JP6888709B2 - Manufacturing method of light emitting device and light emitting device - Google Patents

Description

The present invention relates to a light emitting device used for a lighting fixture, a display, a backlight of a mobile phone, an auxiliary light source for moving image lighting, and other general consumer light sources, and a method for manufacturing the light emitting device.

A light emitting device using a light emitting element is compact, has good power efficiency, and emits bright colors. Further, since this light emitting element is a semiconductor element, there is no need to worry about running out of balls. Furthermore, it has excellent initial drive characteristics and is resistant to vibration and repeated on / off lighting. Since it has such excellent characteristics, a light emitting device using a light emitting element such as a light emitting diode (LED) or a laser diode (LD) is used as various light sources.

FIG. 14 is a perspective view showing a method of manufacturing a conventional light emitting device. FIG. 15 is a perspective view showing an intermediate of a conventional light emitting device. FIG. 16 is a perspective view showing a conventional light emitting device.

Conventionally, as a method of manufacturing a light emitting device, a lead frame is insert-molded with a non-transmissive and light-reflecting white resin, and a resin molded body having concave cups at predetermined intervals is molded via the lead frame. (See, for example, Patent Document 1). Although the material of the white resin is not specified here, a general thermoplastic resin is used from insert molding and drawings. As a general thermoplastic resin, for example, a thermoplastic resin such as a liquid crystal polymer, PPS (polyphenylene sulfide), or nylon is often used as a light-shielding resin molded product (see, for example, Patent Document 2).

However, the thermoplastic resin has poor adhesion to the lead frame, and the resin portion and the lead frame are likely to peel off. Further, since the thermosetting resin has low fluidity of the resin, it is not suitable for molding a resin molded product having a complicated shape, and has poor light resistance. In particular, the output of light emitting elements has been remarkably improved in recent years, and as the output of light emitting elements has been increased, the photodegradation of packages made of thermoplastic resins has become remarkable.

In order to solve these problems, a light emitting device using a thermosetting resin as a material of the resin molded body is disclosed (see, for example, Patent Document 3). FIG. 17 is a perspective view and a cross-sectional view showing a conventional light emitting device. FIG. 18 is a schematic cross-sectional view showing a method of manufacturing a conventional light emitting device. In this light emitting device, metal wiring is formed from a metal foil by a known method such as punching or etching, then the metal wiring is arranged in a mold having a predetermined shape, and a thermosetting resin is injected from a resin injection port of the mold. However, transfer molding is disclosed.

However, with this manufacturing method, it is difficult to manufacture a large number of light emitting devices in a short time. Further, there is a problem that a large amount of resin in the runner portion is discarded for one light emitting device.

As a different light emitting device and a method for manufacturing the same, a package substrate for mounting an optical semiconductor device having a thermosetting resin composition layer for light reflection in the form of a wiring board and a method for manufacturing the same are disclosed (see, for example, Patent Document 4). FIG. 19 is a schematic view showing a manufacturing process of a conventional light emitting device. This package substrate for mounting an optical semiconductor element has a plurality of recesses, which is obtained by attaching a flat plate-shaped printed wiring board to a mold, injecting a thermosetting resin composition for light reflection, and heat-pressing molding with a transfer molding machine. , A matrix-shaped package substrate for mounting an optical semiconductor element is manufactured. It is also described that a lead frame is used instead of the printed wiring board.

However, these wiring boards and lead frames have a flat plate shape, and the thermosetting resin composition is arranged on the flat plate shape, and the contact area is small. Therefore, when dicing, the thermosetting resin and the lead frame or the like are used. There is a problem that the composition is easily peeled off.

Japanese Unexamined Patent Publication No. 2007-35794 (particularly [0033]) Japanese Unexamined Patent Publication No. 11-087780 Japanese Unexamined Patent Publication No. 2006-140207 (particularly, [0028]) Japanese Unexamined Patent Publication No. 2007-23508

In view of the above-mentioned problems, it is an object of the present invention to provide a simple and inexpensive method for manufacturing a large number of light emitting devices in a short time with high adhesion between the lead frame and the thermosetting resin composition. ..

Therefore, as a result of diligent studies, the present invention has been completed.

In the present specification, the terms reed, resin portion, and resin package are used for the light emitting device after being individualized, and the terms lead frame and resin molded body are used in the stage before being individualized.

The present invention is a method for manufacturing a light emitting device having a resin package having a light reflectance at a wavelength of 350 nm to 800 nm after thermosetting of 70% or more and a resin portion and a lead formed on substantially the same surface on the outer surface. Therefore, a light-reflecting substance is contained in the step of sandwiching the lead frame provided with the notched portion between the upper mold and the lower mold and the mold sandwiched between the upper mold and the lower mold. A method for manufacturing a light emitting device, which comprises a step of transferring and molding a thermosetting resin to form a resin molded body on a lead frame, and a step of cutting the resin molded body and the lead frame along a notch. Regarding. According to this configuration, since the notch is filled with the thermosetting resin, the contact area between the lead frame and the thermosetting resin is increased, and the adhesion between the lead frame and the thermosetting resin is improved. Can be done. Further, since a thermosetting resin having a viscosity lower than that of the thermoplastic resin is used, the notch portion can be filled with the thermosetting resin without leaving voids. In addition, a large number of light emitting devices can be obtained at one time, and the production efficiency can be significantly improved. Further, the number of runners to be discarded can be reduced, and an inexpensive light emitting device can be provided.

It is preferable that the lead frame is plated before being sandwiched between the upper mold and the lower mold. At this time, the cut surface of the manufactured light emitting device is not plated, and the other parts are plated. It is not necessary to perform plating treatment for each individualized light emitting device, and the manufacturing method can be simplified.

The lead frame preferably has a notch in the cut portion of about 1/2 or more of the total surrounding circumference. As a result, the weight of the lead frame can be reduced, and an inexpensive light emitting device can be provided. In addition, the number of cut portions in the lead frame is reduced, and peeling between the lead frame and the thermosetting resin can be further suppressed.

It should be noted that the notch portion is filled with the thermosetting resin, whereas the hole portion described later is not filled with the thermosetting resin. The notch and the hole penetrate the lead frame, whereas the groove described later does not penetrate the lead frame.

It is preferable that the lead frame before being sandwiched between the upper mold and the lower mold is provided with a hole. As a result, the weight of the lead frame can be reduced, and an inexpensive light emitting device can be provided. Since the holes can be plated, the exposure of the lead frame can be suppressed.

It is preferable that the lead frame before being sandwiched between the upper mold and the lower mold is provided with a groove. As a result, the weight of the lead frame can be reduced, and an inexpensive light emitting device can be provided. Since the grooves can be plated, the exposure of the lead frame can be suppressed.

It is preferable that the upper mold and the lower mold sandwich the lead frame in the portion where the light emitting element is placed or the portion in the vicinity of the hole portion. As a result, it is possible to prevent the lead frame from fluttering and reduce the occurrence of burrs.

