JP6724939B2 - Light emitting device - Google Patents

Description

The present disclosure relates to a light emitting device.

Semiconductor light emitting devices represented by LEDs are widely used for various illuminations, backlights of liquid crystal display devices, and the like. For example, Patent Document 1 below discloses an LED device including a resin package having a metal portion and a resin portion. A recess is provided in the resin package, and the LED element is arranged in the recess. In Patent Document 1, the light extraction efficiency is improved by providing a reflective layer on the inner wall of the recess.

Patent Document 1 discloses a structure in which a partition wall surrounding the LED element is further formed inside the recess in FIG. In the technique described in Patent Document 1, the LED element is arranged in the recess of the resin package, and then the partition wall and the reflective layer are sequentially formed. The partition wall surrounding the LED element prevents the composition for forming the reflective layer from adhering to the side surface of the LED element. After the formation of the reflective layer, the wavelength conversion layer that covers the LED element, the reflective layer, and the partition wall is formed by applying the composition containing the transparent resin and the phosphor particles and curing the applied composition.

JP, 2014-158011, A

However, peeling may occur between the structure such as the wavelength conversion layer that seals the LED element and the partition and the partition, for example. The peeling of the structure for sealing the LED element reduces the reliability of the LED device.

A light emitting device of the present disclosure is a resin package having a plurality of leads including a first lead and a second lead, and a first resin portion, a second resin portion, and a third resin portion, wherein the first resin portion is The second resin portion is located around the element mounting region, the third resin portion is located between the first lead and the second lead, and constitutes the outer surface of the resin package. Forming a recess having an inner wall surface with the lead and the first resin portion, and a resin package in which a part of the upper surfaces of the plurality of leads are located on the bottom surface of the recess, and light emission arranged in the element mounting region. An element, a light-reflecting member located between the inner wall surface and the second resin portion in the recess, and a region of the recess surrounded by the light-reflecting member, 2 resin part and a sealing member that covers the light emitting element, the second resin part has a recess on the surface, and a part of the sealing member is inside the recess of the second resin part. To position.

According to the embodiments of the present disclosure, it is possible to obtain a highly reliable light emitting device.

FIG. 3 is a schematic perspective view of the light emitting device according to the first embodiment viewed from the upper surface side. FIG. 3 is a schematic perspective view of the light emitting device according to the first embodiment viewed from the lower surface side. FIG. 3 is a schematic perspective view of the structure in which the light reflecting member is removed from the light emitting device according to the first embodiment as seen from the upper surface side. FIG. 3 is a schematic top view of a structure in which a light reflecting member is removed from the light emitting device according to the first embodiment. FIG. 2C is a schematic end view showing a cross section taken along line 2C-2C of FIG. 2B. It is a schematic top view which expands and shows a part of FIG. 2B. FIG. 2C is a schematic end view when the light emitting device 101 is cut at the position of line 2C-2C shown in FIG. 2B. It is a schematic end view which expands and shows the hollow 32v shown in FIG. 2E, and its periphery. It is a schematic top view which shows the other example of the shape and arrangement|positioning of the dent 32v. It is a schematic top view of a 1st lead and a 2nd lead. It is a typical bottom view of the 1st lead and the 2nd lead. FIG. 3 is a schematic top view of the light emitting device according to the first embodiment. 6A is a schematic end view showing a cross section taken along line 6A-6A of FIG. 5. FIG. 6B is a schematic end view showing a cross section taken along line 6B-6B of FIG. 5. FIG. 6C is a schematic end view showing a cross section taken along line 6C-6C of FIG. 5. FIG. 3 is a schematic top view of a collective substrate 201. FIG. It is a schematic top view which shows four light emitting device equivalent regions 101'. FIG. 4 is a schematic top view showing a portion of the lead frame 202 corresponding to four light emitting device equivalent regions 101 ′. FIG. 6 is a process cross-sectional view showing a manufacturing process of the light emitting device according to the first embodiment. FIG. 6 is a process cross-sectional view showing a manufacturing process of the light emitting device according to the first embodiment. FIG. 3 is a schematic top view of a portion corresponding to four light emitting device corresponding regions 101 ′ of a plurality of light emitting device corresponding regions 101 ′ of the resin-molded lead frame. It is a schematic top view which shows the state in which the light emitting elements 41 and 42 were mounted in the element mounting area 21r of 1st lead equivalent area|region 21'. FIG. 6 is a process cross-sectional view showing a manufacturing process of the light emitting device according to the first embodiment. FIG. 6 is a process cross-sectional view showing a manufacturing process of the light emitting device according to the first embodiment. FIG. 8 is a process cross-sectional view for explaining a modified example of the method for manufacturing the light emitting device. FIG. 13B is a schematic cross-sectional view showing an enlarged view of the convex portion 212 shown in FIG. 13A and the periphery thereof. It is a figure which expands and shows a part of FIG. 13A. FIG. 9 is a schematic top view for explaining another modification of the method for manufacturing the light emitting device. It is a schematic top view of the structure which removed the light reflective member 50 and the sealing member 75 from the light-emitting device 102 by 2nd Embodiment. FIG. 15B is a schematic end view of the light emitting device 102 taken along the line 15B-15B in FIG. 15A. FIG. 16B is a schematic end view showing the projection 32p shown in FIG. 15B and its periphery in an enlarged manner. 7A to 7C are process cross-sectional views illustrating a manufacturing process of the light emitting device according to the second embodiment. FIG. 16B is a schematic cross-sectional view showing a recess 214 shown in FIG. 16A and its periphery in an enlarged manner.

Hereinafter, the light emitting device of the present disclosure will be described in detail with reference to the drawings. The following embodiments are examples, and the configuration of the light emitting device according to the present disclosure is not limited to the following embodiments. In the following description, a term indicating a specific direction or position (for example, “upper”, “lower” and another term including those terms) may be used. The terms only use relative orientations or positions in the referenced figures for clarity. The size, positional relationship, etc. of the constituent elements shown in the drawings may be exaggerated for the sake of clarity, and may not reflect the actual size and positional relationship of the constituent elements in the light emitting device. It should be noted that some elements may not be shown in the drawings in order to avoid excessive complexity.

In the following description of the embodiments, terms such as “resin package”, “lead frame with resin molded body”, and “collective substrate” may be the same terms before and after the light emitting element, the wire, and the like are provided. ..

(First embodiment)
[Light emitting device 101]
The light emitting device 101 according to the first embodiment of the present disclosure will be described. 1A and 1B are schematic perspective views of the light emitting device 101 as viewed from the upper surface side and the lower surface side, respectively.

The light emitting device 101 includes a resin package 10, at least one light emitting element, and a light reflecting member 50. The resin package 10 is a housing of the light emitting device 101 and has a recess 11. In the configuration illustrated in FIGS. 1A and 1B, the light emitting device 101 includes two light emitting elements 41 and 42. The light emitting element 41 and the light emitting element 42 are located in the recess 11 of the resin package 10.

The light emitting device 101 further includes a sealing member 75 that covers the light emitting element 41 and the light emitting element 42. In this example, the sealing member 75 covers at least the light emitting elements 41 and 42 and the light reflective member 50 inside the recess 11. In FIG. 1A, the sealing member 75 is shown as a transparent member in order to show the internal structure. In other drawings of the present disclosure, the sealing member 75 may be shown as a transparent member as in FIG. 1A.

Hereinafter, each component will be described in detail.

[Resin package 10]
The resin package 10 has an upper surface 10a and a lower surface 10b located on the opposite side of the upper surface 10a. In the configuration illustrated in FIGS. 1A and 1B, the resin package 10 has a substantially quadrangular outer shape in a top view, and has four outer surfaces. The four outer surfaces include an outer surface 10c, an outer surface 10d located opposite to the outer surface 10c, an outer surface 10e, and an outer surface 10f located opposite to the outer surface 10e. The outer shape of the resin package 10 in a top view is not limited to a quadrangle, and may have another shape.

The resin package 10 is provided with a recess 11 having an opening 11a on the upper surface 10a. The resin package 10 includes a resin body 30 and a plurality of leads integrally formed with the resin body 30. The resin body 30 has a first resin portion 31 that constitutes the outer side surfaces 10 c to 10 f of the resin package 10 and a second resin portion 32 that is formed inside the recess 11 so as to surround the light emitting elements 41 and 42. As will be described later, the second resin portion 32 has one or more depressions and/or one or more protrusions on its surface.

In the configuration illustrated in FIGS. 1A and 1B, the resin package 10 has a first lead 21 and a second lead 22. As shown in FIG. 1B, a part of the lower surface 21b of the first lead 21 and a part of the lower surface 22b of the second lead 22 are exposed from the lower surface 10b of the resin package 10. The first lead 21 and the second lead 22 are arranged so that their lower surfaces 21b and 22b are located on substantially the same plane.

As described later, the first lead 21 has one or more extending portions 21h, and the second lead 22 also has one or more extending portions 22h. As schematically shown in FIGS. 1A and 1B, here, the end surface of the extending portion 21h that is a part of the first lead 21 is exposed from the outer surfaces 10c, 10e, and 10f of the resin package 10. Further, the end surface of the extended portion 22h that is a part of the second lead 22 is exposed from the outer surface 10d of the resin package 10.

FIG. 2A is a schematic perspective view of the structure in which the sealing member 75 and the light reflecting member 50 are removed from the light emitting device 101 as seen from the upper surface side. FIG. 2B is a schematic top view of the light emitting device 101 with the sealing member 75 and the light reflecting member 50 removed. FIG. 2C schematically shows an end face when cut along the line 2C-2C in FIG. 2B. Note that, in FIG. 2C, in order to prevent the drawing from becoming excessively complicated, a wire, which will be described later, that electrically connects the light emitting element 42 and the first lead 21 to each other is omitted.

