CN201256509Y - Radiator - Google Patents

Radiator Download PDF

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Publication number
CN201256509Y
CN201256509Y CNU2008200497461U CN200820049746U CN201256509Y CN 201256509 Y CN201256509 Y CN 201256509Y CN U2008200497461 U CNU2008200497461 U CN U2008200497461U CN 200820049746 U CN200820049746 U CN 200820049746U CN 201256509 Y CN201256509 Y CN 201256509Y
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China
Prior art keywords
plate
radiator
heat
metal
metal base
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Expired - Fee Related
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CNU2008200497461U
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Chinese (zh)
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汪冰雯
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汪冰雯
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Priority to CNU2008200497461U priority Critical patent/CN201256509Y/en
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Publication of CN201256509Y publication Critical patent/CN201256509Y/en
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Abstract

The utility model relates to technical field of radiators, in particular to a radiator capable of enhancing heat radiating efficiency. The radiator comprises a metal base and a metal radiator fixed on the metal base, wherein the metal base is provided with a vacuum chamber which is equipped inside with an inner capillary core and coolant. The heat of a lower plate passes through the coolant and the inner capillary core and then is transferred to an upper plate, and the heat of the upper plate will be mostly radiated through the metal radiator. The radiator of the utility model has the advantages of raw material saving, reduced integral mass, great heat conductivity, high heat radiating efficiency, large heat radiating area, low cost, and function of reducing noise. Additionally, the metal radiator employed by the radiator of the utility model has great compressional resistance, without deforming.

