CN107634045A - A kind of compound bonding wire of golden contracted payment and preparation method thereof - Google Patents

A kind of compound bonding wire of golden contracted payment and preparation method thereof Download PDF

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Publication number
CN107634045A
CN107634045A CN201710637729.3A CN201710637729A CN107634045A CN 107634045 A CN107634045 A CN 107634045A CN 201710637729 A CN201710637729 A CN 201710637729A CN 107634045 A CN107634045 A CN 107634045A
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China
Prior art keywords
golden
prepared
silver
bonding wire
compound
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CN201710637729.3A
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Chinese (zh)
Inventor
康菲菲
杨国祥
孔建稳
吴永瑾
周文艳
裴洪营
俞建树
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Sino Platinum Metals Co Ltd
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Sino Platinum Metals Co Ltd
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Priority to CN201710637729.3A priority Critical patent/CN107634045A/en
Publication of CN107634045A publication Critical patent/CN107634045A/en
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/43—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45139—Silver (Ag) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/4554—Coating
    • H01L2224/45565—Single coating layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/4554—Coating
    • H01L2224/45599—Material
    • H01L2224/456—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45638—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45644—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Metal Extraction Processes (AREA)

Abstract

The invention discloses a kind of golden compound bonding wire of contracted payment and preparation method thereof, belong to Electronic Packaging field.The cladding thickness and core diameter ratio of the golden compound bonding wire of contracted payment are 1：200~1：50, the chemical composition (weight %) of silver core material is：2~10Pd, surplus Ag.Preparation method includes：Gold pipe is prepared using founding-drilling-rolling-drawing process flow, silver-colored rod is prepared with continuous casting technology, billet will be assembled into after gold pipe and the heat treatment of silver-colored rod, cleaning, billet is compound through 30~50% large deformation drawing, and compound billet drawing is processed intoFilament, it is thermally treated to be prepared into the compound bonding wire of golden contracted payment.The golden compound bonding wire of contracted payment has good mechanical performance, electric property and welding performance, is suitable for microelectronics Packaging.Preparing the compound bonding wire of golden contracted payment using sleeve drawing complex technique has the advantages that finished size is accurate, surface smoothness is high, and interface binding power is strong, cladding thickness is controllable, equipment is simple, easy to maintenance.

