JP7189413B2 - light emitting device - Google Patents

Description

The present invention relates to light emitting devices.

For example, Patent Document 1 describes a light-emitting device having a substrate, an LED chip mounted on the substrate, a phosphor layer above the LED chip, and a dam material (covering member) surrounding the LED chip. there is

JP 2014-072213 A

An object of the present invention is to provide a light emitting device capable of improving the bonding strength between a substrate and a covering member.

A light emitting device according to an aspect of the present invention includes a substantially rectangular upper surface, a lower surface located on the opposite side of the upper surface, first long side surfaces adjacent to long sides of the upper surface and orthogonal to the upper surface, and A second long side opposite to the first long side, a first short side adjacent to the short side of the upper surface and orthogonal to the upper surface, and a second short side opposite to the first short side. and a first wiring arranged on the upper surface, and a second wiring arranged on the lower surface and electrically connected to the first wiring, the first wiring and at least one light emitting element placed on the first wiring, and a light-reflective covering member covering the side surface of the light emitting element and the upper surface of the base material. The base material has at least one first recess opening to the top surface and the first long side surface, and the surface of the recess is covered with the coating member.
Further, a light emitting device according to an aspect of the present invention includes a substantially rectangular upper surface, a lower surface located on the opposite side of the upper surface, a first long side adjacent to a long side of the upper surface and perpendicular to the upper surface, a second long side located opposite to the first long side; a first short side adjacent to the short side of the top surface and orthogonal to the top; a second long side located opposite to the first short side; a substrate having a short side surface; a first wiring arranged on the upper surface; and a second wiring arranged on the lower surface and electrically connected to the first wiring; at least one light-emitting element electrically connected to one wiring and mounted on the first wiring; and a light-reflective coating member covering the side surface of the light-emitting element and the top surface of the base material. A light-emitting device, wherein the base material includes the second recess opening to the upper surface and the first short side surface, and the surface of the second recess is covered with the covering member.
Further, a light-emitting device according to an aspect of the present invention includes a substrate having a substantially rectangular upper surface, a lower surface located on the opposite side of the upper surface, and a side surface located between the upper surface and the lower surface; a substrate provided with a first wiring arranged on an upper surface and a second wiring arranged on the lower surface and electrically connected to the first wiring; a substrate electrically connected to the first wiring; A light-emitting device comprising at least one light-emitting element mounted on one wiring, and a light-reflective covering member covering a side surface of the light-emitting element and an upper surface of the substrate, wherein the side surface A first long side adjacent to the long side of the top surface and orthogonal to the top surface, a second long side located on the opposite side of the first long side, and a short side adjacent to the top surface and orthogonal to the top surface. The substrate has a first short side surface and a second short side surface opposite to the first short side surface, and the substrate is spaced apart from the side surface and has a plurality of through holes extending from the upper surface to the lower surface. The surfaces of the plurality of through holes are covered with the covering member.

According to the light emitting device of the present invention, it is possible to provide a light emitting device capable of improving the bonding strength between the substrate and the covering member.

FIG. 1 is a schematic top view of a light emitting device according to Embodiment 1. FIG. 2 is a schematic end view taken along line 2A-2A of FIG. 1. FIG. FIG. 3 is a schematic side view of the light emitting device according to Embodiment 1 viewed from the first long side. 4A is a schematic bottom view of the light emitting device according to Embodiment 1. FIG. 4B is a schematic bottom view of a modification of the light emitting device according to Embodiment 1. FIG. 4C is a schematic bottom view of a modification of the light emitting device according to Embodiment 1. FIG. 4D is a schematic bottom view of a modification of the light emitting device according to Embodiment 1. FIG. 4E is a schematic bottom view of a modification of the light emitting device according to Embodiment 1. FIG. 4F is a schematic bottom view of a modification of the light emitting device according to Embodiment 1. FIG. FIG. 5 is a schematic side view of the light emitting device according to Embodiment 1 viewed from the second short side. 6 is a schematic top view of a substrate according to Embodiment 1. FIG. 7 is a schematic top view of a modification of the substrate according to Embodiment 1. FIG. 8A is a schematic end view of a modification of the light emitting device according to Embodiment 1. FIG. 8B is a schematic top view of a modification of the substrate according to Embodiment 1. FIG. 8C is a schematic side view of a modification of the light emitting device according to Embodiment 1 viewed from the first long side; FIG. 9A is a schematic end view of a modification of the light emitting device according to Embodiment 1. FIG. 9B is a schematic top view of a modification of the substrate according to Embodiment 1. FIG. 10A is a schematic end view of a modification of the light emitting device according to Embodiment 1. FIG. 10B is a schematic top view of a modification of the substrate according to Embodiment 1. FIG. 10C is a schematic side view of a modification of the light emitting device according to Embodiment 1 viewed from the first long side; FIG. 10D is a schematic top view of a modification of the substrate and the light emitting element according to Embodiment 1. FIG. 10E is a schematic top view of a modification of the substrate according to Embodiment 1. FIG. 10F is a schematic side view of a modification of the light emitting device according to Embodiment 1 viewed from the first long side; FIG. 11A is a schematic top view of a modification of the substrate according to Embodiment 1. FIG. 11B is a schematic side view of a modification of the light emitting device according to Embodiment 1 viewed from the first long side; FIG. 11C is a schematic side view of a modification of the light emitting device according to Embodiment 1, viewed from the second short side; FIG. 11D is a schematic top view of a modification of the substrate according to Embodiment 1. FIG. 11E is a schematic side view of a modification of the light emitting device according to Embodiment 1 viewed from the first long side; FIG. 12A is a schematic end view of a modification of the light emitting device according to Embodiment 1. FIG. 12B is a schematic top view of a modification of the substrate according to Embodiment 1. FIG. 12C is a schematic side view of a modification of the light emitting device according to Embodiment 1 viewed from the first short side; FIG. 12D is a schematic side view of a modification of the light emitting device according to Embodiment 1, viewed from the second short side; FIG. 13A is a schematic end view of a modification of the light emitting device according to Embodiment 1. FIG. 13B is a schematic top view of a modification of the substrate and the light emitting element according to Embodiment 1; FIG. 14 is a schematic top view of a light emitting device according to Embodiment 2. FIG. 15 is a schematic end view along line 12A-12A of FIG. 14; FIG. 16 is a schematic top view of a substrate according to Embodiment 2. FIG. 17A is a schematic side view of a modification of the light emitting device according to Embodiment 2 viewed from the first long side; FIG. 17B is a schematic top view of a modification of the substrate according to Embodiment 2. FIG. 18A is a schematic side view of a modification of the light emitting device according to Embodiment 2 viewed from the first long side; FIG. 18B is a schematic top view of a modification of the substrate according to Embodiment 2. FIG. 19 is a schematic top view of a substrate and a light emitting element according to Embodiment 2. FIG. 20 is a schematic top view of a light emitting device according to Embodiment 3. FIG. 21 is a schematic end view along line 18A-18A of FIG. 20; FIG. 22 is a schematic top view of a substrate according to Embodiment 3. FIG. 23 is a schematic top view of a substrate and a light emitting element according to Embodiment 3. FIG. 24 is a schematic top view of a light emitting device according to Embodiment 4. FIG. 25 is a schematic end view along line 22A-22A of FIG. 24; FIG. 26 is a schematic bottom view of a light emitting device according to Embodiment 4. FIG. 27 is a schematic top view of a substrate according to Embodiment 4. FIG. 28 is a schematic top view of a substrate and a light emitting element according to Embodiment 4. FIG. 29 is a schematic top view of a light emitting device according to Embodiment 5. FIG. 30 is a schematic end view taken along line 31A-31A of FIG. 29; FIG. 31 is a schematic side view of the light emitting device according to Embodiment 5 viewed from the first long side; FIG. FIG. 32 is a schematic side view of the light emitting device according to Embodiment 5 viewed from the second short side. 33 is a schematic top view of a substrate according to Embodiment 5. FIG. 34A is a schematic top view of a modification of the substrate according to Embodiment 5. FIG. 34B is a schematic side view of a modification of the light emitting device according to Embodiment 5 viewed from the first long side; FIG.

