CN100404197C - Preparation method of copper/molybdenum/copper electronic package composite material - Google Patents
Preparation method of copper/molybdenum/copper electronic package composite material Download PDFInfo
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- CN100404197C CN100404197C CNB2006100728245A CN200610072824A CN100404197C CN 100404197 C CN100404197 C CN 100404197C CN B2006100728245 A CNB2006100728245 A CN B2006100728245A CN 200610072824 A CN200610072824 A CN 200610072824A CN 100404197 C CN100404197 C CN 100404197C
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Abstract
The present invention belongs to the technical field of electronic packaging material, which is mainly applied to metal packaging industry of microelectronics industry and the semiconductor industry, particularly a method which adopts rolling technology to manufacture copper /molybdenum /copper electronic packaging composite material. The method comprises six procedures: surface treatment, coating, hot rolling, anneal, cold rolling and subsequent treatment. Compared with the prior art, the present invention has the advantages of simple manufacture technology and easy control, and is suitable for scale production. The finished product of the present invention has the advantages of high heat conduction, good adaptability and the consistency of size, high finished product rate and good punching performance, and meanwhile, the finished product has thermal expansion coefficient and heat conductivity which are matched with those of semiconductor material.
Description
Technical field
The invention belongs to the electronic package material field, be mainly used in the Metal Packaging industry of microelectronics and semicon industry, particularly relate to a kind of method that adopts sandwich rolling technology to prepare copper/molybdenum/copper/molybdenum/copper electronic package composite material.
Background technology
In the prior art, though traditional electronic package material such as Invar, Kovar, W, Mo etc. have lower thermal coefficient of expansion, but all can not satisfy the requirement of high heat conduction, and high-quality chip requires to have combination properties such as low-expansion coefficient, high heat conductance, high strength to encapsulating material.Therefore homogenous material is difficult to satisfy the harsh requirement of above-mentioned performance, has only composite could utilize the advantage of various homogenous materials, thereby obtains excellent comprehensive performances.At present, electronic packaging composite material has become the focus of current research, and wherein copper/molybdenum/copper is exactly a kind of important electron encapsulation composite.It belongs to the plane metal-base composites, and core is a metal molybdenum, and is two-sided coated with no-oxygen copper plate.This material had both had the low bulk performance of molybdenum, the high conduction, the heat conductivility that have copper again, and the not high problem of compactness that has encapsulating materials such as W/Cu, Mo/Cu, SiC/Al hardly, it can adjust its thermal coefficient of expansion and thermal conductivity by the thickness of adjusting molybdenum, copper again simultaneously, reaches characteristics such as having high strength and easy punch forming concurrently.
At present, the production technology of copper/molybdenum/carbon/carbon-copper composite material has liquid-solid in conjunction with rolling, as publication number is CN1408485A, the patent that open day is on April 9th, 2003 is described, at first copper coin and molybdenum ingot are placed graphite mo(u)ld, be heated to the copper coin fusing, cool off, and be prepared into copper molybdenum copper product by rolling again technology.But this method production process is various, and surface quality and each layer thickness of rolling back of melting cooling back copper coin are wayward, and the electrolysis copper coin that adopts easy hydrogen embrittlement that takes place in nitrogen atmosphere, also is difficult to satisfy the requirement of electronics industry high-purity material.United States Patent (USP) (US4950554, US4988392, US4957823) adopt the welding milling method to prepare the copper composite material of molybdenum and copper, the present invention compares, United States Patent (USP) has increased the operation of rolling preceding welding, and rolling mill practice is comparatively complicated, to the also raising greatly of requirement of rolling equipment, increase the difficulty of implementing, strengthened the preparation cost of material accordingly.
Summary of the invention
The object of the present invention is to provide the method for preparing copper/molybdenum/copper/molybdenum/copper electronic package composite material that a kind of technology is simple, easy to control, be suitable for large-scale production.Its finished product has high heat conduction, size adaptability and high conformity, yield rate height, punching performance is good, has the thermal coefficient of expansion and the thermal conductivity that are complementary with semi-conducting material simultaneously.
According to above-mentioned purpose, technical scheme of the present invention is: this method comprises surface treatment, coating, hot rolling, annealing, cold rolling, six steps of subsequent treatment, and its concrete steps are as follows:
A, surface treatment: the no-oxygen copper plate of getting thickness and be 0.2-0.8mm is 10
-1Pa-10
-3Under Pa vacuum or the protective gas state; through 500-900 ℃ of annealing in process 1-2 hour, selecting thickness simultaneously for use was the molybdenum plate process surface treatment of 0.6-0.8mm, removes the dirt on molybdenum plate surface with copper coin; obtain certain cleannes and roughness, its objective is to reach the enhancing combined strength bination.