Description

A kind of compound bonding wire of golden contracted payment and preparation method thereof
Technical field
The present invention relates to the bonding for connecting electrode and wiring board (lead frame, substrate, band etc.) on semiconductor element Lead, belong to Electronic Packaging field.
Background technology
Bonding wire is one of four big basic materials in semiconductor packages (chip, lead frame, plastic packaging resin, bonding Silk), for connecting between chip and lead frame or chip and chip, play a part of conducting electric signal.Electronic product Portable, miniaturization, networking and multimedization development trend, accordingly will be proposed to integrated antenna package technology and material Ask, high density and high speed turn into an important factor for promoting microelectronic packaging technology development.Encapsulating material is to realize to encapsulate new skill The support of art, the progress of encapsulation technology, it is desirable to which its material increases in performance, to adapt to New Technical Condition.Conventional keys alloy Silk has tended to the limit in electric conductivity, intensity, and it is extremely urgent to seek a kind of new material.The conduction of silver, heat conductivility are high Yu Jin, there is good mechanical performance, and generate the speed of intermetallic compound less than gold.But silver sulphur easy in an atmosphere Change, stability is poor, and covering one layer of gold in silver surface is greatly improved its chemical stability.The cladding and core of the golden compound bonding wire of contracted payment Material performance makes up for each other's deficiencies and learn from each other, and produces cooperative effect, makes the performance of its compound bonding wire meet to encapsulate better than former composition material It is required that.
Complex technique is one of crucial technology of preparing of the compound bonding wire of golden contracted payment.Surface coating technology has plating, solid phase Complex technique, compound founding and gas phase deposition technology etc..By to interface binding power, surface quality, cladding thickness control and batch Quantify the comparison of working condition etc., solid phase complex technique can obtain that cladding is controllable, interface binding power is strong, cladding thickness one Cause property excellent composite blank that is good, meeting mass production environment.Drawing in solid phase complex technique is compound to obtain elongated dimension Product, it is processed further suitable for metal tube and the compound and cladding bar of bar.Existing composite wire material technology of preparing (Xie Ming, Chen Yongtai, Zhang Jiming gold/silver/copper alloy NEW TYPE OF COMPOSITE silk material and preparation method thereof Chinese inventions are extruded after having sleeve pipe Patent, application number：201210580244.2 publication date：2013.05.01 (Jiang Yanbin, Xie Jianxin, Guo) or after sleeve pipe are forged A kind of preparation methods of golden copper-clad composite filament of poem a beautiful gem, Chinese invention patent, application number：201610318397.8 publication date： 2016.07.20), the problem of both approaches are present be：(1) cladding thickness can not be prepared and core diameter ratio is less than 1：10 Ultra-thin cladding bonding wire, the thicker balling-up for influenceing the first solder joint of cladding, then reduces welding performance；2) extruding and forging method The composite blank surface quality prepared is poor, and it is more to be processed further defect, and outage is high；3) extruding and metal stream in forging process When dynamic uneven, it is even to easily cause inside and outside wall unevenness along its length, easily produces profile wave, interface in Bamboo-shaped even Fracture phenomena after hard formation.4) equipment is complicated, cycle length.
The content of the invention
It is an object of the invention to provide a kind of bonding wire-compound bonding wire of golden contracted payment suitable for microelectronics Packaging and its Preparation method.The golden compound bonding wire preparation method of contracted payment is into blank, through drawing deformation and diffusion annealing pair using sleeve-assembled Golden contracted payment progress is compound, and the compound bonding wire of golden contracted payment is prepared through drawing processing.The compound bonding wire cladding that this method is prepared into is equal It is even it is controllable, interface binding power is strong, preparation process is environmentally friendly.
The specific preparation process of the present invention is as follows：
(1) prepared by tubing
Purity is used to be prepared into a diameter of 30~40mm of φ ingot casting through high-frequency melting furnace for 99.99% golden raw material.In ingot casting Centre-drilling hole, hole internal diameter are 10~15mm of φ, and through roughing, fine rolling, drawing, it is 5~10mm of φ to be prepared into external diameter, and wall thickness is 0.05~0.5mm ± 0.005mm gold pipe.
