CN101848629B - Soaking plate of foam metal and copper powder compounded capillary structure - Google Patents
Soaking plate of foam metal and copper powder compounded capillary structure Download PDFInfo
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- CN101848629B CN101848629B CN2010101408433A CN201010140843A CN101848629B CN 101848629 B CN101848629 B CN 101848629B CN 2010101408433 A CN2010101408433 A CN 2010101408433A CN 201010140843 A CN201010140843 A CN 201010140843A CN 101848629 B CN101848629 B CN 101848629B
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
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Abstract
The invention discloses a soaking plate of a foam metal and copper powder compounded capillary structure. In the technical scheme, a main body is a vacuum chamber which consists of an upper cover and a lower cover, a compounded capillary structure formed by foam metal and copper powder is arranged in the chamber, the chamber is also filled with a certain quantity of working medium which can boil and transfer heat at a low temperature, the upper cover and the lower cover are both made of deoxidized plate, and the compounded capillary structure is formed through sintering a foam metal plate and copper powder of a certain size. Compared with the traditional capillary structure, the compounded capillary structure has the significant advantages of large lower capillary force, small upper osmotic resistance, accurate control of the capillary force, small thermal contact resistance and the like; and the capillary structures of the upper cover plate and the lower cover plate can be designed as a whole, thereby improving the backflow capacity. Compared with the traditional product, the soaking plate of the foam metal and copper powder compounded capillary structure has the significant advantages of low cost, high irradiating efficiency, long service life and the like when achieving the identical irradiating effect.
Description
Technical field
The invention belongs to a kind of heat transmission soaking plate, particularly relate to a kind of soaking plate with foam metal and copper powder compounded capillary structure.
Background technology
Along with the development of microelectric technique, the caloric value of the unit are of electronic component improves constantly, and is more and more littler but volume but requires, so the heat dissipation problem of high heat flux element has become one of key technical problem that influences electronic device design.Over the past two years, traditional wind-cooling heat dissipating had reached the limit of heat-sinking capability, and the liquid cooling radiating mode exists cost high, and complex structure has its universal development of shortcoming restriction such as risk of leakage.Along with the raising that heat-sinking capability requires, transmit the phase-change heat element that a large amount of heat principles process during the using liquid phase transformation and begin to be widely applied.The phase-change heat module is made up of solid die casting, heat pipe, heat-exchanging fin, fan.Though the more single die casting base of the radiating effect of heat pipe and die casting combination is good, the near-thermal source point still can reach more than 10 ℃ with the hot source point temperature difference far away on the right heat dissipation base, and radiating effect is not attained ideal yet.In order to solve this contradiction, the notion of soaking plate is suggested, promptly under same principle; With heat pipe design is tabular; Its heating surface directly contacts with thermal source (chip), and being dispelled the heat by the one dimension direction of conventional heat pipe is converted into the two dimension heat radiation, and gives prominence to little thermal resistance and the samming ability in radial direction.The uniform temperature of soaking plate can improve to this point, replaces the combination of solid die casting and heat pipe on the function.Soaking plate discloses a kind of soaking plate in the application (forest-road Son, CompoTech China, in December, 2008) of information products heat radiation; This soaking plate can be considered the distortion of heat pipe, and it is a plane tabular thing in appearance, and the mutual driving fit of a lid is respectively arranged up and down, has the copper post to support in it.Soaking plate two copper sheets up and down is material with oxygen-free copper, is working fluid usually with the pure water, and capillary structure is made with the technology of copper powder sintering or copper mesh.Yet copper powder sintering capillary wick permeability is lower, and copper mesh wick structure thermal contact resistance is bigger, and the capillary micro-structural performance of single structure has been difficult to improve.
Summary of the invention
The low problem of capillary wick performance of the technical problem single structure that patent of the present invention will solve, provide a kind of osmotic resistance little, to working medium the bigger big soaking plate with foam metal and copper powder compounded wick structure of capillary force is provided.