Hereinafter, embodiments of the invention will be described with reference to the drawings as appropriate. However, the light-emitting device described below is for embodying the technical idea of the present invention, and unless there is a specific description, the present invention is not limited to the following. Also, the sizes and positional relationships of members shown in the drawings may be exaggerated for clarity of explanation.

<Embodiment 1>
A light emitting device 1000 according to an embodiment of the present invention will be described with reference to FIGS. 1 to 13B. The light emitting device 1000 includes a substrate 10, at least one light emitting element 20, and a covering member 40. The substrate 10 includes a base material 11 , first wirings 12 and second wirings 13 . The base material 11 has a substantially rectangular upper surface 111, a lower surface 112 located on the opposite side of the upper surface, a first long side 113 adjacent to the long side 101 of the upper surface 111 and perpendicular to the upper surface 111, and the first long side. a second long side 114 located on the opposite side, a first short side 115 adjacent to the short side 102 of the top surface 111 and perpendicular to the top surface, a second short side 116 located on the opposite side of the first short side; have The substrate 11 further has at least one first recess 111R opening to the top surface 111 and the first long side 113 . The first wiring 12 is arranged on the upper surface 111 of the base material 11 . The second wiring 13 is arranged on the lower surface 112 of the base material 11 and electrically connected to the first wiring 12 . At least one light emitting element is electrically connected to the first wiring and mounted on the first wiring. The covering member 40 has light reflectivity and covers the side surface 202 of the light emitting element 20 and the upper surface 111 of the substrate. Also, the covering member 40 covers the surface of the first recess 111R. In the present specification, orthogonal means 90±5°.

By covering the surface of the first recess with the covering member, the contact area between the substrate and the covering member can be increased. Thereby, the bonding strength between the substrate and the covering member can be improved. In addition, since the first concave portion opens to the first long side surface 113, the bonding strength between the substrate and the covering member is particularly improved on the first long side surface 113 side. As a result, even if an external force is applied to the covering member from the side of the first long side surface 113, the bonding strength between the substrate and the covering member on the side of the first long side surface 113 is improved, thereby suppressing separation between the substrate and the covering member. can. Note that the first recess may be open to the bottom surface, or may be spaced apart from the bottom surface. Further, the shape of the first concave portion in a cross-sectional view is not particularly limited, and examples thereof include a substantially rectangular shape and a substantially V-shaped shape.

The number of first recesses may be one, and more preferably, there are a plurality of them. Since the contact area between the substrate and the covering member can be further increased by providing a plurality of first concave portions, the bonding strength between the substrate and the covering member can be improved. Moreover, when there are a plurality of first recesses, it is preferable that the light emitting element is positioned between the plurality of first recesses when viewed from above. By doing so, it becomes easier to improve the bonding strength between the base material and the covering member over a wide range of the upper surface of the base material.

The coefficient of linear expansion of the covering member is preferably higher than that of the substrate. By doing so, even if heat is generated when the light-emitting device is driven, the coating member covering the first concave portion has a higher coefficient of linear expansion than the base material, so that the coating member is prevented from peeling off from the first concave portion. be able to. Moreover, since the coefficient of linear expansion of the covering member is higher than that of the base material, it is possible to suppress the peeling of the covering member from the second concave portion, the third concave portion and/or the through hole, which will be described later.

As shown in FIG. 2, the covering member 40 is preferably in contact with the light emitting element 20 and positioned between the light emitting element 20 and the substrate 10 . By doing so, since the covering member 40 is sandwiched between the light emitting element and the substrate, it is possible to prevent the substrate from peeling off from the covering member.

As shown in FIG. 2, the light emitting element 20 includes at least a semiconductor laminate 23, and the semiconductor laminate 23 is provided with positive and negative electrodes 21 and 22. As shown in FIG. The positive and negative electrodes 21 and 22 are formed on the same side surface of the light emitting element 20, and the light emitting element 20 is preferably flip-chip mounted on the substrate 10. FIG. This eliminates the need for wires for supplying electricity to the positive and negative electrodes of the light-emitting element, so that the size of the light-emitting device can be reduced. Although the light emitting device 20 has the device substrate 24 in this embodiment, the device substrate 24 may be removed. When the light emitting element 20 is flip-chip mounted on the substrate 10 , the positive and negative electrodes 21 and 22 of the light emitting element are connected to the first wiring 12 via the conductive adhesive member 60 .

The light-emitting device 1000 may include a translucent member 30 . It is preferable that the translucent member 30 is positioned on the light emitting element 20 . Positioning the translucent member on the light emitting element can protect the light emitting element 20 from external stress. The covering member 40 preferably covers the side surface of the translucent member 30 . By doing so, it is possible to obtain a light-emitting device having a high contrast between the light-emitting region and the non-light-emitting region, and having good "parting property".

The light emitting element 20 has a mounting surface 203 facing the substrate 10 and a light extraction surface 201 located on the opposite side of the mounting surface. As shown in FIG. 2, when the light emitting element is flip-chip mounted, the surface on which the positive and negative electrodes 21 and 22 of the light emitting element are located is used as a mounting surface 203 and the opposite surface is used as a light extraction surface 201 . The translucent member 30 may be joined to the light emitting element 20 via the light guide member 50 . The light guide member 50 may be positioned only between the light extraction surface 201 of the light emitting element and the translucent member 30 to bond the light emitting element 20 and the covering member 40, or light may be emitted from the light extraction surface 201 of the light emitting element. The light emitting element 20 and the covering member 40 may be adhered by covering up to the side surface 202 of the element. The light guide member 50 has higher transmittance of light from the light emitting elements 20 than the covering member 40 . Therefore, since the light guide member 50 covers the side surface 202 of the light emitting element 20, the light emitted from the side surface of the light emitting element 20 can be easily extracted to the outside of the light emitting device through the light guide member 50, so that the light extraction efficiency can be improved. can be done.

The translucent member 30 may contain a wavelength conversion substance 32 . The wavelength conversion substance 32 is a member that absorbs at least part of the primary light emitted by the light emitting element 20 and emits secondary light with a wavelength different from that of the primary light. By including the wavelength conversion substance 32 in the translucent member 30, it is possible to output a mixed color light in which the primary light emitted by the light emitting element 20 and the secondary light emitted by the wavelength conversion substance 32 are mixed. For example, if a blue LED is used as the light emitting element 20 and a phosphor such as YAG is used as the wavelength conversion material 32, the blue light emitted from the blue LED is mixed with the yellow light emitted by the phosphor excited by the blue light. It is possible to construct a light-emitting device that outputs white light that is

The wavelength converting substance 32 may be uniformly dispersed in the base material 31 of the translucent member 30, or the wavelength converting substance may be unevenly distributed near the light emitting element rather than on the upper surface of the translucent member. By unevenly distributing the wavelength converting substance closer to the light emitting element than the upper surface of the translucent member, the base material 31 of the translucent member 30 can also function as a protective layer even if the wavelength converting substance 32, which is weak against moisture, is used. Therefore, deterioration of the wavelength conversion material 32 can be suppressed. Alternatively, as shown in FIG. 2, the translucent member 30 may include a layer containing the wavelength converting substance 32 and a layer 33 substantially free of the wavelength converting substance. By placing the layer 33 substantially free of the wavelength converting substance on the layer containing the wavelength converting substance 32 of the translucent member 30, the layer 33 substantially free of the wavelength converting substance can also be used as a protective layer. Since it fulfills its function, deterioration of the wavelength conversion material 32 can be suppressed. "Substantially free of wavelength converting substances" means that the wavelength converting substances that are inevitably mixed are not excluded, and the content of the wavelength converting substances is preferably 0.05% by weight or less. As the wavelength conversion material 32 that is sensitive to moisture, for example, a manganese-activated fluoride phosphor can be used. The full width at half maximum in the emission spectrum of manganese-activated fluoride-based phosphors is relatively narrow. Therefore, by using a manganese-activated fluoride-based phosphor, for example, the color reproducibility of a liquid crystal display can be enhanced.

