CN111479454B - Liquid cooling heat radiation structure and electronic terminal - Google Patents
Liquid cooling heat radiation structure and electronic terminal Download PDFInfo
- Publication number
- CN111479454B CN111479454B CN202010429850.9A CN202010429850A CN111479454B CN 111479454 B CN111479454 B CN 111479454B CN 202010429850 A CN202010429850 A CN 202010429850A CN 111479454 B CN111479454 B CN 111479454B
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- Prior art keywords
- accommodating groove
- groove
- heat dissipation
- liquid
- cooling assembly
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
Abstract
The invention relates to the technical field of heat dissipation and cooling, and particularly discloses a liquid cooling heat dissipation structure and an electronic terminal, wherein the liquid cooling heat dissipation structure comprises a shell, a first accommodating groove is formed in one surface of the shell, and a second accommodating groove is formed in the other surface of the shell opposite to the first accommodating groove; the first accommodating groove and the second accommodating groove are both provided with openings, and the directions of the openings of the first accommodating groove and the second accommodating groove are opposite and communicated so that the first accommodating groove and the second accommodating groove form an accommodating space; and the cooling assembly is positioned in the accommodating space, one end of the cooling assembly is positioned in the first accommodating groove and is fixedly connected with the groove bottom of the first accommodating groove, and the other end of the cooling assembly is positioned in the second accommodating groove and is fixedly connected with the groove bottom of the second accommodating groove. The invention provides a liquid cooling heat dissipation structure and an electronic terminal, which can solve the problem that the end part of a cooling assembly is easy to warp.
Description
Technical Field
The invention relates to the technical field of heat dissipation and cooling, in particular to a liquid cooling heat dissipation structure and an electronic terminal.
Background
The heat pipe is a common cooling device, and is mounted as shown in fig. 1, in which a fixing adhesive 2 is first applied to a housing 1, and then a heat pipe 3 is adhered to the fixing adhesive 2. After the heat dissipation device is assembled, the shell 1 is placed on the heat dissipation piece to be cooled by using heat conduction silicone grease and the like, and then heat dissipation of the heat dissipation piece to be cooled can be achieved.
Only rely on fixed gum 2 to fix between present casing 1 and the heat pipe 3, long back of time, along with the weakening of fixed gum 2 adhesion, the tip of heat pipe 3 sticks up to the direction of keeping away from casing 1 easily, finally leads to treating the radiating rate shock dip of heat-dissipating piece.
Disclosure of Invention
An object of the present invention is to provide a liquid cooling heat dissipation structure and an electronic terminal, which can solve the problem that the end of a cooling module is easy to warp.
To achieve the above object, in one aspect, the present invention provides a liquid cooling heat dissipation structure, including:
a housing, one surface of which is provided with a first containing groove and the other surface of which is opposite to the first containing groove is provided with a second containing groove; the first accommodating groove and the second accommodating groove are provided with openings, and the directions of the openings of the first accommodating groove and the second accommodating groove are opposite and are communicated so that the first accommodating groove and the second accommodating groove form an accommodating space;
and the cooling assembly is positioned in the accommodating space, one end of the cooling assembly is positioned in the first accommodating groove and is fixedly connected with the groove bottom of the first accommodating groove, and the other end of the cooling assembly is positioned in the second accommodating groove and is fixedly connected with the groove bottom of the second accommodating groove.
Preferably, a first back glue is arranged between the cooling assembly and the bottom of the first accommodating groove, and a second back glue is arranged between the cooling assembly and the bottom of the second accommodating groove.
Preferably, the first accommodating groove is a through groove, a limiting baffle is fixedly arranged on the surface of the shell, which is provided with the second accommodating groove, and the surface of the limiting baffle, which is close to the first accommodating groove, forms the bottom of the first accommodating groove and is bonded with the first back glue.
Preferably, the first back glue is positioned at one end of the first accommodating groove; the other end of the first accommodating groove is opposite to the second accommodating groove and is communicated with the middle area of the bottom of the second accommodating groove; the second back glue is positioned in the edge area of the bottom of the second accommodating groove.
Preferably, the cooling assembly comprises a heat dissipation bottom plate and a plurality of heat dissipation liquid pipes fixed on the heat dissipation bottom plate.
Preferably, the surface of the heat dissipation bottom plate, which is far away from the heat dissipation liquid pipe, is fixedly connected with the groove bottom of the first accommodating groove, and the surface of the heat dissipation bottom plate, which is close to the heat dissipation liquid pipe, is fixedly connected with the groove bottom of the second accommodating groove.
Preferably, the heat dissipation bottom plate is a copper sheet.
Preferably, the heat radiating liquid pipe is a heat pipe or a liquid cooling pipe.