The object of the invention is realized through following technical scheme:
A kind of soaking plate with foam metal and copper powder compounded wick structure comprises: upper cover plate, lower cover and capillary wick; Capillary wick is arranged in the cavity of upper cover plate and lower cover formation; Perfusion low-temperature boiling heat-transfer working medium and vacuumizing in this cavity; Said capillary wick is connected with lower cover with upper cover plate through solid-state diffusion; Capillary wick is the shaped as frame structure of sintered combined plate through being bent to form of foam metal and copper powder, and the copper powder layer in the foam metal is positioned at the outside of shaped as frame structure, and wherein, shaped as frame structure of hollow height is 3～8mm; The sintered combined plate of foam metal and copper powder is that sintering forms after in foam metal, filling copper powder; The granularity of copper powder is less than the hole aperture of foam metal; Copper powder is positioned at the bottom of foam metal; The sintered combined plate thickness of foam metal and copper powder is 0.3～1.6mm, and the copper powder loading accounts for 40～60% of foam metal pore volume percentage; Said foam metal is foam copper or nickel foam.
For further realizing the object of the invention, said low-temperature boiling heat-transfer working medium is pure water, ethanol or methyl alcohol.
The particle diameter of said copper powder is 100～300 orders.
It is that sintered combined plate with foam metal and copper powder is bent into the shaped as frame structure and is placed in the cavity that upper cover plate and lower cover form that said capillary wick is connected with lower cover through solid-state diffusion and upper cover plate, under 875～950 ℃, hydrogen shield atmosphere, is incubated 30～90 minutes.
Another purpose of the present invention is to provide above-mentioned preparation method with soaking plate of foam metal and copper powder compounded wick structure.This purpose realizes through following method:
Preparation method with soaking plate of foam metal and copper powder compounded wick structure is characterized in that comprising the steps:
(1) preparation of the sintered combined plate of foam metal and copper powder: in sintering mold, place foam metal, then copper powder is added in the foam metal, the copper powder loading accounts for 40～60% of foam metal pore volume percentage; Sintering is 30～90 minutes under 850～950 ℃, hydrogen shield atmosphere; The sintering chamber that said sintering mold is made up of upper die and lower die; Patrix is as compact heap;
(2) shaped as frame structure preparation: the foam metal of step (1) gained and the sintered combined plate of copper powder are passed through the shaped as frame structure that is bent to form, and the copper powder layer in the foam metal is positioned at the outside of shaped as frame structure;
(3) preparation of soaking plate: the technology pad places the shaped as frame structure of sintered combined plate through being bent to form of foam metal and copper powder, and the shaped as frame structure is put into the cavity of being made up of upper cover plate and lower cover, under hydrogen atmosphere, is heated to 875～950 ℃; Be incubated 30～90 minutes, the bottom copper powder is connected through solid-state diffusion with cover plate up and down, cool to the furnace below 200 ℃; Take out the technology pad; With upper cover plate and lower cover pressing, soaking plate inner chamber height 1～5mm after the pressing, perfusion low-temperature boiling heat-transfer working medium; Welded seal makes soaking plate.
It is stock that described upper cover plate and lower cover preferably adopt the deoxidation copper plate.
Patent of the present invention compared with prior art has significant advantage and beneficial effect:
Capillary structure is extremely important in the phase-change heat transfer element design; The wick structure performance of single structure has been difficult to improve, and the wick structure in traditional heat conduction with phase change element is confined to powder sintering structure, single or multiple lift silk screen, machining groove and composite construction thereof.The present invention proposes foam metal and copper powder sintering and form the combined type wick structure, traditional relatively capillary structure, it has the following advantages: the effective capillary radius of copper powder sintering layer is little, can bigger REFRIGERATION SYSTEM DRIVEN BY CAPILLARY FORCE power be provided to working medium; The porous skeleton structure osmotic resistance of foam metal is little, can protect bottom working medium to reflux and not receive steam flush, reduces the working medium return loss, and the compound wick structure that combines is with the obvious advantage; It can form the intermediate of definite shape through preprocessing, and its plasticity is better, can in soaking plate, form continuous wick structure, has guaranteed working medium backflow between cover plate up and down.
