JP7137084B2 - light emitting device - Google Patents

Description

The present invention relates to light emitting devices.

2. Description of the Related Art Light-emitting devices using light-emitting elements such as light-emitting diodes or laser diodes are used in many fields including general lighting such as room lighting, vehicle-mounted light sources, backlights for liquid crystal displays, and the like. Performance required for these light-emitting devices is increasing day by day, and further improvement in reliability is required.

Examples of the base on which the light emitting element is mounted include a ceramic base such as alumina and aluminum nitride provided with wiring, and a resin package integrally formed with a lead frame. Further, there is known a light emitting device in which a resin frame surrounding a light emitting element is formed on a base portion integrally molded with a lead frame (for example, Patent Document 1).

JP 2013-206895 A

However, as the applications of light-emitting devices using light-emitting elements expand, there is a growing demand for efficient extraction of light emitted from the light-emitting elements.
SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a light-emitting device capable of efficiently extracting light emitted from a light-emitting element.

In one embodiment of the light emitting device according to the present invention, a first lead and a second lead are supported by a resin member. a light emitting element provided on the surface of the first lead of the top surface; and a first surface surrounding the light emitting element on the top surface and consisting of a part of the surface of the first lead on the inside of the top surface. a resin frame provided so as to expose one or more second surfaces formed of part of the surface of the resin member,
At least one of said second surfaces is covered by a reflective member.

According to the light emitting device of one embodiment of the present invention configured as described above, light emitted from the light emitting element can be extracted efficiently.

1 is a top view of a light emitting device according to an embodiment of the invention; FIG. FIG. 2 is a top view of the light emitting device according to the embodiment, with the resin frame and the sealing member omitted. FIG. 2 is a top view of the light emitting device according to the embodiment of the present invention, with the sealing member omitted. FIG. 2 is a cross-sectional view taken along the line AA of FIG. 1; FIG. 2 is a cross-sectional view taken along line BB of FIG. 1; FIG. 2 is a sectional view taken along line CC of FIG. 1; FIG. 4 is a cross-sectional view of a light-emitting device according to Modification 1 of the embodiment of the present invention; It is a top view of the light-emitting device which concerns on the modification 2 of embodiment which concerns on this invention. It is a top view of the light-emitting device which concerns on the modification 3 of embodiment which concerns on this invention. FIG. 7 is a cross-sectional view taken along line BB of FIG. 6;

A mode for carrying out the present invention will be described below with reference to the drawings. However, the embodiments shown below are examples of light-emitting devices for embodying the technical idea of the present invention, and the present invention is not limited to the following light-emitting devices.

In addition, this specification does not specify the members shown in the claims as the members of the embodiment. In particular, the dimensions, materials, shapes, relative positions, and the like of components described in the embodiments are not intended to limit the scope of the present invention unless otherwise specified. Note that the sizes and positional relationships of members shown in each drawing may be exaggerated for clarity of explanation. Furthermore, in the following description, the same names and symbols indicate the same or homogeneous members, and detailed description thereof will be omitted as appropriate.

<Embodiment>
As shown in FIG. 1 and the like, the light emitting device of the embodiment includes a base 30, a light emitting element 40 provided on the upper surface of the base 30, a resin frame 50 surrounding the light emitting element 40 on the upper surface of the base 30, a resin frame and a sealing member 70 that seals the light emitting element 40 inside the 50 .
The base 30 includes a first lead 20A, a second lead 20B, and a resin member 10 that supports the first lead 20A and the second lead 20B. The surface of the second lead 20B and the surface of the resin member 10 are included.
The light emitting element 40 is provided on the surface of the first lead 20A on the upper surface of the substrate 30. As shown in FIG.
The resin frame 50 is provided on the upper surface of the base 30 so as to surround the light emitting element 40 and expose part of the surface of the first lead 20A and part of the surface of the resin member 10 to the inside.
In the following description, the surface of the first lead 20A located inside the resin frame 50 on the upper surface 31 of the substrate 30 is referred to as a first surface 25. The surface of the resin member 10 in the region of is called a second surface 15 .

