CN213306052U

CN213306052U - Mobile phone radiator and heat conduction copper sheet thereof

Info

Publication number: CN213306052U
Application number: CN202022345217.XU
Authority: CN
Inventors: 郭志刚
Original assignee: Linxee (beijing) Technology Ltd
Current assignee: Linxee (beijing) Technology Ltd
Priority date: 2020-10-20
Filing date: 2020-10-20
Publication date: 2021-05-28
Anticipated expiration: 2030-10-20

Abstract

The utility model discloses a cell-phone radiator and heat conduction copper sheet thereof. The method comprises the following steps: the heat conduction copper sheet of setting in the positive outside of casing, the positive middle part of casing is equipped with the opening, and the embedding of semiconductor refrigeration piece in the opening, the heat conduction copper sheet orientation the one side of casing is outstanding to be equipped with boss face, the semiconductor refrigeration piece with boss face contacts. The utility model discloses, the refrigeration face and the boss face in close contact with of semiconductor refrigeration piece, heat conduction copper sheet high temperature warp the back, still can guarantee the refrigeration face and the heat conduction copper sheet in close contact with of semiconductor refrigeration piece for the contact surface levels, guarantees the product refrigeration effect. The heat-conducting copper sheet is not required to be shaped manually, so that manpower and material resources are saved, and time is saved.

Description

Mobile phone radiator and heat conduction copper sheet thereof

Technical Field

The utility model relates to a heat dissipation technical field, concretely relates to cell-phone radiator and heat conduction copper sheet thereof.

Background

With the development of mobile phone applications, the mobile phone not only has simple functions of making and receiving calls, sending information and the like, but also has more and more new functional applications, such as surfing the internet, playing games, watching videos and the like, and the mobile phone is required to have strong operation industry storage functions, so that the smart mobile phone has mainstream requirements, the heat productivity of the smart mobile phone is higher and higher, the smart mobile phone can feel hot when the smart mobile phone is used for a long time, particularly when the smart mobile phone is used for playing games, the heat conversion speed of the smart mobile phone is not enough, the smart mobile phone can generate heat quickly, the working stability of the smart mobile phone can be influenced, the smart mobile phone can be halted in serious cases.

For solving the above-mentioned problem, chinese utility model patent CN209692835U discloses a cell-phone radiator, which comprises a housin, be provided with the fin in the casing, the casing openly is towards cell-phone one side, be provided with the semiconductor refrigeration piece between fin and the casing openly, the semiconductor refrigeration piece contacts with the fin, the fin is towards embedded fan that is provided with in casing back one side, fan and semiconductor refrigeration piece are connected with the USB interface that sets up in the casing bottom, the casing back corresponds the fan-out and has seted up the air outlet, the opening has openly been seted up to the casing, the semiconductor refrigeration piece inlays in the opening, the casing openly outside is provided with the sheetmetal, the sheetmetal contacts with the semiconductor refrigeration piece, the area of sheetmetal is greater than the area of. The utility model provides a pair of cell-phone radiator reduces radiator thickness, promotes the radiating effect.

In the above-mentioned patent, the refrigeration face can refrigerate fast through with sheetmetal in close contact with conduction, the sheetmetal is planar design, adopt red copper material conduction mostly, through the fixed red copper of moulding plastics in the mould, nevertheless take place easily behind the high temperature high pressure and warp, in order to guarantee refrigeration face and sheetmetal in close contact with, generally through manpower plastic adjustment plane degree after the completion of moulding plastics, still can't guarantee the refrigeration face can't with red copper in close contact with, the refrigeration effect is poor, and consume manpower and materials and time.

In view of this, it is urgently needed to improve the structure of the existing metal sheet to prevent the metal sheet from deforming, so that the refrigerating surface of the semiconductor refrigerating sheet is in close contact with the metal sheet, the refrigerating effect of the product is stable, and manpower, material resources and time are saved.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the technical problem that present refrigeration face can refrigerate fast through the conduction with sheetmetal in close contact with, the sheetmetal is planar design, adopt red copper material conduction mostly, through mould plastics fixed red copper in, nevertheless take place easily behind the high temperature high pressure and warp, in order to guarantee refrigeration face and sheetmetal in close contact with, generally through manpower plastic adjustment plane degree after the completion of moulding plastics, still can't guarantee the refrigeration face can't with red copper in close contact with, refrigeration effect is poor, and consume the problem of manpower and materials and time.