Description of drawings
Fig. 1 is a structural representation of the present invention;
Fig. 2 is a upper cover plate structural representation of the present invention;
Fig. 3 is a lower cover structural representation of the present invention;
Fig. 4 is foam copper of the present invention and copper powder compounded plate sintering process sketch map;
Fig. 5 a foam copper of the present invention and copper powder compounded sintered plate cross-sectional view;
Fig. 5 b is Fig. 5 a upper foam copper Electronic Speculum figure;
Fig. 5 c is the Electronic Speculum figure behind Fig. 5 a lower floor's foam copper and the copper powder compounded sintering;
The wick structure shaped as frame intermediate structural representation that Fig. 6 is processed by composite plate for the present invention;
Fig. 7 is a wick structure diffusion connecting process sketch map of the present invention;
Fig. 8 is a working example sketch map of the present invention.
The specific embodiment
Below in conjunction with accompanying drawing and embodiment the present invention is done further detailed explanation, but embodiment of the present invention is not limited thereto.
As shown in Figure 1, a kind of soaking plate with foam metal and copper powder compounded wick structure comprises upper cover plate 1, lower cover 2 and is arranged in upper cover plate 1 and the capillary wick 3 of the cavity that lower cover 2 forms.It is stock (also can adopt the deoxidation red copper material of other type) that upper cover plate 1 adopts TP-2 deoxidation copper coin with lower cover 2; Become like Fig. 2 and cavity shape structure shown in Figure 3 through drawing (or machining); Around the cavity shape structure is the welded seal band, perfusion low-temperature boiling heat-transfer working medium in this cavity shape cavity.
Show that like Fig. 5 b foam metal (be generally tabular, foam metal mainly contains foam copper, nickel foam) is skeleton shape porous loose structure); The complex sintered plate that foam metal and copper powder sintering form forms the shaped as frame structure that Fig. 6 shows after bending, its top and bottom are connected with lower cover 2 inwall solid-state diffusion with the upper cover plate 1 of soaking plate respectively.Capillary wick is the shaped as frame structure of sintered combined plate through being bent to form of foam metal and copper powder, and the copper powder layer in the foam metal is positioned at the outside of shaped as frame structure, and wherein, shaped as frame structure of hollow height is 3～8mm; Shown in Fig. 5 a, 5c; The sintered combined plate of foam metal and copper powder is that sintering forms after in foam metal, filling copper powder; The granularity of copper powder is less than the hole aperture of foam metal; Copper powder is positioned at the bottom of foam metal, and the sintered combined plate thickness of foam metal and copper powder is 0.3～1.6mm, and the copper powder loading accounts for 40～60% of foam metal pore volume percentage.
In the composite construction of foam metal plate and copper powder; Copper powder is connected on the skeleton of foam metal through solid-state diffusion under hydrogen atmosphere protection sintering; The copper powder layer can provide bigger capillary force; The porosity of foam metal plate is big, and permeability is better, can reduce the loss that backflow working medium is washed away by vapor stream.This capillary structure makes the capillary channel that UNICOM is arranged between upper and lower surfaces, strengthens the backflow ability of working medium greatly, has improved the evaporation limit of soaking plate.The working medium that upper surface (cryosurface) is condensed is transported to lower surface (evaporating surface), strengthens working medium simultaneously in the rate of set of cryosurface with at the gasification rate of evaporating surface.The composite construction of foam metal plate and copper powder can strengthen the gasification and the condensation rate of working medium, improves the heat-transfer capability at evaporating surface and cryosurface.Therefore; The compound wick structure of use foam metal plate and copper powder can improve the evaporation limit of soaking plate; Reduce to contact thermal resistance between each several part and fabulous working medium conveying capacity is provided; Thereby reduce the overall thermal resistance of soaking plate, improve its heat-transfer capability and soaking performance, reach the purpose of putting forward the soaking plate performance.
