JP7244735B2 - Method for manufacturing light emitting device - Google Patents

Description

The present disclosure relates to a method for manufacturing a light emitting device.

2. Description of the Related Art In general, light-emitting devices using light-emitting elements such as light-emitting diodes are widely used as various light sources such as lighting fixtures. Such a light-emitting device includes, for example, a package having a recess and a light-emitting element arranged on the bottom surface of the recess. Further, as a light-emitting device with further improved light extraction efficiency, there is a light-emitting device in which a resin material containing a light-reflecting substance is injected into the concave portion to form a reflective layer having a light-reflecting surface in the vicinity of the light-emitting element ( For example, Patent Document 1).

Also, as a device for injecting a resin material, for example, a coating device that injects and coats a resin material from a plurality of nozzles into one coating region is known (for example, Patent Document 2). By injecting the resin material from a plurality of nozzles, the time required for coating can be shortened.

JP 2014-158011 A JP 2017-1395 A

However, when the resin material for forming the light reflecting surface is injected by the coating device of Patent Document 2, it may be difficult to form the desired light reflecting surface.

Accordingly, an object of one embodiment of the present invention is to provide a method for manufacturing a light-emitting device having a desired light reflecting surface.

In a method for manufacturing a light-emitting device according to an embodiment of the present invention, a plurality of packages having recesses are arranged in a first direction and a second direction orthogonal to the first direction, and light-emitting elements are arranged on the bottom surfaces of the recesses of the plurality of packages. arranging a light-reflecting member in the vicinity of the light-emitting element from the side surface of the recess in the recess; and separating the collective substrate into pieces to obtain a plurality of light-emitting devices. and the step of arranging the light reflecting member includes a step of simultaneously discharging the resin material to be the light reflecting member from a plurality of nozzles in the concave portion, and the plurality of nozzles are positioned at the first discharge point. It has a first nozzle that ejects a resin material, and a second nozzle that has a nozzle diameter smaller than that of the first nozzle and ejects the resin material to a second ejection point.

According to one embodiment of the present invention, it is possible to provide a method for manufacturing a light emitting device having a desired light reflecting surface.

1 is a schematic top view of an aggregate substrate according to a first embodiment; FIG. It is a schematic top view which shows the state which each mounted the light emitting element and the protection element in four packages, and connected the wire. 1C is a schematic end view along line 1C-1C in FIG. 1B; FIG. FIG. 3 is a schematic top view showing one example of a lead frame; It is a typical end view explaining a metal mold|die. FIG. 4 is a schematic side view showing multiple nozzles; FIG. 4 is a schematic bottom view of a plurality of nozzles viewed from the ejection port side; FIG. 4 is a schematic diagram showing a state in which a resin material to be a light-reflecting member is discharged from a plurality of nozzles; FIG. 4 is a schematic top view showing one package; FIG. 4 is a schematic end view of a package showing a state in which a light reflecting member is formed; FIG. 4 is a schematic perspective view showing a plurality of nozzles; FIG. 4 is a schematic top view showing the position of one package and nozzles; FIG. 5 is a schematic top view of an aggregate substrate according to a second embodiment; It is a schematic top view which shows the state which each mounted the light emitting element and the protection element in four packages, and connected the wire. FIG. 4 is a schematic top view showing the position of one package and nozzles; FIG. 4 is a schematic end view of a package showing a state in which a light reflecting member is formed; It is a schematic top view which shows the modification of the process of arrange|positioning a light-reflective member. It is a schematic top view which shows the modification of the process of arrange|positioning a light-reflective member. FIG. 4 is a schematic perspective view showing a plurality of nozzles; FIG. 9E is a schematic side view of the plurality of nozzles of FIG. 9E viewed from one surface side; FIG. 9E is a schematic side view of the plurality of nozzles of FIG. 9E as viewed from the other side;

A detailed description will be given below with reference to the drawings. Parts with the same reference numbers that appear in multiple drawings indicate the same or equivalent parts or members.
Furthermore, the following is an example of a method for manufacturing a light-emitting device for embodying the technical idea of the present invention, and the present invention is not limited to the following. In addition, unless there is a specific description, the dimensions, materials, shapes, relative positions, and the like of components are intended to be illustrative rather than limiting the scope of the present invention. The sizes and positional relationships of members shown in each drawing may be exaggerated for ease of understanding.

In this specification and drawings, the first direction indicates the horizontal direction (X direction) and includes both the right direction (X 1 ₊ direction) and the left direction (X _{1 −} direction). Also, the second direction indicates the vertical direction (Y direction) and includes both the upward direction (Y 1 ₊ direction) and the downward direction (Y _{2 −} direction).

Moreover, in the embodiments described below, the same terms may be appropriately used for the collective substrate and the package before and after providing the light emitting elements, wires, and the like. Also, the same terms may be appropriately used before and after singulation, such as packages and resin parts.
In addition, in the present disclosure, “parallel” and “perpendicular” mean that two straight lines, sides, or planes are in the range of about 0 ° to ±5 ° and 90 ° to ±5 °, respectively, unless otherwise specified. including when in

(First embodiment)
A method for manufacturing a light-emitting device according to the first embodiment of the present invention includes (A) a step of preparing an aggregate substrate having a plurality of packages and light-emitting elements, and (B) a step of arranging a light reflecting member in each package. and (C) dividing the aggregate substrate into individual pieces to obtain a plurality of light emitting devices. Each step will be described in detail below.

