CN116347749A - PCB heat radiation structure and relevant power supply equipment and electronic equipment - Google Patents
PCB heat radiation structure and relevant power supply equipment and electronic equipment Download PDFInfo
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- CN116347749A CN116347749A CN202310233537.1A CN202310233537A CN116347749A CN 116347749 A CN116347749 A CN 116347749A CN 202310233537 A CN202310233537 A CN 202310233537A CN 116347749 A CN116347749 A CN 116347749A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The embodiment of the invention discloses a PCB heat dissipation structure, a related power supply device and an electronic device, wherein the structure comprises a main board and a ceramic substrate, the main board comprises a board main body, electronic components, first metal pieces and second metal pieces, one first metal piece is arranged corresponding to one second metal piece, the electronic components arranged on a first board surface of the board main body are connected with the first metal pieces, the main board is provided with first heat conduction holes which correspondingly penetrate through the first metal pieces, the board main body and the second metal pieces, the surfaces of the first heat conduction holes are attached with first metal connecting pieces, the first metal connecting pieces are connected with the first metal pieces and the second metal pieces, the ceramic substrate comprises a ceramic substrate, third metal pieces and fourth metal pieces, the third metal pieces are arranged on the first board surface of the ceramic substrate and are connected with the second metal pieces, and the fourth metal pieces are arranged on the second board surface of the ceramic substrate and are used for being connected with a radiator. The PCB heat radiation structure that this application provided radiating effect is good.
Description
Technical Field
The application relates to the technical field of electronic circuits, in particular to a PCB heat dissipation structure, related power supply equipment and electronic equipment.
Background
In order to improve the radiating effect of the PCB, the PCB is prevented from being damaged due to overhigh temperature, and most of the current PCB structures are generally connected with a radiator so as to cool the PCB. In the related art, a heat conductive insulating adhesive is generally used to connect an electronic component of a PCB with a heat sink, so as to ensure a heat dissipation effect of the PCB. However, the heat conducting insulating glue has limited heat conducting effect, and the heat radiating effect of the electronic component is not high enough.
Disclosure of Invention
The embodiment of the application provides a PCB heat radiation structure and power supply equipment, and aims to improve the heat radiation effect of a PCB.
In a first aspect, the present application provides a PCB heat dissipation structure, wherein the PCB heat dissipation structure includes:
the main board comprises a board main body, electronic components, first metal pieces and second metal pieces, wherein the first metal pieces and the second metal pieces are respectively arranged on two side board surfaces of the board main body, which are opposite to each other, the first metal pieces are arranged corresponding to the second metal pieces, the board surface for defining the board main body to be connected with the first metal pieces is the first board surface of the board main body, the board surface for defining the board main body to be connected with the second metal pieces is the second board surface of the board main body, the electronic components are arranged on the first board surface of the board main body, the electronic components arranged on the first board surface of the board main body are connected with the first metal pieces, first heat conduction holes which correspondingly penetrate through the first metal pieces, the board main body and the second metal pieces are formed, and first metal connecting pieces are attached to the surfaces of the first heat conduction holes and are connected with the first metal pieces and the second metal pieces; and
the ceramic substrate comprises a ceramic substrate, a third metal piece and a fourth metal piece, wherein the third metal piece is arranged on a first plate surface of the ceramic substrate and is connected with the second metal piece, the fourth metal piece is arranged on a second plate surface of the ceramic substrate and is used for being connected with a radiator, the first plate surface of the ceramic substrate faces towards the plate surface of the plate main body in two plate surfaces of the ceramic substrate, and the second plate surface of the ceramic substrate is the plate surface deviating from the plate main body in two plate surfaces of the ceramic substrate. Optionally, the second board surface of the board main body is also provided with the electronic component, and the PCB heat dissipation structure further includes:
the connecting plate comprises a connecting main plate, a fifth metal piece and a sixth metal piece, wherein the fifth metal piece is arranged on a first plate surface of the connecting main plate and is connected with the second metal piece, the sixth metal piece is arranged on a second plate surface of the connecting main plate and is connected with the third metal piece, the fifth metal piece is arranged corresponding to the sixth metal piece, a second heat conduction hole which correspondingly penetrates through the fifth metal piece, the connecting main plate and the sixth metal piece is formed in the connecting plate, a second metal connecting piece is attached to the surface of the second heat conduction hole, the second metal connecting piece is connected with the fifth metal piece and the sixth metal piece, the first plate surface of the connecting main plate is the plate surface facing the ceramic substrate in the two plate surfaces of the connecting main plate, and the second plate surface of the connecting main plate is the plate surface facing the ceramic substrate in the two plate surfaces of the connecting main plate;
the connecting main board is provided with a containing groove, and the electronic component connected to the second board surface of the board main body is positioned in the containing groove.
Optionally, at least two accommodating grooves are provided, and one electronic component arranged on the second plate surface of the plate main body is positioned in one accommodating groove.
Optionally, the accommodating groove is disposed through the connection main board.
Optionally, if the electronic component disposed on the second surface of the plate body and the electronic component disposed on the first surface of the plate body are disposed in the same electrical circuit, the electronic component disposed on the second surface of the plate body is connected to the second metal member.
Optionally, the second plate surface of the plate main body is further provided with a seventh metal piece, and the seventh metal piece is connected with the fifth metal piece;
if the electronic component provided on the second plate surface of the plate main body and the electronic component provided on the first plate surface of the plate main body are located in different electric loops, the electronic component provided on the second plate surface of the plate main body is connected to the seventh metal member.
