CN113141711B - Manufacturing method of local high-heat-dissipation circuit board and high-heat-dissipation circuit board - Google Patents
Manufacturing method of local high-heat-dissipation circuit board and high-heat-dissipation circuit board Download PDFInfo
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- CN113141711B CN113141711B CN202110273976.6A CN202110273976A CN113141711B CN 113141711 B CN113141711 B CN 113141711B CN 202110273976 A CN202110273976 A CN 202110273976A CN 113141711 B CN113141711 B CN 113141711B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
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- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a manufacturing method of a local high-heat-dissipation circuit board, which comprises the following steps: forming a lamination heat dissipation layer on the first dielectric layer, wherein the lamination heat dissipation layer comprises a non-heat dissipation copper-aluminum alloy plate area and a heat dissipation copper-aluminum alloy plate area, and the heat dissipation copper-aluminum alloy plate area is positioned in a high heat dissipation electronic device area of the circuit board; manufacturing an electroplated copper layer on the pressed heat dissipation layer; manufacturing a pressed copper foil layer on the electroplated copper layer; patterning the laminated copper foil layer to form a patterned laminated copper foil layer; thereby forming a localized high heat dissipation circuit board. According to the invention, the lamination heat dissipation layer is arranged, and comprises the high heat dissipation copper aluminum alloy plate area, so that the heat dissipation area of the circuit board is increased, the heat dissipation efficiency is improved, the high heat dissipation circuit board is easy to process and manufacture, and the problems of local overheating or vibration splitting and the like are not easy to occur in the actual application process, thereby being beneficial to medical equipment to exert the maximum and most accurate measurement value.
Description
Technical Field
The invention relates to the technical field of circuit board manufacturing, in particular to a manufacturing method of a local high-heat-dissipation circuit board and the high-heat-dissipation circuit board.
Background
The development of medical technology has higher and higher precision requirements on medical equipment, and the used circuit board of the medical equipment needs to have the performances of refinement, high heat dissipation and high sensitivity.
The circuit board that uses among the medical equipment of prior art is the circuit board of general organic polymer substrate and copper circuit type, and the heat dispersion of this type of circuit board is relatively poor, if long-term use or high frequency use, produces the overheated problem of part easily, influences the accuracy of detection data, if increase supplementary heat conduction device, on the one hand needs higher cost to can increase equipment volume, influence the effect that circuit board and medical equipment are meticulous, on the other hand can influence the precision of equipment, and because the restriction of circuit board material and processing characteristics itself, increase auxiliary heat abstractor's radiating effect is not very ideal.
At present, a local high-heat-dissipation circuit board is generally manufactured in a mode of locally embedding a copper block, but the heat dissipation efficiency of the copper block is lower, local overheating and the like are easy to generate, so that the thermal expansion coefficient of the circuit board is overlarge, the stability and the reliability of the circuit board are affected, the embedded copper block can be embedded into the circuit board in a mechanical mode, under the general condition, a circuit pattern cannot be manufactured on the surface of the embedded copper block, and the copper block is not easy to connect with the circuit pattern, therefore, the heat dissipation efficiency of the copper block is reduced, the quality of the circuit board is increased by the copper block, and the overall quality of equipment is increased.
Based on the above problems, it is necessary to provide a circuit board product which can effectively meet the requirement of medical equipment on high-precision detection due to overhigh and too fast local heat dissipation of the medical equipment.
Disclosure of Invention
The invention mainly aims to provide a manufacturing method of a local high-heat-dissipation circuit board and the high-heat-dissipation circuit board thereof, and aims to solve the technical problem that the circuit board in the prior art cannot meet the requirement of excessively high and excessively fast local heat dissipation of medical equipment.
In order to achieve the above objective, an embodiment of the present invention provides a method for manufacturing a local high heat dissipation circuit board, including:
s110: manufacturing a lamination heat dissipation layer: and taking a first dielectric layer, and manufacturing and forming a pressing heat dissipation layer on the first dielectric layer, wherein the pressing heat dissipation layer comprises a non-heat dissipation copper-aluminum alloy plate area and a heat dissipation copper-aluminum alloy plate area, and the heat dissipation copper-aluminum alloy plate area is positioned in a high heat dissipation electronic device area of the circuit board.
