JP2022023959A - Light-emitting device and manufacturing method of the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light-emitting device having an excellent light fetching property and light distribution property, and provide a manufacturing method of them.

SOLUTION: A light-emitting device 10 comprises: a substrate 20 having a first lead 20A, a second lead 20B, and a fixed member 20C; a light emission element 40 mounted on an upper face of the substrate 20; a frame body 50 provided onto the upper face of the substrate 20 so as to surround the light emission element 40; a first member 30 that covers at least one part of the upper face of the fixed member 20C exposed to an outer peripheral side of the frame body 50 in an upper surface view, and contains a reflection material contacted to an outer side surface of the frame body 50; and a second member 70 coating the light emission element 40, the frame body 50, and the first member 30. The first member 30 has an inclined region in a cross-section view, and a height of the inclination region is formed smaller than an upper end of the frame body 50.

SELECTED DRAWING: Figure 1B

COPYRIGHT: (C)2022,JPO&INPIT

Description

The present disclosure relates to a light emitting device and a method for manufacturing the same.

Light emitting devices using light emitting elements such as light emitting diodes or laser diodes are used in many fields including general lighting such as indoor lighting, in-vehicle light sources, backlights of liquid crystal displays, and the like. The performance required for these light emitting devices is increasing day by day, and further improvement in reliability is required.

The light emitting device includes a light emitting element mounted on the upper surface of the lead, a resin frame surrounding the light emitting element, a first sealing resin filled in the resin frame and sealing the light emitting element, a resin frame, and a resin frame. A light emitting device including a second sealing resin covering the first sealing resin is known (see, for example, Patent Document 1).

Japanese Unexamined Patent Publication No. 2014-209602

However, as the use of the light emitting device expands, it is required to further improve the light extraction property and the light distribution property.
Therefore, it is an object of the present embodiment to provide a light emitting device having excellent light extraction and light distribution properties and a method for manufacturing the same.

In order to solve the above problems, the light emitting device according to the embodiment of the present disclosure includes a substrate having a first lead, a second lead, and a fixing member for fixing the first lead and the second lead. At least a light emitting element placed on the upper surface of the substrate, a frame body provided on the upper surface of the substrate so as to surround the light emitting element, and the fixing member exposed on the outer peripheral side of the frame body in a top view. A first member that covers a part of the upper surface and contains a reflective material that is in contact with the outer surface of the frame body, and a second member that covers the light emitting element, the frame body, and the first member, said. The first member has an inclined region in a cross-sectional view, and the height of the inclined region is formed to be lower than the upper end of the frame body.

The method for manufacturing a light emitting device according to the embodiment of the present disclosure includes a step of placing a light emitting element on the upper surface of a substrate in which the first lead and the second lead are fixed by a fixing member, and the light emitting element on the upper surface of the substrate. A step of providing a first member containing a reflective material so as to surround at least a part of the upper surface of the fixing member, and the substrate in contact with the inner surface of the first member and the upper surface of the substrate in a cross-sectional view. A step of providing a frame body on the upper surface of the substrate so as to surround the light emitting element with a height higher than that of the first member, and a second step of covering the light emitting element, the frame body and the first member. Includes the step of providing the member.

The method for manufacturing a light emitting device according to the embodiment of the present disclosure includes a step of placing a light emitting element on the upper surface of a substrate in which a first lead and a second lead are fixed by a fixing member, and a step of mounting the light emitting element so as to surround the light emitting element. The step of providing the frame on the upper surface of the substrate, and covering at least a part of the upper surface of the fixing member exposed on the outer peripheral side of the frame in contact with the outer surface of the frame and the upper surface of the substrate, and having a cross section. A step of providing a first member containing a reflective material so that the height from the substrate is lower than that of the frame body and a second member covering the light emitting element, the frame body and the first member are provided. Including the process.

According to the light emitting device and the manufacturing method thereof according to the embodiment of the present disclosure, the light extraction property and the light distribution property are excellent.

It is a top view which shows typically the structure of the light emitting device which concerns on 1st Embodiment. It is sectional drawing in the IB-IB line of FIG. 1A. FIG. 1B is a partially enlarged cross-sectional view of FIG. 1B. It is sectional drawing which shows the other form of the 1st member of FIG. 1C. It is sectional drawing which shows the other form of the 1st member of FIG. 1C. It is sectional drawing which shows the other form of the 1st member of FIG. 1C. It is sectional drawing which shows the other form of the 1st member of FIG. 1C. FIG. 5 is a plan view in which a frame body, a first member, and a second member are omitted in the light emitting device according to the first embodiment. It is a top view which the frame body and the 2nd member were omitted in the light emitting device which concerns on 1st Embodiment. It is a top view drawn by omitting the 2nd member in the light emitting device which concerns on 1st Embodiment. It is sectional drawing explaining the action effect of the 1st member. It is sectional drawing explaining the action effect of the 1st member. It is a flowchart which shows the flow of the 1st manufacturing method of the light emitting device which concerns on 1st Embodiment. FIG. 2 is a cross-sectional view taken along the line VIIA-VIIA of FIG. 2, which is a cross-sectional view schematically showing a substrate on which a light emitting element is placed in the manufacturing process of the first manufacturing method of the light emitting device according to the first embodiment. FIG. 3 is a cross-sectional view taken along the line VIIB-VIIB of FIG. 3, which is a cross-sectional view schematically showing a substrate provided with the first member in the manufacturing process of the first manufacturing method of the light emitting device according to the first embodiment. 4 is a cross-sectional view taken along the line VIIC-VIIC of FIG. 4, which is a cross-sectional view schematically showing a substrate provided with a frame in the manufacturing process of the first manufacturing method of the light emitting device according to the first embodiment. It is sectional drawing which shows typically the method of providing the 2nd member in the manufacturing process of the 1st manufacturing method of the light emitting device which concerns on 1st Embodiment. It is a flowchart which shows the flow of the 2nd manufacturing method of the light emitting device which concerns on 1st Embodiment. It is sectional drawing which shows typically the substrate which provided the frame body in the manufacturing process of the 2nd manufacturing method of the light emitting device which concerns on 1st Embodiment. It is sectional drawing which shows typically the substrate provided with the 1st member in the manufacturing process of the 2nd manufacturing method of the light emitting device which concerns on 1st Embodiment. It is sectional drawing which shows typically the structure of the light emitting device which concerns on 2nd Embodiment. It is a flowchart which shows the flow of the 1st manufacturing method of the light emitting device which concerns on 2nd Embodiment. It is a flowchart which shows the flow of the 2nd manufacturing method of the light emitting device which concerns on 2nd Embodiment.

The embodiments will be described below with reference to the drawings. However, the embodiments shown below exemplify a light emitting device for embodying the technical idea of the present embodiment, and are not limited to the following. Further, the dimensions, materials, shapes, relative arrangements, etc. of the components described in the embodiments are not intended to limit the scope of the present invention to the specific description, and are merely explanatory examples. It's just that. The size, positional relationship, etc. of the members shown in each drawing may be exaggerated for the sake of clarity. Further, in the following description, members having the same name and reference numerals are shown to have the same or the same quality, and detailed description thereof will be omitted as appropriate.