The first lead 21 has an upper surface 21a located on the opposite side to the lower surface 21b, and the second lead 22 has an upper surface 22a located on the opposite side to the lower surface 22b. In this example, the light emitting elements 41 and 42 are arranged on the upper surface 21 a of the first lead 21, and the protective element 60 is arranged on the upper surface 22 a of the second lead 22. As shown in FIG. 2B, a part of the upper surface 21 a of the first lead 21 and a part of the upper surface 22 a of the second lead 22 are located on the bottom surface 11 b of the recess 11. As will be described later, the first lead 21 has a first groove 21j and a second groove 21k provided on the upper surface 21a thereof. The first groove 21j is located in at least a part of the periphery of the element mounting region 21r schematically shown by the broken line in FIG. 2B, and the second groove 21k extends from the first groove 21j. The element mounting area 21r is an area in which the light emitting elements 41 and 42 are mounted. Details of the first lead 21 and the second lead 22 will be described later.

[Resin body 30]
The resin body 30 includes a first resin portion 31, a second resin portion 32, and a third resin portion 33 located between the first lead 21 and the second lead 22. A part of the upper surface 33a of the third resin portion 33 is located on the bottom surface 11b of the recess 11.

The first resin portion 31 has inner side surfaces 31c, 31d, 31e and 31f located on the opposite sides of the outer side surfaces 10c, 10d, 10e and 10f of the resin package 10, respectively. As shown in FIG. 2B, the inner side surface 31c and the inner side surface 31d face each other, and the inner side surface 31e and the inner side surface 31f face each other. In this example, of the inner side surfaces 31c, 31d, 31e, and 31f, two adjacent ones are connected so as to form a curved surface, and a clear boundary is not formed between the two inner side surfaces.

The inner side surfaces 31c, 31d, 31e, and 31f form the inner wall surface of the recess 11. The recess 11 of the resin package 10 is defined by the inner side surfaces 31c, 31d, 31e and 31f of the first resin portion 31, a part of the upper surface 21a of the first lead 21 and a part of the upper surface 22a of the second lead 22. To be done.

In the resin package 10 shown in FIG. 2B, the opening 11a of the recess 11 has a substantially quadrangular outer shape in a top view, and four corners are rounded. The outer edge of the bottom surface 11b of the recessed portion 11 is rounded so as to draw a circular arc having a larger radius at the four corners in the top view than the four corners of the outer edge of the opening 11a. The resin package 10 may have an anode mark or a cathode mark formed by chamfering one corner of the opening 11a of the recess 11 in a top view. The anode mark or the cathode mark functions as a mark indicating the polarities of the first lead 21 and the second lead 22.

As shown in FIG. 2B, the second resin portion 32 of the resin body 30 is arranged around the element mounting region 21r. In the configuration illustrated in FIG. 2B, the first portion 32c of the second resin portion 32 has a ring shape that surrounds the element mounting region 21r without interruption. Here, a part of the first portion 32c is located on the upper surface 21a of the first lead 21, and another part is located on the second portion 32d of the second resin portion 32. The remaining portion of the first portion 32c is located on the upper surface 33a of the third resin portion 33.

The second resin portion 32 suppresses the light reflecting member 50 from covering the side surfaces of the light emitting elements 41 and 42 in the process of forming the light reflecting member 50. As shown in FIG. 1A, the light reflecting member 50 is located between the inner wall surface of the recess 11 and the second resin portion 32. By forming the light reflecting member 50 so that the side surfaces of the light emitting elements 41 and 42 are not directly covered, it is possible to prevent light emitted to the side of the light emitting elements 41 and 42 from being trapped inside the light reflecting member 50. You can

In this example, the second resin portion 32 has an outer shape different from the outer shape of the light emitting device 101 in a top view. The outer shape of the light emitting device 101, that is, the outer shape of the resin package 10 is substantially quadrangular in a top view, whereas the first portion 32c of the second resin portion 32 has a substantially pentagonal outer shape in a top view. doing. In the configuration illustrated in FIG. 2B, in particular, the first portion 32c has an inclined portion 32s that extends obliquely with respect to the outer side surface 10c in a top view. The first portion 32c also has an arc-shaped portion that connects a portion extending in parallel with the outer side surface 10d in a top view and a portion extending in parallel with the outer side surface 10f in a top view.

As well shown in FIG. 2C, the second resin portion 32 includes a first portion 32c located above a plane including the upper surface 21a of the first lead 21 and a first groove 21j of the first lead 21. And a second portion 32d located below the plane including the upper surface 21a of the first lead 21. In the present embodiment, the first portion 32c of the second resin portion 32 has a recess 32v on its surface. By providing the recess 32v in the second resin portion 32, the effect of increasing the surface area of the second resin portion 32 can be obtained. Further, by forming the second portion 32d of the second resin portion 32 in the first groove 21j of the first lead 21, the area where the second portion 32d and the first lead 21 contact each other can be increased. The adhesion between them can be improved. That is, it is possible to more reliably arrange the second resin portion 32 on the bottom surface 11b.

FIG. 2D is an enlarged view of a part of FIG. 2B. As described with reference to FIG. 2C, here, the first portion 32c of the second resin portion 32 projects from the upper surface 21a of the first lead 21 toward the opening 11a, and one or more depressions are formed on the surface thereof. Have 32v. In this example, the plurality of recesses 32v are formed in the first portion 32c, but the number of the recesses 32v may be one.

As described with reference to FIG. 1A, the light emitting device 101 includes the light emitting element 41 and the sealing member 75 that covers the light emitting element 42. The sealing member 75 also covers the second resin portion 32 arranged in the recess 11.

2E schematically shows a cross section of the light emitting device 101 taken along the line 2C-2C shown in FIG. 2B, and FIG. 2F schematically shows an enlarged view of the recess 32v and its periphery shown in FIG. 2E. Show. 2E and 2F, the hatched portion represents the sealing member 75. Note that in FIG. 2E, the wire 43c (see FIG. 2D) that electrically connects the light emitting element 42 and the first lead 21 to each other is omitted for simplicity.

As schematically shown in FIG. 2F, in the present embodiment, a part of the sealing member 75 is located inside the recess 32v of the second resin portion 32. The contact area between the second resin portion 32 and the sealing member 75 is formed by providing the recess 32v in the second resin portion 32 and forming the sealing member 75 so that a part thereof is located inside the recess 32v. Can be increased. By increasing the contact area between the second resin portion 32 and the sealing member 75, the connection between the second resin portion 32 and the sealing member 75 can be made stronger. As a result, the effect of suppressing the peeling of the sealing member 75 from the second resin portion 32 is obtained, and the reliability of the light emitting device 101 is improved.

Referring back to FIG. 2D. In the configuration illustrated in FIG. 2D, the recess 32v has a shape that extends mainly along the extending direction of the second resin portion 32. Further, one of them is located in the vicinity of a portion of the first portion 32c where the second resin portion 32 and a resin connecting portion 34 described later are connected. The resin connecting portion 34 has a structure arranged in the second groove 21k of the first lead 21, one end thereof is connected to the second portion 32d of the second resin portion 32, and the other end thereof is the first resin portion. It is in contact with the inner surface 31c of 31. Further, in this example, one of the depressions 32v is located below the wire 43c that electrically connects the light emitting element 42 to a portion of the upper surface 21a of the first lead 21 outside the element mounting region 21r. .. In other words, a part of the wire 43c is located above the recess 32v of the second resin portion 32.

A wire 43d is further connected to the light emitting element 42, and one end of the wire 43d is connected to the second lead 22. Similarly, one ends of the wires 43a and 43b are connected to the light emitting element 41, and the other ends of the wires 43a and 43b are respectively a portion of the first lead outside the element mounting region 21r and a second portion. It is connected to the lead 22. As can be seen from FIGS. 2B and 2D, here, a part of the first lead 21 and a part of the second lead 22 are exposed between the second resin portion 32 and the inner wall surface of the recess 11. By exposing a part of the first lead 21 and a part of the second lead 22 between the second resin portion 32 and the inner wall surface of the recess 11, one end of the wire connected to the light emitting element is connected to the other end. The area can be secured.

As illustrated in FIG. 3, the second resin portion 32 may have a recess 32v′ extending along a direction intersecting the extending direction of the second resin portion 32 in a top view. In the example shown in FIG. 3, the wire 43a is arranged so as to straddle the recess 32v'. Forming a dent 32v' so that at least a part of the dent 32v' is located below a wire that electrically connects the light emitting element arranged in the element mounting region 21r to the first lead 21 or the second lead. By this, the wire can be arranged more easily. In addition, the recess 32v' may have a shape that connects an inner region and an outer region of the first portion 32c of the second resin portion 32. If at least a part of the surface of the first portion 32c included in the depression 32v′ projects from the upper surface 21a of the first lead 21, an uncured resin material for forming the light reflecting member 50 is formed. It can exert the function of blocking. When the second resin portion 32 has a shape extending along the extending direction of the second resin portion 32 like the depression 32v described above, the second resin portion 32 and the sealing member 75 are secured while ensuring the function of blocking the uncured resin material. Advantageously, the contact area between can be increased.

Further, in this example, the recess 32v' is located on the inclined portion 32s of the first portion 32c. As can be seen from FIG. 3, the inclined portion 32s has an inner side surface that forms an inner wall surface of the recess 11 as compared with a portion of the first portion 32c that extends parallel to the outer surface 10c and a portion that extends parallel to the outer surface 10e. The distance from 31c and 31e is large. Since the dent is located at a portion farther from the inner wall surface of the recess 11 in the first portion 32c, the uncured resin material for forming the light reflecting member 50 can be formed when the light reflecting member 50 is arranged. The possibility that the element mounting region 21r may be crossed over the first portion 32c is reduced. That is, it is possible to prevent the side surfaces of the light emitting elements 41 and 42 from being covered with the light reflecting member 50.