The present invention is a light emitting device having a resin package having a light reflectance of 70% or more at a wavelength of 350 nm to 800 nm after thermosetting, and a resin portion and a lead formed on substantially the same surface on the outer surface. The reed relates to a light emitting device having a portion in which at least one of a bottom surface and an upper surface is plated and an outer surface is not plated. As a result, it is possible to prevent the reeds that have not been plated from being exposed, and it is possible to obtain a large number of light emitting devices at one time. Further, the efficiency of extracting light from the light emitting device can be improved by plating only the portion that reflects the light from the light emitting element.

The resin package preferably has leads exposed from the four corners. Since the exposed portion of the lead can be reduced as compared with the case where the lead is provided on the entire one side surface of the resin package, the adhesion between the resin portion and the lead can be improved. Further, since the insulating resin portion is provided between the leads having different positive and negative directions, a short circuit can be prevented.

It is preferable that the four corners of the resin package are formed in an arc shape when viewed from the bottom surface side. The arc-shaped portion is plated, and the cut surface may not be plated. As a result, the bonding area with solder or the like is expanded, and the bonding strength can be improved.

The lead is preferably provided with a step. This step is preferably provided on the bottom surface of the resin package. The portion where the step is formed is plated, and the cut surface may not be plated. As a result, the bonding area with solder or the like is expanded, and the bonding strength can be improved.

The present invention is a method for producing a resin package in which the light reflectance at a wavelength of 350 nm to 800 nm after thermosetting is 70% or more, and the resin portion and the lead are formed on substantially the same surface on the outer surface. A process of sandwiching a lead frame provided with a notch between an upper mold and a lower mold, and a thermosetting substance containing a light-reflecting substance in the mold sandwiched between the upper mold and the lower mold. The present invention relates to a method for manufacturing a resin package, which comprises a step of transferring and molding a resin to form a resin molded body on a lead frame, and a step of cutting the resin molded body and the lead frame along a notch. According to this configuration, since the notch is filled with the thermosetting resin, the contact area between the lead frame and the thermosetting resin is increased, and the adhesion between the lead frame and the thermosetting resin is improved. Can be done. Further, since a thermosetting resin having a viscosity lower than that of the thermoplastic resin is used, the notch portion can be filled with the thermosetting resin without leaving voids. In addition, a large number of resin packages can be obtained at one time, and the production efficiency can be significantly improved. Further, the number of runners to be discarded can be reduced, and an inexpensive resin package can be provided.

It is preferable that the lead frame is plated before being sandwiched between the upper mold and the lower mold. At this time, the cut surface of the manufactured resin package is not plated, and the other parts are plated. It is not necessary to perform plating treatment for each individualized resin package, and the manufacturing method can be simplified.

The present invention is a resin package in which the light reflectance at a wavelength of 350 nm to 800 nm after thermosetting is 70% or more, and the resin portion and the lead are formed on substantially the same surface on the outer surface, and the lead is a bottom surface. The present invention relates to a resin package having a portion in which at least one of the upper surfaces is plated and the outer surface is not plated. As a result, it is possible to prevent the unplated leads from being exposed, and it is possible to obtain a large number of resin packages at one time. Further, the efficiency of extracting light from the light emitting device can be improved by plating only the portion that reflects the light from the light emitting element.

In the present invention, after thermosetting, the light reflectance at a wavelength of 350 nm to 800 nm is 70% or more, a plurality of recesses are formed, and the inner bottom surface of the recesses is resin molded with a part of the lead frame exposed. A method of manufacturing a body, in which a lead frame provided with a notch is used, and the lead frame is sandwiched between an upper mold and a lower mold having a convex portion at a position where adjacent concave portions are formed in a resin molded body. A thermosetting resin containing a light-reflecting substance is transferred and molded into a mold sandwiched between the upper mold and the lower mold, and the notch is filled with the thermosetting resin. The present invention relates to a method for producing a resin molded product, which comprises a step of forming a resin molded product on a lead frame. According to such a configuration, a large number of light emitting devices can be obtained at one time, and the production efficiency can be significantly improved.

In the present invention, after thermosetting, the light reflectance at a wavelength of 350 nm to 800 nm is 70% or more, a plurality of recesses are formed, and the inner bottom surface of the recesses is resin molded with a part of the lead frame exposed. In the body, the lead frame has a notch, and the notch is filled with a thermosetting resin to be a resin molded product, and a resin having a side wall between adjacent recesses. Regarding molded products. This makes it possible to provide a resin molded product having excellent heat resistance and light resistance.

According to the light emitting device according to the present invention and the manufacturing method thereof, it is possible to provide a light emitting device having high adhesion between the lead frame and the resin molded body. In addition, a large number of light emitting devices can be obtained in a short time, and the production efficiency can be significantly improved. Further, the number of runners to be discarded can be reduced, and an inexpensive light emitting device can be provided.

Hereinafter, a method for manufacturing a light emitting device according to the present invention and the best embodiment of the light emitting device will be described in detail together with drawings. However, the present invention is not limited to this embodiment.

<First Embodiment>
(Light emitting device)
The light emitting device according to the first embodiment will be described. FIG. 1 is a perspective view showing a light emitting device according to the first embodiment. FIG. 2 is a cross-sectional view showing a light emitting device according to the first embodiment. FIG. 2 is a cross-sectional view of II-II shown in FIG. FIG. 3 is a plan view showing a lead frame used in the first embodiment.

The light emitting device 100 according to the first embodiment has a light reflectance of 70% or more at a wavelength of 350 nm to 800 nm after heat curing, and the resin portion 25 and the lead 22 are formed on substantially the same surface on the outer surface 20b. Has a resin package 20 to be used. The lead 22 is plated on at least one of the bottom surface (outer bottom surface 20a of the resin package 20) and the upper surface (inner bottom surface 27a of the recess 27). On the other hand, the side surface of the lead 22 (outer surface 20b of the resin package 20) is not plated. On the outer surface 20b of the resin package 20, the resin portion 25 occupies a large area, and the leads 22 are exposed from the corners.

The resin package 20 is mainly composed of a resin portion 25 containing a light-reflecting substance 26 and a lead 22. The resin package 20 has an outer bottom surface 20a on which the leads 22 are arranged, an outer surface 20b on which a part of the leads 22 is exposed, and an outer upper surface 20c forming an opening recess 27. The resin package 20 is formed with a recess 27 having an inner bottom surface 27a and an inner side surface 27b. The lead 22 is exposed on the inner bottom surface 27a of the resin package 20, and the light emitting element 10 is placed on the lead 22. A sealing member 30 that covers the light emitting element 10 is arranged in the recess 27 of the resin package 20. The sealing member 30 contains a fluorescent substance 40. The light emitting element 10 is electrically connected to the lead 20 via the wire 50. Leads 20 are not arranged on the outer upper surface 20c of the resin package 20.

In the total surrounding length of the outer surface 20b of the resin package 20, the portion where the lead 22 is exposed is shorter than 1/2. In the method of manufacturing a light emitting device described later, the lead frame 21 is provided with a notch 21a and cuts along the notch 21a, so that the cut portion of the lead frame 21 is exposed from the resin package 20.

The leads 22 of the resin package 20 are exposed from the four corners. The lead 22 is exposed on the outer surface 20b and is not plated. Further, the lead 22 can adopt a structure that is also exposed on the outer bottom surface 20a, and can be plated. It is possible to plate the outer surface 20b of the lead 22 after it is separated into pieces.