[First Embodiment]
<Light emitting device>
First, the light emitting device according to the first embodiment will be described.
FIG. 1A is a plan view schematically showing the configuration of the light emitting device according to the first embodiment. FIG. 1B is a cross-sectional view taken along the line IB-IB of FIG. 1A. FIG. 1C is a partially enlarged cross-sectional view of FIG. 1B. FIG. 1D is a cross-sectional view showing another form of the first member of FIG. 1C. FIG. 1E is a cross-sectional view showing another form of the first member of FIG. 1C. FIG. 1F is a cross-sectional view showing another form of the first member of FIG. 1C. FIG. 1G is a cross-sectional view showing another form of the first member of FIG. 1C. FIG. 2 is a plan view in which the frame body, the first member, and the second member are omitted in the light emitting device according to the first embodiment. FIG. 3 is a plan view of the light emitting device according to the first embodiment, in which the frame body and the second member are omitted. FIG. 4 is a plan view of the light emitting device according to the first embodiment, in which the second member is omitted. FIG. 5A is a cross-sectional view illustrating the action and effect of the first member. FIG. 5B is a cross-sectional view illustrating the action and effect of the first member.

As shown in FIGS. 1A to 4, the light emitting device 10 includes a substrate 20 having a first lead 20A, a second lead 20B, and a fixing member 20C for fixing the first lead 20A and the second lead 20B. A light emitting element 40 mounted on the upper surface of the substrate 20, a frame body 50 provided on the upper surface of the substrate 20 so as to surround the light emitting element 40, and a fixing member 20C exposed on the outer peripheral side of the frame body 50 in a top view. A first member 30 that covers at least a part of the upper surface of the frame and contains a reflective material that is in contact with the outer surface of the frame 50, and a second member 70 that covers the light emitting element 40, the frame 50, and the first member 30. The first member 30 has an inclined region 31 in a cross-sectional view, and the height H1 of the inclined region 31 is formed to be lower than the height H2 of the upper end of the frame body 50. Hereinafter, each configuration will be described.

(Hypokeimenon)
As shown in FIG. 2, the substrate 20 has a first lead 20A, a second lead 20B, and a fixing member 20C for fixing the first lead 20A and the second lead 20B in a separated state. .. The upper surface of the first lead 20A, the upper surface of the second lead 20B, and the upper surface of the fixing member 20C can be flush with each other. Further, the lower surface of the first lead 20A, the lower surface of the second lead 20B, and the lower surface of the fixing member 20C can be flush with each other.
The first lead 20A is, for example, a mounting portion 21A formed in a substantially polygonal shape in the center of the substrate 20 and on which the light emitting element 40 is mounted, a terminal portion 23A arranged on one end side of the substrate 20, and a mounting portion. It has a connection portion 22A for connecting the 21A and the terminal portion 23A. The width W22 of the connecting portion 22A is formed to be narrower than the width W21 of the mounting portion 21A and the width W23 of the terminal portion 23A. The width W23 of the terminal portion 23A is wider than the width W21 of the mounting portion 21A and is formed in the same manner as the substrate 20. The connecting portion 22A has a region to which the wire 60 of the light emitting element 40 is connected. Here, in the first lead 20A and the second lead 20B, the width means the maximum length in the direction orthogonal to the direction in which the connecting portion 22A extends from the mounting portion 21A.
Further, the mounting portion 21A is formed in a substantially octagonal shape. The mounting portion 21A has a first side 21A1 having the same length as the width W22 of the connecting portion 22A, a second side 21A2 parallel to and facing the first side 21A1, and the first side 21A1 and the second side 21A2. A third side 21A3 orthogonal to the first side 21A3, a fourth side 21A4 orthogonal to the first side 21A1 and the second side 21A2 facing the third side 21A3, and an inclined fifth side connecting the first side 21A1 and the third side 21A3. Side 21A5, an inclined sixth side 21A6 connecting the first side 21A1 and the fourth side 21A4, an inclined seventh side 21A7 connecting the second side 21A2 and the third side 21A3, and the second side 21A2 and the second side. It has an inclined eighth side 21A8 connecting the four sides 21A4. Further, the mounting portion 21A has convex portions formed on the third side 21A3 and the fourth side 21A4 so as to project from the sides.

The second lead 20B is arranged so that the distance between the second side 21A2, the seventh side 21A7, and the eighth side 21A8 of the mounting portion 21A is substantially constant. Further, the second lead 20B has substantially the same width as the width W23 of the terminal portion 23A, and the connection end so that one end and the other end in the long axis direction are bent toward the mounting portion 21A to increase the area. Parts 20B1, 20B2 and the like are formed. One connection end portion 20B1 has a region on which the protection element 90 is placed. Further, the other connection end portion 20B2 has a region for connecting the wire 60 of the light emitting element 40.

In a plan view, it is preferable that the area of the first lead 20A is larger than the area of the second lead 20B. Since the light emitting element 40 is mounted on the upper surface of the mounting portion 21A of the first lead 20A, the heat generated by the light emitting element 40 is transferred to the first lead due to the large area of the mounting portion 21A of the first lead 20A. It becomes easy to conduct to 20A. As a result, the temperature rise of the light emitting element 40 can be suppressed, so that the reliability of the light emitting device 10 can be improved.

It is preferable that the end faces of the first lead 20A and / or the second lead 20B are provided with concave portions or convex portions. By providing a concave portion or a convex portion at a position where the first lead 20A and / or the second lead 20B and the fixing member 20C come into contact with each other, the first lead 20A and / or the second lead 20B, the fixing member 20C, and the fixing member 20C can be provided. The contact area of can be increased. Thereby, the adhesion between the first lead 20A and / or the second lead 20B and the fixing member 20C can be improved.

The first lead 20A and the second lead 20B are used to apply a voltage from an external power source to an electronic component such as a light emitting element 40. The first lead 20A and the second lead 20B are preferably formed of a material having a relatively large thermal conductivity. For example, by using a material having a thermal conductivity of about 200 W / (m · K) or more, the heat generated by the light emitting element 40 can be easily conducted to the first lead 20A.

The first lead 20A and the second lead 20B are preferably formed of a high-strength material that can be easily punched or cut. For example, a metal such as copper, aluminum, gold, silver, tungsten, iron, nickel or an alloy thereof, or a single layer or a laminate such as phosphor bronze or copper containing iron can be used as a base material. The metal layer may be provided on the entire surface of the first lead 20A and the second lead 20B, or may be partially provided. Further, it may be provided on only one lead.

The first lead 20A and the second lead 20B may be provided with a reflective film on the surface. As the reflective film, one or more metals such as aluminum, copper, and gold can be used. In particular, it is preferable to use silver for the reflective film. By doing so, the light extraction efficiency of the light emitting device 10 can be improved.

Examples of the method for forming the reflective film on the first lead 20A and the second lead 20B include various methods such as a plating method, a vapor deposition method, a sputtering method, and an ion beam assisted vapor deposition method. The film thickness may be any film thickness that can effectively reflect the light from the light emitting element 40, for example, about 20 nm to 10 μm, preferably about 50 nm to 5 μm, and more preferably about 100 nm to 3 μm. The thickness and shape of the first lead 20A and the second lead 20B can be appropriately set within a range known in the art.

