CN210489647U - LED lamp with multilayer structure chip - Google Patents
LED lamp with multilayer structure chip Download PDFInfo
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- CN210489647U CN210489647U CN201921758073.1U CN201921758073U CN210489647U CN 210489647 U CN210489647 U CN 210489647U CN 201921758073 U CN201921758073 U CN 201921758073U CN 210489647 U CN210489647 U CN 210489647U
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- layer
- silica gel
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- adhesive layer
- glue film
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- 239000010410 layer Substances 0.000 claims abstract description 67
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 54
- 239000000741 silica gel Substances 0.000 claims abstract description 54
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 54
- 239000012790 adhesive layer Substances 0.000 claims abstract description 38
- 238000004806 packaging method and process Methods 0.000 claims abstract description 29
- 238000009434 installation Methods 0.000 claims abstract description 24
- 239000003292 glue Substances 0.000 claims description 58
- 238000005538 encapsulation Methods 0.000 claims description 21
- 239000013078 crystal Substances 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 3
- 238000000605 extraction Methods 0.000 abstract description 9
- 239000000843 powder Substances 0.000 description 11
- 239000000463 material Substances 0.000 description 8
- 238000007723 die pressing method Methods 0.000 description 6
- 239000002184 metal Substances 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 239000000084 colloidal system Substances 0.000 description 3
- 239000011265 semifinished product Substances 0.000 description 3
- 238000007711 solidification Methods 0.000 description 3
- 230000008023 solidification Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000000149 argon plasma sintering Methods 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000004313 glare Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000011856 silicon-based particle Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
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Abstract
The utility model relates to the technical field of lighting, in particular to an LED lamp with multilayer structure chips, which comprises a bottom plate, a lower shell, an upper shell, a transparent plate and a reflecting bowl, wherein the top end surface of the bottom plate is fixedly connected with an inclined white surrounding wall layer, the inner side of the inclined white surrounding wall layer is provided with an installation cavity, the bottom of the installation cavity is provided with chips, a first silica gel packaging adhesive layer for covering all the chips is arranged in the installation cavity of the inclined white surrounding wall layer, the top of the first silica gel packaging adhesive layer is covered with a first fluorescent adhesive layer, and the top of the first fluorescent adhesive layer is covered with a second silica gel packaging adhesive layer. The bonding force between the adhesive layer and the chip is improved, the probability of bubbles on the surface of the chip is reduced, and the light extraction rate is improved.
Description
Technical Field
The utility model relates to the field of lighting technology, specifically a LED lamp with multilayer structure chip.
Background
The traditional LED packaging structure needs to adopt a support or a substrate as a support body of an LED chip, the support or the substrate is provided with a positive electrode and a negative electrode, the positive electrode and the negative electrode are electrically communicated through a metal wire, then the chip is packaged by using colloid or a mixture of fluorescent powder and the colloid, the packaging structure adopts a metal wire bonding process, and the reliability is low; the substrate is arranged, the overall structure is high in thermal resistance, and the service life of the chip is shortened.
The novel chip-scale packaging LED structure based on the flip chip is characterized in that the chip is provided with a positive electrode and a negative electrode, colloid is directly packaged on the upper surface and the side surface of the chip, and highly-reflective white wall glue is packaged on the side surface to expose the electrodes of the chip, so that the structure has the defects that the white wall angle is 90 degrees, light extraction is not facilitated, and the luminous flux of a device is reduced; the fluorescent glue is arranged around the flip chip, the fluorescent powder is directly contacted with the flip chip, and when the flip chip works under large current, high temperature is generated, so that the luminous efficiency and the reliability of the fluorescent powder under high temperature are reduced, and larger light decay and color drift occur; the fluorescent powder is solid particles, is mixed in the glue, and bubbles are easily formed around the fluorescent powder particles at the contact part with the surface of the chip, so that the adhesive force between the glue layer and the chip and the extraction rate of fluorescence are influenced. Therefore, an LED lamp having a chip with a multilayer structure is proposed to address the above problems.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a LED lamp with multilayer structure chip through changing the gummed chalk and cup wall structure, has improved light-emitting rate, reliability, the space colour homogeneity of device.