In addition, in the light emitting device of the embodiment, the second surface 15 , which is a part of the surface of the resin member 10 exposed inside the resin frame 50 , is covered with the reflecting member 11 . As a result, absorption of light emitted by the light emitting element 40 by the resin member 10 can be suppressed, and the light emitted by the light emitting element 40 can be efficiently extracted.

Hereinafter, the light emitting device of the embodiment will be described in detail.
1. Technical Significance of Reflecting Member 11 in Light-Emitting Device of Embodiment In the light-emitting device 1000 of the embodiment, the light-emitting element 40 and the resin frame 50 surrounding the light-emitting element 40 are provided on the upper surface of the base 30 , and light is emitted inside the resin frame 50 . The element 40 is sealed, and the light emitted by the light emitting element 40 is extracted to the outside through the sealing member 70 . In the above configuration, in order to efficiently extract the light emitted by the light emitting element 40 to the outside, the light from the light emitting element should be reflected on the upper surface of the substrate 30 and extracted upward. Therefore, it is conceivable to increase the ratio of the surface of the first lead 20</b>A made of metal having a relatively high light reflectance to the entire upper surface of the base 30 inside the resin frame 50 . However, reducing the exposed area of the surface (second surface 15 ) of the resin member 10 inside the resin frame 50 has the following restrictions.

First, the base 30 is supported by the resin member 10 while the first lead 20A and the second lead 20B are electrically separated. Therefore, in order to reliably support the first lead 20A and the second lead 20B and to insulate the first lead 20A and the second lead 20B, the ratio of the surface of the resin member 10 to the upper surface of the substrate 30 should be increased to a certain level or more. There is a structural constraint that it is difficult to make it small.
It is also conceivable to increase the reflectance of the resin member 10 itself by adding a filler such as titanium oxide to the resin member 10 .
However, the resin member 10 is required to reliably support the first lead 20A and the second lead 20B in an electrically separated state. In addition, it is not always easy to provide a reflection function.

Also, the substrate 30 is formed by, for example, setting the first lead 20A and the second lead 20B in a mold, and molding resin (hereinafter, all means uncured resin to become the resin member 10) into the first lead 20A. and second lead 20B.
Therefore, when the base body 30 is produced by molding, it is desirable to secure a certain area or more for arranging the injection port for injecting the molding resin, and the ratio of the surface of the resin member 10 to the upper surface of the base body is set to a certain level. There is also a restriction in manufacturing the substrate that it is difficult to make it smaller than this.
Furthermore, in recent years, there has been a trend toward further miniaturization, and if an attempt is made to secure the resin member 10 necessary to support the first lead 20A and the second lead 20B in an electrically insulated state, the entire base body needs to be The ratio of the resin member 10 to the total tends to increase rather. That is, if the resin member 10 is reduced at the same rate as the entire substrate, the distance between the first lead 20A and the second lead 20B becomes narrower, and insulation cannot be maintained, and the strength of the support may be insufficient. Because it becomes
Therefore, it is becoming more and more difficult to reduce the ratio of the surface of the resin member 10 to the upper surface of the base 30 .

Therefore, by covering the surface (second surface 15) of the resin member 10 exposed on the upper surface of the base 30 inside the resin frame 50 with a reflective member, absorption of light by the resin member 10 can be suppressed.
A specific configuration of the light emitting device according to the embodiment will be described below.

2. Specific Configuration of Light Emitting Device 1000 of Embodiment 2-1. base 30
As shown in FIG. 3A, the base 30 includes a conductive member 20 including a first lead 20A and a second lead 20B and a resin member 10. As shown in FIG. The substrate 30 has an upper surface 31 and a lower surface 32, and the upper surface 31 and the lower surface 32 include the surface of the first lead 20A, the surface of the second lead 20B, and the surface of the resin member 10, respectively. As shown in FIG. 2A and the like, the first lead 20A has, for example, a substantially polygonal wide portion 21A, a terminal portion 23A, and a connection portion 22A connecting the wide portion 21A and the terminal portion 23A. there is The width W22 of the connection portion 22A is narrower than the width W21 of the wide portion 21A and the width W23 of the terminal portion 23A. Here, in this specification, the width refers to the maximum length in the direction orthogonal to the direction in which the connecting portion 22A extends from the wide portion 21A.

