CN113141711A - Manufacturing method of local high-heat-dissipation circuit board and high-heat-dissipation circuit board - Google Patents
Manufacturing method of local high-heat-dissipation circuit board and high-heat-dissipation circuit board Download PDFInfo
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- CN113141711A CN113141711A CN202110273976.6A CN202110273976A CN113141711A CN 113141711 A CN113141711 A CN 113141711A CN 202110273976 A CN202110273976 A CN 202110273976A CN 113141711 A CN113141711 A CN 113141711A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
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- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a manufacturing method of a local high-heat-dissipation circuit board, which comprises the following steps: forming a press-fit heat dissipation layer on the first medium layer, wherein the press-fit heat dissipation layer comprises a non-heat-dissipation copper aluminum alloy plate area and a heat-dissipation copper aluminum alloy plate area, and the heat-dissipation copper aluminum alloy plate area is positioned in a high-heat-dissipation electronic device area of the circuit board; electroplating the laminated heat dissipation layer to make the surface layer of the laminated heat dissipation layer be an electroplated copper layer; carrying out pressing copper foil treatment on the electroplated copper layer so as to enable the surface layer of the electroplated copper layer to be a pressing copper foil layer; and patterning and laminating the copper foil layer to form the patterned and laminated copper foil layer. According to the invention, the laminated heat dissipation layer is arranged and comprises the high heat dissipation copper-aluminum alloy plate area, so that the heat dissipation area of the circuit board is increased, the heat dissipation efficiency is also improved, the high heat dissipation circuit board is easy to process and manufacture, the problems of local overheating or vibration splitting and the like are not easy to occur in the practical application process, and the maximum and accurate measurement value of medical equipment is favorably exerted.
Description
Technical Field
The invention relates to the technical field of circuit board manufacturing, in particular to a manufacturing method of a local high-heat-dissipation circuit board and the high-heat-dissipation circuit board.
Background
The development of medical technology has higher and higher requirements on the precision of medical equipment, and for the medical equipment which needs to be started for a long time or used at a high frequency, a circuit board used by the medical equipment needs to have the performances of refinement, high heat dissipation and high sensitivity.
The circuit board that uses among the medical equipment of prior art is the circuit board of general organic polymer substrate and copper circuit type, the heat dispersion of this type of circuit board is relatively poor, if long-term use or high frequency use, produce local overheated problem easily, influence the accuracy of detection data, if increase supplementary heat conduction device, need higher cost on the one hand, and can increase the equipment volume, influence the effect that circuit board and medical equipment become more meticulous, on the other hand can influence the precision of equipment, and because the restriction of circuit board material and processing characteristics itself, it is not very ideal to increase the radiating effect of supplementary radiating equipment.
Present local high heat dissipation circuit board generally adopts the mode preparation at local embedding copper billet, but the radiating efficiency of copper billet is lower, produce local overheat scheduling problem easily, lead to circuit board self thermal expansion coefficient too big, influence the stability and the reliability of circuit board, and the embedding copper billet can be seen as relying on in the mode of "machinery" imbeds the circuit board with the copper billet, under the general condition, the surface of embedding copper billet can not make the circuit figure again, and the copper billet itself is difficult to link to each other with the circuit figure, therefore, lead to the radiating efficiency reduction of copper billet, and the copper billet can increase the quality of circuit board, thereby increase the overall quality of equipment.
Based on the above problems, it is desirable to provide a circuit board product which can effectively meet the local over-high and over-fast heat dissipation requirements of medical equipment, thereby meeting the requirements of medical equipment on high-precision detection.
Disclosure of Invention
The invention mainly aims to provide a manufacturing method of a local high-heat-dissipation circuit board and the high-heat-dissipation circuit board, and aims to solve the technical problem that the circuit board in the prior art cannot meet the requirement of high and quick local heat dissipation of medical equipment.