In order to achieve the above object, the utility model provides a following technical scheme:
an LED lamp with a multilayer structure chip comprises a bottom plate, a lower shell, an upper shell, a transparent plate and a reflecting bowl, wherein the lower shell is fixedly connected to the outer side of the bottom plate, the upper shell is spirally connected to the outer side of the top end face of the lower shell, the transparent plate is clamped and arranged on the inner side of the upper shell, the reflecting bowl is arranged on the bottom end face of the transparent plate, an inclined white surrounding wall layer is fixedly connected to the top end face of the bottom plate, a support ring is fixedly connected to the outer top end of the inclined white surrounding wall layer, the reflecting bowl is arranged at the top end of the support ring, an installation cavity is arranged on the inner side of the inclined white surrounding wall layer, chips are arranged at the bottom of the installation cavity, all the chips are located on the same horizontal plane, a bottom white surrounding wall layer is fixedly connected to the bottom end of the inclined white surrounding wall layer, a positive electrode installation groove and a negative electrode installation groove, install the negative electrode in the negative electrode mounting groove, all the positive terminal of chip all with positive electrode electric connection, the negative terminal of chip all with negative electrode electric connection, be equipped with the first silica gel encapsulation glue film that covers all chips in the installation cavity on white wall layer to one side, first silica gel encapsulation glue film top covers and is equipped with first fluorescence glue film, first fluorescence glue film top covers and is equipped with second silica gel encapsulation glue film, second silica gel encapsulation glue film top covers and is equipped with second fluorescence glue film, second fluorescence glue film top covers and has third silica gel encapsulation glue film, first fluorescence glue film, second silica gel encapsulation glue film, second fluorescence glue film, third silica gel encapsulation glue film are all arranged in the installation cavity on white wall layer to one side.
Preferably, the installation cavity in the inclined white wall layer is in an inverted frustum shape, and the inclined angle of the inner side surface of the inclined white wall layer is 0-40 degrees.
Preferably, the bottom end of the inner side of the mounting cavity is fixedly connected with a grid plate, and the inner side of the grid plate is uniformly provided with chips.
Preferably, the first silica gel packaging adhesive layer, the first fluorescent adhesive layer, the second silica gel packaging adhesive layer, the second fluorescent adhesive layer and the third silica gel packaging adhesive layer are formed by mould pressing in sequence.
Preferably, the grid plate is made of high-temperature-resistant plates, and the chips are arranged in the grid plate through crystal fixing glue.
Compared with the prior art, the beneficial effects of the utility model are that:
1. in the utility model, the white wall material at the bottom of the chip can increase the light reflection effect, improve the lighting effect of the device and prevent the light leakage at the bottom of the chip;
2. in the utility model, the transparent silica gel layer is directly contacted with the surface of the chip, the fluorescent layer of the LED element is not directly contacted with the flip chip, thereby avoiding light decay or color drift caused by high temperature, the glue is directly contacted with the surface of the chip, the wetting capacity of the glue on the surface of the chip is increased, the bonding force of the glue layer and the chip is improved, the probability of bubbles appearing on the surface of the chip is reduced, and the light extraction rate is improved;
3. the angle of the inclined enclosing white wall layer is 90-130 degrees, so that the light reflection is facilitated, the light extraction rate of the product can be improved, the light loss is reduced, and the light extraction rate of the product is improved; the shape of the reflecting surface inside the white wall is not limited, and can be a plane, an elliptical surface, a paraboloid and the like;
4. the silica gel layer is adopted at the uppermost layer of the structure of the utility model, and can be a pure silica gel layer or a diffusion layer; the diffusion layer is a mixture of glue and organic silicon particles, and the diffusion layer can change the light propagation path through light scattering, so that light is fully mixed, the light intensity of a light-emitting surface is more uniform and soft, and the problems of device glare and the like are avoided; the deviation of the edge chromaticity and the center chromaticity of the device is weakened, so that the chromaticity distribution of each point in the space is more uniform; the fluorescent layer can be protected from being damaged by the outside, and poor chromaticity of the lamp beads can be avoided;
5. the utility model discloses in, adopted two-layer fluorescent glue structure and non-one deck fluorescent glue, weakened the phosphor powder and to the direct reflection or the scattering effect of blue light, made the blue light pierce through first layer phosphor powder more easily and get into the silica gel layer, can restrict more blue light at the silica gel layer, through effects such as reflection, scattering, the phosphor powder is aroused to the blue light in the make full use of silica gel layer, improves the luminous efficacy of device, practices thrift the quantity of phosphor powder, has reduced the device cost.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
fig. 2 is a schematic diagram of the structure of the grid plate of fig. 1 according to the present invention.