Substrate 11 may include vias 15, as shown in FIG. The via 15 is provided in a hole penetrating from the upper surface 111 to the lower surface 112 of the base material 11 and electrically connects the first wiring and the second wiring. The via 15 includes a third wiring 151 covering the surface of the through hole of the base material and a filling member 152 filled in the third wiring 151 . Fill member 152 may be conductive or insulating. A resin material is preferably used for the filling member 152 . In general, the resin material before hardening has higher fluidity than the metal material before hardening, so that even if the inside of the third wiring 151 is narrow, it can be easily filled. Therefore, using a resin material for the filling member facilitates manufacturing of the substrate. As a resin material that can be easily filled, for example, an epoxy resin can be used. When a resin material is used as the filling member, it is preferable to contain an additive member in order to lower the coefficient of linear expansion. By doing so, the difference in linear expansion coefficient from that of the third wiring becomes small, so it is possible to suppress formation of a gap between the third wiring and the filling member due to heat from the light emitting element. Examples of the added member include silicon oxide. Moreover, when a metal material is used for the filling member 152, heat dissipation can be improved.

The first wiring 12 preferably has a first protrusion 121 protruding in the Z+ direction at a portion connected to the light emitting element. The Z+ direction on the Z axis is the direction from bottom to top, and the opposite direction to the Z+ direction is the Z− direction. The first convex portion 121 is positioned above the upper surface 111 of the base material in the Z direction. Since the first wiring has the first convex portion, for example, when the positive and negative electrodes of the light emitting element and the first convex portion of the first wiring are joined by the fusible member, the fusible member in the molten state is the first convex portion. Even if it flows from above one convex portion, since the circumference of the first convex portion is one step lower, the meltable member in the molten state tends to accumulate around the first convex portion. As a result, it is possible to prevent the fusible member from entering an unintended region, thereby suppressing a short circuit of the light emitting element. Moreover, it is preferable that at least a part of the outer shape of the first convex portion when viewed from above has a shape that matches the outer shape of the electrode of the light emitting element. By doing so, when the positive and negative electrodes of the light emitting element and the first convex portion of the first wiring are joined by the fusible member, the self-alignment effect is exerted to prevent misalignment between the light emitting element and the first wiring. can be suppressed.

The second wiring 13 preferably has a second protrusion 131 protruding in the Z-direction at a portion connected to the mounting board. Note that the mounting substrate is a substrate on which the light emitting device is mounted. The second protrusion 131 is positioned below the bottom surface 112 of the base material in the Z direction. Since the second wiring is provided with the second convex portion, for example, when the second convex portion of the second wiring and the electrode of the mounting substrate are joined by the fusible member, the fusible member in the molten state is the second convex portion. Even if it flows from the convex portion, since the circumference of the second convex portion rises by one step, the meltable member in the molten state tends to accumulate around the second convex portion. As a result, it is possible to prevent the fusible member from entering an unintended region, thereby suppressing a short circuit or the like of the light emitting device. Moreover, it is preferable that at least a part of the outer shape of the second protrusion in bottom view matches the outer shape of the electrode of the mounting substrate. By doing so, when the second convex portion and the electrode of the mounting substrate are joined by the fusible member, a self-alignment effect can be exerted to suppress positional deviation between the light emitting device and the mounting substrate. .

It is preferable that the first protrusion 121 and/or the second protrusion 131 overlap the via 15 when viewed from above. When an insulating member is used as the filling member 152 of the via 15, a conductive member is formed to cover the filling member exposed from the base material. The insulating filling member can be covered with the conductive first protrusions 121 and/or the second protrusions 131 by overlapping the first protrusions 121 and/or the second protrusions 131 with the vias. This makes it possible to make the light-emitting device thinner than when the conductive member covering the filling member and the first convex portion 121 and/or the second convex portion 131 are formed separately.

As shown in FIG. 3, a side 404 of the covering member 40 adjacent the first short side 115 and the second short side 116 of the substrate is substantially the same as the first short side 115 and the second short side 116 of the substrate 10 . They are preferably coplanar. By doing so, the width in the X direction can be shortened, so that the size of the light emitting device can be reduced.

As shown in FIG. 4A, the light emitting device 1000 may include an insulating film 18 that partially covers the second wiring 13 . By providing the insulating film 18, it is possible to ensure the insulation of the lower surface and prevent a short circuit. Moreover, it is possible to prevent the second wiring from being peeled off from the base material.

As shown in FIG. 4B, the insulating film 18 covering part of the second wiring 13 may have an insulating film recess 181 recessed in the X direction. Since the insulating film 18 has the insulating film concave portion 181, the shape of the insulating film 18 can be easily made asymmetric with respect to the center line in the X direction of the substrate. By making the shape of the insulating film 18 asymmetric with respect to the center line in the X direction of the substrate, the polarity of the light emitting device can be recognized by confirming the position of the insulating film concave portion 181 . The polarity of the light emitting device can also be recognized by the difference in the shape of the second wiring 13 exposed from the insulating film 18 . Although the insulating film recess 181 shown in FIG. 4B is located substantially in the center of the substrate in the Y direction, the insulating film recess 181 may be located at the end of the substrate in the Y direction as shown in FIG. 4C. .

As shown in FIG. 4D, the insulating film 18 covering part of the second wiring 13 may have an insulating film protrusion 182 extending in the X direction. Since the insulating film 18 has the insulating film protrusions 182, the shape of the insulating film 18 can be easily made asymmetric with respect to the center line in the X direction of the substrate. By making the shape of the insulating film 18 asymmetric with respect to the center line in the X direction of the substrate, the polarity of the light emitting device can be recognized by confirming the position of the insulating film protrusion 182 .

As shown in FIG. 4E, the second wiring 13 may have a wiring recess 132 recessed in the X direction. Since the second wiring 13 is provided with the wiring recess 132, the shape of the second wiring 13 exposed from the insulating film 18 can be easily made asymmetric with respect to the center line in the X direction of the substrate. By making the shape of the second wiring 13 exposed from the insulating film 18 asymmetric with respect to the center line in the X direction of the substrate, the polarity of the light emitting device can be recognized by confirming the position of the wiring recess 132. can. Although the wiring recess 132 shown in FIG. 4E is located substantially in the center of the substrate in the Y direction, the wiring recess 132 may be located at the end of the substrate in the Y direction as shown in FIG. 4F.

As shown in FIG. 5, side surfaces 403 of the covering member 40 adjacent to the first long side surface and the second long side surface of the substrate are preferably inclined toward the inside of the light emitting device 1000 in the Z direction. By doing so, contact between the side surface 403 of the covering member 40 and the suction nozzle (collet) is suppressed, and damage to the covering member 40 during suction of the light emitting device 1000 can be suppressed. Although the inclination angle θ of the covering member 40 can be selected as appropriate, it is preferably 0.3° or more and 3° or less, and 0.5° from the viewpoint of the ease of achieving such effects and the strength of the covering member 40. It is more preferably 0.7° or more and 1.5° or less, more preferably 0.7° or more and 1.5° or less.