As described above, the outer shape of the second resin portion 32 in a top view is different from the outer shape of the light emitting device 101, and, for example, the inclined portion 32s is provided in the first portion 32c, so that the second resin portion 32 is located farther from the inner wall surface of the recess 11. It is possible to place a recess in the. As will be described later in detail, the light reflecting member 50 is formed, for example, by dropping an uncured resin material in a region between the inner wall surface of the recess 11 and the second resin portion 32, and spreading the resin material by flowing. Can be formed by curing a resin material. That is, in the bottom surface 11b of the recess 11, the region between the inner wall surface of the recess 11 and the first portion 32c of the second resin portion 32 has a function as a flow path for the flow of the uncured resin material. You can Therefore, arranging the recesses while avoiding the portion of the first portion 32c where the distance from the inner wall surface of the recess 11 is smaller prevents the side surfaces of the light emitting elements 41 and 42 from being covered by the light reflecting member 50. It is advantageous for avoidance.

The shape, number, and arrangement of the depressions of the first portion 32c of the second resin portion 32 are not limited to the examples described with reference to FIGS. 2C to 2F and FIG. For example, the recess is formed in a bent portion that connects two portions of the first portion 32c that extend in parallel to the outer surface of the resin package 10 (for example, a portion that extends in parallel to the outer surface 10c and a portion that extends in parallel to the outer surface 10f). It may be located. Alternatively, a plurality of depressions may be provided in the second resin portion 32, and in addition to the depressions, one or more protrusions protruding from the surface of the first portion 32c may be provided in the first portion 32c of the second resin portion 32. It may be provided. 2C, 2E, and 2F, the recess 32v is located near the top of the first portion 32c. However, the positions of the depression and the protrusion in the height direction with respect to the bottom surface 11b of the depression 11 are arbitrary, and the shape of the depression in cross-sectional view is not limited to a particular shape. The shape of the depression in top view is not limited to the elliptical shape illustrated in FIG. 3, and may be, for example, an irregular shape.

The maximum value of the width of the depression 32v in the top view may be approximately the same as the width of the first portion 32c. Here, the "width" of the depression 32v refers to the distance between both ends of the depression 32v along the direction perpendicular to the extending direction of the portion of the first portion 32c where the focused depression 32v is located, and the first portion The "width" of 32c refers to the distance between the ends of the first portion 32c along a direction perpendicular to the extending direction of the first portion 32c.

Please refer to FIG. 2C and FIG. 2D. As described above, the resin package 10 may further include the resin connection portion 34 located on the bottom surface 11b of the recess 11. The resin connecting portion 34 is a portion of the resin body 30 located between the second resin portion 32 and the first resin portion 31, and connects these to each other. As shown in FIG. 2C, here, the resin connecting portion 34 does not protrude from the upper surface 21 a of the first lead 21, and the upper surface 34 a of the resin connecting portion 34 and the upper surface 21 a of the first lead 21 have substantially the same height. Located in By setting the upper surface 34a of the resin connecting portion 34 to have substantially the same height as the upper surface 21a of the first lead 21, when an uncured resin material for forming the light reflecting member 50 is applied onto the bottom surface 11b of the recess 11. The uncured resin material can naturally flow on the bottom surface 11b without being hindered by the resin connection portion 34. Even when the resin connecting portion 34 projects from the upper surface 21 a of the first lead 21, the height of the resin connecting portion 34 is set lower than that of the second resin portion 32, so that the uncured resin material is formed. It is possible to spread the material of the light-reflecting member 50 on the bottom surface 11b while avoiding that the resin connection portion 34 hinder the flow of the light.

By providing the resin connection portion 34 that connects the second resin portion 32 and the first resin portion 31 to each other in the resin package 10, it is possible to prevent the second resin portion 32 from peeling from the bottom surface 11b of the recess 11. The formation of the resin connection portion 34 contributes to the improvement of the reliability of the light emitting device 101.

As described above, the resin body 30 has the third resin portion 33 located between the first lead 21 and the second lead 22. As shown in FIG. 2C, the upper surface 33 a of the third resin portion 33 is located on the bottom surface 11 b of the recess 11. The upper surface 33a is located at the same height as the upper surface 21a of the first lead 21 and the upper surface 22a of the second lead 22, and does not protrude from the upper surface 21a of the first lead 21 and the upper surface 22a of the second lead 22.

The third resin portion 33 has a lower surface 33b opposite to the upper surface 33a. The lower surface 33b of the third resin portion 33 is located on the lower surface 10b of the resin package 10. As shown in FIG. 2B, the third resin portion 33 is connected to the wall portion having the inner side surface 31e and the wall portion having the inner side surface 31f of the first resin portion 31.

A part of the first portion 32c of the second resin portion 32 is located on the upper surface 33a of the third resin portion 33. When the second resin portion 32 and the third resin portion 33 have this positional relationship, when the uncured resin material to be the resin body 30 flows into the mold by the molding method, the third resin portion The resin material can be introduced from the space where the resin portion 33 is formed into the space where the second resin portion 32 is formed. When a part of the first portion 32c of the second resin portion 32 is connected to the third resin portion 33, peeling of the second resin portion 32 and detachment from the resin package 10 are suppressed, which is useful. is there.

The resin body 30 is formed using a resin material. A thermosetting resin, a thermoplastic resin, or the like can be used as the resin material as the base material. Examples of the resin material as the base material include an epoxy resin composition, a silicone resin composition, a modified epoxy resin composition such as a silicone modified epoxy resin, a modified silicone resin composition such as an epoxy modified silicone resin, an unsaturated polyester resin, and a saturated polyester resin. Cured product of polyester resin, polyimide resin composition, modified polyimide resin composition, etc., polyphthalamide (PPA), polycarbonate resin, polyphenylene sulfide (PPS), liquid crystal polymer (LCP), ABS resin, phenol resin, acrylic resin, PBT Resin such as resin. Particularly, when a thermosetting resin such as an epoxy resin composition and a modified silicone resin composition is used, it is easy to integrally form the first resin portion 31, the second resin portion 32, and the third resin portion 33 with the same resin material, which is advantageous. Is.

When the viscosity of the material for forming the resin body 30 in the uncured state is 10 Pa·s to 40 Pa·s, the material for forming the resin body 30 is sufficiently fluidized inside the mold, This is advantageous because the first resin portion 31, the second resin portion 32, the third resin portion 33, and the resin connecting portion 34 can be collectively formed by a molding method. It is more advantageous that the viscosity of the material for forming the resin body 30 in the uncured state is 15 Pa·s to 25 Pa·s.

It is advantageous that the resin material that is the base material of the resin body 30 contains a light-reflecting substance. As the light-reflecting substance, it is possible to use a material that hardly absorbs light from the light-emitting element and has a large difference in refractive index from the resin material that is the base material. Examples of such a light-reflecting substance are titanium oxide, zinc oxide, silicon oxide, zirconium oxide, aluminum oxide, aluminum nitride and the like.

Further, the resin body 30 includes, as a base material, acetylene black, carbon such as activated carbon or graphite, transition metal oxide such as iron oxide, manganese dioxide, cobalt oxide or molybdenum oxide, or a colored organic pigment. It may be contained. By forming the resin body 30 in black or a color close to black, the reflectance of the resin body 30 with respect to external light (in many cases, sunlight) is reduced, and the light emitting device 101 emits light. The contrast ratio with other parts can be improved.

[First lead 21, second lead 22]
The first lead 21 and the second lead 22 have conductivity and function as electrodes for supplying power to the light emitting elements 41 and 42. The number of leads included in the resin package 10 is not limited to two, that is, the first lead 21 and the second lead 22, and the resin package 10 may further include, for example, a third lead. The third lead may function as an electrode for feeding power or may function as a heat dissipation member. When the resin package 10 further includes the third lead in addition to the first lead 21 and the second lead 22, the third resin portion 33 of the resin body 30 may include, for example, between the first lead 21 and the third lead, Also, it is arranged between the second lead 22 and the third lead.

FIG. 4A is a schematic top view showing the first lead 21 and the second lead 22 taken out from the light emitting device 101, and FIG. 4B is a schematic view showing the first lead 21 and the second lead 22 taken out from the light emitting device 101. FIG. The first lead 21 has, for example, a substantially rectangular shape, and has side portions 21c, 21d, 21e, and 21f. The side portion 21d faces the second lead 22. The side part 21c is located on the opposite side of the side part 21d. The side portion 21e and the side portion 21f are located on the opposite sides and do not face the second lead 22.

The extending portion 21h is located near the center of each of the side portions 21c, 21e, and 21f in a top view. The extending portion 21h is a part of the first lead 21. The end faces of the extending portions 21h on the side portions 21c, 21e, and 21f can be exposed from the resin body 30 on the outer surfaces 10c, 10e, and 10f of the resin package 10, respectively, as shown in FIGS. 1A and 1B. Here, the end surface of each extending portion 21h is substantially flush with the outer surfaces 10c, 10e, and 10f of the resin package 10.

As shown by hatching in FIG. 4A, the first lead 21 has a first groove 21 j on the upper surface 21 a side located on the bottom surface 11 b of the recess 11 and a first groove 21 j having one end connected to the first groove 21 j. It has two grooves 21k. As described above, here, the first groove 21j is located in at least a part of the periphery of the element mounting region 21r. The first groove 21j may be arranged all around the element mounting region 21r, in other words, around the entire circumference. The first groove 21j and the second groove 21k can be formed by etching or pressing.