(A) Process of Preparing Collective Board First, referring to FIGS. 1A and 1B, the collective board 50 after completion will be described first, and then the process of preparing the collective board 50 will be described. Further, here, as the aggregate substrate 50, a substrate including the lead frame 20 and the resin portion 30 will be described as an example. FIG. 1A is a schematic top view of the collective substrate 50, and FIG. 1B is a schematic top view showing a state in which the light emitting elements 10 and the protection elements 11 are mounted on the four packages 1 and wires are connected.

The collective substrate 50 includes a plurality of packages 1 arranged in a first direction F and a second direction S orthogonal to the first direction F. As shown in FIG. As shown in FIG. 1B, each package 1 corresponds to a region surrounded by lines to be cut (dotted lines) extending in the first direction F and the second direction S. As shown in FIG. The package 1 has a rectangular shape when viewed from above. It has a part of the part 30 . The resin portion 30 is integrally formed across one package 1 and another adjacent package 1 . The four packages 1 shown in FIG. 1B are positioned in the vicinity of the planned cutting line between the resin portion 30 forming the upper surface of one package 1, the resin portion 30 forming the upper surface of the other package 1, and the two packages 1. The resin portion 30 has substantially the same surface.

Each package 1 has a recess 2 and a light emitting element 10 is mounted on the bottom surface of the recess 2 . In the package 1 shown in FIG. 1B, both the first lead portion 21a and the second lead portion 22a are positioned on the bottom surface of the recess 2, and the light emitting element 10 is mounted on the first lead portion 21a.

The package 1 shown in FIG. 1B also has a groove 6 surrounding the light emitting element 10 . The groove portion 6 functions as a damming portion that dams the resin material that becomes the light reflecting member 5 described later. Therefore, the groove portion 6 may be arranged on the bottom surface of the recess portion 2 between the region (peripheral region) where the light reflecting member 5 is formed and the light emitting element 10 .

The groove 6 may be, for example, one continuous groove 6 as shown in FIG. 1B, or may be a plurality of intermittently formed grooves 6 . When the grooves 6 are intermittently formed, the distance between the grooves 6 is preferably set to a small distance so that the resin material that becomes the light reflecting member 5 does not reach the side surface of the light emitting element 10. . The distance between the grooves 6 is, for example, 1 μm to 100 μm, preferably 10 μm to 50 μm. Further, on the upper surface of the first lead portion 21 a positioned on the bottom surface of the recess 2 , the groove 6 is separated from the sidewall of the recess 2 .

FIG. 1C is a schematic end view along line 1C-1C in FIG. 1B. The groove 6 has an outer top edge P and an inner top edge Q, as shown in FIG. 1C. The outer upper edge P is the edge farther from the light emitting element 10 of the two edges (upper edge) that face each other in the width direction on the upper surface of the groove 6 , and the inner upper edge Q is the edge closer to the light emitting element 10 . is the edge.

Such an aggregate substrate 50 may be prepared by purchasing a pre-manufactured aggregate substrate, or may be prepared by manufacturing according to an example of the manufacturing process described below.

(An example of a method for manufacturing an aggregate board)
First, a flat metal plate is etched, pressed, or the like to form a plurality of pairs of first lead portions 21a and second lead portions 22a, and groove portions 6 are formed on the upper surfaces of the first lead portions 21a. A lead frame 20 is prepared. FIG. 2 is an example of the lead frame 20 and shows a part of the lead frame 20 corresponding to the four packages 1 . A hatched portion is a portion where the thickness of the lead frame 20 is thin, and is a region where half-etching or the like is performed from the lower surface side of the lead frame 20 . The step of forming the first lead portion 21a and the second lead portion 22a and the step of forming the groove portion 6 may be the same step or separate steps. From the viewpoint of shortening the manufacturing lead time, the same process is preferable. Also, the plurality of pairs of the first lead portions 21a and the second lead portions 22a are connected by a plurality of connecting portions.

The lead frame 20 preferably has a plated layer of silver or the like on its surface including the upper and lower surfaces. Thereby, the light emitted from the light emitting element 10 can be efficiently reflected. The step of forming a plated layer of silver or the like is preferably performed after etching the metal plate and before forming the resin portion 30, but it may be performed on the metal plate before etching or the like. However, it may be performed after the resin portion 30 is formed.

Next, as shown in FIG. 3, the lead frame 20 is sandwiched using a mold having an upper mold U and a lower mold D each having a convex portion. Then, a resin material that forms the resin portion 30 is poured into a mold including a gap formed when the lead frame 20 is sandwiched between the molds. The resin material injected into the gap becomes the resin portion 30 after hardening, and the area corresponding to the convex portion of the upper mold U becomes the concave portion 2 of the package 1 . Various molding methods such as a transfer molding method, an injection molding method, and a compression molding method can be used as a method of molding the resin portion 30 using a mold.