In order to solve the technical problem, the utility model provides a heat conduction copper sheet of cell-phone radiator, include: a heat conducting copper sheet arranged on the outer side of the front surface of the shell, an opening is arranged in the middle of the front surface of the shell, the semiconductor refrigeration sheet is embedded into the opening,

the heat conduction copper sheet is towards the one side of casing is equipped with boss face in the outstanding, the semiconductor refrigeration piece with boss face contacts.

In the scheme, the heat conduction copper sheet is made of red copper, and the boss surface and the heat conduction copper sheet are formed in a high-temperature pressing mode.

In the above scheme, the outer side of the heat conducting copper sheet is provided with the double-conducting copper foil sheet, and the outer side of the double-conducting copper foil sheet is provided with the heat conducting silica gel sheet.

A mobile phone radiator, as above be used for mobile phone radiator's heat conduction copper sheet, the casing includes drain pan and face-piece of mutual lock, be equipped with the fin in the casing, the front of fin is towards the face-piece, the back is towards the drain pan, semiconductor refrigeration piece is arranged in the fin with between the face-piece.

In the above scheme, a heat dissipation fan is further arranged in the shell, the heat dissipation fan is embedded into the back surface of the heat dissipation fin and arranged facing the face shell, and a heat dissipation opening used for air outlet of the heat dissipation fan is formed in the face shell.

In the above scheme, the fin with be equipped with the PCBA board between the semiconductor refrigeration piece, be equipped with the USB interface on the PCBA board, the bottom of drain pan be equipped with the through-hole of USB interface adaptation.

In the above scheme, the upper end and the lower end of the face shell are respectively provided with the fixing clamps, and the face shell is clamped on two sides of the mobile phone through the fixing clamps.

Compared with the prior art, the utility model discloses, increase protruding mesa on the heat conduction copper sheet, the refrigeration face and the boss face in close contact with of semiconductor refrigeration piece, heat conduction copper sheet high temperature warp the back, still can guarantee the refrigeration face and the heat conduction copper sheet in close contact with of semiconductor refrigeration piece for the contact surface levels, guarantees the product refrigeration effect. The heat-conducting copper sheet is not required to be shaped manually, so that manpower and material resources are saved, and time is saved.

Drawings

Fig. 1 is a schematic view of a split structure of the heat sink of the present invention;

FIG. 2 is a schematic plan view of a heat conductive copper sheet according to the present invention;

fig. 3 is a schematic structural view of the middle heat-conducting copper sheet and the semiconductor refrigerating sheet of the present invention;

fig. 4 is a schematic structural diagram of the middle shell of the present invention.

Wherein, the corresponding relationship between each reference number and the part name in fig. 1 to fig. 4 is:

the heat dissipation structure comprises a 10-face shell, 11 heat conduction copper sheets, 12 convex table faces, 13 fixing clamps, 20 bottom shells, 21 heat dissipation fans, 22 heat dissipation fins, 23 through holes, 30 PCBA boards, 31 USB interfaces, 40 semiconductor refrigeration sheets, 101 openings and 110 red copper.

Detailed Description

The utility model provides a cell-phone radiator and heat conduction copper sheet thereof prevents that the sheetmetal from warping to make the refrigeration face and the sheetmetal in close contact with of semiconductor refrigeration piece, make product refrigeration effect stable, use manpower sparingly, material resources and time.

The invention is described in detail below with reference to the drawings and the detailed description.

As shown in fig. 1, the heat conductive copper sheet of the heat sink for mobile phone provided by the present invention comprises a housing, wherein the housing is divided into a bottom shell 20 and a face shell 10 which are fastened to each other; the face shell 10 contacts with the back of the mobile phone, and the bottom shell 20 faces outwards;

the face shell 10 comprises a plastic soft shell and a heat-conducting copper sheet 11 arranged on the outer side of the plastic soft shell, the plastic soft shell is provided with an opening 101, the semiconductor refrigeration sheet 40 is embedded into the opening 101, the heat-conducting copper sheet 11 is in contact with the semiconductor refrigeration sheet 40, and a convex table surface 12 is arranged on the surface of the heat-conducting copper sheet 11 in contact with the plastic soft shell in a protruding mode; the area of the boss surface 12 is larger than or equal to the area of the opening 101, and is tightly attached to the refrigerating surface of the semiconductor refrigerating sheet 40.