S120: manufacturing a heat dissipation copper-aluminum alloy plate area: performing windowing treatment on the pressing heat dissipation layer to form a windowing treatment area; placing a copper aluminum alloy plate in the windowing treatment area to form a heat dissipation copper aluminum alloy plate area; the windowing treatment area is larger than the heat dissipation copper-aluminum alloy plate area.
S130: manufacturing a high heat dissipation copper-aluminum alloy plate area: and (3) grooving the heat-dissipation copper aluminum alloy plate area to form a groove body, wherein the thickness of the groove body is 1/3 to 1/2 of that of the heat-dissipation copper aluminum alloy plate area, and copper paste is printed in the groove body through silk-screen printing to obtain the high-heat-dissipation copper aluminum alloy plate area.
S140: manufacturing an electroplated copper layer: sealing the first dielectric layer facing away from the laminated heat dissipation layer to obtain a circuit board to be electroplated; electroplating the circuit board to be electroplated; and (3) carrying out film tearing treatment on the circuit board subjected to the electroplating treatment, so that an electroplated copper layer is formed on the surface of the pressed heat dissipation layer.
S150: manufacturing a pressed copper foil layer: carrying out surface micro-roughening treatment on the pressed heat dissipation layer to obtain a circuit board to be pressed; and pressing the covered copper foil and the circuit board to be pressed, so that the surface layer of the electroplated copper layer is a pressed copper foil layer.
S160: manufacturing a local high-heat-dissipation circuit board:
patterning the laminated copper foil layer to form a patterned laminated copper foil layer; and forming the local high-heat-dissipation circuit board.
Further, before the step of performing a film sealing treatment on the first dielectric layer facing away from the laminated heat dissipation layer to obtain the circuit board to be electroplated, the method includes: forming a heat conduction film layer on the pressing heat dissipation layer; and electroplating on the heat conducting film layer to make the surface layer of the heat conducting film layer be an electroplated copper layer.
In order to achieve the above object, an embodiment of the present invention further provides a local high heat dissipation circuit board, where the high heat dissipation circuit board is manufactured by any one of the above methods, and the high heat dissipation circuit board includes:
a first dielectric layer; the laminated radiating layer is formed on the first dielectric layer and comprises a non-radiating copper-aluminum alloy plate area and a radiating copper-aluminum alloy plate area, and the radiating copper-aluminum alloy plate area is positioned in a high-radiating electronic device area of the circuit board; the electroplated copper layer is formed on the lamination heat dissipation layer; and the pattern pressing copper foil layer is formed on the electroplated copper layer.
The local high-heat-dissipation circuit board further comprises a heat-conducting film layer, and the heat-conducting film layer is located between the pressing heat-dissipation layer and the electroplated copper layer.
Compared with the prior art, in the technical scheme provided by the invention, the pressing heat dissipation layer is arranged and comprises the high heat dissipation copper aluminum alloy plate area, so that the heat dissipation area of the circuit board is increased, the heat dissipation efficiency is improved, the high heat dissipation circuit board is easy to process and manufacture, and the problems of local overheating or vibration splitting and the like are not easy to occur in the actual application process, thereby being beneficial to medical equipment to exert the maximum and most accurate measurement value.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is apparent that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a first embodiment of a local high heat dissipation circuit board according to the present invention;
FIG. 2 is a schematic flow chart of a method for manufacturing a local high heat dissipation circuit board according to an embodiment of the invention;
FIG. 3 is a schematic diagram of a local high heat dissipation circuit board according to a second embodiment of the present invention;
fig. 4 is a flow chart of another embodiment of a method for manufacturing a local high heat dissipation circuit board according to the present invention.
Reference numerals illustrate:
| reference numerals | Name of the name | Reference numerals | Name of the |
| 10 | Local high heat |
10A | Another local high heat dissipation circuit board |
| 100 | A first |
200 | Lamination |
| 300 | |
210 | Heat dissipation copper-aluminum |
| 400 | Copper foil layer with |
201 | High heat dissipation copper aluminum |
| 500 | Heat |
220 | Non-heat dissipation copper-aluminum alloy plate area |
The achievement of the objects, functional features and advantages of the present invention will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments of the present invention without making any inventive effort, are intended to be within the scope of the embodiments of the present invention.