In the figure: 1-bottom plate, 2-lower shell, 3-upper shell, 4-transparent plate, 5-reflector, 6-inclined wall layer, 7-support ring, 8-chip, 9-bottom wall layer, 10-positive electrode installation groove, 11-negative electrode installation groove, 12-positive electrode, 13-negative electrode, 14-first silica gel encapsulation adhesive layer, 15-first silica gel layer, 16-second silica gel encapsulation adhesive layer, 17-second silica gel layer, 18-third silica gel encapsulation adhesive layer and 19-grid plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-2, the present invention provides a technical solution:
an LED lamp with a multilayer structure chip comprises a bottom plate 1, a lower shell 2, an upper shell 3, a transparent plate 4 and a reflecting bowl 5, wherein the outer side of the bottom plate 1 is fixedly connected with the lower shell 2, the outer side of the top end surface of the lower shell 2 is spirally connected with the upper shell 3, the inner side of the upper shell 3 is clamped with the transparent plate 4, the bottom end surface of the transparent plate 4 is provided with the reflecting bowl 5, the top end surface of the bottom plate 1 is fixedly connected with an inclined white surrounding wall layer 6, the top end of the outer side of the inclined white surrounding wall layer 6 is fixedly connected with a support ring 7, the top end of the support ring 7 is provided with the reflecting bowl 5, the inner side of the inclined white surrounding wall layer 6 is provided with an installation cavity, the bottom of the installation cavity is provided with chips 8, all the chips 8 are positioned on the same horizontal plane, the bottom end of the inclined white surrounding wall layer 6 is fixedly connected with a bottom white wall layer 9, and the bottom white wall layer 9, the utility model discloses a chip mounting structure, including positive electrode mounting groove 10, positive electrode 12 is installed to positive electrode mounting groove 10 inboard, install negative electrode 13 in the negative electrode mounting groove 11, all the positive terminal of chip 8 all with positive electrode 12 electric connection, the negative terminal of chip 8 all with negative electrode 13 electric connection, be equipped with the first silica gel encapsulation glue film 14 that covers all chips 8 in the installation cavity of oblique enclosure white wall layer 6, the first silica gel encapsulation glue film 14 top covers and is equipped with first fluorescence glue film 15, adopts transparent silica gel layer and chip surface direct contact, and LED component fluorescent layer is direct and flip chip contact not, has avoided producing light decay or look to float because of high temperature, glue and chip surface direct contact, increases the wet ability of glue on chip surface, improves the cohesion of glue film and chip, reduces the probability that the bubble appears in chip surface, improves the extraction rate of light, first fluorescence glue film 15 top covers and is equipped with second silica gel encapsulation glue film 16, the top of the second silica gel packaging adhesive layer 16 is covered with a second fluorescent adhesive layer 17, the top of the second fluorescent adhesive layer 17 is covered with a third silica gel packaging adhesive layer 18, the first fluorescent adhesive layer 15, the second silica gel packaging adhesive layer 16, the second fluorescent adhesive layer 17 and the third silica gel packaging adhesive layer 18 are all arranged in the installation cavity of the inclined white surrounding wall layer 6, the light transmission path can be changed through light scattering on the layers, light is fully mixed, the light intensity of a light-emitting surface is more uniform and soft, and the problems of device glare and the like are avoided; the deviation of the edge chromaticity and the center chromaticity of the device is weakened, so that the chromaticity distribution of each point in the space is more uniform; the fluorescent layer can be protected from being damaged by the outside, and poor chromaticity of the lamp beads can be avoided.
