CN113136542B - Preparation method of gold-coated silver bonding wire - Google Patents
Preparation method of gold-coated silver bonding wire Download PDFInfo
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- CN113136542B CN113136542B CN202110450753.2A CN202110450753A CN113136542B CN 113136542 B CN113136542 B CN 113136542B CN 202110450753 A CN202110450753 A CN 202110450753A CN 113136542 B CN113136542 B CN 113136542B
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C10/00—Solid state diffusion of only metal elements or silicon into metallic material surfaces
- C23C10/18—Solid state diffusion of only metal elements or silicon into metallic material surfaces using liquids, e.g. salt baths, liquid suspensions
- C23C10/20—Solid state diffusion of only metal elements or silicon into metallic material surfaces using liquids, e.g. salt baths, liquid suspensions only one element being diffused
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Abstract
The invention provides a preparation method of a gold-clad silver bonding wire, which comprises the following steps: taking a silver wire blank with a wire diameter of 15-30 mu m as a blank; adding the nano gold into a stable solvent, and performing ultrasonic treatment for 30-60 min to prepare nano gold immersion plating solution; immersing the silver wire blank in nano-gold immersion plating liquid, and forming a stable alloy layer on the gold-silver contact surface by adopting a vacuum heating immersion plating or infrared heating immersion plating mode; processing the dip plated silver wire blank by adopting a vacuum heating drying or vacuum infrared drying mode to form an integrated gold-coated silver bonding wire; and (3) annealing the gold-clad silver bonding wire. The preparation method of the invention enables the nano-gold and silver wires to be contacted in nano level to form a firm gold-silver alloy transition layer, the prepared gold-coated silver bonding wire gold layer is uniform and controllable, the gold-silver interface binding force is strong, the production process is environment-friendly, meanwhile, the weldability is better, the oxidation resistance is excellent, the conductivity is excellent, and the reliability of the bonding wire is overall better.
Description
Technical Field
The invention relates to a preparation method of a gold-clad silver bonding wire, and belongs to the field of electronic packaging.
Background
With the development of the integrated circuit manufacturing industry and the packaging industry, the demand for bonding wires (inner leads between a chip and a frame) as one of four basic materials of a semiconductor package is increasing. The rapid development of microelectronics has led to the continuous advancement of chips to high performance, high density and miniaturization, and therefore, higher demands are placed on bonding wires between the chip and the frame. The traditional bonding wire has the advantages of excellent electrochemical performance, high reliability and the like, becomes the bonding wire with the most application in the packaging industry, but the price of the gold bonding wire is high, so that the product with equivalent performance and low price is sought for reducing the cost.
Silver has good electric conduction, heat conduction and mechanical properties, and is a candidate substitute product with good bond alloy wires. Although the silver wire has lower cost advantage and better bonding performance, the silver wire is easy to oxidize, the conductivity of the oxidized silver wire is poor, bonding reliability is affected, and the application of the silver wire in the field of high-end electronic packaging industry is further limited. The surface of the silver wire is plated with inert metal to form a protective layer, so that the oxidation resistance of the lead can be improved on the premise of not reducing the bonding performance of the silver wire, and the gold plating performance is excellent among a plurality of inert elements.
At present, the gold plating process of the silver-based bonding wire is mainly finished through chemical plating and electroplating, but the prior art has certain disadvantages, such as: the process pollutes the environment, the plating solution component contains acid-base ions, is easy to remain on the surface of the wire body, and affects the stability of the bonding wire. There are also problems with solid phase complexation techniques, such as: the thickness of the gold layer is not easy to control, the gold layer is uneven, etc.
Disclosure of Invention
Aiming at the defects of the prior art, the invention aims to provide a preparation method of a gold-coated silver bonding wire, wherein the obtained gold layer is uniform and controllable, the gold-silver interface bonding force is strong, and the production process is environment-friendly.
In order to achieve the above purpose, the technical scheme adopted by the invention is as follows:
a preparation method of a gold-clad silver bonding wire comprises the following steps:
(1) Silver wire blank: taking a silver wire blank with a wire diameter of 15-30 mu m as a blank;
(2) Preparing nano gold immersion plating liquid: adding the nano gold into a stable solvent, and performing ultrasonic treatment for 30-60 min to prepare nano gold immersion plating solution;
(3) Plating silver wire blank with nano gold: immersing the silver wire blank in nano-gold immersion plating liquid, and forming a stable alloy layer on the gold-silver contact surface by adopting a vacuum heating immersion plating or infrared heating immersion plating mode;
(4) Vacuum treatment: processing the dip plated silver wire blank by adopting a vacuum heating drying or vacuum infrared drying mode to form an integrated gold-coated silver bonding wire;
(5) Heat stability treatment: and (3) annealing the gold-clad silver bonding wire.
