JP5766976B2 - Method for manufacturing light emitting device - Google Patents

Description

  The present invention relates to a method of manufacturing a light emitting device used for various light sources including a lighting fixture, a display, a backlight of a mobile phone and a mobile terminal, and a moving image illumination auxiliary light source.

  A light-emitting device using a light-emitting element such as a light-emitting diode (LED) or a laser diode (LD) is small and has high light-emitting efficiency, and can emit clear light. Furthermore, it has excellent initial driving characteristics and excellent durability against vibration and repeated on / off. For this reason, light emitting devices having light emitting elements are used as various light sources.

In such a light-emitting device, the light-emitting element is mounted (mounted) on a lead frame for the purpose of supplying power to the light-emitting element and for efficiently dissipating heat generated by the light-emitting element to the outside of the light-emitting device. The
On the other hand, a resin having a high reflectance is used in order to efficiently reflect the light that has reached the surface of the light emitting device such as the element mounting surface from the light emitting element toward the outside of the light emitting device. For this reason, many light emitting devices use a package including a resin portion made of resin and a lead frame that is disposed inside the resin portion and the surface on which the light emitting element is placed is exposed from the resin portion. Yes.

Therefore, the resin of the resin portion and the metal of the lead frame are bonded (bonded) inside the package.
However, due to the difference in coefficient of thermal expansion between the metal and the resin, there has been a problem that the resin and the metal may be peeled off due to the influence of stress or the like generated during thermal expansion due to heat from the light emitting element.

  Therefore, for example, as shown in Patent Document 1 (see FIG. 1 and FIG. 2 of the same document), a method of preventing peeling by providing irregularities on the lead frame and increasing the contact area between the resin and the metal is used. ing.

  For example, as shown in Patent Document 2 (see, for example, FIG. 3 of the same document), a lead frame having a uniform thickness is bent to provide a protruding portion (bent portion) on the upper surface of the lead frame. There is also known a method for preventing peeling by generating a concave portion corresponding to the portion in the resin portion and increasing the contact area between the metal and the resin.

JP 2005-353914 A Japanese translation of PCT publication No. 2002-520823

  However, since the unevenness of such a lead frame has been conventionally formed by using a method such as bending by press working, a desired complex uneven shape cannot be obtained, and thus the peeling prevention effect may not be sufficient. .

  Even with the method of bending the lead frame described in Patent Document 2, only a relatively simple protruding portion can be formed, so that the peeling prevention effect may not be sufficient. In addition, since the manufacturing accuracy is not sufficient and the size of the unevenness that can be processed is limited, it is necessary to provide an extra region in consideration of a shift in dimensions and position that occurs during manufacturing.

  In view of the above, an object of the present invention is to provide a method for manufacturing a light-emitting device that is more firmly bonded between a resin portion of a package and a lead frame and has excellent peel resistance.

  Aspect 1 of the present invention includes a package including a resin portion including a resin, a lead frame disposed inside the resin portion, and a light emitting element disposed on an element mounting surface of the package. A method of manufacturing a light-emitting device in which the lead frame has a mounting portion exposed from the resin portion on the element mounting surface, and the light-emitting element is mounted on the mounting portion, the lead In the frame, a convex portion having the mounting portion as an upper surface is formed by etching the periphery of the mounting portion, and a resin portion surrounding the convex portion is formed by pouring resin around the convex portion. It is a manufacturing method including forming.

  The inventor of the present application etches the periphery of the mounting portion on which the light emitting element is mounted in the lead frame, and forms a convex portion with the mounting portion as an upper surface, whereby the side surface of the convex portion of the lead frame and the resin portion are formed. It has been found that sufficient adhesion can be obtained between the resin and the resin can be prevented from peeling from the lead frame.

  Conventionally, it has been known to perform a process of cutting a lead frame of a predetermined shape from a metal plate by etching. However, as in the present invention, a convex portion having a mounting portion (surface on which a light emitting element is mounted) as an upper surface is known. Little is known to use to form parts.

Making the mounting portion of the lead frame the upper surface of the convex portion makes the shape of the lead frame complicated and requires high-precision processing, so it is difficult with conventional processing methods such as punching, and etching is difficult. It can be easily formed only after use.
Also, unlike the case of using a conventional processing method, when etching is used, the side surface of the convex part becomes a shape that swells toward the convex part, and a strong bonding force acts between the resin and the convex part side surface. What can be done is also an advantage of using the etching method.

  According to the second aspect of the present invention, the lead frame has a wire connection portion exposed from the resin portion on the element mounting surface, and the wire is formed by etching the periphery of the wire connection portion in the lead frame. The manufacturing method according to aspect 1, further comprising: forming a second convex portion having a connection portion as an upper surface; and connecting a wire electrically connected to the light emitting element to the wire connection portion.

  According to the third aspect of the present invention, the resin is disposed between the convex portion and the second convex portion, and the resin portion surface forming the element placement surface is formed together with the placement portion and the wire connection portion. Furthermore, it is the manufacturing method of the aspect 2 further included.

  Aspect 4 of the present invention further includes a molding step of arranging the lead frame in a cavity of a mold and injecting resin into the cavity to produce the resin portion. A flat surface of a mold larger than the placement portion is brought into contact with the placement portion, and a resin is injected into the cavity, whereby the placement portion and the surface of the resin portion are formed on the element placement surface. It is a manufacturing method in any one of aspects 1-3 made into the same plane.

  Aspect 5 of the present invention is the manufacturing according to aspect 4, further comprising plating the mounting portion after the molding step, and projecting the convex portion from the surface of the resin portion on the element mounting surface. Is the method.

  Aspect 6 of the present invention is the manufacturing method according to any one of aspects 1 to 5, wherein the resin portion further includes a recess having the element mounting surface as a bottom surface.

  According to the seventh aspect of the present invention, the plurality of convex portions each having the placement portion described above are formed by the etching, and one light emitting element 50 is placed over the placement portions of the plurality of convex portions. It is a manufacturing method in any one of the aspects 1-7 which further contain.

  Aspect 8 of the present invention is the manufacturing method according to any one of aspects 1 to 7, further comprising making the shape of the placement portion of the convex portion circular by the etching.

  In the method for manufacturing a light emitting device according to the present invention, the lead frame can be formed with a convex portion having the mounting portion as an upper surface by etching the periphery of the mounting portion on which the light emitting element is mounted. By adhering the side surface of the convex portion to the resin of the package, it is possible to prevent the resin from peeling from the lead frame.

It is a top view of the light-emitting device 100 which concerns on this invention. It is sectional drawing which shows the II-II cross section of FIG. 3 is a plan view of a package 30 of the light emitting device 100. FIG. It is sectional drawing which shows the IV-IV cross section of FIG. It is sectional drawing which shows the VV cross section of FIG. 2 is a perspective view illustrating a bottom surface and a side surface of the light emitting device 100. FIG. It is sectional drawing which shows another embodiment of the positional relationship of the bottom face 14 of the recessed part 12 of the resin part 10, and the upper surface of the convex part 20a. FIG. 8A is a plan view of a package 30A according to Modification 3 of the present invention, and FIG. 8B is a plan view of a light emitting device 100A according to Modification 3 of the present invention. It is sectional drawing of the light-emitting device 100B which concerns on the modification 4 of this invention. FIG. 10A is a process schematic diagram showing a first manufacturing method of the light emitting device 100 according to the present invention, and FIG. 10B shows a second manufacturing method of the light emitting device 100 according to the present invention. It is process schematic. FIG. 11A is a cross-sectional view of a base material 60 for producing a lead frame, FIG. 11B is a cross-sectional view showing the AA cross section of FIG. 11A, and FIG. 11A is a cross-sectional view showing a cross section taken along the line B-B of FIG. 11A, and FIG. 11D is a cross-sectional view showing the lead frame 20 and the lead frame 22 manufactured from the base material 60, and FIG. FIG. 11D is a cross-sectional view showing the AA cross section of FIG. 11D, and FIG. 11F is a cross-sectional view showing the BB cross section of FIG. 11D. FIG. 12A is a plan view showing a light emitting device 100C according to the first modification of the present invention, and FIG. 12B is a plan view showing a light emitting device 100D according to the second modification of the present invention. It is sectional drawing of the light-emitting device 100E using the light emitting element which has a face-down structure as the light emitting element 50. FIG.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the following description, terms indicating a specific direction and position (for example, “up”, “down”, “right”, “left” and other terms including those terms) are used as necessary. These terms are used for easy understanding of the invention with reference to the drawings, and the technical scope of the present invention is not limited by the meaning of these terms. Moreover, the part of the same code | symbol which appears in several drawing shows the same part or member.