Optionally, the first metal piece includes connecting portion and at least one heat conduction portion, first heat conduction hole corresponds runs through heat conduction portion the board main part with the setting of second metal piece, the electronic components of locating the first face includes a plurality of pins, a pin with one connecting portion of first metal piece is connected.
Optionally, one of the first metal pieces is connected with at least two electronic components arranged on the first plate surface of the plate main body.
Optionally, the fourth metal pieces are provided in plurality and are arranged on the second plate surface of the ceramic substrate at intervals.
In a second aspect, the present application provides a power supply apparatus, which includes a heat sink and the PCB heat dissipation structure described above.
The technical scheme of the invention provides a PCB heat dissipation structure, which comprises a main board and a ceramic substrate, wherein the main board comprises a board main body, electronic components, a first metal piece and a second metal piece, the main board is provided with a first heat conduction hole which is arranged in a penetrating way, and a first metal connecting piece attached to the surface of the first heat conduction hole is connected with the first metal piece and the second metal piece. The ceramic substrate comprises a ceramic substrate, a third metal piece and a fourth metal piece, wherein the third metal piece is connected with the second metal piece, and the fourth metal piece is connected with the radiator. The heat transfer process of the PCB heat dissipation structure is as follows: the heat energy generated by the operation of the electronic component flows to the first metal piece through the circuit, then is transferred to the second metal piece positioned on the second plate surface of the plate main body through the first metal connecting piece attached to the surface of the first heat conduction hole, and then is transferred to the third metal piece through the second metal piece, so that the heat energy on the third metal piece is transferred to the fourth metal piece through the ceramic substrate, and finally, the fourth metal piece is transferred to the radiator to radiate heat. The whole heat dissipation process of the PCB heat dissipation structure provided by the application adopts metal and ceramic substrates to conduct heat, and is high in heat conduction efficiency and good in heat dissipation effect. And the ceramic substrate is connected with the radiator, so that the electronic components and the radiator can be effectively isolated, and the electronic components and the radiator are prevented from being electrically conducted.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a PCB heat dissipation structure provided in an embodiment of the present application;
fig. 2 is a schematic cross-sectional structure of a PCB heat dissipation structure according to an embodiment of the present disclosure;
fig. 3 is an exploded view of the PCB heat dissipation structure shown in fig. 2;
fig. 4 is a schematic structural diagram of a second board surface of the PCB heat dissipation structure shown in fig. 1;
fig. 5 is a schematic structural diagram of a first board surface of the display connection board in the PCB heat dissipation structure shown in fig. 1;
fig. 6 is a schematic structural diagram of a second board surface of the display connection board in the PCB heat dissipation structure shown in fig. 1;
FIG. 7 is a schematic diagram of a first board surface of the ceramic substrate in the PCB heat dissipation structure shown in FIG. 1;
fig. 8 is a schematic structural diagram showing a second board surface of the ceramic substrate in the PCB heat dissipation structure shown in fig. 1.
Reference numerals illustrate:
100. a PCB heat dissipation structure; 10. a main board; 10a, a first heat conduction hole; 10b, through holes; 11. a plate main body; 13. an electronic component; 15. a first metal piece; 17. a second metal piece; 19. a first metal connection; 21. a seventh metal piece; 30. a connecting plate; 30a, second heat conduction holes; 30b, a receiving groove; 31. connecting a main board; 33. a fifth metal member; 35. a sixth metal piece; 37. a second metal connector; 50. a ceramic substrate; 51. a ceramic substrate; 53. a third metal piece; 55. a fourth metal piece; 70a, connecting holes.
Detailed Description
In order to facilitate understanding of the present application, the following detailed description of the specific embodiments of the present application will be described in connection with the accompanying drawings, so that the foregoing objects, features, and advantages of the present application will be more readily understood. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application, the preferred embodiments of which are shown in the accompanying drawings. This application may, however, be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete. This application is intended to be limited to the details of the particular embodiments disclosed herein since it is to be understood that modifications may be made by those skilled in the art without departing from the spirit of the present application.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the meaning of "plurality" is at least two, such as two, three, etc., unless explicitly defined otherwise. In the description of the present application, the meaning of "several" means at least one, such as one, two, etc., unless explicitly defined otherwise.
PCB boards generally include a substrate-type circuit structure and a multi-layer-type circuit structure. The substrate type circuit structure can only be used for arranging a circuit on one side surface of the substrate and is connected with the electronic component. Because the substrate-type circuit structure cannot manufacture a complex circuit system, the power density of the substrate-type circuit structure is difficult to increase. In contrast, the multi-layer board type circuit structure can be provided with multi-layer circuits, and electronic components can be connected and installed on the board surfaces on two opposite sides of the substrate to manufacture and produce products with high power density.
In the related art, in order to improve the radiating effect of the PCB, the PCB is prevented from being damaged due to overhigh temperature, and the PCB is connected with the radiator through the heat conduction insulating glue no matter the PCB is of a substrate type circuit structure or a multi-layer type circuit structure, so that the radiating effect of the PCB is ensured. However, the heat conducting insulating glue has limited heat conducting effect, and the heat radiating effect of the electronic component is not high enough.