(2) prepared by core
According to the ingredient composition of AgPdx (x=2~10%), 4.5 μm~9.95 μm of diameter phi is prepared into using accurate continuous casting technology Ingot casting, vacuum 10-2, casting speed is 50~100mm/min, and casting temperature is 900~1050 DEG C.
(3) composite blank assembles
The gold pipe prepared is annealed in an atmosphere, annealing process is 200 DEG C~400 DEG C/45min, silver-colored rod hydrogen in tube furnace Annealed under gas shielded atmosphere, annealing process is 600 DEG C~800 DEG C/30min.Gold pipe and silver-colored rod are respectively washed, cleaning process is such as Under：Boiled in golden Guan Xianjing 10% HCl, the 10min that seethes with excitement, drying are heated in ventilating kitchen.Then rinsed with acetone soln Golden inside pipe wall；Silver-colored rod surface is wiped with acetone soln, is dried.Silver-colored rod being placed on clean glass plate, both hands press silver-colored rod, Roll, until silver-colored rod is vertical, must be gently inserted in from one end of golden pipe on a glass.
(4) drawing is compound
The blank assembled is compound with 30~50% pass deformation drawing, and the composite bar after drawing is in an atmosphere with 300 ~500 DEG C of temperature, 5~60min soaking time diffusion annealing.
(5) filament is processed
Golden contracted payment composite wire material is prepared into step (4) and carries out further drawing processing, is prepared into 50 μm of 20 μm~φ's of φ Finished product.Wherein φ 0.3mm above silk material pass deformation is 10%~20%, and drawing speed is 10~80m/min, φ 0.3mm Following silk material pass deformation is 3%~15%, and drawing speed is 50~200m/min.
(6) anneal
The golden contracted payment composite wire material prepared to step (5) is annealed, and annealing temperature is 300 DEG C~600 DEG C, and annealing speed is 50m/min~100m/min.
The advantage of the invention is that：Sleeve drawing complex technique utilizes the characteristics of stretcher strain, makes gold pipe and silver-colored bar shape Into the fresh surface of large area, the gas between cladding and core is discharged, defect is eliminated, obtains composite blank.Composite blank passes through Diffusion annealing, the element of interface both sides is activated and phase counterdiffusion, forms the diffusion layer of fine grain structure, enhances the boundary of material Face combines, and improves the bond strength at interface.
Preparing the compound bonding wire of golden contracted payment using sleeve drawing deformation bonding technology has that finished size is accurate, any surface finish Degree is high, and interface binding power is strong, cladding thickness is controllable, and equipment is simple, it is easy to maintenance the advantages that.
Brief description of the drawings
Fig. 1 is sleeve drawing complex technique schematic diagram：1:Wire drawing die；2nd, core；3rd, cladding.
Embodiment
PrepareThe compound bonding wire of golden contracted payment
(1) prepared by tubing
Using 99.99% gold as raw material, φ 30mm ingot casting is prepared into using casting method, in centre-drilling hole, hole internal diameter For φ 10mm, it is φ 5.08mm to be prepared into external diameter through roughing, finish rolling, finish draw, and the gold that wall thickness is 0.08mm ± 0.005mm is managed.
(2) prepared by core
With more than 99.9% silver for raw material, φ 4.9mm bar is prepared into using accurate continuous casting process, continuous casting process is：Temperature Spend for 1050 DEG C, off speed 100m/min, vacuum 10-2Pa。
(3) composite blank assembles
The gold pipe prepared is annealed in an atmosphere, annealing process is 350 DEG C/45min, silver-colored rod hydrogen shield gas in tube furnace Annealed under atmosphere, annealing process is 700 DEG C/30min.Gold pipe and silver-colored rod are respectively washed, cleaning process is as follows：Golden Guan Xianjing 10% HCl in boil, be heated in ventilating kitchen seethe with excitement 10min, drying.Then golden inside pipe wall is rinsed with acetone soln；Use acetone Solution wipes silver-colored rod surface, dries.Silver-colored rod being placed on clean glass plate, both hands press silver-colored rod, roll on a glass, Until silver-colored rod is vertical, must be gently inserted in from one end of golden pipe.
Drawing is compound
Composite blank crosses mould after annealing using 40% deflection, and annealing process is 350 DEG C/30min.
Drawing is processed
To the further drawing processing of silk material after compound, be prepared into 20 μm of the φ compound bonding wire of golden contracted payment, wherein φ 0.3mm with Upper silk material pass deformation is 12%, and drawing speed 40m/min, below φ 0.3mm silk material pass deformation are 5%, are drawn It is 100m/min to pull out speed.
Annealing
Continuous annealing is carried out to the composite wire material prepared, annealing temperature is at 560 DEG C, and annealing speed is in 85m/min.
The technical indicator of the specific embodiment of the compound bonding wire of golden contracted payment of the present invention is as shown in table 1.