When the lead frame 20 is sandwiched between the molds, the convex portion of the upper mold U is preferably arranged so that the entire groove portion 6 is located inside the outer circumference of the convex portion when viewed from above. In other words, the size of the convex portion of the upper mold U (the area of the top of the convex portion) is larger than the region where the groove portion 6 is formed. It is preferable to arrange so that it overlaps with the region where is formed. As a result, it is possible to prevent the resin material forming the resin portion 30 from entering the groove portion 6 , thereby preventing the groove portion 6 from being filled with the resin portion 30 . When the groove 6 is filled with the resin portion 30, the groove 6 may not function as a damming portion. can.
As a result, the groove 6 is separated from the side wall of the recess 2 on the upper surface of the first lead portion 21 a located on the bottom surface of the recess 2 .

After injecting the resin material into the mold, the resin material is temporarily cured by applying a predetermined temperature. After that, the resin material is removed from the mold and subjected to a temperature higher than that of the temporary curing to perform the final curing of the resin material. As a result, a collective substrate 50 (resin-coated lead frame) is formed in which the resin portion 30 is formed on the lead frame 20 .

Next, the light emitting element 10 is placed on the bottom surface of the recess 2 of the package 1 . The light emitting element 10 is mounted on the upper surface of the first lead portion 21a via a bonding member such as resin, for example. Then, the light emitting element 10, the first lead portion 21a and the second lead portion are connected by wires. In addition, a protection element 11 may be provided on the bottom surface of the concave portion 2 in order to improve the electrostatic withstand voltage of the light emitting device 100 .

Through the manufacturing process described above, the collective substrate 50 including the plurality of packages 1, the light emitting elements 10, and the like can be manufactured.

(B) Step of Arranging Light Reflective Member Next, the light reflective member 5 is arranged in the concave portion 2 of each package 1 using a coating device. The light-reflecting member 5 forms a light-reflecting surface extending from the side surface of the recess 2 to the vicinity of the light-emitting element 10, and has a role of efficiently extracting the light from the light-emitting element 10 upward. Therefore, it is preferable that the light reflecting member 5 covers the entire bottom surface of the recess 2 except for the light emitting element 10 and its vicinity.

The step of arranging the light reflecting member 5 is performed using a plurality of nozzles 8 with different nozzle diameters. The "nozzle diameter" refers to the inner diameter of the nozzle. FIG. 4A is a schematic side view showing a plurality of nozzles 8, and FIG. 4B is a schematic bottom view of the plurality of nozzles 8 viewed from the ejection port side. The plurality of nozzles 8 includes at least a first nozzle 8a and a second nozzle 8b, both of which are connected to a supply holder H that supplies resin material. The first nozzle 8a has an outlet with a first nozzle diameter, and the second nozzle 8b has an outlet with a second nozzle diameter smaller than the first nozzle diameter. By using two or more nozzles with different nozzle diameters, a required amount of resin material can be injected according to the ejection point.
Specifically, a first nozzle 8a with a large nozzle diameter is arranged in a region where a large amount of resin is required, and a second nozzle 8b with a small nozzle diameter is arranged in a region where a small amount of resin is required. This makes it possible to supply a suitable amount of resin material according to the ejection point. As a result, it is possible to prevent the light-reflecting member 5 from unintentionally covering the side surface of the light-emitting element 10 and prevent the resin material from running out, and furthermore, the light-reflecting member 5 having a desired light-reflecting surface can be formed. be able to.

The process of arranging the light reflecting member 5 will be specifically described below.
First, the collective substrate 50 is placed in the coating device. The coating device has a supply holder H for supplying a resin material to be the light reflecting member 5 and a plurality of nozzles 8 integrally connected with the supply holder H. As shown in FIG. By applying a predetermined pressure to the supply holder H, the resin material is simultaneously supplied to each of the plurality of nozzles 8 . As shown in FIG. 4C, the plurality of nozzles 8 correspond to the positions of the recesses 2 of each package 1 and the positions of the plurality of nozzles 8 with respect to the plurality of packages 1 arranged in the first direction F and the second direction S. Move in order while aligning the

Each of the plurality of nozzles 8 simultaneously discharges the resin material toward each discharge point on the bottom surface of the recess 2 . FIG. 5 is a schematic top view showing one package 1, omitting the light emitting element 10, wires, and the like so that the discharge point and the like can be easily understood. The package 1 shown in FIG. 5 has four corners 12 , 13 , 14 and 15 on the bottom surface of the recess 2 . The corner 14 has a cathode mark indicating polarity, but this portion can be one corner. The first ejection point 9a and the second ejection point 9b are located near two corners 12 and 14 out of the four corners. Further, the first discharge point 9a and the second discharge point 9b are located within the outer peripheral region between the side surface of the recess 2 and the groove 6 (damming portion). Then, the resin material is discharged from the discharge port of the first nozzle 8a toward the first discharge point 9a, and the resin material is discharged from the discharge port of the second nozzle 8b toward the second discharge point 9b.

The shortest distance from the first discharge point 9 a to the groove portion 6 (damming portion) is longer than the shortest distance from the second discharge point 9 b to the groove portion 6 . As for the resin material, the required amount of resin is generally determined according to the area of the coating region. Therefore, when the distance between each ejection point and the groove portion 6 is as described above, the first nozzle 8a having a large nozzle diameter is arranged at the first ejection point 9a, and the second nozzle 8a having a small nozzle diameter is arranged at the second ejection point 9b. 8b is preferably arranged to supply the resin material.
Further, when the ratio of the shortest distance from the first ejection point 9a to the groove portion 6 to the shortest distance from the second ejection point 9b to the groove portion 6 is 40 to 50%, the first nozzle diameter with respect to the second nozzle diameter is It is preferably 20-40%. This makes it possible to supply a suitable resin material to a predetermined coating area.