The light emitting device 100 has a light reflectance of 70% or more at a wavelength of 350 nm to 800 nm after thermosetting. This mainly indicates that the light reflectance in the visible light region is high. The light emitting element 10 preferably has a light emitting peak wavelength of 360 nm to 520 nm, but those having a light emitting peak wavelength of 350 nm to 800 nm can also be used. In particular, the light emitting element 10 preferably has an emission peak wavelength in a short wavelength region of visible light of 420 nm to 480 nm. The resin package 20 has excellent light resistance to light on the short wavelength side of 480 nm or less and is not easily deteriorated. Further, the resin package 20 is not easily deteriorated even if the light emitting element 10 generates heat by applying an electric current, and has excellent heat resistance.

It is preferable to use the resin package 20 in which a translucent thermosetting resin is highly filled with a light-reflecting substance. For example, it is preferable to use a thermosetting resin having a light transmittance of 80% or more at 350 nm to 800 nm, and a thermosetting resin having a light transmittance of 90% or more is particularly preferable. This is because deterioration of the resin package 20 can be suppressed by reducing the light absorbed by the thermosetting resin. The light-reflecting substance 26 preferably reflects 90% or more of the light from the light emitting element 10, and particularly preferably 95% or more of the light. Further, the light-reflecting substance 26 preferably reflects 90% or more of the light from the fluorescent substance 40, and particularly preferably 95% or more. By reducing the amount of light absorbed by the light-reflecting substance 26, the efficiency of extracting light from the light emitting device 100 can be improved.

The shape of the light emitting device 100 is not particularly limited, but may be a polygonal shape such as a substantially rectangular parallelepiped, a substantially cubic shape, or a substantially hexagonal column. The recess 27 is preferably widened in the opening direction, but may be tubular. The shape of the recess 27 can be a substantially circular shape, a substantially elliptical shape, a substantially polygonal shape, or the like.

Hereinafter, each member will be described in detail.
(Light emitting element)
As the light emitting element, those in which semiconductors such as GaAlN, ZnS, SnSe, SiC, GaP, GaAlAs, AlN, InN, AlInGaP, InGaN, GaN, and AlInGaN are formed as a light emitting layer on a substrate are preferably used. Not limited. The emission peak wavelength is preferably 360 nm to 520 nm, but 350 nm to 800 nm can also be used. In particular, the light emitting element 10 preferably has an emission peak wavelength in a short wavelength region of visible light of 420 nm to 480 nm.

As the light emitting element, one having a face-up structure can be used, and one having a face-down structure can also be used. The size of the light emitting element is not particularly limited, and □ 350 μm, □ 500 μm, □ 1 mm and the like can also be used. Further, a plurality of light emitting elements can be used, and all of them may be of the same type, or may be of different types showing red, green, and blue emission colors which are the three primary colors of light.
(Resin package)
The resin package has a resin portion made of a thermosetting resin and a lead, and is integrally molded. The resin package has a light reflectance of 70% or more at 350 nm to 800 nm, and a light reflectance of 80% or more at 420 nm to 520 nm is particularly preferable. Further, it is preferable that the light emitting region of the light emitting element and the light emitting region of the fluorescent substance have high reflectance.

The resin package has an outer bottom surface, an outer surface, and an outer upper surface. The reed is exposed from the outer surface of the resin package. The resin portion and the lead are formed on substantially the same surface. This substantially identical surface means that they were formed in the same cutting process.

The outer shape of the resin package is not limited to a substantially rectangular parallelepiped, and may be a substantially cube, a substantially hexagonal column, or another polygonal shape. Further, when viewed from the outer upper surface side, shapes such as a substantially triangular shape, a substantially quadrangle, a substantially pentagonal shape, and a substantially hexagonal shape can be adopted.

The resin package forms a recess having an inner bottom surface and an inner side surface. Leads are arranged on the inner bottom surface of the recess. The recess can take various shapes such as a substantially circular shape, a substantially elliptical shape, a substantially quadrangular shape, a substantially polygonal shape, and a combination thereof when viewed from the outer upper surface side. The recess is preferably shaped to expand in the opening direction, but may be tubular. The concave portion may be provided with a smooth slope, but the concave portion may be provided with fine irregularities on the surface to scatter light.

The leads are provided at predetermined intervals so as to form a pair of positive and negative. The leads on the inner surface of the recess and the leads on the outer bottom surface of the resin package are plated. Although this plating treatment can be performed before cutting out the resin molded product, it is preferable to use a lead frame that has been previously plated. On the other hand, the side surface of the reed is not plated.
(Resin part, resin molded body)
It is preferable to use a triazine derivative epoxy resin which is a thermosetting resin as the material of the resin part and the resin molded body. Further, the thermosetting resin can contain an acid anhydride, an antioxidant, a mold release material, a light reflecting member, an inorganic filler, a curing catalyst, a light stabilizer, and a lubricant. The light reflecting member uses titanium dioxide and is filled with 10 to 60 wt%.

The resin package is not limited to the above-mentioned form, and is formed of at least one selected from the group consisting of epoxy resin, modified epoxy resin, silicone resin, modified silicone resin, acrylate resin, and urethane resin among thermosetting resins. Is preferable. In particular, epoxy resin, modified epoxy resin, silicone resin, and modified silicone resin are preferable. For example, an epoxy resin consisting of triglycidyl isocyanurate, hydrided bisphenol A diglycidyl ether, etc., and an acid anhydride consisting of hexahydrophthalic anhydride, 3-methylhexahydrophthalic anhydride, 4-methylhexahydrophthalic anhydride, etc. To 100 parts by weight of a colorless and transparent mixture prepared by dissolving and mixing the epoxy resin in an equivalent amount, 0.5 part by weight of DBU (1,8-Diazabicyclo (5,4,0) undecene-7) as a curing accelerator. As a co-catalyst, a solid epoxy resin composition obtained by adding 1 part by weight of ethylene glycol, 10 parts by weight of a titanium oxide pigment, and 50 parts by weight of glass fiber and partially curing the reaction by heating to form a B stage can be used. it can.
(Lead, lead frame)
A flat metal plate can be used for the lead frame, but a metal plate having steps or irregularities can also be used.

The lead frame is a flat metal plate that has been punched or etched. The etched lead frame has irregularities in the cross-sectional shape, and the adhesion to the resin molded body can be improved. In particular, when a thin lead frame is used, a step or uneven shape is formed in order to improve the adhesion between the lead frame and the resin molded body in the punching process, but the step or uneven shape becomes smaller, so that the effect of improving the adhesion is improved. Is small. However, in the etching process, it is possible to form an uneven shape on the entire cross section (etched portion) of the lead frame, so that the joint area between the lead frame and the resin molded body can be increased, and a resin package with better adhesion can be obtained. Can be molded.

On the other hand, in the processing method of punching a flat metal plate, the cost required for replacement parts becomes high due to the wear of the die due to the punching, and the manufacturing cost of the lead frame becomes high. On the other hand, in the etching process, when the punching die is not used and the number of packages taken per frame is large, the lead frame manufacturing cost per package can be reduced.