The fixing member 20C is provided around the first lead 20A, between the second lead 20B and the first lead 20A, and around one end and the other end of the second lead 20B, and the first lead 20A is provided. And the second lead 20B are fixed. The space between the fixing members 20C becomes wider as the distance from the connecting portion 22A between the two inclined fifth sides 21A5 and the sixth side 21A6 of the terminal portion 23A, the connecting portion 22A, and the mounting portion 21A increases. Molding resin is injected from the region (resin injection part), around the first lead 20A, between the second lead 20B and the first lead 20A, and around one end and the other end of the second lead 20B. Is formed by filling with a molding resin. By injecting the molding resin from the resin injection portion in this way, for example, the region between the second lead 20B and the first lead 20A, which is separated from the resin injection portion, can be easily filled with the molding resin. can. Further, since the shape of the mounting portion 21A of the first lead 20A is substantially polygonal, and the fifth side 21A5, the sixth side 21A6, the seventh side 21A7, and the eighth side 21A8 inclined at the corners are provided. It becomes easy to guide the molding resin around the first lead 20A, between the second lead 20B and the first lead 20A, and around one end and the other end of the second lead 20B.

Examples of the material of the fixing member 20C include resins such as epoxy resin, silicone resin, BT resin, polyamide resin, polyimide resin, nylon resin, and unsaturated polyester, and ceramics may be used. These materials may contain colorants, fillers, reinforcing fibers and the like known in the art. When a white filler such as titanium oxide or zinc oxide is used as the colorant, the light extraction efficiency of the light emitting device can be improved. Further, by containing a black filler such as carbon black having a large heat radiation coefficient, heat from the light emitting element 40 can be efficiently dissipated, and the strength of the resin can be further increased. Examples of the filler include silicon oxide and aluminum oxide. Examples of the reinforcing fiber include glass, calcium silicate, potassium titanate and the like.
In the above description, the first lead 20A has a mounting portion 21A on which the light emitting element 40 is mounted, but the second lead 20B may have a mounting portion. In the following description of each configuration, a case where the first lead 20A has a mounting portion 21A will be described as an example.

(Light emitting element 40)
The light emitting element 40 is mounted on the upper surface of the mounting portion 21A of the first lead 20A. The light emitting element 40 is a semiconductor element that emits light by itself when a voltage is applied, and has a light emitting surface on the upper surface. The number of light emitting elements 40 mounted on the upper surface of the mounting portion 21A is not particularly limited. In the drawing, two light emitting elements 40 are mounted on the upper surface of the mounting portion 21A, but one or three or more light emitting elements 40 may be mounted on the upper surface of the mounting portion 21A.

The light emitting device 40 preferably includes an element substrate 41 made of sapphire or the like arranged on the substrate 20 side, and a semiconductor layer 42 made of a nitride semiconductor or the like provided on the element substrate 41. The emission wavelength of the light emitting element 40 can be selected from the ultraviolet region to the infrared region, including the visible region (380 to 780 nm). For example, in the light emitting device 40 having a peak wavelength of 430 to 490 nm, In _X Al _Y Ga _1-XY N (0 ≦ X, 0 ≦ Y, X + Y ≦ 1) or the like can be used as the nitride semiconductor. Further, the light emitting element 40 may be arranged on the upper surface of the first lead 20A via a submount.

The shape of the light emitting element 40 may be any shape such as a polygon such as a triangle, a quadrangle, or a hexagon, or a shape similar to these, when viewed from above. Further, the light emitting element 40 is configured as a single-sided electrode in which the n electrode 43 and the p electrode 44 are formed on the same surface side, or the n electrode 43 and the p electrode 44 are formed on two different surfaces (for example, an upper surface and a lower surface). It may be configured as a double-sided electrode. The n electrode 43 and the p electrode 44 of the light emitting element 40 are connected to the first lead 20A and the second lead 20B, respectively, via a wire 60. The n electrode 43 and the p electrode 44 of the light emitting element 40 may be configured to be directly connected to the second lead 20B and the first lead 20A, respectively. For the wire 60, a metal material having excellent conductivity such as gold, aluminum, copper, and silver can be used.

When the light emitting element 40 is a single-sided electrode, it is face-up mounted on the upper surface of the first lead 20A. The face-up mounting is a form in which the surface of the light emitting element 40 opposite to the electrode forming surface is mounted toward the substrate 20. The joining member of the light emitting element 40 and the first lead 20A may be an insulating joining member or a conductive joining member, and a known joining member can be used. For example, examples of the insulating joining member include epoxy resin, silicone resin, and modified resins thereof, and examples of the conductive joining member include conductive pastes such as silver, gold, and palladium, and Au-Sn eutectic. Examples thereof include brazing materials such as solder and low melting point metal.
When the light emitting element 40 is a double-sided electrode, a well-known bonding member may be used as the bonding member between the light emitting element 40 and the first lead 20A as long as it is a conductive bonding member. For example, examples of the conductive joining member include conductive pastes such as silver, gold and palladium, solders such as Au—Sn eutectic, and brazing materials such as low melting point metals.

(Frame body)
As shown in FIG. 4, the frame body 50 is an annular frame body provided on the upper surface of the substrate 20 so as to surround the light emitting element 40. The inner and outer edges of the frame 50 may have various shapes such as a circular shape, an elliptical shape, a square shape, a hexagonal shape, an octagonal shape, and a chamfered shape at the corners of the polygonal shape. .. The frame body 50 can be formed by arranging an uncured raw material that is the source of the frame body 50 in a region where the frame body 50 is desired to be formed and curing the raw material.

The frame body 50 is provided on the boundary so as to cover the connecting portion between the first lead 20A and the fixing member 20C. That is, it is preferable that only the mounting portion 21A of the first lead 20A is exposed inside the frame body 50, and the fixing member 20C is not exposed inside the frame body 50. Since the fixing member 20C is not exposed inside the frame body 50, the light from the light emitting element is not absorbed by the black filler or the like contained in the fixing member 20C. As a result, the light from the light emitting element is reflected on the upper surface of the mounting portion 21A, so that the light extraction property of the light emitting device 10 is improved.
Further, regarding the size of the cross-sectional diameter D2 (see FIG. 1B) of the frame body 50, the mounting portion 21A of the first lead 20A is exposed inside the frame body 50, and the first lead 20A is exposed outside the frame body 50. (Terminal portion 23A) and a part of the second lead 20B and a part of the fixing member 20C are appropriately set so as to be exposed.

The cross-sectional shape of the frame 50 (see FIGS. 1B and 1C) is not particularly limited, and can have various shapes such as a circular shape including a partial circle, an elliptical shape including a partial ellipse, and a rectangular shape, and is a semi-elliptical shape. Is preferable. Further, the cross-sectional shape of the frame body 50 may be a shape in which the outer surface and the inner side surface are symmetrical, or may be an asymmetrical shape. In the case of asymmetry, the inclination of the outer surface of the frame 50 may be gentler than the inclination of the inner surface.

Examples of the material constituting the frame 50 include resins, ceramics, and metal bodies having an insulating coating on the surface. Examples of the resin material include phenol resin, epoxy resin, BT resin, PPA, silicone resin and the like. In particular, as the material of the frame body 50, a silicone resin having excellent light resistance is preferable. It is preferable that the base material resin of the frame body 50, which is the base material of the frame body 50, is the same material as the base material resin of the first member 30. As a result, the adhesion between the frame body 50 and the first member 30 is improved.

