JP2013131519A - Light emitting device - Google Patents

Light emitting device Download PDF

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JP2013131519A
JP2013131519A JP2011278026A JP2011278026A JP2013131519A JP 2013131519 A JP2013131519 A JP 2013131519A JP 2011278026 A JP2011278026 A JP 2011278026A JP 2011278026 A JP2011278026 A JP 2011278026A JP 2013131519 A JP2013131519 A JP 2013131519A
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light emitting
emitting device
light
recess
resin
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JP5848114B2 (en
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Akio Ogawa
昭雄 小川
Toshimi Kamikawa
俊美 上川
Akifumi Ochiai
昭文 落合
Shunichi Sato
瞬一 佐藤
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Stanley Electric Co Ltd
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Stanley Electric Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15172—Fan-out arrangement of the internal vias
    • H01L2924/15174—Fan-out arrangement of the internal vias in different layers of the multilayer substrate

Abstract

PROBLEM TO BE SOLVED: To provide a light emitting device capable of improving yield in manufacturing a light emitting device and further capable of improving reliability thereof.SOLUTION: A light emitting device includes: a housing 11 including a recessed part on a light radiation surface side; a light emitting element 15 mounted in an element mounting region disposed on a bottom face 17A of the recessed part; and an element embedded part 20 comprising a resin filled so that the light emitting element 15 is embedded within the recessed part. The element embedded part 20 includes a sealing part 23 containing the light emitting element and a buffer part 21 comprising a resin having hardness smaller than that of a resin in the sealing part. The buffer part 21 is disposed in a region between the light emitting element 15 and an inner surface 17B of the recessed part while being apart from the light emitting element.

Description

本発明は、発光装置に関し、特にＬＥＤ（Light Emitting Diode）素子を搭載した発光装置に関する。   The present invention relates to a light emitting device, and more particularly to a light emitting device equipped with an LED (Light Emitting Diode) element.

近年、白熱電球や蛍光灯ランプに代わりＬＥＤ素子等の発光素子を利用した発光装置が照明器具や車両用の灯具等に利用されている。このような発光装置においては、発光素子を外部から封止して保護するために、発光素子の周囲を透光性の樹脂等で覆う構造が多く用いられている。   In recent years, light-emitting devices using light-emitting elements such as LED elements instead of incandescent bulbs and fluorescent lamps have been used for lighting fixtures, vehicle lamps, and the like. In such a light emitting device, in order to seal and protect the light emitting element from the outside, a structure in which the periphery of the light emitting element is covered with a translucent resin or the like is often used.

特許文献１には、蛍光体を含む透明なエポキシ注型樹脂を基材とするエレクトロルミネセンス素子用の注型材料がＬＥＤ素子パッケージの凹部内に充填され、ＬＥＤ素子の周囲を覆っている発光装置が開示されている。   Patent Document 1 discloses a light emitting material in which a casting material for an electroluminescent element based on a transparent epoxy casting resin containing a phosphor is filled in a recess of an LED element package and covers the periphery of the LED element. An apparatus is disclosed.

特開平１１−５００５８４号公報Japanese Patent Application Laid-Open No. 11-500584

特許文献１に示されている発光装置等の従来の発光装置では、凹部全体にエポキシ樹脂を充填してＬＥＤ素子を封止している。しかし、このように凹部全体をエポキシ樹脂で充填した場合、製造における半田リフロー時または実際の使用時等の温度変化に伴い、エポキシ樹脂内部に応力が発生し、樹脂内部に、特にＬＥＤ素子の上面角部に端を発するクラックが生じてしまうことを本願発明者は見出した。ＬＥＤ素子付近に発生するクラックは、ＬＥＤ素子を破壊したり、ボンディングワイヤを破断させたりする。従って、クラックの発生により、発光装置の製造時の歩留まりが低下したり、発光装置の信頼性が損なわれたりしていた。
また、発光素子近傍のクラック発生により、発光素子から発せられた光が反射または減衰させられ、発光装置の光取り出し効率が低下する等の問題が発生していた。 In the conventional light emitting device such as the light emitting device disclosed in Patent Document 1, the entire recess is filled with epoxy resin to seal the LED element. However, when the entire recess is filled with the epoxy resin in this way, stress is generated inside the epoxy resin due to a temperature change at the time of solder reflow or actual use in manufacturing, and the inside of the resin, especially the upper surface of the LED element is generated. The inventor of the present application has found that a crack originating at the corner portion is generated. The crack generated near the LED element breaks the LED element or breaks the bonding wire. Therefore, the yield at the time of manufacture of a light-emitting device fell by generation | occurrence | production of a crack, or the reliability of the light-emitting device was impaired.
In addition, the occurrence of cracks in the vicinity of the light emitting element has caused problems such as the light emitted from the light emitting element being reflected or attenuated and the light extraction efficiency of the light emitting device being lowered.