In view of the above problems, referring to fig. 1 to 8, the present application provides a PCB heat dissipation structure 100 and a power supply apparatus. The PCB heat dissipation structure 100 according to the embodiment of the present application may be applied to electronic devices such as handheld devices, vehicle-mounted devices, wearable devices, and computer devices, and may also be applied to structures such as power supply devices or inverters.
Referring to fig. 1 to 8, the present application provides a PCB heat dissipation structure 100, where the PCB heat dissipation structure 100 includes a main board 10 and a ceramic substrate 50, the main board 10 includes a board main body 11, electronic components 13, first metal pieces 15, and second metal pieces 17, the first metal pieces 15 and the second metal pieces 17 are respectively disposed on two opposite side boards of the board main body 11, and the first metal pieces 15 are disposed corresponding to the second metal pieces 17, the board surface defining the board main body 11 to be connected with the first metal pieces 15 is a first board surface of the board main body 11, the board surface of the board main body 11 to be connected with the second metal pieces 17 is a second board surface of the board main body 11, the first board surface of the board main body 11 is provided with electronic components 13, the electronic components 13 disposed on the first board surface of the board main body 11 are connected with the first metal pieces 15, the main board 10 is formed with a first heat conduction hole 10a penetrating through the first metal member 15, the board main body 11 and the second metal member 17 correspondingly, a first metal connecting member 19 is attached to the surface of the first heat conduction hole 10a, the first metal connecting member 19 connects the first metal member 15 and the second metal member 17, the ceramic substrate 50 comprises a ceramic substrate 51, a third metal member 53 and a fourth metal member 55, the third metal member 53 is arranged on a first board surface of the ceramic substrate 50 and connected with the second metal member 17, the fourth metal member 55 is arranged on a second board surface of the ceramic substrate 51 and is used for connection with a heat sink, the first board surface of the ceramic substrate 51 is the board surface facing the board main body 11 of the two board surfaces of the ceramic substrate 51, and the second board surface of the ceramic substrate 51 is the board surface facing away from the board main body 11 of the two board surfaces of the ceramic substrate 51.
The first metal piece 15, the second metal piece 17, the first metal connecting piece 19, the third metal piece 53, and the fourth metal piece 55 may be made of metal materials such as copper, aluminum, or gold, and the metal materials have excellent heat conducting performance, so that the efficiency and the effect of transferring the heat energy generated by the electronic component 13 to the radiator can be effectively improved. In the present embodiment, the materials of the first metal member 15, the second metal member 17, the first metal connecting member 19, the third metal member 53, and the fourth metal member 55 may be copper, so as to reduce the manufacturing cost of the PCB heat dissipation structure 100.
The shape of the first metal member 15 and the second metal member 17 may be any shape such as a circle, a square, or other irregular shape, which is not limited herein. The shapes of the first metal piece 15 and the second metal piece 17 may be specifically designed according to the configuration of the circuit of the motherboard 10, for example, the configuration may be provided at a position where the motherboard 10 does not form a circuit or at a position where the motherboard 10 does not mount the electronic component 13, so long as the connection with the electronic component 13 is ensured and the operation of the circuit system is not affected. The shapes of the first metal piece 15 and the second metal piece 17 can be the same or different, and the first metal connecting piece 19 can be specifically set according to actual requirements, so that the first metal piece 15 and the second metal piece 17 can be connected to realize heat conduction. The number of the first metal members 15 and the second metal members 17 may be set according to the circuit system of the main board 10, and is not limited herein. The number of the second metal pieces 17 can be set corresponding to the number of the first metal pieces 15, so that the first metal pieces 15 are correspondingly connected with the second metal pieces 17, the cross conduction of circuits is avoided, and the reliability of the circuit system of the main board 10 is ensured.
Wherein the electronic components 13 connected in different electrical circuits are connected with different first metal pieces 15 to avoid circuit cross-talk.
The motherboard 10 may be a power board, and is used for installing the electronic components 13 and main circuit systems, and all functions of the circuit systems can be realized by a single motherboard 10. The motherboard 10 may be a substrate-type circuit structure or a multi-layer board-type circuit structure. When the motherboard 10 is in a substrate circuit structure, the electronic components 13 on the motherboard 10 may be all mounted on the first board surface of the board main body 11, that is, the board surface of the board main body 11 facing away from the ceramic substrate 51. In an embodiment, when the electronic components 13 are all disposed on the first surface of the board body 11, the main board 10 and the ceramic substrate 50 may be directly connected. At this time, the position of the second metal member 17 may be set corresponding to the position of the third metal member 53 to be positioned when the main board 10 and the ceramic substrate 50 are assembled while the main board 10 and the ceramic substrate 50 are connected, thereby ensuring the accuracy of the assembly position of the PCB heat dissipation structure 100 and improving the convenience of the assembly of the PCB heat dissipation structure 100. When the main board 10 is a multi-layer board type circuit structure capable of producing a high-power density product, electronic components 13 can be mounted on two opposite board surfaces of the board main body 11, and at least one side of the board main body 11 connected with the electronic components 13 is connected with a ceramic substrate 50.