In order to achieve the above object, an embodiment of the present invention provides a method for manufacturing a local high heat dissipation circuit board, where the method includes: forming a press-fit heat dissipation layer on the first medium layer, wherein the press-fit heat dissipation layer comprises a non-heat dissipation copper aluminum alloy plate area and a heat dissipation copper aluminum alloy plate area, and the heat dissipation copper aluminum alloy plate area is positioned in a high heat dissipation electronic device area of the circuit board; electroplating treatment is carried out on the pressed heat dissipation layer, so that the surface layer of the pressed heat dissipation layer is an electroplated copper layer; carrying out pressing copper foil treatment on the electroplated copper layer so as to enable the surface layer of the electroplated copper layer to be a pressing copper foil layer; and patterning the laminated copper foil layer to form the patterned laminated copper foil layer.
The step of forming the laminated heat dissipation layer on the first dielectric layer comprises the following steps: windowing is carried out on the pressed heat dissipation layer, and the windowing processing area is larger than the area of the copper-aluminum alloy plate; and placing a copper-aluminum alloy plate in the windowing treatment area to obtain the heat dissipation copper-aluminum alloy plate area.
The step of carrying out wire copper aluminum alloy wire printing treatment on the windowing treatment area to obtain the heat dissipation copper aluminum alloy plate area comprises the following steps: grooving the area of the heat dissipation copper-aluminum alloy plate; and carrying out copper paste filling on the heat dissipation copper-aluminum alloy plate area subjected to the slotting treatment through silk-screen printing treatment to obtain a high heat dissipation copper-aluminum alloy plate area.
The thickness of the slotting treatment area is 1/3-1/2 of the thickness of the copper-aluminum alloy plate area.
And the slotting treatment is a numerical control milling machine processing mode or a graphical processing mode.
The method for electroplating the laminated heat dissipation layer to enable the surface layer of the laminated heat dissipation layer to be the electroplated copper layer comprises the following steps: carrying out film sealing treatment on the first dielectric layer back to the pressed heat dissipation layer to obtain a circuit board to be electroplated; electroplating the circuit board to be electroplated; and carrying out film tearing treatment on the circuit board subjected to electroplating treatment so as to enable the surface layer of the pressed heat dissipation layer to be an electroplated copper layer.
The method for carrying out pressing copper foil treatment on the electroplated copper layer to enable the surface layer of the electroplated copper layer to be a pressing copper foil layer comprises the following steps: performing surface micro-roughening treatment on the pressed heat dissipation layer to obtain a circuit board to be pressed; and pressing the covering copper foil and the circuit board to be pressed together so as to enable the surface layer of the electroplated copper layer to be a pressed copper foil layer.
The step of electroplating the laminated heat dissipation layer to make the surface layer of the laminated heat dissipation layer be an electroplated copper layer comprises the following steps: forming a heat-conducting thin film layer on the pressed heat dissipation layer; and electroplating the pressed heat dissipation layer containing the heat conduction film layer to enable the surface layer of the heat conduction film layer to be an electroplated copper layer.
In order to achieve the above object, an embodiment of the present invention further provides a local high thermal dissipation circuit board, where the high thermal dissipation circuit board is manufactured by any one of the above manufacturing methods, and the local high thermal dissipation circuit board includes:
a first dielectric layer; the laminated heat dissipation layer is formed on the first medium layer and comprises a non-heat dissipation copper-aluminum alloy plate area and a heat dissipation copper-aluminum alloy plate area, and the heat dissipation copper-aluminum alloy plate area is located in a high-heat dissipation electronic device area of the circuit board; the copper electroplating layer is formed on the pressed heat dissipation layer; and pressing the copper foil layer in a pattern to form the copper electroplating layer.
The high-heat-dissipation circuit board further comprises a heat conduction thin film layer, and the heat conduction thin film layer is located between the press-fit heat dissipation layer and the electroplated copper layer.