The particle size of the nano gold is less than or equal to 80nm, and the mass concentration of the nano gold in the nano gold immersion plating solution is 0.4-15%.
The stabilizing solvent comprises the following components in mass concentration: 0.02-2% of stabilizer, 0.5-12% of auxiliary agent, 0.05-1% of surfactant and the balance of water.
The stabilizer is one or more of tetrahydrofuran, dimethyl sulfoxide, N-methyl pyrrolidone, formamide and methyl guanamine.
The auxiliary agent is any one or the mixture of two or more of formaldehyde, methanol, ethanol and acetone.
The surfactant is nonionic surfactant or/and block copolymerization surfactant; the nonionic surfactant is as follows: allyl alcohol polyoxyalkyl ether F-6 and/or polyethylene glycol 1000; the block copolymerization surfactant comprises: any one or two or more of polyethylene oxide-polypropylene oxide-polyethylene oxide triblock copolymer P123, propylene glycol block polyether L-64 and propylene glycol block polyether F68.
The temperature of the vacuum heating dip plating or the infrared heating dip plating in the step (3) is 500-600 ℃ and the time is 5-15 min.
And (4) vacuum heating and drying or vacuum infrared drying at the temperature of 80-120 ℃ for 30 s-5 min.
The annealing temperature in the step (5) is 500-680 ℃ and the time is 5-15 min.
And (3) repeating the step (3) to dip the silver wire blank after dip plating into the nano-gold dip plating liquid again before the step (4) of vacuum treatment to finish the dip plating again, wherein the dip plating frequency is more than or equal to 1 time.
The invention has the beneficial effects that:
the invention adopts a stabilizing agent, an auxiliary agent and a surfactant to form a stabilizing solvent, so that the gold nanoparticles are stably suspended in the solution, wherein the larger the size of the gold nanoparticles is, the larger the required building effect is, the higher the requirement on the surfactant is, the larger the size of the gold nanoparticles is, and the larger the thickness of the gold plating layer is after single dip plating. The surfactant of the invention is selected from polyether, polyalcohol and polyalkyl substances, and active groups on molecules of the surfactant can form chemical bonding action with nano materials, so that nano gold particles can stably exist in a solution. Meanwhile, the stabilizer is added to assist the surfactant, so that compatibility among the auxiliary agent, the surfactant and the nano gold particles is better, stability of the solution is better, and the gold layer outside the silver wire blank is good in uniformity through an immersion plating process. The vacuum treatment and the heat stabilization treatment process are used for improving the comprehensive performance of the gold-clad silver bonding wire because the gold layer and the silver blank are firmly combined.
The preparation method of the invention enables the nano gold and silver wires to be contacted in nano level, and gold and silver elements are mutually diffused through gold and silver contact surface treatment to form a firm gold and silver alloy transition layer, so that the gold plating layer and the silver wire blank are integrated. The method combines one or more times of dip plating, the thickness of the gold coating layer is controllable, the coating is compact, the production equipment is simple, and the production process is environment-friendly. The cost price of the prepared gold-clad silver bonding wire is greatly reduced, and the bonding process has strong compatibility; meanwhile, the welding performance is good, the oxidation resistance is excellent, the conductivity is excellent, and the reliability of the bonding wire is overall excellent.
Detailed Description
The following describes the embodiments of the present invention in further detail with reference to examples.
Example 1 preparation of gold nano-immersion plating solution
1#: 0.5mg of N-methylpyrrolidone, 12.5mg of acetone, 1.25mg of polyethylene oxide-polypropylene oxide-polyethylene oxide triblock copolymer P123 are dissolved in water to prepare a stable solvent with a total weight of 2.5 g. 10mg of nano gold with the wavelength of 10-30 nm is selected and added into the stable solvent, and ultrasonic treatment is carried out for 30min, thus preparing the nano gold immersion plating solution No. 1.
2#: 0.5mg of N-methylpyrrolidone, 0.3mg of methylguanamine, 100mg of acetone, 1mg of polyethylene oxide-polypropylene oxide-polyethylene oxide triblock copolymer P123 and 5mg of propylene glycol block polyether F68 are dissolved in water to prepare a stable solvent with a total weight of 2.5 g. Selecting 25mg of nano gold with the wavelength of 10-30 nm, adding the nano gold into the stable solvent, and performing ultrasonic treatment for 30min to prepare nano gold immersion plating solution No. 2.
3#: 0.3mg of N-methylpyrrolidone, 0.3mg of dimethyl sulfoxide, 0.4mg of tetrahydrofuran, 50mg of acetone, 50mg of formaldehyde, 4mg of propylene glycol block polyether L-64 and 3mg of polyethylene glycol 1000 are dissolved in water to prepare a stable solvent with a total weight of 2.5 g. Selecting 50mg of nano gold with the wavelength of 30-50 nm, adding the nano gold into the stable solvent, and carrying out ultrasonic treatment for 60min to prepare nano gold immersion plating solution No. 3.