As shown in FIG. 6, the first concave portion 111R preferably extends in a direction substantially parallel to the short side 102 of the upper surface 111. As shown in FIG. By doing so, it becomes easier to form the first concave portion. A well-known method can be used to form the first concave portion, and examples thereof include half dicing with a laser or blade, and etching. As will be described later, dicing may also be used when the first concave portion 111R opens to the lower surface 112 . For example, when a plurality of substrates are arranged in a matrix and a first recess is formed by using a laser and/or a blade or the like, the first recess extends in a direction substantially parallel to the short side of the upper surface. And/or by half-dicing by moving the blade in one direction, the first recess can be formed in each of the plurality of substrates. In this specification, "substantially parallel" means that a variation of about ±5° from parallel is allowed.

As shown in FIG. 7, the first recess 111R may be spaced apart from the second long side 114. As shown in FIG. By doing so, it becomes easier to reduce the area of the thin portion of the base material, so that the strength of the base material increases. Also, as shown in FIG. 6, the first recess 111R may open to the second long side surface 114 . By doing so, the contact area between the substrate and the covering member can be further increased, so that the bonding strength between the substrate and the covering member can be improved.

As shown in FIGS. 8A and 8B, the first concave portion 111R may open to the lower surface 112. As shown in FIGS. By doing so, it becomes easier to form the first concave portion. Also, as shown in FIGS. 2 and 6, the first recess 111R may be spaced apart from the bottom surface 112 . Since the first recess is spaced apart from the lower surface, the bottom surface of the first recess can also come into contact with the covering member, so that the bonding strength between the base material and the covering member can be improved. As shown in FIGS. 2 and 6, when the first recess 111R is separated from the bottom surface 112, the distance H1 from the bottom surface to the top surface of the first recess in the Z direction is the thickness of the base material 11 in the Z direction. 0.3 to 0.7 times H2 is preferred. If the thickness H1 from the bottom surface to the bottom surface of the first recess in the Z direction is shorter than 0.3 times the thickness H2 of the base material 11 in the Z direction, it becomes difficult to increase the contact area between the base material and the covering member. If the distance H1 from the bottom surface to the top surface of the first recess in the Z direction is longer than 0.7 times the thickness H2 of the base material 11 in the Z direction, the thickness of the base material 11 in the Z direction is thin in the first recess part. As a result, the strength of the base material 11 may decrease.

Further, as shown in FIG. 8C, when the thickness of the base material is large, the thickness H1 from the bottom surface to the bottom surface of the first concave portion in the Z direction is 0.2 to 0.2 times the thickness H2 of the base material 11 in the Z direction. It may be 0.8 times. When the base material is thick, the thickness H1 from the bottom surface to the bottom surface of the first recess in the Z direction is 0.2 times or more the thickness H2 of the base material 11 in the Z direction, so that the base material and the covering member It becomes easier to increase the contact area with Further, when the thickness of the base material is large, the thickness H1 from the bottom surface to the bottom surface of the first recess in the Z direction is 0.8 times or less than the thickness H2 of the base material 11 in the Z direction. strength reduction can be suppressed. In this specification, the term "thickness of the substrate" means that the thickness of the substrate is 0.2 mm or more.

As shown in FIGS. 9A and 9B, the first recess 111R may open to the first short side 115. As shown in FIGS. By doing so, the length of the base material in the X direction can be easily shortened, and the size of the light emitting device can be easily reduced. In addition, the second concave portion, which will be described later, is a concave portion that opens to the upper surface and the first short side surface of the base material. Therefore, the recesses that are open to the top surface, the first long side surface, and the first short side surface shown in FIG. 9B are both the first recesses and the second recesses. Further, a fourth concave portion, which will be described later, is a concave portion that opens to the upper surface and the second long side surface of the base material. Therefore, the recesses that open to the top surface, the first long side surface, and the second long side surface shown in FIG. 9B are both the first recess and the fourth recess. The recess opening to the top surface, the first long side surface, the second long side surface, and the first short side surface is the first recess, the second recess, and the fourth recess. Also, as shown in FIGS. 2 and 6, the first recess 111R may be spaced apart from the first short side surface 115 . The first concave portion 111R is spaced apart from the first short side surface 115 to increase the contact area between the base material and the covering member. Thereby, the bonding strength between the substrate and the covering member can be improved.

It is preferable that the first concave portion is spaced apart from the light emitting element when viewed from above. At the location where the first concave portion is located, the thickness (Z direction) of the base material is thin, or the base material is open from the top surface to the bottom surface, so the base material is easily deformed due to thermal expansion of the coating resin or the like. By separating the first concave portion from the light emitting element, it is possible to reduce the force applied to the light emitting element due to the deformation of the base material.

As shown in FIGS. 10A to 10D, the first recess 111R opens to the second long side 114 and the first short side 115, and the width of the first recess 111R is different in the X direction, for example, the width is wide. It may also have regions or narrower regions. In addition, it may have regions with gradually varying widths. For example, the width W2 in the X direction of the first recess 111R at the position where it opens to the first long side surface 113 of the substrate is longer than the width W1 in the X direction of the first recess 111R positioned substantially in the Y direction of the substrate. is preferred. By doing so, it is possible to further increase the contact area between the substrate and the covering member, thereby improving the bonding strength between the substrate and the covering member.

As shown in FIGS. 10B and 10D, it is preferable that the first wiring 12 has a wiring extending portion 123 extending in the X direction when viewed from above. As shown in FIG. 10D, the wiring extending portion 123 is formed extending in the X+ direction and/or the X− direction from the position where the light emitting element is to be placed when viewed from the top, so that the light emitting element can be mounted on the substrate. When placing, the wiring extension part 123 can be used as a mark. The X+ direction on the X axis is the direction from left to right when viewed from above, and the opposite direction to the X+ direction is the X− direction. This makes it easier to mount the light emitting element on the substrate. The first wiring 12 may have only one wiring extending portion 123 , and preferably has a plurality of wiring extending portions 123 . Moreover, when a plurality of wiring extending portions 123 are provided, it is preferable that the wiring extending portions 123 are positioned on both sides of the light emitting element 20 in the X direction. By doing so, since the wiring extending portions 123 positioned on both sides of the light emitting element 20 can be used as marks, the positional accuracy of mounting the light emitting element on the substrate is improved. Also, when the light-transmitting member is placed on the light-emitting element, the wiring extending portion is formed to extend from the position where the light-transmitting member is to be placed when viewed from the top. When the translucent member is placed on the substrate, the wiring extending portion can be used as a mark. This facilitates placing the translucent member on the light emitting element. Further, the width W2 in the X direction of the first recess 111R at the position where it opens to the first long side surface 113 of the substrate is longer than the width W1 in the X direction of the first recess 111R positioned substantially in the Y direction of the substrate. This makes it easier to secure a space for forming the wiring extending portion 123 that is located in the center of the substrate in the Y direction and extends in the X direction.

Also, as shown in FIG. 10E, the first wiring 12 may have a wiring extending portion 123 extending to the first long side 113 and/or the second long side 114 of the substrate. When the first wiring 12 has wiring extensions 123 extending to the first long side 113 and/or the second long side 114 of the substrate, as shown in FIG. 10F, the first long side and/or In the side surface of the light emitting device viewed from the second long side surface, it is preferable that the wiring extending portion 123 exposed from the covering member be asymmetric with respect to the center line in the X direction of the substrate. By doing so, the polarity of the light-emitting device can be recognized by confirming the position and/or size of the wiring extending portion 123 exposed from the covering member.