Further, the first lead 21 has a side edge groove portion 21g along the side portions 21d, 21e, and 21f on the lower surface 21b side, as shown by hatching in FIG. 4B. The side edge groove portion 21g is recessed from the lower surface 21b to the upper surface 21a side. A portion of the side edge groove portion 21g along the side portions 21e and 21f is embedded in the first resin portion 31. By forming the resin body 30 so that the side edge groove portion 21g is located in the first resin portion 31, the adhesion between the resin body 30 and the first lead 21 is improved. The side edge groove portion 21g can be formed by etching or pressing.

Like the first lead 21, the second lead 22 has, for example, a substantially rectangular shape and has side portions 22c, 22d, 22e, and 22f. In the resin package 10, the first lead 21 and the second lead 22 are located at a predetermined interval, and the side portion 22c of the second lead 22 faces the side portion 21d of the first lead 21.

The extending portion 22h is located near the center of the side portion 22d in a top view. The extending portion 22h is a part of the second lead 22. The end surface of the extending portion 22h on the side portion 22d may be exposed from the resin body 30 on the outer surface 10d of the resin package 10, as shown in FIG. 1B. Here, the end surface of the extended portion 22h is substantially flush with the outer surface 10d of the resin package 10.

As shown by hatching in FIG. 4B, the second lead 22 has a side edge groove portion 22g along the side portions 22c, 22e and 22f of the lower surface 22b. The side edge groove portion 22g is recessed from the lower surface 22b toward the upper surface 22a. A portion of the side edge groove portion 22g along the side portions 22e and 22f is embedded in the first resin portion 31. By forming the resin body 30 so that the side edge groove portion 22g is located inside the first resin portion 31, the adhesion between the resin body 30 and the second lead 22 is improved. The side edge groove portion 22g can be formed by etching or pressing. Hereinafter, the portion of the second lead 22 excluding the extending portion 22h and the portion of the first lead 21 excluding the extending portion 21h may be referred to as a main body portion.

The first lead 21 and the second lead 22 are composed of a frame body, a plurality of pairs of a main body portion of the first lead 21 and a main body portion of the second lead 22, and the pairs and the frame body. It is possible to obtain a lead frame including a plurality of connecting portions that are connected to each other by cutting at a position of the connecting portion. The extending portion 21h and the extending portion 22h described above are a part of a connecting portion that connects the portion that becomes the main body portion of the first lead 21 and the portion that becomes the main body portion of the second lead 22 to the frame body in the lead frame. As will be described later, by cutting the structure in which the resin body 30 is integrally formed on the lead frame at the position of the connecting portion of the lead frame, the individual light emitting device 101 can be obtained. According to such a process, the extending portion 21h and the extending portion 22h, which are a part of the connecting portion, are substantially flush with the surface of the resin body 30 on the outer surfaces 10c, 10d, 10e, and 10f of the resin package 10. Exposed. After being separated into individual pieces, the structure including the main body portion of the first lead 21 and the extending portion 21h constitutes the first lead 21. Similarly, after being divided into individual pieces, the structure including the main body portion of the second lead 22 and the extending portion 22h constitutes the second lead 22.

In the present embodiment, the first lead 21 has a larger area than the second lead 22 in a top view. This is because the element mounting region 21r is provided on the first lead 21. The element mounting region 21r may be provided on the second lead 22. When the element mounting region 21r is provided on the second lead 22, the area of the second lead 22 may exceed the area of the first lead 21 in a top view. The element mounting region 21r may be provided so as to straddle the first lead 21 and the second lead 22. In this case, the first lead 21 and the second lead 22 may have substantially the same area in a top view.

The resin package 10 may include a third lead in addition to the first lead 21 and the second lead 22. When the resin package 10 has the third lead, for example, the element mounting region 21r is provided in the first lead 21. The first lead 21 is disposed, for example, between the second lead 22 and the third lead, and at this time, the areas of the second lead 22 and the third lead are substantially the same in a top view, and the first lead 21 is The area of the lead 21 may be larger than the area of the second lead 22 and the area of the third lead 22.

Each of the first lead 21 and the second lead 22 may have a base material and a metal layer that covers the base material. The base material is typically a plate-shaped member. The base material includes, for example, copper, aluminum, gold, silver, iron, nickel or alloys thereof, or a metal such as phosphor bronze or iron-containing copper. These may be a single layer or may have a laminated structure like a clad material. From the viewpoint of price and heat dissipation, it is advantageous to select copper as the material forming the base material. The metal layer includes, for example, silver, aluminum, nickel, palladium, rhodium, gold, copper or alloys thereof.

The first lead 21 and the second lead 22 may have a region where the metal layer is not provided. In addition, in the first lead 21 and the second lead 22, the metal layers formed on the upper surfaces 21a and 22a may be different from the metal layers formed on the lower surfaces 21b and 22b. For example, even if the metal layer formed on the upper surfaces 21a and 22a is a metal layer composed of a plurality of layers including a nickel layer, and the metal layer formed on the lower surfaces 21b and 22b is a metal layer not including the nickel layer. Good.

[Light emitting elements 41, 42]
Referring back to FIG. 2D. As the light emitting elements 41 and 42, semiconductor light emitting elements such as light emitting diode elements can be used. Here, the light emitting device 101 has two light emitting elements 41 and 42, but the number of light emitting elements that the light emitting device 101 has is not limited to this example, and may be one. There may be three or more. Emitting elements 41 and 42 may in particular comprise a light emitting capable nitride semiconductor of ultraviolet to visible range _{(In x Al y Ga 1-} x-y N, 0 ≦ x, 0 ≦ y, x + y ≦ 1). For example, the light emitting elements 41 and 42 may emit blue light and green light, respectively. When the light emitting device has three light emitting elements, the three light emitting elements may emit blue light, green light, and red light, respectively.

The light emitting elements 41 and 42 are located in the element mounting region 21r of the first lead 21, and are joined to the first lead 21 by a joining member. As the joining member, for example, a resin containing a resin material exemplified as a material forming the resin body 30, a tin-bismuth-based solder, a tin-copper-based solder, a tin-silver-based solder, a gold-tin-based solder, silver, gold, or A conductive paste such as palladium, a bump, an anisotropic conductive material, or a brazing material such as a low melting point metal can be used.

As described above, the light emitting element 41 is electrically connected to the first lead 21 and the second lead 22 by the wires 43a and 43b. Similarly, the light emitting element 42 is electrically connected to the first lead 21 and the second lead 22 by the wires 43c and 43d. Here, the light emitting element 41 and the light emitting element 42 are connected in parallel between the first lead 21 and the second lead 22. The light emitting element 41 and the light emitting element 42 may be connected in series.

[Protection element 60]
The light emitting device 101 may have a protection element 60. The protection element 60 improves the electrostatic breakdown voltage of the light emitting device 101. As the protective element 60, various protective elements mounted on a general light emitting device such as a Zener diode can be used. The protection element 60 is arranged, for example, on the upper surface 22 a of the second lead 22 and embedded in the light reflective member 50. By forming the light reflecting member 50 so as to cover the protective element 60, it is possible to suppress the light from the light emitting elements 41 and 42 from being absorbed by the protective element 60.

The protection element 60 is typically connected in parallel with the light emitting elements 41 and 42. In this example, one of the two terminals of the protection element 60 is connected to the upper surface 21 a of the first lead 21 by the wire 61. The other terminal of the protective element 60 is electrically connected to the upper surface 22a of the second lead 22 by, for example, solder, conductive paste, bump, anisotropic conductive material, or brazing material such as low melting point metal.

[Light-reflecting member 50]
Please refer to FIG. FIG. 5 is a schematic top view of the light emitting device 101. As shown by hatching in FIG. 5, the light reflecting member 50 is located in a region surrounded by the inner side surfaces 31c, 31d, 31e and 31f of the recess 11 and the second resin portion 32 in a top view. As can be seen from a comparison between FIG. 2B and FIG. 5, the light reflecting member 50 has the inner side surfaces 31 c, 31 d, 31 e and 31 f in the recess 11 and the second resin portion of the upper surface 21 a of the first lead 21. It is formed so as to cover a portion located outside 32, the upper surface 22a of the second lead 22, and a part of the upper surface 33a of the third resin portion 33. The light reflecting member 50 is not provided in the region inside the second resin portion 32, that is, in the element mounting region 21r. It can be said that the above-mentioned second resin portion 32 has a structure that defines the position of the inner edge of the light reflecting member 50.

6A schematically shows the end face when cut along the line 6A-6A in FIG. 5, and FIG. 6B schematically shows the end face when cut along the line 6B-6B in FIG. FIG. 6C schematically shows an end face when cut along the line 6C-6C in FIG.

As shown in FIGS. 6A to 6C, the light reflecting member 50 has an inclined surface 50s between the inner side surfaces 31c, 31d, 31e and 31f and the second resin portion 32. The inclined surface 50s is recessed toward the bottom surface 11b of the recess 11. The light reflecting member 50 can reflect the light emitted from the light emitting elements 41 and 42 and incident on the light reflecting member 50 toward the opening 11 a of the recess 11 by the inclined surface 50 s, and the light extraction of the light emitting device 101 can be performed. Improve efficiency.

The inclination angle formed by the straight line connecting the upper end and the lower end of the inclined surface 50s and the bottom surface 11b of the recess 11 connects the upper end and the lower end of the inner side surface (for example, the inner side surface 31d) of the first resin portion 31. It can be made smaller than the inclination angle formed by the straight line and the bottom surface 11b of the recess 11. This is because the light reflecting member 50 can be formed near the light emitting element as compared with the first resin portion 31. By forming the light reflecting member 50 near the light emitting element, the light emitted from the light emitting elements 41 and 42 and incident on the light reflecting member 50 can be efficiently reflected toward the opening 11a.