本発明は、上記した点に鑑みてなされたものであり、発光装置の製造時の歩留まりを向上させ、かつ信頼性を向上させることが可能な発光装置を提供することを目的とする。   The present invention has been made in view of the above points, and an object of the present invention is to provide a light-emitting device capable of improving the yield at the time of manufacturing the light-emitting device and improving the reliability.

本発明の発光装置は、光放射面側に凹部を備えたハウジングと、凹部の底面に配された素子搭載領域に搭載された発光素子と、凹部内に発光素子を埋設するように充填されている樹脂からなる素子埋設部と、を有し、素子埋設部は、発光素子を包含する封止部、及び封止部の樹脂よりも硬度の小さい樹脂からなる緩衝部からなり、緩衝部は、発光素子と凹部の内側面との間の領域に、発光素子と離間して配されていることを特徴とする。   The light-emitting device of the present invention is filled with a housing having a recess on the light emitting surface side, a light-emitting element mounted in an element mounting area disposed on the bottom surface of the recess, and a light-emitting element embedded in the recess. Element embedded portion made of resin, and the element embedded portion is composed of a sealing portion including a light emitting element, and a buffer portion made of a resin having a hardness lower than that of the resin of the sealing portion. It is characterized in that it is arranged in a region between the light emitting element and the inner side surface of the concave portion so as to be separated from the light emitting element.

本発明の発光装置では、発光素子の周囲を覆う樹脂よりも硬度の低い樹脂を発光素子とハウジングの凹部側面との間に配置する。それによって、発光装置の製造時または使用時の温度変化において封止樹脂内部に発生するクラックを防止し、発光装置製造時の歩留まり及び使用時の信頼性を向上させることが可能となる。   In the light-emitting device of the present invention, a resin having a lower hardness than the resin covering the periphery of the light-emitting element is disposed between the light-emitting element and the concave side surface of the housing. Accordingly, cracks generated in the sealing resin due to a temperature change during manufacture or use of the light emitting device can be prevented, and yield during manufacture of the light emitting device and reliability during use can be improved.

本発明の実施例１に係る発光装置の平面図である。It is a top view of the light-emitting device which concerns on Example 1 of this invention. 本発明の実施例１に係る発光装置の断面図である。It is sectional drawing of the light-emitting device which concerns on Example 1 of this invention. 本発明の実施例２に係る発光装置の断面図である。It is sectional drawing of the light-emitting device which concerns on Example 2 of this invention. 本発明の実施例３に係る発光装置の断面図である。It is sectional drawing of the light-emitting device which concerns on Example 3 of this invention. 本発明の実施例３に係る発光装置の断面図である。It is sectional drawing of the light-emitting device which concerns on Example 3 of this invention. 本発明の実施例３に係る発光装置の断面図である。It is sectional drawing of the light-emitting device which concerns on Example 3 of this invention. 本発明の変形例に係る発光装置の断面図である。It is sectional drawing of the light-emitting device which concerns on the modification of this invention. 本発明の変形例に係る発光装置の平面図である。It is a top view of the light-emitting device which concerns on the modification of this invention. 本発明の変形例に係る発光装置の断面図である。It is sectional drawing of the light-emitting device which concerns on the modification of this invention.

以下に、本発明の実施例１に係る発光装置１について、図１ａ、ｂを参照しつつ説明する。図１ａは、本発明の実施例１に係る発光装置１の光放射面側からみた平面図である。図１ｂは、図１ａにおける１ｂ−１ｂ線に沿った断面図である。   Below, the light-emitting device 1 which concerns on Example 1 of this invention is demonstrated, referring FIG. FIG. 1A is a plan view of the light emitting device 1 according to Example 1 of the present invention as viewed from the light emitting surface side. 1b is a cross-sectional view taken along line 1b-1b in FIG. 1a.

ハウジング１１は、例えばナイロン６等の熱可塑性のポリアミド樹脂をリードフレーム１３とともに一体成形した矩形の平面形状を有する樹脂基板である。当該樹脂基板には、光反射性を持たせるために二酸化チタン等の白色顔料が混合されている。ハウジング１１は、発光素子であるＬＥＤ素子１５を搭載する光放射面側の面（すなわち、ハウジングの上面）の中央に、押し出し成形または射出成形等によってハウジングと一体に成形された凹部１７を有している。尚、凹部１７は、穴の空いた基板等を複数重ね合わせることで形成されてもよい。また、ハウジング１１を形成する樹脂は、ナイロン１１、ナイロン６６、ナイロン４Ｔ、ナイロン６Ｔ等の他のポリアミド、または、ポリエチレン、ポリエチレンテレフラタートもしくはポリ塩化ビニル等の熱可塑性樹脂でもよい。また、ハウジング１１を形成する樹脂に混合される白色顔料は、硫酸バリウム、酸化アルミニウム、酸化ケイ素または酸化亜鉛等であってもよい。   The housing 11 is a resin substrate having a rectangular planar shape in which a thermoplastic polyamide resin such as nylon 6 is integrally formed with the lead frame 13. The resin substrate is mixed with a white pigment such as titanium dioxide in order to provide light reflectivity. The housing 11 has a recess 17 formed integrally with the housing by extrusion molding or injection molding at the center of the light emitting surface side surface (that is, the upper surface of the housing) on which the LED element 15 that is a light emitting element is mounted. ing. The concave portion 17 may be formed by overlapping a plurality of substrates with holes. The resin forming the housing 11 may be other polyamide such as nylon 11, nylon 66, nylon 4T, nylon 6T, or thermoplastic resin such as polyethylene, polyethylene terephthalate, or polyvinyl chloride. The white pigment mixed with the resin forming the housing 11 may be barium sulfate, aluminum oxide, silicon oxide, zinc oxide, or the like.