In addition to being formed so as to penetrate the lead frame, the etching process may be performed from only one side to the extent that it does not penetrate.

The cutout portion is formed so that the leads form a positive / negative pair when the resin molded body is individually separated into a resin package. Further, the notch portion is formed so as to reduce the area for cutting the reed when cutting the resin molded body. For example, a notch portion is provided in the lateral direction so as to form a pair of positive and negative leads, and a notch portion is provided at a position corresponding to the cutout portion when the resin molded product is individualized. However, a part of the lead frame is connected so that a part of the lead frame does not fall off or the lead is exposed on the outer surface of the resin package. Since the resin molded product is diced using a dicing saw, it is preferable that the notch portion is formed vertically and horizontally or diagonally linearly.

The lead frame is formed by using a good electric conductor such as iron, phosphor bronze, or a copper alloy. Further, in order to increase the reflectance of light from the light emitting element, metal plating such as silver, aluminum, copper and gold can be applied. It is preferable to apply metal plating before sandwiching between the upper mold and the lower mold, such as after providing the notch or etching, but before the lead frame is integrally molded with the thermosetting resin. It can also be metal plated.
(Sealing member)
The material of the sealing member is a thermosetting resin. Among the thermosetting resins, it is preferably formed by at least one selected from the group consisting of epoxy resin, modified epoxy resin, silicone resin, modified silicone resin, acrylate resin, and urethane resin, and particularly epoxy resin and modified epoxy resin. , Silicone resin, modified silicone resin are preferable. The sealing member is preferably a hard one in order to protect the light emitting element. Further, it is preferable to use a resin having excellent heat resistance, weather resistance, and light resistance as the sealing member. The sealing member may be mixed with at least one selected from the group consisting of fillers, diffusing agents, pigments, fluorescent substances and reflective substances in order to have a predetermined function. A diffusing agent may be contained in the sealing member. As a specific diffusing agent, barium titanate, titanium oxide, aluminum oxide, silicon oxide and the like can be preferably used. Further, an organic or inorganic coloring dye or coloring pigment can be contained for the purpose of cutting an undesired wavelength. Further, the sealing member can also contain a fluorescent substance that absorbs light from the light emitting element and converts the wavelength.
(Fluorescent substance)
The fluorescent substance may be any substance that absorbs the light from the light emitting element and converts the wavelength into light having a different wavelength. For example, nitride-based phosphors, oxynitride-based phosphors, sialone-based phosphors, which are mainly activated by lanthanoid-based elements such as Eu and Ce, lanthanoid-based elements such as Eu, and transition metal-based elements such as Mn. Alkaline earth halogen apatite phosphor, alkaline earth metal borate halogen phosphor, alkaline earth metal aluminate phosphor, alkaline earth silicate, alkaline earth sulfide, alkaline earth thiogallate , Alkaline earth Silicon nitride, germanate, or organic and mainly activated by lanthanoid elements such as Ce and other lanthanoid elements such as rare earth aluminate, rare earth silicate or Eu. It is preferably at least one or more selected from organic complexes and the like. As a specific example, the following phosphors can be used, but the present invention is not limited thereto.

Nitride-based phosphors mainly activated by lanthanoid elements such as Eu and Ce are selected from M ₂ Si ₅ N ₈ : Eu and MalSiN ₃ : Eu (M is selected from Sr, Ca, Ba, Mg and Zn). At least one kind or more.) And so on. In addition to M ₂ Si ₅ N ₈ : Eu _{, M Si 7} N ₁₀ : Eu, M _1.8 Si ₅ O _0.2 N ₈ : Eu, M _0.9 Si ₇ O _0.1 N ₁₀ : Eu (M) Is at least one selected from Sr, Ca, Ba, Mg, Zn.) And the like.

The oxynitride phosphors mainly activated by lanthanoid elements such as Eu and Ce are MSi ₂ O ₂ N ₂ : Eu (M is at least one selected from Sr, Ca, Ba, Mg and Zn). There are.) And so on.

The sialone-based phosphors mainly activated by lanthanoid-based elements such as Eu and Ce are M _{p / 2} Si _12-p-q Al _{p + q} O _q N _16-p : Ce, M-Al-Si-ON. (M is at least one selected from Sr, Ca, Ba, Mg, and Zn. Q is 0 to 2.5, and p is 1.5 to 3.).

For alkaline earth halogen apatite phosphors that are mainly activated by lanthanoid-based elements such as Eu and transition metal-based elements such as Mn, M ₅ (PO ₄ ) ₃ X: R (M is Sr, Ca, Ba). , Mg, Zn at least one selected. X is at least one selected from F, Cl, Br, I. R is any one or more of Eu, Mn, Eu and Mn. There are.) And so on.

The alkaline earth metal halide halogen phosphor _{is at least one selected from M 2} B ₅ O ₉ X: R (M is Sr, Ca, Ba, Mg, Zn. X is F, Cl. , Br, and at least one selected from I. R is any one or more of Eu, Mn, Eu and Mn) and the like.

Alkaline earth metal aluminate aluminate phosphors include SrAl ₂ O ₄ : R, Sr ₄ Al ₁₄ O ₂₅ : R, CaAl ₂ O ₄ : R, BaMg ₂ Al ₁₆ O ₂₇ : R, BaMg ₂ Al ₁₆ O ₁₂ : R, BaMgAl ₁₀ O ₁₇ : R (R is any one or more of Eu, Mn, Eu and Mn) and the like.

Alkaline earth sulfide phosphors include La ₂ O ₂ S: Eu, Y ₂ O ₂ S: Eu, Gd ₂ O ₂ S: Eu and the like.

Rare earth aluminate phosphors that are mainly activated by lanthanoid elements such as Ce include Y ₃ Al ₅ O ₁₂ : Ce, (Y _0.8 Gd _0.2 ) ₃ Al ₅ O ₁₂ : Ce, Y ₃ (Al _0.8 Ga _0.2 ) ₅ O ₁₂ : Ce, (Y, Gd) ₃ (Al, Ga) ₅ O ₁₂ : YAG-based phosphor represented by the composition formula of Ce. _{Further, there are also Tb 3} Al ₅ O ₁₂ : Ce and Lu ₃ Al ₅ O ₁₂ : Ce in which part or all of Y is replaced with Tb, Lu or the like.

Other phosphors include ZnS: Eu, Zn ₂ GeO ₄ : Mn, Mga ₂ S ₄ : Eu (M is at least one selected from Sr, Ca, Ba, Mg, Zn) and the like. is there.

These phosphors can be used alone or in combination of two or more to realize colors such as blue, green, yellow, and red, as well as intermediate colors such as blue-green, yellow-green, and orange. it can.

(Other)
The light emitting device may be further provided with a Zener diode as a protective element. The Zener diode can be placed on the lead on the inner bottom surface of the recess apart from the light emitting element. Further, the Zener diode may be mounted on the lead on the inner bottom surface of the recess, and the light emitting element may be mounted on the lead. In addition to □ 280 μm size, □ 300 μm size and the like can also be used.
(Manufacturing method of light emitting device according to the first embodiment)
A method of manufacturing a light emitting device according to the first embodiment will be described. FIG. 4 is a schematic cross-sectional view showing a method of manufacturing the light emitting device according to the first embodiment. FIG. 5 is a plan view showing the resin molded product according to the first embodiment.