The frame 50 efficiently emits light from the light emitting element 40 by dispersing the light from the light emitting element 40 in the base material resin and powder such as a reflective member having a large difference in refractive index with respect to the base material resin. It can reflect light. As the reflective member, for example, titanium oxide, aluminum oxide, zirconium oxide, or magnesium oxide can be used. In particular, titanium oxide is preferable because it is relatively stable against moisture and has a high refractive index. The frame 50 is a member having a reflectance of 60% or more, preferably 90% or more, with respect to light from the light emitting element 40. The filling amount of the reflective member such as titanium oxide is appropriately selected depending on the molding conditions such as resin fluidity. For example, when titanium oxide is used, it is preferably blended in an amount of preferably 20 to 60 wt%, more preferably 25 to 35 wt%. Is preferable. By doing so, the light that has reached the frame 50 is less likely to be absorbed by the frame 50, and the light extraction property of the light emitting device 10 is improved.

(First member)
As shown in FIGS. 3 and 4, the first member 30 is formed on the outer peripheral side of the frame body 50 in a top view. The first member 30 is a member that covers at least a part of the upper surface of the fixing member 20C exposed from the frame body 50, and the inner side surface of the first member 30 is in contact with the frame body 50.
When the first member 30 covers at least a part of the upper surface of the fixing member 20C, the light extraction property and the light distribution property of the light emitting device 10 are improved. Further, when the first member 30 covers the entire upper surface of the fixing member 20C exposed on the outer peripheral side of the frame body 50, the light extraction property and the light distribution property of the light emitting device 10 are further improved. Since the inner side surface of the first member 30 is in contact with the frame body 50, the adhesion between the first member 30 and the frame body 50 is improved.

Specifically, as shown in FIG. 5A, a part of the light L1 emitted from the light emitting element 40 is reflected by the surface of the lens portion 71 of the second member 70, passes through the lens portion 71, and passes through the lens portion 71 to form the frame body 50. It is returned to the outside. When the fixing member 20C is a material that absorbs light, the returned light L2 may be absorbed by the fixing member 20C, but since the fixing member 20C is covered with the first member 30, the returned light L2 Is emitted to the outside as reflected light L3 without being absorbed by the fixing member 20C. As a result, the light extraction property of the light emitting device 10 is improved.
As shown in FIG. 5B, a plurality of light emitting devices 10 and 11 are used side by side in a lighting fixture or the like. Even in such a case, the reflected light L3 reflected by the first member 30 of the light emitting device 10 is not absorbed by the fixing member 20C of the adjacent light emitting device 11, but is reflected by the first member 30 covering the fixing member 20C. It is emitted to the outside as reflected light L4. As a result, it is possible to prevent deterioration of the light extraction property of each of the plurality of light emitting devices 10 and 11.

As shown in FIG. 1C, the first member 30 has an inclined region 31 (a region outside the upper end U) in a cross-sectional view, and the height H1 of the inclined region 31 is higher than the height H2 of the upper end of the frame body 50. It is formed low.
Since the first member 30 has the inclined region 31, the light L2 returned from the lens portion 71 of the second member 70 is reflected laterally outward by the inclined region 31 as the reflected light L3. As a result, the light distribution property of the light emitting device 10 is improved.
The height H1 of the inclined region 31, that is, the maximum value of the height of the inclined region 31 from the substrate 20 is 1 / of the height H2 from the substrate 20 at the upper end of the frame 50 because the luminous flux of the extracted light is improved. 3 or more is preferable.

As shown in FIG. 1C, the first member 30 has a curved shape in which the inclined region 31 is convex in a cross-sectional view, the first member 30 and the frame body 50 are in contact with each other, and the upper end U of the first member 30 is located. It may be in contact with the frame body 50. The inclination of the inclined region 31, which becomes higher as it approaches the upper end U, is preferably an inclination angle θ defined by an angle formed by the inclined surface and the upper surface of the substrate 20 at 30 to 60 degrees. When the inclination degree of the inclined region 31 is the above, the contact area between the first member 30 and the second member 70 increases as compared with the case where the inclined region 31 has a flat shape, so that the first member 30 and the second member Adhesion with 70 is improved. Further, if the inner surface surface of the first member 30 also has a curved shape that is convex in a cross-sectional view, the contact area between the first member 30 and the frame body 50 increases, so that the first member 30 and the frame body 50 are in close contact with each other. Sex improves. Further, the first member 30 may be left-right symmetrical or left-right asymmetric with respect to the perpendicular line Y1 drawn from the upper end U to the bottom in the cross-sectional view. In the case of left-right asymmetry, as shown in FIG. 1C, the inclination of the outer surface (inclined region 31) of the first member 30 can be made gentler than the inclination of the inner surface.

Since the inclined region 31 has such a convex curved shape, in the first member 30, the light L2 returned from the lens portion 71 is reflected over a wide range, that is, it is simply reflected outward as reflected light L3. Instead, it is also reflected upward as reflected light L5.
Further, in FIG. 1C, since there is a dent at a position where the outer surface of the first member 30 and the outer surface of the frame 50 are connected, the contact area with the second member 70 increases by the amount of the dent, and the contact area with the second member 70 increases. The adhesion between the first member 30 and the frame body 50 is further improved.

As shown in FIG. 1D, the shape of the first member 30 is a curved shape in which the inclined region 31 is convex in a cross-sectional view, and even if the upper end U of the first member 30 is located on the frame body 50 side. good. The fact that the upper end U is located on the frame body 50 side means that the vertical line Y1 drawn from the upper end U to the bottom side is on the frame body 50 side with respect to the perpendicular line Y2 passing through the center point C of the bottom side. When the frame body 50 does not touch the upper end U of the first member 30 but only contacts the inner side surface (the region inside from the upper end U), most of the returned light L2 is mostly the outer surface (inclined region) of the first member 30. Since it can be applied to 31), the reflected light L3 to the outer side can be increased. Further, the first member 30 can be configured such that the lower end of the outer surface of the frame body 50 is in contact with the outer surface (inclined region 31) of the first member 30.

As shown in FIG. 1E, the first member 30 has a curved shape in which the inclined region 31 is convex, and the lower end of the outer surface of the frame body 50 can be configured to be in contact with the substrate 20. Even with such a first member 30, most of the returned light L2 can be applied to the inclined region 31 of the first member 30, so that the reflected light L3 to the outer side can be increased.

The shape of the first member 30 may be the shape shown in FIG. 1F. The first member 30 has a curved shape in which the inclined region 31 is concave toward the lower end of the frame body 50 in a cross-sectional view, and the first member 30 and the frame body 50 are in contact with each other, and the upper end U of the first member 30 is U. May be in contact with the frame body 50. In such an inclined region 31, the contact area between the first member 30 and the second member 70 increases (compared to the case where the inclined region has a flat shape), so that the first member 30 and the second member 70 Adhesion is improved. Further, if the inner surface of the first member 30 also has a curved shape that is concave in cross-sectional view, the contact area between the first member 30 and the frame body 50 increases, so that the first member 30 and the frame body 50 are in close contact with each other. Sex improves. Further, the first member 30 may be left-right symmetrical or left-right asymmetric with respect to the perpendicular line Y1 drawn from the upper end U to the bottom in the cross-sectional view. Further, since the inclined region 31 has such a concave curved shape, the ratio of the light L2 returned from the lens portion 71 reflected laterally as the reflected light L3 increases in the first member 30.