(1) Outline of Light-Emitting Device FIG. 1 is a plan view of a light-emitting device 100 obtained by the manufacturing method according to the present invention, and FIG. 2 is a cross-sectional view showing a II-II section of FIG. 3 is a plan view in which the light emitting element 50 and the wires 40 and 42 are omitted from the light emitting device 100 shown in FIG. 1 in order to facilitate understanding, that is, the plan view of the package 30 of the light emitting device 100. The figure is shown. 4 is a cross-sectional view showing the IV-IV cross section of FIG. 3, and FIG. 5 is a cross-sectional view showing the VV cross section of FIG.

The package 30 includes a resin portion (package main body) 10 having a recess (cavity) 12 on the upper surface, and at least one lead frame that is located inside (at least immediately below) the recess 12 within the resin portion 10. have. The embodiment shown in FIGS. 1 and 3 has two lead frames 20 and 22. The light emitting device 100 further includes a light emitting element 50 disposed on the lead frame 20 inside the recess 12. The light emitting element 50 is electrically connected to at least one lead frame using a wire or the like as necessary. In the embodiment shown in FIGS. 1 and 3, the light emitting element 50 is connected to the lead frame 20 by a wire 40. The wire 42 is connected to the lead frame 22.
The recess 12 is preferably filled with a sealing material whose details will be described later as shown in FIGS.
The light emitting device 100 having such a configuration and effect will be described in detail below.

(2) Lead frame 20
The light emitting device 100 according to the present invention has at least one lead frame (lead frame 20 in the figure).
At least one convex portion 20 a is provided on the upper surface of the lead frame 20 disposed inside the resin portion 10, and the upper surface (also referred to as “top surface”) of the convex portion 20 a is the bottom surface of the concave portion 12 of the resin portion 10. In FIG. 14, the light-emitting element 50 is disposed so as to be exposed from the resin portion 10. That is, the upper surface of the convex portion 20a is a placement portion (light emitting element mounting pattern) for placing the light emitting element 50 thereon.
The side surface of the convex portion 20 is bonded (bonded) to the resin of the resin portion 10.

  The light emitting element 50 may be fixed to the mounting portion (the upper surface of the convex portion 20a) using eutectic bonding using an Au—Sn alloy or the like, or a paste such as silicon paste, silver paste, or resin paste.

Preferably, the lead frame 20 includes a protrusion other than the protrusion 20a.
In the embodiment shown in FIGS. 1 to 5, there are further two convex portions 20 b (second convex portions) and 20 c (third convex portions).
The upper surface (also referred to as “top surface”) of the convex portion 20 b is also not covered with the resin of the resin portion 10, that is, exposed from the resin portion 10 at the bottom surface 14 of the concave portion 12.
The bottom surface 14 refers to the upper surface of the convex portion exposed from the resin portion 10 (the resin constituting the resin 10) in addition to the portion made of the resin constituting the resin portion 10 (in the embodiment of FIGS. 3 and 4). In addition to the upper surface of the convex portion 20a of the lead frame 20 and the upper surface of the convex portion 20b, the upper surface of the convex portion 22a of the lead frame 22 to be described in detail later.
The bottom surface 14 corresponds to an element mounting surface on which the light emitting element 50 is disposed.

The protrusions 20a, 20b, and 20c preferably have a height (z direction in FIGS. 1 and 2) that is approximately half the thickness of the lead frame 20 or less. Specifically, the height to the bottom surface 14 (the height from the upper surface of the portion without the convex portion of the frame 20 to the upper surface of the convex portion) is 0.2 mm or less, and further 0.01 mm to 0.1 mm. Is preferred. The vertical direction (x direction in FIGS. 1 and 2) and the horizontal direction (y direction in FIGS. 1 and 2) of the upper surface of the convex portion have an area sufficient for bonding the light emitting element 50, the wire 40 and the like placed on the upper surface. It is preferable to set so. When the light emitting element 50 is mounted, the area of the bottom surface of the light emitting element 50 is preferably 50% to 150% with respect to the area of the upper surface of the convex portion 20a. This makes it possible to achieve both good heat dissipation and good light-emitting element mounting properties. The area of the upper surface of the convex portion 20b to which the wire 40 is bonded may be substantially the same as or smaller than the area of the convex portion 20a on which the light emitting element 50 is placed.
Further, the distance between the convex parts 20a, 20b, and 20c, which are closest to each other (the convex part of the same lead frame), depends on the processing method. For example, if etching is used, the distance is reduced to about 0.1 mm. can do. Preferably it is 0.1 mm or more.

  The light emitting element 50 is electrically connected to the lead frame 20. One of the preferred connection forms is to connect the upper surface of the convex portion 20b and the light emitting element 50 by a wire 40 as shown in the figure. That is, the upper surface of the convex part 20b functions as a wire connection part (wire pattern).

  A gap (concave portion) 25 a between the convex portion 20 a and the convex portion 20 b of the lead frame 20 is filled with the resin of the resin portion 10. More preferably, the resin present in the gap 25a forms a resin portion surface that forms the bottom surface 14 (element placement surface) together with the protrusion 20a (mounting portion) and the protrusion 20b (wire connection portion) (that is, A part of the bottom surface 14 of the recess 12 of the resin portion 10 is formed at the upper end of the gap 25a).

  Preferably, as illustrated, the gap 25b between the convex portion 20b and the convex portion 20c is also filled with the resin of the resin portion 10. More preferably, the resin existing in the gap 25b also forms a resin portion surface that forms the bottom surface 14 (element placement surface) together with the protrusions 20a (mounting portions) and the protrusions 20b (wire connection portions) (that is, A part of the bottom surface 14 of the recess 12 of the resin portion 10 is formed at the upper end of the gap 25b.)

  As described above, the resin enters the gaps 25a and 25b, and the entered resin adheres (bonds) to the side surfaces of the protrusions 20a, 20b, and 20c, and further, the bottom surfaces of the gaps 25a and 25b (leads in the gaps 25a and 25b). Since the upper surface of the frame is also bonded, the area where the resin of the resin portion 10 and the lead frame 22 are bonded can be increased. Thereby, the risk that the resin part 10 and the lead frame 20 will peel can be greatly reduced.

  Further, in the preferred embodiment, since the resin filled in the gap 25a and the gap 25b of the lead frame 20 forms the bottom surface 14 of the recess 12 as described above, a metal having low reflectance at the bottom surface 14 of the recess. The exposure of the frame 20 can be reduced, and the proportion of the resin having a high reflectance can be increased. This means that more light reaching the bottom surface 14 of the recess 12 from the light emitting element is reflected, and as a result, more light is emitted from the light emitting device 100 to the outside. That is, the light emitting device 100 has higher luminous efficiency.