Compared with the prior art, according to the technical scheme provided by the invention, the press-fit heat dissipation layer is arranged and comprises the high-heat-dissipation copper-aluminum alloy plate region, so that the heat dissipation area of the circuit board is increased, the heat dissipation efficiency is also improved, the high-heat-dissipation circuit board is easy to process and manufacture, the problems of local overheating or vibration splitting and the like are not easy to occur in the practical application process, and the maximum and accurate measurement value of medical equipment is favorably exerted.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a local high heat dissipation circuit board according to a first embodiment of the present invention;
FIG. 2 is a schematic flow chart illustrating a method for manufacturing a local high-heat-dissipation circuit board according to an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a second embodiment of a local high-heat-dissipation circuit board according to the present invention;
fig. 4 is a schematic flow chart illustrating a manufacturing method of a local high heat dissipation circuit board according to another embodiment of the present invention.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 100 | A first |
200 | Laminated |
| 300 | Electroplated |
210 | Heat dissipating copper aluminum |
| 400 | Figure pressfitting |
201 | High heat dissipation copper aluminum |
| 500 | Heat-conducting |
220 | Non-heat-dissipating copper-aluminum alloy plate region |
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments that can be obtained by a person skilled in the art based on the embodiments of the present invention without any inventive step belong to the scope of the embodiments of the present invention.
In order to better understand the technical scheme, the technical scheme is described in detail below with reference to the accompanying drawings.
Referring to fig. 1 and fig. 2 together, fig. 1 is a schematic structural diagram of a local high heat dissipation circuit board according to a first embodiment of the present invention, and fig. 2 is a schematic flow chart of a manufacturing method of a local high heat dissipation circuit board according to an embodiment of the present invention.
As shown in fig. 1, the high thermal dissipation circuit board 10 is manufactured by the manufacturing method shown in fig. 2, wherein the high thermal dissipation circuit board 10 includes a first dielectric layer 100, a laminated thermal dissipation layer 200, an electroplated copper layer 300, and a patterned laminated copper foil layer 400.
Specifically, the laminated heat dissipation layer 200 is formed on the first dielectric layer 100, wherein the laminated heat dissipation layer 200 includes a non-heat dissipation copper aluminum alloy plate region 220 and a heat dissipation copper aluminum alloy plate region 210, and the heat dissipation copper aluminum alloy plate region 210 is located in a high heat dissipation electronic device region of the circuit board 10; an electroplated copper layer 300 formed on the laminated heat dissipation layer 200; the copper foil layer 400 is patterned and laminated to form the electroplated copper layer 300. The method for manufacturing the high heat dissipation circuit board 10 of this embodiment is specifically described below.
Referring to fig. 2, a method for manufacturing a local high heat dissipation circuit board includes the following steps:
step S110, a pressed heat dissipation layer is formed on the first medium layer, the pressed heat dissipation layer comprises a non-heat dissipation copper aluminum alloy plate area and a heat dissipation copper aluminum alloy plate area, and the heat dissipation copper aluminum alloy plate area is located in a high heat dissipation electronic device area of the circuit board.
Step S120, an electroplating process is performed on the pressed heat dissipation layer, so that the surface layer of the pressed heat dissipation layer is an electroplated copper layer.
Step S130, performing a copper foil lamination process on the electroplated copper layer to make the surface layer of the electroplated copper layer a laminated copper foil layer.
Step S140, the copper foil layer is subjected to graphical lamination to form a graphical laminated copper foil layer.
The high-heat-dissipation circuit board manufactured by the manufacturing method is provided with the press-fit heat dissipation layer, the press-fit heat dissipation layer comprises the high-heat-dissipation copper-aluminum alloy plate area, the heat dissipation area of the circuit board is increased, the heat dissipation efficiency is improved, the high-heat-dissipation circuit board is easy to process and manufacture, the problems of local overheating or vibration splitting and the like are not easy to occur in the practical application process, and the maximum and accurate measurement value of medical equipment is facilitated to be exerted.