Next, a curing process is performed by applying a predetermined temperature to the resin material. Thereby, the light reflecting member 5 is formed. FIG. 6 shows that the light reflecting member 5 is arranged from the side surface of the recess 2 to the vicinity of the outer upper edge P of the groove 6 and is further arranged away from the side surface of the light emitting element 10 . By separating the light reflecting member 5 from the side surface of the light emitting element 10, the possibility that part of the light emitted from the light emitting element 10 is confined can be suppressed. As a result, the light emitting device 100 can be excellent in light extraction.

Note that the plurality of nozzles 8 may have three or more nozzles. The plurality of nozzles 8 shown in FIG. 7A further has a third nozzle that ejects the resin material to a third ejection point. Then, as shown in FIG. 7B, the first nozzle 8a is positioned at the first discharge point 9a near the corner 12, the second nozzle 8b is positioned at the second discharge point 9b near the corner 14, and the third nozzle 8c are preferably positioned at third ejection points 9c near the corners 13, respectively. Thereby, a desired light reflecting surface can be formed. In addition, in FIG. 7B, the light emitting element 10, wires, and the like are omitted so that the discharge point and the like can be easily understood.

Also, the first discharge point 9a, the second discharge point 9b, and the third discharge point 9c are preferably positioned in a region other than the region Y to which the wire is connected. In other words, in the wire connection step of connecting one electrode of the light emitting element 10 and the package 1 with a wire, the wire is preferably connected to a region where the first to third discharge points 9a to 9c are not located. . As a result, when the resin material is injected, it is possible to prevent the wires from breaking due to the stress of the resin injection. In FIG. 7B, the areas where the wires are connected are located near the corners 15 .
If a wire with a large diameter is used or the resin injection stress is small, the wire connecting portion and the ejection point may be positioned so as to overlap each other when viewed from above.

As described above, by using a plurality of nozzles with different nozzle diameters to apply the resin material to be the light-reflecting member, the lead time of the manufacturing process can be shortened, and furthermore, the light having the desired light-reflecting surface can be used. A reflective member can be formed.

After the light reflecting member 5 is formed, the sealing member 3 covering the light emitting element 10 and the like may be formed in the concave portion. By providing the sealing member 3, the light emitting element 10 and the like can be protected from external force, dust, moisture, and the like. Further, the sealing member 3 preferably contains a phosphor such as cerium-activated yttrium-aluminum-garnet.

(C) Step of Individualizing the Collective Substrate to Obtain a Plurality of Light-Emitting Devices Next, the collective substrate 50 is singulated to obtain a plurality of light-emitting devices 100 . Various methods such as cutting with a lead cutting mold, cutting with a dicing saw, or cutting with laser light can be used as a method for separating the collective substrate 50 into individual pieces. The collective board 50 is cut along the first direction F and the second direction S, for example.

Each member used in the method for manufacturing the light emitting device of the present invention will be described below.

(package)
The package 1 is a base on which the light emitting element 10 is placed. The package 1 has at least a base and electrode portions (for example, leads). Materials constituting the base of the package 1 include, for example, ceramics such as aluminum oxide and aluminum nitride, resins (for example, silicone resin, silicone-modified resin, epoxy resin, epoxy-modified resin, unsaturated polyester resin, phenol resin, polycarbonate resin, acrylic resins, trimethylpentene resins, polynorbornene resins, or hybrid resins containing one or more of these resins), pulp, glass, or composite materials thereof. Moreover, the base of the package 1 may have a single-layer structure or a multi-layer structure including a plurality of layers.

(Lead frame, first lead, second lead)
The lead frame 20 is made of metal such as copper, aluminum, gold, silver, iron, nickel, alloys thereof, phosphor bronze, iron-containing copper, etc., as a base material. These may be single layers or laminated structures (for example, clad materials). In particular, it is preferable to use copper, which is inexpensive and has high heat dissipation, as the base material. Moreover, the lead frame 20 may have a metal layer on the surface of the base material. Metal layers include, for example, silver, aluminum, nickel, palladium, rhodium, gold, copper, or alloys thereof. The lead frame 20 may be provided with a metal layer over the entire surface including the upper surface and the lower surface, or may be partially provided with a metal layer. Also, the metal layer formed on the upper surface of the lead frame 20 and the metal layer formed on the lower surface of the lead frame 20 may be different. For example, the metal layer formed on the upper surface of the lead frame 20 is a metal layer composed of multiple layers including metal layers of nickel and silver, and the metal layer formed on the lower surface of the lead frame 20 includes a metal layer of nickel. It may be a metal layer that does not contain.

The first lead portion 21 a and the second lead portion 22 a are conductive and function as electrodes for supplying power to the light emitting element 10 . The package 1 may have a third lead in addition to the first lead portion 21a and the second lead portion 22a. The third lead may function as a heat radiating member, or may function as an electrode like the first lead portion 21a and the second lead portion 22a.

Moreover, when a plating layer containing silver is formed on the outermost surface of the lead frame 20, it is preferable to provide a protective layer such as silicon oxide on the surface of the plating layer containing silver. As a result, discoloration of the plated layer containing silver due to sulfur components in the air can be suppressed. The protective layer can be formed by a vacuum process such as sputtering, but other known methods may be used.