In this example, the first portion 32c of the second resin portion 32 has a height h1 from the upper surface 21a of the first lead 21. When the height h1 of the first portion 32c is lower than the height h2 of the light emitting elements 41, 42 from the upper surface 21a, the light emitted from the light emitting elements 41, 42 is incident on the inclined surface 50s of the light reflecting member 50. This is advantageous because the light emitted from the light emitting elements 41 and 42 can be efficiently emitted to the outside through the opening 11a.

It is advantageous that the light-reflecting member 50 is formed of a member that has a low transmittance for light emitted from the light emitting element, external light, or the like, or that does not easily absorb light emitted from the light emitting element, external light, or the like. The light reflecting member 50 can be formed of, for example, a mixture of resin and light scattering particles. For example, a thermosetting resin, a thermoplastic resin, or the like can be used as the base material of the light reflecting member 50. Specific examples of the base material are phenol resin, epoxy resin, BT resin, polyphthalamide (PPA), silicone resin and the like. By dispersing a reflecting member that hardly absorbs light from the light emitting element and has a large difference in refractive index between the resin and the base material, the light reflecting member 50 reflects the light more efficiently. be able to. Advantageously, the light reflective member 50 has a white color. As the reflecting member, light scattering particles such as titanium oxide, zinc oxide, silicon oxide, zirconium oxide, aluminum oxide or aluminum nitride can be used.

It is advantageous that the reflectance of the light reflecting member 50 with respect to the light emitted from the light emitting element is higher than the reflectance of the resin body 30. For example, the content of the reflective member such as titanium oxide dispersed in the light reflective member 50 is larger than the content of the light reflective substance dispersed in the resin body 30. The content of the reflective member in the light reflective member 50 is preferably 1.5 times or more, more preferably 2 times or more, the content of the light reflective substance in the resin body 30. It is more preferably 5 times or more. For example, the proportion of titanium oxide in the uncured resin material for forming the resin body 30 may be 15 to 20% by weight. At this time, the proportion of titanium oxide in the uncured resin material for forming the light reflecting member 50 may be 30 to 60% by weight.

It is advantageous that the viscosity of the resin material for forming the light reflecting member 50 in the uncured state is lower than the viscosity of the material for forming the resin body 30 in the uncured state. The viscosity of the light-reflecting member 50 in the uncured state is, for example, preferably 1 Pa·s to 20 Pa·s, and more preferably 5 Pa·s to 15 Pa·s. By adjusting the viscosity of the resin material for forming the light-reflecting member 50 in the uncured state to such a range, good flow can be achieved when the material of the light-reflecting member 50 is applied into the recess 11. The property can be obtained, and the light reflecting member 50 can be prevented from being insufficiently filled. It is advantageous that the light-reflecting member 50 has high thixotropy in the uncured state.

In the configuration illustrated in FIGS. 6A to 6C, the width w1 of the first portion 32c of the second resin portion 32 is smaller than the width w2 of the first groove 21j of the first lead 21. By reducing the width w1 of the first portion 32c, it is possible to secure a sufficient path for flowing the uncured material when the light reflecting member 50 is formed. Thereby, the effect that the light reflecting member 50 can be efficiently formed and the surface of the light reflecting member 50 that serves as a reflecting surface can be easily inclined is obtained. As a result, the light emitted from the light emitting elements 41 and 42 can be efficiently extracted upward. Further, by enlarging the width w2 of the first groove 21j with respect to the width w1 of the first portion 32c, the area where the second resin portion 32 and the first lead 21 are in contact with each other is increased, and It is possible to reduce the possibility that the peeling of the second resin portion 32 will occur.

[Sealing member 75]
The sealing member 75 is located in a region of the recess 11 surrounded by the light-reflecting member 50 and covers the light emitting elements 41 and 42 located at the bottom of the recess 11 and the second resin portion 32 of the resin body 30. ing. In other words, the sealing member 75 mainly occupies the portion other than the light emitting elements 41 and 42, the second resin portion 32, and the light reflecting member 50 in the recess 11. By covering the light emitting elements 41 and 42 with the sealing member 75, it is possible to protect the light emitting elements 41 and 42 from external force, dust, moisture, and the like.

As a material for forming the sealing member 75, a resin material such as a thermosetting resin or a thermoplastic resin can be used as in the base material forming the resin body 30. As the base material for forming the sealing member 75, it is useful to select a material having a transmittance of 60% or more for the light emitted from the light emitting elements 41, 42. It is more useful that the transmittance for the light emitted from is 90% or more. As the material of the sealing member 75, for example, a silicone resin, an epoxy resin, an acrylic resin, or a resin material containing one or more of these can be used. The sealing member 75 may be a single layer or a plurality of layers. Light-scattering particles such as titanium oxide, silicon oxide, zirconium oxide, and aluminum oxide may be dispersed in the resin that is the base material.

The sealing member 75 may contain a material such as a phosphor that converts the wavelength of light from the light emitting elements 41 and 42. As the phosphor, yttrium aluminum garnet activated by cerium, lutetium aluminum garnet activated by cerium, nitrogen-containing calcium aluminosilicate activated by europium and/or chromium (a part of calcium is replaced by strontium) Possible), europium-activated sialon, europium-activated silicate, europium-activated strontium aluminate, manganese-activated potassium fluorosilicate and the like can be used. The total content of the light-scattering particles and/or the phosphor dispersed in the base material may be, for example, about 10 to 150 wt% with respect to the resin material forming the base material of the sealing member 75.

[Wires 43a to 43d, Wire 61]
As the wires 43a to 43d and the wire 61, for example, a wire of a metal such as gold, copper, silver, platinum, aluminum, or palladium, or an alloy containing one or more of these can be used. A wire formed of a material mixed with silicon or the like may be used as the wires 43a to 43d and/or the wire 61. When the material of the wire contains gold, a wire having excellent thermal resistance and the like, which is less likely to be broken by the stress from the sealing member 75, and when the material of the wire contains silver, a high light reflectance is obtained. Advantageously, the wire shown is obtained. In particular, it is beneficial to use a wire containing both gold and silver. When the wires 43a to 43d and/or the wire 61 is a wire containing both gold and silver, the content ratio of silver is, for example, 15% or more and 20% or less, 45% or more and 55% or less, 70% or more and 90% or less, or 95. The range can be from 99% to 99%. In particular, when the content ratio of silver is 45% or more and 55% or less, the possibility of sulfidation can be reduced while obtaining high light reflectance. The wire diameter of the wire can be appropriately selected, and can be, for example, 5 μm or more and 50 μm or less. The wire diameter of the wire is more preferably 10 μm or more and 40 μm or less, and even more preferably 15 μm or more and 30 μm or less.

[Manufacturing Method of Light-Emitting Device 101]
An embodiment of a method for manufacturing a light emitting device of the present disclosure will be described. The method for manufacturing a light emitting device of the present disclosure includes a step (A) of preparing a collective substrate and a step (B) of dividing the collective substrate into pieces to obtain a plurality of light emitting devices. Hereinafter, each step will be described in detail.

(A) Step of Preparing Collective Substrate FIG. 7A is a schematic top view of the collective substrate 201. The collective substrate 201 includes a lead frame 202 as a part thereof. In the collective substrate 201, a plurality of portions each serving as a light emitting device (hereinafter, referred to as light emitting device corresponding region 101′) are two-dimensionally arranged. FIG. 7B is a schematic top view showing four light emitting device equivalent regions 101 ′. Each of the light emitting device equivalent regions 101 ′ has the same structure as the light emitting device 101 described with reference to FIGS. 1A to 6C, except that it is not divided into individual pieces.

FIG. 8 shows the lead frame 202 extracted from the collective substrate 201. In FIG. 8, among the plurality of light emitting device equivalent regions 101 ′, a portion corresponding to four light emitting device equivalent regions 101 ′ is shown as a representative. A rectangle of two-dot chain line in FIG. 8 indicates a portion corresponding to one light emitting device equivalent region 101'.

As shown in FIG. 8, in each of the light emitting device equivalent regions 101 ′, a portion serving as the first lead 21 (hereinafter referred to as the first lead corresponding region 21 ′) and a portion serving as the second lead 22 (hereinafter referred to as the second lead 21 ). (Corresponding to the lead equivalent region 22') is formed. In the example shown in FIG. 8, first lead-corresponding regions 21' and second lead-corresponding regions 22' are alternately arranged along the y direction shown in FIG. Further, a plurality of first lead-corresponding regions 21' or second lead-corresponding regions 22' are arrayed along the x-direction orthogonal to the y-direction. In the y direction of FIG. 8, the side portion 21c of the first lead-corresponding region 21' and the side portion 22d of the second lead-corresponding region 22' are connected by the connecting portion 24. In the x direction, the side portion 21f of the first lead-corresponding region 21' and the side portion 21e of the first lead-corresponding region 21' adjacent to each other are connected by the connecting portion 23.

In the collective substrate 201, for example, after obtaining a lead frame with a resin molded body in which the resin body 30 is formed on the lead frame 202, the light emitting elements 41, 42, etc. are arranged on the lead frame with a resin molded body, and a light reflecting member is provided. It can be obtained by further forming 50 and the sealing member 75.

The resin-molded lead frame is manufactured by forming the resin body 30 on the lead frame 202. A transfer molding method, an injection molding method, a compression molding method or the like can be applied to the formation of the resin body 30 on the lead frame 202. For example, a lead frame 202 with a resin molded body can be formed by sandwiching the lead frame 202 with a die including an upper die and a lower die and pouring a resin material into a space inside the die.

FIG. 9A shows a state in which the lead frame 202 is arranged between the upper mold 210U and the lower mold 210D. The two-dot chain line rectangle in FIG. 9A represents a portion corresponding to the cross section shown in FIG. 2C.