Further, the heat generated when the light emitting element 50 is caused to emit light by being energized is conducted in the lead frame 20 through the upper surface (mounting portion) of the convex portion 20a. The lead frame 20 is disposed not only directly under the light emitting element 50 but also in the lateral direction (x direction in FIG. 2) in FIG. 2 and has a sufficient volume, so that it sufficiently absorbs heat generated by the light emitting element 50. The heat can be radiated to the outside of the light emitting device 100.
In particular, since the bottom surface (lower surface) of the lead frame 20 is exposed from the resin portion 10 immediately below the light emitting element 50, heat can be radiated more efficiently. As shown in FIG. 2, the convex portion 20a on which the light emitting element 50 is placed has a surface (back surface) facing the placement portion of the light emitting element 50 exposed from the resin portion 10 (that is, a lead frame). It is preferable that a portion immediately below the convex portion 20a is exposed from the resin portion 10 on the lower surface of the resin 20).
As shown in FIGS. 2 and 4, the lead frame 20 is preferably exposed from the resin portion 10 on the side surface and / or the bottom surface of the package 30. This is because heat generated from the light emitting element 50 can be radiated outside the light emitting device more efficiently. Details of this preferred embodiment will be described later.
The convex portions 20a and 20b having such effects are produced by etching.
The effect of using the formation method and etching will be described together with the effect of using the formation method of the convex portion 22a of the lead frame 22 and the formation method after describing the lead frame 22 that is suitably arranged below. .

(3) Lead frame 22
The light emitting device 100 may include a lead frame (second lead frame) 22 as illustrated. When the lead frame 22 is used, the lead frame 22 is also disposed in the resin portion 10 as in the case of the lead frame (first lead frame) 20, and at least a part thereof is located below the bottom surface 14. The lead frame 22 has two convex portions 22 a and 22 b on the upper surface, and the convex portion 22 a is located below the bottom surface 14 of the concave portion 12. The top surface (also referred to as “top surface”) of the convex portion 22 a is not covered with the resin of the resin portion 10 and is exposed from the resin portion 10 at the bottom surface 14.

  The protrusions 22 a and 22 b preferably have a height (z direction in FIGS. 1 and 2) that is substantially half or less than the thickness of the lead frame 22. Specifically, the height to the bottom surface 14 (the height from the upper surface of the portion without the convex portion of the frame 22 to the upper surface of the convex portion) is 0.2 mm or less, and further 0.01 mm to 0.1 mm. Is preferred. The length (x direction in FIGS. 1 and 2) and the width (y direction in FIGS. 1 and 2) of the upper surface of the convex portion are preferably set so as to have an area sufficient for bonding the wire 42 and the like. The area of the upper surface of the protrusion 22a to which the wire 42 is bonded is preferably substantially the same as or smaller than the area of the protrusion 20a on which the light emitting element 50 is placed. Further, the distance between the convex portions 22a and 22b, which are closest to each other (the convex portion of the same lead frame), depends on the processing method. For example, if etching is used, the distance should be reduced to about 0.1 mm. Can do. Preferably it is 0.1 mm or more.

  The light emitting element 50 is electrically connected to the upper surface of the convex portion 22a through a wire 42. That is, the upper surface of the convex portion 22a functions as a wire connecting portion (wire pattern).

  A gap (concave portion) 25 c between the convex portion 22 a and the convex portion 22 b of the lead frame 22 is filled with the resin of the resin portion 10. Preferably, the resin that fills the gap 25c forms part of the bottom surface 14 of the recess 12 of the resin portion 10 at the upper end of the gap 25c.

  Further, the resin enters the gap 25c, and this resin adheres (bonds) to the side surfaces of the convex portions 22a and 22b, and further adheres to the bottom surface of the gap 25c (the upper surface of the lead frame 22 in the gap 25c). The area where the resin and the lead frame 22 are bonded can be increased. Thereby, the risk that the resin part 10 and the lead frame 22 will peel can be reduced.

  Further, since the gap 25c is filled with resin, and this resin preferably forms a part of the bottom surface 14 of the recess 12, the exposure of the metal frame 22 having low reflectivity at the bottom 14 of the recess 12 is reduced. The ratio of the resin having a high reflectance can be increased. This means that more light reaching the bottom surface 14 of the recess 12 from the light emitting element 50 is reflected, and as a result, more light is emitted from the light emitting device 100 to the outside. That is, although the light emitting device 100 includes the two lead frames 20 and 22, high light emission efficiency can be obtained.

More preferably, as shown in FIGS. 2 and 4, the gap 25 c is formed under a connection portion (a portion where the bottom surface 14 and the side surface 16 intersect) of the bottom surface 14 of the concave portion 12 and the side surface 16 of the concave portion 12. Located directly below).
Since it is possible to reliably realize a state in which the lead frame 22 does not exist at the connection portion between the bottom surface 14 and the side surface 16 where stress is concentrated and tends to be a starting point of peeling, the peeling between the resin portion 10 and the lead frame 22 is more reliably performed. Can be prevented.

It is more preferable that the lead frame 20 has the same configuration. That is, as shown in FIG. 2 and FIG. 3, more preferably, the gap 25 b is a connecting portion (a portion where the bottom surface 14 and the side surface 16 intersect) of the bottom surface 14 of the concave portion 12 of the resin portion 10 and the side surface 16 of the concave portion 12. Located below (directly below).
Accordingly, the same effect can be obtained for the lead frame 20.

FIG. 6 is a perspective view showing a bottom surface and a side surface of the light emitting device 100.
The lead frame 20 preferably has a side surface (right side surface in FIGS. 2 and 4) and / or a bottom surface (bottom surface in FIGS. 2 and 4 and bottom surface in FIG. 5), as shown in FIGS. Is exposed from the resin portion 10. Thereby, the heat generated by the light emitting element 50 can be radiated to the outside of the light emitting device 100 more easily.
In this case, on the bottom surface of the lead frame, for example, as shown in FIGS. 2 and 4, it is more preferable that a portion immediately below the convex portion 20 a on which the light emitting element 50 is placed is exposed from the resin portion 10.
Further, by exposing a part of the surface of the lead frame 20 to the outside as described above, the lead frame 20 and an electrical contact such as an electrode of a mounting board on which the light emitting device 100 is mounted can be easily electrically connected. .

  Similarly, the lead frame 22 preferably has a side surface (left side surface in FIGS. 2 and 4) and / or a bottom surface (bottom surface in FIGS. 2 and 4, as shown in FIGS. 2, 4 and 5). 5 is shown as an upper surface) from the resin portion 10. Thus, by exposing a part of the surface of the lead frame 22 to the outside, the lead frame 22 and an electrical contact such as an electrode of a mounting board on which the light emitting device 100 is mounted can be easily electrically connected.

  In the light emitting device 100 according to the embodiment shown in FIGS. 2, 4, and 5, for example, the bottom surfaces of the lead frames 20 and 22 are fixed onto the electrodes arranged on the mounting substrate using solder or the like. The lead frame 20 and the lead frame 22 can be electrically connected to the external electrodes, respectively.

In this case, the lead frame 20 preferably has notches (dents) 27a on the exposed bottom surface and side surfaces. Similarly, the lead frame 22 preferably has cutouts 27b on the exposed bottom and side surfaces.
When the bottom surfaces of the lead frame 20 and the lead frame 22 are fixed to the electrodes of the mounting substrate using solder, the solder enters the notches 27a and 27b. As a result, the lead frame 20 and the lead frame 22 can be fixed to the electrodes more stably, and as a result, the lead frame 20 and the lead frame 22 can be electrically connected more stably.

(4) Manufacturing Method of Lead Frame 20 and Lead Frame 22 FIG. 11 is a cross-sectional view showing a method of manufacturing the lead frame 20 and the lead frame 22. FIG. 11A is a cross-sectional view of a base material 60 for producing a lead frame, FIG. 11B is a cross-sectional view showing the AA cross section of FIG. 11A, and FIG. It is sectional drawing which shows the BB cross section of Fig.11 (a). FIG. 11D is a cross-sectional view showing the lead frame 20 and the lead frame 22 manufactured from the base material 60, and FIG. 11E is a cross-sectional view showing the AA cross section of FIG. 11D. FIG. 11 (f) is a cross-sectional view showing a BB cross section of FIG. 11 (d).