The ceramic substrate 50 may be an insulating and heat-conducting material such as alumina (AlO) ceramic or aluminum nitride (AlN) ceramic, so as to ensure the heat-conducting and insulating effects of the ceramic substrate 50. The ceramic substrate 50 has high thermal conductivity, and can ensure the efficiency of heat energy transfer between the third metal piece 53 and the fourth metal piece 55, thereby ensuring the heat dissipation effect of the electronic component 13 in the whole heat dissipation process. In addition, the ceramic substrate 50 has high temperature resistance, and the problem of damage due to the excessively high temperature of the transferred heat energy can be avoided. Meanwhile, the ceramic substrate 50 is also an electrical insulator, so that electrical conduction between the circuit of the motherboard 10 and the heat sink can be effectively prevented. In addition, the ceramic substrate 50 has good radiation resistance, and the ceramic substrate 50 is adopted in the PCB heat dissipation structure 100 to reduce the influence of the external environment on the performance of the motherboard 10.
The technical scheme of the invention provides a PCB heat dissipation structure 100, the PCB heat dissipation structure 100 comprises a main board 10 and a ceramic substrate 50, the main board 10 comprises a board main body 11, an electronic component 13, a first metal piece 15 and a second metal piece 17, the main board 10 is provided with a first heat conduction hole 10a which is arranged in a penetrating way, and a first metal connecting piece 19 attached to the surface of the first heat conduction hole 10a is connected with the first metal piece 15 and the second metal piece 17. The ceramic substrate 50 includes a ceramic substrate 51, a third metal piece 53, and a fourth metal piece 55, the third metal piece 53 being connected to the second metal piece 17, the fourth metal piece 55 being connected to the heat sink. The heat transfer process of the PCB heat dissipation structure 100 is: the heat energy generated by the operation of the electronic component 13 will flow to the first metal member 15 through the circuit, then be transferred to the second metal member 17 located on the second plate surface of the plate main body 11 through the first metal connecting member 19 attached to the surface of the first heat conduction hole 10a, and then be transferred to the third metal member 53 through the second metal member 17, so that the heat energy on the third metal member 53 is transferred to the fourth metal member 55 through the ceramic substrate 51, and finally be transferred to the radiator through the fourth metal member 55 for heat dissipation. The metal and ceramic substrate 51 used only in the whole heat dissipation process of the PCB heat dissipation structure 100 provided in the present application conducts heat. In addition, the ceramic substrate 50 is connected to the heat sink, so that the electronic component 13 and the heat sink can be effectively isolated, and electrical conduction between the electronic component 13 and the heat sink can be avoided.
It will be appreciated that the circuit board itself will typically be processed to form the vias 10b, with the vias 10b including plated vias (Plating Through Hole, PTH) and non-plated vias (Non Plating Through Hole, NPTH). Through set up first heat conduction hole 10 a's mode connection first metalwork 15 and second metalwork 17 on mainboard 10, not only can effectively guarantee the radiating effect of PCB heat radiation structure 100, can also process the preparation and form first heat conduction hole 10a when processing formation through-hole 10b to reduce the manufacturing processing degree of difficulty of PCB heat radiation structure 100, reduce processing cost. The first metal connector 19 attached to the surface of the first heat conduction hole 10a can radiate heat through the first heat conduction hole 10a, and the heat radiation effect can be further improved.
It will be appreciated that at least two electronic components 13 are typically provided on the same board surface of the board body 11. Specifically, the electronic component 13 may be provided with two, three, four or more, without further limitation. It is understood that the plurality of electronic components 13 provided in the board body 11 may be of the same kind or of different kinds. The dimensions of the plurality of electronic components 13 may be the same or different. Therefore, the maximum vertical distance between at least two electronic components 13 provided on the same board surface and the board surface of the board body 11 is not exactly the same, that is, the plurality of electronic components 13 connected to the same board surface of the board body 11 have a height difference with respect to the board surface of the board body 11. The thickness of the conventional ceramic substrate 50 in the market is usually thinner, and when the electronic components 13 are also disposed on the second surface of the board body 11, the conventional ceramic substrate 50 cannot adapt to the height difference between the electronic components 13 disposed on the second surface of the board body 11.
Referring to fig. 1 to 3, in an embodiment of the present application, the second board surface of the board main body 11 is also provided with the electronic component 13, the pcb heat dissipation structure 100 further includes a connection board 30, the connection board 30 includes a connection main board 31, a fifth metal piece 33, and a sixth metal piece 35, the fifth metal piece 33 is disposed on a first board surface of the connection main board 31 and connected with the second metal piece 17, the sixth metal piece 35 is disposed on a second board surface of the connection main board 31 and connected with the third metal piece 53, the fifth metal piece 33 is disposed corresponding to the sixth metal piece 35, the connection board 30 is formed with a second heat conduction hole 30a corresponding to penetrate through the fifth metal piece 33, the connection main board 31, and the sixth metal piece 35, the second metal connection piece 37 is connected with the fifth metal piece 33 and the sixth metal piece 35, the first board surface of the connection main board 31 is a board surface facing the board surface of the board main body 11, and the second board surface of the connection main board 31 is a second board surface facing the ceramic substrate 51 facing the two board surfaces of the connection main board 31; the connection main board 31 is formed with a receiving groove 30b, and the electronic component 13 connected to the second board surface of the board main body 11 is located in the receiving groove 30 b.
The electronic components 13 are mounted on both side surfaces of the board main body 11, which increases the mounting range of the electronic components 13 and improves the performance of the motherboard 10.