4#: 0.5mg of N-methylpyrrolidone, 0.5mg of dimethyl sulfoxide, 0.5mg of formamide, 50mg of acetone, 20mg of formaldehyde, 8mg of polyethylene oxide-polypropylene oxide-polyethylene oxide triblock copolymer P123, 6mg of propylene glycol block polyether L-64 and 6mg of propylene glycol block polyether F68 are dissolved in water to prepare a stable solvent with a total weight of 2.5 g. Selecting 100mg of nano gold with the wavelength of 30-50 nm, adding the nano gold into the stable solvent, and carrying out ultrasonic treatment for 45min to prepare nano gold immersion plating solution No. 4.
5#: 0.5mg of N-methylpyrrolidone, 1mg of tetrahydrofuran, 1mg of methylguanamine, 100mg of methanol, 200mg of ethanol, 10mg of allyl alcohol polyoxyalkylene ether F-6 and 10mg of polyethylene glycol 1000 were dissolved in water to prepare a stable solvent of 2.5g in total weight. Selecting 300mg of nano gold with the wavelength of 30-80 nm, adding the nano gold into the stable solvent, and carrying out ultrasonic treatment for 60min to prepare nano gold immersion plating solution No. 5.
Example 2 preparation of gold-coated silver bond wire
A preparation method of a gold-coated silver bonding wire with a nano gold layer coated with a silver blank comprises the following steps:
(1) Fresh silver wire blank: taking a fresh superfine silver wire blank with a wire diameter of 15 mu m as a blank;
(2) Preparing nano-gold immersion plating solution 1#: preparing nano-gold immersion plating solution 1# by adopting the method of the embodiment 1;
(3) Plating silver wire blank with nano gold: immersing a fresh silver wire blank in nano-gold immersion plating solution 1# and carrying out vacuum heating immersion plating at 500 ℃ for 15min to enable a gold-silver contact surface to form a stable alloy layer;
(4) Vacuum treatment: vacuum infrared heating and drying are carried out for 30s at the temperature of 100 ℃ so that the gold plating layer and the silver wire blank are in closer contact to form an integrated gold-coated silver bonding wire;
(5) Heat stability treatment: and (3) annealing the gold-coated silver bonding wire, wherein the annealing temperature is 500 ℃, the time is 5min, and the thickness of the obtained gold layer is 50-80 nm.
Example 3 preparation of gold-coated silver bond wire
A preparation method of a gold-coated silver bonding wire with a nano gold layer coated with a silver blank comprises the following steps:
(1) Fresh silver wire blank: taking a fresh superfine silver wire blank with a wire diameter of 15 mu m as a blank;
(2) Preparing nano-gold immersion plating solution No. 2: preparing nano-gold immersion plating solution No. 2 by adopting the method of the embodiment 1;
(3) Plating silver wire blank with nano gold: immersing a fresh silver wire blank in nano-gold immersion plating solution 2# and carrying out vacuum heating immersion plating at 550 ℃ for 15min to enable a gold-silver contact surface to form a stable alloy layer;
(4) Vacuum treatment: vacuum heating and drying at 80 ℃ for 3min to enable the gold plating layer and the silver wire blank to be in closer contact to form an integrated gold-clad silver bonding wire;
(5) Heat stability treatment: and (3) annealing the gold-coated silver bonding wire, wherein the annealing temperature is 550 ℃, the time is 5min, and the thickness of the obtained gold layer is 150-200 nm.
Example 4 preparation of gold-coated silver bond wire
A preparation method of a gold-coated silver bonding wire with a nano gold layer coated with a silver blank comprises the following steps:
(1) Fresh silver wire blank: taking a fresh superfine silver wire blank with a wire diameter of 30 mu m as a blank;
(2) Preparing nano gold immersion plating liquid: nano gold immersion plating solutions 1# and 3# were prepared using example 1;
(3) Plating silver wire blank with nano gold: immersing a fresh silver wire blank in nano-gold immersion plating solution 3# at 600 ℃ for 15min of vacuum heating immersion plating, and then immersing in nano-gold immersion plating solution 1# at 600 ℃ for 15min of vacuum heating immersion plating to form a stable alloy layer on a gold-silver contact surface;
(4) Vacuum treatment: vacuum infrared drying is carried out for 1min at 100 ℃ to ensure that the gold plating layer and the silver wire blank are in closer contact to form an integrated gold-coated silver bonding wire;
(5) Heat stability treatment: and (3) annealing the gold-coated silver bonding wire, wherein the annealing temperature is 580 ℃, the time is 5min, and the thickness of the gold layer is 400-500 nm.