The method for manufacturing the light emitting device according to the first embodiment includes a step of sandwiching the lead frame 21 provided with the notch 21a between the upper mold 61 and the lower mold 62, and the upper mold 61 and the lower mold 62. A step of transferring and molding a thermosetting resin 23 containing a light-reflecting substance 26 into a mold 60 sandwiched between the two to form a resin molded body 24 on a lead frame 21 and a notch 21a. It has a step of cutting the resin molded body 24 and the lead frame 21 along the above.

First, a mold 60 including an upper mold 61 and a lower mold 62 used for the transfer mold will be described.

The upper mold 61 includes a main body portion of a flat plate constituting the upper portion of the upper mold, an outer wall portion formed in a frame shape from an end portion of the main body portion, a plurality of projecting portions protruding from the main body portion, and an outer wall portion. It has an injection port that penetrates a part in the horizontal direction.

The outer wall portion protrudes vertically from the end portion of the main body portion, and the first outer wall portion and the first outer wall portion for molding the first outer surface, the second outer surface, the third outer surface, and the fourth outer surface of the resin molded body, respectively. (Ii) It is provided with an outer wall portion, a third outer wall portion, and a fourth outer wall portion. That is, the outer wall portion is a portion for molding the outer shell of the resin molded body, and is formed in a rectangular shape in a plan view. The shape of the outer wall portion may be appropriately formed according to the desired shape of the resin molded body.

The protruding portion is a portion that comes into contact with the lead frame 21 during transfer molding, and by preventing the thermosetting resin 23 from flowing into the contact portion, a part of the lead frame 21 is formed from the resin molded body 24. An exposed portion that is exposed can be formed. The protruding portion protrudes downward from the main body portion and is formed so as to be surrounded by an outer wall. The protruding portion has a flat portion in contact with the lead frame 21. In order to efficiently form recesses around the area of the upper surface of the resin molded body 24, protrusions are formed in one direction and at equal intervals, and in each protrusion, protrusions are formed in the 90 ° direction and at equal intervals from the one direction. It is preferably formed.

The injection port is for injecting the thermosetting resin 23, and is formed so as to penetrate in the horizontal direction at the substantially central lower end of the outer wall portion. The injection port has a semicircular cross section, and is formed so that the width becomes narrower from the inlet portion to the outlet portion of the injection port.

Further, although not particularly shown, a pin insertion hole penetrating the main body is formed in the upper part of the upper mold 61. The pin insertion hole is a hole for inserting a pin when the resin molded body 24 is removed from the upper mold 61.

The lower mold 62 is a plate material having a predetermined thickness, and the surface is formed flat. The lower mold 62 forms a space portion by bringing it into contact with the upper mold 61.

Next, each manufacturing process will be described.

The lead frame 21 is metal-plated after being provided with the cutout portion 21a.

First, the lead frame 21 provided with the cutout portion 21a is sandwiched between the upper mold 61 and the lower mold 62. A space is provided in the mold 60 by sandwiching it between the upper mold 61 and the lower mold 62.

At this time, the notch 21a at the position where the recess 27 is formed is arranged so as to be sandwiched between the protruding portion of the upper mold 61 and the lower mold 62. As a result, the fluttering of the lead frame 21 in the cutout portion 21a is suppressed, and the occurrence of burrs can be reduced.

Next, the thermosetting resin 23 containing the light-reflecting substance 26 is transfer-molded into the mold sandwiched between the upper mold 61 and the lower mold 62, and the lead frame 21 is made of a resin molded product. A thermosetting resin 23 containing a light-reflecting substance 26 is injected from an injection port into a space provided in a mold 60 forming 24, and a predetermined temperature and pressure are applied for transfer molding. .. Since the lead frame 21 near the notch 21a is sandwiched between the upper mold 61 and the lower mold 62, the lead frame 21 does not flutter when the thermosetting resin 23 is transferred and molded, and the recess 27 The generation of burrs can be suppressed on the inner bottom surface 27a.

A pin is inserted into the pin insertion portion to remove the resin molded body 24 from the upper mold 61. It is preferable that a predetermined temperature is applied in the mold 60 to perform temporary curing, and then the mold 60 is removed from the mold 60 and a temperature higher than the temporary curing is applied to perform main curing.

Next, the light emitting element 10 is placed on the lead frame 21 of the inner bottom surface 27a of the recess 27 formed in the resin molded body 24, and is electrically connected to the lead frame 21 by the wire 50. In the step of mounting the light emitting element 10, the resin molded body 24 can be mounted after being removed from the mold 60, and the light emitting element 10 is mounted on the resin package 20 obtained by cutting and fragmenting the resin molded body 24. You may. Further, the light emitting element may be mounted face-down without using a wire. After the light emitting element 10 is mounted on the lead frame 21, the sealing member 30 containing the fluorescent substance 40 is filled in the recess 27 and cured.

Next, the resin molded body 24 and the lead frame 21 are cut along the notch 21a.
The resin molded body 24 in which the plurality of recesses 27 are formed is cut in the longitudinal direction and the lateral direction so that the side wall between the adjacent recesses 27 is separated at substantially the center. The cutting method is dicing from the resin molded body 24 side using a dicing saw. As a result, the resin molded body 24 and the lead frame 21 are substantially the same surface as the cut surface, and the lead frame 21 is exposed from the resin molded body 24. By providing the cutout portion 21a in this way, the number of lead frames 21 to be cut is reduced, and peeling between the lead frame 21 and the resin molded body 24 can be suppressed. Further, not only the upper surface of the lead frame 21 but also the side surface corresponding to the cutout portion 21a is in close contact with the resin molded body 24, so that the adhesion strength between the lead frame 21 and the resin molded body 24 is improved.
<Second embodiment>
The light emitting device according to the second embodiment will be described. FIG. 6 is a perspective view showing a light emitting device according to the second embodiment. FIG. 7 is a plan view showing a lead frame used in the second embodiment. FIG. 8 is a plan view showing the resin molded product according to the second embodiment. The description may be omitted where a configuration substantially similar to that of the light emitting device according to the first embodiment is adopted.

In the light emitting device according to the second embodiment, the light emitting element 10 is placed in the recess provided in the resin package 120. The outer upper surface 120c of the resin package 120 has corners formed in an arc shape. Further, the side surface of the lead 122 is formed in an arc shape when viewed from the upper surface, and the lead 122 is provided with a step so as to slightly protrude from the resin portion 125 when viewed from the upper surface. The upper surface and outer bottom surface 120a of the protruding lead 122 and the arcuate curved surface portion are plated. On the other hand, the outer surface 120b portion of the lead 122 other than the arc shape is not plated. By widening the plated portion in this way, the bonding strength with a conductive member such as solder is increased.
(Manufacturing method of light emitting device according to the second embodiment)
In the method for manufacturing a light emitting device according to the second embodiment, the lead frame 121 is provided with a notch portion 121a and a hole portion 121b. The shape of the hole 121b is preferably circular, but a polygonal shape such as a quadrangular shape or a hexagonal shape, an elliptical shape, or the like can be adopted. The position of the hole 121b in the lead frame 121 is preferably an extension of the notch 121a and is preferably provided near a point where they intersect with each other. The size of the hole 121b is not particularly limited, but when it is used as an electrode and the bonding strength with the conductive member is increased, a wide mouth is preferable. In addition, the contact area with the conductive member can be expanded and the bonding strength can be increased.