  The lead frame forming base material 60 is made of, for example, a good electrical conductor such as iron, phosphor bronze, or copper alloy, and is prepared in a predetermined shape by processing such as rolling, punching, or extrusion. For example, as shown in FIGS. 11A to 11C, a shape that makes it easier to obtain a desired lead frame shape, such as changing the width (length in the y direction) between the upper end side and the lower end side, may be selected. ,

As an etching method, dry etching and wet etching can be used. As the etchant, an appropriate one corresponding to the material of the lead frames 20 and 22 may be selected. The lead frames 20 and 22 are obtained by etching the base material 60.
Etching conditions vary depending on the type of metal used, but when copper is used for the lead frame, for example, as an etchant, persulfate or hydrogen peroxide and inorganic acid, iron chloride or copper chloride and inorganic acid, ammonia copper complex salt It is suitable to use a general copper soft etching solution made of an ammonium salt or the like.

The convex portion is formed by etching the peripheral portion.
For example, in the case of the convex portion 20a, the right side of the portion to be the convex portion 20a (the portion used as the placement portion) is etched from the top to the bottom (-z direction) to create a gap 25a and the convex portion 20a. The left side of the portion is formed by etching from the top to the bottom (−z direction) and from the bottom to the top (+ z direction) so as to penetrate, and separating the base material 60 into the lead frame 20 and the lead frame 22.

  In this way, the etching is not only used to stop the etching in the middle of the thickness (z direction) of the base material and form a gap in the lead frame, but also to penetrate in the thickness direction of the base material. Etching may be used to separate the lead frame.

  Moreover, in the case of the convex part 20b, it can obtain by forming the clearance gap 25b on the right side of the part used as the convex part 20b (part used as a connection part), and the clearance gap 25a on the left side by etching.

  As an advantage of using the etching method, as shown in FIG. 11 (d), the side surface of the obtained convex portion is shaped so as to swell toward the convex portion (so-called barrel shape). As a result, the gaps 25a, 25b, and 25c all have a width (length in the y direction) that increases from the upper end toward the lower end, and then decreases toward the lower end. Therefore, since the resin entering the gap is restrained by the barrel-shaped gap having a wide central portion, it is extremely difficult to move upward. That is, it becomes difficult to peel off more reliably.

  Further, the upper surface (mounting portion) of the convex portion 20a after etching, the upper surface (connecting portion) of the convex portion 20b, and the upper surface (connecting portion) of the convex portion 22a are as shown in FIG. (In a plane seen from above), the corner portion is etched away to have R (having roundness).

  As an advantage that the corner of the mounting portion is round, for example, when the light emitting element 50 is fixed to the mounting portion (the upper surface of the convex portion 20a) using an adhesive material such as a eutectic alloy such as Au—Sn, light is emitted. It is mentioned that the element 50 can be fixed more firmly. This is because when the corner of the mounting portion is rounded, the adhesive material easily spreads to the end of the corner and the wettability of the eutectic alloy is improved. It is particularly preferable when the light emitting element 50 is bonded by an adhesive material containing a metal such as a eutectic alloy or a silver paste.

  As described above, when etching is performed so as to penetrate the base material 60 in the thickness direction, the etching may be performed only from one surface (for example, the upper surface) of the base material, or both surfaces (for example, the upper surface and the lower surface). However, the etching is preferably performed from both sides. When etching is performed from both sides as shown in FIG. 11 (d), two bulges (barrels) in the direction of the lead frame of the side surface of the convex portion formed by etching are formed, so that the adhesion to the resin is further improved. It is because it improves.

  Of course, the notches 27a and 27b may also be formed by etching.

(5) Positional relationship between the bottom surface of the concave portion of the resin portion and the top surface of the convex portion of the lead frame Next, the positional relationship between the bottom surface 14 of the concave portion 10 and the top surface (mounting portion) of the convex portion 20a will be described in detail.
In one preferred embodiment of the bottom surface 14, the bottom surface 14 is planar as shown in FIGS. That is, the upper surface of each of the convex portions 20a and 20b of the lead frame 20, the upper surface of the convex portion 22a of the lead frame 22, and the other portion (that is, the portion made of resin) of the bottom surface 14 are coplanar. It is a state that exists in (is in the same plane). In such a state, when the lead frames 20 and 22 are arranged in the cavity of the mold and the package 30 is formed by pouring resin by the transfer molding method, the portion of the mold (the convex A flat surface larger than the portion 20a (mounting portion) can be easily formed by bringing the upper surfaces of the convex portions 20a, 20b, and 22a into contact with each other.

  Since the resin is poured in such a state that the upper surface of the mold and the convex portion are in contact with each other, the upper surface of the convex portions 20a, 20b, and 22a is not covered with the resin, or the resin is extremely thin even if covered with the resin. Since it can be easily removed by deburring, there is an advantage that the upper surfaces of the protrusions 20a, 20b, and 22a can be exposed very easily.

  The bottom surface 14 having such a configuration is the size of the light emitting element 50 placed on the upper surface (mounting portion) of the convex portion 20a, more specifically, the portion placed on the upper surface of the convex portion 20a. The size of the bottom surface of the light emitting element 50 is plus or minus 0.1 mm with respect to the vertical and horizontal sides of the top surface of the convex portion 20a in both the vertical direction (x direction in FIGS. 1 and 2) and the horizontal direction (y direction). It is preferable to be within the range. Within this range, the upper surface of the convex portion 20a is not covered by the light emitting element 50, and therefore there are few portions with low reflectance (including the case where the silver plating is discolored due to corrosion), and the bottom surface 14 is This is because a higher reflectance can be maintained. Furthermore, when the size of the bottom surface of the light emitting element 50 is within this range, a so-called self-alignment effect can be obtained. That is, since the outer shapes of the bottom surface of the light emitting element 50 and the upper surface of the convex portion 20a are substantially the same (the shapes correspond to each other), the light emitting element 50 is fixed to the upper surface of the convex portion 20a, for example, by eutectic bonding. If it is going to do, since the bottom face of the light emitting element 50 will automatically move to the center of the upper surface of the convex part 20a at the time of joining, the light emitting element 50 can be mounted with extremely high mounting accuracy. The shape of the upper surface of the convex portion 20a is preferably a shape corresponding to the shape of the light emitting element 50 in plan view. For example, if the planar view shape of the light emitting element 50 is substantially square (for example, as shown in FIG. 1), the shape of the upper surface of the convex portion 20a is also substantially square. The shape of the upper surface of the convex portion 20a may be a shape with rounded corners as shown in FIG. By setting it as such a shape, wettability with the adhesive material which adhere | attaches the light emitting element 50 can be improved. It is particularly preferable when the light emitting element 50 is bonded by an adhesive material containing a metal such as eutectic bonding.

  Such a preferable relationship between the size of the bottom surface of the light emitting element and the size of the top surface of the convex portion 20 can be defined by the area instead of the vertical and horizontal lengths. Specifically, the area of the bottom surface of the light emitting element 50 is preferably in the range of 50% to 150% with respect to the area of the top surface of the convex portion 20. The reason why this area range is preferable is the same as the above-described vertical and horizontal size ranges.