In order to better understand the above technical solutions, the following describes the above technical solutions in detail with reference to the accompanying drawings.
Referring to fig. 1 and fig. 2 together, fig. 1 is a schematic structural diagram of a first embodiment of a local high heat dissipation circuit board according to the present invention, and fig. 2 is a schematic flow chart of an embodiment of a method for manufacturing a local high heat dissipation circuit board according to the present invention.
As shown in fig. 1, the local high heat dissipation circuit board 10 is manufactured by the manufacturing method in fig. 2, wherein the local high heat dissipation circuit board 10 includes a first dielectric layer 100, a laminated heat dissipation layer 200, an electroplated copper layer 300, and a patterned laminated copper foil layer 400.
Specifically, the laminated heat dissipation layer 200 is formed on the first dielectric layer 100, where the laminated heat dissipation layer 200 includes a non-heat dissipation copper-aluminum alloy plate area 220 and a heat dissipation copper-aluminum alloy plate area 210, and the heat dissipation copper-aluminum alloy plate area 210 is located in a high heat dissipation electronic device area of the local high heat dissipation circuit board 10; a copper electroplating layer 300 formed on the lamination heat dissipation layer 200; the pattern-bonded copper foil layer 400 is formed on the electroplated copper layer 300. The method for manufacturing the local and local high heat dissipation circuit board 10 of this embodiment is specifically described below.
Referring to fig. 2, a method for manufacturing a local high heat dissipation circuit board includes the following steps:
s110: manufacturing a lamination heat dissipation layer:
taking a first dielectric layer 100, and manufacturing a pressing heat dissipation layer 200 on the first dielectric layer 100, wherein the pressing heat dissipation layer 200 comprises a non-heat dissipation copper-aluminum alloy plate area 220 and a heat dissipation copper-aluminum alloy plate area 210, and the heat dissipation copper-aluminum alloy plate area 210 is positioned in a high heat dissipation electronic device area of the circuit board;
specifically, windowing is carried out on the pressed heat dissipation layer, and the windowing treatment area is larger than the copper-aluminum alloy plate area; the length and the width of the windowing treatment area are both 0.5-2mm greater than those of the copper-aluminum alloy plate area; the windowing area is a high-heat-dissipation electronic device area of the circuit board; wherein, the area of windowing is 0.5mm ~ 2.0mm larger than unilateral size of above-mentioned heat dissipation copper aluminum alloy sheet area (namely copper aluminum alloy sheet) and is regional (set up the area of windowing that is bigger than copper aluminum alloy sheet, in order to guarantee after the pressfitting heat dissipation layer can just "block" copper aluminum alloy sheet just).
S120: manufacturing a heat dissipation copper-aluminum alloy plate area 210:
performing windowing treatment on the pressing heat dissipation layer to form a windowing treatment area;
placing a copper aluminum alloy plate in the windowing treatment area to form a heat dissipation copper aluminum alloy plate area;
the windowing treatment area is larger than the heat dissipation copper-aluminum alloy plate area;
s130: manufacturing a high heat dissipation copper-aluminum alloy plate area:
grooving the heat dissipation copper aluminum alloy plate area to form a groove body, wherein the thickness of the groove body is 1/3 to 1/2 of that of the heat dissipation copper aluminum alloy plate area, and copper paste is printed in the groove body through silk-screen printing to obtain a high heat dissipation copper aluminum alloy plate area;
specifically, a copper-aluminum alloy plate (heat dissipation copper-aluminum alloy plate area) with the same size is manufactured in a windowing area, slotting treatment is carried out in the copper-aluminum alloy plate, a groove body is arranged at the center of one surface of the copper-aluminum alloy plate, and the size of the groove body is 1-5 mm smaller than that of the single side of the copper-aluminum alloy plate.
The manufacturing method in the concrete practical application is that typesetting is carried out before the pressing procedure, the copper-aluminum alloy plate is placed in a windowing area, the groove body is placed upwards, and finally, the manufacturing procedures of typesetting, pressing and the like are carried out; it is worth mentioning that the copper-aluminum alloy plate (section) can be trapezoid or truncated cone, and the trapezoid long side is downwards arranged when typesetting is performed in the lamination process.