Description

Radiator
Technical field:
The utility model relates to a kind of heat sink technology field, refers in particular to a kind of radiator that improves radiating efficiency.
Background technology:
The trend of electronic chip miniaturization and golf calorific value, make the heat radiation of electronic equipment show out several outstanding features especially once: (1) local heat flux density is very big, and heat focuses in the part easily, causes local temperature too high.(2) density of heat flow rate skewness, high heat flux mostly just is confined in the very little spatial dimension.(3) in the electronic equipment start-up course, occur instantaneous power easily and " rise violently ", burn out electronic equipment.(4) it is not very big needing lost total heat flow.So solve the key of electronic equipment cooling is how to reduce too high local heat flux density, prevent focus and cause equipment fault.In order to strengthen radiating effect, generally all can on electronic chip, install one additional than much bigger heat sink of chip volume.Be easy to like this produce focus at chip surface.And make the heat sink bigger diffusion thermal resistance that has, and the density of heat flow rate on the inner section distributes very inhomogeneous, and heat sink radiating effect has been subjected to certain influence.
Now in order to prevent that electronic chip inside is owing to the basic means that heat accumulation produces focus is still the solid fine copper plate soaking device that attaches the tool high thermal conductivity coefficient at chip surface, the inner heat that produces of electronic chip is drawn out on the heat radiator fin in heat conducting mode, in the convection action of joint fin and its surrounding air heat is imported in the air-flow and take away.Solid fine copper plate soaking device can play to a certain extent and make heat flux distribution even, eliminates the effect of focus.But because the conductive coefficient of copper is limited, its expensive price will make its difficulty to spread in the practical application.
In order to guarantee that electronic chip can normally work fast, must cool off it, make the heat of its generation distribute rapidly.Traditional radiator that is used on the chip generally includes pedestal and is fixed on page or leaf sheet on the pedestal, and chip is fixed on the pedestal usually, and the heat that produces in the chip operation process passes on the pedestal, this heat be by with pedestal on a page or leaf sheet heat is exhaled.In order to improve radiating efficiency: (1) page or leaf sheet adopts the higher metal material of thermal conductivity to make, and the page or leaf sheet need have bigger area of dissipation.The method of common raising page or leaf sheet area of dissipation is the quantity that as far as possible increases the page or leaf sheet, and very thin with the moulding of page or leaf sheet.But because the restriction of production technology, page or leaf sheet thickness is difficult to reduce, and the material use amount also is difficult to reduce, and cooling-down effect is limited.(2) increase a fan, it is to come chip is dispelled the heat by the heat dissipating of self, thereby can't satisfy the demands of consumers.
In sum, there is the improved place of some needs in radiator at present, and the applicant also is in this purpose just and creates design the utility model.
The utility model content:
Technical problem to be solved in the utility model is exactly in order to overcome the deficiency of present radiator, a kind of radiating efficiency height to be provided, and can reduce the radiator of material usage.
For solving the problems of the technologies described above, the utility model has adopted following technical scheme: this metal base and be fixed on heat dissipation metal body on the metal base, described metal base is provided with a vacuum chamber, be provided with inner capillary wick in this vacuum chamber and be filled with cold-producing medium, the heat of lower plate passes to upper plate after by cold-producing medium, inner capillary wick, and the heat major part of upper plate will outwards exhale by the heat dissipation metal body.
Described metal base comprises: upper plate, lower plate, fill the hole of cold-producing medium, form a cavity on the lower plate, the hole is communicated with cavity, and upper plate and lower plate are interconnected to constitute vacuum chamber, are provided with between upper plate and the lower plate to support to strengthen the boiling structure.
Described inner capillary wick is positioned at the unsettled place of cavity, and is fixedly connected on lower plate.
Form irregular duct on the described radiator, interlaced, the connection in duct.
Form irregular duct on the described inner capillary wick, interlaced, the connection in duct.
Described metal base is a soaking plate, and the surface that the upper plate in the metal base contacts with radiator is a plane.
Described heat dissipation metal body, inner capillary wick are made by foam copper or copper sponge.Because foam copper or copper sponge so directly adopt this kind material, can be saved cost of manufacture from just have irregular duct when moulding.And for inner capillary wick, it requires inner pipeline very trickle, so can adopt the mode with foam copper or copper sponge compression to form.
In sum, the heat of metal base lower plate passes to upper plate by inner capillary wick, cold-producing medium in the utility model, and the heat major part of upper plate will outwards exhale by the heat dissipation metal body.The many interlaced irregular ducts of radiator moulding that foam copper that the utility model uses or copper sponge metal are made, the many interlaced irregular ducts of moulding on the inner capillary wick, because the existence in these ducts can improve the efficient of heat radiation greatly.The utility model can conservation, can absorption refrigeration, and total quality alleviates, and the body thermal conductivity is good, radiating efficiency is high, area of dissipation is big, and cost is low, can reduce the noise function.In addition, the heat dissipation metal body compressive property that is adopted in the utility model is good, can not be out of shape.
Description of drawings:
The local cutaway view of part in Fig. 1 the utility model front view;