More specifically, the wide portion 21A
(1) a first side 21A1 that is a boundary side with the connecting portion 22A and has the same length as the width W22 of the connecting portion 22A;
(2) a second side 21A2 parallel to and facing the first side 21A1;
(3) a third side 21A3 orthogonal to the first side 21A1 and the second side 21A2;
(4) a fourth side 21A4 orthogonal to the first side 21A1 and the second side 21A2 and facing the third side 21A3;
(5) an inclined fifth side 21A5 connecting the first side 21A1 and the third side 21A3;
(6) an inclined sixth side 21A6 connecting the first side 21A1 and the fourth side 21A4;
(7) an inclined seventh side 21A7 connecting the second side 21A2 and the third side 21A3;
(8) an inclined eighth side 21A8 connecting the second side 21A2 and the fourth side 21A4;
and is formed in a substantially polygonal shape in plan view.
Here, the second side 21A2 of the wide portion 21A is longer than the first side 21A1.

For example, the longitudinal length W23 of the terminal portion 23A is longer than the second side 21A2 of the wide portion 21A. Between the 5th side 21A5 and the 6th side 21A6, the width increases as the distance from the connecting portion 22A increases. Then, the resin member 10 is formed around the widened portion along the widened region from the connecting portion.

The second lead 20B is arranged so that the interval with the wide portion 21A is constant. Specifically, the length from one end to the other end in the longitudinal direction of the second lead 20B is substantially the same as the width W21 of the wide portion 21A. bent inwards. The side of the second lead 20B facing the wide portion 21A is bent inward at one end and the other end so as to face the seventh side 21A7 and the eighth side 21A8 of the wide portion 21A in parallel.

In the base 30, the resin member 10 is formed around the wide portion 21A of the first lead 20A and around one end and the other end of the second lead 20B, including the region between the second lead 20B and the first lead 20A. provided to support the first lead 20A and the second lead 20B. The resin member 10 is, for example, widened from the terminal portion 23A, the connecting portion 22A, and the wide portion 21A between the two inclined fifth sides 21A5 and sixth sides 21A6 toward the second lead 20B from the connecting portion 22A. Molding resin is injected from the two regions (resin injection portions), and the region between the second lead 20B and the first lead 20A, around the wide portion 21A of the first lead 20A, and one end portion of the second lead 20B are formed. and the other end by filling molding resin. In this way, by injecting the molding resin from the two resin-injected portions that widen as the distance from the connection portion 22A increases, the distance between the resin-injected portions, for example, between the second lead 20B and the first lead 20A, is increased. The molding resin can be easily injected into the area of . Further, in the light emitting device of the embodiment, the wide portion 21A of the first lead 20A has a substantially polygonal shape, and the fifth side 21A5, the sixth side 21A6, the seventh side 21A7, and the eighth side 21A8 inclined at the corners. , the resin member 10 can be easily removed around the wide portion 21A of the first lead 20A and one end and the other end of the second lead 20B, including the region between the second leads 20B and the first leads 20A. can be placed around the

2-2. light emitting element 40
The light-emitting element 40 exemplified here has an upper surface as a light-emitting surface, and an n-electrode and a p-electrode are provided on the upper surface. Although the upper surface of the light emitting element 40 is rectangular in FIG. 1 and the like, the shape of the upper surface may be any shape. The light emitting element 40 is mounted face up on the first surface 25 of the first lead 20A with the upper surface, which is the light emitting surface, facing up. A bonding member that bonds the light emitting element 40 and the first lead 20A may be an insulating bonding member or a conductive bonding member, and a known bonding member can be used. The n-electrode and p-electrode of the light emitting element 40 are connected to the first lead 20A and the second lead 20B via wires 60, respectively. The n-electrode and p-electrode of the light emitting element 40 may be connected to the second lead 20B and the first lead 20A through wires 60, respectively.