凹部１７は、底面１７Ａと光放射方向（すなわち、底面１７Ａに垂直な方向）に向かって広がっていく内側面１７Ｂとからなる円錐台形状を有しており、ＬＥＤ素子１５から射出された光を光放射方向に向けて反射するリフレクタの役割を果たしている。凹部１７の底面１７Ａには、ＬＥＤ素子１５への電力供給のためにリードフレーム１３の一部が露出している。リードフレーム１３は、銅の表面に導体メッキ（銀メッキ、アルミニウムメッキまたは金メッキ等）を施した導電性の構造体であり、凹部１７の底面１７Ａからハウジング１１の内部及び側部を通ってハウジング１１の光放射面と反対の面（すなわち、ハウジングの裏面）まで至っている。すなわち、ＬＥＤ素子１５がハウジング１１の裏面側から電力供給を受け得る構造になっている。   The concave portion 17 has a truncated cone shape composed of a bottom surface 17A and an inner surface 17B that spreads in the light emission direction (that is, a direction perpendicular to the bottom surface 17A), and allows the light emitted from the LED element 15 to be emitted. It plays the role of a reflector that reflects in the direction of light emission. A part of the lead frame 13 is exposed on the bottom surface 17 </ b> A of the recess 17 in order to supply power to the LED element 15. The lead frame 13 is a conductive structure in which a copper surface is subjected to conductor plating (silver plating, aluminum plating, gold plating, etc.), and passes through the inside and the side of the housing 11 from the bottom surface 17A of the concave portion 17. To the surface opposite to the light emitting surface (that is, the back surface of the housing). That is, the LED element 15 is configured to receive power supply from the back side of the housing 11.

ＬＥＤ素子１５は、凹部１７の底面１７Ａの中央に設けられた素子搭載領域１８Ａに搭載されている。ＬＥＤ素子１５は、例えば、一辺が３５０μｍの正方形を底辺とする高さＨ１が１００μｍの直方体であり、赤色光（波長６６０ｎｍ程度）を発する赤色発光ダイオードである。ＬＥＤ素子１５は、リードフレーム表面に塗布したＡｇペースト等の導電性ペースト上に載置して、当該ペーストを硬化させるダイボンディングによって固定されている。ＬＥＤ素子１５は、例えば、上面にＰ電極、下面にＮ電極を有しており、Ｐ電極は、金（銅、白金、アルミウムの導電体等でもよい）のボンディングワイヤ１９を介してリードフレーム１３に接続されており、Ｎ電極は上述のＡｇペーストを介したダイボンディングによってリードフレーム１３に電気的に接続されている。   The LED element 15 is mounted on an element mounting region 18A provided at the center of the bottom surface 17A of the recess 17. The LED element 15 is a red light emitting diode that emits red light (wavelength of about 660 nm), for example, a rectangular parallelepiped having a height H1 of 100 μm with a square having a side of 350 μm as a base. The LED element 15 is mounted on a conductive paste such as an Ag paste applied to the surface of the lead frame, and is fixed by die bonding that cures the paste. The LED element 15 has, for example, a P electrode on the upper surface and an N electrode on the lower surface, and the P electrode is connected to the lead frame 13 via a bonding wire 19 of gold (copper, platinum, aluminum conductor or the like). The N electrode is electrically connected to the lead frame 13 by die bonding via the above Ag paste.

凹部１７内には、ＬＥＤ素子１５を埋設するように樹脂が充填された素子埋設部２０が設けられている。より詳細には、凹部１７内には、比較的硬度の低い緩衝樹脂からなる緩衝部２１及び比較的硬度の高い封止樹脂からなる封止部２３が形成されている。緩衝部２１は、ＬＥＤ素子１５及びボンディングワイヤ１９から離間し、かつ凹部１７の底面１７Ａの周縁及び内側面１７Ｂの下部を覆うように形成されている。すなわち、緩衝部２１は、ＬＥＤ素子１５及びボンディングワイヤ１９の周囲を囲むリング体を形成している。   An element embedding part 20 filled with a resin is embedded in the recess 17 so as to embed the LED element 15. More specifically, a buffer portion 21 made of a buffer resin having a relatively low hardness and a sealing portion 23 made of a sealing resin having a relatively high hardness are formed in the recess 17. The buffer portion 21 is formed so as to be separated from the LED element 15 and the bonding wire 19 and to cover the periphery of the bottom surface 17A of the recess 17 and the lower portion of the inner side surface 17B. That is, the buffer portion 21 forms a ring body that surrounds the LED element 15 and the bonding wire 19.