(6) Another embodiment of the positional relationship between the bottom surface of the concave portion of the resin portion and the top surface of the convex portion of the lead frame FIG. 7 shows another implementation of the positional relationship between the bottom surface 14 of the concave portion 12 of the resin portion 10 and the top surface of the convex portion. It is sectional drawing which shows a form. In the embodiment shown in FIG. 7, the convex portion 20a of the lead frame 20 is formed on the bottom surface 14 except for the surface of the resin portion 10 (of the bottom surface 14 other than the upper surface of the convex portion 20a, the upper surface of the convex portion 20b, and the upper surface of the convex portion 22a. (That is, the mounting portion protrudes from the resin portion 10 on the element mounting surface). In this case, preferably, as shown in FIG. 7, the convex portion 20 b of the lead frame 20 and the convex portion 22 a of the lead frame 22 protrude similarly.
Such a protrusion of the lead frame protrusion is formed by, for example, placing the lead frame 20 and the lead frame 22 in a cavity of a mold and pouring resin by the transfer molding method to form the package 30. It can be obtained by adjusting the mold shape so that the surface to be the bottom surface 14 of the resin portion 10 is lower than the upper surfaces of the convex portions 20a, 20b, and 22a.

However, preferably, as described above, the upper surface of each of the convex portions 20a and 20b of the lead frame 20, the upper surface of the convex portion 22a of the lead frame 22, and the other portions of the bottom surface 14 (that is, from resin) And the upper surfaces of the protrusions 20a, 20b, and 22a are plated layers (metal layers) 21a, 21b, and 21c, respectively. Thus, by performing the plating process, the upper surface of the convex portion can be more easily protruded from the surface of the resin portion 10 at the bottom surface 14.
In this case, needless to say, the plating layer 20a functions as a mounting portion, and the plating layers 20b and 20c function as connection surfaces.

  The plating layers 21a, 21b, and 21c are made of, for example, metal plating selected from silver, gold, nickel, palladium, copper, tin, or alloy plating combining these. Preferably, high reflectivity silver or gold having good adhesion to the wire is selected. The plating layers 21a, 21b, and 21c can be selectively formed only on the convex portions 20a, 20b, and 22a by forming by electroplating after the resin portion 10 is formed. Moreover, the plating layers 21a, 21b, and 21c can be formed in the same process by using the same material.

  Thus, by projecting the upper surface of the convex portion of the lead frame from the surface of the resin portion 10 at the bottom surface 14, for example, as shown in FIG. 7, when the bottom surface of the light emitting element 50 is larger than the upper surface of the convex portion 20a (light emitting element). 50 is placed outside the top surface of the protrusion 20a (placed to the outside in the vertical direction (x direction) and / or the horizontal direction (y direction)) without contacting the bottom surface of the light emitting element 50 with the resin part 10. It can be bonded to the upper surface (light emitting element bonding portion) of the convex portion 20a. Thereby, the light emitting element 50 can be more accurately and stably mounted on the upper surface of the convex portion 20a. In particular, when the light emitting element 50 is mounted by eutectic bonding, if the bottom surface of the light emitting element 50 is larger than the upper surface of the convex portion 20a, bonding failure may occur. However, as described above, the upper surface of the convex portion is separated from the surface of the resin portion 10. By projecting, it can be mounted with high accuracy and stability using eutectic bonding. By using eutectic bonding, the light emitting element and the lead frame can be connected by a metal material having good thermal conductivity, so that heat of the light emitting element can be efficiently released to the lead frame.

(7) Modifications 1 and 2
FIG. 12A is a plan view showing a light emitting device 100C according to the first modification of the present invention, and FIG. 12B is a plan view showing a light emitting device 100D according to the second modification of the present invention.
In FIG. 12A and FIG. 12B, the upper surface (mounting portion) of the convex portion 20a located under the light emitting element 50 is indicated by a dotted line.

・ Modification 1
As shown to Fig.12 (a), in 100 C of light-emitting devices, the upper surface (mounting part) of the convex part 20a is circular. And the light emitting element 50 is arrange | positioned beyond the upper surface (mounting part) of the convex part 20a.
That is, the bottom surface of the light emitting element 50 is larger than the top surface of the convex portion 20a.

The upper surface (mounting portion) of such a circular convex portion 20a can be easily formed by performing the etching shown in the above-mentioned “(4) Manufacturing method of lead frame 20 and lead frame 22”.
In the light emitting device 100C, since the bottom surface of the light emitting element 50 is larger than the upper surface of the convex portion 20a, the upper surface of the convex portion 20a preferably has the plating layer 21a as described above.

  In the light emitting device 100C in which the upper surface (mounting portion) of the convex portion 20a has such a shape, the adhesive material for adhering the light emitting element 50 easily spreads to the end of the upper surface of the convex portion 20a, and the light emitting element 50 and the package (lead) It has the advantage of improving the adhesion to the frame. Moreover, since the reflectance of the upper surface of the convex part 20a hardly affects the light output of the light emitting device 100C by making the upper surface of the convex part 20a small enough to be completely covered with the light emitting element 50, the convex part 20a The top surface material can be selected without limiting the reflectivity.

・ Modification 2
As shown in FIG. 12B, the light emitting device 100D has upper surfaces (a plurality of placement portions) of the plurality of convex portions 20a, each of which is circular. And one light emitting element 50 is arrange | positioned over these some mounting parts (upper surface of the convex part 20a).

The upper surfaces (mounting portions) of the plurality of convex portions 20a close to each other can be easily formed by performing the etching shown in the above-mentioned “(4) Method for manufacturing lead frame 20 and lead frame 22”. .
In the light emitting device 100D, since the bottom surface of the light emitting element 50 is larger than the top surface of each convex portion 20a, the top surface of the convex portion 20a preferably has the plating layer 21a as described above. Moreover, it is preferable to arrange the plurality of convex portions 20 a in the vicinity of the corner of the light emitting element 50 so that the light emitting element 50 can be easily fixed.

Since the light emitting device 100D in which the upper surface (mounting portion) of the convex portion 20a has such a shape can further reduce the area of the upper surface of the convex portion 20a, the reflectance of the upper surface of the convex portion 20a is the light of the light emitting device 100D. This has the advantage that the influence on the output can be further reduced.
In the second modification, the shape of the upper surface of the convex portion 20a may be an elliptical shape, a rectangular shape, or a polygonal shape in addition to the circular shape. When formed by etching as described above, the corners are rounded. Therefore, when forming a small convex portion 20a as shown in FIG. 12B, it can be easily formed by making it substantially circular (circular convex The upper surface of the portion 20a can be easily formed).
(8) Modification 3
FIG. 8A is a plan view of a package 30A according to Modification 3 of the present invention, and FIG. 8B is a plan view of a light emitting device 100A according to Modification 3 of the present invention.
In the light emitting device 100A, a plurality of light emitting elements 50 (three in the embodiment of FIG. 8B) are placed on the convex portions 20a1, 20a2, and 20a3 of different lead frames. The convex portions 20a1, 20a2, and 20a3 may have the same configuration as the convex portion 20a described above.
Similar to the light emitting device 100, the convex portions 22b1, 20b1, 20b2, and the convex portions 22a of the lead frame, in which the light emitting element 50 is not disposed, are disposed. The convex portions 20b1, 20b2, and 22b may have the same configuration as the above-described convex portion 20b unless otherwise specified. The wire 40 and / or the wire 42 may be connected to the upper surfaces of the convex portions 20b1, 20b2, 20b3 and the convex portions 22a, 22b.
A plurality of lead frames having these convex portions are disposed in the resin portion of the package 30A and below the bottom surface 14 of the resin portion, and a resin that forms the bottom surface 14 in a gap between the convex portions is formed. Existence is similar to that of the light emitting device 100.

  Further, as shown in FIG. 8B, a Zener diode 55 that functions as a protective element is formed on at least one of the upper surfaces of the convex portions 20b1 and 20b2 and the convex portions 22a and 22b, in which the light emitting element 50 is not disposed. Elements other than such a light emitting element may be arranged.