2-3. Resin frame 50
In the light emitting device of the embodiment, as shown in FIG. 2B, the resin frame 50 covers part of the wide portion 21A around the wide portion 21A of the first lead 20A, and the surface of the resin member 10 is placed inside the resin frame 50. (second surface 15) is exposed. In FIG. 2B, the portions of the first lead 20A and the second lead 20B covered with the resin frame 50 are hatched. In the light emitting device of the embodiment, as shown in FIG. 2B, the resin frame 50 has the first lead 20A with a predetermined width along the first side 21A1, the second side 21A2, the third side 21A3 and the fourth side 21A4. Between the fifth side 21A5 and the sixth side 21A6 of the wide portion 21A and the lower end of the inner periphery of the resin frame 50, and between the seventh side 21A7 and the eighth side 21A8 of the wide portion 21A and the lower end of the inner periphery of the resin frame 50 The surface (second surface 15 ) of the resin member 10 is exposed inside the resin frame 50 . As described above, in the light emitting device of the embodiment, the resin frame 50 is formed to have a substantially rectangular top view shape, and the second surfaces are formed inside the four corners at the lower end of the inner circumference of the substantially rectangular resin frame 50 . 15 are exposed, and the four second surfaces 15 thereof are each covered with a reflective member 11 as described later.

2-4. Reflective member 11
As shown in FIG. 3A, the reflecting member 11 has, for example, an inner (the side closer to the center of the resin frame 50) end portion formed between the surface (second surface 15) of the resin member 10 and the surface of the wide portion 21A of the first lead. (the first surface 25 ) and formed so that the outer end is positioned on the resin frame 50, but it does not have to be completely aligned with the boundary, and the resin member It suffices if most of the surface of 10 (second surface 15) is covered. In the light emitting device of the embodiment, the reflecting member 11 may be formed with substantially the same thickness as the surface (second surface 15) of the resin member 10 inside the resin frame 50, but preferably the reflecting member 11 is formed so that the thickness increases as it approaches the resin frame 50 . In this way, when the reflecting member 11 is formed so as to be thicker as it approaches the resin frame 50 and has an inclined surface, the light emitted by the light emitting element is directed upward (light extraction) by the inclined surface of the reflecting member 11 . direction), and the extraction efficiency can be increased. Further, when the resin frame has a shape having corners such as a rectangle, the corners are covered with the reflecting member 11, so that diffused reflection of light can be prevented and extraction efficiency can be further increased. Moreover, the inclination angle of the surface of the reflecting member 11 with respect to the second surface 15 at the inner end of the reflecting member 11 away from the resin frame 50 is preferably smaller than the internal angle at the inner peripheral end of the resin frame 50 . In other words, the reflecting member 11 is preferably formed so that the inclination angle of the lower end of the inclined surface of the reflecting member 11 (the lower end away from the resin frame 50) is smaller than the inner angle of the inner peripheral lower end of the resin frame 50. Thereby, the light extraction efficiency can be further increased.

In the light-emitting device of the above-described embodiment, a part of the outer circumference of the surface (first surface 25 ) of the wide portion 21A of the first lead exposed on the upper surface of the base body 30 inside the resin frame 50 is the inner circumference of the resin frame 50. The surface (second surface 15) of the resin member 10 is exposed between a portion of the outer periphery of the first surface 25 and the lower end of the inner periphery of the resin frame 50, and the exposed resin member A reflecting member 11 is formed on the surface of 10 (second surface 15). This makes it possible to suppress absorption of light emitted by the light emitting element by the resin member 10, and to provide a light emitting device with high light extraction efficiency.

Further, in the light emitting device of the above embodiment, even if the surface (second surface 15) of the resin member 10 is exposed inside the resin frame 50, by forming the reflecting member 11 on the second surface 15, Absorption of light by the resin member 10 can be suppressed. As a result, the surface (second surface 15) of the resin member 10 exposed to the inside of the resin frame 50 is not made smaller than necessary, and restrictions on the configuration and the manufacturing process can be suppressed. The degree of freedom in design can be improved.