In this embodiment, the step of forming the laminated heat dissipation layer on the first dielectric layer in step S110 specifically includes:
and S101, performing windowing treatment on the pressed heat dissipation layer, wherein the windowing treatment area is larger than the area of the copper-aluminum alloy plate. Wherein, the length and the width of the windowing processing area are both 0.5-2mm greater than those of the copper-aluminum alloy plate area. And the windowed area is a high heat dissipating electronic device area of the circuit board. The windowing area is 0.5-2.0 mm larger than the unilateral size of the radiating copper-aluminum alloy plate area (namely the copper-aluminum alloy plate) (the windowing area larger than the copper-aluminum alloy plate is arranged, so that the pressing radiating layer can be used for just clamping the copper-aluminum alloy plate after pressing.
And S102, placing a copper-aluminum alloy plate in the windowing processing area to obtain a heat dissipation copper-aluminum alloy plate area.
The method in step S102 specifically includes:
performing slotting treatment on the area of the heat-dissipation copper-aluminum alloy plate;
and (4) carrying out copper paste filling on the grooved heat dissipation copper aluminum alloy plate area through silk-screen printing treatment to obtain a high heat dissipation copper aluminum alloy plate area.
Specifically, a copper aluminum alloy plate (a heat dissipation copper aluminum alloy plate area) with the same size is manufactured in a windowing area, grooving treatment is carried out in the copper aluminum alloy plate, a groove body is arranged and located in the center of one side of the copper aluminum alloy plate, and the size of the groove body is 1-5 mm smaller than that of the single side of the copper aluminum alloy plate.
The manufacturing method in the practical application comprises the steps of typesetting before the pressing process, placing the copper-aluminum alloy plate in the windowing area, placing the groove body upwards, and finally performing the manufacturing processes of typesetting, pressing and the like. It is worth mentioning that (the cross section of) the copper-aluminum alloy plate can be in a trapezoid shape or a truncated cone shape, and the long side of the trapezoid is arranged downwards when the pressing procedure is carried out.
The thickness of the slotting treatment area is 1/3-1/2 of the thickness of the copper-aluminum alloy plate area. The slotting treatment is a numerical control milling machine processing mode or a graphical processing mode.
Furthermore, copper slurry is manufactured in the groove body subjected to grooving treatment, so that the copper slurry is flush with the copper-aluminum alloy plate. In other embodiments, the copper paste may be replaced by a silver paste. The manufacturing method of the stuffing copper paste (or silver paste) in practical application comprises the following steps: a screen printing machine is adopted, and an aluminum mesh (instead of a silk screen) is used for plugging copper paste (or silver paste); manufacturing an aluminum sheet mesh (the windowing area of the aluminum sheet mesh is 0.3-0.6 mm larger than the single edge of the area of the copper-aluminum alloy plate on the circuit board); then, using a screen printing machine to plug the copper paste for the first time; then precuring (baking in an oven at 150 ℃ for 30 min); then, using a screen printing machine to plug the copper paste for the second time; then post-curing (baking in an oven at 150 ℃ for 60 min); then polishing (non-woven fabric polishing, ceramic polishing); and finally, completing the press-fit heat dissipation layer of the circuit board.
In this embodiment, step S120 specifically includes:
step S201, a first dielectric layer facing away from the heat dissipation layer is sealed to obtain a circuit board to be electroplated.
Step S202, the circuit board to be electroplated is electroplated.
Step S203, the electroplated circuit board is subjected to film tearing treatment, so that the surface layer of the pressed heat dissipation layer is an electroplated copper layer.
In the concrete practical application, the method for manufacturing the electroplated copper layer comprises the following steps: firstly, edge sealing (sealing the edges of the plate which does not need to be electroplated by using a polyimide adhesive film, generally 3-6 mm); then copper deposition pretreatment is carried out; then carrying out copper deposition process (glue removal is not carried out, and damage to the dielectric layer and the copper slurry caused by glue removal is prevented); then the whole board is electroplated and processed (the binding force of the electroplated copper and the copper slurry is good); then tearing off the plate edge glue film after electroplating; then drying; and finally, completing the copper electroplating layer of the circuit board.
Wherein the thickness of the electroplated copper layer is 10-30 μm.