緩衝部２１は、硬化後に比較的低い硬度（例えば、ＪＩＳ−Ａ硬度が２０−５０程度）を有する樹脂、例えば、無色透明のシリコーン樹脂を、例えば、シリンジ等によって、凹部１７の底部周縁に沿って滴下・塗布し、加熱硬化させることによって形成される。尚、緩衝部２１を形成する緩衝樹脂には、白色顔料またはＬＥＤ素子１５の発光色と同色に着色した顔料を含有させてもよい。当該顔料には、例えば、二酸化チタン、硫酸バリウム、酸化アルミニウム、酸化ケイ素または酸化亜鉛等を使用してもよい。   The buffer portion 21 is made of a resin having a relatively low hardness (for example, a JIS-A hardness of about 20-50) after curing, such as a colorless and transparent silicone resin, along the periphery of the bottom portion of the concave portion 17 by, for example, a syringe. It is formed by dropping, applying and heat-curing. The buffer resin forming the buffer portion 21 may contain a white pigment or a pigment colored in the same color as the emission color of the LED element 15. As the pigment, for example, titanium dioxide, barium sulfate, aluminum oxide, silicon oxide, or zinc oxide may be used.

封止部２３は、ＬＥＤ素子１５、ボンディングワイヤ１９及び緩衝部２１を埋設するように凹部１７のほぼ全体に形成されている。封止部２３は、ＬＥＤ素子１５及びボンディングワイヤを外部衝撃等から保護するために、緩衝部２１を形成する緩衝樹脂よりも高い硬化後の硬度（例えば、ＪＩＳ−Ｄ硬度が６０−９０程度）を有し、かつ透光性を有する樹脂、例えば、ビスフェノール型エポキシ樹脂を凹部１７内に充填して硬化することによって形成されている。   The sealing part 23 is formed in substantially the entire recess 17 so as to embed the LED element 15, the bonding wire 19 and the buffer part 21. The sealing portion 23 has a hardness after curing higher than that of the buffer resin forming the buffer portion 21 in order to protect the LED element 15 and the bonding wire from external impacts (for example, JIS-D hardness is about 60-90). And a resin having translucency, for example, a bisphenol type epoxy resin, is filled in the recesses 17 and cured.

緩衝部２１を形成する緩衝樹脂は、封止部２３を形成する封止樹脂よりも低い硬度を有しているので、発光装置１０に温度変化が生じて、封止部２３を形成する封止樹脂が膨張または収縮した場合に発生する応力が緩衝部２１を形成する緩衝樹脂の弾性的柔軟性故に緩和される。この緩和効果により、封止部２３内のＬＥＤ素子近傍に発生するクラックの発生が防止される。この結果、ＬＥＤ素子近傍に発生するクラックによるＬＥＤ素子１５及びボンディングワイヤ１９の破損、並びに光取り出し効率の低下が防止される。   Since the buffer resin forming the buffer portion 21 has a lower hardness than the sealing resin forming the sealing portion 23, the temperature change occurs in the light emitting device 10, and the sealing portion 23 forms the sealing portion 23. The stress generated when the resin expands or contracts is alleviated due to the elastic flexibility of the buffer resin that forms the buffer portion 21. Due to this relaxation effect, the generation of cracks in the vicinity of the LED element in the sealing portion 23 is prevented. As a result, it is possible to prevent the LED element 15 and the bonding wire 19 from being damaged and the light extraction efficiency from being lowered due to a crack generated in the vicinity of the LED element.

尚、応力集中を生じやすいＬＥＤ素子の上面角部における応力集中をさらに緩和するために、緩衝部２１は、素子搭載面からＬＥＤ素子１５の上面までの高さＨ１以上の高さＨ２を有しているのが好ましい。また、ＬＥＤ素子１５及びボンディングワイヤ１９に緩衝部２１を形成する緩衝樹脂が接したり付着したりすると、ＬＥＤ素子１５の表面上やボンディングワイヤ１９の表面上に、緩衝樹脂が這い上がり、ＬＥＤ素子１５上及びボンディングワイヤ１９上に、緩衝樹脂と封止樹脂との界面が形成される。この界面は温度上昇時に剥離を生じ、光取り出し効率を著しく低下させる恐れがある。従って、緩衝部２１が形成するリング体の内側面は、ＬＥＤ素子の側面から適度に離して形成するのが好ましく、５００−７００μｍ（例えば、６００μｍ）の距離にあるのが好ましい。   In order to further relieve the stress concentration at the corners of the upper surface of the LED element where stress concentration tends to occur, the buffer portion 21 has a height H2 equal to or higher than the height H1 from the element mounting surface to the upper surface of the LED element 15. It is preferable. When the buffer resin forming the buffer portion 21 contacts or adheres to the LED element 15 and the bonding wire 19, the buffer resin crawls up on the surface of the LED element 15 or on the surface of the bonding wire 19, and the LED element 15. An interface between the buffer resin and the sealing resin is formed on the top and the bonding wire 19. This interface peels when the temperature rises, and there is a possibility that the light extraction efficiency is remarkably lowered. Therefore, the inner side surface of the ring body formed by the buffer portion 21 is preferably formed at a suitable distance from the side surface of the LED element, and is preferably at a distance of 500 to 700 μm (for example, 600 μm).