For example, the material of the resin member 10 is more appropriate considering the insulation separation between the first lead 20A and the second lead 20B and the support of the first lead 20A and the second lead 20B without considering the absorption of light more than necessary. Therefore, it becomes possible to set a structure and select materials appropriately, and it is possible to provide a highly reliable light-emitting device.
In addition, since it is possible to secure a relatively wide area for injecting the molding resin forming the resin member 10, the filling property can be improved, the time required for filling can be shortened, and the molding time of the resin member 10 can be reduced. yield can be improved, and the light-emitting device can be manufactured at low cost.
Taking advantage of the above advantages, it is possible to provide a more compact and highly reliable light-emitting device.

In the light emitting device of the above embodiment, four second surfaces 15 are exposed around the first surface 25 inside the resin frame 50, and the four second surfaces 15 are all covered with the reflecting member 11. showed morphology.
However, it is not necessary that all of the second surfaces 15 at four locations are covered with the reflecting member 11 , and at least one of the second surfaces 15 at at least four locations should be covered with the reflecting member 11 . For example, only one second surface 15 having a relatively large exposed area among the plurality of second surfaces 15 exposed inside the resin frame 50 may be covered.
Moreover, the second surface 15 exposed inside the resin frame 50 does not need to be present at four locations or a plurality of locations, and at least one second surface 15 may be exposed.

In the light emitting device of the above embodiment, for example, as shown in FIG. 3C, the example using the sealing member 70 having a flat upper surface was shown. However, the sealing member 70 is not limited to one having a flat upper surface, and as shown in FIG. 4, a lens-shaped sealing member having a curved upper surface may be used.

In the description of the light emitting device of the above embodiment, the light emitting device including one light emitting element 40 has been described. However, in the description of the light emitting device of the embodiment, as shown in FIG. 5, a plurality of light emitting elements may be used and the resin frame 50 may be formed so as to collectively surround the plurality of light emitting elements 40 . Further, the light emitting device of the embodiment may include a protection element 80, and the protection element 80 may be embedded in the resin frame 50, for example, as shown in FIG.

In the description of the light emitting device of the above embodiment, as shown in FIGS. 6 and 7, the convex portion 12 may be formed on the upper surface of the resin member 10 on the upper surface of the base 30. FIG. By forming the convex portion 12 on the upper surface of the resin member 10 on the upper surface of the base 30 and forming the resin frame 50 so as to cover the convex portion 12, the bonding strength between the base 30 and the resin frame 50 can be increased.

Materials and the like suitable for each component of the light emitting device of the embodiment will be described below.
(Reflection member 11)
The reflecting member 11 covers the second surface 15 which is the surface of the resin member 10 exposed inside the resin frame 50 .
Materials for the reflecting member 11 include phenol resin, epoxy resin, BT resin, PPA, and silicone resin. In particular, as the material of the reflecting member 11, a silicone resin having excellent light resistance is preferable. By using a resin material as a material, the reflecting member 11 and the resin member 10 each contain a resin material, so that the adhesion between the reflecting member 11 and the resin member 10 and the resin frame 50 can be improved. In addition, by dispersing the reflector powder, which does not easily absorb the light from the light emitting element 40 and has a large difference in refractive index with respect to the base resin, in the base resin, the light from the light emitting element 40 can be efficiently emitted. Can reflect light. As the reflector powder, for example, powders of titanium oxide, aluminum oxide, zirconium oxide, and magnesium oxide can be used. In particular, titanium oxide is preferable because it is relatively stable against moisture and has a high refractive index. The reflecting member 11 is a member having a reflectance of 60% or more, preferably 70% or more, with respect to the light from the light emitting element 40 .