Fig. 2 is the main cutaway view of metal base in the utility model;
Fig. 3 is the main cutaway view of lower plate in the utility model;
Fig. 4 is the upward view of user mode of the present utility model.
Embodiment:
See Fig. 1-4, the utility model comprises: metal base 2 and be fixed on heat dissipation metal body 3 on the metal base 2.Wherein metal base 2 is provided with a vacuum chamber 4, be provided with inner capillary wick 5 in this vacuum chamber 4 and be filled with cold-producing medium 6, the heat of lower plate 22 passes to upper plate 21 by cold-producing medium 6, inner capillary wick 5 after freezing, and the heat major part of upper plate 21 will outwards exhale by heat dissipation metal body 3.
Particularly, above-mentioned metal base 2 is a soaking plate, and this metal base 2 directly is welded by upper plate 21 and lower plate 22, has saved the loaded down with trivial details courses of processing such as sintering, helps the implementation that abrasive tool moulding is produced in batches, has broad application prospects.Comprise in metal base 2: upper plate 21, lower plate 22, fill the hole of cold-producing medium 6, form a cavity 7 on the lower plate 22, the hole is communicated with cavity 7, and upper plate 21 is interconnected to constitute vacuum chamber 4 with lower plate 22, is provided with between upper plate 21 and the lower plate 22 to support to strengthen boiling structure 8.Be provided with inner capillary wick 5 and cold-producing medium 6 in vacuum chamber 4, wherein inner capillary wick 5 is positioned at the unsettled place of cavity 7, and is fixedly connected on lower plate 22.These lower plate 22 lower planes are used for chip 9 or other components to be heated of bonding needs heat radiation, the upper surface of its upper plate 21 is used for bonded metal radiator 3, in order to make upper plate 21 and heat dissipation metal body 3 bonding smoothly, the surface 211 that the upper surface of its upper plate 21 contacts with radiator 3 is made as a plane.The heat that chip 9 work produce will conduct on the lower plate 22, and the heat of lower plate 22 passes to upper plate 21 by cold-producing medium 6, inner capillary wick 5, and the heat major part of upper plate 21 will outwards exhale by heat dissipation metal body 3.
Furthermore:
Form irregular duct 31 on the above-mentioned heat dissipation metal body 3, these irregular duct 31 interlaced, connections, form the metal blocks of a similar sponge, metal derby is in light weight in order to make, the body thermal conductivity is good, radiating efficiency is high, area of dissipation is big, cost is low, this metal blocks is made by foam copper or copper sponge, directly inner wall surface thereof is being grown irregular duct 31 structures by technologies such as chemical plating, plating, and its porosity is 10-20PPI.
In order to change inner capillary wick 5 Liquid Flow structures, form irregular duct 51 on the inner capillary wick 5, these irregular duct 51 interlaced, connections, form the metal blocks of a similar sponge, strengthened the effect of capillary force like this, made the phase transformation shuttling movement of cold-producing medium 6 more smooth and easy.Metal derby is in light weight in order to make, the body thermal conductivity is good, radiating efficiency is high, area of dissipation is big, and cost is low, and this metal blocks is made by foam copper or copper sponge.These inner capillary wick 5 can be compressed inner capillary wick 5 then by technologies such as chemical plating, plating directly inner wall surface thereof being grown tiny irregular duct 51 structures, dwindle its duct 51, and its porosity is 200-250PPI.
Between upper plate 21 and lower plate 22, be provided with to support and strengthen boiling structure 8.This support is strengthened boiling structure 8 and is improved boiling performance, and the boiling hysteresis is alleviated, and boiling regime is more stable.Boiling structure 8 is strengthened in this support makes inner capillary wick 5 form inner natural circulation solid phase enhanced boiling heat transfer.
During work, cold-producing medium 6 is passed to the HTHP of lower plate 21 through chip 9 and is seethed with excitement, and forms superheated vapor at last, and the superheated steam of generation is discharged along inner capillary wick 5, and the steam of discharge will move to the bottom of upper plate 22, and condense, and emit heat.The liquid that freeze-outs seethes with excitement once more thereby return the original place under the effect of inner capillary wick 5 capillary forces, finishes the phase transformation cyclic process of cold-producing medium 6.When the heat radiation power of thermal source strengthened, heat pipe needed more cold-producing medium 6 to keep circulation time, and the effect meeting of inner capillary wick 5 capillary forces sucks back the original place with cold-producing medium 6 again.Inner capillary wick 5 and support are strengthened boiling structure 8 and are all had the effect of strengthening boiling, so can improve boiling heat transfer efficient greatly.
Above-mentioned cold-producing medium 6 directly adopts water usually, certainly, also can be refrigerant.
In sum, the heat of metal base 2 lower plates 21 passes to upper plate 21 by inner capillary wick 5, cold-producing medium 6 in the utility model, and the heat major part of upper plate 21 will outwards exhale by heat dissipation metal body 3.The utility model uses foam copper or copper sponge to make heat dissipation metal body 3, the interlaced irregular duct 31 that its inner moulding is many, the many interlaced irregular ducts 51 of moulding on the inner capillary wick 5 are because the existence in these ducts 31,51 can improve the efficient of heat radiation greatly.The utility model can conservation, and total quality alleviates, and the body thermal conductivity is good, radiating efficiency is high, area of dissipation is big, and cost is low, can reduce the noise function.In addition, heat dissipation metal body 3 compressive properties that adopted in the utility model are good, can not be out of shape.
Certainly, the above only is the utility model example, be not to limit the utility model practical range,, all should be included in the utility model claim so all equivalences of doing according to the described structure of the utility model claim, feature and principle change or modify.