The grooving process is a numerical control milling machine processing mode or a graphical processing mode.
Furthermore, copper paste is manufactured in the groove body subjected to grooving treatment, so that the copper paste is flush with the copper aluminum alloy plate. In other embodiments, the copper paste may be replaced with silver paste. The manufacturing method for filling copper paste (or silver paste) in practical application comprises the following steps: a screen printer is adopted, and an aluminum sheet net (instead of a silk screen) is used for plugging copper paste (or silver paste); manufacturing an aluminum sheet net (the window opening area of the aluminum sheet net is 0.3 mm-0.6 mm larger than the unilateral area of a copper-aluminum alloy plate on a circuit board); then using a screen printing machine to plug copper paste for the first time; then pre-curing (baking at 150 ℃ C. For 30min in an oven); then using a screen printing machine to plug copper paste for the second time; then post-curing (oven baking 150 ℃ C. For 60 min); then polishing (non-woven fabric polishing and ceramic polishing); and finally, finishing the lamination heat dissipation layer of the circuit board.
S140: manufacturing an electroplated copper layer 300:
performing film sealing treatment on the first dielectric layer 100 facing away from the laminated heat dissipation layer 200 to obtain a circuit board to be electroplated;
electroplating the circuit board to be electroplated;
performing film tearing treatment on the circuit board subjected to the electroplating treatment to form an electroplated copper layer 300 on the surface of the pressed heat dissipation layer;
in specific practical application, the method for manufacturing the electroplated copper layer comprises the following steps: firstly, edge sealing (the edges of the plate which do not need to be electroplated are sealed by polyimide adhesive films, and the thickness is generally 3 mm-6 mm); then copper deposition pretreatment is carried out; then copper deposition step treatment (without removing glue, preventing the glue from damaging the dielectric layer and copper paste); then the whole plate electroplating process treatment (the binding force between electroplated copper and copper paste is good); then tearing off the adhesive film on the edge of the plate after electroplating; then drying; finally, the electroplated copper layer of the circuit board is completed.
Wherein the thickness of the electroplated copper layer is 10-30 μm.
S150: manufacturing a pressed copper foil layer:
performing surface micro-roughening treatment on the electroplated copper layer 300 to obtain a circuit board to be pressed;
laminating the cover copper foil and the circuit board to be laminated so that the surface layer of the electroplated copper layer 300 is a laminated copper foil layer;
in specific practical application, the method for manufacturing the laminated copper foil layer comprises the following steps: first, surface micro-roughening treatment (microetching, or browning treatment); then covering copper foil; and finally, pressing copper foil.
Wherein the thickness of the pressed copper foil layer is 10-30 mu m.
S160: manufacturing a local high heat dissipation circuit board 10:
the laminated copper foil layer is patterned to form a patterned laminated copper foil layer 400.
In specific practical application, the manufacturing method of the circuit pattern comprises the following steps: firstly, pasting a dry film; then the exposure procedure is carried out; then the development process is carried out; then etching process treatment is carried out; finally, the film stripping procedure is carried out, and the patterned pressed copper foil layer of the circuit board is completed.
Specifically, the circuit patterning comprises a coverage area and a circuit area, wherein the coverage area covers the copper aluminum alloy plate, and the size of the coverage area is 0.5 mm-2.0 mm larger than the single side of the copper aluminum alloy plate; the circuit area is connected with the coverage area (is an integral pattern), and extends to other pattern areas of the circuit board (completes the functions of heat collection, heat conduction, heat dissipation and the like).
Through the above processing, the local high heat dissipation circuit board 10 is integrally formed.
The beneficial effects of this technical scheme lie in, through pressfitting copper aluminum alloy plate, increased radiating base plate area, the characteristic of the high radiating efficiency of reuse copper thick liquid combines the positive circuit preparation of extension to the circuit board on copper thick liquid surface, make the heat dissipation function in high radiating area can effectively extend to the whole board of circuit board, improved radiating efficiency, and copper aluminum alloy plate and circuit board itself's combined area is bigger, the processing preparation of more easily, also be difficult to appear local overheated or vibrations split scheduling problem in the application process, be favorable to medical equipment to exert the biggest, most accurate measurement value.