A hole slightly larger than the shape of the hole 121b is provided so as to cover the vicinity of the hole 121b of the lead frame 121.

The lead frame 121 provided with the cutout portion 121a is sandwiched between the upper mold and the lower mold. At this time, the vicinity of the hole 121b is also sandwiched by the mold. As a result, the thermosetting resin does not flow into the hole 121b during the transfer mold, and it is not necessary to remove the thermosetting resin in the hole 121b.

A thermosetting resin containing a light-reflecting substance is transfer-molded in a mold sandwiched between an upper mold and a lower mold to form a resin molded body 124 on a lead frame 121.

The exposed portion of the lead frame 121 of the resin molded body 124 is plated. The inner bottom surface of the recess, the outer bottom surface 120a of the resin package 120, the circular inner surface of the lead frame 121, and the upper surface extending from the circular inner surface are plated.

The resin molded body 124 and the lead frame 121 are cut along the notch portion 121a.

By going through the above steps, the light emitting device according to the second embodiment can be provided. Since the hole 121b is provided on the extension line of the notch 121a, the cutting time can be shortened because the number of lead frames 121 to be cut can be reduced when dicing with a dicing saw. According to this manufacturing method, it is possible to provide a light emitting device having a large number of plated portions on the lead frame 121 in a simple and short time.

<Third embodiment>
The light emitting device according to the third embodiment will be described. FIG. 9 is a perspective view showing a light emitting device according to a third embodiment. FIG. 10 is a plan view showing a lead frame used in the third embodiment. The description may be omitted where a configuration substantially similar to that of the light emitting device according to the first embodiment is adopted.

The light emitting device according to the third embodiment has a light reflectance of 70% or more at a wavelength of 350 nm to 800 nm after heat curing, and the resin portion 225 and the lead 222 are formed on substantially the same surface on the outer surface 220b. It is a light emitting device having a resin package 220. The lead 222 has a bottom surface and an upper surface plated, and the outer surface has a non-plated portion. The lead 222 has a predetermined thickness, and a step is provided near the outer surface of the resin package 220. Plating is applied to the side surface side, which is one step deeper than this step, and the bottom surface side, which projects slightly outward. By providing the lead 222 with a step formed by plating in this way, the bonding area can be increased and the bonding strength with a conductive member such as solder can be improved. Further, since the thickness of the lead 222 of the portion to be cut using the dicing saw can be reduced, the cutting time can be shortened. Further, since dicing is performed from the outer upper surface side of the resin package 220 using a dicing saw, burrs extending toward the outer bottom surface are likely to occur on the cut surface of the lead 222. If the cut surface of the reed is the same surface as the outer bottom surface, the light emitting device may be tilted due to burrs when mounting the light emitting device. However, by providing a step on the cut surface of the lead, the burrs are formed on the outer bottom surface. The light emitting device does not tilt due to burrs.

In the lead 222 exposed from the resin package 220, the step is a first surface exposed on the outer bottom surface 220a of the resin package 220, a second surface formed substantially at a right angle upward from the outer bottom surface 220a, and a second surface. It is composed of a third surface formed substantially at right angles to the outer surface of the resin package 220 from the surface and a fourth surface exposed on the outer surface of the resin package 220. The first surface, the second surface and the third surface are plated, but the fourth surface is not plated. The second and third surfaces can be one curved surface. By making the second surface and the third surface curved, the solder can easily spread in the stepped portion.

The resin package 220 has a substantially square shape on the outer upper surface 220c and is covered with the resin portion 225. A substantially conical trapezoidal recess is provided on the 220c side of the outer upper surface of the resin package 220.
(Manufacturing method of light emitting device according to the third embodiment)
In the method for manufacturing a light emitting device according to the third embodiment, the lead frame 221 is provided with a groove 221c on a substantially straight line on the side corresponding to the outer bottom surface side of the light emitting device. The depth of the groove 221c is preferably about half the thickness of the lead frame 221 but may be about 1/4 to 4/5. The width of the groove 221c varies depending on the distance to the adjacent recesses, the size of the light emitting device, etc., but it is such that the light emitting device can be recognized as having a step when the center of the groove is cut. All you need is.

The lead frame 221 provided with the notch portion 221a is sandwiched between the upper mold and the lower mold. When the notch portion 221a is transferred and molded, it is sandwiched between the upper mold and the lower mold so as not to flutter.

A thermosetting resin containing a light-reflecting substance is transfer-molded in a mold sandwiched between an upper mold and a lower mold to form a resin molded body on a lead frame 221.

The exposed portion of the lead frame 221 of the resin molded product is plated. The inner bottom surface of the recess, the outer bottom surface 220a of the lead frame 221 and the groove 221c are plated. The plating process of the groove 221c corresponds to the first surface, the second surface, and the third surface of the step in the light emitting device.

The resin molded body and the lead frame are cut along the notch portion 221a. Further, the resin molded body is cut along the groove 221c.

By going through the above steps, the light emitting device according to the third embodiment can be provided. According to this manufacturing method, it is possible to provide a light emitting device having a large number of plated portions on the lead frame 121 in a simple and short time.

<Fourth Embodiment>
The light emitting device according to the fourth embodiment will be described. FIG. 11 is a perspective view showing a light emitting device according to a fourth embodiment. The description may be omitted where a configuration substantially similar to that of the light emitting device according to the first embodiment is adopted.

The light emitting device according to the fourth embodiment has a step recessed from the outer surface 320b only partially in the reed 322 of the outer surface 320b of the resin package 320. In the lead 322 exposed from the resin package 320, the step is a first surface provided on the outer bottom surface 320a of the resin package 320, a second surface formed substantially at a right angle upward from the outer bottom surface 320a, and a second surface. It is composed of a third surface formed at a substantially right angle from the surface toward the outer surface of the resin package 320, and a fourth surface of the outer surface of the resin package 320. The outer upper surface 320c of the resin package 320 is formed in a substantially rectangular shape composed of the resin portion 325. The outer bottom surface 320a, the first surface, the second surface and the third surface provided with steps, and the inner bottom surface of the recess are plated. On the other hand, the outer surface 320b having no step is not plated.

The lead 322 uses an etched lead frame. The etched leads 322 have irregularities on the cut surface of the resin molded product. This unevenness improves the adhesion between the resin portion and the lead.

By providing a step on a part of the lead 322, the bonding area with the conductive member at the time of mounting can be widened, and the bonding strength can be increased. Further, since the lead frame is provided with a recess, it is easy to cut and the time required for cutting can be shortened.
<Fifth Embodiment>
The light emitting device according to the fifth embodiment will be described. FIG. 12 is a perspective view showing a light emitting device according to a fifth embodiment. The description may be omitted where a configuration substantially similar to that of the light emitting device according to the first embodiment is adopted.