(9) Modification 4
FIG. 9 is a cross-sectional view of a light emitting device 100B according to Modification 4 of the present invention.
Unlike the resin portion 10 of the light emitting device 100, the resin portion 10B of the light emitting device 100B does not have a recess. Therefore, the package in the present modification example is composed of the resin portion 10B and the lead frames 20 and 22, and the package in this specification is a concept including the one in which the resin portion does not include a recess.
Such a light-emitting device in which the resin portion of the package does not have a recess and the light-emitting element 50 is disposed on the upper surface 14B of the resin portion 10B is also included in the present application.
In the light emitting device 100, the bottom surface 14 and the side surface 16 of the concave portion 12 function as a reflector that reflects the light of the light emitting element 50, whereas in the light emitting device 100B, since there is no concave portion 12, a corresponding portion of the side surface 16 is formed. Absent. The upper surface 14B of the resin portion 10B of the light emitting device 100B corresponds to the bottom surface 14 of the light emitting device 100. In other words, the upper surface 14B is an element mounting surface in this modification.
That is, the light that reaches the upper surface 14B of the resin portion 10B from the light emitting element 50 is reflected in a desired direction by the upper surface 14B.

  Also in the light emitting device 100B, the light emitting element 50 is placed on the upper surface of the convex portion 20a. Further, the side surface of the convex portion 20 is bonded (bonded) to the resin of the resin portion 10B, thereby preventing the resin portion 10B and the lead frame 20 from being separated.

  The lead frame 20 shown in FIG. 9 preferably has two convex portions 20a and 20b as shown, and the upper surfaces of the convex portions 20a and 20b are exposed from the resin portion 10B on the upper surface 14B of the resin portion 10B. ing. The gap (concave portion) 25a between the convex portion 20a and the convex portion 20b of the lead frame 20 is filled with the resin of the resin portion 10B, and the resin existing in the gap 25a is resin at the upper end of the gap 25a. Part of the upper surface 12 of the portion 10B is formed.

Thus, the lead frame 20 preferably has two convex portions on the upper surface, and there is a resin that forms the upper surface of the resin portion 10B in a gap formed between the two convex portions. . Further, at least one of the convex portions on the upper surface of the lead frame 20 (the convex portion 20a) is preferably exposed from the resin portion 10B on the upper surface 14B, which is one of the surfaces of the resin portion 10B. The light emitting element 50 is placed on the upper surface.
Therefore, similar to the light emitting device 100, it has higher luminous efficiency.

When energized, the heat generated when the light emitting element 50 emits light is conducted in the lead frame 20 through the upper surface of the convex portion 20a. The lead frame 20 is disposed not only directly under the light emitting element 50 but also in the lateral direction (x direction in FIG. 2) in FIG. 2 and has a sufficient volume, so that it sufficiently absorbs heat generated by the light emitting element 50. It is possible to radiate heat to the outside of the light emitting device 100B.
As shown in FIG. 9, the lead frame 20 is exposed on the bottom surface of the resin portion 10B. As a result, the heat generated from the light emitting element 50 can be radiated to the outside of the light emitting device 100B more efficiently. In particular, since the bottom surface (lower surface) of the lead frame 20 is exposed from the resin portion 10 immediately below the light emitting element 50, heat can be radiated more efficiently.

  Further, since the resin enters the gap 25a and adheres to the lead frame 20, the area where the resin of the resin portion 10B and the lead frame 20 are adhered can be increased. Thereby, the risk that the resin part 10B and the lead frame 20 will peel can be reduced. In particular, as shown in FIG. 9, the resin portion 10 </ b> B that does not have a concave portion is likely to have a small adhesion area between the resin portion 10 </ b> B and the lead frame 20, and thus the structure is highly reliable in that peeling is suppressed. The light emitting device 100B can be obtained.

  Further, in the embodiment shown in FIG. 9, the convex portions 20a, 20b, and 22a have plating layers 21a, 21b, and 21c on the upper surface, respectively, and therefore, similar to the light emitting device according to the embodiment shown in FIG. The same effect can be obtained.

  Of course, the lead frames 20 and 22 are not limited to the form described in FIG. 9, and the form described in the description of the light emitting device 100 can be similarly applied.

(10) Description of each element Next, the detail of each element of the light-emitting device 100, 100A, 100B, 100C, 100D demonstrated above is demonstrated.

(Light emitting element)
As the light emitting element 50, a substrate in which a semiconductor such as GaAlN, ZnS, SnSe, SiC, GaP, GaAlAs, AlN, InN, AlInGaP, InGaN, GaN, and AlInGaN is formed as a light emitting layer is preferably used. There is no particular limitation. Those having an emission peak wavelength of 360 nm to 520 nm are preferred, but those having a wavelength of 350 nm to 800 nm can also be used. In particular, the light emitting element 50 preferably has an emission peak wavelength in a short wavelength region of visible light of 420 nm to 480 nm.

As the light emitting element 50, a face-up structure in which a p-electrode and an n-electrode are formed on the same surface side can be used, and a face-down structure can also be used. In the case of the face-up structure, as shown in FIGS. 1 and 2, a plurality of convex portions 20a and 20b are formed on one lead frame 20, the light emitting element 50 is placed on one convex portion 20a, and the other A wire 40 electrically connected to the p-electrode (or n-electrode) of the light-emitting element 50 is connected to the convex portion 20b, and further, a wire 42 electrically connected to the n-electrode (or p-electrode) of the light-emitting element 50. May be connected to a convex portion 22 a formed on the other lead frame 22.
Moreover, the light emitting element 50 can also use the thing of the double-sided electrode structure each formed in the two main surfaces where a p electrode and an n electrode oppose. In this case, the electrode on the back side of the light emitting element 50 is electrically connected to the lead frame 20 via a conductive adhesive, and the electrode on the surface side of the light emitting element 50 is connected to the other lead frame 22 via a wire. Can be electrically connected. At this time, it is preferable to mount a plurality of light emitting elements 50 on the plurality of convex portions 20a and 20b provided on the lead frame 20, respectively. The size of the light-emitting element 50 is not particularly limited, and a square shape or a rectangular shape having one side of 350 μm, 500 μm, and 1 mm can also be used. A plurality of light emitting elements can be used. When a plurality of light emitting elements 50 are used, they may all be the same type, or may be different types that exhibit red, green, and blue emission colors that are the three primary colors of light.
FIG. 13 is a cross-sectional view of a light-emitting device 100E using a light-emitting element having a face-down structure including a p-electrode and an n-electrode on the bottom side as the light-emitting element 50. By forming the convex portions 20a and 22a by etching, the convex portions 20a and 22a having a shape along the shape of the light emitting element 50 can be formed with high accuracy. Moreover, the convex parts 20a and 22a along the electrode shape of the light emitting element 50 can also be formed.

(package)
The packages 30 and 30A have a resin portion made of resin and a lead frame, and are integrally molded.

  The outer shape of the packages 30 and 30A is not limited to a substantially rectangular parallelepiped, and may be a substantially cube, a substantially hexagonal column, or another polygonal shape. Further, when viewed from the outer upper surface side, shapes such as a substantially triangular shape, a substantially rectangular shape, a substantially pentagonal shape, and a substantially hexagonal shape can be employed.