Referring to fig. 3 and fig. 4 together, fig. 3 is a schematic structural diagram of a second embodiment of a local high heat dissipation circuit board according to the present invention, and fig. 4 is a flow chart of another embodiment of a manufacturing method of a local high heat dissipation circuit board according to the present invention.
As shown in fig. 3, the structure and the manufacturing method of the second embodiment are substantially the same as those of the first embodiment, except that the other local high heat dissipation circuit board 10A of the embodiment further includes a heat conductive film layer 500, where one heat conductive film layer 500 is located between the laminated heat dissipation layer 200 and the electroplated copper layer 300, and the other structures are the same as those of the first embodiment, and will not be described herein.
Referring to fig. 4, a method for manufacturing a local high heat dissipation circuit board includes the following steps:
step S210, a pressing heat dissipation layer is formed on the first dielectric layer, the pressing heat dissipation layer comprises a non-heat dissipation copper-aluminum alloy plate area and a heat dissipation copper-aluminum alloy plate area, and the heat dissipation copper-aluminum alloy plate area is located in a high heat dissipation electronic device area of the circuit board.
In step S220, a heat conductive thin film layer is formed on the heat dissipation layer.
In step S230, electroplating is performed on the laminated heat dissipation layer including the heat conductive film layer, so that the surface layer of the heat conductive film layer is an electroplated copper layer.
Step S240, performing copper foil laminating treatment on the electroplated copper layer, so that the surface layer of the electroplated copper layer is a copper foil laminating layer.
Step S250, the copper foil layer is patterned to form a patterned copper foil layer.
Namely, electroplating treatment is carried out on the laminated heat dissipation layer, so that the step of electroplating copper layer on the surface layer of the laminated heat dissipation layer comprises the following steps:
forming a heat conducting film layer on the pressing heat dissipation layer;
and electroplating on the lamination heat dissipation layer containing the heat conduction film layer to make the surface layer of the heat conduction film layer be an electroplated copper layer.
In this embodiment, a heat conducting thin film layer is disposed between the electroplated copper layer and the press-fit heat dissipation layer, which is favorable for the combination of the electroplated copper layer and plays a role in further heat conduction. Wherein the heat conducting film layer is a polytetrafluoroethylene film layer or a heat conducting silica gel film layer or an ethylene-polytetrafluoroethylene blend film layer.
In summary, it is easy to understand by those skilled in the art that in the method for manufacturing a local high heat dissipation circuit board provided by the invention, by arranging the lamination heat dissipation layer, the lamination heat dissipation layer comprises the high heat dissipation copper aluminum alloy plate area, so that the heat dissipation area of the circuit board is increased, the heat dissipation efficiency is also improved, and the high heat dissipation circuit board is easy to process and manufacture, and is not easy to generate problems of local overheating or vibration splitting and the like in the actual application process, thereby being beneficial to medical equipment to exert the maximum and most accurate measurement value.
The foregoing description is only the preferred embodiments of the present invention, and is not intended to limit the scope of the embodiments of the present invention, and all the equivalent structural changes made by the descriptions of the embodiments of the present invention and the accompanying drawings or the direct/indirect application in other related technical fields are included in the scope of the embodiments of the present invention.