The light emitting device according to the fifth embodiment has a step recessed from the outer surface 420b only partially in the reed 422 of the outer surface 420b of the resin package 420. In the lead 422 exposed from the resin package 420, the step is a first surface provided on the outer bottom surface 420a of the resin package 420, a second surface formed substantially at a right angle upward from the outer bottom surface 420a, and a second surface. It is composed of a third surface formed substantially at right angles to the outer surface of the resin package 420 from the surface and a fourth surface of the outer surface of the resin package 420. The outer surface 420b of the resin package 420 has six leads 422 separated from each other. The leads 422 may be separated or connected. It is preferable that the lead 422 is provided with a notch rather than a flat plate shape because the bonding strength between the resin portion 425 and the lead 422 is higher. The outer upper surface 420c of the resin package 420 is formed in a substantially rectangular shape including the resin portion 425. The outer bottom surface 420a, the first surface, the stepped second surface, the third surface, and the inner bottom surface of the recess are plated. On the other hand, the outer surface 420b having no step is not plated.

By providing a step on a part of the lead 422, the bonding area with the conductive member can be widened, and the bonding strength can be increased. Further, since the lead frame is provided with a recess, it is easy to cut and the time required for cutting can be shortened.
<Sixth Embodiment>
The resin package according to the sixth embodiment will be described. FIG. 13 is a perspective view showing the resin package according to the sixth embodiment. The description may be omitted where the resin package according to the first embodiment and the resin package according to the fifth embodiment have substantially the same configurations.

The resin package according to the sixth embodiment has a step with a recessed corner in the lead 522 of the outer surface 520b of the resin package 520. This step has an arc shape when viewed from the outer bottom surface 520a side of the reed 522 exposed from the resin package 520. This arc shape is a circle divided into four parts. This arc shape is obtained by performing an etching process to about half the thickness so as not to penetrate the lead 522, and then dividing the arc into four parts. The arc-shaped portion is plated. The arc-shaped portion is plated and the outer bottom surface 520a is plated before being divided into four parts. On the other hand, the outer surface 520b having no step is not plated. The resin package 520 has a substantially square shape when viewed from the outer upper surface 520c, and the resin portion 525 is exposed.

By providing a step on a part of the lead 522, the bonding area with the conductive member can be widened, and the bonding strength can be increased. Further, even if burrs are generated on the stepped portion when the resin molded body is cut, it is above the outer bottom surface 520a, so that wobbling does not occur when joining the resin molded body. Further, since the lead frame is provided with a recess, it becomes easy to cut and the time required for cutting can be shortened.

The light emitting device according to the first embodiment will be described. The description may be omitted if it overlaps with the description in the first embodiment. FIG. 1 is a perspective view showing a light emitting device according to the first embodiment. FIG. 2 is a cross-sectional view showing a light emitting device according to the first embodiment. FIG. 2 is a cross-sectional view of II-II shown in FIG. FIG. 3 is a plan view showing a lead frame used in the first embodiment.

The light emitting device 100 includes a light emitting element 10, a resin package 20 in which a resin portion 25 containing a light reflecting substance 26 and a lead 22 are integrally molded. The light emitting device 10 is a nitride semiconductor light emitting device that has a light emitting peak wavelength of 450 nm and emits blue light. The resin package 20 has a substantially rectangular parallelepiped shape with a mortar-shaped recess 27. The size of the resin package 20 is 35 mm in length, 35 mm in width, and 0.8 mm in height, the outer upper surface 20c side of the recess 27 has a substantially diameter of 2.9 mm, and the inner bottom surface 27a has a substantially diameter of 2.6 mm and a depth of 2.6 mm. It is 0.6 mm. The thickness of the lead 22 is 0.2 mm. Titanium oxide is used as the light reflecting substance 26. An epoxy resin, which is a thermosetting resin, is used for the resin portion 25. Titanium oxide is contained in the epoxy resin in an amount of about 20% by weight. The resin package 20 has a light reflectance of 81% at a wavelength of 450 nm after thermosetting. On the outer surface 20b of the resin package 20, the resin portion 25 and the lead 22 are formed on substantially the same surface. The leads 22 are exposed from the four corners of the resin package 20. The lead 22 is plated on the outer bottom surface 20a of the resin package 20 and the inner bottom surface 27a of the recess 27. On the other hand, the lead 22 is not plated on the outer surface 20b of the resin package 20. The recess 27 is filled with a sealing member 30 containing a fluorescent substance 40 that emits yellow light. (Y, Gd) ₃ (Al, Ga) ₅ O ₁₂ : Ce is used as the fluorescent substance 40. Silicone resin is used as the sealing member 30.

This light emitting device is manufactured as follows.

The lead frame is provided with a notch 21a by etching. Although not shown, the cross section of the cutout portion 21a has irregularities. Ag is attached to the lead frame by electrolytic plating. A lead frame 21 provided with a notch 21a and plated is used.

Next, a lead frame 21 having a predetermined size is sandwiched between the upper mold 61 and the lower mold 62. The lead frame 21 has a flat plate shape, and is provided with a notch 21a according to the size of the light emitting device to be individualized. The cutout portion 21a is provided vertically and horizontally so that the four corners are exposed when the resin package 20 is individualized and the other corners are not exposed. Further, the notch portion 21a is provided in the lateral direction so as to be electrically insulated when the resin package 20 is separated into individual pieces, and the notch portion 21a is provided in the upper mold 61 and the lower mold 62. Is sandwiched.

A thermosetting resin 23 containing a light-reflecting substance 26 is transferred and molded into a mold 60 sandwiched between an upper mold 61 and a lower mold 62 to form a resin molded body 24 on a lead frame 21. To do. The thermosetting resin 23 containing the light-reflecting substance 26 is pelletized and poured into the mold 60 by applying heat and pressure. At this time, the notch portion 21a is also filled with the thermosetting resin 23. After the poured thermosetting resin 23 is temporarily cured, the upper mold 61 is removed, and further heat is applied to perform the main curing. As a result, the resin molded body 24 in which the lead frame 21 and the thermosetting resin 23 are integrally molded is manufactured.

Next, the light emitting element 10 is mounted on the lead 22 of the inner bottom surface 27a of the recess 27 by using a die bond member. After mounting the light emitting element 10, the light emitting element 10 and the lead 22 are electrically connected by using a wire 50. Next, the sealing member 30 containing the fluorescent substance 40 is filled in the recess 27.

Finally, the resin molded body 24 and the lead frame 21 are cut along the cutout portion 21a to be individualized so as to be individual light emitting devices 100. As a result, the lead 22 is not plated at the cut portion.

By going through the above steps, a large number of light emitting devices 100 can be manufactured at one time.

The present invention can be used for lighting equipment, displays, backlights for mobile phones, auxiliary light sources for moving images, and other general consumer light sources.

