CN111380388A - Processing technology of copper powder capillary structure for ultrathin soaking plate - Google Patents
Processing technology of copper powder capillary structure for ultrathin soaking plate Download PDFInfo
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- CN111380388A CN111380388A CN201911422768.7A CN201911422768A CN111380388A CN 111380388 A CN111380388 A CN 111380388A CN 201911422768 A CN201911422768 A CN 201911422768A CN 111380388 A CN111380388 A CN 111380388A
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- copper powder
- capillary structure
- soaking plate
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
- F28F21/081—Heat exchange elements made from metals or metal alloys
- F28F21/085—Heat exchange elements made from metals or metal alloys from copper or copper alloys
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- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Powder Metallurgy (AREA)
Abstract
The invention discloses a processing technology of a copper powder capillary structure for an ultrathin soaking plate, which comprises the following steps: s1, uniformly mixing copper powder and 20-40 wt% of adhesive to obtain paste; s2, coating the paste on the upper cover and/or the lower cover of the soaking plate by adopting a method of dispensing, screen printing, silk-screen printing or spraying; s3, sintering the upper cover and/or the lower cover coated with the paste in an inert atmosphere to obtain the copper powder capillary structure; wherein the sintering system is as follows: the temperature is raised from 500-fold temperature of 600 ℃ to 850-fold temperature of 1000 ℃ at constant speed, the temperature is kept for 15-20min, and then the temperature is lowered to 500-fold temperature of 600 ℃ at constant speed. The invention also provides the ultrathin soaking plate prepared by the method. The processing technology of the copper powder capillary structure for the ultrathin soaking plate can form capillary structures with various paths, widths and densities, and the porous capillary structures greatly improve the permeability.
Description
Technical Field
The invention relates to the technical field of soaking plates, in particular to a processing technology of a copper powder capillary structure for an ultrathin soaking plate.
Background
With the rapid development of microelectronic technology, the feature size of electronic devices is continuously reduced, and the integration level, packaging density and operating frequency of chips are continuously improved, which all make the heat flux density of chips rapidly increase. The heat pipe has extremely high heat conductivity, is a green and environment-friendly heat dissipation technology without additional energy, and the Vapor Chamber (Vapor Chamber) has more outstanding advantages compared with the common heat pipe, the shape of the Vapor Chamber is very favorable for dissipating heat of a concentrated heat source, but the production cost is always high at present, the market competition is more intense, and the optimal production configuration is very important for obtaining better production and marketing conditions and obtaining more market resources.
The "capillary tissue" is one of the three major elements of the soaking plate. For the ultrathin soaking plate with the thickness less than 1mm, the traditional production method of the capillary structure is mainly realized by weaving copper wires, and the production method has a plurality of defects:
1. the traditional capillary and product fitting can only be performed manually, a large amount of manpower is needed, the requirement on the skills of workers is high, and the production reject ratio is high;
2. the traditional capillary tissue needs to be subjected to winding, weaving, cleaning, attaching, cutting and sintering processes, and the development period is long;
3. different products have different capillaries, and stock preparation is needed according to different specifications;
4. the traditional capillary processing needs a subscription amount, and if the verification fails, the waste of time and energy sources occurs;
5. the conventional capillary bend diameter needs to be at least greater than D25, otherwise capillary failure occurs.
Disclosure of Invention
The technical problem to be solved by the invention is to provide a processing technology of a copper powder capillary structure for an ultrathin soaking plate, the technology can form capillary structures with various paths, widths and densities, and the porous capillary structures greatly improve the permeability.
In order to solve the technical problem, the invention provides a processing technology of a copper powder capillary structure for an ultrathin soaking plate, which comprises the following steps:
s1, uniformly mixing copper powder and 20-40 wt% of adhesive to obtain paste;
s2, coating the paste on the upper cover and/or the lower cover of the soaking plate by adopting a method of dispensing, screen printing, silk-screen printing or spraying;
s3, sintering the upper cover and/or the lower cover coated with the paste in an inert atmosphere to obtain the copper powder capillary structure; wherein the sintering system is as follows: the temperature is raised from 500-fold temperature of 600 ℃ to 850-fold temperature of 1000 ℃ at constant speed, the temperature is kept for 15-20min, and then the temperature is lowered to 500-fold temperature of 600 ℃ at constant speed.
Further, in step S1, the particle size of the copper powder is 150-350 mesh.
Further, in step S1, the adhesive is at least one selected from cellulose and glycerin.
Further, in step S1, the amount of the adhesive is 25 to 35 wt%, such as 26%, 28%, 30%, 32%, 34%, etc.
Further, in step S3, the sintering specifically includes: sintering the upper cover and/or the lower cover coated with the paste through a sintering furnace, wherein the temperature of an inlet and an outlet of the sintering furnace is 500-600 ℃, the temperature of a constant temperature section is 850-1000 ℃, the time of passing through the constant temperature section is 15-20min, and the time of passing through the sintering furnace is 30-50 min.