よって、緩衝樹脂は、滴下または塗布後、硬化前に凹部１７底部中央に向かって広がってしまわないように、適当なチキソ性を有する樹脂で形成されることが好ましい。例えば、このようなチキソ性を有する樹脂として、ＪＩＳ−Ａ硬度が３０程度のシリコーン樹脂等が使用可能である。   Therefore, it is preferable that the buffer resin is formed of a resin having an appropriate thixotropy so as not to spread toward the bottom center of the concave portion 17 before being cured after being dropped or applied. For example, a silicone resin having a JIS-A hardness of about 30 can be used as such a thixotropic resin.

以下に、本発明の実施例２に係る発光装置２について、図２を参照して説明する。図２は、本発明の実施例２に係る発光装置２の断面図である。   Below, the light-emitting device 2 which concerns on Example 2 of this invention is demonstrated with reference to FIG. FIG. 2 is a cross-sectional view of the light emitting device 2 according to Example 2 of the invention.

実施例２に係る発光装置２は、凹部１７の底面１７Ａに、緩衝部２１を形成する緩衝樹脂の流出を防止する構造として突起２５が形成されている以外の構成に関しては、実施例１の発光装置１の構成と同一である。   The light emitting device 2 according to the second embodiment has the same configuration as that of the first embodiment except that the protrusions 25 are formed on the bottom surface 17A of the concave portion 17 to prevent the buffer resin forming the buffer portion 21 from flowing out. The configuration of the apparatus 1 is the same.

突起２５は、凹部１７の底面１７Ａに、ＬＥＤ素子１５及びボンディングワイヤ１９の周囲を囲むようリング状に形成されている突起構造である。この突起２５は、ハウジング１１と一体に形成されてもよいし、凹部１７の底面１７Ａにスタンプまたはシリンジによる滴下によって塗布されて硬化させられた樹脂材料、例えばシリコーン樹脂によって形成されてもよい。   The protrusion 25 is a protrusion structure formed in a ring shape on the bottom surface 17 </ b> A of the recess 17 so as to surround the LED element 15 and the bonding wire 19. The protrusion 25 may be formed integrally with the housing 11, or may be formed of a resin material, such as a silicone resin, which is applied to the bottom surface 17 </ b> A of the recess 17 by dripping with a stamp or a syringe and cured.

この突起２５によって、硬化前の液状の緩衝樹脂が、凹部１７の底面１７Ａの中央部に向かって流出するのを抑制することが可能となる。従って、実施例１の発光装置１の緩衝部２１に使用される緩衝樹脂よりも、硬化前のチキソ性が低い緩衝樹脂を緩衝部２１に使用することが可能となる等、製造が容易になる。   The protrusion 25 can prevent the liquid buffer resin before curing from flowing out toward the center of the bottom surface 17 </ b> A of the recess 17. Accordingly, the buffer resin having a lower thixotropy before curing than the buffer resin used in the buffer part 21 of the light emitting device 1 of Example 1 can be used for the buffer part 21, and the manufacture becomes easy. .

尚、突起２５の代わりにリング状の溝を形成してもよい。この溝によっても、突起２５と同様の流出抑制効果が得られる。また、突起または溝は全体としてリング状を形成している断続的な構造であってもよい。   A ring-shaped groove may be formed instead of the protrusion 25. Also by this groove, the same outflow suppression effect as that of the protrusion 25 can be obtained. Further, the protrusions or grooves may have an intermittent structure forming a ring shape as a whole.

以下に、本発明の実施例３に係る発光装置３について、図３ａ−ｃを参照して説明する。図３ａ−ｃは、本発明の実施例３に係る発光装置３の断面図である。   Below, the light-emitting device 3 which concerns on Example 3 of this invention is demonstrated with reference to FIG. 3a to 3c are cross-sectional views of the light emitting device 3 according to Example 3 of the invention.

実施例３に係る発光装置３は、凹部１７の底部の周縁に緩衝樹脂充填用のリセス１８Ｂが形成されている以外の構成に関しては、実施例１の発光装置１の構成と同一である。すなわち、凹部１７の底面１７Ａから突出し、その頂部表面が素子搭載領域１８Ａとなる素子搭載部２２が設けられている。   The light emitting device 3 according to the third embodiment is the same as the light emitting device 1 according to the first embodiment, except that a recess 18B for filling a buffer resin is formed on the periphery of the bottom of the recess 17. That is, an element mounting portion 22 that protrudes from the bottom surface 17A of the recess 17 and whose top surface becomes the element mounting region 18A is provided.