The connecting plate 30 may be assembled from different materials, that is, the first metal connecting piece 19 may be made of a material with better heat conductivity, such as copper, aluminum, silver, etc., the connecting main board 31 may be made of other materials with lower cost, for example, the connecting main board 31 may be a plastic board. Of course, for convenience of manufacturing and processing, the PCB heat dissipation structure 100 is more coordinated as a whole, and the connection board 30 may be a circuit board without a circuit.
The second metal connector 37 may be attached to the hole surface of the second heat conductive hole 30a by coating or plating. The fifth metal piece 33 and the sixth metal piece 35 are connected by arranging the second heat conduction holes 30a on the connecting plate 30, so that the heat dissipation effect of the PCB heat dissipation structure 100 can be ensured, the manufacturing and processing difficulty of the PCB heat dissipation structure 100 can be reduced, and the processing cost can be reduced. The second metal connector 37 can also radiate heat through the second heat conduction hole 30a, thereby further improving the heat radiation effect.
When the main board 10 is in operation, the electronic components 13 connected to the two side surfaces of the board main body 11 generate heat, and after the heat energy of the electronic components 13 is transferred to the second metal member 17, the heat energy can be transferred from the second metal member 17 to the fifth metal member 33 of the connecting board 30, and then transferred from the second metal connecting member 37 attached to the surface of the second heat conducting hole 30a to the sixth metal member 35, so as to be transferred to the second metal member 17 of the ceramic substrate 50 through the sixth metal member 35.
It will be appreciated that the opening of the receiving groove 30b provided on the connection plate 30 is disposed toward the electronic component 13 provided on the second plate surface of the plate body 11, and at least a part of the electronic component 13 will be correspondingly inserted into the receiving groove 30 b. Therefore, the electronic components 13 and the accommodating grooves 30b can be positioned when the main board 10 and the connecting board 30 are assembled, the electronic components 13 can be prevented from being exposed, and the risk of damaging the electronic components 13 is reduced. In addition, the accommodating groove 30b arranged on the connecting plate 30 is further used for adapting and adjusting the height difference between different electronic components 13 so as to accommodate the electronic components 13 with different sizes, so that the main board 10 is stably connected to the ceramic substrate 50, the connection stability and reliability of the board main body 11, the connecting plate 30 and the ceramic substrate 50 are ensured, and the mutual interference caused by the relative inclination between the boards of the boards is avoided. And, adopt connecting plate 30 to realize the level, need not to correspond the recess that sets up the confession electron components and parts 13 held on the radiator, PCB heat radiation structure 100 can be connected on the smooth surface of radiator, so can make PCB heat radiation structure 100 adapt to more kinds of radiators, improve the suitability of PCB heat radiation structure 100 and radiator, and then reduce the design and the processing cost of radiator, be convenient for radiator batch processing preparation.
It will be appreciated that one receiving slot 30b may receive at least one electronic component 13. In an embodiment of the present application, referring to fig. 2 and 5, in an embodiment of the present application, at least two accommodating grooves 30b are provided, and one electronic component 13 provided on the second plate surface of the plate body 11 is located in one accommodating groove 30 b.
In this embodiment, when one electronic component 13 is correspondingly mounted in one accommodating groove 30b, the shape of each accommodating groove 30b can be set according to the shape of the corresponding electronic component 13, so as to further improve the connection stability of the electronic component 13 and the connecting plate 30, and avoid the position offset of the motherboard 10 relative to the connecting plate 30. And, so can also more accurately fix the mounted position of mainboard 10 and connecting plate 30 through electronic components 13 and holding tank 30b, guarantee the accuracy of hookup location.
Referring to fig. 2, 5 and 6, in an example embodiment of the present application, the accommodating groove 30b is provided through the connection main board 31. That is, the receiving groove 30b may be a through groove. Thus, the size of the accommodating groove 30b can be reduced, and the accommodating groove 30b can be conveniently machined. In addition, when the design is adopted, the electronic component 13 with larger part thickness can directly pass through the accommodating groove 30b to be in contact with the ceramic substrate 51 for heat conduction, so that the heat dissipation efficiency is further improved. In the present embodiment, the accommodating groove 30b is configured as a through groove, which also makes the PCB heat dissipation structure 100 smaller and lighter.
Of course, in other embodiments, the depth of the accommodating groove 30b may be set corresponding to the thickness of the electronic component 13 provided on the second surface of the board body 11, which is not limited herein.
Referring to fig. 2 and 4, in an example embodiment of the present application, if the electronic component 13 provided on the second surface of the board body 11 and the electronic component 13 provided on the first surface of the board body 11 are located in the same electrical circuit, the electronic component 13 provided on the second surface of the board body 11 is connected to the second metal member 17.
In this embodiment, not only the electronic components 13 in the same circuit can be electrically connected, but also the heat energy generated by the operation of these electronic components 13 can be transferred to the second metal member 17, so that the heat energy is finally transferred to the heat sink by the second metal member 17 through the connecting plate 30 and the ceramic substrate 50 for heat dissipation. In the present embodiment, the number of second metal pieces 17 can be reduced and the design and manufacturing cost can be reduced by connecting the electronic components 13 located on the opposite side surfaces of the board main body 11 in the same electric circuit to the same second metal piece 17.
Referring to fig. 2 and 4, in an embodiment of the present application, the second plate surface of the plate body 11 is further provided with a seventh metal member 21, and the seventh metal member 21 is connected to the fifth metal member 33; if the electronic component 13 provided on the second plate surface of the plate body 11 is located in a different electrical circuit from the electronic component 13 provided on the first plate surface of the plate body 11, the electronic component 13 provided on the second plate surface of the plate body 11 is connected to the seventh metal member 21.