In this embodiment, step S130 specifically includes:
step S301, performing surface micro-roughening treatment on the pressed heat dissipation layer to obtain a circuit board to be pressed.
Step S302, the covering copper foil and the circuit board to be pressed are pressed, so that the surface layer of the electroplated copper layer is a pressed copper foil layer.
In a specific practical application, the method for manufacturing the laminated copper foil layer comprises the following steps: firstly, carrying out surface micro-roughening treatment (micro-etching or browning treatment); then covering a copper foil; and finally, pressing the copper foil.
Wherein the thickness of the pressed copper foil layer is 10-30 μm.
Step S140, the copper foil layer is subjected to graphical lamination to form a graphical laminated copper foil layer. In a specific practical application, the manufacturing method of the circuit patterning comprises the following steps: firstly, dry film pasting process treatment; then carrying out exposure process; then carrying out development process treatment; then etching process treatment is carried out; and finally, performing film removing process treatment, namely finishing the graphical press-fit copper foil layer of the circuit board.
Specifically, the circuit patterning comprises a covering area and a circuit area, wherein the covering area covers the copper-aluminum alloy plate, and the size of the covering area is 0.5-2.0 mm larger than the single side of the size of the copper-aluminum alloy plate; the circuit area is connected with the covering area (is an integral graph), and the circuit area extends to other graph areas of the circuit board (to complete the functions of heat collection, heat conduction, heat dissipation and the like).
The technical scheme has the beneficial effects that the area of the radiating substrate is increased by pressing the copper-aluminum alloy plate, the characteristic of high heat dissipation efficiency of copper paste is recycled, the surface of the copper paste is combined with the circuit manufacture extending to the front surface of the circuit board, so that the heat dissipation function of a high heat dissipation area can be effectively extended to the whole circuit board, the heat dissipation efficiency is improved, the combination area of the copper-aluminum alloy plate and the circuit board is larger, the processing and the manufacture are easier, the problems of local overheating or vibration and splitting and the like are not easy to occur in the application process, and the maximum and accurate measurement value of medical equipment can be favorably exerted.
Referring to fig. 3 and 4 together, fig. 3 is a schematic structural diagram of a second embodiment of a local high heat dissipation circuit board of the present invention, and fig. 4 is a schematic flow chart of a manufacturing method of a local high heat dissipation circuit board of another embodiment of the present invention. As shown in fig. 3, the structure and the manufacturing method of the second embodiment are substantially the same as those of the first embodiment, except that the high thermal dissipation circuit board 20 of the embodiment further includes a thermal conductive film layer 500, wherein the thermal conductive film layer 500 is located between the press-fit heat dissipation layer 200 and the copper electroplating layer 300, and other structures are the same as those of the first embodiment and are not repeated herein.
Referring to fig. 4, a method for manufacturing a local high heat dissipation circuit board includes the following steps:
step S210, a pressed heat dissipation layer is formed on the first medium layer, the pressed heat dissipation layer comprises a non-heat dissipation copper aluminum alloy plate area and a heat dissipation copper aluminum alloy plate area, and the heat dissipation copper aluminum alloy plate area is located in a high heat dissipation electronic device area of the circuit board.
Step S220 is to form a heat conductive thin film layer on the heat dissipation layer.
Step S230, an electroplating process is performed on the pressed heat dissipation layer including the heat conductive film layer, so that the surface layer of the heat conductive film layer is an electroplated copper layer.
Step S240, performing a copper foil lamination process on the electroplated copper layer, so that the surface layer of the electroplated copper layer is a laminated copper foil layer.
Step S250, the copper foil layer is subjected to graphical lamination to form a graphical laminated copper foil layer.
Namely, the step of electroplating treatment on the pressed heat dissipation layer to make the surface layer of the pressed heat dissipation layer be the electroplated copper layer comprises the following steps:
forming a heat-conducting film layer on the pressed heat dissipation layer;
and electroplating the laminated heat dissipation layer containing the heat conduction film layer to enable the surface layer of the heat conduction film layer to be an electroplated copper layer.