リセス１８Ｂは、素子搭載領域１８Ａを囲む溝状の凹部である。リセス１８Ｂは、緩衝部２１を形成する緩衝樹脂のための液だまりを形成している。   The recess 18B is a groove-like recess surrounding the element mounting region 18A. The recess 18 </ b> B forms a liquid pool for the buffer resin that forms the buffer portion 21.

発光装置３においては、緩衝部２１は、リセス１８Ｂ内を緩衝樹脂で充填することによって形成されている。このようにすることで、緩衝部２１の体積を増大させて、緩衝部２１による応力緩和効果をさらに増大させることが可能である。また、発光装置１及び２よりも緩衝樹脂の滴下量の調整が容易になり、緩衝樹脂がＬＥＤ素子側に流出する可能性が低減する。   In the light emitting device 3, the buffer portion 21 is formed by filling the recess 18B with a buffer resin. By doing in this way, it is possible to increase the volume of the buffer part 21 and to further increase the stress relaxation effect by the buffer part 21. In addition, it becomes easier to adjust the dropping amount of the buffer resin than the light emitting devices 1 and 2, and the possibility that the buffer resin flows out to the LED element side is reduced.

尚、リセス１８Ｂによる体積増大効果を十分に得るために、リセス１８Ｂの深さは、ＬＥＤ素子１５の搭載面から少なくとも３００μｍ以上（例えば４００μｍ）であるのが好ましく、５００μｍ以上の深さであるのが更に好ましい。また、図３ｂのように、発光装置３においても、応力集中を生じやすいＬＥＤ素子の上面角部における応力集中を緩和するために、緩衝部２１は、素子搭載面以上の高さまで設けられているのが好ましく、素子搭載面からＬＥＤ素子１５の上面までの高さＨ１以上の素子搭載面からの高さＨ２′を有しているのが更に好ましい。   In order to sufficiently obtain the effect of increasing the volume by the recess 18B, the depth of the recess 18B is preferably at least 300 μm or more (for example, 400 μm) from the mounting surface of the LED element 15, and more preferably 500 μm or more. Is more preferable. In addition, as shown in FIG. 3b, also in the light emitting device 3, the buffer portion 21 is provided to a height higher than the element mounting surface in order to alleviate the stress concentration at the top corner portion of the LED element that is likely to cause stress concentration. It is more preferable that the height H2 ′ from the element mounting surface is not less than the height H1 from the element mounting surface to the upper surface of the LED element 15.

尚、図３ｃに示すように、発光装置３において、実施例２の発光装置２と同様に、緩衝樹脂がＬＥＤ素子１５の方向に流れ出すことを防止するために、素子搭載領域１８Ａの周縁部に突起２５を設けてもよい。   As shown in FIG. 3c, in the light emitting device 3, as in the light emitting device 2 of Example 2, in order to prevent the buffer resin from flowing in the direction of the LED element 15, the peripheral portion of the element mounting region 18A is provided. The protrusion 25 may be provided.

［実施例１及び比較例の評価］
実施例１の発光装置１の評価のため、比較例の発光装置を製造して、これらの比較評価を行った。 [Evaluation of Example 1 and Comparative Example]
In order to evaluate the light emitting device 1 of Example 1, a light emitting device of a comparative example was manufactured and subjected to comparative evaluation.

比較例の発光装置の構造は、図１ｂに示す緩衝部２１を設けていない点を除いて、発光装置１の構造と同一である。評価は、リフロー処理の実施を想定して、比較例の発光装置及び発光装置１を温度が常温から２６０℃まで上昇する環境下におき、発光素子を封止している樹脂の状態をリアルタイムで確認することによって行った。   The structure of the light emitting device of the comparative example is the same as that of the light emitting device 1 except that the buffer portion 21 shown in FIG. 1b is not provided. The evaluation assumes that the reflow process is performed and places the light emitting device and the light emitting device 1 of the comparative example in an environment where the temperature rises from room temperature to 260 ° C., and the state of the resin sealing the light emitting element in real time. Done by checking.

比較例の発光装置においては、温度が２５０℃付近に達した際にＬＥＤ素子の上面端部にクラックが発生し、その後の温度上昇とともにクラックが面状に成長していった。発光装置１においては、緩衝部２１の上述の応力緩和効果によりクラックは発生しなかった。   In the light emitting device of the comparative example, when the temperature reached around 250 ° C., a crack occurred at the upper end portion of the LED element, and the crack grew into a planar shape as the temperature increased thereafter. In the light emitting device 1, no crack was generated due to the stress relaxation effect of the buffer portion 21.

上述の実施例において、緩衝部２１は、凹部１７の内側面１７Ｂに接している場合を例に説明したが、緩衝部２１と内側面１７Ｂとは必ずしも接している必要はない。例えば、図４のように緩衝部２１を内側面１７Ｂと離間させて配置してもよい。   In the above-described embodiment, the case where the buffer portion 21 is in contact with the inner side surface 17B of the recess 17 has been described as an example, but the buffer portion 21 and the inner side surface 17B do not necessarily have to be in contact with each other. For example, as shown in FIG. 4, the buffer portion 21 may be disposed apart from the inner surface 17B.