The installation cavity in the white wall layer 6 of enclosing to one side is the setting of radius platform form, and the inclination of the white wall layer 6 medial surface of enclosing to one side is 0 ~ 40, more does benefit to the reflection of light, can promote the light extraction rate of product, reduces light loss, improves the light extraction rate of product, the inboard bottom fixedly connected with grid plate 19 of installation cavity, the inboard even chip 8 of installing of grid plate 19, the effectual even of having guaranteed the light source, first silica gel encapsulation glue film 14, first fluorescence glue film 15, second silica gel encapsulation glue film 16, second fluorescence glue film 17, third silica gel encapsulation glue film 18 mould pressing in proper order form, and the effectual off-the-shelf quality of having guaranteed of this kind of processing technology, grid plate 19 comprises high temperature resistant plate material, chip 8 is installed in grid plate 19 through solid crystal glue, and this kind of setting guarantees going on of high temperature processing.
The production process comprises the following steps: a. crystal solidification, namely manufacturing a grid plate 19 for positioning on the surface of a high-temperature resistant material, and then fixing a light-emitting chip 8 with the high-temperature resistant material at the top of the inner side of the grid plate 19 through crystal solidification glue, wherein the high-temperature resistant material is a metal plate, and the crystal solidification glue is pyrolytic glue;
b. preparing fluorescent glue from the fluorescent powder and the silica gel according to a certain proportion, and preparing silica gel packaging glue from the silica gel and the diffusion powder according to a certain proportion;
c. die pressing, namely die pressing a first silica gel packaging adhesive layer 14 on the top surface and the side surface of the light-emitting chip 8 by using a die with a special structure on the inner wall, die pressing a prepared first fluorescent adhesive layer 15 on the surface of the first silica gel packaging adhesive layer 14, die pressing a second silica gel packaging adhesive layer 16 on the surface of the first fluorescent adhesive layer 15, die pressing a second fluorescent adhesive layer 17 on the surface of the second silica gel packaging adhesive layer 16, and die pressing a third silica gel packaging adhesive layer 18 on the surface of the second fluorescent adhesive layer 17; the molding temperature is 80-150 ℃, the molding pressure is 15-120kgf/m2, and the molding time is 2-10 min;
d. c, transferring the semi-finished product obtained in the step c to the surface of another high-temperature-resistant material, wherein a boss with the height of 1-200 mu m is arranged on the surface of the high-temperature-resistant material corresponding to the electrode position of the sapphire LED chip;
e. d, molding a white wall, namely molding an inclined surrounding white wall layer 6 and a bottom white wall layer 9 on the semi-finished product obtained in the step d;
f. and e, curing, baking the semi-finished product obtained in the step e at a high temperature, curing the silica gel packaging adhesive layer, the fluorescent adhesive layer and the white wall glue to obtain the packaging structure, taking the packaging structure down from a high-temperature-resistant material when the packaging structure is applied, and directly welding the packaging structure on the printed circuit board with the bonding pad through a metal solder without adopting a metal wire.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. The utility model provides a LED lamp with multilayer structure chip, includes bottom plate (1), lower casing (2), goes up casing (3), transparent plate (4) and reflector (5), its characterized in that: the outer side of the bottom plate (1) is fixedly connected with a lower shell (2), the outer side of the top end face of the lower shell (2) is spirally connected with an upper shell (3), the inner side of the upper shell (3) is clamped with a transparent plate (4), the bottom end face of the transparent plate (4) is provided with a light reflecting bowl (5), the top end face of the bottom plate (1) is fixedly connected with an inclined white surrounding wall layer (6), the top end of the outer side of the inclined white surrounding wall layer (6) is fixedly connected with a support ring (7), the top end of the support ring (7) is provided with the light reflecting bowl (5), the inner side of the inclined white surrounding wall layer (6) is provided with an installation cavity, the bottom of the installation cavity is provided with chips (8), all the chips (8) are positioned on the same horizontal plane, the bottom end of the inclined white surrounding wall layer (6) is fixedly connected with a bottom white surrounding wall layer (9), and the bottom white wall layer (9) is provided with a positive electrode installation, positive electrode (12) are installed to positive electrode mounting groove (10) inboard, install negative electrode (13) in negative electrode mounting groove (11), all the positive terminal of chip (8) all with positive electrode (12) electric connection, the negative terminal of chip (8) all with negative electrode (13) electric connection, be equipped with first silica gel encapsulation glue film (14) that covers all chip (8) in the installation cavity of enclosing white wall layer (6) to one side, first silica gel encapsulation glue film (14) top cover is equipped with first fluorescence glue film (15), first fluorescence glue film (15) top cover is equipped with second silica gel encapsulation glue film (16), second silica gel encapsulation glue film (16) top cover is equipped with second fluorescence glue film (17), second fluorescence glue film (17) top covers has third silica gel encapsulation glue film (18), and the first fluorescent glue layer (15), the second silica gel packaging glue layer (16), the second fluorescent glue layer (17) and the third silica gel packaging glue layer (18) are arranged in the installation cavity of the inclined white surrounding wall layer (6).