As illustrated, the upper mold 210U has a first space 210c for forming the first resin portion 31 and a second space 210d for forming the first portion 32c of the second resin portion 32. On the other hand, no space is formed in the lower die 210D in this embodiment. In the upper mold 210U, the second space 210d is an independent space that does not communicate with the first space 210c. The second space 210d includes a space 210d1 and a space 210d2.

The lead frame 202 located between the upper mold 210U and the lower mold 210D has a third space 202e on the lower surface side, a fourth space 202d on the upper surface side, and a fifth space 202f on the lower surface side. The third space 202e corresponds to the shape of the third resin portion 33, and the third resin portion 33 can be formed by filling the third space 202e with a resin material and curing the resin material. The fourth space 202d of the lead frame 202 includes the first groove 21j and the second groove 21k of the first lead 21, and the fourth space 202d is filled with a resin material, and the resin material is cured, whereby the second resin portion is formed. The second portion 32d of 32 and the resin connecting portion 34 can be formed respectively. The resin material filled and cured in the fifth space 202f may form a part of the first resin portion 31.

When the lead frame 202 is arranged between the upper die 210U and the lower die 210D, the release sheet 300 is interposed between the upper die 210U and the lead frame 202, as shown in FIG. 9A. By interposing the release sheet 300 between the mold and the lead frame 202, it is possible to prevent the cured resin material from sticking to the mold. Therefore, even when the viscosity of the uncured resin material with which the space in the mold is filled is relatively low, the cured resin material can be easily separated from the mold. Further, for example, cleaning of the mold for each shot may be unnecessary. As the release sheet 300, a sheet having a certain degree of elasticity is used. As the release sheet 300, for example, a resin sheet or a resin film-shaped member such as a fluororesin resin film marketed under the name of ETFE film can be used. The release sheet 300 may be a single layer or a plurality of layers. The release sheet 300 may have a thickness of, for example, 12 micrometers or more and 100 micrometers or less.

FIG. 9B shows a state in which the lead frame 202 is sandwiched between the upper mold 210U and the lower mold 210D. As described above, in the upper mold 210U, the first space 210c and the second space 210d are separated. However, as shown in FIG. 9B, by sandwiching the lead frame 202 between the upper mold 210U and the lower mold 210D, the first space 210c of the upper mold 210U becomes the second groove 21k of the fourth space 202d of the lead frame 202. Connected to. Similarly, the space 210d1 of the upper die 210U is connected to the first groove 21j of the fourth space 202d of the lead frame 202. Further, the space 210d2 of the second space 210d of the upper die 210U is connected to the third space 202e of the lead frame 202. In the state shown in FIG. 9B, the first space 210c also communicates with the fifth space 202f.

Since the space of the upper die 210U and the space of the lead frame 202 are connected as described above, the resin body 30 and the resin body 30 are provided in the above-mentioned space in the die sandwiched between the upper die 210U and the lower die 210D. When the uncured resin material is injected, these spaces are filled with the uncured resin material. The uncured resin material with which the first space 210c is filled with the uncured resin material passes through the second groove 21k and the first groove 21j of the fourth space 202d through the space of the second space 210d, as indicated by a dashed arrow in FIG. 9B. It is transferred to 210d1. Similarly, the uncured resin material with which the third space 202e is filled is transferred from the third space 202e to the space 210d2 of the second space 210d, as indicated by the dashed arrow in FIG. 9B. As a result, the uncured resin material enters all the spaces. Space 210d1 and space 210d2 shown separately in FIGS. 9A and 9B are two cross-sections of different annular spaces, and communicate with each other in the state shown in FIG. 9B.

As described above, according to the method for manufacturing a light emitting device of the present disclosure, the second groove 21k of the first lead 21 in which the resin connection portion 34 of the resin body 30 is formed has the second resin portion when the resin body 30 is formed. It functions as a gate to the second space 210 d for forming 32. Therefore, when the resin package 10 is manufactured by molding using a mold, the second resin portion 32 can be formed together with the formation of the first resin portion 31 and the third resin portion 33.

As described above, when the resin material is injected, the second space 210d is connected to other spaces at a plurality of places in the mold. In this example, the second space 210d is connected to the first space 210c for forming the first resin portion 31 via the fourth space 202d including the first groove 21j and the second groove 21k, and It is also connected to the third space 202e for forming the three resin portion 33. Since the uncured resin material is supplied to the second space 210d from a plurality of locations, it is possible to reduce the possibility of insufficient filling of the resin material in the second space 210d in the mold.

As shown in FIG. 4A, the second groove 21k that functions as a gate may be connected to the first groove 21j at, for example, a substantially intermediate portion between both ends of a portion of the first groove 21j that extends in the substantially left-right direction of the paper surface. .. The uncured resin material transferred from the first space 210c to the second groove 21k of the fourth space 202d is connected to the second groove 21k at the substantially middle portion with respect to both ends of the first groove 21j. The two grooves 21k can be branched at a position where they are connected to the first groove 21j and flow in two directions in the first groove 21j and the space 210d1 of the mold. As a result, it is possible to uniformly fill the second space 210d with the uncured resin material in a shorter time.

After filling the uncured resin material, heat is applied to the resin material in the mold to temporarily cure the resin material. When the uncured resin material is filled, for example, by adjusting the clamp pressure applied to the upper mold 210U and the lower mold 210D, wrinkles can be intentionally generated in the release sheet 300. The clamping pressure may be, for example, about 500 kN or more and 1200 kN or less. When the release sheet 300 has wrinkles, a part of the release sheet 300 projects into the second space 210d. When the uncured resin material is filled in this state and the resin material in the mold is temporarily cured, a depression is formed in the resin body in the second space 210d at the position where the release sheet 300 has wrinkles. be able to.

After that, the lead frame 202 to which the temporarily cured resin material is attached is removed from the mold, and the resin material is fully cured at a temperature higher than the temporarily cured. As a result, a resin-molded lead frame in which the resin body 30 is formed on the lead frame 202 is obtained. By the main curing of the resin material, it is possible to obtain the second resin portion 32 having the depression at the position corresponding to the wrinkles of the release sheet 300 in the mold.

FIG. 10 shows a part of a plurality of light emitting device-corresponding regions 101 ′ of the resin-molded lead frame corresponding to four light emitting device-corresponding regions 101 ′. As a result of the second space 210d and the first space 210c being connected to each other via the fourth space 202d including the first groove 21j and the second groove 21k, and the third space 202e, the resin connecting portion 34 and the third resin With the portion 33, the second resin portion 32 is connected to the first resin portion 31 of the resin package 10. Therefore, the peeling of the second resin portion 32 from the upper surface of the first lead-corresponding region 21' is suppressed.

Next, as shown in FIG. 11, the light emitting elements 41 and 42 are arranged inside the concave portion 11 of each light emitting device corresponding region 101 ′. For example, the light emitting elements 41 and 42 are fixed to the element mounting area 21r of the first lead-corresponding area 21' surrounded by the second resin portion 32 using a joining member such as resin. Further, the light emitting elements 41 and 42 are electrically connected to the first lead-corresponding region 21' and the second lead-corresponding region 22' by the wires 43a, 43b, 43c and 43d. The protection element 60 is arranged in the recess 11 as necessary. In this example, one terminal of the protection element 60 is electrically and physically connected to the second lead-corresponding region 22' by soldering or the like, and the other terminal is electrically connected to the first lead-corresponding region 21' by the wire 61. Connected to.

Next, the light reflecting member 50 is formed in the concave portion 11 of each light emitting device corresponding region 101'. For example, the potting method is used to apply an uncured resin material to a region between the inner wall surface of the recess 11 and the second resin portion 32, and then the resin material is cured. The potting method is a method of applying or dropping a resin material and arranging the resin material in an appropriate region by flowing the resin material.

According to the method for manufacturing a light emitting device of the present disclosure, since the second resin portion 32 is arranged around the element mounting region 21r, even if the uncured resin material is moved inside the recess 11, the element mounting portion 21r is mounted. The flow of the resin material to the center of the region 21r can be blocked by the second resin portion 32. Therefore, the position of the inner edge of the uncured resin material can be defined by the second resin portion 32, and the uncured resin material for forming the light reflecting member 50 can be appropriately arranged on the bottom surface 11b of the recess 11. As described with reference to FIG. 2C, here, the resin connecting portion 34 has the upper surface 34 a at substantially the same height as the upper surface 21 a of the first lead 21, so that the resin connecting portion 34 is provided with the light reflecting member 50. It does not hinder the flow of the uncured resin material for forming the.

After that, the uncured resin material applied to the predetermined region in the recess 11 is cured by heat, light, or the like. Further, the recess formed by the inclined surface 50s of the light reflecting member 50 is filled with an uncured resin material to cover at least the light emitting elements 41 and 42 and the second resin portion 32. At this time, the uncured resin material is also arranged inside the recess 32v of the second resin portion 32. After that, the resin material provided in the recess formed by the inclined surface 50s is cured to form the sealing member 75 that covers the light emitting elements 41 and 42 and the second resin portion 32. By disposing the uncured resin material inside the recess 32v of the second resin portion 32, it is possible to form the sealing member 75, a part of which is located inside the recess 32v. By forming the sealing member 75, the collective substrate 201 having a plurality of light-emitting devices 101 which are not divided into pieces is completed as shown in FIG. 7A.

(B) Step of Obtaining Multiple Light Emitting Devices by Dividing the Collective Substrate into Individual Pieces Next, the aggregate substrate 201 including a plurality of light emitting device corresponding regions 101 ′ in which the light reflecting members 50 are provided in the recesses 11 is placed at a predetermined position. Disconnect with. In this example, the collective substrate 201 is cut at a position indicated by a thick arrow CL in FIG. 12A. By cutting the collective substrate 201, as shown in FIG. 12B, the collective substrate 201 is separated into a plurality of light emitting devices 101.