また、上述の実施例において、緩衝部２１が単一樹脂から形成されている場合を例に説明したが、緩衝部２１は、封止樹脂よりも硬度が低い２種類以上の複数の樹脂から形成されていてもよい。例えば、封止部２３に接している樹脂は比較的硬度が高く、封止部から離れるにつれて樹脂の硬度が低くなるように複数の樹脂で緩衝部２１を形成してもよい。   In the above-described embodiment, the case where the buffer portion 21 is formed from a single resin has been described as an example. However, the buffer portion 21 is formed from a plurality of two or more types of resins having hardness lower than that of the sealing resin. May be. For example, the buffer portion 21 may be formed of a plurality of resins so that the resin in contact with the sealing portion 23 has a relatively high hardness and the hardness of the resin decreases as the distance from the sealing portion increases.

また、上述の実施例において、緩衝部２１は、リング状の構造として示したが、必ずしもリング状の構造を有している必要は無い。例えば、図５に示すように、断続的に緩衝部２１が存在して、全体としてリング形状を形成していてもよい。その場合、実施例２の突起２５及び実施例３のリセス１８Ｂは、少なくとも緩衝部２１がある場所に存在すればよい。   Moreover, in the above-mentioned Example, although the buffer part 21 was shown as a ring-shaped structure, it does not necessarily need to have a ring-shaped structure. For example, as shown in FIG. 5, the buffer part 21 may exist intermittently, and the ring shape may be formed as a whole. In that case, the protrusion 25 of the second embodiment and the recess 18B of the third embodiment may be present at least in a place where the buffer portion 21 is present.

また、上述の実施例において、緩衝部２１が凹部１７の底面１７Ａに接している場合を例に説明したが、必ずしも底面１７Ａに接している必要は無い。例えば、図６に示すように、緩衝部２１が底面１７Ａから離間するように設けられていてもよい。このような構造は、まず、凹部内に任意の量の封止樹脂を注入し、次に、その上から緩衝樹脂を滴下し、最後に、緩衝樹脂を覆うように、さらに封止樹脂を注入した後に硬化を行う方法で形成されてもよい。   In the above-described embodiment, the case where the buffer portion 21 is in contact with the bottom surface 17A of the recess 17 has been described as an example, but it is not necessarily required to be in contact with the bottom surface 17A. For example, as shown in FIG. 6, the buffer portion 21 may be provided so as to be separated from the bottom surface 17A. In such a structure, first, an arbitrary amount of sealing resin is injected into the recess, then buffer resin is dropped from above, and finally, sealing resin is further injected to cover the buffer resin. Then, it may be formed by a method of curing.

また、上述の実施例において、凹部１７は円錐台状として説明したが、凹部１７は四角錐台状、三角錐状台状等、ＬＥＤ素子１５から射出された光を光取り出し方向に反射する形状であればどんな形状でもよい。その場合、緩衝部２１の配置、突起２５またはリセス１８Ｂの形状は、凹部１７の形状に合わせて、四角いリング状等としてもよい。   In the above-described embodiments, the concave portion 17 has been described as a truncated cone shape. However, the concave portion 17 has a shape that reflects light emitted from the LED element 15 in the light extraction direction, such as a quadrangular pyramid shape or a triangular pyramid shape. Any shape is acceptable. In that case, the arrangement of the buffer portion 21 and the shape of the protrusion 25 or the recess 18 </ b> B may be a square ring shape or the like in accordance with the shape of the concave portion 17.

上述の実施例において、発光素子は赤色ＬＥＤ素子としたが、青色または緑色等の他の色を発するＬＥＤ素子、またはＬＥＤ素子以外の他の発光素子を使用してもよい。また、ＬＥＤ素子１５は、２本のボンディングワイヤによって電気的接続を得るタイプでもよく、ボンディングワイヤを用いないフリップチップ型の素子であってもよい。   In the above-described embodiment, the light emitting element is a red LED element. However, an LED element emitting another color such as blue or green, or another light emitting element other than the LED element may be used. The LED element 15 may be of a type that obtains electrical connection with two bonding wires, or may be a flip chip type element that does not use bonding wires.

また、緩衝部２１または封止部２３に蛍光体や光散乱材を分散させてもよい。例えば、白色光を得るために、ＬＥＤ素子１５を青色ＬＥＤ素子として、緩衝部２１または封止部２３にＹＡＧ（イットリウム・アルミニウム・ガーネット：Ｙ３Ａｌ５Ｏ１２）に付活剤としてＣｅ（セリウム）を導入したＹＡＧ：Ｃｅ蛍光体を分散させてもよい。 Further, a phosphor or a light scattering material may be dispersed in the buffer part 21 or the sealing part 23. For example, in order to obtain white light, the LED element 15 is a blue LED element, the buffer part 21 or the sealing part 23 is YAG (yttrium / aluminum / garnet: Y 3 Al 5 O 12 ) as an activator Ce (cerium) ) Introduced YAG: Ce phosphor may be dispersed.