With outside dimension 55mm * 55mm * 4mm, the soaking plate of inner cavity size 50mm * 50mm * 2mm is an example, and its wick structure processing technology is described.Its compound capillary structure is sintered to composite plate backlash press-bending folding by foam copper coin and spherical copper powder and forms.
The sintering manufacturing of foam copper coin and copper powder compounded plate: show that like Fig. 4 the sintering mold structure comprises compact heap (patrix) 4, foam copper coin 5, sintering chamber (counterdie) 6 and copper powder layer 7.Foam copper plate porosity is that 110ppi (per inch hole count), thickness are that 1.6mm, surface density are 400g/m
2The copper powder of copper powder layer 7 is 200 order spherical copper powders, and the copper powder loading is 40～60% of a filled and process copper pore volume percentage.During preparation, at first foam copper coin 5 is compressed to desired thickness 0.4mm, compression process adopts baby press (below the pressure 3t) to get final product, and flattens to 0.4mm (accurately controlling compressed thickness through pad), keeps 30s, the die sinking pickup.The foam copper coin after compression; Cut out and be 50mm * 114mm; Place the cavity (the mould cavity is slightly larger than the foam copper board size, is convenient to pickup) of mould, but in cavity, add the copper powder of about 40～60% pore volumes of filled and process copper coin after the compacting; Because the granularity of copper powder is less than the hole aperture of foam copper coin, copper powder can be filled its hole and be deposited on the bottom and formed the copper powder layer that an about 0.2mm is thick, have less capillary radius (≤75 μ m).Entire die is heated to 850～950 ℃ under the hydrogen atmosphere protection; Be incubated 30～90 minutes, copper powder is connected through solid-state diffusion with the foam copper skeleton with copper powder, copper powder, cool to sampling below 200 ℃ with the furnace; Can obtain the composite plate of foam copper coin and copper powder, show like Fig. 5.
Fig. 5 shows the composite plate cross-section structure of foam copper coin and copper powder, and its matrix is a foam copper framework structure, and bottom has the compound capillary layer (Fig. 5 c) of one deck 0.2mm copper powder and foam copper coin.Bottom capillary radius≤75 μ m can provide bigger capillary force; The foam copper porosity on upper strata is big (>=95%), and osmotic resistance is less, do not receive steam flush in the time of can protecting bottom working medium to reflux simultaneously, reduces the working medium return loss.The manufacturing of wick structure intermediate: foam copper coin that sinters and copper powder compounded plate are bent into shaped as frame structure shown in Figure 6 through punching press, and it is of a size of 50mm * 50mm * 7mm, and the bottom copper powder layer of composite plate is positioned at outer surface.Because the composite plate intensity that sintering forms is less, plasticity is better, this operation also can adopt the manual bending of mould to process.
The copper powder compounded wick structure of foam metal is connected with cover plate solid-phase sintering up and down: show upper cover plate 1, lower cover 2, capillary wick 3 intermediates, technology pad 8 like Fig. 7.Fill in three thick technology pads 8 of 2mm (the monolithic pad thickness should can take out with assurance less than compressing back covers welding interband distance) in the wick structure intermediate of after above-mentioned preforming technique, processing; Again capillary structure and upper cover plate 1, lower cover 2 are compressed; In the atmosphere protection stove, be heated to 875～950 ℃; Under hydrogen shield atmosphere, be incubated 30～90 minutes, the bottom copper powder is connected through solid-state diffusion with cover plate up and down, cool to sampling below 200 ℃ with the furnace; And take out technology pad 8 successively, can make wick structure be connected to cover inner surface up and down.This kind connected mode can guarantee good contact the between wick structure and cover plate, has less thermal contact resistance, guarantees that simultaneously wick structure is an one between covers.Compress upper cover plate 1 and lower cover 2 this moment; Because foam metal has good plastic deformation ability; Connecting up and down, cover plate wick structure wall promptly can curve inwardly until the covers plate closing; Weld seam welded seal with around the cover plate up and down can form continuous wick structure in seal chamber.