In the present embodiment, the electrical circuit in which the electronic component 13 provided on the second surface of the board body 11 and connected to the seventh metal member 21 is located is not connected to the electronic component 13 provided on the first surface of the board body 11. In this way, the seventh metal member 21 can ensure that only the heat energy generated by the operation of the electronic components 13 in the electrical circuit formed between the electronic components 13 on the second plate surface of the plate main body 11 can be transferred to the fifth metal member 33 on the connection plate 30 through the seventh metal member 21 to be finally transferred to the heat sink. At this time, the number of the fifth metal pieces 33 may be equal to the sum of the number of the second metal pieces 17 and the number of the seventh metal pieces 21. A fifth metal part 33 is connected to a second metal part 17 or a first seventh metal part 21, respectively.
In an embodiment of the present application, the first metal piece 15 includes a connection portion and at least one heat conduction portion, the first heat conduction hole 10a is correspondingly disposed through the heat conduction portion, the board main body 11 and the second metal piece 17, and the electronic component 13 disposed on the first board surface includes a plurality of pins, where one pin is connected with the connection portion of one first metal piece 15.
Wherein one pin may be connected with one, two or more heat conductive parts through a connection part, and the number of the heat conductive parts may be set according to the spatial layout of the board body 11.
In this embodiment, the number of heat conducting parts and the area of the heat conducting parts can be increased as much as possible according to the space layout of the board main body 11, so that the efficiency of heat conduction between the first metal piece 15 and the second metal piece 17 is increased, and the heat dissipation efficiency and heat dissipation effect of the electronic component 13 connected with the first metal piece 15 are further improved.
In order to further improve the efficiency of heat energy transfer from the first metal member 15 to the second metal member 17, the heat radiation effect of the heat energy may be improved, the number of the first heat conduction holes 10a penetrating the heat conduction portion and the second metal member 17 provided correspondingly may be increased, or the aperture of the first heat conduction holes 10a penetrating the heat conduction portion and the second metal member 17 provided correspondingly may be increased.
In one embodiment of the present application, one first metal piece 15 is connected to at least two electronic components 13 provided on the first plate surface of the plate body 11.
In this embodiment, at least two electronic components 13 connected with the same first metal piece 15 and arranged on the first board surface of the board main body 11 are located in the same electrical circuit, and when at least two electronic components 13 are connected with the same first metal piece 15, the spatial positions of the structures such as the first metal piece 15 and the second metal piece 17 in the spatial layout of the main board 10 can be reduced, so that the influence on the operation of the circuit system or the heat dissipation effect due to insufficient layout space is avoided.
It can be understood that when the space positions available for setting the first metal piece 15 and the second metal piece 17 in the layout space of the board main body 11 are enough, the electronic components 13 of the first board surface of the board main body 11 in the same electrical circuit can be connected with different first metal pieces 15, so that the electronic components 13 can be conveniently combined with the reasonable design layout of the electronic components 13 while ensuring that each electronic component 13 is connected with the first metal piece 15 for heat conduction, and the difficulty of connecting the electronic components 13 with the first metal piece 15 is simplified.
Referring to fig. 2 and 8, in an embodiment of the present application, a plurality of fourth metal members 55 are provided, and the plurality of fourth metal members 55 are arranged at intervals on the second surface of the ceramic substrate 51.
It will be appreciated that fourth metal member 55 may be circular, square, or any other shape, without further limitation. The plurality of fourth metal pieces 55 are arranged, and the plurality of fourth metal pieces 55 are arranged at intervals, so that the stress of connection between the ceramic substrate 50 and the radiator can be reduced, the connection and the installation of the PCB radiating structure 100 and the radiator are facilitated, and the connection stability of the PCB radiating structure 100 and the radiator is improved. In addition, the arrangement of the plurality of fourth metal pieces 55 can also ensure the range of the fourth metal pieces 55 distributed on the ceramic substrate 51, and ensure that the connection contact area of the fourth metal pieces 55 and the radiator is large enough, thereby improving the efficiency of heat energy transfer on the ceramic substrate 51 to the radiator and improving the radiating effect.
In this embodiment of the application, in order to ensure thermal energy conduction between each plate and ensure the effect of thermal energy transfer between each metal piece, two adjacent metal pieces are required to be in contact with each other. Taking the connection of the motherboard 10 with the ceramic substrate 50 through the connection board 30 as an example, it is to be ensured that thermal energy transfer is enabled between the motherboard 10, the connection board 30, the ceramic substrate 50, and the heat sink, that is, the connection between the second metal member 17 and the fifth metal member 33, the connection between the seventh metal member 21 and the fifth metal member 33, the connection between the sixth metal member 35 and the third metal member 53, and the connection between the fourth metal member 55 and the heat sink described in the above embodiments. The above-described respective connection methods may be performed by direct contact. Specifically, in the present embodiment, the locking plate body 11, the connection main plate 31, the ceramic substrate 51, and the heat sink may be connected by means of a snap-fit, screw, or bolt connection, etc., so that the adjacent two metal pieces can be brought into contact with each other to connect heat transfer. Of course, in other embodiments, the second metal piece 17 and the fifth metal piece 33, the seventh metal piece 21 and the fifth metal piece 33, the sixth metal piece 35 and the third metal piece 53, and the fourth metal piece 55 and the radiator may be connected and contacted by adopting a welding manner, so that the connection and contact of the adjacent two metal pieces are ensured, and meanwhile, the main board 10, the connecting board 30, the ceramic substrate 50 and the radiator are connected and fixed, so that the connection and fixation stability of the PCB heat dissipation structure 100 is ensured, and the heat dissipation of the electronic component 13 is prevented from being influenced due to the separation of the adjacent metal pieces. In specific implementation, in the welded PCB heat dissipation structure 100, the second board surface of the board main body 11 may be in direct contact with the first board surface of the connection main board 31, the second board surface of the connection main board 31 may be in direct contact with the first board surface of the ceramic substrate 51, and the second board surface of the ceramic substrate 51 may be in direct contact with the heat sink, so as to ensure the connection tightness of the structure, improve the connection strength between the structures, and avoid entering impurities such as dust.