(Resin part)
The resin portion 30 can use a thermosetting resin, a thermoplastic resin, or the like as a resin material serving as a base material. Specifically, epoxy resin compositions, silicone resin compositions, modified epoxy resin compositions such as silicone-modified epoxy resins, modified silicone resin compositions such as epoxy-modified silicone resins, unsaturated polyester resins, saturated polyester resins, and polyimide resins. Compositions, cured products such as modified polyimide resin compositions, resins such as polyphthalamide (PPA), polycarbonate resin, polyphenylene sulfide (PPS), liquid crystal polymer (LCP), ABS resin, phenol resin, acrylic resin, PBT resin, etc. can be used. In particular, it is preferable to use a thermosetting resin such as an epoxy resin composition or a modified silicone resin composition.
A silicone resin composition (for example, SMC resin), which is excellent in heat resistance and light resistance, is also preferable as the resin material for the resin portion 30 .

Reflective materials (e.g., titanium oxide, zinc oxide, silicon oxide, zirconium oxide, aluminum oxide) having a large difference in refractive index with respect to the base material resin are added to these base material resins. By dispersing light scattering particles such as aluminum nitride), light can be efficiently reflected.

Also, the resin portion 30 may have a low light reflectance with respect to external light (sunlight in many cases) of the light emitting device in order to improve the contrast of the light emitting device. In this case, it is usually preferred that the color is black or a color close thereto. As a filler at this time, carbon such as acetylene black, activated carbon and graphite, transition metal oxides such as iron oxide, manganese dioxide, cobalt oxide and molybdenum oxide, or colored organic pigments can be used depending on the purpose. can.

(Light reflective member)
The light reflecting member 5 reflects the light emitted from the light emitting element 10 toward the opening of the recess 2 . The light reflecting member 5 is positioned between the side wall of the recess 2 and the vicinity of the light emitting element 10 .

The light reflecting member 5 has a light reflecting surface between the sidewall of the recess 2 and the vicinity of the light emitting element 10 . The light reflecting surface is recessed on the bottom side of the recess. The light-reflecting member 5 can reflect the light emitted from the light-emitting element 10 toward the opening of the recess 2 , and can improve the light extraction of the light-emitting device 100 .

The light reflecting member 5 is preferably a member that hardly transmits or absorbs light from the light emitting element 10 or external light. The light reflecting member 5 is preferably white. For example, a thermosetting resin, a thermoplastic resin, or the like can be used as the resin that serves as the base material of the light reflecting member 5. More specifically, phenol resin, epoxy resin, BT resin, PPA, silicone resin, or the like can be used. can be used. Reflective materials (e.g., titanium oxide, zinc oxide, silicon oxide, zirconium oxide, aluminum oxide) having a large difference in refractive index with respect to the base material resin are added to these base material resins. By dispersing light scattering particles such as aluminum nitride), light can be efficiently reflected. The viscosity of the light reflecting member 5 in an uncured state is preferably lower than the viscosity of the resin portion 30 in an uncured state. For example, the uncured viscosity of the light reflecting member 5 is preferably 1 pa·s to 20 pa·s, more preferably 5 pa·s to 15 pa·s. As a result, the light reflecting member 5 spreads well in the concave portion 2, and the possibility of insufficient filling of the light reflecting member 5 can be suppressed. It is preferable that the light reflecting member 5 has high thixotropy in an uncured state.

The light reflecting member 5 preferably has a higher light reflectance than the resin portion 30 . For example, the content of the light reflective substance (eg, titanium oxide) contained in the light reflective member 5 is greater than the content of the light reflective substance contained in the resin portion 30 . Specifically, the content of the light reflective substance contained in the light reflective member 5 is preferably 1.5 times or more the content of the light reflective substance contained in the resin portion 30. It is more preferably 2.5 times or more, further preferably 2.5 times or more. For example, the light reflecting member 5 contains 30 to 45% by weight of titanium oxide out of the total weight of the uncured resin material, and the resin portion 30 contains titanium oxide out of the total weight of the uncured resin material. It contains 15 to 20% by weight of titanium.

(multiple nozzles)
A plurality of nozzles 8 supply the resin material that will become the light reflecting member 5 to each package 1 . The plurality of nozzles 8 is part of a coating device (dispensing device), and the coating device includes a supply unit H that supplies resin material, a plurality of nozzles 8, a control unit that aligns the plurality of nozzles 8, and the like. . The plurality of nozzles 8 includes at least a first nozzle 8a, a second nozzle 8b having a nozzle diameter smaller than that of the first nozzle 8a, and may further include a third nozzle 8c.