As shown in FIG. 1G, the first member 30 has a curved shape in which the inclined region 31 is concave, and the lower end of the outer surface of the frame body 50 can be configured to be in contact with the substrate 20. Even with such a first member 30, most of the return light L2 can be applied to the inclined region 31 of the first member 30, so that the reflected light L3 to the outer side can be increased.

The inclined region 31 of the first member 30 is not limited to a convex or concave curved shape in a cross-sectional view, and is a corrugated shape in which the convex and concave shapes are adjacent to each other, or a corrugated shape in which a plurality of convex shapes are adjacent to each other. It can also be. If the inclined region 31 of the first member 30 has a flat shape, light can be taken out without being diffusely reflected, so that the light extraction efficiency is improved.

The first member 30 can be configured to be continuously provided on the entire circumference along the outer circumference of the frame body 50 in a top view. Further, the continuously provided first member 30 is a first member 30 that covers the four corners of the fixing member 20C having a large exposed area from the frame 50 when the substrate 20 is rectangular and the frame 50 is an annular shape. The height H1 may be higher than the height H1 of the first member 30 that covers other than the four corners. As a result, the height H1 of the first member 30 changes between the four corners of the substrate 20 and the corners other than the four corners, so that the height H2 of the frame body 50 overlapping the upper surface of the first member 30 changes so as to undulate all around. The height H2 of the frame body 50 has a non-uniform structure. As a result, as compared with the case where the height H2 of the frame body 50 is uniform, the contact area with the second member 70 is increased, and the adhesion between the frame body 50 and the second member 70 is improved. Further, by making the height H1 of the first member 30 covering other than the four corners lower than the height H1 of the first member 30 covering the four corners, the injection amount when the first member 30 is provided can be minimized. It can be done and the tact is good.

As shown in FIG. 4, the first member 30 may be provided intermittently along the outer periphery of the frame body 50 in a top view. The number of the first members 30 provided intermittently is not particularly limited, and is appropriately set in consideration of the reflection efficiency of the light returned from the lens unit 71. When the substrate 20 is rectangular and the frame 50 is a ring, it is preferable to provide the first member 30 so as to cover at least four corners of the fixing member 20C having a large exposed area from the frame 50. As a result, the light returned from the lens unit 71 can be sufficiently reflected by the first member 30, and the light extraction property and the light distribution property of the light emitting device 10 are sufficient. Even when the first member 30 is provided intermittently, if the height of the frame body 50 changes between the four corner regions and the regions other than the four corners, the contact area with the second member 70 increases and the frame The adhesion between the body 50 and the second member is improved.

The first member 30 is a member in which a reflective material is contained in a base material such as resin and ceramics. As the base material, resins such as phenol resin, epoxy resin, BT resin, PPA, and silicone resin are preferable. In particular, as the base material resin, a silicone resin having excellent light resistance is preferable. It is preferable that the base material resin of the first member 30 is the same material as the base material resin of the frame body 50. As a result, the adhesion between the frame body 50 and the first member 30 is improved.

The first member 30 efficiently disperses the light from the light emitting element 40 into the base resin, and disperses a reflective material such as powder having a large difference in refractive index with respect to the base resin. Can reflect the light of.
The reflective material is a member having a reflectance of 90% or more, preferably 95% or more, with respect to the light from the light emitting element 40. By doing so, the light L2 returned from the lens portion 71 that has reached the first member 30 is less likely to be absorbed by the first member 30, and the light extraction property of the light emitting device 10 is improved.
As the reflective material, for example, titanium oxide, aluminum oxide, zirconium oxide, and magnesium oxide can be used. In particular, titanium oxide is preferable because it is relatively stable against moisture and has a high refractive index. The content of titanium oxide in the first member 30 is preferably 10 to 60% by mass.

(Second member)
As shown in FIGS. 1A and 1B, the second member 70 is formed so as to cover the light emitting element 40, the frame body 50, and the first member 30. By covering the second member 70 to the outside of the frame body 50, the contact area of the second member can be increased and the second member 70 can be prevented from peeling off. Further, the second member 70 may be formed so as to cover at least a part of each of the first lead 20A and the second lead 20B of the substrate 20 on the outside of the first member 30. As a result, the peeling of the second member 70 is further reduced.

The second member 70 may have various shapes. Examples of the shape of the second member 70 include a plate shape, an upper surface convex lens shape, an upper surface concave lens shape, a Fresnel lens shape, and a lens shape having a concave portion near the center of the convex lens. With such a shape, the directivity characteristic of the extracted light in the second member 70 can be adjusted.

When the second member 70 has a lens shape, the lens portion 71 has a curved exit surface provided above the light emitting element 40 and is located above the first member 30. It may have a flange portion 72 extending outward from the lower portion. According to such a configuration, since the second member 70 has the flange portion 72, the light emitted from the light emitting element 40 is reflected by the upper surface and the side surface of the flange portion 72 to be diffused more widely, and the light is distributed. Sex improves.

The second member 70 is made of a translucent material capable of extracting light. As the translucent material constituting the second member 70, a resin such as a silicone resin or an epoxy resin, or glass can be exemplified.
The cross-sectional diameter D3 of the second member 70 (see FIG. 1B) may have any size as long as the second member 70 can cover the light emitting element 40, the frame body 50, and the first member 30. .. The cross-sectional diameter D3 of the second member 70 is appropriately determined in consideration of the light emitting area of the light emitting element 40.
The refractive index of the second member 70 may be any as long as the difference between the refractive index of the second member 70 and the refractive index of the atmosphere is within an appropriate range. The refractive index of the second member 70 is preferably about 1.4 to 1.6. When the refractive index of the second member 70 is within such a range, the light extraction property can be improved.

As shown in FIG. 1A, the light emitting device 10 according to the first embodiment may include a protective element 90. The protection element 90 is mounted on the connection end portion 21B1 of the second lead 20B, and is electrically connected to the mounting portion 21A of the first lead 20A by a wire 60. The mounting position of the protective element 90 is not limited to the above, and may be mounted on the mounting portion 21A of the first lead 20A.
For example, when a voltage in the reverse direction is applied to the light emitting element 40, the protection element 90 blocks a current flowing in the reverse direction, or when a forward voltage higher than the operating voltage of the light emitting element 40 is applied. In addition, it prevents an overcurrent from flowing through the light emitting element 40. Examples of the protection element 90 include a protection circuit and an electrostatic protection element, and specifically, a Zener diode can be used.

<Manufacturing method of light emitting device>
Next, two manufacturing methods of the light emitting device according to the first embodiment will be described.
(First manufacturing method)
FIG. 6 is a flowchart showing the flow of the first manufacturing method of the light emitting device according to the first embodiment. FIG. 7A is a cross-sectional view taken along the line VIIA-VIIA of FIG. 2, which schematically shows a substrate on which a light emitting element is placed in the manufacturing process of the first manufacturing method of the light emitting device according to the first embodiment. Is. FIG. 7B is a cross-sectional view taken along the line VIIB-VIIB of FIG. 3, which schematically shows a substrate provided with the first member in the manufacturing process of the first manufacturing method of the light emitting device according to the first embodiment. Is. FIG. 7C is a cross-sectional view taken along the line VIIC-VIIC of FIG. 4, which is a cross-sectional view schematically showing a substrate provided with a frame in the manufacturing process of the first manufacturing method of the light emitting device according to the first embodiment. be. FIG. 7D is a cross-sectional view schematically showing a method of providing a second member in the manufacturing process of the first manufacturing method of the light emitting device according to the first embodiment. In FIGS. 7A to 7C, the description of the wire is omitted.