As shown in FIGS. 11A to 11C, the base material 11 may have at least one fourth recess 115R that opens to the top surface 111 and the second long side surface 114. As shown in FIGS. Also, the fourth recess 115R may open to the first short side surface 115 in the same manner as the first recess 111R. Since the base material has the fourth concave portion 115R, the contact area between the base material and the covering member can be further increased, thereby improving the bonding strength between the base material and the covering member. It is preferable that the first concave portion 111R and the fourth concave portion 115R are symmetrical about the center line in the X direction of the substrate. When forming the first recesses and the fourth recesses on an aggregate substrate in which a plurality of substrates are arranged in a matrix by using a laser and/or a blade or the like, the first recesses and the fourth recesses of adjacent substrates may be formed at the same time. This makes manufacturing easier. Also, the width in the X direction of the first recess 111R and/or the fourth recess 115R may be constant or may vary. By providing regions with different widths in the X direction in the first recess 111R and/or the fourth recess 115R, the contact area between the base material and the covering member can be further increased, so the bonding strength between the base material and the covering member improve.

Also, as shown in FIG. 11D, the first wiring 12 may have a wiring extending portion 123 extending to the first long side 113 and/or the second long side 114 of the substrate. When the first wiring 12 has wiring extensions 123 extending to the first long side 113 and/or the second long side 114 of the substrate, as shown in FIG. In the side surface of the light emitting device viewed from the second long side surface, it is preferable that the wiring extending portion 123 exposed from the covering member be asymmetric with respect to the center line in the X direction of the substrate. By doing so, the polarity of the light-emitting device can be recognized by confirming the position and/or size of the wiring extending portion 123 exposed from the covering member.

Both ends of the substrate in the X direction may be provided with first recesses, respectively, and the shape of the first recesses located on the X+ side may be different from the shape of the first recesses located on the X− side. When viewed from above, the right side on the X axis from the center of the light emitting device is the X+ side, and the left side is the X− side. For example, as shown in FIGS. 12A to 12D, the first recess 111R located on the X− side opens to the first short side 115 and opens to the second long side 114 . The first recess 111R′ located on the X+ side opens to the second short side 116 but is separated from the second long side 114 . In this way, the sides 404 of the covering member 40 adjacent to the first short side 115 and the second short side 116 of the substrate are substantially the same as the first short side 115 and the second short side 116 of the substrate 10 . When they are on the same plane, as shown in FIGS. 12C and 12D, the shape of the side surface of the light emitting device viewed from the first short side is different from the shape of the side surface of the light emitting device viewed from the second short side. Accordingly, the polarity of the light-emitting device can be recognized by checking the side of the light-emitting device viewed from the first short side and/or the side of the light-emitting device viewed from the second short side.

The light-emitting device may include a plurality of light-emitting elements 20 as shown in FIGS. 13A and 13B. When the light-emitting device includes a plurality of light-emitting elements, the plurality of light-emitting elements are preferably arranged side by side in the X direction. By doing so, the width of the light emitting device in the Y direction can be shortened, so that the thickness of the light emitting device can be reduced. The number of light emitting elements may be three or more or one. The first concave portion 111R may be provided between the multiple light emitting elements 20 . By doing so, it is possible to improve the bonding strength between the base material and the covering member between the light emitting elements.

<Embodiment 2>
A light-emitting device 2000 according to Embodiment 2 of the present invention shown in FIGS. 14 to 19 is different from the light-emitting device 1000 according to Embodiment 1 in that the substrate has a second concave portion. Other points are the same as those of the light emitting device 1000 .

A light-emitting device 2000 includes a substrate 10 , at least one light-emitting element 20 , and a covering member 40 . The substrate 10 includes a base material 11 , first wirings 12 and second wirings 13 . The base material 11 has a substantially rectangular upper surface 111, a lower surface 112 opposite to the upper surface, a first long side 113 adjacent to the long side 101 of the upper surface 111 and perpendicular to the upper surface, and an opposite side of the first long side. a second long side 114 located on the side, a first short side 115 adjacent to the short side 102 of the top surface 111 and orthogonal to the top surface, and a second short side 116 located on the opposite side of the first short side. have. The substrate 11 further has at least one second recess 112R that opens to the top surface 111 and the first short side 115 . The first wiring 12 is arranged on the upper surface 111 of the base material 11 . The second wiring 13 is arranged on the lower surface 112 of the base material 11 and electrically connected to the first wiring 12 . At least one light emitting element is electrically connected to the first wiring and mounted on the first wiring. The covering member 40 has light reflectivity and covers the side surface 202 of the light emitting element 20 and the upper surface 111 of the substrate. Also, the covering member 40 covers the surface of the second recess 112R.

By coating the surface of the second recess with the coating member, the contact area between the substrate and the coating member can be increased. Thereby, the bonding strength between the substrate and the covering member can be improved. In addition, since the second concave portion opens to the first short side surface 115, the bonding strength between the substrate and the covering member is particularly improved on the first short side surface 115 side. As a result, even if an external force is applied to the covering member from the side of the first short side surface 115, the bonding strength between the substrate and the covering member on the side of the first short side surface 115 is improved, so that the substrate and the covering member are prevented from peeling off. can be suppressed. In addition, the second concave portion may be open to the bottom surface, or may be spaced apart from the bottom surface. Moreover, the shape of the second concave portion in a cross-sectional view is not particularly limited, and examples thereof include a substantially rectangular shape and a substantially V-shaped shape.

The number of the second recesses may be one, and it is preferable that there are a plurality of the second recesses. Since the contact area between the substrate and the covering member can be further increased by providing the plurality of second concave portions, the bonding strength between the substrate and the covering member can be improved. Moreover, when there are a plurality of second recesses, it is preferable that the light-emitting element is positioned between the plurality of second recesses when viewed from above. By doing so, it becomes easier to improve the bonding strength between the base material and the covering member over a wide range of the upper surface of the base material.

As shown in FIG. 16, the second concave portion 112R preferably extends in a direction substantially parallel to the long side 101 of the upper surface 111. As shown in FIG. By doing so, the formation of the second concave portion is facilitated. A well-known method can be used to form the second recesses, similarly to the formation of the first recesses. For example, in the case of forming the second recesses by using a laser or the like on a collective substrate in which a plurality of substrates are arranged in a matrix, the second recesses extend in a direction substantially parallel to the long side of the upper surface, so that the laser is directed in one direction. By moving and half-dicing, the second recesses can be formed in each of the adjacent substrates.

As shown in FIGS. 17A and 17B, the second recess 112R may open to the first long side 113 and/or the second long side 114. As shown in FIGS. By doing so, the bonding strength between the substrate and the covering member is particularly improved on the first long side surface 113 and/or the second long side surface 114 side. As a result, even if an external force is applied to the covering member from the first long side surface 113 and/or the second long side surface 114 side, the bonding strength between the substrate and the covering member on the first long side surface 113 and/or the second long side surface 114 side is high. Since it is improved, it can suppress that a base material and a coating member peel. Also, as shown in FIG. 16, the second recess 112R may be spaced apart from the first long side surface 113 and the second long side surface 114. As shown in FIG. By separating the second concave portion 112R from the first long side surface 113 and the second long side surface 114, the contact area between the base material and the covering member can be increased. Thereby, the bonding strength between the substrate and the covering member can be improved.