The outer diameter of each nozzle is preferably 0.11 to 3 mm. This prevents the nozzle from coming into contact with the side wall of the recess 2 and the light emitting element 10, and the resin material can be easily supplied. From the same point of view, it is preferable that the tip of the nozzle be a conical shape that is thinner toward the tip. The shape of the outer diameter of the nozzle can be various shapes, but a shape that does not easily come into contact with other members, such as a circular shape without corners, is preferable.
Moreover, the nozzle diameter (inner diameter) of the first nozzle 8a is not particularly limited as long as it is larger than the nozzle diameter of the second nozzle 8b. For example, the nozzle diameter of the first nozzle 8a is selected from the range of 0.1 to 0.5 mm, and the nozzle diameter of the second nozzle 8b is selected from the range of 0.1 to 0.5 mm. Also, the nozzle diameter of the third nozzle 8c may be the same as or different from the nozzle diameter of the first nozzle 8a or the second nozzle 8b. For example, the nozzle diameter of the third nozzle 8c is 0.2 to 0.4 mm. The shape of the inner diameter of each nozzle can be various shapes. The outer diameter and inner diameter of the nozzle may be similar (for example, both are circular) or dissimilar (for example, the outer diameter is circular and the inner diameter is polygonal). .

In the step of arranging the light reflecting member 5 , it is preferable to arrange the resin material so that the injection axis of each nozzle is perpendicular to the upper surface of the collective substrate 50 . As a result, the wetting and spreading of the resin material at each discharge point is likely to be uniform, and the fluidity of the resin material is easily controlled. Note that the manufacturing method of the present disclosure is not limited to this, and the injection axis of each nozzle may be inclined with respect to the upper surface of the collective substrate 50 . Thereby, for example, when it is desired to form a light reflecting surface that is thick in the lateral direction, it is possible to efficiently form a desired light reflecting surface.

It is preferable that the discharge points of the plurality of nozzles 8 are located at positions that are not rotationally symmetric (asymmetric positions) with respect to the geometric center of the bottom surface of the recess 2 . For example, if the bottom surface of the concave portion 2 is rectangular, it is preferable to provide discharge points only near three of the four corners instead of providing discharge points near all four corners. By intentionally providing the area where the ejection point is not located, when air bubbles are generated in the resin material, the air bubble can be released in the area where the ejection point is not located. Further, for example, the flow pressure when the resin material flows can be relieved in that region, and the moldability of the light reflecting member 5 can be improved. In addition, by arbitrarily (asymmetrically) arranging the nozzles, the light reflecting member 5 can be arranged with a high degree of freedom in accordance with the application area.

Each nozzle is preferably a member that can withstand the injection pressure of the resin material. Examples of materials for the nozzle include glass, stainless steel, aluminum, aluminum alloys, magnesium, magnesium alloys, zirconium, and zirconium alloys.

(light emitting element)
The light emitting element 10 is placed on the bottom surface of the recess 2 . A light-emitting diode element or the like is used for the light-emitting element 10 . The light-emitting element 10 preferably contains a nitride semiconductor (In _x Al _y Ga _1-x-y N, 0≦x, 0≦y, x+y≦1) capable of emitting light in the ultraviolet to visible range. In this embodiment, the light-emitting device includes two light-emitting elements, but the number of light-emitting elements is not limited to one and may be three or more. When the light-emitting device includes two light-emitting elements, for example, a light-emitting element that emits blue light and a light-emitting element that emits green light may be used. When the light-emitting device includes three light-emitting elements, a light-emitting element that emits blue light, a light-emitting element that emits green light, and a light-emitting element that emits red light may be used.

(sealing member)
The light emitting device 100 may include a sealing member 3 inside the recess 2 . The sealing member 3 can cover the light emitting element 10 and the like positioned on the bottom surface of the recess 2 to protect the light emitting element 10 and the like from external force, dust, moisture, and the like.

The sealing member 3 preferably transmits 60% or more, more preferably 90% or more, of the light emitted from the light emitting element 10 . As the material of the sealing member 3, the resin material used in the resin part 30 can be used, and as the base material resin, a thermosetting resin, a thermoplastic resin, or the like can be used. A resin, an acrylic resin, or a resin containing one or more of these can be used. The sealing member can be formed from a single layer, but it can also be constructed from multiple layers. Further, light scattering particles such as titanium oxide, silicon oxide, zirconium oxide, and aluminum oxide may be dispersed in the sealing member 3 .

The sealing member 3 may contain a material (phosphor or the like) that converts the wavelength of light from the light emitting element 10 . Specific examples of phosphors include cerium-activated yttrium-aluminum garnet, cerium-activated lutetium-aluminum garnet, europium- and/or chromium-activated nitrogen-containing calcium aluminosilicate (one of calcium part can be replaced with strontium), europium-activated sialon, europium-activated silicate, europium-activated strontium aluminate, and manganese-activated potassium fluorosilicate.

The content of the light-scattering particles and/or phosphor is preferably, for example, about 10 to 100% by weight with respect to the total weight of the sealing member.

(Second embodiment)
A method for manufacturing a light emitting device 200 according to the second embodiment of the present disclosure includes (A′) a step of preparing an aggregate substrate 50 including a plurality of packages 1 and light emitting elements 10; and (C′) dividing the collective substrate 50 into individual pieces to obtain a plurality of light emitting devices 200 . The method for manufacturing the light emitting device 200 differs from the method for manufacturing the light emitting device 100 in that the damming portion of the light reflecting member 5 is the convex portion 7 . Therefore, the manufacturing method of the light emitting device 200 according to the second embodiment will be mainly described with respect to the collective substrate 50 .