As shown in FIGS. 6A to 7D, in the method of manufacturing the light emitting device 10, the light emitting element 40 is placed on the upper surface of the substrate 20 in which the first lead 20A and the second lead 20B are fixed by the fixing member 20C. Step S1 to provide a first member 30 containing a reflective material so as to surround the light emitting element 40 on the upper surface of the substrate 20 and cover at least a part of the upper surface of the fixing member 20C, and among the first members 30. Step S3 in which the frame 50 is provided on the upper surface of the substrate 20 so as to be in contact with the side surface and the upper surface of the substrate 20 so that the height from the substrate 20 is higher than that of the first member 30 and the light emitting element 40 is surrounded. A step S4 of providing a second member 70 that covers the light emitting element 40, the frame body 50, and the first member 30. Hereinafter, each step will be described.

(1) Step S1 for mounting the light emitting element
As shown in FIG. 7A, the step S1 for mounting the light emitting element is a step of mounting the light emitting element 40 on the upper surface of the substrate 20 in which the first lead 20A and the second lead 20B are fixed by the fixing member 20C. .. Preferably, the light emitting element 40 is mounted on the mounting portion 21A of the first lead 20A.
In the step S1 for mounting the light emitting element, the two light emitting elements 40 (see FIG. 1A) are mounted on the substrate 20 by a known method, and the element substrate 41 of the two light emitting elements 40 is used by using a known bonding member. The lower surface of the side and the upper surface of the substrate 20 are joined. Next, as shown in FIG. 1A, the n electrode 43 of one of the light emitting elements 40 is electrically connected to the first lead 20A via the wire 60. Further, the p electrode 44 of the other light emitting element 40 is electrically connected to the second lead 20B via the wire 60. Further, the p electrode 44 of one light emitting element 40 and the n electrode 43 of the other light emitting element 40 are electrically connected via the wire 60. The protective element 90 may be electrically connected to the first lead 20A via the wire 60. As a wire bonding method, a known method such as ball bonding or wedge bonding may be used.

(2) Step S2 for providing the first member
As shown in FIG. 7B, the step S2 for providing the first member is a step for providing the first member 30 containing the reflective material on the upper surface of the substrate 20. Since the step S2 for providing the first member is performed prior to the step S3 for providing the frame body, it is easy to confirm the installation area of the first member 30 on the upper surface of the substrate 20, and the first member 30 can be provided accurately. can. When applying the first member to the substrate 20, position authentication of the lead is required, but since the step S2 for providing the first member is performed prior to the step S3 for providing the frame, the position information of the lead is reduced. Therefore, the position authentication of the lead can be performed with high accuracy.
In the step S2 for providing the first member, when the base material of the first member 30 is made of resin, the first member 30 is surrounded by two light emitting elements 40 (see FIG. 1A) in a state where the base material resin is uncured. , Is injected and placed on the upper surface of the substrate 20 by a known method so as to cover at least a part of the upper surface of the fixing member 20C. The first member 30 may be cured together with the frame body 50 in the step S3 for providing the next frame body, or may be cured before the step S3 for providing the frame body 50. By adjusting the viscosity of the first member 30 in the uncured state, the shape of the inclined region 31 of the first member 30 in the cured state in a cross-sectional view can be changed to a convex or concave curved shape (FIGS. 1C, 1D, (See Fig. 1F), it can be adjusted to a flat shape, etc.
In step S2 for providing the first member, a solid material made of resin, ceramics, or the like may be produced and placed on the upper surface of the substrate 20 so as to cover at least a part of the upper surface of the fixing member 20C.
Further, the first member 30 may be injected continuously or intermittently. In the case of intermittent injection, it may be injected into each of the four corners of the fixing member 20C, or after injecting into each of the four corners of the fixing member 20C, it is injected into the points connecting the four corners of the fixing member 20C and the first member 30. May be injected so that the rings are connected in a ring shape when viewed from above.

(3) Step of providing a frame S3
As shown in FIG. 7C, the step S3 for providing the frame is a step for providing the frame 50 on the upper surface of the substrate 20. In the step S3 of providing the frame body, the frame body 50 is in contact with the inner side surface of the first member 30 and the upper surface of the base material 20 in a state where the base material resin is uncured, and the height from the base material 20 is the first in cross-sectional view. It is injected, placed, and cured on the upper surface of the substrate 20 so as to be higher than the member 30 and surround the two light emitting elements 40 (see FIG. 1A). In FIG. 7C, the frame body 50 is provided so that the lower end of the outer surface of the frame body 50 is in contact with the upper end of the first member 30, but the lower end of the outer surface of the frame body 50 is the first member 30. It may be provided so as to be in contact with the outer surface outside the upper end (contact with the inclined region 31), or the lower end of the outer surface of the frame body 50 may be provided so as to be in contact with the inner side surface inside the upper end of the first member 30. can. When the frame body 50 is provided so that the lower end of the outer surface of the frame body 50 is in contact with the outer surface surface outside the upper end of the first member 30, the contact area between the first member 30 and the frame body 50 increases, and the first member 30 And the adhesion of the frame body 50 is improved.

(4) Step of providing the second member S4
As shown in FIG. 7D, the step S4 for providing the second member is a step for providing the second member 70 that covers the light emitting element 40, the frame body 50, and the first member 30. Further, in the step S4 of providing the second member, the second member 70 may be provided so as to cover at least a part of each of the first lead 20A and the second lead 20B on the outside of the first member 30.

In the step S4 for providing the second member, it is preferable to provide the second member 70 by, for example, transfer molding. In transfer molding, first, an upper mold 101 having a hollow portion having a hollow portion having a shape corresponding to the shape of the second member 70, for example, a lens portion 71 and a flange portion 72, is formed on the upper surface of the substrate 20, and the hollow portion is the light emitting element 40. , Arrange so as to cover the frame body 50 and the first member 30. Next, the lower mold 102 is arranged so as to cover the lower surface of the substrate 20 on which the light emitting element 40, the frame body 50, and the first member 30 are not provided. In the state of being arranged in this way, the edge portion of the cavity portion corresponding to the lens portion 71 of the upper mold 101 is arranged outside the frame body 50, and the frame body 50 is placed on the surface of the cavity portion of the upper mold 101. It is preferable not to make contact. Then, the uncured resin or glass constituting the second member 70 is poured into the cavity portion from the injection port 101a, and this is cured. As a result, a second member 70 that covers the light emitting element 40, the frame body 50, and the first member 30 is provided on the upper surface of the substrate 20. Further, a second member 70 that covers at least a part of each of the first lead 20A and the second lead 20B may be provided on the outside of the first member 30.

(Second manufacturing method)
FIG. 8 is a flowchart showing the flow of the second manufacturing method of the light emitting device according to the first embodiment. FIG. 9A is a cross-sectional view schematically showing a substrate provided with a frame in the manufacturing process of the second manufacturing method of the light emitting device according to the first embodiment. FIG. 9B is a cross-sectional view schematically showing a substrate provided with the first member in the manufacturing process of the second manufacturing method of the light emitting device according to the first embodiment. In FIGS. 9A and 9B, the description of the wire is omitted.