Heat conduction copper sheet 11 adopts the red copper 110 material, boss face 12 passes through mould high temperature press forming with heat conduction copper sheet 11, and heat conduction copper sheet 11 is after the high temperature suppression among the prior art, the problem of warping appears easily, leads to heat conduction copper sheet 11 can't closely laminate with the refrigeration face of semiconductor refrigeration piece 40, has reduced refrigeration effect, adopts the manual work to carry out the plastic to heat conduction copper sheet 11 usually, makes the refrigeration face laminating with semiconductor refrigeration piece 40, and the utility model discloses, increase protruding mesa 12 on the heat conduction copper sheet 11, the refrigeration face and the boss face 12 in close contact with of semiconductor refrigeration piece 40, after 11 high temperature warp of heat conduction copper sheet, still can guarantee the refrigeration face and the 11 in close contact with of heat conduction copper sheet of semiconductor refrigeration piece 40 for the contact surface is level and smooth, guarantees product refrigeration effect. The heat conducting copper sheet 11 is not required to be shaped manually, so that manpower and material resources are saved, and time is saved.

Be equipped with fin 22 in the casing, the back of fin 22 sets up towards drain pan 20, the front is towards face-piece 10, semiconductor refrigeration piece 40 is arranged in between fin 22 and face-piece 10, still be equipped with radiator fan 21 in the casing, radiator fan 21 imbeds the back of fin 22, set up towards face-piece 10, be equipped with the thermovent that is used for radiator fan 21 air-out on the face-piece 10, when the cell-phone produced heat in the use, semiconductor refrigeration piece 40 refrigerates, absorb the heat that the cell-phone produced, and by the heat on the fin 22 conduction semiconductor refrigeration piece 40, blow out the thermovent outside by radiator fan 21 again.

The outer side of the heat conducting copper sheet 11 is provided with a double-conducting copper foil, the outer side of the double-conducting copper foil is provided with a heat conducting silica gel sheet, heat emitted by the mobile phone is transmitted to the double-conducting copper foil through the heat conducting silica gel, the double-conducting copper foil converts a point heat source emitted by the mobile phone into a surface heat source and transmits the surface heat source to the heat conducting copper sheet 11, the heat of the mobile phone is absorbed through the refrigeration of the semiconductor refrigeration sheet 40, the temperature of the back of the mobile phone is reduced, and the heat is dissipated through the.

A PCBA board 30 is arranged between the radiating fins 22 and the semiconductor refrigerating fins 40, a USB interface 31 is arranged on the PCBA board 30, and a through hole 23 matched with the USB interface 31 is arranged at the bottom of the bottom shell 20.

The upper and lower both ends of face-piece 10 are equipped with fixation clamp 13 respectively, through the both sides of fixation clamp 13 centre gripping at the cell-phone, and the inboard of fixation clamp 13 still is equipped with the slipmat, plays the effect of friction when fixed, prevents the cell-phone landing.

The present invention is not limited to the above-mentioned best mode, and any person should learn the structural change made under the teaching of the present invention, all with the present invention has the same or similar technical solution, all fall into the protection scope of the present invention.

Claims

1. A heat conducting copper sheet for a heat sink of a mobile phone, comprising: a heat conducting copper sheet arranged on the outer side of the front surface of the shell, an opening is arranged in the middle of the front surface of the shell, the semiconductor refrigeration sheet is embedded into the opening,

2. The heat-conducting copper sheet for the heat radiator of the mobile phone as claimed in claim 1, wherein the heat-conducting copper sheet is made of red copper, and the boss surface and the heat-conducting copper sheet are formed by high-temperature pressing.

3. The heat-conducting copper sheet for the heat radiator of the mobile phone as claimed in claim 1, wherein a double copper foil is disposed on the outer side of the heat-conducting copper sheet, and a heat-conducting silicone sheet is disposed on the outer side of the double copper foil.

4. A heat sink for a mobile phone according to any one of claims 1-3, wherein the housing comprises a bottom shell and a front shell fastened to each other, the housing has a heat sink disposed therein, the heat sink has a front surface facing the front shell and a back surface facing the bottom shell, and the semiconductor refrigeration chip is disposed between the heat sink and the front shell.

5. The mobile phone heat sink according to claim 4, wherein a heat dissipation fan is further disposed in the housing, the heat dissipation fan is embedded in a back surface of the heat dissipation plate and disposed facing the front housing, and a heat dissipation opening for exhausting air from the heat dissipation fan is disposed on the front housing.

6. The mobile phone radiator of claim 4, wherein a PCBA (printed Circuit Board Assembly) is arranged between the radiating fins and the semiconductor refrigerating fins, a USB interface is arranged on the PCBA, and through holes matched with the USB interface are formed in the bottom of the bottom shell.

7. The heat sink for mobile phone as claimed in claim 4, wherein the top and bottom ends of the front cover are respectively provided with a fixing clip, and the front cover is clamped on two sides of the mobile phone by the fixing clips.