Claims (7)

1, radiator, this radiator (1) comprising: metal base (2) and be fixed on heat dissipation metal body (3) on the metal base (2), it is characterized in that: described metal base (2) is provided with a vacuum chamber (4), be provided with inner capillary wick (5) in this vacuum chamber (4) and be filled with cold-producing medium (6), the heat of lower plate (22) passes to upper plate (21) after by cold-producing medium (6), inner capillary wick (5), and the heat major part of upper plate (21) will outwards exhale by heat dissipation metal body (3).
2, radiator according to claim 1, it is characterized in that: described metal base (2) comprising: upper plate (21), lower plate (22), fill the hole of cold-producing medium (6), form a cavity (7) on the lower plate (22), the hole is communicated with cavity (7), upper plate (21) is interconnected to constitute vacuum chamber (4) with lower plate (22), is provided with between upper plate (21) and the lower plate (22) to support to strengthen boiling structure (8).
3, radiator according to claim 2 is characterized in that: described inner capillary wick (5) is positioned at the unsettled place of cavity (7), and is fixedly connected on lower plate (22).
4, radiator according to claim 3 is characterized in that: form irregular duct (31) on the described radiator (3), duct (31) interlaced, connection.
5, radiator according to claim 4 is characterized in that: form irregular duct (51) on the described inner capillary wick (5), duct (51) interlaced, connection.
6, radiator according to claim 5 is characterized in that: described metal base (2) is a soaking plate, and the surface (211) that the upper plate (21) in the metal base (2) contacts with radiator (3) is a plane.
7, according to any described radiator among the claim 1-6, it is characterized in that: described heat dissipation metal body (3), inner capillary wick (5) are made by foam copper or copper sponge.
CNU2008200497461U 2008-06-26 2008-06-26 Radiator Expired - Fee Related CN201256509Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2008200497461U CN201256509Y (en) 2008-06-26 2008-06-26 Radiator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2008200497461U CN201256509Y (en) 2008-06-26 2008-06-26 Radiator

Publications (1)

Publication Number Publication Date
CN201256509Y true CN201256509Y (en) 2009-06-10

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101848629A (en) * 2010-03-31 2010-09-29 华南理工大学 Soaking plate of foam metal and copper powder compounded capillary structure
CN105020397A (en) * 2015-08-20 2015-11-04 青岛海森流体机械工程研究院有限公司 Contact type mechanical seal stationary ring assembly and assembling method
CN105845662A (en) * 2015-01-29 2016-08-10 英飞凌科技股份有限公司 Device including a metallization layer and method of manufacturing a device
CN106231871A (en) * 2016-08-23 2016-12-14 山东时风(集团)有限责任公司 A kind of heat abstractor of electric vehicle controller
CN106304781A (en) * 2016-08-23 2017-01-04 山东时风(集团)有限责任公司 A kind of electric vehicle controller of band capillary radiator structure
CN107517575A (en) * 2017-09-28 2017-12-26 北京无线电测量研究所 A kind of lightweight samming efficient radiating apparatus and electronic equipment

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101848629A (en) * 2010-03-31 2010-09-29 华南理工大学 Soaking plate of foam metal and copper powder compounded capillary structure
CN101848629B (en) * 2010-03-31 2012-02-15 华南理工大学 Soaking plate of foam metal and copper powder compounded capillary structure
CN105845662A (en) * 2015-01-29 2016-08-10 英飞凌科技股份有限公司 Device including a metallization layer and method of manufacturing a device
CN105845662B (en) * 2015-01-29 2020-01-07 英飞凌科技股份有限公司 Device comprising a metallization layer and method of manufacturing a device
CN105020397A (en) * 2015-08-20 2015-11-04 青岛海森流体机械工程研究院有限公司 Contact type mechanical seal stationary ring assembly and assembling method
CN106304781A (en) * 2016-08-23 2017-01-04 山东时风(集团)有限责任公司 A kind of electric vehicle controller of band capillary radiator structure
CN106231871B (en) * 2016-08-23 2018-04-20 山东时风(集团)有限责任公司 A kind of radiator of electric vehicle controller
CN106304781B (en) * 2016-08-23 2018-09-28 山东时风(集团)有限责任公司 A kind of electric vehicle controller with capillary radiator structure
CN106231871A (en) * 2016-08-23 2016-12-14 山东时风(集团)有限责任公司 A kind of heat abstractor of electric vehicle controller
CN107517575A (en) * 2017-09-28 2017-12-26 北京无线电测量研究所 A kind of lightweight samming efficient radiating apparatus and electronic equipment
CN107517575B (en) * 2017-09-28 2019-10-29 北京无线电测量研究所 A kind of lightweight samming efficient radiating apparatus and electronic equipment

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Legal Events

Date Code Title Description
GR01 Patent grant
C14 Grant of patent or utility model
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20090610

Termination date: 20120626

C17 Cessation of patent right