(Resin part)
The resin portion 10 forms a recess 12 having a bottom surface 14 and a side surface 16. The concave portion 12 can take various shapes such as a substantially circular shape, a substantially elliptical shape, a substantially rectangular shape, a substantially polygonal shape, and a combination thereof, as viewed from the outer upper surface side. The recess 12 preferably has a shape that expands in the opening direction, but may have another shape including a cylindrical shape. The surface of the concave portion 12 may be smooth, but it may have a surface shape that provides fine irregularities on the surface and scatters light.
It is preferable to use a triazine derivative epoxy resin which is a thermosetting resin as the material of the resin portions 10 and 10B. The thermosetting resin can contain an acid anhydride, an antioxidant, a release material, a light reflecting member, an inorganic filler, a curing catalyst, a light stabilizer, and a lubricant. The light reflecting member may use titanium dioxide and is filled with 10 to 60 wt%.
The resin parts 10 and 10B are not limited to the above-described forms, and at least one selected from the group consisting of epoxy resins, modified epoxy resins, silicone resins, modified silicone resins, acrylate resins, and urethane resins among thermosetting resins. It is preferable to form by. Particularly preferred are epoxy resins, modified epoxy resins, silicone resins, and modified silicone resins. For example, an epoxy resin composed of triglycidyl isocyanurate, hydrogenated bisphenol A diglycidyl ether, etc., and an acid anhydride composed of hexahydrophthalic anhydride, 3-methylhexahydrophthalic anhydride, 4-methylhexahydrophthalic anhydride, etc. To 100 parts by weight of a colorless and transparent mixture obtained by dissolving and mixing with an epoxy resin in an equivalent amount, 0.5 parts by weight of DBU (1,8-Diazabicyclo (5,4,0) undecene-7) as a curing accelerator, It is possible to use a solid epoxy resin composition in which 1 part by weight of ethylene glycol, 10 parts by weight of titanium oxide pigment and 50 parts by weight of glass fiber are added as co-catalysts and B-staged by partial curing reaction by heating. it can.
In addition, the resin portions 10 and 10B are made of an insulating material that has heat resistance and appropriate strength and is difficult to transmit light emitted from the light emitting element 50, external light, and the like. As such a material, at least one resin selected from an epoxy resin, a modified epoxy resin, a silicone resin, a modified silicone resin, an acrylate resin, and a urethane resin among thermosetting resins can be used. In particular, an epoxy resin, a modified epoxy resin, a silicone resin, and a modified silicone resin are suitable as the material for the resin portion 10. Further, a thermoplastic resin such as a liquid crystal polymer, a polyphthalamide resin, or polybutylene terephthalate (PBT) may be used. The resin may contain a light reflecting member or the like. As the light reflecting member, titanium dioxide filled in 0.1 to 90 wt%, preferably 10 to 60 wt% can be used.
The resin portions 10 and 10B have a light reflectance of 70% or more at 350 nm to 800 nm, and particularly preferably a light reflectance of 420 nm to 520 nm is 80% or more. Further, it is preferable that the light emitting region of the light emitting element 50 and the light emitting region of the fluorescent material (when used) have high reflectance.

(Lead frame)
The lead frames 20 and 22 are formed using a good electrical conductor such as iron, phosphor bronze, or copper alloy, for example. If necessary, metal plating such as silver, aluminum, copper and gold can be applied for the purpose of improving the reflectivity, for example.

(Wire)
The wires 40 and 42 may be various materials such as metal having electrical conductivity. Preferably, it is made of gold, copper, aluminum, gold alloy, silver alloy or the like.

(Encapsulant)
The recess 12 of the resin part 10 of the light emitting devices 100 and 100A is preferably filled with a sealing material. In the light emitting device 100B, a sealing member 18 (see FIG. 9) made of a sealing material may be disposed on the upper surface 14B of the resin portion 10B where the light emitting element 50 is disposed so as to surround the light emitting element 50.
The material of the sealing material is a thermosetting resin. Among thermosetting resins, it is preferably formed of at least one selected from the group consisting of epoxy resins, modified epoxy resins, silicone resins, modified silicone resins, acrylate resins, and urethane resins, particularly epoxy resins and modified epoxy resins. Silicone resins and modified silicone resins are preferred. The sealing member is preferably a hard member in order to protect the light emitting element. Moreover, it is preferable to use resin excellent in heat resistance, a weather resistance, and light resistance for a sealing member. The sealing material may be mixed with at least one selected from the group consisting of a filler, a diffusing agent, a pigment, a fluorescent material, and a reflective material in order to have a predetermined function. The sealing material may contain a diffusing agent. As a specific diffusing agent, barium titanate, titanium oxide, aluminum oxide, silicon oxide, or the like can be suitably used. Moreover, an organic or inorganic coloring dye or coloring pigment can be contained for the purpose of cutting an undesired wavelength. Further, the sealing material may contain a fluorescent material that absorbs light from the light emitting element and converts the wavelength.

(Fluorescent substance)
The fluorescent substance may be any substance that absorbs light from the light emitting element and converts the wavelength into light of a different wavelength. For example, nitride phosphors / oxynitride phosphors / sialon phosphors mainly activated by lanthanoid elements such as Eu and Ce, lanthanoid elements such as Eu, and transition metal elements such as Mn. Alkaline earth halogen apatite phosphor, alkaline earth metal borate phosphor, alkaline earth metal aluminate phosphor, alkaline earth silicate, alkaline earth sulfide, alkaline earth thiogallate Organic earth mainly activated by lanthanoid elements such as alkaline earth silicon nitride, germanate or rare earth aluminate, rare earth silicate or Eu mainly activated by lanthanoid elements such as Ce and It is preferably at least one selected from organic complexes and the like. As specific examples, the following phosphors can be used, but are not limited thereto.

Nitride-based phosphors mainly activated with lanthanoid elements such as Eu and Ce are M ₂ Si ₅ N ₈ : Eu, MAlSiN ₃ : Eu (M is selected from Sr, Ca, Ba, Mg, Zn) At least one or more). In addition to M ₂ Si ₅ N ₈ : Eu, MSi ₇ N 10: Eu, M _1.8 Si ₅ O _0.2 N ₈ : Eu, M _0.9 Si ₇ O _0.1 N ₁₀ : Eu (M is , Sr, Ca, Ba, Mg, and Zn.).

An oxynitride phosphor mainly activated by a lanthanoid element such as Eu or Ce is MSi ₂ O ₂ N ₂ : Eu (M is at least one selected from Sr, Ca, Ba, Mg, Zn) Etc.).

Eu, sialon phosphors activated mainly with lanthanoid elements such as Ce _{is, M p / 2 Si 12-} p-q Al p + q O q N 16-p: Ce, M-Al-Si-O-N (M is at least one selected from Sr, Ca, Ba, Mg, and Zn. Q is 0 to 2.5, and p is 1.5 to 3).

Alkaline earth halogen apatite phosphors mainly activated by lanthanoid compounds such as Eu and transition metal elements such as Mn include M ₅ (PO _{4) 3} X: R (M is Sr, Ca, Ba). X is at least one selected from F, Cl, Br and I. R is any one of Eu, Mn, Eu and Mn. Etc.).

The alkaline earth metal borate phosphor has M ₂ B ₅ O ₉ X: R (M is at least one selected from Sr, Ca, Ba, Mg, Zn. X is F, Cl , Br, or I. R is Eu, Mn, or any one of Eu and Mn.).

Alkaline earth metal aluminate phosphors include SrAl ₂ O ₄ : R, Sr ₄ Al ₁₄ O ₂₅ : R, CaAl ₂ O ₄ : R, BaMg ₂ Al ₁₆ O ₂₇ : R, BaMg ₂ Al ₁₆ O ₁₂ : R, BaMgAl ₁₀ O ₁₇ : R (R is Eu, Mn, or any one of Eu and Mn).

Examples of the alkaline earth sulfide phosphor include La ₂ O ₂ S: Eu, Y ₂ O ₂ S: Eu, and Gd ₂ O ₂ S: Eu.