In this embodiment, set up the heat conduction thin layer between electroplated copper layer and pressfitting heat dissipation layer, be favorable to the combination of electroplated copper layer to play further heat conduction effect. Wherein, the heat conduction film layer is a polytetrafluoroethylene film layer or a heat conduction silica gel film layer or an ethylene-polytetrafluoroethylene blend film layer.
In summary, it is easily understood by those skilled in the art that, in the manufacturing method of the local high heat dissipation circuit board provided by the invention, by arranging the press-fit heat dissipation layer, the press-fit heat dissipation layer includes the high heat dissipation copper aluminum alloy plate region, the heat dissipation area of the circuit board is increased, the heat dissipation efficiency is also improved, the high heat dissipation circuit board is easy to process and manufacture, the problems of local overheating or vibration splitting and the like are not easy to occur in the practical application process, and the method is beneficial to the medical equipment to exert the maximum and accurate measurement value.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the embodiments of the present invention, and all modifications and equivalents that can be made by using the contents of the description and drawings of the embodiments of the present invention or directly/indirectly applied to other related technical fields are included in the scope of the embodiments of the present invention.
Claims (10)
1. A manufacturing method of a local high heat dissipation circuit board is characterized by comprising the following steps:
forming a press-fit heat dissipation layer on the first medium layer, wherein the press-fit heat dissipation layer comprises a non-heat dissipation copper aluminum alloy plate area and a heat dissipation copper aluminum alloy plate area, and the heat dissipation copper aluminum alloy plate area is positioned in a high heat dissipation electronic device area of the circuit board;
electroplating treatment is carried out on the pressed heat dissipation layer, so that the surface layer of the pressed heat dissipation layer is an electroplated copper layer;
carrying out pressing copper foil treatment on the electroplated copper layer so as to enable the surface layer of the electroplated copper layer to be a pressing copper foil layer;
and patterning the laminated copper foil layer to form the patterned laminated copper foil layer.
2. The method of claim 1, wherein the step of forming a laminated heat sink layer on the first dielectric layer comprises:
windowing is carried out on the pressed heat dissipation layer, and the windowing processing area is larger than the area of the copper-aluminum alloy plate;
and placing a copper-aluminum alloy plate in the windowing treatment area to obtain the heat dissipation copper-aluminum alloy plate area.
3. The method of claim 2, wherein said step of wire copper aluminum alloy wire printing said windowed processing region to obtain said heat dissipating copper aluminum alloy plate region comprises:
grooving the area of the heat dissipation copper-aluminum alloy plate;
and carrying out copper paste filling on the heat dissipation copper-aluminum alloy plate area subjected to the slotting treatment through silk-screen printing treatment to obtain a high heat dissipation copper-aluminum alloy plate area.
4. The manufacturing method of claim 3, wherein the thickness of the slotting treatment region is 1/3-1/2 of the thickness of the heat dissipation copper aluminum alloy plate region.
5. The manufacturing method according to claim 3, wherein the grooving process is a numerically controlled milling machine machining method or a patterning machining method.
6. The method of claim 3, wherein the step of performing an electroplating process on the bonded heat spreader layer to make the surface layer of the bonded heat spreader layer a copper electroplating layer comprises:
carrying out film sealing treatment on the first dielectric layer back to the pressed heat dissipation layer to obtain a circuit board to be electroplated;
electroplating the circuit board to be electroplated;
and carrying out film tearing treatment on the circuit board subjected to electroplating treatment so as to enable the surface layer of the pressed heat dissipation layer to be an electroplated copper layer.
7. The method of claim 6, wherein the step of performing a copper foil lamination process on the electroplated copper layer to make the surface layer of the electroplated copper layer a laminated copper foil layer comprises:
performing surface micro-roughening treatment on the pressed heat dissipation layer to obtain a circuit board to be pressed;
and pressing the covering copper foil and the circuit board to be pressed together so as to enable the surface layer of the electroplated copper layer to be a pressed copper foil layer.