Further, in step S3, the temperature of the constant temperature section is 980-1000 ℃.
According to another aspect of the invention, the ultrathin soaking plates are provided, and the capillary structures among the ultrathin soaking plates are processed by the process of any one of the above items.
The invention has the beneficial effects that:
1. according to the characteristic that copper powder can be formed at will, the method of dispensing, screen printing, silk printing or spraying is adopted to apply the copper powder to the capillary structure area of the ultrathin soaking plate, so that capillary structures with various paths, widths and densities can be formed, and the permeability is greatly improved by the porous capillary structures. The processing technology of the copper powder capillary structure can be suitable for soaking plates with the thickness less than 1 mm.
2. The processing technology of the capillary structure can be processed by automatic equipment, the size consistency is high, and the reject ratio of the capillary structure is low; one person can control a plurality of devices simultaneously, so that the manpower is greatly reduced, the daily capacity of each machine reaches 2w, and the capacity is 10 times of that of the traditional wire arrangement; the verification time is shortened, the competitiveness is improved, the order volume and the stock are not needed, and the production is carried out according to the order.
Drawings
FIG. 1 is a schematic structural view of an ultra-thin vapor chamber prepared in example 1 of the present invention;
FIG. 2 is a schematic structural view of an ultra-thin vapor chamber prepared in example 2 of the present invention;
wherein: 1. a lower cover; 2. an upper cover; 3. a capillary structure; 4. and (5) degassing the small pipe.
Detailed Description
The present invention is further described below in conjunction with the following figures and specific examples so that those skilled in the art may better understand the present invention and practice it, but the examples are not intended to limit the present invention.
Example 1
Fig. 1 shows an ultrathin soaking plate provided in this embodiment, which includes an upper cover 2 and a lower cover 1, wherein a support pillar structure is etched on the lower cover 1, a degassing tubule 4 and a capillary structure 3 are formed on the upper cover 2, and a processing process of the capillary structure is as follows:
s1, uniformly mixing copper powder with the granularity of 200 meshes and 30 wt% of cellulose to obtain paste;
s2, coating the paste on the upper cover of the soaking plate by adopting a dispensing method;
and S3, sintering the upper cover coated with the paste in a roller furnace under the protection of inert atmosphere, wherein the inlet and outlet temperatures of the sintering furnace are 600 ℃, the temperature of the constant temperature section is 980 ℃, the time of passing through the constant temperature section is 20min, and the time of passing through the sintering furnace is 50 min.
Example 2
Fig. 2 is a view of an ultrathin soaking plate provided in this embodiment, and the ultrathin soaking plate includes an upper cover 2 and a lower cover 1, where a support column structure is etched on the lower cover 1, a degassing tubule 4 and a capillary structure 3 are further formed on the lower cover 1, and a processing process of the capillary structure is as follows:
s1, uniformly mixing copper powder with the particle size of 200 meshes with 25 wt% of glycerin to obtain paste;
s2, coating the paste on the lower cover of the soaking plate by adopting a silk-screen printing method;
and S3, sintering the upper cover coated with the paste in a roller furnace under the protection of inert atmosphere, wherein the inlet and outlet temperatures of the sintering furnace are 600 ℃, the temperature of the constant temperature section is 1000 ℃, the time of passing through the constant temperature section is 15min, and the time of passing through the sintering furnace is 40 min.
The effect of the capillary structure is mainly the speed of the working medium backflow, and compared with the traditional capillary structure, the capillary climbing rate of the copper powder capillary structure in the embodiments 1 and 2 of the invention is improved by about 10-15%.
The above-mentioned embodiments are merely preferred embodiments for fully illustrating the present invention, and the scope of the present invention is not limited thereto. The equivalent substitution or change made by the technical personnel in the technical field on the basis of the invention is all within the protection scope of the invention. The protection scope of the invention is subject to the claims.
Claims (6)
1. A processing technology of a copper powder capillary structure for an ultrathin soaking plate is characterized by comprising the following steps:
s1, uniformly mixing copper powder and 20-40 wt% of adhesive to obtain paste;
s2, coating the paste on the upper cover and/or the lower cover of the soaking plate by adopting a method of dispensing, screen printing, silk-screen printing or spraying;
s3, sintering the upper cover and/or the lower cover coated with the paste in an inert atmosphere to obtain the copper powder capillary structure; wherein the sintering system is as follows: the temperature is raised from 500-fold temperature of 600 ℃ to 850-fold temperature of 1000 ℃ at constant speed, the temperature is kept for 15-20min, and then the temperature is lowered to 500-fold temperature of 600 ℃ at constant speed.