The second manufacturing method of the light emitting device according to the first embodiment is the above-mentioned first manufacturing method (see FIG. 6) except that the step S3 for providing the frame is performed prior to the step S2 for providing the first member. ).
As shown in FIG. 9A, in the step S3 for providing the frame body, the frame body 50 is injected and arranged on the upper surface of the substrate 20 so as to surround the light emitting element 40 with the base material resin uncured. The curing of the frame body 50 is preferably performed before the step S2 in which the first member is provided. As a result, the shape of the frame body 50 does not change when the first member 30 is formed, and the predetermined shape can be maintained. The base material resin of the frame body 50 can be injected and placed on the boundary between the fixing member 20C and the first lead 20A in an uncured state.
As shown in FIG. 9B, in the step S2 for providing the first member, the first member 30 containing the reflective material is in contact with the outer surface of the frame 50 and the upper surface of the substrate 20 with the base resin uncured. The upper surface of at least a part of the fixing member 20C exposed on the outer peripheral side of the frame body 50 is covered, and the height from the substrate 20 is lower than that of the frame body 50 in a cross-sectional view. By adjusting the viscosity of the first member 30, the shape of the inclined region 31 of the first member 30 in the cross-sectional view becomes higher as the height from the substrate 20 approaches the frame 50, and becomes convex or concave. (See FIGS. 1E and 1G), the shape can be adjusted to a flat shape or the like.
When the step S2 for providing the first member is performed after the step S3 for providing the frame body, it is easy to control the shape of the inclined region 31 of the first member 30 in the cross-sectional view. As a result, the light distribution property of the light emitting device 10 can be controlled by controlling the shape of the first member 30. Further, the amount of the first member 30 applied can be minimized, and the manufacturing efficiency is improved.

[Second Embodiment]
<Light emitting device>
First, the light emitting device according to the second embodiment will be described. FIG. 10 is a cross-sectional view schematically showing the configuration of the light emitting device according to the second embodiment. The same components as those of the light emitting device according to the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.

As shown in FIG. 10, in addition to the same configuration as the light emitting device 10, the light emitting device 10A further includes a third member 80 provided inside the frame body 50 and covering the light emitting element 40. The second member 70 covers the light emitting element 40, the third member 80, the frame body 50, and the first member 30. Further, in the light emitting device 10A, it is preferable that the third member 80 contains a phosphor.
By providing the third member 80, it is possible to further suppress the entry of dust and the like into the light emitting device 10A from the outside, and it is possible to protect the wire 60, and the reliability is improved. Since the third member 80 contains a phosphor, the wavelength of the light emitted from the light emitting element 40 can be converted, so that the color tone of the extracted light can be adjusted. Further, since the light wavelength-converted by the phosphor is omnidirectional and radiated in all directions, the amount of light returned from the lens portion 71 and hitting the fixing member 20C exposed on the outer peripheral side of the frame body 50 also increases. The upper surface of the fixing member 20C is covered with the first member 30, and the light returned from the lens portion 71 is reflected upward and sideways by the first member 30 to be taken out light. As a result, the light extraction property and the light distribution property in the light emitting device 10A are improved.

(Third member 80)
The third member 80 is a member that covers the light emitting element 40 and encloses the light emitting element 40 inside the frame body 50. As shown in FIG. 10, the third member exceeds the height of the frame body 50 in a cross-sectional view, and the center is curved upward so as to be higher directly above the light emitting element 40 and comes into contact with the inner surface surface of the frame body 50. It may be provided so as to be in contact with the inner side surface of the frame body 50 at a height not exceeding the height of the frame body 50. In the former case, the effect of suppressing the reflected light generated at the interface between the third member 80 and the second member 70 can be obtained.
As the material constituting the third member 80, a translucent resin, glass, or the like can be used. In particular, it is preferable to use a resin for the third member 80. When the base materials of the first member 30 and the frame body 50 are each made of resin, the third member 80 is also made of resin, so that the adhesion between the third member 80 and the first member 30 and the third member 80 are achieved. And the adhesion with the frame body 50 can be improved. Examples of the resin of the third member 80 include polycarbonate resin, epoxy resin, phenol resin, silicone resin, acrylic resin, polymethylpentene resin, polynorbornene resin, modified resins thereof, and hybrid resins containing one or more of these resins. Can be used. In particular, as the material of the third member 80, a dimethyl-based silicone resin and a phenyl-based silicone resin having excellent light resistance are preferable. The third member 80 preferably contains a fluorescent substance, and may contain a light diffusing agent. When the third member 80 contains a phosphor, the shape of the upper surface of the third member 80 is centered downward so that the distance between the phosphor and the light emitting element 40 is short in consideration of luminous efficiency. A shape that curves toward it is preferable.

(Fluorescent material)
As the phosphor, particles of a phosphor that are excited by light emitted from the light emitting element 40 and can convert the wavelength of the light emitted from the light emitting element 40 or reflected by the first member 30 are used. For example, as a fluorescent substance that can be excited by a blue light emitting element or an ultraviolet light emitting element, an yttrium aluminum garnet fluorescent substance (YAG: Ce) activated by cerium and a lutetium aluminum garnet fluorescent substance activated by cerium are used. (LAG: Ce), europium and / or chromium-activated nitrogen-containing calcium aluminosilicate-based fluorophore (CaO-Al ₂ O ₃ -SiO ₂ : Eu, Cr), europium-activated silicate-based fluorophore ((() Sr, Ba) ₂ SiO ₄ : Eu), β-sialon fluorescent material, CASN-based fluorescent material, SCASN-based fluorescent material and other room-based fluorescent materials; KSF-based fluorescent material and other fluoride-based fluorescent materials and sulfide-based fluorescent materials , Chloride-based phosphors, silicate-based phosphors, phosphate-based phosphors, quantum dot phosphors and the like. By combining these phosphors with a blue light emitting element or an ultraviolet light emitting element, a light emitting device 10 having various wavelengths can be manufactured.

(Light diffuser)
As the material of the light diffusing agent, titanium oxide, zirconium oxide, aluminum oxide, silicon oxide and the like can be used. In particular, titanium oxide is preferable because it is relatively stable against moisture and has a high refractive index.

<Manufacturing method of light emitting device>
Next, two manufacturing methods of the light emitting device according to the second embodiment will be described. FIG. 11 is a flowchart showing the flow of the first manufacturing method of the light emitting device according to the second embodiment. FIG. 12 is a flowchart showing the flow of the second manufacturing method of the light emitting device according to the second embodiment. The same steps as those for manufacturing the light emitting device according to the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.

(First manufacturing method)
As shown in FIG. 11, in the first manufacturing method of the light emitting device 10A, in addition to the same step as the manufacturing method of the light emitting device 10 (see FIG. 6), a third member is provided after the step S4 for providing the frame. Step S5 is further included.
In the first manufacturing method of the light emitting device 10A, the inclined region 31 of the first member 30 has a curved shape (see FIGS. 1C and 1D) that is convex toward the upper side of the substrate 20 in a cross-sectional view, and a frame in a cross-sectional view. It has a curved shape (see FIG. 1F) that becomes concave toward the lower end of 50. Further, in the step S4 for providing the second member, the second member 70 that covers the light emitting element 40, the third member 80, the frame body 50, and the first member 30 is provided.
In the first manufacturing method of the light emitting device 10A, the reliability of the light emitting device 10A and the color tone of the extracted light are improved by including the step S5 in which the third member is provided.