8. The method as claimed in any one of claims 1 to 7, wherein the step of performing an electroplating process on the laminated heat spreader layer to make the surface layer of the laminated heat spreader layer a copper electroplating layer comprises:
forming a heat-conducting thin film layer on the pressed heat dissipation layer;
and electroplating the pressed heat dissipation layer containing the heat conduction film layer to enable the surface layer of the heat conduction film layer to be an electroplated copper layer.
9. A local high heat dissipation circuit board, characterized in that the high heat dissipation circuit board is manufactured by the method of any one of claims 1 to 7, the high heat dissipation circuit board comprising:
a first dielectric layer;
the laminated heat dissipation layer is formed on the first medium layer and comprises a non-heat dissipation copper-aluminum alloy plate area and a heat dissipation copper-aluminum alloy plate area, and the heat dissipation copper-aluminum alloy plate area is located in a high-heat dissipation electronic device area of the circuit board;
the copper electroplating layer is formed on the pressed heat dissipation layer;
and pressing the copper foil layer in a pattern to form the copper electroplating layer.
10. The high heat dissipation circuit board of claim 9, further comprising a heat conductive film layer between the pressed heat dissipation layer and the copper plating layer.
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| CN202110273976.6A CN113141711B (en) | 2021-03-15 | 2021-03-15 | Manufacturing method of local high-heat-dissipation circuit board and high-heat-dissipation circuit board |
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| CN113141711B CN113141711B (en) | 2023-06-02 |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201623133U (en) * | 2010-01-29 | 2010-11-03 | 江苏长电科技股份有限公司 | Packaging structure of printed circuit board with flip chip and rectangular radiating block with locking hole |
| KR101055297B1 (en) * | 2010-03-18 | 2011-08-09 | 기주산업(주) | Method for fabricating metal pcb with improved thermal emission characteristics |
| CN106572609A (en) * | 2016-11-04 | 2017-04-19 | 深圳市深联电路有限公司 | Manufacture method for manufacturing high-thermal-conductivity and single-sided aluminum substrate |
| CN107645827A (en) * | 2017-09-20 | 2018-01-30 | 苏州三冷暖工程有限公司 | A kind of high radiating progressive metal-layer structure of level |
| CN108419376A (en) * | 2018-05-14 | 2018-08-17 | 星河电路（福建）有限公司 | A kind of production method of the high thick copper pcb board of selective local plating |
| CN110933850A (en) * | 2019-12-09 | 2020-03-27 | 赣州金顺科技有限公司 | Manufacturing method of high-heat-dissipation double-sided sandwich copper-based printed circuit board |
-
2021
- 2021-03-15 CN CN202110273976.6A patent/CN113141711B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201623133U (en) * | 2010-01-29 | 2010-11-03 | 江苏长电科技股份有限公司 | Packaging structure of printed circuit board with flip chip and rectangular radiating block with locking hole |
| KR101055297B1 (en) * | 2010-03-18 | 2011-08-09 | 기주산업(주) | Method for fabricating metal pcb with improved thermal emission characteristics |
| CN106572609A (en) * | 2016-11-04 | 2017-04-19 | 深圳市深联电路有限公司 | Manufacture method for manufacturing high-thermal-conductivity and single-sided aluminum substrate |
| CN107645827A (en) * | 2017-09-20 | 2018-01-30 | 苏州三冷暖工程有限公司 | A kind of high radiating progressive metal-layer structure of level |
| CN108419376A (en) * | 2018-05-14 | 2018-08-17 | 星河电路（福建）有限公司 | A kind of production method of the high thick copper pcb board of selective local plating |
| CN110933850A (en) * | 2019-12-09 | 2020-03-27 | 赣州金顺科技有限公司 | Manufacturing method of high-heat-dissipation double-sided sandwich copper-based printed circuit board |
Non-Patent Citations (1)
| Title |
|---|
| 于岩 等: "不同叠层结构印制电路板散热性能研究", 《电子元件与材料》 * |
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