Claims (6)

  1. A kind of 1. compound bonding wire of golden contracted payment, it is characterised in that：The golden compound bonding wire of contracted payment is one kind in silver alloy core surfaces The micron order filament of one layer of layer gold is coated, compound bonding wire is prepared using sleeve drawing.
  2. 2. the compound bonding wire of golden contracted payment according to claim 1, it is characterised in that：Core is silver alloy, and top layer is gold, multiple The ratio of thickness degree and core diameter is 1：200~1：50.
  3. 3. the compound bonding wire of golden contracted payment according to claim 1, it is characterised in that：Silver alloy core is to be in purity The palladium of addition 2~10% in 99.9% silver.
  4. 4. the compound bonding wire of golden contracted payment according to claim 1, it is characterised in that：Described sleeve drawing is using molten Casting-drilling-rolling-drawing prepares gold pipe, prepares silver alloy bar with continuous casting technology, silver alloy bar and golden pipe are combined Form composite blank.Composite blank is further compound through drawing deformation.
  5. 5. the preparation method of the compound bonding wire of gold medal contracted payment, specifically includes following process steps：
    (1) prepared by tubing
    Purity is used to be prepared into for 99.99% golden raw material through high-frequency melting furnace a diameter ofIngot casting.In ingot casting Centre-drilling hole, hole internal diameter areThrough roughing, fine rolling, drawing, being prepared into external diameter isWall thickness is 0.05~0.5mm ± 0.005mm gold pipe；
    (2) prepared by core
    According to AgPdx, wherein x=2~10% ingredient composition, diameter is prepared into using accurate continuous casting technology Ingot casting, vacuum 10-2, casting speed is 50~100mm/min, and casting temperature is 900~1050 DEG C；(3) it is multiple Close blank assembling
    The gold pipe prepared is annealed in an atmosphere, annealing process is 200 DEG C~400 DEG C/45min, silver-colored rod hydrogen in tube furnace Annealed under gas shielded atmosphere, annealing process is 600 DEG C~800 DEG C/30min.Gold pipe and silver-colored rod are respectively washed, cleaning process is such as Under：Boiled in golden Guan Xianjing 10% HCl, the 10min that seethes with excitement, drying are heated in ventilating kitchen.Then rinsed with acetone soln Golden inside pipe wall；Silver-colored rod surface is wiped with acetone soln, is dried.Silver-colored rod being placed on clean glass plate, both hands press silver-colored rod, Roll on a glass, until silver-colored rod is vertical, from one end of golden pipe being inserted in gently；
    (4) drawing is compound
    The blank assembled is compound with 30~50% pass deformation drawing, and the composite bar after drawing is in an atmosphere with 300 ~500 DEG C of temperature, 5~60min soaking time diffusion annealing；
    (5) filament is processed
    Golden contracted payment composite wire material is prepared into step (4) and carries out further drawing processing, is prepared intoInto Product, wherein φ 0.3mm above silk material pass deformation are 10%~20%, and drawing speed is 10~80m/min, φ 0.3mm with Under silk material pass deformation be 3%~15%, drawing speed is 50~200m/min；
    (6) anneal
    The golden contracted payment composite wire material prepared to step (5) is annealed, and annealing temperature is 300 DEG C~600 DEG C, and annealing speed is 50m/min~100m/min.
  6. 6. the preparation method of the compound bonding wire of gold medal contracted payment, specifically includes following process steps：
    (1) prepared by tubing
    Using 99.99% gold as raw material, φ 30mm ingot casting is prepared into using casting method, in centre-drilling hole, hole internal diameter For φ 10mm, it is φ 5.08mm to be prepared into external diameter through roughing, finish rolling, finish draw, and the gold that wall thickness is 0.08mm ± 0.005mm is managed；
    (2) prepared by core
    With more than 99.9% silver for raw material, φ 4.9mm bar is prepared into using accurate continuous casting process, continuous casting process is：Temperature Spend for 1050 DEG C, off speed 100m/min, vacuum 10-2Pa；
    (3) composite blank assembles
    The gold pipe prepared is annealed in an atmosphere, annealing process is 350 DEG C/45min, silver-colored rod hydrogen shield gas in tube furnace Annealed under atmosphere, annealing process is 700 DEG C/30min.Gold pipe and silver-colored rod are respectively washed, cleaning process is as follows：Golden Guan Xianjing 10% HCl in boil, be heated in ventilating kitchen seethe with excitement 10min, drying.Then golden inside pipe wall is rinsed with acetone soln；Use acetone Solution wipes silver-colored rod surface, dries.Silver-colored rod being placed on clean glass plate, both hands press silver-colored rod, roll on a glass, Until silver-colored rod is vertical, must be gently inserted in from one end of golden pipe；
    (4) drawing is compound
    Composite blank crosses mould after annealing using 40% deflection, and annealing process is 350 DEG C/30min.
    (5) drawing is processed
    To the further drawing processing of silk material after compound, be prepared into 20 μm of the φ compound bonding wire of golden contracted payment, wherein φ 0.3mm with Upper silk material pass deformation is 12%, and drawing speed 40m/min, below φ 0.3mm silk material pass deformation are 5%, are drawn It is 100m/min to pull out speed.
    (6) anneal
    Continuous annealing is carried out to the composite wire material prepared, annealing temperature is at 560 DEG C, and annealing speed is in 85m/min.
CN201710637729.3A 2017-07-31 2017-07-31 A kind of compound bonding wire of golden contracted payment and preparation method thereof Withdrawn CN107634045A (en)