さらに、上述した実施例における種々の数値、寸法、材料等は、例示に過ぎず、用途及び使用される発光素子、封止樹脂等に応じて、適宜選択することができる。   Furthermore, various numerical values, dimensions, materials, and the like in the above-described embodiments are merely examples, and can be appropriately selected according to the application and the light-emitting element, sealing resin, and the like used.

１、２、３ 発光装置
１１ ハウジング
１３ リードフレーム
１５ ＬＥＤ素子
１７ 凹部
１７Ａ 底面
１７Ｂ 内側面
１８Ａ 素子搭載領域
１８Ｂ リセス
１９ ボンディングワイヤ
２０ 素子埋設部
２１ 緩衝部
２２ 素子搭載部
２３ 封止部
２５ 突起 1, 2, 3 Light emitting device 11 Housing 13 Lead frame 15 LED element 17 Recess 17A Bottom surface 17B Inner side surface 18A Element mounting region 18B Recess 19 Bonding wire 20 Element embedding part 21 Buffer part 22 Element mounting part 23 Sealing part 25 Projection

Claims (8)

光放射面側に凹部を備えたハウジングと、
前記凹部の底面に配された素子搭載領域に搭載された発光素子と、
前記凹部内に前記発光素子を埋設するように充填されている樹脂からなる素子埋設部と、を有し、
前記素子埋設部は、前記発光素子を包含する封止部、及び前記封止部の樹脂よりも硬度の小さい樹脂からなる緩衝部からなり、
前記緩衝部は、前記発光素子と前記凹部の内側面との間の領域に、前記発光素子と離間して配されていることを特徴とする発光装置。 A housing having a recess on the light emitting surface side;
A light emitting element mounted on an element mounting region disposed on the bottom surface of the recess;
An element embedding part made of resin filled so as to embed the light emitting element in the recess,
The element embedding part is composed of a sealing part including the light emitting element, and a buffer part made of a resin whose hardness is smaller than the resin of the sealing part,
The light-emitting device, wherein the buffer portion is disposed in a region between the light-emitting element and the inner side surface of the concave portion and spaced from the light-emitting element. 前記緩衝部は前記素子搭載領域の上面以上の高さまで形成されていることを特徴とする請求項１に記載の発光装置。   The light emitting device according to claim 1, wherein the buffer portion is formed to a height equal to or higher than an upper surface of the element mounting region. 前記凹部の底部は、前記凹部の底面から突出する素子搭載部と、前記素子搭載部を囲堯するリセス部とからなり、
前記素子搭載領域は、前記素子搭載部上に設けられ、前記緩衝部は前記リセス部を充填するように形成されていることを特徴とする請求項１または２に記載の発光装置。 The bottom portion of the recess is composed of an element mounting portion protruding from the bottom surface of the recess, and a recess portion surrounding the element mounting portion,
The light emitting device according to claim 1, wherein the element mounting region is provided on the element mounting portion, and the buffer portion is formed to fill the recess portion. 前記緩衝部の少なくとも一部が、前記発光素子の上面を含む平面内に存在していることを特徴とする請求項１乃至３のいずれか１項に記載の発光装置。   4. The light emitting device according to claim 1, wherein at least a part of the buffer portion exists in a plane including an upper surface of the light emitting element. 前記素子搭載領域の周縁部に設けられた突起を有し、前記緩衝部は前記発光素子に対し、前記突起の外側に配置されていることを特徴とする請求項１乃至４のいずれか１項に記載の発光蔵置。   5. The device according to claim 1, further comprising a protrusion provided at a peripheral edge of the element mounting region, wherein the buffer portion is disposed outside the protrusion with respect to the light emitting element. The light-emitting warehouse as described in. 前記発光素子は前記ハウジング表面に形成された電極にボンディングワイヤによって接続され、前記封止部は前記発光素子及び前記ボンディングワイヤを包含することを特徴とする請求項１乃至５のいずれか１項に記載の発光装置。   The said light emitting element is connected to the electrode formed in the said housing surface with a bonding wire, The said sealing part includes the said light emitting element and the said bonding wire, The said any one of Claim 1 thru | or 5 characterized by the above-mentioned. The light-emitting device of description. 前記緩衝部が、前記凹部の前記底面及び前記内側面に接しているリング構造を形成していることを特徴とする請求項１乃至６のいずれか１項に記載の発光装置。   The light-emitting device according to claim 1, wherein the buffer portion forms a ring structure in contact with the bottom surface and the inner side surface of the recess. 前記緩衝部は、ＪＩＳ−Ａ硬度規格において２０〜５０の範囲の硬度を有するシリコーン樹脂からなることを特徴とする請求項１乃至７のいずれか１項に記載の発光装置。   The light emitting device according to any one of claims 1 to 7, wherein the buffer portion is made of a silicone resin having a hardness in a range of 20 to 50 according to a JIS-A hardness standard.
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