Preferably, the side face of the heat dissipation bottom plate, which is far away from the heat dissipation liquid pipe, is flush with the side face of the shell, which is provided with the second accommodating groove.
In another aspect, the present invention provides an electronic terminal, including a heat dissipation member to be cooled and any one of the liquid-cooled heat dissipation structures described above.
The invention has the beneficial effects that: the first end of the cooling component is fixedly connected with the bottom of the first accommodating groove, so that the second end of the cooling component has a tendency to move towards the bottom of the second accommodating groove. Therefore, the fixedly connected first end of the cooling assembly with the bottom of the first accommodating groove can effectively inhibit the second end of the cooling assembly from warping in the direction away from the bottom of the second accommodating groove, and the fixedly connected second end of the cooling assembly with the bottom of the second accommodating groove can effectively inhibit the first end of the cooling assembly from warping in the direction away from the bottom of the first accommodating groove. Because the first end and the second end of the cooling assembly can be kept attached to the shell, the liquid cooling heat dissipation structure and the electronic terminal provided by the invention can solve the problem of warping of the cooling assembly, and further avoid the occurrence of sudden drop of the heat dissipation speed of a heat dissipation piece to be cooled.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.
FIG. 1 is an exploded view of a prior art heat pipe mounting structure provided in the background art;
fig. 2 is an exploded schematic view of a liquid-cooled heat dissipation structure according to an embodiment;
FIG. 3 is a first schematic view of an embodiment of a cooling assembly and housing installation process;
FIG. 4 is a second schematic view of an embodiment of a second exemplary step of installing a cooling assembly and a housing;
FIG. 5 is a third schematic view illustrating an installation step of the cooling assembly and the housing according to the embodiment;
fig. 6 is a schematic front structure diagram of a liquid-cooled heat dissipation structure according to an embodiment;
fig. 7 is a schematic structural view illustrating that the first receiving groove is a blind groove according to the embodiment.
In the figure:
1. a housing; 101. a first accommodating groove; 102. a second accommodating groove;
2. fixing gum;
3. a heat pipe;
4. a cooling assembly; 401. a heat dissipation base plate; 402. a heat radiation liquid pipe;
501. a first back glue; 502. second gum;
6. and a limiting baffle.
Detailed Description
In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. When a component is referred to as being "disposed on" another component, it can be directly on the other component or intervening components may also be present.
Furthermore, the terms "long", "short", "inner", "outer", and the like indicate orientations or positional relationships based on orientations or positional relationships illustrated in the drawings, and are merely for convenience of description of the present invention, but do not indicate or imply that the device or element referred to must have the specific orientation, be configured to operate in the specific orientation, and thus, should not be construed as limiting the present invention.
The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings.
The embodiment provides an electronic terminal, which comprises a to-be-cooled piece and a liquid cooling heat dissipation structure for dissipating heat of the to-be-cooled piece. Optionally, the electronic terminal may be a code scanning device, a mobile phone, a notebook, a tablet computer, a desktop computer, a POS machine, or the like. Treat that the radiating piece can be heating components such as central processing unit or LED lamp plate, treat to be equipped with heat conduction silver glue or heat conduction silicone grease in order to reduce thermal contact resistance between radiating piece and the liquid cooling heat radiation structure.
Referring to fig. 2 and 3, the liquid-cooled heat dissipation structure includes a housing 1 and a cooling assembly 4. One surface of the housing 1 is provided with a first receiving groove 101, and the other surface opposite to the first receiving groove is provided with a second receiving groove 102. The first receiving groove 101 and the second receiving groove 102 are both provided with openings, and the directions of the openings of the first receiving groove 101 and the second receiving groove 102 are opposite and communicated, so that the first receiving groove 101 and the second receiving groove 102 form a receiving space. The cooling assembly 4 is located in the accommodating space, one end of the cooling assembly is located in the first accommodating groove 101 and is fixedly connected with the bottom of the first accommodating groove 101, and the other end of the cooling assembly is located in the second accommodating groove 102 and is fixedly connected with the bottom of the second accommodating groove 102.
For convenience of description, an end of the cooling module 4 inserted into the first receiving groove 101 is referred to as a first end, and an end of the cooling module 4 inserted into the second receiving groove 102 is referred to as a second end.