In order to improve the connection stability among the main board 10, the ceramic substrate 50, the connection board 30, and the heat sink, the main board 10, the ceramic substrate 50, the connection board 30, and the heat sink may be further fastened by screws or bolts on the basis of welding. So as to further improve the stability of the connection assembly between the structures. For example, at the time of connection, screw holes may be provided on the heat sink, and connection holes 70a may be provided on at least two of the main board 10, the ceramic substrate 50, and the connection board 30, for example, the second metal member 17 may be welded with the fifth metal member 33 to connect the main board 31 and the connection board 30, and connection holes 70a may be provided on the connection board 30 and the ceramic substrate 50. Screws or bolts are locked in screw holes of the heat sink through the connection holes 70a, thereby connecting and fixing the main board 10, the ceramic substrate 50, the connection plate 30, and the heat sink. In order to facilitate alignment and assembly of the PCB heat dissipation structure 100 and the radiator, a stud may be disposed on one side of the radiator facing the PCB heat dissipation structure 100, and a screw hole is disposed in the stud and extends along a central axis direction of the stud. During assembly, the ceramic substrate 50, the connecting plate 30 and the main board 10 can be sleeved outside the studs according to the positional relationship, and then the screws or bolts are inserted into the screw holes and are limited and abutted against the first board surface of the main board 10, so that the relative positions of the PCB heat dissipation structure 100 and the radiator can be limited, locked and fixed.
In the above embodiment, in the case of using screw or bolt connection, in order to improve the smoothness of connection, a plurality of connection holes 70a and screw holes may be provided correspondingly. In order to further improve the stability, the plurality of connection holes 70a may be symmetrically provided. Meanwhile, in the case of providing the connection holes 70a, in order to avoid interference with the mounting arrangement of the electronic components 13, a plurality of connection holes 70a may be provided at positions adjacent to edges of the main board 10, the ceramic substrate 50, or the connection board 30.
The invention also provides a power supply device, which comprises a radiator and a PCB heat dissipation structure 100, wherein the specific structure of the PCB heat dissipation structure 100 refers to the above embodiment, and because the power supply device adopts all the technical schemes of all the embodiments, the power supply device at least has all the beneficial effects brought by the technical schemes of the embodiments, and the details are not repeated here.
Wherein the power supply device may be a switching power supply or the like. The heat sink may be a plate-like structure, i.e., a heat sink, and the fourth metal member 55 is attached to one side surface thereof. Alternatively, the radiator may include a mounting plate and a plurality of heat dissipating fins, where the plurality of heat dissipating fins are connected to the same plate surface of the mounting plate at intervals, and the fourth metal member 55 is connected to a plate surface of the mounting plate facing away from the heat dissipating fins. The mounting plate and the radiating fins may be made of metal, such as aluminum, copper, gold, etc., so as to ensure high efficiency of heat exchange between the third heat conducting member and the radiator. Specifically, the radiator can absorb the heat energy on the second metal connecting piece 37 and can exchange heat with the space environment, so that the absorbed heat energy is emitted, the temperature is reduced, and the electronic component 13 can be ensured to continuously dissipate heat.
In order to further improve the heat dissipation effect of the PCB heat dissipation structure 100, the power supply apparatus may further include an air cooling structure and/or a water cooling structure, where both the air cooling structure and the water cooling structure may act on the heat sink to cool the heat sink, thereby further accelerating the cooling efficiency of the heat sink. The power supply apparatus may further include an electric fan that acts on the radiator to improve a cooling effect of the radiator, for example.
The foregoing examples represent only a few embodiments of the present application, which are described in more detail and are not thereby to be construed as limiting the scope of the present application. It should be noted that it would be apparent to those skilled in the art that various modifications and improvements could be made without departing from the spirit of the present application, which would be within the scope of the present application. Accordingly, the scope of protection of the present application is to be determined by the claims appended hereto.