As a method for dividing the collective substrate 201 into individual pieces, various methods such as cutting with a lead-cut die or a dicing saw, cutting with a laser beam, or the like can be used. When the aggregate substrate 201 includes a plurality of integrally molded resin packages 10, the lead frame 202 and the resin body 30 may be cut at the same time when the aggregate substrate 201 is divided into individual pieces. The plurality of resin packages 10 may be integrally molded or may be individually molded. When the resin package 10 is individually molded for each region 101 ′ corresponding to the light emitting device, the lead frame 202 may be cut into individual pieces at a position between two resin packages 10 adjacent to each other.

The aggregate substrate 201 may be prepared by purchasing a pre-produced aggregate substrate or the like, in addition to the above-described manufacturing process. Further, the present invention is not limited to the form in which the collective substrate including the plurality of resin packages 10 is used, and it is also possible to prepare and use one resin package 10, for example.

The method of forming the depression 32v is not limited to the above example. For example, as shown in FIGS. 13A to 13C, an upper mold 210U′ having one or more protrusions 212 protruding toward the inside of the second space 210d may be used. Here, FIG. 13B shows the convex portion 212 shown in FIG. 13A and the periphery thereof in an enlarged manner, and FIG. 13C shows a portion of FIG. 13A in an enlarged manner. By forming one or more convex portions 212 on the upper mold 210U' in advance, it is possible to form a recess having a desired shape at a desired position on the first portion 32c. Similar to the example described with reference to FIGS. 9A and 9B, the release sheet 300 may be interposed between the upper die 210U′ and the lead frame 202.

Alternatively, a lead frame with a resin molded body is formed by using an upper mold that does not have the second space 210d, and the uncured resin material is applied to the lead frame with the resin molded body and the resin material is cured, whereby the second resin portion is formed. The first portion 32c of 32 may be formed.

FIG. 14 shows a part of a resin-molded lead frame formed using an upper mold that does not have the second space 210d. In the example shown in FIG. 14, the second resin portion 32' does not include a portion protruding from the upper surface of the first lead-corresponding region 21'. After such a lead frame with a resin molded body is obtained, an uncured resin material is linearly applied to the bottom surface 11b of the recess 11 of each light emitting device corresponding region 101' using a dispenser or the like.

As shown by a dashed arrow P in FIG. 14, for example, the uncured resin material is moved to the bottom surface of the recess 11 while moving the nozzle of the dispenser along the shape of the element mounting region 21r starting from the position of the resin connecting portion 34. 11b. At this time, by changing the amount of the resin material injected from the nozzle or changing the moving speed of the nozzle, the amount of the resin material applied to the bottom surface 11b is adjusted, and the cured structure is obtained. The height of the surface of the certain first portion 32c can be changed. For example, if the moving speed of the nozzle is increased in the vicinity of the resin connecting portion 34, the height of the portion in the vicinity of the resin connecting portion 34 in the structure after curing can be selectively reduced. As a result, it is possible to obtain a lead frame with a resin molded body having a recess 32v in a portion of the first portion 32c near the resin connecting portion 34.

[effect]
According to the light emitting device 101, the surface area of the second resin portion 32 can be increased by providing the one or more recesses 32v on the surface of the second resin portion 32. Due to the increase in the surface area of the second resin portion 32, the contact area between the second resin portion 32 and the sealing member 75 increases, and the second resin portion 32 and the sealing member 75 can be bonded more firmly. By improving the adhesiveness of the sealing member 75, peeling of the sealing member 75 from the recess 11 is suppressed, and the reliability of the light emitting device 101 is improved. Note that this effect can also be obtained by providing a convex portion instead of the depression 32v.

When the recess 32v has a shape extending in a direction intersecting the direction in which the second resin portion 32 extends and at least a part of the recess 32v is located below the wire that electrically connects the light emitting element to the lead, the recess 32v At the position, the height of the first portion 32c of the second resin portion 32 can be partially reduced. Therefore, the wire can be more easily arranged in the recess 11. When the recess 32v has a shape that extends substantially parallel to the extending direction of the second resin portion 32, the effect of increasing the surface area of the second resin portion 32 can be obtained without impairing the function of blocking the uncured resin material. ..

By providing the resin package 10 with the resin connecting portion 34 that connects the first resin portion 31 and the second resin portion 32 to each other, the possibility that the second resin portion 32 is separated from the lead can be reduced. Therefore, the second resin portion 32 can be more reliably arranged on the bottom surface 11b of the recess 11. The recess 32v may be located in the vicinity of the portion of the second resin portion 32 where the second resin portion 32 and the resin connecting portion 34 are connected.

Further, by providing a groove portion on the lead and forming the second resin portion 32 so that a part of the second resin portion 32 is located inside the groove portion, the adhesion between the lead and the second resin portion 32 is improved. Can improve. That is, it is possible to more reliably arrange the second resin portion 32 on the bottom surface 11b.

(Second embodiment)
FIG. 15A is a schematic top view showing a structure in which the light reflecting member 50 and the sealing member 75 are removed from the light emitting device 102 according to the second embodiment of the present disclosure. The main difference between the light emitting device 101 according to the first embodiment and the light emitting device 102 is that the second resin portion 32 of the light emitting device 102 has one or more convex portions 32p on its surface. Other structures of the light emitting device 102 may be similar to the light emitting device 101. Therefore, the differences from the light emitting device 101 will be mainly described below.

In the configuration illustrated in FIG. 15A, the second resin portion 32 of the resin body 30 is located above the plane including the upper surface 21 a of the first lead 21 as in the light emitting device 101 according to the first embodiment. It includes a portion 32e and a second portion 32d arranged in the first groove 21j of the first lead 21. The first portion 32e has the above-mentioned convex portion 32p protruding from the surface thereof. In this example, four convex portions 32p are provided, and one of them is located in the vicinity of the portion where the second resin portion 32 and the resin connecting portion 34 are connected.

15B schematically shows an end surface of the light emitting device 102 cut along a plane perpendicular to the lower surface 10b of the resin package 10 at the position of the line 15B-15B shown in FIG. 15A, and FIG. 15C shows the projection shown in FIG. 15B. The part 32p and its periphery are enlarged and shown schematically. 15B and 15C, the hatched portion represents the sealing member 75 as in FIGS. 2E and 2F.

As schematically shown in FIG. 15C, in the present embodiment, the convex portion 32p provided on the first portion 32e is covered with the sealing member 75. By providing the convex portion 32p on the second resin portion 32, the surface area of the second resin portion 32 can be increased similarly to the case where the depression 32v is provided. Further, by forming the sealing member 75 so as to cover the convex portion 32p, the contact area between the second resin portion 32 and the sealing member 75 is increased as compared with the case where the convex portion 32p is not provided. Thus, the bond between the second resin portion 32 and the sealing member 75 can be made stronger. As a result, peeling of the sealing member 75 from the second resin portion 32 is suppressed, and the reliability of the light emitting device 102 is improved. In addition, the surface of the first portion 32e may have a mixture of protrusions and depressions.

Referring back to FIG. 15A. Similar to the depressions 32v and 32v' described above, the number, shape, and arrangement of the convex portions 32p in the first portion 32e of the second resin portion 32 are basically arbitrary. However, from the viewpoint of avoiding that the side surfaces of the light emitting elements 41 and 42 are covered with the light reflecting member 50, the first portion 32e is projected at a position where the distance from the inner wall surface of the recess 11 is relatively small. It is advantageous to form the part 32p. This is because the second resin portion 32 has a function of blocking the uncured resin material for forming the light reflecting member 50 at the position of the second resin portion 32. Further, when the convex portion 32 p has a shape that extends mainly along the extending direction of the second resin portion 32, the uncured resin material for forming the light reflective member 50 is formed at the position of the second resin portion 32. This is useful because the dam can be blocked more effectively.

In the example shown in FIG. 15A, the portion where the second resin portion 32 and the resin connecting portion 34 are connected has a smaller distance from the inner wall surface of the recess 11 than the inclined portion 32s of the first portion 32e. This means that when the uncured resin material is dropped in the region between the inner wall surface of the recess 11 and the second resin portion 32 and the resin material is spread by the flow, it is compared with the position of the inclined portion 32s. 2 This means that the resin material is likely to exceed the first portion 32e in the vicinity of the portion where the resin portion 32 and the resin connecting portion 34 are connected. Therefore, as shown in FIG. 15A, the height of the first portion 32c is partially formed by forming the protrusion 32p at a position in the first portion 32e where the distance from the inner wall surface of the recess 11 is relatively small. It is possible to more effectively prevent the resin material from entering the region inside the first portion 32e by increasing the size.

[Manufacturing Method of Light-Emitting Device 102]
Similar to the first embodiment, the light emitting device 102 is obtained by performing the step (A) of preparing a collective substrate and the step (B) of dividing the collective substrate into pieces to obtain a plurality of light emitting devices. You can The process after obtaining the collective substrate may be the same as that in the first embodiment, and thus the description regarding the process (B) is omitted here.

(A) Step of Preparing Collective Substrate First, a lead frame with a resin molded body is produced. Similar to the first embodiment, in the lead frame with a resin molded body, for example, the lead frame 202 is sandwiched by a die including an upper die and a lower die, and a resin material is poured into a space inside the die to form a resin. It can be formed by curing the material.

FIG. 16A shows a state in which the lead frame 202 is sandwiched between the upper mold 210U″ and the lower mold 210D. The two-dot chain line rectangle in FIG. 16A represents a portion corresponding to the cross section shown in FIG. 15B.