As shown in FIGS. 18A and 18B, the second recess 112R may open to the bottom surface 112. As shown in FIGS. By doing so, the formation of the second concave portion is facilitated. Also, as shown in FIG. 15, the second recess 112R may be spaced apart from the bottom surface 112 . Since the second recess is spaced apart from the lower surface, the bottom surface of the second recess can also contact the covering member, so that the bonding strength between the base material and the covering member can be improved. As shown in FIG. 15, when the second recess 112R is separated from the bottom surface 112, the distance H3 from the bottom surface to the top surface of the second recess in the Z direction is 0% of the thickness H2 of the base material 11 in the Z direction. 0.3 times to 0.7 times is preferred. If the distance H3 from the bottom surface to the top surface of the second recess in the Z direction is shorter than 0.3 times the thickness H2 of the base material 11 in the Z direction, it becomes difficult to increase the contact area between the base material and the covering member. If the distance H3 from the bottom surface to the top surface of the second recess in the Z direction is longer than 0.7 times the thickness H2 of the base material 11 in the Z direction, the thickness of the base material 11 in the Z direction in the second recess part is thin. As a result, the strength of the base material 11 may decrease.

As shown in FIG. 19, it is preferable that the second concave portion 112R is spaced apart from the light emitting element 20 when viewed from above. At the locations where the second concave portions are located, the thickness of the substrate (in the Z direction) is reduced, or the substrate is open from the top surface to the bottom surface. When viewed from above, the force applied to the light emitting element due to the deformation of the base material can be reduced by separating the second concave portion from the light emitting element.

<Embodiment 3>
A light-emitting device 3000 according to Embodiment 3 of the present invention shown in FIGS. The difference is that the covering member covers. Other points are the same as those of the light emitting device 1000 .

The light emitting device 3000 includes a substrate 10, at least one light emitting element 20, and a covering member 40. The substrate 10 includes a base material 11 , first wirings 12 and second wirings 13 . The substrate 11 has a substantially rectangular upper surface 111 , a lower surface 112 located opposite the upper surface 111 , and side surfaces located between the upper surface 111 and the lower surface 112 . The substrate is further provided with a plurality of through holes 113R that are separated from the side surface of the substrate and reach from the upper surface to the lower surface of the substrate. The first wiring 12 is arranged on the upper surface 111 of the base material 11 . The second wiring 13 is arranged on the lower surface 112 of the base material 11 and electrically connected to the first wiring 12 . At least one light emitting element is electrically connected to the first wiring and mounted on the first wiring. The covering member 40 has light reflectivity and covers the side surface 202 of the light emitting element 20 and the upper surface 111 of the substrate. Also, the covering member 40 covers the surfaces of the plurality of through holes. The side surfaces of the substrate 11 are a first long side surface 113 adjacent to the long side 101 of the top surface 111 and orthogonal to the top surface 111, a second long side surface 114 located on the opposite side of the first long side surface 113, and a top surface. It has a first short side 115 adjacent to the short side 102 of 111 and orthogonal to the top surface, and a second short side 116 located on the opposite side of the first short side 115 .

By covering the surface of the through-hole with the covering member, the contact area between the substrate and the covering member can be increased. Thereby, the bonding strength between the substrate and the covering member can be improved. Moreover, the shape of the through-hole in a top view is not particularly limited, and examples thereof include a circular shape, a polygonal shape such as a triangular shape, a square shape, and the like.

The through-hole 113R is preferably located substantially in the center of the base material in the Y direction. By doing so, even if external force is applied to the covering member from the first long side surface 113 side or from the second long side surface 114 side, peeling of the base material and the covering member is suppressed. easier to do. A known method can be used to form the through-holes, for example, a laser or a drill can be used.

As shown in FIG. 23, the through hole 113R is preferably spaced apart from the light emitting element 20 when viewed from above. Locations where the through holes are located are likely to be deformed due to thermal expansion of the coating resin or the like. By separating the through hole from the light emitting element, the force applied to the light emitting element due to the deformation of the base material can be reduced. In addition, it is preferable that the light emitting element is positioned between the plurality of through holes when viewed from above. By doing so, it is possible to improve the bonding strength between the substrate and the covering member on both sides of the light emitting element in the X direction.

When the light emitting device 3000 includes a plurality of light emitting elements, through holes may be positioned between the light emitting elements. By doing so, it is possible to improve the bonding strength between the covering member positioned between the light emitting elements and the substrate.

<Embodiment 4>
A light-emitting device 4000 according to Embodiment 4 of the present invention shown in FIGS. 24 to 28 differs from the light-emitting device 3000 according to Embodiment 3 in that the base material has a third concave portion. Other points are the same as those of the light emitting device 3000 .

In light-emitting device 4000 , base material 11 has third concave portion 114</b>R that opens to bottom surface 112 . When viewed from above, the third recess 114R overlaps the through hole 113R, and the surface of the third recess 114R is covered with the covering member 40. As shown in FIG. By doing so, the inner surface of the third recess 114R and the covering member come into contact with each other, so that the bonding strength between the base material and the covering member can be further improved. Moreover, the shape of the third recess in a cross-sectional view is not particularly limited, and examples thereof include a substantially rectangular shape and a substantially V-shaped shape.

It is preferable that the area of the third recess 114R is larger than that of the through hole 113R when viewed from above. By doing so, the covering member 40 positioned inside the third recess 114R can be made larger than the covering member 40 positioned inside the through hole 113R in top view, so that the covering member is separated from the base material. become difficult. Therefore, the bonding strength between the substrate and the covering member is further improved.

When viewed from above, it is preferable that the third recess 114R be separated from the light emitting element. At the place where the third concave portion 114R is located, the thickness (Z direction) of the base material is thin, or the base material is open from the upper surface to the lower surface, so it is likely to be deformed due to thermal expansion of the coating resin or the like. By separating the third concave portion from the light emitting element, it is possible to reduce the force applied to the light emitting element due to the deformation of the base material.

The third recess 114</b>R may open to the first long side 113 and/or the second long side 114 . By doing so, it is possible to further increase the contact area between the substrate and the covering member, thereby improving the bonding strength between the substrate and the covering member. In addition, the 3rd recessed part may be opened to the 1st short side and the 2nd short side.

The third recessed portion 114R preferably extends in a direction substantially parallel to the short side 102 of the upper surface 111 . By doing so, for example, it becomes easy to form the third concave portion 114R on a collective substrate in which a plurality of substrates are arranged in a matrix by using a laser or the like.

<Embodiment 5>
A light-emitting device 5000 according to Embodiment 5 of the present invention shown in FIGS. 29 to 33 is different from the light-emitting device 1000 according to Embodiment 1 in that the substrate has a second concave portion and a fourth concave portion. Other points are the same as those of the light emitting device 1000 .

Since the base material 11 is provided with the first recess 111R, the second recess 112R, and the fourth recess 115R, the contact area between the base material and the covering member can be further increased, thereby improving the bonding strength between the base material and the covering member. do.

The substrate of the light emitting device may have a plurality of first recesses, second recesses, third recesses, fourth recesses and/or through holes. By providing the base material of the light-emitting device with the first concave portion, the second concave portion, the third concave portion, the fourth concave portion and/or the through hole, the bonding strength between the base material and the covering member is improved.

Further, as shown in FIG. 34A, the first wiring 12 may have a wiring extending portion 123 extending to the first long side 113 and/or the second long side 114 of the substrate. When the first wiring 12 has wiring extensions 123 extending to the first long side 113 and/or the second long side 114 of the substrate, as shown in FIG. In the side surface of the light emitting device viewed from the second long side surface, it is preferable that the wiring extending portion 123 exposed from the covering member be asymmetric with respect to the center line in the X direction of the substrate. By doing so, the polarity of the light-emitting device can be recognized by confirming the position and/or size of the wiring extending portion 123 exposed from the covering member.

Each component in the light-emitting device according to one embodiment of the present invention will be described below.

(Substrate 10)
The substrate 10 is a member on which the light emitting element is placed. The substrate 10 is composed of at least a base material 11 , first wirings 12 and second wirings 13 . Further, the substrate 10 may include vias 15 that electrically connect the first wiring 12 and the second wiring 13 .