Rare earth aluminate phosphors mainly activated by lanthanoid elements such as Ce include Y ₃ Al ₅ O ₁₂ : Ce, (Y _0.8 Gd _0.2 ) ₃ A ₁₅ O ₁₂ : Ce, Y ₃ There are YAG phosphors represented by the composition formula of (Al _0.8 Ga _0.2 ) ₅ O ₁₂ : Ce, (Y, Gd) ₃ (Al, Ga) ₅ O ₁₂ : Ce. Further, there are Tb ₃ Al ₅ O ₁₂ : Ce, Lu ₃ Al ₅ O ₁₂ : Ce, etc. in which a part or all of Y is substituted with Tb, Lu or the like.

Other phosphors include ZnS: Eu, Zn ₂ GeO ₄ : Mn, MGa ₂ S ₄ : Eu (M
Is at least one selected from Sr, Ca, Ba, Mg and Zn. )and so on.

These phosphors can be used alone or in combination of two or more to achieve colors such as blue, green, yellow, and red, as well as their intermediate colors such as blue-green, yellow-green, and orange. it can.

(11) Manufacturing Method A manufacturing method of the light emitting device 100 will be described below.
FIG. 10A is a process schematic diagram showing a first manufacturing method of the light emitting device 100 according to the present invention, and FIG. 10B shows a second manufacturing method of the light emitting device 100 according to the present invention. It is process schematic.
First, the first manufacturing method will be described with reference to FIG.

S1: Processing of lead frame Based on the above-mentioned “(4) Manufacturing method of lead frame 20 and lead frame 22”, the lead frame 20 and, if necessary, the lead frame 22 are formed by etching.

S2: Resin Molding Next, the lead frames 20 and 22 obtained in the above-described S1 step are placed in the cavity of the mold, and the resin 30 is poured into the package 30 by the transfer molding method. For example, it is preferable to use a separable mold composed of an upper mold and a lower mold for improving workability.
By bringing the upper surfaces of the convex portions 20a, 20b, and 22a into contact with the portion of the mold that forms the concave portion 12 of the resin portion 10 (at least a flat surface larger than the convex portion 20a (mounting portion)), The upper surfaces of the convex portions 20a, 20b, and 22a can be made the same plane, and the upper surfaces of the convex portions 20a, 20b, and 22a can be exposed from the resin portion.
In this resin molding step, the resin (resin that forms the resin portion 10) poured around the convex portions 20a, 20b, and 22a surrounds the convex portions 20a, 20b, and 22a (the upper surfaces of the convex portions 20a, 20b, and 22a). The surrounding area is excluded.

S3: Deburring If necessary, for example, burrs generated in the package 30 such as resin covering the upper surfaces of the protrusions 20a, 20b, and 22a, or electrolytic solution method (such as alkali), or a combination thereof To remove.

S4: Lead frame plating treatment For example, the lead frame 20 and / or the lead frame 22 are plated as necessary, for example, to improve reflectivity.
In particular, as in the embodiment shown in FIG. 7, the plating process is a preferable process in order to project the protrusions 20 a, 20 b, and 22 b from the surface of the resin part 10 on the bottom surface 14 of the recess 12.
In particular, in this manufacturing method, since the resin molding is performed in step S2, the upper surface of the convex portions 20a, 20b, and 22b and the bottom surface 14 of the resin portion 10 are made flush with each other, and then the main plating process is performed. The convex portions 20 a, 20 b, and 22 b can be protruded from the surface of the resin portion 10 at the bottom surface 14.
As a preferable plating method, electrolytic plating or electroless plating can be used. By forming by electrolytic plating, a metal layer can be selectively formed only on the convex portions 20a, 20b, and 22a exposed from the resin portion 10.

S5: Mounting of Light Emitting Element Next, the light emitting element 50 is mounted on the upper surface of the convex portion 20a. It is preferable to perform eutectic bonding using an Au—Sn alloy. Alternatively, the light emitting element 50 may be fixed using a resin paste, a silicon paste, or a silver paste.
After fixing the light emitting element 50, the light emitting element 50, the lead frame 20, and the lead frame 22 are electrically connected by wire bonding using the wires 40 and 42.

S6: Sealing If necessary, the above-described sealing material is inserted into the recess 12 and cured to be sealed.
Thereby, the light emitting device 100 can be obtained.

Next, the second manufacturing method will be described with reference to FIG.
In the first manufacturing method, processing was performed in the order of S2: resin molding → S3: deburring → S4: lead frame plating processing, but in the second manufacturing method supplement, S2A: lead frame → S3A: resin Processing is performed in the order of molding → S4A: deburring. Although the order of the steps is different, the contents of each step are substantially the same.

  By changing the order in this way, the lead frame 20 and / or the lead frame 22 is plated and then resin molding is performed. Therefore, the upper surfaces of the plated protrusions 20a, 20b, and 22a It can be easily flush with the bottom surface 14.

  That is, the reflectance is improved by applying to the lead frame 20 and / or the lead frame 22, and the top surface and the bottom surface 14 of the convex portions 20a, 20b, and 22a are in the same plane as in the embodiment shown in FIG. The light emitting device 100 can be easily obtained.

The light emitting devices 100A, 100B, 100C, 100D, and 100E can be manufactured by the same method.
More specifically, regarding the light emitting device 100A, the number of lead frames and the number of light emitting elements increases, and in addition to the light emitting element 50 in S5: light emitting element mounting step, a Zener diode 55 or the like is added as necessary. It can be manufactured by mounting the element.
On the other hand, the light emitting device 100B does not shape the concave portion in the resin portion 10B in the resin molding process, and seals with the sealing material instead of inserting the sealing material into the concave portion in the sealing step performed as necessary. It can be manufactured by forming the stop member 18.
The light emitting devices 100C and 100D can be manufactured by obtaining the shape of the convex portion 20a having a desired shape by etching as described above.
The manufacturing apparatus 100E can be manufactured by using a light emitting element having a face-down structure as the light emitting element 50.

10, 10B Resin part 12 Recess (cavity)
14, 14B Bottom surface 16 Side surface 20, 22 Lead frame 20a, 20b, 20c, 22a, 22b Convex part 21a, 21b, 21c Plating layer 25a, 25b, 25c Clearance (concave part)
27a, 27b Notch (dent)
30, 30A package 40, 42 wire 50 light emitting element 60 base material for lead frame production 100, 100A, 100B, 100C, 100D light emitting device

Claims (6)

A package including a resin portion including a resin and a lead frame disposed inside the resin portion;
A light emitting element disposed on an element mounting surface of the package;
Include, in the device mounting surface, the lead frame is exposed from the resin portion has a mounting portion and the wire connecting portion, fabrication of the light emitting device light emitting element is mounted on the placing portion A method,
In the single lead frame, a first convex portion having the mounting portion as an upper surface is formed by etching the periphery of the mounting portion, and the wire connecting portion is etched by etching the periphery of the wire connecting portion. Forming a second convex portion with the upper surface of
Disposing a resin between the first convex portion and the second convex portion, and forming the surface of the resin portion that forms the element placement surface together with the placement portion and the wire connection portion;
Connecting a wire electrically connected to the light emitting element to the wire connecting portion;
Manufacturing method. The method further includes a molding step of disposing the lead frame in a cavity of a mold and injecting resin into the cavity to produce the resin portion.
In the molding step, the flat surface of the mold larger than the mounting portion is brought into contact with the mounting portion, and a resin is injected into the cavity. the process according to claim 1, flush with the surface of the resin portion. The manufacturing method according to claim 2 , further comprising: plating the mounting portion after the forming step, and projecting the first convex portion from the surface of the resin portion on the element mounting surface. The resin portion, the manufacturing method according to claim 1 or 2, wherein the element mounting surface further comprises a recess comprising a bottom surface. By the etching, each of which forms a plurality of the first protrusions having the mounting section further comprises placing the one light emitting element over the placing portion of the first convex portion of the plurality of billing Item 5. The production method according to any one of Items 1 to 4 . By the etching method according to any one of claims 1 to 5 including the shape of the mounting section of the first convex portion further be circular.

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