Here, the upper mold 210U″ provided with the second space 210d including the space 210d1′ and the space 210d2 is used. As shown in FIG. 16A, the upper mold 210U″ has a recess 214 that is recessed toward the inside of the upper mold 210U″ in the space 210d1′. 16B is an enlarged view of the recess 214 shown in FIG. 16A and the periphery thereof. When an uncured resin material to be the resin body 30 is injected into the space inside the mold sandwiched between the upper mold 210U″ and the lower mold 210D, these spaces are filled with the uncured resin material. .. At this time, the inside of the recess 214 is also filled with the uncured resin material.

After filling the uncured resin material, heat is applied to the resin material in the mold to temporarily cure the resin material. After that, the lead frame 202 to which the temporarily cured resin material is attached is removed from the mold, and the resin material is fully cured at a temperature higher than the temporarily cured. As a result, a lead frame with a resin molded body is obtained. By curing the resin material disposed inside the recess 214 of the upper mold 210U″, the above-mentioned protrusion 32p can be formed. By adjusting the number, shape, and arrangement of the concave portions 214 in the upper mold 210U″, the convex portions 32p can be formed in the second resin portion 32 with an arbitrary number, shape, and arrangement.

After obtaining the lead frame with the resin molded body, the light emitting elements 41, 42 and the like are arranged on the lead frame with the resin molded body. After that, the uncured resin material is applied to the region between the inner wall surface of the recess 11 and the second resin portion 32 by, for example, the potting method, and the resin material is cured. Similar to the first embodiment, in this embodiment as well, the position of the inner edge of the uncured resin material can be defined by the second resin portion 32, so that the uncured resin material for forming the light reflective member 50 is not used. It can be appropriately arranged in a predetermined region of the recess 11. The light-reflecting member 50 can be formed by curing the uncured resin material applied to the predetermined region in the recess 11 with heat, light, or the like.

Next, the concave portion formed by the inclined surface 50s of the light reflecting member 50 is filled with an uncured resin material to cover at least the light emitting elements 41 and 42 and the second resin portion 32. At this time, the convex portion 32p of the second resin portion 32 can be covered with the uncured resin material. By curing the resin material provided in the recess formed by the inclined surface 50s, the sealing member 75 that covers the light emitting elements 41 and 42 and the second resin portion 32 is obtained. By forming the sealing member 75, a collective substrate having a plurality of light-emitting devices 102 which are not divided into individual pieces is completed.

The method of forming the convex portion 32p is not limited to the above example. For example, a lead frame with a resin molded body is formed using an upper mold that does not have the second space 210d, and an uncured resin material is applied to the lead frame with a resin molded body and the resin material is cured to form the second resin portion. A first portion 32e of 32 may be formed. An upper mold having no second space 210d is used to form a lead frame with a resin molded body including a second resin portion 32′ having no portion protruding from the upper surface of the first lead corresponding region 21′, and FIG. As indicated by a dashed arrow P therein, an uncured resin material may be linearly applied to the bottom surface 11b of the recess 11 of each light emitting device corresponding region 101' using a dispenser or the like.

For example, the uncured resin material is applied to the bottom surface 11b of the recess 11 while moving the nozzle of the dispenser along the shape of the element mounting region 21r starting from the position of the resin connecting portion 34. At this time, by reducing the moving speed of the nozzle in the vicinity of the resin connecting portion 34 or applying the resin material in the vicinity of the resin connecting portion 34 in an overlapping manner, for example, in the structure after the curing, The height of the portion near the connecting portion 34 can be selectively increased. As a result, it is possible to obtain a lead frame with a resin molded body that includes the first portion 32e in which the convex portion 32p is provided at a position near the resin connection portion 34.

Alternatively, a release sheet having holes intentionally formed in a part may be interposed between the upper mold and the lead frame 202. For example, if a hole is provided in a part corresponding to a space filled with a resin material for forming the second resin portion 32 in the release sheet arranged in the upper mold, the resin injected into the space is filled. Part of the material enters inside the holes of the release sheet. By temporarily curing the resin material in this state, the surface of the second resin portion 32 can be projected at the position of the hole of the release sheet. After obtaining such a structure, the resin material is fully cured to form the second resin portion 32 including the first portion 32e having the convex portion 32p on the surface.

The depressions 32v, 32v' and the protrusion 32p described above may be provided in the second portion 32d of the second resin portion 32. The effect of increasing the surface area of the second resin portion 32 can also be obtained by providing the depressions 32v, 32v′ or the convex portion 32p in the second portion 32d instead of the first portion 32c or in addition to the first portion 32c. .. Therefore, as in the case where the depressions 32v, 32v′ or the protrusions 32p are provided in the first portions 32c, 32e of the second resin portion 32, the adhesion of the sealing member 75 to the second resin portion 32 is improved, and the recesses are formed. The peeling of the sealing member 75 from the bottom surface 11b of 11 can be prevented.

DESCRIPTION OF SYMBOLS 10 Resin package 10a Upper surface of resin package 10 10b Lower surface of resin package 10c-10f Outer surface of resin package 10 Recess 11a Recess 11a Opening 11b Recess 11 bottom 21 Lead 1 21e 1st lead equivalent area 21a 1st Upper surface of lead 21 21b Lower surface of first lead 21 21c to 21f Side portion of first lead 21 21g Side edge groove portion of first lead 21 21h Extended portion of first lead 21 21j First groove of first lead 21k First Second groove of the lead 21r Element mounting area 22 Second lead 22' Second lead equivalent area 22a Upper surface of the second lead 22b Lower surface of the second lead 22c to 22f Side portion of the second lead 22g Second lead 22 side edge groove portion 22h extended portions 23 and 24 of the second lead 22 coupling portion 30 resin body 31 first resin portion 31 of the resin body 31c to 31f inner side surface of the first resin portion 31 32 second resin portion of the resin body 30 32c, 32e 1st part of 2nd resin part 32 32d 2nd part of 2nd resin part 32 32s Inclined part of 1st part 32c 32v, 32v' Recess of 2nd resin part 32 32p Convex part of 2nd resin part 32 33 3rd resin part of resin body 30 33a Upper surface of 3rd resin part 33b Lower surface of 3rd resin part 34 Resin connecting part 34a Upper surface of resin connecting part 34 41, 42 Light emitting element 43a-43d, 61 Wire 50 Light reflecting member 50s Inclined surface of light reflective member 50 Protective element 75 Sealing member 101, 102 Light emitting device 101' Light emitting device equivalent region 201 Collective substrate 202 Lead frame 210D Lower mold 210U, 210U', 210U'' Upper mold 212 upper Projection of mold 210U' 214 Recess of upper mold 210U'' 300 Release sheet

Claims (7)

A resin package having a plurality of leads including a first lead and a second lead, and a first resin portion, a second resin portion, and a third resin portion, wherein the first resin portion covers an outer surface of the resin package. The second resin portion is located around the element mounting region, the third resin portion is located between the first lead and the second lead, and the plurality of leads and the first resin are provided. A resin package in which a concave portion having an inner wall surface is formed by the portion, and a part of upper surfaces of the leads are located on the bottom surface of the concave portion,
A light emitting element disposed in the element mounting area,
A light-reflecting member located between the inner wall surface and the second resin portion in the recess;
A sealing member that is located in a region surrounded by the light-reflecting member and that covers the second resin portion and the light-emitting element,
The second resin portion has a depression on the surface,
The recess extends in a direction intersecting with the extending direction of the second resin portion,
The light emitting device, wherein a part of the sealing member is located in the recess of the second resin portion. The light emitting device further includes a wire that electrically connects a portion of the plurality of leads outside the element mounting area and the light emitting element to each other,
Some of the wire is positioned above the recess of the second resin portion, the light emitting device according to claim 1. A resin package having a plurality of leads including a first lead and a second lead, and a first resin portion, a second resin portion, and a third resin portion, wherein the first resin portion covers an outer surface of the resin package. The second resin portion is located around the element mounting region, the third resin portion is located between the first lead and the second lead, and the plurality of leads and the first resin are provided. A resin package in which a concave portion having an inner wall surface is formed by the portion, and a part of upper surfaces of the leads are located on the bottom surface of the concave portion,
A light emitting element disposed in the element mounting area,
A light-reflecting member located between the inner wall surface and the second resin portion in the recess;
A sealing member located in a region surrounded by the light-reflecting member in the recess, and covering the second resin portion and the light-emitting element;
Equipped with
The second resin portion has a depression on the surface,
A part of the sealing member is located in the recess of the second resin portion,
The resin package is located on the bottom surface of the recess, and further having a resin connecting portion which connects the said first resin part and the second resin portion, emitting light device. The light emitting device according to claim 3 , wherein the recess is located in the vicinity of a portion where the resin connecting portion and the second resin portion are connected to each other. A resin package having a plurality of leads including a first lead and a second lead, and a first resin portion, a second resin portion, and a third resin portion, wherein the first resin portion covers an outer surface of the resin package. The second resin portion is located around the element mounting region, the third resin portion is located between the first lead and the second lead, and the plurality of leads and the first resin are provided. A resin package in which a concave portion having an inner wall surface is formed by the portion, and a part of upper surfaces of the leads are located on the bottom surface of the concave portion,
A light emitting element disposed in the element mounting area,
A light-reflecting member located between the inner wall surface and the second resin portion in the recess;
A sealing member that is located in a region surrounded by the light-reflecting member and that covers the second resin portion and the light-emitting element,
The resin package further includes a resin connecting portion located on the bottom surface of the recess and connecting the first resin portion and the second resin portion,
The second resin portion has a convex portion on the surface,
The light emitting device, wherein the convex portion is covered with the sealing member. The light emitting device according to claim 5 , wherein the convex portion is located in the vicinity of a portion where the resin connecting portion and the second resin portion are connected to each other. The first lead has a first groove on at least a part of the periphery of the element mounting region on the upper surface located on the bottom surface of the recess,
Wherein at least a portion of the second resin portion is disposed in the first groove, the light emitting device according to any one of claims 1 to 6.

Images