(Base material 11)
The base material 11 can be configured using an insulating member such as resin or fiber-reinforced resin, ceramics, or glass. Examples of resins or fiber-reinforced resins include epoxy, glass epoxy, bismaleimide triazine (BT), and polyimide. Examples of ceramics include aluminum oxide, aluminum nitride, zirconium oxide, zirconium nitride, titanium oxide, titanium nitride, and mixtures thereof. Among these base materials, it is particularly preferable to use a base material having physical properties close to the coefficient of linear expansion of the first light emitting element. Although the lower limit of the thickness of the base material can be selected as appropriate, it is preferably 0.05 mm or more, more preferably 0.1 mm or more, from the viewpoint of the strength of the base material. Also, the upper limit of the thickness of the substrate is preferably 0.5 mm or less, more preferably 0.4 mm or less, from the viewpoint of the thickness of the light emitting device.

(First wiring 12, second wiring 13)
The first wiring is arranged on the upper surface of the base material and electrically connected to the light emitting element. The second wiring is arranged on the lower surface of the base material and electrically connected to the first wiring. The first wiring and the second wiring can be made of copper, iron, nickel, tungsten, chromium, aluminum, silver, gold, titanium, palladium, rhodium, or alloys thereof. A single layer or multiple layers of these metals or alloys may be used. In particular, copper or a copper alloy is preferable from the viewpoint of heat dissipation. In addition, from the viewpoint of wettability and/or light reflectivity of the conductive adhesive member, a layer of silver, platinum, aluminum, rhodium, gold, or an alloy thereof is formed on the surface layer of the first wiring and/or the second wiring. may be provided.

(Via 15)
The via 15 is provided in a hole penetrating the upper surface and the lower surface of the base material 11, and is a member that electrically connects the first wiring and the second wiring. The via 15 is composed of a third wiring 151 covering the surface of the through-hole of the base material, and a filling member 152 filling the inside 151 of the third wiring. A conductive member similar to the first wiring and the second wiring can be used for the third wiring 151 . A conductive member or an insulating member may be used for the filling member 152 .

(insulating film 18)
The insulating film 18 is a member that ensures insulation on the lower surface and prevents short circuits. The insulating film may be formed of any material used in the relevant field. For example, thermosetting resins or thermoplastic resins may be used.

(Light emitting element 20)
The light emitting element 20 is a semiconductor element that emits light by itself when a voltage is applied, and a known semiconductor element made of a nitride semiconductor or the like can be applied. Examples of the light emitting element 20 include an LED chip. The light emitting device 20 comprises at least a semiconductor stack 23 and often further comprises a device substrate 24 . The top view shape of the light emitting element is preferably a rectangle, particularly a square shape or a rectangular shape elongated in one direction, but may be another shape, such as a hexagonal shape, which can increase the luminous efficiency. The side surface of the light emitting element may be perpendicular to the top surface, or may be inclined inward or outward. In addition, the light emitting element has positive and negative electrodes. The positive and negative electrodes can be composed of gold, silver, tin, platinum, rhodium, titanium, aluminum, tungsten, palladium, nickel, or alloys thereof. The emission peak wavelength of the light emitting element can be selected from the ultraviolet region to the infrared region depending on the semiconductor material and its mixed crystal ratio. As the semiconductor material, it is preferable to use a nitride semiconductor, which is a material capable of emitting short-wavelength light that can efficiently excite the wavelength conversion substance. Nitride semiconductors are mainly represented by the general formula InxAlyGa1 _-xyN (0≤x, _0≤y , _x +y≤1). The emission peak wavelength of the light emitting element is preferably 400 nm or more and 530 nm or less, more preferably 420 nm or more and 490 nm or less, and more preferably 450 nm or more and 475 nm or less, from the viewpoint of luminous efficiency, excitation of the wavelength conversion substance, color mixing relationship with light emission, and the like. more preferred. In addition, InAlGaAs-based semiconductors, InAlGaP-based semiconductors, zinc sulfide, zinc selenide, silicon carbide, and the like can also be used. The element substrate of the light emitting element is mainly a crystal growth substrate on which semiconductor crystals constituting the semiconductor laminate can be grown, but it may be a bonding substrate that is separated from the crystal growth substrate and bonded to the semiconductor element structure. . Since the element substrate has translucency, it is easy to employ flip-chip mounting, and it is easy to increase the light extraction efficiency. Base materials for the element substrate include sapphire, gallium nitride, aluminum nitride, silicon, silicon carbide, gallium arsenide, gallium phosphide, indium phosphide, zinc sulfide, zinc oxide, zinc selenide, and diamond. Among them, sapphire is preferred. The thickness of the element substrate can be selected as appropriate, and is, for example, 0.02 mm or more and 1 mm or less, and from the viewpoint of the strength of the element substrate and/or the thickness of the light emitting device, it is preferably 0.05 mm or more and 0.3 mm or less. .

(translucent member 30)
The translucent member is a member provided on the light emitting element to protect the light emitting element. The translucent member is composed of at least the following base material. Moreover, the translucent member can function as a wavelength conversion substance by containing the following wavelength conversion substance 32 in the base material. Even when the translucent member has a layer containing a wavelength converting substance and a layer containing substantially no wavelength converting substance, the base material of each layer is configured as follows. The base material of each layer may be the same or different. However, it is not essential that the translucent member has a wavelength converting substance. Also, the translucent member may be a sintered body of a wavelength converting substance and an inorganic substance such as alumina, or a plate crystal of a wavelength converting substance.

(Base material 31 of translucent member)
The base material 31 of the translucent member may be any material as long as it has translucency to the light emitted from the light emitting element. The term “translucent” means that the light transmittance at the emission peak wavelength of the light emitting element is preferably 60% or more, more preferably 70% or more, and even more preferably 80% or more. Say things. As the base material of the translucent member, silicone resin, epoxy resin, phenol resin, polycarbonate resin, acrylic resin, or modified resins thereof can be used. Glass may be used. Among them, silicone resins and modified silicone resins are preferable because of their excellent heat resistance and light resistance. Specific silicone resins include dimethylsilicone resin, phenyl-methylsilicone resin, and diphenylsilicone resin. The light-transmitting member can be composed of a single layer of one of these base materials, or a laminate of two or more of these base materials. In addition, the "modified resin" in this specification shall include a hybrid resin.

The base material of the translucent member may contain various fillers in the above resin or glass. This filler includes silicon oxide, aluminum oxide, zirconium oxide, zinc oxide and the like. One of these fillers can be used alone, or two or more of these can be used in combination. Silicon oxide, which has a small coefficient of thermal expansion, is particularly preferred. Moreover, by using nanoparticles as a filler, it is possible to increase the scattering of light emitted from the light emitting element and reduce the amount of the wavelength conversion substance used. Note that nanoparticles are particles with a particle size of 1 nm or more and 100 nm or less. Also, the "particle size" in this specification is defined by, for example, _D50 .

(Wavelength conversion substance 32)
The wavelength conversion material absorbs at least part of the primary light emitted by the light emitting element and emits secondary light with a wavelength different from that of the primary light. As the wavelength conversion substance, one of the specific examples shown below can be used alone, or two or more of them can be used in combination.