It can be understood that the opening directions of the first receiving groove 101 and the second receiving groove 102 are opposite, and the first end of the cooling assembly 4 is fixedly connected to the bottom of the first receiving groove 101, so that the second end of the cooling assembly 4 tends to move toward the bottom of the second receiving groove 102, and similarly, the second end of the cooling assembly 4 is fixedly connected to the bottom of the second receiving groove 102, so that the first end of the cooling assembly 4 tends to move toward the bottom of the first receiving groove 101. Therefore, the first end of the cooling assembly 4 is fixedly connected to the bottom of the first receiving groove 101 so as to effectively inhibit the second end of the cooling assembly 4 from warping in the direction away from the bottom of the second receiving groove 102, and the second end of the cooling assembly 4 is fixedly connected to the bottom of the second receiving groove 102 so as to effectively inhibit the first end of the cooling assembly 4 from warping in the direction away from the bottom of the first receiving groove 101. Because the first end and the second end of cooling module 4 all can keep with the laminating of casing 1, so the liquid cooling heat radiation structure and the electronic terminal that this embodiment provided can solve the easy problem of upwarping of traditional mounting structure, and then avoid treating the emergence of the heat dissipation speed shock wave down condition of radiating piece.
For convenient assembly, the fixing mode between the cooling component 4 and the shell 1 can be selected from a bonding mode. Specifically, a first adhesive 501 is disposed between the cooling module 4 and the bottom of the first receiving groove 101, and a second adhesive 502 is disposed between the cooling module 4 and the bottom of the second receiving groove 102. In this embodiment, the thickness of the cooling module 4 is not less than that of the housing 1, so that the surface of the cooling module 4 close to the bottom of the first receiving groove 101 is flush with the surface of the housing 1 provided with the second receiving groove 102, the first receiving groove 101 may be a through groove, the surface of the housing 1 provided with the second receiving groove 102 is fixedly provided with a limit baffle 6, and the surface of the limit baffle 6 close to the first receiving groove 101 forms the bottom of the first receiving groove 101 and is bonded with the first back glue 501. The first adhesive 501 is located at one end of the first receiving groove 101. The other end of the first accommodating groove 101 is opposite to the second accommodating groove 102 and is communicated with the middle area of the bottom of the second accommodating groove 102; the second back adhesive 502 is located at the edge region of the bottom of the second receiving groove 102.
The limiting baffle 6 is mainly used for supporting the first gum 501, optionally, the limiting baffle can be fixed on the housing 1 in a welding manner, and can also be of an integrally formed structure with the housing 1.
The cooling assembly 4 includes a heat sink base plate 401 and a plurality of heat sink liquid pipes 402 fixed to the heat sink base plate 401. The surface of the heat dissipation bottom plate 401 far away from the heat dissipation liquid pipe 402 is fixedly connected with the groove bottom of the first accommodating groove 101, and the surface close to the heat dissipation liquid pipe 402 is fixedly connected with the groove bottom of the second accommodating groove 102. Specifically, the surface of the heat dissipation bottom plate 401 away from the heat dissipation liquid pipe 402 is bonded to the first adhesive tape 501, and the surface close to the heat dissipation liquid pipe 402 is bonded to the second adhesive tape 502.
Optionally, the heat dissipation base plate 401 is a heat conduction member with good heat conduction performance, such as a copper sheet, a silver sheet, or heat conduction silica gel; the heat dissipation liquid pipe 402 is a heat pipe 3 or a liquid cooling pipe. Specifically, the liquid cooling pipe may be a water cooling pipe or an oil cooling pipe. When the heat dissipating liquid pipe 402 is a liquid cooling pipe, a liquid inlet and a liquid outlet are respectively disposed at two ends of the heat dissipating liquid pipe 402.
In this embodiment, the side of the heat dissipation bottom plate 401 away from the heat dissipation liquid pipe 402 and the side of the housing 1 is provided with the second accommodation groove 102 are parallel and level, such a structure design is favorable for maintaining the flatness of the liquid cooling heat dissipation structure, and improves the heat dissipation speed, and it can be understood that the heat dissipation bottom plate 401 can further accelerate the heat dissipation speed of the to-be-dissipated part after contacting the to-be-dissipated part through heat conduction silicone grease and the like.
In this embodiment, the second back adhesive 502 is a U-shaped structure, and the installation process of the cooling assembly 4 and the housing 1 is as follows:
(1) fixing a first gum 501 on the surface of the limit baffle 6 close to the first accommodating groove 101, and fixing a second gum 502 at the edge position of the bottom of the second accommodating groove 102;
(2) referring to fig. 3, the cooling module 4 is inserted into the housing 1;
(3) referring to fig. 4 and 7, the cooling assembly 4 is rotated so that the surface of the heat dissipation bottom plate 401 away from the heat dissipation liquid pipe 402 is opposite to the first adhesive 501, and the surface of the heat dissipation bottom plate 401 close to the heat dissipation liquid pipe 402 is opposite to the second adhesive 502;
(4) referring to fig. 2, 3, 5 and 6, the first end of the cooling assembly 4 is placed in the first receiving groove 101, the second end of the cooling assembly 4 is placed in the second receiving groove 102, and the cooling assembly 4 is pressed to be attached to the housing 1, so that the installation is completed.
