CN218827226U - High-heat-dissipation metal-packaged light-emitting diode - Google Patents

Abstract

The utility model discloses a high heat dissipation metal package emitting diode, comprising a base plate, be equipped with the shell on the bottom plate, the lower part of shell is equipped with radiator unit, and radiator unit includes a set of card strip, radiating ring and fin, and the card strip is established at the radiating ring inboard, and the fin is established in the radiating ring outside, and the radiating ring card cover is on the shell, the inside diode chip that is equipped with of shell, and the both ends of diode chip are equipped with the heat-conducting plate respectively, the utility model discloses the shell adopts metal material, compares in traditional plastic casing, and metal material has a higher anti vibration nature, diamagnetism, can make the plastic envelope diode in the in-service use, can the efficient heat dissipation, and the radiating effect is strong, and the radiating rate is fast for the plastic envelope diode can not damage because of generating heat in long-time working process, has promoted the quality of plastic envelope diode, has guaranteed the life of plastic envelope diode.

Description

High-heat-dissipation metal-packaged light-emitting diode

Technical Field

The utility model relates to a diode field specifically is a high heat dissipation metal package emitting diode.

Background

Diodes are one of the most popular semiconductor devices, and are widely used, and particularly, in various electronic circuits, diodes are reasonably connected with components such as resistors, capacitors, inductors and the like to form circuits with different functions, so that various functions such as alternating current rectification, modulation signal detection, amplitude limiting and clamping, and power supply voltage stabilization can be realized. The trace of diodes, which are semiconductor components and originally used mostly as indicator lights, display panels, etc., can be found in both common radio circuits and other household appliances or industrial control circuits, and also as illumination with the advent of white LEDs. With the widespread use of diodes, people have higher and higher requirements on the diodes, especially on the heat dissipation performance of the diodes.

The conventional diode is not provided with a heat radiating device, a large amount of heat can be generated in a high-power diode when high current passes through the diode, the heat radiating performance of the common diode is very poor, the service life of the diode is greatly shortened, the diode is damaged, and a shell is broken or even a chip in the diode is influenced.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

The to-be-solved technical problem of the utility model is: the conventional diode is not provided with a heat radiating device, a large amount of heat can be generated in a high-power diode when high current passes through the diode, the heat radiating performance of the common diode is very poor, the service life of the diode is greatly shortened, the diode is damaged, and a shell is broken or even a chip in the diode is influenced.

(II) technical scheme

In order to solve the above problem, the utility model provides a following technical scheme:

a high heat dissipation metal package light emitting diode, a high heat dissipation metal package light emitting diode which characterized in that: the LED lamp comprises a base plate, be equipped with the shell on the bottom plate, the lower part of shell is equipped with radiator unit, radiator unit includes a set of card strip, radiating ring and fin, the card strip is established the radiating ring is inboard, the fin is established the radiating ring outside, the radiating ring card cover is in on the shell, the inside diode chip that is equipped with of shell, the both ends of diode chip are equipped with the heat-conducting plate respectively, the diode chip with use between the shell the heat-conducting plate is connected, diode chip lower part is equipped with anodal pin and negative pole pin.

Further, the shell is of a hollow cylindrical metal structure, heat dissipation holes are formed in the lower portion of the shell, and the heat dissipation holes surround the lower portion of the shell for one circle.

Furthermore, the lower part of shell runs through the radiating ring, the shell with be fixed connection between the radiating ring, and the junction is equipped with the sealing rubber circle.

Furthermore, the anode pin and the cathode pin are arranged in parallel, one end of the anode pin and one end of the cathode pin are connected with the diode chip, and the other end of the anode pin and the other end of the cathode pin penetrate through the bottom plate.

Furthermore, the radiating fin and the radiating ring are both made of high-radiating materials.

Furthermore, a limit groove is arranged between the heat dissipation holes and is clamped with the clamping strip

Furthermore, the top of the shell is of a hemispherical structure and is made of transparent insulating materials

Further, the radiating fins are arranged on the surface of the radiating ring in a circumferential arrangement mode

(III) advantageous effects

The utility model has the advantages that:

the utility model discloses the shell adopts metal material, compares in traditional plastic casing, and metal material has a higher vibration resistance, and diamagnetism can make the plastic envelope diode in the in-service use, can the efficient heat dissipation, and the radiating effect is strong, and the radiating rate is fast for the plastic envelope diode can not damage because of generating heat in long-time working process, has promoted the quality of plastic envelope diode, has guaranteed the life of plastic envelope diode.