It is a perspective view which shows the light emitting device which concerns on 1st Embodiment. It is sectional drawing which shows the light emitting device which concerns on 1st Embodiment. It is a top view which shows the lead frame used in 1st Embodiment. It is schematic cross-sectional view which shows the manufacturing method of the light emitting device which concerns on 1st Embodiment. It is a top view which shows the resin molded body which concerns on 1st Embodiment. It is a perspective view which shows the light emitting device which concerns on 2nd Embodiment. It is a top view which shows the lead frame used in 2nd Embodiment. It is a top view which shows the resin molded body which concerns on 2nd Embodiment. It is a perspective view which shows the light emitting device which concerns on 3rd Embodiment. It is a top view which shows the lead frame used in 3rd Embodiment. It is a perspective view which shows the light emitting device which concerns on 4th Embodiment. It is a perspective view which shows the light emitting device which concerns on 5th Embodiment. It is a perspective view which shows the resin package which concerns on 6th Embodiment. It is a perspective view which shows the manufacturing method of the conventional light emitting device. It is a perspective view which shows the intermediate body of the conventional light emitting device. It is a perspective view which shows the conventional light emitting device. It is a perspective view and sectional view which shows the conventional light emitting device. It is the schematic sectional drawing which shows the manufacturing method of the conventional light emitting device. It is a schematic diagram which shows the manufacturing process of the conventional light emitting device.

10, 110 Light emitting elements 20, 120, 220, 320, 420, 520 Resin packages 20a, 120a, 220a, 320a, 420a, 520a Outer bottom surface 20b, 120b, 220b, 320b, 420b, 520b Outer side surface 20c, 120c, 220c, 320c, 420c, 520c Outer surface 21, 121, 221 Lead frame 21a, 121a, 221a Notch 121b Hole 221c Groove 22, 122, 222, 222, 422, 522 Lead 23 Thermosetting resin 24 Resin molded body 25, 125, 225, 325, 425, 525 Resin part 26 Light-reflecting material 27 Recessed 27a Inner bottom surface 27b Inner side surface 30 Sealing member 40 Fluorescent material 50 Wire 60 Mold 61 Upper mold 62 Lower mold 70 Dicing saw 100 Light emitting device

Claims (21)

This is a step of preparing a lead frame and a lead frame with a resin molded body having a resin molded body.
(A) On the upper side of the lead frame with a resin molded body, recesses are provided in each of a plurality of quadrangular regions separated by a plurality of planned cutting lines perpendicular to each other in the top view.
(B) The lead frame is divided and exposed by the resin molded body on the bottom surface of the recess.
(C) The lead frame is exposed on the bottom surface of the lead frame with a resin molded body.
(D) The lead frame has a plurality of notches arranged along any of the planned cutting lines, penetrating the upper surface and the lower surface, and arranged along any of the planned cutting lines. A plurality of holes penetrating the upper surface and the lower surface are formed, and a part of the resin molded body is inserted into each of the plurality of notches, and each of the plurality of holes has a portion of the resin molded body. Is the process of preparing a lead frame with a resin molded body in which a part of the resin molded body is not contained, and
A step of placing a light emitting element on the bottom surface of each of the plurality of recesses, and
A step of arranging a sealing member covering the light emitting element in the recess, and
One of the resin molded bodies that has entered a part of the lead frame and the notch in each of the plurality of light emitting devices manufactured by cutting the lead frame with the resin molded body along the planned cutting line. Light emission is characterized by having a step of forming the portions on substantially the same surface on the cut surface and exposing the inner side surface of the hole portion of the lead frame from the resin molded body at a position inside the cut surface. Manufacturing method of the device.
The method for manufacturing a light emitting device according to claim 1, wherein the cutout portion is provided over ½ or more of the entire surrounding circumference of the light emitting device to be manufactured.
The method for manufacturing a light emitting device according to claim 1 or 2, wherein in the step of preparing the lead frame with a resin molded body, the entire surface of the lead frame is silver-plated.
The step according to any one of claims 1 to 3, wherein in the step of preparing the lead frame with a resin molded body, the lead frame has steps or irregularities in all the portions defining the cutout portion. The method for manufacturing a light emitting device according to the description.
The step according to any one of claims 1 to 4, wherein in the step of preparing the lead frame with a resin molded body, the lead frame has a portion etched from one side so as not to penetrate the lead frame. The method for manufacturing a light emitting device according to the description.
The method for manufacturing a light emitting device according to any one of claims 1 to 5, wherein the resin molded body contains a triazine derivative epoxy resin.
The method for manufacturing a light emitting device according to any one of claims 1 to 6, wherein a sealing member containing a fluorescent substance is used as the sealing member in the step of arranging the sealing member.
The lead frame further has at least one groove on any of the lines to be cut.
The method for manufacturing a light emitting device according to any one of claims 1 to 7, wherein in the step of obtaining the plurality of light emitting devices, the lead frame is cut through the groove.
In the step of obtaining the plurality of light emitting devices,
The method for manufacturing a light emitting device according to any one of claims 1 to 8, wherein a part of the cut surface of the lead frame exposed to the cut surface has irregularities.
The method for manufacturing a light emitting device according to any one of claims 1 to 9, wherein at least one of the plurality of cutout portions is inclined with respect to the planned cutting line.
The light emitting device has a substantially quadrangular outer shape when viewed from above and has four outer surfaces.
The method for manufacturing a light emitting device according to any one of claims 1 to 10, wherein the lead frame is provided with the notch at any of the four positions on the outer surface.
In the step of exposing the inner side surface of the hole portion of the lead frame from the resin molded body at a position inside the cut surface.
The method for manufacturing a light emitting device according to any one of claims 1 to 11, wherein a part of the upper surface continuous with the hole of the lead frame is exposed so as to protrude from the resin molded body in a top view. ..
A resin package having a lead having a positive lead and a lead having a negative lead and a resin portion, and having a recess having a bottom surface in which a part of the positive lead and a part of the negative lead are exposed, and a bottom surface of the recess. A light emitting device having a light emitting element mounted on a light emitting element and a sealing member for covering the light emitting element in the recess, and having four outer surfaces which are substantially quadrangular in a top view.
The leads are exposed on the bottom surface of the light emitting device and have notches on at least two opposing outer surfaces.
A part of the resin portion is inserted into each of the notch portions.
The resin portion that has entered the cutout portion is substantially on the same plane as a part of the side surface of the lead, and the side surface of the lead is recessed inward from the outer surface in a top view and is exposed from the resin portion. Have a face,
Light emitting device.
The light emitting device according to claim 13, wherein the cutout portion is provided over ½ or more of the entire surrounding circumference of the light emitting device to be manufactured.
The light emitting device according to claim 13 or 14, wherein the lead is silver-plated on the entire surface except the outer surface.
The light emitting device according to any one of claims 13 to 15, wherein the lead has steps or irregularities in all the portions defining the cutout portion.
The light emitting device according to any one of claims 13 to 16, wherein the lead has a portion etched from one side so as not to penetrate the lead.
The light emitting device according to any one of claims 13 to 17, wherein the resin portion contains a triazine derivative epoxy resin.
The light emitting device according to any one of claims 13 to 18, wherein the sealing member contains a fluorescent substance.
The light emitting device according to any one of claims 13 to 19, wherein the notch portions are provided on all four sides of the light emitting device which is a substantially quadrangular shape.
The light emitting device according to any one of claims 13 to 20, wherein a part of the upper surface of the lead continuous with the exposed surface protrudes from the resin portion in the top view.

Images