2. The process for processing the copper powder capillary structure of the ultrathin soaking plate according to the claim 1, wherein in the step S1, the granularity of the copper powder is 150-350 meshes.
3. The process for fabricating a copper powder capillary structure for ultra-thin vapor chambers in accordance with claim 1, wherein in step S1, the adhesive is selected from at least one of cellulose and glycerol.
4. The process for processing the copper powder capillary structure of the ultrathin soaking plate as claimed in claim 1, wherein in the step S3, the sintering is specifically as follows: sintering the upper cover and/or the lower cover coated with the paste through a sintering furnace, wherein the temperature of an inlet and an outlet of the sintering furnace is 500-600 ℃, the temperature of a constant temperature section is 850-1000 ℃, the time of passing through the constant temperature section is 15-20min, and the time of passing through the sintering furnace is 30-50 min.
5. The process for processing the copper powder capillary structure of the ultrathin soaking plate as claimed in claim 4, wherein the temperature of the constant temperature section is 980-1000 ℃ in step S3.
6. An ultrathin soaking plate is characterized in that a capillary structure between the ultrathin soaking plates is processed by the process as claimed in any one of claims 1 to 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201911422768.7A CN111380388A (en) | 2019-12-31 | 2019-12-31 | Processing technology of copper powder capillary structure for ultrathin soaking plate |
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| CN201911422768.7A CN111380388A (en) | 2019-12-31 | 2019-12-31 | Processing technology of copper powder capillary structure for ultrathin soaking plate |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112266771A (en) * | 2020-10-15 | 2021-01-26 | 江苏库博德金属科技有限公司 | Capillary copper powder paste for ultrathin soaking plate |
| CN114659396A (en) * | 2020-12-23 | 2022-06-24 | 广州力及热管理科技有限公司 | Patterned capillary structure element and manufacturing method thereof |
| CN114993083A (en) * | 2022-05-24 | 2022-09-02 | 武汉理工大学 | Visual ultrathin flexible vapor chamber for low-temperature process and preparation method thereof |
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| CN101848629A (en) * | 2010-03-31 | 2010-09-29 | 华南理工大学 | Soaking plate of foam metal and copper powder compounded capillary structure |
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| CN105108163A (en) * | 2015-09-09 | 2015-12-02 | 元磁新型材料(苏州)有限公司 | Copper powder used for ultrathin vapor chamber and manufacturing method thereof |
| CN105547026A (en) * | 2015-12-25 | 2016-05-04 | 江苏宏力光电科技股份有限公司 | Thermal column processing method |
| CN207543468U (en) * | 2017-08-29 | 2018-06-26 | 苏州天脉导热科技股份有限公司 | Ultra-thin soaking plate |
| CN110303153A (en) * | 2019-06-28 | 2019-10-08 | 安泰环境工程技术有限公司 | A kind of processing method of capillary wick and its assembly method with shell |
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2019
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Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US4885129A (en) * | 1988-10-24 | 1989-12-05 | The United States Of America As Represented By The Secretary Of The Air Force | Method of manufacturing heat pipe wicks |
| US4964457A (en) * | 1988-10-24 | 1990-10-23 | The United States Of America As Represented By The Secretary Of The Air Force | Unidirectional heat pipe and wick |
| CN1804534A (en) * | 2005-01-15 | 2006-07-19 | 富准精密工业(深圳)有限公司 | Manufacturing method for porous structure layer of heat pipe |
| CN1920467A (en) * | 2005-08-26 | 2007-02-28 | 富准精密工业(深圳)有限公司 | Method for manufacturing sintered heat pipe |
| CN101848629A (en) * | 2010-03-31 | 2010-09-29 | 华南理工大学 | Soaking plate of foam metal and copper powder compounded capillary structure |
| CN104227164A (en) * | 2013-06-14 | 2014-12-24 | 富瑞精密组件（昆山）有限公司 | Heat pipe and manufacturing method thereof |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112266771A (en) * | 2020-10-15 | 2021-01-26 | 江苏库博德金属科技有限公司 | Capillary copper powder paste for ultrathin soaking plate |
| CN114659396A (en) * | 2020-12-23 | 2022-06-24 | 广州力及热管理科技有限公司 | Patterned capillary structure element and manufacturing method thereof |
| CN114659396B (en) * | 2020-12-23 | 2023-12-19 | 广州力及热管理科技有限公司 | Patterned capillary structure element and manufacturing method thereof |
| CN114993083A (en) * | 2022-05-24 | 2022-09-02 | 武汉理工大学 | Visual ultrathin flexible vapor chamber for low-temperature process and preparation method thereof |
| CN114993083B (en) * | 2022-05-24 | 2024-01-26 | 武汉理工大学 | Low-temperature process visual ultrathin flexible vapor chamber and preparation method thereof |
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Application publication date: 20200707 |