It should be noted that, in some other embodiments, referring to fig. 7, when the thickness of the housing 1 is greater than that of the cooling assembly 4, the limit baffle 6 does not need to be disposed, the first receiving groove 101 and the second receiving groove 102 are both non-through blind groove structures, the first adhesive 501 is fixed at the bottom of the first receiving groove 101, and the second adhesive 502 is fixed at the bottom of the second receiving groove 102, so that the surface of the heat dissipation bottom plate 401 away from the heat dissipation liquid pipe 402 is just flush with the surface of the housing 1 where the second receiving groove 102 is disposed by controlling the depths of the first receiving groove 101 and the second receiving groove 102.
The liquid cooling heat radiation structure and the electronic terminal provided by the embodiment are suitable for a quick heat radiation application scene, and the two ends of the cooling assembly 4 are respectively fixed in the first accommodating groove 101 and the second accommodating groove 102 on the two opposite side surfaces of the shell 1, so that the limitation of the cooling assembly 4 and the shell 1 in the thickness direction parallel to the shell 1 is realized, the problem that the traditional mounting structure is easy to warp is solved, and the sudden drop of the heat radiation speed of the heat radiation piece is effectively avoided.
The above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (6)
1. A liquid-cooled heat dissipation structure, comprising:
a housing, one surface of which is provided with a first containing groove and the other surface opposite to the first containing groove is provided with a second containing groove; the first accommodating groove and the second accommodating groove are both provided with openings, and the directions of the openings of the first accommodating groove and the second accommodating groove are opposite and communicated so that the first accommodating groove and the second accommodating groove form an accommodating space;
the cooling assembly is positioned in the accommodating space, one end of the cooling assembly is positioned in the first accommodating groove and is fixedly connected with the groove bottom of the first accommodating groove, and the other end of the cooling assembly is positioned in the second accommodating groove and is fixedly connected with the groove bottom of the second accommodating groove;
a first back glue is arranged between the cooling assembly and the bottom of the first accommodating groove, and a second back glue is arranged between the cooling assembly and the bottom of the second accommodating groove;
the first accommodating groove is a through groove, a limiting baffle is fixedly arranged on the surface of the shell, which is provided with the second accommodating groove, the surface of the limiting baffle, which is close to the first accommodating groove, forms the groove bottom of the first accommodating groove and is bonded with the first back glue;
the cooling assembly comprises a heat dissipation bottom plate and a plurality of heat dissipation liquid pipes fixed on the heat dissipation bottom plate;
the surface of the radiating bottom plate, which is far away from the radiating liquid pipe, is fixedly connected with the bottom of the first accommodating groove, and the surface of the radiating bottom plate, which is close to the radiating liquid pipe, is fixedly connected with the bottom of the second accommodating groove.
2. The liquid-cooled heat dissipation structure of claim 1, wherein the first adhesive is disposed at one end of the first receiving groove; the other end of the first accommodating groove is opposite to the second accommodating groove and is communicated with the middle area of the bottom of the second accommodating groove; the second back glue is positioned in the edge area of the bottom of the second accommodating groove.
3. The liquid-cooled heat dissipation structure of claim 1, wherein the heat dissipation base plate is a copper sheet.
4. The liquid-cooled heat dissipation structure of claim 1, wherein the heat sink fluid pipe is a heat pipe or a liquid-cooled pipe.
5. The liquid-cooled heat dissipating structure of claim 1, wherein a side of the heat dissipating base plate away from the heat dissipating liquid pipe is flush with a side of the housing where the second receiving groove is formed.
6. An electronic terminal, characterized in that it comprises a member to be heat-dissipated and the liquid-cooled heat-dissipating structure of any one of claims 1 to 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010429850.9A CN111479454B (en) | 2020-05-20 | 2020-05-20 | Liquid cooling heat radiation structure and electronic terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010429850.9A CN111479454B (en) | 2020-05-20 | 2020-05-20 | Liquid cooling heat radiation structure and electronic terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111479454A CN111479454A (en) | 2020-07-31 |
| CN111479454B true CN111479454B (en) | 2022-12-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010429850.9A Active CN111479454B (en) | 2020-05-20 | 2020-05-20 | Liquid cooling heat radiation structure and electronic terminal |
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| CN (1) | CN111479454B (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI631887B (en) * | 2014-10-28 | 2018-08-01 | 富智康（香港）有限公司 | Heat dissipation structure and electronic device using same |
| CN205123806U (en) * | 2015-11-04 | 2016-03-30 | 联想(北京)有限公司 | Mobile terminal with front camera and large LCD |
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| CN111479454A (en) | 2020-07-31 |
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