Claims (4)
1. The manufacturing method of the local high-heat-dissipation circuit board is characterized by comprising the following steps of:
s110: manufacturing a lamination heat dissipation layer:
a first dielectric layer is taken, a pressing heat dissipation layer is formed on the first dielectric layer, the pressing heat dissipation layer comprises a non-heat dissipation copper aluminum alloy plate area and a heat dissipation copper aluminum alloy plate area, and the heat dissipation copper aluminum alloy plate area is located in a high heat dissipation electronic device area of the circuit board;
s120: manufacturing a heat dissipation copper-aluminum alloy plate area:
performing windowing treatment on the pressing heat dissipation layer to form a windowing treatment area;
placing a copper aluminum alloy plate in the windowing treatment area to form a heat dissipation copper aluminum alloy plate area;
the windowing treatment area is larger than the heat dissipation copper-aluminum alloy plate area;
s130: manufacturing a high heat dissipation copper-aluminum alloy plate area:
grooving the heat dissipation copper aluminum alloy plate area to form a groove body, wherein the thickness of the groove body is 1/3 to 1/2 of that of the heat dissipation copper aluminum alloy plate area, and copper paste is printed in the groove body through silk-screen printing to obtain a high heat dissipation copper aluminum alloy plate area;
s140: manufacturing an electroplated copper layer:
sealing the first dielectric layer facing away from the laminated heat dissipation layer to obtain a circuit board to be electroplated;
electroplating the circuit board to be electroplated;
performing film tearing treatment on the circuit board subjected to the electroplating treatment to form an electroplated copper layer on the surface of the pressed heat dissipation layer;
s150: manufacturing a pressed copper foil layer:
carrying out surface micro-roughening treatment on the pressed heat dissipation layer to obtain a circuit board to be pressed;
laminating the cover copper foil and the circuit board to be laminated so that the surface layer of the electroplated copper layer is a laminated copper foil layer;
s160: manufacturing a local high-heat-dissipation circuit board:
patterning the laminated copper foil layer to form a patterned laminated copper foil layer; thereby forming the local high heat dissipation circuit board.
2. The method for manufacturing a local high heat dissipation circuit board according to claim 1, wherein before the step of performing a film sealing treatment on the first dielectric layer facing away from the laminated heat dissipation layer to obtain a circuit board to be electroplated, the method comprises:
forming a heat conduction film layer on the pressing heat dissipation layer;
and electroplating on the heat conducting film layer to make the surface layer of the heat conducting film layer be an electroplated copper layer.
3. A local high heat dissipation circuit board, characterized in that the high heat dissipation circuit board is manufactured by the manufacturing method of claim 1 or 2, and the high heat dissipation circuit board comprises:
a first dielectric layer;
the laminated radiating layer is formed on the first dielectric layer and comprises a non-radiating copper-aluminum alloy plate area and a radiating copper-aluminum alloy plate area, and the radiating copper-aluminum alloy plate area is positioned in a high-radiating electronic device area of the circuit board;
the electroplated copper layer is formed on the lamination heat dissipation layer;
and the pattern pressing copper foil layer is formed on the electroplated copper layer.
4. The localized high heat dissipation circuit board of claim 3, further comprising a thermally conductive film layer positioned between the laminate heat dissipation layer and the electroplated copper layer.
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| CN202110273976.6A CN113141711B (en) | 2021-03-15 | 2021-03-15 | Manufacturing method of local high-heat-dissipation circuit board and high-heat-dissipation circuit board |
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| CN202110273976.6A CN113141711B (en) | 2021-03-15 | 2021-03-15 | Manufacturing method of local high-heat-dissipation circuit board and high-heat-dissipation circuit board |
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| CN113141711B true CN113141711B (en) | 2023-06-02 |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108419376A (en) * | 2018-05-14 | 2018-08-17 | 星河电路（福建）有限公司 | A kind of production method of the high thick copper pcb board of selective local plating |
| CN110933850A (en) * | 2019-12-09 | 2020-03-27 | 赣州金顺科技有限公司 | Manufacturing method of high-heat-dissipation double-sided sandwich copper-based printed circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN201623133U (en) * | 2010-01-29 | 2010-11-03 | 江苏长电科技股份有限公司 | Packaging structure of printed circuit board with flip chip and rectangular radiating block with locking hole |
| KR101055297B1 (en) * | 2010-03-18 | 2011-08-09 | 기주산업(주) | Method for fabricating metal pcb with improved thermal emission characteristics |
| CN106572609A (en) * | 2016-11-04 | 2017-04-19 | 深圳市深联电路有限公司 | Manufacture method for manufacturing high-thermal-conductivity and single-sided aluminum substrate |
| CN107645827B (en) * | 2017-09-20 | 2019-12-10 | 苏州三一冷暖工程有限公司 | High heat dissipation level progressive metal layer structure |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108419376A (en) * | 2018-05-14 | 2018-08-17 | 星河电路（福建）有限公司 | A kind of production method of the high thick copper pcb board of selective local plating |
| CN110933850A (en) * | 2019-12-09 | 2020-03-27 | 赣州金顺科技有限公司 | Manufacturing method of high-heat-dissipation double-sided sandwich copper-based printed circuit board |
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