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Application Number Priority Date Filing Date Title
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109719467A (en) * 2019-01-07 2019-05-07 新饰尚生活科技(深圳)有限公司 A kind of gold contracted payment method and silver-colored pot
CN109979687A (en) * 2019-04-23 2019-07-05 张裕仕 A kind of manufacture craft of fine silver & proof gold balance conductor
CN113026009A (en) * 2021-03-29 2021-06-25 广东禾木科技有限公司 Passivation solution, method for improving bonding performance of metal material, bonding wire and application
CN113136542A (en) * 2021-04-26 2021-07-20 河南机电职业学院 Preparation method of gold-coated silver bonding wire

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Publication number Priority date Publication date Assignee Title
GB2042943A (en) * 1979-02-20 1980-10-01 Gibbons K T Composite Material of Precious Metals
CN1733420A (en) * 2005-06-27 2006-02-15 赵兵 Manufacturing method of iron-nickel alloy bag oxygen-free copper low-resistance packaging lead wire
CN101698206A (en) * 2009-10-27 2010-04-28 宝鸡市巨成钛业有限责任公司 Technique for producing titanium-copper compound wire
CN102723144A (en) * 2012-06-19 2012-10-10 西北有色金属研究院 Method for preparing Cu-Ag multi-core composite wire
CN103056191A (en) * 2012-12-23 2013-04-24 昆明贵金属研究所 Novel preparation method for noble composite metallic bond composite wire materials
CN104308124A (en) * 2014-10-14 2015-01-28 昆明贵金属研究所 High-strength gold clad copper composite wire and preparation method thereof
CN104867622A (en) * 2015-05-22 2015-08-26 西北有色金属研究院 Preparation method of AgSnO2 multi-core composite wire rod
CN105772612A (en) * 2016-05-13 2016-07-20 北京科技大学 Preparation method for gold-cladding copper composite wire

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2042943A (en) * 1979-02-20 1980-10-01 Gibbons K T Composite Material of Precious Metals
CN1733420A (en) * 2005-06-27 2006-02-15 赵兵 Manufacturing method of iron-nickel alloy bag oxygen-free copper low-resistance packaging lead wire
CN101698206A (en) * 2009-10-27 2010-04-28 宝鸡市巨成钛业有限责任公司 Technique for producing titanium-copper compound wire
CN102723144A (en) * 2012-06-19 2012-10-10 西北有色金属研究院 Method for preparing Cu-Ag multi-core composite wire
CN103056191A (en) * 2012-12-23 2013-04-24 昆明贵金属研究所 Novel preparation method for noble composite metallic bond composite wire materials
CN104308124A (en) * 2014-10-14 2015-01-28 昆明贵金属研究所 High-strength gold clad copper composite wire and preparation method thereof
CN104867622A (en) * 2015-05-22 2015-08-26 西北有色金属研究院 Preparation method of AgSnO2 multi-core composite wire rod
CN105772612A (en) * 2016-05-13 2016-07-20 北京科技大学 Preparation method for gold-cladding copper composite wire

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109719467A (en) * 2019-01-07 2019-05-07 新饰尚生活科技(深圳)有限公司 A kind of gold contracted payment method and silver-colored pot
CN109979687A (en) * 2019-04-23 2019-07-05 张裕仕 A kind of manufacture craft of fine silver & proof gold balance conductor
CN113026009A (en) * 2021-03-29 2021-06-25 广东禾木科技有限公司 Passivation solution, method for improving bonding performance of metal material, bonding wire and application
CN113136542A (en) * 2021-04-26 2021-07-20 河南机电职业学院 Preparation method of gold-coated silver bonding wire
CN113136542B (en) * 2021-04-26 2023-08-15 河南机电职业学院 Preparation method of gold-coated silver bonding wire

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