As described with reference to FIG. 3A, the reflecting member 11 has, for example, an inner (the side closer to the center of the resin frame 50) end portion that is located between the surface (second surface 15) of the resin member 10 and the wide width of the first lead. It is preferable that the outer end portion is formed so as to be positioned on the resin frame 50 so as to coincide with the boundary with the surface (first surface 25) of the portion 21A. Moreover, it is preferable to form the reflecting member 11 so that its thickness increases as it approaches the resin frame 50 . The reflecting member 11 having such a shape utilizes, for example, the difference in wettability between the surface of the resin member 10 (second surface 15) and the surface of the wide portion 21A of the first lead (first surface 25). can be formed by appropriately adjusting the viscosity and coating amount of the resin material when forming the reflecting member 11 by coating. Specifically, the surface (second surface 15) of the resin member 10 has lower wettability than the surface (first surface 25) of the wide portion 21A of the first lead, which is a metal surface, due to the difference in glossiness. high. Therefore, when a raw material resin having a relatively low viscosity is applied to the surface (second surface 15) of the resin member 10, the inner (the side closer to the center of the resin frame 50) ends of the surface (second surface 15) of the resin member 10 ) and the surface (first surface 25) of the wide portion 21A of the first lead, and the thickness increases with distance from the boundary. In addition, the inclination and curved shape of the surface of the reflecting member 11 can be adjusted by adjusting the viscosity and application amount of the resin to be applied.

(Resin member 10)
Materials for the resin member 10 include epoxy resin, silicone resin, BT resin, polyamide resin, polyimide resin, nylon resin, unsaturated polyester, and the like. These resin materials may contain coloring agents, fillers, reinforcing fibers and the like known in the art. In addition, by including a black filler such as carbon black having a large heat radiation coefficient, heat from the light emitting element can be efficiently released. Generally, if the resin member 10 contains a black filler such as carbon black, the light absorption by the resin member 10 increases, and the light extraction efficiency of the light emitting device decreases. However, in the light emitting device of the embodiment, since the reflecting member 11 is formed on the surface (second surface 15) of the resin member 10 exposed inside the resin frame 50, absorption of light by the resin member 10 can be suppressed. A decrease in the light extraction efficiency of the light emitting device can be suppressed. Examples of fillers include silicon oxide and aluminum oxide. Examples of reinforcing fibers include glass, calcium silicate, potassium titanate, and the like.

(Conductive member 20)
The conductive member 20 is used to apply voltage from an external power supply to electronic components such as the light emitting element 40 . The conductive member 20 includes a first lead 20A and a second lead 20B.
The conductive member 20 is preferably made of a material with relatively high thermal conductivity. For example, by using a material having a thermal conductivity of about 200 W/(m·K) or more, the heat generated by the light emitting element 40 can be easily conducted to the first lead 20A.

It is preferable that the conductive member 20 be made of a high-strength material that can be easily punched or cut. For example, metals such as copper, aluminum, gold, silver, tungsten, iron, nickel, palladium, rhodium, or alloys thereof, phosphor bronze, iron-containing copper, or the like can be used as the base material. The metal layer may be provided on the entire surface of the first lead 20A and the second lead 20B, or may be provided only on one side or partially.

The conductive member 20 may have a reflective film on its surface. One or more metals such as aluminum, copper, and gold can be used for the reflective film. In particular, it is preferable to use silver for the reflective film. By doing so, the light extraction efficiency of the light emitting device can be improved.

Various methods such as a plating method, a vapor deposition method, a sputtering method, and an ion beam assist vapor deposition method can be used as a method of forming the reflective film on the conductive member 20 . The film thickness may be any film thickness that can effectively reflect the light from the light emitting element 40, and is, for example, about 20 nm to 10 μm, preferably about 50 nm to 5 μm, more preferably about 100 nm to 3 μm. The thickness and shape of the conductive member can be appropriately set within the range known in the art.

As shown in FIG. 2A, the end faces of the first lead 20A and/or the second lead 20B preferably have unevenness. The contact area between the first lead 20A and/or the second lead 20B and the resin member 10 is reduced by providing unevenness at the location where the first lead 20A and/or the second lead 20B and the resin member 10 contact. can be increased. Thereby, the adhesion between the first lead 20A and/or the second lead 20B and the resin member 10 can be improved.

