth side wall 24 extend in the second direction and face each other. The resin member 20 has a resin recess 25 defined in the first side wall 21, the second side wall 22, the third side wall 23, and the fourth side wall 24. The first side wall 21 covers the first A convex portion 11A and the second A convex portion 12A. This improves the adhesion between the resin member 20 and the first lead 11. The second side wall 22 covers the first B convex portion 11B and the second B convex portion 12B. This improves the adhesion between the resin member 20 and the second lead 12.

As the resin member 20, a known material such as a thermosetting resin or a thermoplastic resin can be used as the resin material. In the case of the thermoplastic resin, for example, polyphthalamide resin, polybutylene terephthalate (PBT), unsaturated polyester and the like can be used. In the case of a thermosetting resin, for example, an epoxy resin, a modified epoxy resin, a silicone resin, a modified silicone resin, or the like can be used. In particular, as the resin material, it is preferable to use a thermosetting resin such as an epoxy resin or a silicone resin having excellent heat resistance and light resistance.

The resin member 20 preferably contains a light-reflecting substance in the resin material. As the light-reflecting substance, it is preferable to use a member that does not easily absorb light from the light emitting element and has a large difference in refractive index with respect to the resin material. Examples of such a light-reflecting substance include titanium oxide, zinc oxide, silicon oxide, zirconium oxide, aluminum oxide, aluminum nitride and the like. These light-reflecting substances can be contained in an amount of 5% by weight or more and 90% by weight or less with respect to the resin material. Since the resin member is arranged in the recess adjacent to the element mounting area, the resin member has reflectivity to improve the efficiency of extracting light from the light emitting element mounted in the element mounting area. Can be done.

(Light emitting element 30)
The light emitting element 30 is a semiconductor element that emits light by itself when a voltage is applied, and a known semiconductor element composed of a nitride semiconductor or the like can be applied. Examples of the light emitting element include an LED chip. The light emitting device comprises at least a semiconductor layer, and in many cases further comprises an element substrate. The light emitting element has an element electrode. The element electrode can be made of gold, silver, tin, platinum, rhodium, titanium, aluminum, tungsten, palladium, nickel or an alloy thereof. As the semiconductor material, it is preferable to use a nitride semiconductor. Nitride semiconductors are mainly represented by the general formula In _x Al _y Ga _1-xy N (0 ≦ x, 0 ≦ y, x + y ≦ 1). In addition, InAlGaAs-based semiconductors, InAlGaP-based semiconductors, zinc sulfide, zinc selenide, silicon carbide and the like can also be used. The element substrate of the light emitting device is mainly a crystal growth substrate capable of growing semiconductor crystals constituting the semiconductor layer, but may be a bonding substrate for joining semiconductor layers separated from the crystal growth substrate.

The light emitting element 30 is mounted on the surface of the first lead 11, the second lead 12, and / or the resin member 20 located on the bottom surface of the resin recess 25 of the resin member 20 by a joining member. The light emitting element may be flip-chip mounted or face-up mounted. In the case of face-up mounting, the positive electrode and the negative electrode of the light emitting element 30 and the first lead 11 and the second lead 12 may be electrically connected by wires, respectively. Only one light emitting element 30 may be mounted in one light emitting device, or a plurality of light emitting elements 30 may be mounted. In this case, in order to improve the luminous intensity, a plurality of light emitting elements that emit the same light emitting color may be combined. Further, for example, the color reproducibility can be improved by combining a plurality of light emitting elements having different light emitting colors so as to correspond to RGB. When the light emitting device includes a plurality of light emitting elements, all of them may be connected in series, may be connected in parallel, or may be connected in series and in parallel.

In the light emitting device 1000 shown in FIG. 1A, all of the plurality of light emitting elements 30 are connected in series. For example, the light emitting device 1000 includes four light emitting elements 31 and a second light emitting element 32 located on the first lead, and a third light emitting element 33 and a fourth light emitting element 34 located on the second lead. It includes a light emitting element 30. One electrode of the first lead 11 and the first light emitting element 31 is connected by a wire 60. The other electrode of the first light emitting element 31 and one electrode of the second light emitting element 32 are connected by a wire. The other electrode of the second light emitting element 32 and one electrode of the third light emitting element 33 are connected by a wire. The other electrode of the third light emitting element 33 and one electrode of the fourth light emitting element 34 are connected by a wire. The other electrode of the fourth light emitting element 34 and the second lead 12 are connected by a wire. In this way, the first light emitting element 31, the second light emitting element 32, the third light emitting element 33, and the fourth light emitting element 34 are connected in series.