The welded seal of cover plate up and down: as above-mentioned; With cover plate is after solid-phase sintering is connected up and down, the taking-up pad is with cover plate pressing up and down in the capillary structure intermediate; The butt joint of covers plate welding seams is compressed; Working pressure bonding machine pressure welding seal-weld gets final product, and its technology is as good as with general soaking plate pressure welding, so not exhaustive explanation.
The perfusion working medium of soaking plate with vacuumize: take out mouth through one, perfusion is equivalent to the working medium of capillary structure pore volume 50%-80% in soaking plate, is evacuated to 1.3 * 10 again
-1-10
-4p
aVacuum after will take out mouthful sealing.This technology is as good as with the perfusion working medium and the evacuation process of general heat pipe, so not exhaustive explanation.
Show that like Fig. 8 during work, thermal source 9 places said soaking plate lower surface; Guarantee closely contact through coated with thermally conductive silica gel and in addition certain thrust, the heat of thermal source is passed to its lower cover 2, passes to working medium through wick structure 3 again; Working medium is evaporated to gaseous state, is full of the soaking plate cavity with velocity of sound, on the wick structure of upper surface, is condensed into liquid state; With heat transferred upper cover plate 1; Liquid simultaneously working medium is back to lower surface through connecting the passage of upper and lower surfaces wick structure by upper surface, so circulation.The heat that is passed to upper surface is distributed to surrounding environment by heat sink 10.
The above; Only being the preferable embodiment of patent of the present invention, is not that the present invention is done any type of restriction, anyly is familiar with these professional method personnel and possibly utilizes the technology contents of above-mentioned announcement to change or be modified to the equivalent embodiment of equivalent variations; But everyly do not break away from technical scheme content of the present invention; Any simple modification of above embodiment being done according to technical spirit of the present invention, equivalent variations and modification all still belong to the scope of technical scheme of the present invention.
Claims (6)
1. the soaking plate with foam metal and copper powder compounded wick structure comprises: upper cover plate, lower cover and capillary wick; Capillary wick is arranged in the cavity of upper cover plate and lower cover formation; Perfusion low-temperature boiling heat-transfer working medium and vacuumizing in this cavity; It is characterized in that: said capillary wick is connected with lower cover with upper cover plate through solid-state diffusion; Capillary wick is the shaped as frame structure of sintered combined plate through being bent to form of foam metal and copper powder, and the copper powder layer in the foam metal is positioned at the outside of shaped as frame structure, and wherein, shaped as frame structure of hollow height is 3～8mm; The sintered combined plate of foam metal and copper powder is that sintering forms after in foam metal, filling copper powder; The granularity of copper powder is less than the hole aperture of foam metal; Copper powder is positioned at the bottom of foam metal; The sintered combined plate thickness of foam metal and copper powder is 0.3～1.6mm, and the copper powder loading accounts for 40～60% of foam metal pore volume percentage; Said foam metal is foam copper or nickel foam.
2. the soaking plate with foam metal and copper powder compounded wick structure according to claim 1 is characterized in that: said low-temperature boiling heat-transfer working medium is pure water, ethanol or methyl alcohol.
3. the soaking plate with foam metal and copper powder compounded wick structure according to claim 1 is characterized in that: the particle diameter of said copper powder is 100～300 orders.
4. the soaking plate with foam metal and copper powder compounded wick structure according to claim 1; It is characterized in that: it is that sintered combined plate with foam metal and copper powder is bent into the shaped as frame structure and is placed in the cavity that upper cover plate and lower cover form that said capillary wick is connected with lower cover through solid-state diffusion and upper cover plate, under 875～950 ℃, hydrogen shield atmosphere, is incubated 30～90 minutes.