8A is a schematic top view of an aggregate substrate 50 used in the method of manufacturing the light emitting device 200, and FIG. 8B is a schematic top view illustrating four packages 1. FIG. The package 1 has a convex portion 7 surrounding the light emitting element 10 as a blocking portion. The convex portion 7 functions as a damming portion that dams the resin material that forms the light reflecting member 5 . The protrusion 7 may be integrated with the package 1 or may be separate from the package 1 . For example, the convex portion 7 may be formed by drawing resin or the like around the light emitting element 10, or an aggregate substrate 50 including a plurality of packages 1 integrally having the convex portion 7 may be prepared. As an example of the package 1 having the protrusions 7 as an integral part, the protrusions 7 can be formed at the same time when the collective substrate 50 is manufactured by resin molding using a mold.

FIG. 9A is a schematic top view showing one package 1, and omits the light emitting element 10, wires, and the like so that the discharge point and the like can be easily understood. In the step of arranging the light reflecting member 5, for example, on the bottom surface of the concave portion 2, the first discharge point 9a is arranged near the corner 12, the second discharge point 9b is arranged near the corner 14, and the corner 13 is arranged. A third discharge point 9c is arranged in the vicinity. Thereby, the light reflecting member 5 having a desired light reflecting surface can be formed. 9B is a schematic end view of the package 1 after forming the light reflecting member 5. FIG.

FIG. 9C is a schematic top view showing a modification of the process of arranging the light reflecting member 5. FIG. In FIG. 9C, the light emitting element 10, wires, etc. are omitted so that each ejection point can be easily understood. In the package 1 shown in FIG. 9C, six nozzles are used as the plurality of nozzles 8, and the six nozzles are provided in four corners of the bottom surface of the recess 2 and in two regions between the corners. A light reflecting member 5 is arranged so as to position the ejection point. Specifically, in a top view, the first ejection point 9a is arranged near the corner 12, the third ejection point 9c is arranged near the corner 13, and the area is located between the corner 12 and the corner 13. , the fourth ejection point 9d is arranged. Further, the second discharge point 9b is arranged near the corner 14, the fifth discharge point 9e is arranged near the corner 15, and the sixth discharge point 9f is arranged between the corners 14 and 15. are placed. The first nozzles 8a are arranged at the first ejection point 9a, the third ejection point 9c and the fourth ejection point 9d, and the first nozzles 8a are arranged at the second ejection point 9b, the fifth ejection point 9e and the sixth ejection point 9f. A second nozzle 8b having a smaller nozzle diameter than the nozzle diameter of .

Arranging the ejection points at all four corners makes it easy to arrange the light reflecting member 5 in the area from the corners to the protrusions 7 even when the distance from each corner to the protrusions 7 is long. In addition, the resin material discharged from the nozzle can be discharged while being in contact with the two inner side surfaces of the concave portion 2 forming the corner. Thereby, even if the resin material discharged from the nozzle has a high viscosity, the resin material can be easily supplied into the concave portion 2 . Further, by arranging further ejection points between the corners such as the fourth ejection point 9d and the sixth ejection point 9f, the area between the central region of the inner surface of the recess 2 and the protrusion 7 It becomes easier to arrange the light reflecting member 5 in the region. By providing discharge points in the regions between the corners in addition to the vicinity of the corners, the light reflective member 5 is not arranged on the bottom surface of the recess 2, or the region where the light reflective member 5 is insufficient. can be suppressed. Thereby, a light-emitting device having a desired light reflecting surface can be manufactured.

Of the two inner side surfaces of the concave portion 2 facing each other, it is preferable to dispose a nozzle having a large nozzle diameter on the inner side surface side having the longest shortest distance to the convex portion 7 (damming portion). In the package 1 shown in FIG. 9C, the shortest distance a between the first inner side surface 2a and the convex portion 7 is longer than the shortest distance b between the second inner side surface 2b and the convex portion 7. As shown in FIG. In this case, on the first inner side surface 2a and the second inner side surface 2b facing each other, the first nozzles (the first discharge point 9a, the third discharge point 9c and the fourth discharge point 9d) having a large nozzle diameter are arranged on the first inner side surface 2a side. ), and the second nozzles (the second ejection point 9b, the fifth ejection point 9e and the sixth ejection point 9f) are preferably arranged on the second inner surface 2b side. Thereby, for example, even if it is necessary to arrange a larger amount of resin on the first inner side surface 2a side, it becomes easier to arrange the necessary resin material in each region.

The ejection point may be arranged between the corners 12 and 15 or between the corners 13 and 14 . In the package 1 shown in FIG. 9D, the fourth discharge point 9d is arranged between the corners 12 and 15, and the sixth discharge point 9f is arranged between the corners 13 and . Thereby, a light-emitting device having a desired light reflecting surface can be manufactured. Further, the nozzle diameter h1 of the first nozzle 8a positioned at the first ejection point 9a and the third ejection point 9c on the side of the first inner surface 2a where the shortest distance to the convex portion 7 is long, Nozzle diameter h2 of nozzles located at fourth ejection point 9d and sixth ejection point 9f located between two inner side surfaces 2b, and second ejection point 9b and fifth ejection point 9e on the second inner side surface 2b side. The nozzle diameter h3 of the second nozzle 8b located at the position may be set so as to satisfy h1>h2>h3. Thereby, a necessary amount of resin can be supplied to each region, and a light-emitting device having a desired light reflecting surface can be manufactured.