(Protective element 40)
The light emitting device 1000 preferably includes a protective element 40. Examples of the protection element 40 include a Zener diode, which is an element for protecting the light emitting element from static electricity and high voltage surge. The protective element 40 may be arranged in the resin recess, or may be covered with the resin member 20 as shown in FIG. 1A. By covering the protective element 40 with the resin member 20, it is possible to suppress the light from the light emitting element 30 from being absorbed by the protective element 40. This improves the light extraction efficiency of the light emitting device.

(Translucent member 50)
The light emitting device 1000 preferably includes a translucent member 50. The translucent member 50 is a member located in the resin recess 25 and covers the light emitting element 30. By covering the light emitting element 30 with the translucent member 50, the light emitting element 30 can be protected from an external force. As the material of the translucent member 50, for example, a resin can be used. As the resin that can be used for the translucent member, a thermosetting resin is preferable. Examples of the thermosetting resin include epoxy resin, modified epoxy resin, silicone resin, modified silicone resin, acrylate resin, urethane resin, fluororesin and the like. Among them, silicone resin and modified silicone resin are preferable because they are excellent in heat resistance and light resistance.

The translucent member 50 may contain a fluorescent substance. By doing so, the color adjustment of the light emitting device becomes easy. The phosphor contained in the translucent member 50 may be of one type or a plurality of types. The fluorescent material contained in the translucent member 50 may be dispersed or unevenly distributed. Known materials can be applied to the phosphor. Examples of the fluorescent substance are a fluoride-based fluorescent substance such as a KSF-based fluorescent substance, a nitride-based fluorescent substance such as CASN, a YAG-based fluorescent substance, a β-sialon fluorescent substance, and the like. The KSF-based phosphor and CASN are examples of wavelength conversion members that convert blue light into red light, and the YAG-based phosphors are examples of wavelength conversion members that convert blue light into yellow light. The β-sialon phosphor is an example of a wavelength conversion member that converts blue light into green light. The phosphor may be a quantum dot phosphor.

The light emitting device according to the embodiment of the present invention includes a backlight device for a liquid crystal display, various lighting fixtures, a large display, various display devices such as advertisements and destination guides, a projector device, a digital video camera, a facsimile, and a copier. , Can be used as an image reading device in a scanner or the like.

1000: Light emitting device 10: Lead 11: 1st lead 11A: 1st A convex part 11B: 1st B convex part 12: 2nd lead 12A: 2nd A convex part 12B: 2nd B convex part 20: Resin member 21: 1st side wall 22: 2nd side wall 23: 3rd side wall 24: 4th side wall 25: Resin recess 30: Light emitting element 40: Protective element 110: 1st main body 113: 1st recess 120: 2nd main body 123: 2nd recess

Claims (11)

The first lead and the second lead arranged side by side in the first direction,
A resin member that holds the first lead and the second lead, the first side wall and the second side wall extending in the first direction and facing each other, and extending in a second direction orthogonal to the first direction. A resin member having resin recesses defined in the third side wall and the fourth side wall facing each other, and
With at least one light emitting element arranged in the resin recess,
The first lead has a first main body portion and a first A convex portion and a first B convex portion extending from the first main body portion toward the second lead side.
The second lead has a second main body portion and a second A convex portion and a second B convex portion extending from the second main body portion toward the first lead side.
The first A convex portion and the second A convex portion are covered with the first side wall.
The first B convex portion and the second B convex portion are covered with the second side wall.
The first A convex portion is located outside the second A convex portion.
The second B convex portion is located outside the first B convex portion.
A light emitting device in which at least a part of the first A convex portion and the second B convex portion overlap in the second direction. The light emitting device according to claim 1, wherein the first B convex portion and the second A convex portion do not overlap in the second direction. The light emitting device according to claim 1 or 2, wherein at least a part of the first A convex portion and the second A convex portion overlap in the second direction. The light emitting device according to any one of claims 1 to 3, wherein at least a part of the first B convex portion and the second B convex portion overlap in the second direction. The light emitting device according to any one of claims 1 to 4, wherein at least a part of the first A convex portion and the second A convex portion overlap in the first direction. The light emitting device according to any one of claims 1 to 5, wherein at least a part of the first B convex portion and the second B convex portion overlap in the first direction. The light emitting device according to any one of claims 1 to 6, wherein the outer edge of the first A convex portion and the outer edge of the second A convex portion are parallel in a top view. The light emitting device according to claim 7, wherein the outer edge of the first A convex portion and the outer edge of the second A convex portion extend in a third direction tilted by 10 ° or more and 80 ° or less with respect to the first direction. The light emitting device according to any one of claims 1 to 8, wherein the outer edge of the first B convex portion and the outer edge of the second A convex portion are parallel in a top view. The light emitting device according to claim 9, wherein the outer edge of the first B convex portion and the outer edge of the second B convex portion extend in a fourth direction tilted by 10 ° or more and 80 ° or less with respect to the first direction. The light emitting device according to claim 8 and 10, wherein the third direction and the fourth direction are the same direction.

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