5. each said preparation method with soaking plate of foam metal and copper powder compounded wick structure of claim 1-5 is characterized in that comprising the steps:
(1) preparation of the sintered combined plate of foam metal and copper powder: in sintering mold, place foam metal; Then copper powder is added in the foam metal; The granularity of copper powder is less than the hole aperture of foam metal; Copper powder is positioned at the bottom of foam metal, and the copper powder loading accounts for 40～60% of foam metal pore volume percentage; Sintering is 30～90 minutes under 850～950 ℃, hydrogen shield atmosphere; The sintering chamber that said sintering mold is made up of upper die and lower die; Patrix is as compact heap;
(2) shaped as frame structure preparation: the foam metal of step (1) gained and the sintered combined plate of copper powder are passed through the shaped as frame structure that is bent to form, and the copper powder layer in the foam metal is positioned at the outside of shaped as frame structure;
(3) preparation of soaking plate: the technology pad places the shaped as frame structure of sintered combined plate through being bent to form of foam metal and copper powder, and the shaped as frame structure is put into the cavity of being made up of upper cover plate and lower cover, under hydrogen atmosphere, is heated to 875～950 ℃; Be incubated 30～90 minutes, the bottom copper powder is connected through solid-state diffusion with cover plate up and down, cool to the furnace below 200 ℃; Take out the technology pad; With upper cover plate and lower cover pressing, soaking plate inner chamber height 2mm after the pressing, perfusion low-temperature boiling heat-transfer working medium; Vacuumize the back welded seal, make soaking plate.
6. the preparation method with soaking plate of foam metal and copper powder compounded wick structure according to claim 5 is characterized in that: it is stock that described upper cover plate and lower cover adopt the deoxidation copper plate.
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| CN2010101408433A CN101848629B (en) | 2010-03-31 | 2010-03-31 | Soaking plate of foam metal and copper powder compounded capillary structure |
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| CN2010101408433A CN101848629B (en) | 2010-03-31 | 2010-03-31 | Soaking plate of foam metal and copper powder compounded capillary structure |
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| CN113894504A (en) * | 2021-10-20 | 2022-01-07 | 广东思泉新材料股份有限公司 | Ultrathin uniform temperature plate and manufacturing method thereof |
| CN115178738A (en) * | 2022-07-13 | 2022-10-14 | 航天科工哈尔滨风华有限公司 | Device and method for sintering metal powder liquid absorption core |
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| CN1877241A (en) * | 2005-06-08 | 2006-12-13 | 财团法人工业技术研究院 | Combined capillary structure for heat transfer assembly |
| CN1901176A (en) * | 2005-07-22 | 2007-01-24 | 富准精密工业(深圳)有限公司 | Air-tightness chamber heat radiation structure and its producing method |
| CN101348910A (en) * | 2007-07-19 | 2009-01-21 | 纬创资通股份有限公司 | Manufacturing method of capillary structure for generating soaking plate by means of high temperature powder spray gun |
| CN201256509Y (en) * | 2008-06-26 | 2009-06-10 | 汪冰雯 | Radiator |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1877241A (en) * | 2005-06-08 | 2006-12-13 | 财团法人工业技术研究院 | Combined capillary structure for heat transfer assembly |
| CN1901176A (en) * | 2005-07-22 | 2007-01-24 | 富准精密工业(深圳)有限公司 | Air-tightness chamber heat radiation structure and its producing method |
| CN101348910A (en) * | 2007-07-19 | 2009-01-21 | 纬创资通股份有限公司 | Manufacturing method of capillary structure for generating soaking plate by means of high temperature powder spray gun |
| CN201256509Y (en) * | 2008-06-26 | 2009-06-10 | 汪冰雯 | Radiator |
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