Drawings

Fig. 1 is a perspective view of the present invention;

FIG. 2 is a partial view of the heat sink assembly of the present invention;

FIG. 3 is a partial view of the housing of the present invention;

FIG. 4 is another cross-sectional view of the present invention;

the labels in the figure are: 1-bottom plate, 2-shell, 3-heat dissipation component, 31-clamping strip, 32-heat dissipation ring, 33-heat dissipation sheet, 4-diode chip, 5-heat conduction plate, 6-anode pin, 7-cathode pin, 8-heat dissipation hole and 9-limit groove.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

Referring to fig. 1-4, a high heat dissipation metal-packaged led includes a bottom plate 1, a housing 2 is disposed on the bottom plate 1, a heat dissipation assembly 3 is disposed at a lower portion of the housing 2, the heat dissipation assembly 3 includes a set of clamping strips 31, a heat dissipation ring 32 and heat dissipation fins 33, the clamping strips 31 are disposed at an inner side of the heat dissipation ring 32, the heat dissipation fins 33 are disposed at an outer side of the heat dissipation ring 32, the heat dissipation ring 32 is clamped on the housing 2, a diode chip 4 is disposed inside the housing 2, heat conduction plates 5 are disposed at two ends of the diode chip 4, the diode chip 4 is connected to the housing 2 by the heat conduction plate 5, and a positive pin 6 and a negative pin 7 are disposed at a lower portion of the diode chip 4.

Further, the housing 2 is a hollow cylindrical metal structure, the lower portion of the housing 2 is provided with heat dissipation holes 8, the heat dissipation holes 8 surround the lower portion of the housing 2 for one circle, and the housing 2 made of metal material has higher vibration resistance, diamagnetism and high temperature resistance compared with a traditional plastic housing, and can better protect the diode chip 2 therein, the lower portion of the housing 2 penetrates through the heat dissipation ring 32, the housing 2 and the heat dissipation ring 32 are fixedly connected, and a sealing rubber ring is arranged at the joint, the heat dissipation ring 32 is clamped at the heat dissipation holes 8 at the lower portion of the housing 2, when the diode starts to work, the diode chip 4 can generate heat and is not easy to dissipate heat, the heat dissipation holes 8 arranged at the bottom can enable the heat to reach the heat dissipation ring 32 from the heat dissipation holes 8, through heat dissipation, the heat dissipation holes are arranged in parallel between the positive pin 6 and the negative pin, one end of the positive pin 6 and the negative pin 7 is connected with the diode chip 4, the other end of the diode chip 4 penetrates through the bottom plate 1, the heat dissipation fins 33 and the heat dissipation ring 32 are made of high heat dissipation materials, the heat dissipation speed of the diode is increased, the spacing groove 9 is arranged between the housing 8, the spacing groove 9 is clamped with the clamping strip 31, the top of the housing 2, the heat dissipation hole 32, the top of the heat dissipation ring 32 is arranged in a semi-sphere, and the heat dissipation ring 32, and the heat dissipation holes are arranged in a transparent heat dissipation holes, and the heat dissipation holes 32, so that the heat dissipation holes are arranged in a heat dissipation holes 32, and the spacing groove is not blocked in a way, and the heat dissipation holes 32 is formed in the heat dissipation holes 32, and the heat dissipation holes 32 is formed in a manner, and the spacing groove 31 is not blocked.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims (8)

1. A high heat dissipation metal package LED is characterized in that: including bottom plate (1), be equipped with shell (2) on bottom plate (1), the lower part of shell (2) is equipped with radiator unit (3), radiator unit (3) are including a set of card strip (31), radiating ring (32) and fin (33), card strip (31) are established radiating ring (32) are inboard, fin (33) are established the radiating ring (32) outside, radiating ring (32) cutting ferrule is in on shell (2), the inside diode chip (4) that is equipped with of shell (2), the both ends of diode chip (4) are equipped with heat-conducting plate (5) respectively, diode chip (4) with use between shell (2) heat-conducting plate (5) are connected, diode chip (4) lower part is equipped with anodal pin (6) and negative pole pin (7).

2. The led of claim 1, wherein: the shell (2) is of a hollow cylindrical metal structure, heat dissipation holes (8) are formed in the lower portion of the shell (2), and the heat dissipation holes (8) encircle the lower portion of the shell (2) for one circle.

3. The led of claim 1, wherein: the lower part of shell (2) runs through heat dissipation ring (32), shell (2) with be fixed connection between heat dissipation ring (32), and the junction is equipped with the sealing rubber circle.

4. The high heat dissipation metal-encapsulated light emitting diode of claim 3, wherein: the LED chip is characterized in that the anode pin (6) and the cathode pin (7) are arranged in parallel, one end of the anode pin (6) and one end of the cathode pin (7) are connected with the diode chip (4), and the other end of the anode pin and the cathode pin penetrate through the bottom plate (1).

5. The led of claim 1, wherein: the radiating fins (33) and the radiating ring (32) are both made of high-radiating materials.

6. The led of claim 2, wherein: and a limiting groove (9) is arranged between the heat dissipation holes (8), and the limiting groove (9) is clamped with the clamping strip (31).

7. The high heat dissipation metal-encapsulated light emitting diode of claim 1, wherein: the top of the shell (2) is of a hemispherical structure, and the top of the shell (2) is made of transparent insulating materials.

8. The led of claim 1, wherein: the radiating fins (33) are arranged on the surface of the radiating ring (32) in a circumferential arrangement mode.

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