In the package 1 shown in FIGS. 9C and 9D, the light reflecting members 5 can be arranged using, for example, multiple nozzles 8 having six nozzles as shown in FIG. 9E. Moreover, it is preferable that the plurality of nozzles 8 include a first identification portion 23a and/or a second identification portion 23b, as shown in FIGS. 9F and 9G. 9F is a schematic side view of the plurality of nozzles 8 shown in FIG. 9E when viewed from direction X, and FIG. 9G is a schematic side view of the plurality of nozzles 8 shown in FIG. 9E viewed from direction Y which is perpendicular to direction X. FIG. 10 is a schematic side view of the case. The first identification portion 23a is an identification portion for allowing the device to recognize or visually confirm whether or not the nozzle is positioned at the correct position when viewed in the X direction. The second identification portion 23b is an identification portion for allowing the device to recognize or visually confirm whether or not the nozzle is positioned at the correct position when viewed from the Y direction. By providing the first identification portion 23a and/or the second identification portion 23b to the plurality of nozzles 8, the plurality of nozzles 8 can be attached in the correct direction and at the correct position when the plurality of nozzles 8 are attached to the coating device. . This can reduce the possibility of, for example, mounting multiple nozzles 8 in the opposite direction.

In addition, although 1st Embodiment and 2nd Embodiment demonstrated the embodiment provided with the damming part around the light emitting element, this invention is not limited to this. In addition, the preferred forms exemplified in each of the first and second embodiments can also be suitably applied to other embodiments.

REFERENCE SIGNS LIST 100 light emitting device 200 light emitting device 20 lead frame 30 resin portion 50 aggregate substrate 1 package 2 recess 2a first inner side 2b second inner side 3 sealing member 5 light reflecting member 6 groove 7 convex 8 nozzles 8a first Nozzle 8b Second nozzle 8c Third nozzle 9a First ejection point 9b Second ejection point 9c Third ejection point 9d Fourth ejection point 9e Fifth ejection point 9f Sixth ejection point 10 Light emitting element 11 Protection elements 12 to 15 Corners 21a First lead portion 22a Second lead portion 23a First identification portion 23b Second identification portion F First direction S Second direction P Outer upper edge Q Inner upper edge H Supply holder U Upper mold D Lower mold

Claims (10)

A step of preparing an aggregate substrate in which a plurality of packages having recesses are arranged in a first direction and a second direction orthogonal to the first direction, and light emitting elements are mounted on the bottom surfaces of the recesses of the plurality of packages. and,
a wire connection step of connecting the light emitting element and the package with a wire;
disposing a light reflecting member in the vicinity of the light emitting element from the side surface of the recess in the recess;
and obtaining a plurality of light emitting devices by singulating the aggregate substrate,
The step of arranging the light reflective member includes a step of simultaneously discharging the resin material that will be the light reflective member from a plurality of nozzles in the recess,
The plurality of nozzles includes a first nozzle that ejects a resin material to a first ejection point;
a second nozzle having a nozzle diameter smaller than that of the first nozzle and ejecting a resin material to a second ejection point;
a third nozzle for ejecting the resin material to the third ejection point;
The bottom surface of the recess has four corners,
In the step of arranging the light reflective member, the light reflective member is arranged such that the first ejection point to the third ejection point are positioned near three of the four corners, respectively. ,
In the wire connecting step, the wire is connected in the vicinity of a corner of the four corners where the first to third ejection points are not located. In the step of preparing the aggregate substrate, a damming portion is provided around the light emitting element on the bottom surface of the recess, and the first discharge point and the second discharge point are provided between the side surface of the recess and the damming portion. providing a package having a perimeter region including a dispensing point;
2. The method of manufacturing a light-emitting device according to claim 1, wherein the step of arranging the light-reflecting member includes the step of covering the outer peripheral region and providing the member so as to be spaced apart from the side surface of the light-emitting element. In the step of arranging the light reflecting member,
3. The method of manufacturing a light-emitting device according to claim 2, wherein the shortest distance from said first ejection point to said damming portion is longer than the shortest distance from said second ejection point to said damming portion. When the ratio of the shortest distance from the first discharge point to the damming portion to the shortest distance from the second discharge point to the damming portion is 40 to 50%,
4. The method of manufacturing a light emitting device according to claim 3, wherein the nozzle diameter of said first nozzle is 20 to 40% of the nozzle diameter of said second nozzle. The plurality of nozzles are provided integrally with a supply holder that supplies a resin material to be the light reflecting member,
5. The method of manufacturing a light emitting device according to claim 1, wherein said resin material is simultaneously supplied to each of said plurality of nozzles by applying a predetermined pressure to said supply holder. 6. The method of manufacturing a light-emitting device according to claim 3, wherein said damming portion is a groove portion which is spaced apart from the side surface of said recess and surrounds said light-emitting element. 6. The method of manufacturing a light-emitting device according to claim 3, wherein said blocking portion is a convex portion surrounding said light-emitting element. 8. The method of manufacturing a light emitting device according to claim 7, wherein said convex portion is part of said package. 9. The method of manufacturing a light-emitting device according to claim 1, wherein the light-reflecting member has a viscosity of 5 pa·s to 15 pa·s. The light reflective member includes a light reflective substance,
10. The method of manufacturing a light-emitting device according to claim 1, wherein the light-reflecting substance is contained in an amount of 30 to 45% by weight of the total weight of the resin material serving as the light-reflecting member.

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