(1) Step S5 for providing the third member
The step S5 for providing the third member is a step for providing the third member 80 that covers the light emitting element 40 inside the frame body 50. The method of providing the third member 80 is performed by a known method such as potting or spraying.
Although the third member 80 has been described as being formed so that the center is curved upward so as to be higher directly above the light emitting element 40, the third member 80 may be formed so as to have the same height uniformly. It may be formed so that the center curves downward.

In the first manufacturing method in which the first member 30 is manufactured prior to the frame body 50, the substrate 20 is rectangular in top view, the frame body 50 is an annular body, and the first member 30 is along the outer periphery of the frame body 50. When manufacturing the light emitting device 10A continuously provided on the entire circumference, it is preferable to perform the step S2 for providing the first member by the following procedure.
It is preferable that the injection amount of the first member 30 in the step S2 for providing the first member is large at the positions of the four corners of the fixing member 20C exposed to the outside of the frame body 50 and small at the positions other than the four corners. As a result, in the step S3 of providing the frame body, the upper end of the frame body 50 in contact with the first member 30 changes so as to undulate over the entire circumference, and the height of the frame body 50 becomes non-uniform. Since the height of the frame body 50 is not uniform in the step S4 for providing the second member, the contact between the frame body 50 and the second member 70 is compared with the case where the height of the frame body 50 is uniform. The area is increased, and the adhesion between the frame body 50 and the second member 70 is improved.

(Second manufacturing method)
As shown in FIG. 12, the second manufacturing method of the light emitting device 10A is the same as the second manufacturing method of the light emitting device 10 (see FIG. 8), and after the step S2 of providing the first member, the second manufacturing method is performed. The step S5 for providing the three members is further included. Then, in the second manufacturing method of the light emitting device 10A, the inclined region 31 of the first member 30 has a curved shape (see FIG. 1G) that is concave toward the lower end of the frame body 50 in cross-sectional view, and is convex in cross-sectional view. It can be a curved shape (see FIG. 1E) or the like. Further, in the step S4 for providing the second member, the second member 70 that covers the light emitting element 40, the third member 80, the frame body 50, and the first member 30 is provided.
In the second manufacturing method of the light emitting device 10A, the reliability of the light emitting device 10A and the color tone of the extracted light are improved by including the step S5 in which the third member is provided.

In the above-described embodiment, the embodiment for carrying out the invention has been described more specifically, but the gist of the present invention is not limited to these descriptions, and is widely interpreted based on the description of the scope of claims. There must be. Needless to say, various changes and modifications based on these descriptions are also included in the gist of the present invention.

10 Light emitting device 10A Light emitting device 11 Light emitting device 20 Base 20A 1st lead 21A Mounting part 21A1 1st side 21A2 2nd side 21A3 3rd side 21A4 4th side 21A5 5th side 21A6 6th side 21A7 7th side 21A8 8th Side 22A Connection part 23A Terminal part 20B Second lead 20C Fixing member 30 First member 31 Tilt region 40 Light emitting element 41 Element substrate 42 Semiconductor layer 43 n Electrode 44 p Electrode 50 Frame 60 Wire 70 Second member 71 Lens part 72 Part 80 Third member 90 Protective element C Center point U Upper end L1 Light L2 Light L3 Reflected light L4 Reflected light L5 Reflected light Y1 Vertical wire Y2 Vertical wire S1 Step S2 Step S3 Step S4 Step S5 Step

Claims (18)

A substrate having a first lead, a second lead, and a fixing member for fixing the first lead and the second lead.
A light emitting element mounted on the upper surface of the substrate and
A frame provided on the upper surface of the substrate so as to surround the light emitting element, and
A first member containing a reflective material that covers at least a part of the upper surface of the fixing member exposed on the outer peripheral side of the frame body in a top view and is in contact with the outer surface of the frame body.
The light emitting element, the frame body, and the second member covering the first member are provided.
The first member has an inclined region in a cross-sectional view, and the height of the inclined region is formed to be lower than the upper end of the frame body. The light emitting device according to claim 1, wherein the base material of the first member is a resin. A third member provided inside the frame and covering the light emitting element is further provided.
The light emitting device according to claim 1 or 2, wherein the second member covers the light emitting element, the third member, the frame body, and the first member. The light emitting device according to claim 3, wherein the third member contains a phosphor. The light emitting device according to any one of claims 1 to 4, wherein the frame is provided on the boundary between the fixing member and the first lead. The light emitting device according to any one of claims 1 to 5, wherein the inclined region has a curved shape that is convex in a cross-sectional view. The inclined region has a curved shape that is convex in a cross-sectional view, and the upper end of the first member is located on the frame body side and does not come into contact with the frame body according to any one of claims 1 to 5. The light emitting device described. The light emitting device according to any one of claims 1 to 5, wherein the inclined region has a curved shape that is concave toward the lower end of the frame in a cross-sectional view. The light emitting device according to any one of claims 1 to 8, wherein the first member is continuously provided on the entire circumference along the outer periphery of the frame body in a top view. The light emitting device according to any one of claims 1 to 8, wherein the first member is intermittently provided along the outer periphery of the frame body in a top view. The light emitting device according to claim 9 or 10, wherein the substrate has a rectangular shape when viewed from above, and the first member is provided at at least four corners of the fixing member exposed on the outer peripheral side of the frame. The light emitting device according to any one of claims 1 to 11, wherein the reflective material is titanium oxide. The light emitting device according to any one of claims 1 to 12, wherein the frame and the first member contain a base resin of the same material. The second member is made of a translucent material, and has a lens portion provided above the light emitting element, a flange portion extending outward from the lower portion of the lens portion so as to be located above the first member, and a flange portion. The light emitting device according to any one of claims 1 to 13. A step of placing a light emitting element on the upper surface of a substrate in which the first lead and the second lead are fixed by a fixing member, and
A step of surrounding the light emitting element on the upper surface of the substrate and providing a first member containing a reflective material so as to cover at least a part of the upper surface of the fixing member.
A frame on the upper surface of the substrate so as to be in contact with the inner surface of the first member and the upper surface of the substrate, the height from the substrate is higher than that of the first member in cross-sectional view, and the light emitting element is surrounded. And the process of providing
A method for manufacturing a light emitting device, comprising a step of providing a light emitting element, a frame body, and a second member covering the first member. After the step of providing the frame body, a step of providing a third member for covering the light emitting element is further included inside the frame body.
The method for manufacturing a light emitting device according to claim 15, wherein in the step of providing the second member, the light emitting element, the third member, the frame body, and the second member covering the first member are provided. A step of placing a light emitting element on the upper surface of a substrate in which the first lead and the second lead are fixed by a fixing member, and
A step of providing a frame on the upper surface of the substrate so as to surround the light emitting element, and
It is in contact with the outer surface of the frame and the upper surface of the substrate, covers at least a part of the upper surface of the fixing member exposed on the outer peripheral side of the frame, and the height from the substrate is the height of the frame in cross-sectional view. The process of providing the first member containing the reflective material so that it is lower than the body,
A method for manufacturing a light emitting device, comprising a step of providing a light emitting element, a frame body, and a second member covering the first member. After the step of providing the first member, a step of providing a third member for covering the light emitting element is further included inside the frame.
The method for manufacturing a light emitting device according to claim 17, wherein in the step of providing the second member, the light emitting element, the third member, the frame body, and the second member covering the first member are provided.

Images