(Light emitting element 40)
A light emitting element 40 is disposed on the first surface 25 of the first lead 20A. The light emitting element 40 is a semiconductor element that emits light by itself when a voltage is applied, and a known semiconductor element made of a nitride semiconductor or the like can be applied. The emission wavelength of the light emitting element can be selected from the ultraviolet region to the infrared region, including the visible region (380 to 780 nm). For example, a nitride semiconductor can be used as a light emitting element with a peak wavelength of 430 to 490 nm. As the nitride semiconductor, In _X Al _Y Ga _1-XY N (0≦X, 0≦Y, X+Y≦1) or the like can be used. Alternatively, the light emitting element 40 may be placed on the first surface 25 via a submount.

The shape of the light emitting element 40 may be an arbitrary shape such as a triangle, a square, a polygon such as a hexagon, or a shape similar to these when viewed from above. Further, the light emitting element 40 may be a single-sided electrode in which the n-electrode and the p-electrode are formed on the same side, or may be two surfaces on which the n-electrode and the p-electrode are opposite to each other (for example, the upper surface and the lower surface). ) may also be double-sided electrodes formed on each of the substrates.

When the light emitting element 40 is a single-sided electrode, it is mounted face up on the first surface 25 of the first lead 20A. Face-up mounting is a form in which the surface of the light-emitting element 40 opposite to the surface on which the electrodes are formed faces the base 30 . A bonding member between the light emitting element 40 and the first lead 20A may be an insulating bonding member or a conductive bonding member, and may be a known bonding member. For example, insulating bonding members include epoxy resins, silicone resins, modified resins thereof, and the like, and conductive bonding members include conductive pastes such as silver, gold, and palladium, and Au—Sn eutectic. Brazing materials such as solder and low-melting-point metals can be used.

When the light emitting element 40 is a double-sided electrode, any known bonding member may be used as the bonding member between the light emitting element 40 and the first lead 20A as long as it is a conductive bonding member. Examples of conductive joining members include conductive paste such as silver, gold and palladium, solder such as Au—Sn eutectic, brazing material such as low melting point metal, and the like. In this case, by placing the light emitting element on the first lead 20A, the light emitting element 40 and the first lead 20A can be electrically connected.

(resin frame 50)
The resin frame 50 is provided to surround the light emitting element 40 in an annular shape. Since the resin frame 50 is provided so as to surround the light emitting element 40 , the uncured raw material to be the sealing member 70 can be held within the resin frame 50 . The resin frame 50 is formed by arranging an uncured raw material, which is the base of the resin frame 50, in a region where the resin frame 50 is desired to be formed, and curing the raw material.

Materials for the resin frame 50 include phenol resin, epoxy resin, silicone resin, BT resin, and PPA. In particular, as the material of the resin frame 50, a silicone resin having excellent light resistance is preferable. In addition, by dispersing the reflector powder, which does not easily absorb the light from the light emitting element 40 and has a large difference in refractive index with respect to the base resin, in the base resin, the light from the light emitting element 40 can be efficiently emitted. Can reflect light. As the reflector powder, for example, titanium oxide, aluminum oxide, zirconium oxide, and magnesium oxide can be used. In particular, titanium oxide is preferable because it is relatively stable against moisture and has a high refractive index. The resin frame 50 is a member having a reflectance of 60% or more, preferably 70% or more, with respect to the light from the light emitting element 40 . By doing so, the light reaching the resin frame 50 is less likely to be absorbed by the resin frame 50, and the light extraction efficiency of the light emitting device can be improved.

(wire 60)
The light emitting element 40 and the second lead 20B may be electrically connected via a wire 60. FIG. The wire 60 can be made of a highly conductive metal material. Gold, aluminum, copper, silver, or the like can be used as the metal material. As the wire bonding method, known methods such as ball bonding and wedge bonding may be used.