Yttrium-aluminum-garnet-based phosphors (e.g., Y3 ₍ Al, Ga) _5O12 :Ce) and lutetium-aluminum-garnet-based phosphors (e.g., _{Lu3 (} Al, Ga)) can be used as wavelength conversion materials that emit green light. _5O12 :Ce), terbium-aluminum-garnet-based phosphors (e.g., Tb3 ₍ Al, Ga) _5O12 :Ce)-based phosphors, silicate _- based phosphors ₍ e.g., ₍ Ba, Sr) _2SiO4 :Eu ), chlorosilicate-based phosphors (e.g., _Ca8Mg (SiO4) _4Cl2 :Eu), β _- sialon-based phosphors (e.g., Si6- _{zAlzOzN8-z : Eu} (0< _z < ₄ .2)), SGS-based phosphors (for example, SrGa ₂ S ₄ :Eu), and the like. As a wavelength conversion material for yellow light emission, an α-sialon phosphor (for example, M _z (Si, Al) ₁₂ (O, N) ₁₆ (where 0<z≦2, M is Li, Mg, Ca, Y , and lanthanide elements excluding La and Ce), etc. In addition, among the wavelength conversion substances that emit green light, there are wavelength conversion substances that emit yellow light.For example, yttrium-aluminum-garnet-based phosphors include , Y can be shifted to the long wavelength side by substituting a part of Y with Gd, and yellow light emission is possible.In addition, among these, there are also wavelength conversion substances capable of orange light emission. Examples of wavelength conversion substances that emit red light include nitrogen-containing calcium aluminosilicate (CASN or SCASN)-based phosphors (eg, (Sr, Ca)AlSiN ₃ :Eu), etc. In addition, manganese-activated fluoride-based phosphors are listed. is a phosphor represented by the general formula (I) A ₂ [M _{1-a Mna} F ₆ ] (wherein A is K, Li, Na, Rb, Cs and NH ₄ , M is at least one element selected from the group consisting of Group 4 elements and Group 14 elements, and a is 0<a<0.2 A representative example of the manganese-activated fluoride-based phosphor is a manganese-activated potassium fluorosilicate phosphor (for example, K ₂ SiF ₆ :Mn).

(Coating member 40)
From the viewpoint of upward light extraction efficiency, the light-reflecting coating member preferably has a light reflectance of 70% or more, more preferably 80% or more, at the peak emission wavelength of the light-emitting element. % or more is even more preferable. Furthermore, the covering member is preferably white. Therefore, the covering member preferably contains a white pigment in the base material. The covering member goes through a liquid state before curing. The covering member can be formed by transfer molding, injection molding, compression molding, potting, or the like.

(Base material of covering member)
Resins can be used for the base material of the covering member, and examples thereof include silicone resins, epoxy resins, phenol resins, polycarbonate resins, acrylic resins, and modified resins thereof. Among them, silicone resins and modified silicone resins are preferable because of their excellent heat resistance and light resistance. Specific silicone resins include dimethylsilicone resin, phenyl-methylsilicone resin, and diphenylsilicone resin. Also, the base material of the covering member may contain the same filler as that of the translucent member described above.

(white pigment)
White pigments include titanium oxide, zinc oxide, magnesium oxide, magnesium carbonate, magnesium hydroxide, calcium carbonate, calcium hydroxide, calcium silicate, magnesium silicate, barium titanate, barium sulfate, aluminum hydroxide, aluminum oxide, zirconium oxide, One type of silicon oxide can be used alone, or two or more types thereof can be used in combination. The shape of the white pigment can be selected as appropriate, and may be amorphous or pulverized, and is preferably spherical from the viewpoint of fluidity. The particle size of the white pigment is, for example, approximately 0.1 μm or more and 0.5 μm or less. The content of the white pigment in the light-reflecting coating member can be selected as appropriate, but from the viewpoint of light reflectivity and viscosity in the liquid state, for example, 10 wt% or more and 80 wt% or less is preferable, and 20 wt% or more and 70 wt% or less is preferable. More preferably, 30 wt % or more and 60 wt % or less is even more preferable. It should be noted that "wt%" is percent by weight and represents the ratio of the weight of the material to the total weight of the light-reflective covering member.

(Light guide member 50)
The light guide member is a member that adheres the light emitting element and the translucent member and guides the light from the light emitting element to the translucent member. Examples of the base material of the light guide member include silicone resins, epoxy resins, phenol resins, polycarbonate resins, acrylic resins, and modified resins thereof. Among them, silicone resins and modified silicone resins are preferable because of their excellent heat resistance and light resistance. Specific silicone resins include dimethylsilicone resin, phenyl-methylsilicone resin, and diphenylsilicone resin. Moreover, the base material of the light guide member may contain the same filler as the translucent member described above. Also, the light guide member can be omitted.

(Conductive adhesive member 60)
The conductive adhesive member is a member that electrically connects the electrode of the light emitting element and the first wiring. Examples of conductive adhesive members include bumps of gold, silver, copper, etc., metal pastes containing metal powders of silver, gold, copper, platinum, aluminum, palladium, etc. and resin binders, tin-bismuth-based, tin-copper-based, tin - Any one of silver-based solder, gold-tin-based solder, and brazing material such as a low-melting-point metal can be used.

Light-emitting devices according to one embodiment of the present invention include backlight devices for liquid crystal displays, various lighting fixtures, large displays, various display devices for advertisements and destination information, projector devices, digital video cameras, facsimiles, and copiers. , an image reading device such as a scanner.

1000, 2000, 3000, 4000 light emitting device 10 substrate 11 base material 12 first wiring 13 second wiring 15 via
151 third wiring
152 Filling Member 18 Insulating Film 20 Light Emitting Element 30 Translucent Member 40 Coating Member 50 Light Guide Member 60 Conductive Adhesive Member

Claims (11)

a substrate including a substrate having at least one first recess, a first wiring, and a second wiring electrically connected to the first wiring;
at least one light emitting element placed on the first wiring and electrically connected to the first wiring;
a light-reflective covering member;
with
The base material is
a substantially rectangular upper surface;
a lower surface located opposite the upper surface;
a first long side adjacent to the long side of the top surface and perpendicular to the top surface;
a second long side opposite the first long side;
a first short side adjacent to the short side of the top surface and perpendicular to the top surface;
a second short side opposite to the first short side;
has
The first wiring is arranged on the upper surface,
The second wiring is arranged on the lower surface,
The covering member covers the side surface of the light emitting element and the upper surface of the base material,
The at least one first recess has the top surface and the first long side surface., said second long sideand is open to the first short side,And,
a first portion opening on the first long side;
a second portion opening on the second long side;
a third portion opening on the first short side;
including
In a first direction parallel to the long side of the substantially rectangular shape, the width of the first portion and the width of the second portion are larger than the width of the third portion,
the first wiring has a wiring extending portion extending toward the first recess in the first direction;
When viewed from above, the wiring extending portion includes a portion that does not overlap with the light emitting element, and is positioned between the first portion and the second portion in a second direction orthogonal to the first direction. including the part to
The light-emitting device, wherein the surface of the first recess is covered with the covering member. 2. The light emitting device according to claim 1 , wherein said first recess is open to said lower surface. 3. The light emitting device according to claim 1, wherein said first concave portion is separated from said light emitting element when viewed from above. the at least one first recess comprises a plurality of first recesses;
The light emitting device according to any one of claims 1 to 3 , wherein the light emitting element is positioned between the plurality of first recesses when viewed from above. 5. The third portion of the first concave portion according to any one of claims 1 to 4 , wherein the third portion extends in the second direction and has a shape connecting the first portion and the second portion. luminous device. The light-emitting device according to any one of claims 1 to 5 , wherein the linear expansion coefficient of the covering member is higher than that of the base material. 7. The light emitting device according to any one of claims 1 to 6 , further comprising a translucent member located on said light emitting element. 8. The light-emitting device according to claim 7 , wherein said covering member covers a side surface of said translucent member. The light emitting device according to any one of claims 1 to 8 , wherein said first wiring has a convex portion. The light emitting device according to any one of claims 1 to 9 , wherein said second wiring has a convex portion. The light emitting device according to any one of claims 1 to 10 , wherein the covering member is in contact with the light emitting element and includes a portion located between the light emitting element and the substrate.

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