Claims (10)
1. A PCB heat dissipation structure, the PCB heat dissipation structure comprising: motherboard and ceramic substrate
The main board comprises a board main body, electronic components, a first metal piece and a second metal piece, wherein the first metal piece and the second metal piece are respectively arranged on two side board surfaces of the board main body, which are opposite to each other, the first metal piece is arranged corresponding to the second metal piece, the board surface, which defines the board main body to be connected with the first metal piece, is the first board surface of the board main body, the board surface, which is connected with the second metal piece, is the second board surface of the board main body, the first board surface of the board main body is provided with the electronic components, the electronic components arranged on the first board surface of the board main body are connected with the first metal piece, the main board is provided with first heat conducting holes which correspondingly penetrate through the first metal piece, the board main body and the second metal piece, and first metal connecting pieces are attached to the surfaces of the first heat conducting holes, and the first metal connecting pieces are connected with the first metal pieces and the second metal pieces. And
the ceramic substrate comprises a ceramic substrate, a third metal piece and a fourth metal piece, wherein the third metal piece is arranged on a first plate surface of the ceramic substrate and is connected with the second metal piece, the fourth metal piece is arranged on a second plate surface of the ceramic substrate and is used for being connected with a radiator, the first plate surface of the ceramic substrate faces towards the plate surface of the plate main body in two plate surfaces of the ceramic substrate, and the second plate surface of the ceramic substrate is the plate surface deviating from the plate main body in two plate surfaces of the ceramic substrate.
2. The PCB heat dissipation structure of claim 1, wherein the second plate surface of the plate body is also provided with the electronic component, the PCB heat dissipation structure further comprising:
the connecting plate comprises a connecting main plate, a fifth metal piece and a sixth metal piece, wherein the fifth metal piece is arranged on a first plate surface of the connecting main plate and is connected with the second metal piece, the sixth metal piece is arranged on a second plate surface of the connecting main plate and is connected with the third metal piece, the fifth metal piece is arranged corresponding to the sixth metal piece, a second heat conduction hole which correspondingly penetrates through the fifth metal piece, the connecting main plate and the sixth metal piece is formed in the connecting plate, a second metal connecting piece is attached to the surface of the second heat conduction hole, the second metal connecting piece is connected with the fifth metal piece and the sixth metal piece, the first plate surface of the connecting main plate is the plate surface facing the ceramic substrate in the two plate surfaces of the connecting main plate, and the second plate surface of the connecting main plate is the plate surface facing the ceramic substrate in the two plate surfaces of the connecting main plate;
the connecting main board is provided with a containing groove, and the electronic component connected to the second board surface of the board main body is positioned in the containing groove.
3. The PCB heat dissipating structure of claim 2, wherein at least two of the receiving grooves are provided, and one of the electronic components provided on the second surface of the board body is positioned in one of the receiving grooves.
4. The PCB heat dissipating structure of claim 2, wherein the receiving slot is disposed through the connecting motherboard.
5. The PCB heat dissipating structure of claim 2, wherein the electronic component disposed on the second plate surface of the plate body is connected to the second metal member if the electronic component disposed on the second plate surface of the plate body is in the same electrical circuit as the electronic component disposed on the first plate surface of the plate body.
6. The PCB heat dissipation structure of claim 2, wherein the second plate surface of the plate body is further provided with a seventh metal member, the seventh metal member being connected to the fifth metal member;
if the electronic component provided on the second plate surface of the plate main body and the electronic component provided on the first plate surface of the plate main body are located in different electric loops, the electronic component provided on the second plate surface of the plate main body is connected to the seventh metal member.
7. The PCB heat dissipation structure of any one of claims 1 to 6, wherein the first metal member includes a connection portion and at least one heat conduction portion, the first heat conduction hole is correspondingly formed through the heat conduction portion, the board body and the second metal member, and the electronic component disposed on the first board surface includes a plurality of pins, one pin being connected to the connection portion of one of the first metal members.
8. The PCB heat dissipating structure of any one of claims 1 to 7, wherein one of the first metal pieces is connected to at least two electronic components provided on the first board face of the board main body.
9. A power supply device comprising a heat sink and a PCB heat dissipation structure as claimed in any one of claims 1 to 8.
10. An electronic device comprising a heat sink and a PCB heat dissipation structure as claimed in any one of claims 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310233537.1A CN116347749A (en) | 2022-10-10 | 2022-10-10 | PCB heat radiation structure and relevant power supply equipment and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310233537.1A CN116347749A (en) | 2022-10-10 | 2022-10-10 | PCB heat radiation structure and relevant power supply equipment and electronic equipment |
| CN202211232284.8A CN115334743B (en) | 2022-10-10 | 2022-10-10 | PCB heat radiation structure and power supply equipment |
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| CN202211232284.8A Division CN115334743B (en) | 2022-10-10 | 2022-10-10 | PCB heat radiation structure and power supply equipment |
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| CN202211232284.8A Active CN115334743B (en) | 2022-10-10 | 2022-10-10 | PCB heat radiation structure and power supply equipment |
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| JP3147087B2 (en) * | 1998-06-17 | 2001-03-19 | 日本電気株式会社 | Stacked semiconductor device heat dissipation structure |
| TW201230897A (en) * | 2011-01-14 | 2012-07-16 | Askey Computer Corp | Circuit board |
| CN102300397A (en) * | 2011-06-30 | 2011-12-28 | 深南电路有限公司 | Metal matrix circuit board and manufacturing method thereof |
| CN105163485A (en) * | 2015-09-25 | 2015-12-16 | 湖南三一电控科技有限公司 | Heat conducting substrate for heating device and heating device and manufacturing method thereof |
| KR102565119B1 (en) * | 2016-08-25 | 2023-08-08 | 삼성전기주식회사 | Electronic component embedded substrate and manufacturing method threrof |
| CN112004314A (en) * | 2020-10-10 | 2020-11-27 | 华域视觉科技(上海)有限公司 | Circuit board with holes |
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