(sealing member 70)
As a material of the sealing member 70, a translucent resin material, a glass material, or the like can be used. In particular, it is preferable to use a resin material for the material of the sealing member 70 . Since the reflecting member 11 and the resin frame 50 each contain a resin material, the sealing member 70 is also made of a resin material. Adhesion with the resin frame 50 can be improved. The resin material of the sealing member 70 includes polycarbonate resin, epoxy resin, phenol resin, silicone resin, acrylic resin, polymethylpentene resin, polynorbornene resin, modified resins thereof, and hybrid resins containing one or more of these resins. etc. can be used. In particular, as the material of the sealing member 70, dimethyl-based silicone resin and phenyl-based silicone resin, which are excellent in light resistance, are preferable.
The sealing member 70 may contain a wavelength converting member and/or a light diffusing material.

(Wavelength conversion member)
Phosphor particles that can be excited by light emitted from the light emitting element are used as the wavelength conversion member. For example, phosphors that can be excited by a blue light emitting device or an ultraviolet light emitting device include a cerium-activated yttrium aluminum garnet phosphor (YAG:Ce), a cerium activated lutetium aluminum garnet phosphor. (LAG:Ce), nitrogen-containing calcium aluminosilicate phosphor activated with europium and/or chromium (CaO-Al2O3-SiO2:Eu, Cr), silicate phosphor activated with europium ((Sr, Ba) 2SiO4:Eu), β-SiAlON phosphors, CASN phosphors, SCASN phosphors, etc.; Fluoride phosphors, such as KSF phosphors, sulfide phosphors, chloride phosphors , silicate-based phosphors, phosphate-based phosphors, quantum dot phosphors, and the like. By combining these phosphors with a blue light emitting element or an ultraviolet light emitting element, light emitting devices with various wavelengths can be manufactured.

(light diffusion material)
Titanium oxide, zirconium oxide, aluminum oxide, silicon oxide, or the like can be used as the material of the light diffusing material. In particular, titanium oxide is preferable because it is relatively stable against moisture and has a high refractive index.

(protective element 80)
For example, the protection element 80 blocks a current flowing in the reverse direction when a voltage is applied to the light emitting element 40 in the reverse direction, or emits light when a forward voltage higher than the operating voltage of the light emitting element 40 is applied. Protection circuits and electrostatic protection elements that can prevent an overcurrent from flowing through the element can be used. Specifically, a Zener diode can be used.

REFERENCE SIGNS LIST 10 resin member 11 reflective member 12 convex portion 20 conductive member 20A first lead 20B second lead 15 second surface 25 first surface 30 substrate 31 upper surface 32 lower surface 40 light emitting element 50 resin frame 60 wire 70 sealing member 80 protective element 1000 light emitting device

Claims (5)

A first lead and a second lead are supported by a resin member, the resin member contains a black filler, and an upper surface includes the surface of the first lead, the surface of the second lead, and the surface of the resin member. a substrate;
a light emitting element provided on the surface of the first lead on the upper surface;
a resin frame provided on the upper surface so as to surround the light emitting element;
a reflecting member that covers substantially all of one or more second surfaces, each of which is a surface of the resin member exposed to the inside of the resin frame ;
with
The light emitting device according to claim 1, wherein the reflecting member is provided except for the surface of the first lead exposed inside the resin frame . 2. The light emitting device according to claim 1, wherein said reflecting member is provided so as to increase in thickness as it approaches said resin frame. 3. The reflective member according to claim 1, wherein an inclination angle of the surface of the reflective member with respect to the second surface at an inner end portion of the reflective member away from the resin frame is smaller than an internal angle at an inner peripheral end portion of the resin frame. Luminescent device. The resin frame has a substantially rectangular top view shape, and the second surfaces are exposed inside four corners of the bottom end of the inner periphery of the substantially rectangular resin frame, and the four second surfaces are respectively exposed to the reflecting surfaces. 4. The light-emitting device according to claim 1, wherein the light-emitting device is covered with a member. The light emitting device according to any one of claims 1 to 4, wherein the black filler is carbon black.

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