Example 5 preparation of gold-coated silver bond wire
A preparation method of a gold-coated silver bonding wire with a nano gold layer coated with a silver blank comprises the following steps:
(1) Fresh silver wire blank: taking a fresh superfine silver wire blank with the wire diameter of 20 mu m as a blank;
(2) Preparing nano-gold immersion plating solution No. 4: preparing nano-gold immersion plating solution No. 4 by adopting the method of the embodiment 1;
(3) Plating silver wire blank with nano gold: immersing a fresh silver wire blank in nano-gold immersion plating solution 4# and carrying out vacuum heating immersion plating at 550 ℃ for 15min to enable a gold-silver contact surface to form a stable alloy layer;
(4) Vacuum treatment: vacuum heating and drying at 120 ℃ for 5min to enable the gold plating layer and the silver wire blank to be in closer contact to form an integrated gold-clad silver bonding wire;
(5) Heat stability treatment: and (3) annealing the gold-coated silver bonding wire, wherein the annealing temperature is 600 ℃, the time is 10min, and the thickness of the obtained gold layer is 350-450 nm.
Example 6 preparation of gold-coated silver bond wire
A preparation method of a gold-coated silver bonding wire with a nano gold layer coated with a silver blank comprises the following steps:
(1) Fresh silver wire blank: taking a fresh superfine silver wire blank with a wire diameter of 30 mu m as a blank;
(2) Preparing nano-gold immersion plating solution No. 5: preparing nano-gold immersion plating solution No. 5 by adopting the method of the embodiment 1;
(3) Plating silver wire blank with nano gold: immersing a fresh silver wire blank in nano-gold immersion plating solution 5# and carrying out vacuum heating immersion plating at 500 ℃ for 5min to enable a gold-silver contact surface to form a stable alloy layer;
(4) Vacuum treatment: vacuum heating and drying at 100 ℃ for 5min to enable the gold plating layer and the silver wire blank to be in closer contact to form an integrated gold-clad silver bonding wire;
(5) Heat stability treatment: and (3) annealing the gold-coated silver bonding wire, wherein the annealing temperature is 680 ℃, the time is 10min, and the thickness of the obtained gold layer is 100-300 nm.
Claims (4)
1. The preparation method of the gold-clad silver bonding wire is characterized by comprising the following steps of:
(1) Silver wire blank: taking a silver wire blank with a wire diameter of 15-30 mu m as a blank;
(2) Preparing nano gold immersion plating liquid: adding the nano gold into a stabilizing solvent, and performing ultrasonic treatment for 30-60 min to prepare nano gold immersion plating solution;
the particle size of the nano gold is less than or equal to 80nm, and the mass concentration of the nano gold in the nano gold immersion plating solution is 0.4% -15%;
the stabilizing solvent comprises the following components in mass concentration: 0.02-2% of stabilizer, 0.5-12% of auxiliary agent, 0.05-1% of surfactant and the balance of water;
the stabilizer is one or more of tetrahydrofuran, dimethyl sulfoxide, N-methyl pyrrolidone, formamide and methyl guanamine; the auxiliary agent is any one or the mixture of two or more of formaldehyde, methanol, ethanol and acetone;
the surfactant is nonionic surfactant or/and block copolymerization surfactant; the nonionic surfactant is as follows: allyl alcohol polyoxyalkyl ether F-6 and/or polyethylene glycol 1000; the block copolymerization surfactant comprises: any one or two or more of polyethylene oxide-polypropylene oxide-polyethylene oxide triblock copolymer P123, propylene glycol block polyether L-64 and propylene glycol block polyether F68;
(3) Plating silver wire blank with nano gold: immersing the silver wire blank in nano-gold immersion plating liquid, and forming a stable alloy layer on the gold-silver contact surface by adopting a vacuum heating immersion plating or infrared heating immersion plating mode;
the temperature of the vacuum heating dip plating or the infrared heating dip plating is 500-600 ℃ and the time is 5 min-15 min;
(4) Vacuum treatment: processing the dip plated silver wire blank by adopting a vacuum heating drying or vacuum infrared drying mode to form an integrated gold-coated silver bonding wire;
(5) Heat stability treatment: and (3) annealing the gold-clad silver bonding wire.
2. The preparation method of claim 1, wherein the temperature of vacuum heating and drying or vacuum infrared drying in the step (4) is 80-120 ℃ and the time is 30 s-5 min.
3. The method of claim 1, wherein the annealing temperature in step (5) is 500 ℃ to 680 ℃ and the time is 5min to 15min.
4. The method according to any one of claims 1 to 3, wherein the method further comprises, before the vacuum treatment in step (4), repeating step (3) to dip the immersion-plated silver wire blank into the nano-gold immersion plating solution again, thereby completing the immersion plating again, wherein the immersion plating frequency is not less than 1 time.
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