2. The LED lamp with the multi-layer chip as claimed in claim 1, wherein: the installation cavity in the oblique white wall layer (6) is in the shape of an inverted circular truncated cone, and the inclined angle of the inner side surface of the oblique white wall layer (6) is 0-40 degrees.
3. The LED lamp with the multi-layer chip as claimed in claim 1, wherein: the inner side bottom end of the mounting cavity is fixedly connected with a grid plate (19), and the inner side of the grid plate (19) is uniformly provided with chips (8).
4. The LED lamp with the multi-layer chip as claimed in claim 1, wherein: the first silica gel packaging adhesive layer (14), the first fluorescent adhesive layer (15), the second silica gel packaging adhesive layer (16), the second fluorescent adhesive layer (17) and the third silica gel packaging adhesive layer (18) are formed through mould pressing in sequence.
5. The LED lamp with the multi-layer chip as claimed in claim 3, wherein: the grating plate (19) is made of high-temperature-resistant plates, and the chip (8) is arranged in the grating plate (19) through crystal fixing glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921758073.1U CN210489647U (en) | 2019-10-20 | 2019-10-20 | LED lamp with multilayer structure chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921758073.1U CN210489647U (en) | 2019-10-20 | 2019-10-20 | LED lamp with multilayer structure chip |
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| Publication Number | Publication Date |
|---|---|
| CN210489647U true CN210489647U (en) | 2020-05-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921758073.1U Active CN210489647U (en) | 2019-10-20 | 2019-10-20 | LED lamp with multilayer structure chip |
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| Country | Link |
|---|---|
| CN (1) | CN210489647U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115347103A (en) * | 2022-09-19 | 2022-11-15 | 深圳市宇亮光电技术有限公司 | Non-bleaching lamp bead and preparation method thereof |
-
2019
- 2019-10-20 CN CN201921758073.1U patent/CN210489647U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115347103A (en) * | 2022-09-19 | 2022-11-15 | 深圳市宇亮光电技术有限公司 | Non-bleaching lamp bead and preparation method thereof |
| CN115347103B (en) * | 2022-09-19 | 2023-05-26 | 深圳市宇亮光电技术有限公司 | Colorless floating lamp bead and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: LED lamp with multilayer structure chip Effective date of registration: 20210819 Granted publication date: 20200508 Pledgee: Gaoxin sub branch of Bank of Changsha Co.,Ltd. Pledgor: HUNAN PUSISAT OPTO TECHNOLOGY Co.,Ltd. Registration number: Y2021430000038 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20231220 Granted publication date: 20200508 Pledgee: Gaoxin sub branch of Bank of Changsha Co.,Ltd. Pledgor: HUNAN PUSISAT OPTO TECHNOLOGY Co.,Ltd. Registration number: Y2021430000038 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: An LED light with a multi-layer structure chip Effective date of registration: 20231225 Granted publication date: 20200508 Pledgee: Gaoxin sub branch of Bank of Changsha Co.,Ltd. Pledgor: HUNAN PUSISAT OPTO TECHNOLOGY Co.,Ltd. Registration number: Y2023980073696 |