B, coating: molybdenum plate is placed in the middle of the two-layer copper coin, coats molybdenum plate four limits with copper coin, compacting prevents in heating, the problem of oxidation in the operation of rolling to get rid of the air of interlayer.
C, hot rolling: above-mentioned coating sheet material in the hot rolling of 600-1000 ℃ of process 2-5 passage, is obtained the dimensions near the finished product requirement, and its width is 40mm-260mm, and thickness is 0.5-1.2mm.
D, annealing: under vacuum or gas shield state; will be through the copper/molybdenum/copper composite plate of hot rolling annealing in process 1.5 hours under 500-900 ℃ of temperature, air cooling its objective is and eliminate the stress that composite board produces in the operation of rolling to room temperature then; softener material is prepared for next step is cold rolling.
E, cold rolling: cold rolling through the 2-10 passage on four-high mill annealed composite plate, to obtain the dimensions that final finished requires, its width is 50mm-300mm, and thickness is 0.1-1mm.
F, subsequent treatment: comprise mainly and cut limit, annealing, aligning, check that with the final finished that obtains to meet the demands, the thickness ratio of finished product sheet material copper/molybdenum/copper is 1: 1: 1～1: 4: 1.
In above-mentioned preparation method: gas shield described in the above-mentioned Technology for Heating Processing is a kind of in hydrogen, the nitrogen.
The present invention compared with prior art has the advantage that preparation technology is simple, easy to control, be suitable for large-scale production.Its finished product has high heat conduction, size adaptability and high conformity, yield rate height, punching performance is good, has the thermal coefficient of expansion that is complementary with semi-conducting material and the advantage of thermal conductivity simultaneously.
Specific as follows:
1, adopts the molybdenum sheet of direct rolling coating copper coin to prepare copper/molybdenum/copper electronic package material, realized serialization, mass and the automation of producing.
2, thermal conductivity and thermal coefficient of expansion can be controlled by the copper that changes original coating, the thickness proportion and the rolling mill practice of molybdenum layer, make copper/molybdenum/copper/molybdenum/copper electronic package composite material of preparing have thermal coefficient of expansion and the thermal conductivity that is complementary with various semiconductor chips.
3, copper/molybdenum of preparing/copper/molybdenum/copper electronic package composite material possesses good punching performance, has improved the mouldability and the production efficiency of part.
4, size adaptability and high conformity.The appearance and size of copper/molybdenum/copper electronic package material, thickness etc. all can be regulated and control by rolling mill practice, thereby are accurately guaranteed.
The specific embodiment
Method produced according to the present invention has prepared the finished product of 3 batches of copper/molybdenum/copper/molybdenum/copper electronic package composite materials, in order to contrast conveniently, will adopt also the listing in the table of copper/molybdenum/copper/molybdenum/copper electronic package composite material end properties of art methods preparation.Wherein table 1 is copper/molybdenum/copper/molybdenum/copper electronic package composite material dimensions and the step of preparation process and the process parameter table of the present invention and prior art for preparing, table 2 is for adopting preparation method's gained copper molybdenum copper product end properties index of the present invention and prior art performance indications contrast table, wherein conical cup test value CCV is a parameter that embodies material Sheet Metal Forming Technology performance, concrete experiment method is by steel ball sample to be washed into the awl cup, when finding material breaks, stop test, measure the maximum dimension D cmax and the minimum diameter Dcmin of rim of a cup, and calculate conical cup test value CCV with CCV=(Dcmax+Dcmin)/2.According to experimental principle, conical cup test value CCV is big more, and expression material punching performance is good more, and sequence number 1-3# is the embodiment of the invention in the above-mentioned tabulation, and 4-5# is the prior art Comparative Examples.
Claims (2)
1. the preparation method of copper/molybdenum/copper/molybdenum/copper electronic package composite material is characterized in that this method comprises surface treatment, coating, hot rolling, annealing, cold rolling, six steps of subsequent treatment:
A, surface treatment: the no-oxygen copper plate of getting thickness and be 0.2-0.8mm is 10
-1Pa-10
-3Under Pa vacuum or the gas shield state, through 500-900 ℃ of annealing in process 1-2 hour, selecting thickness simultaneously for use was the molybdenum plate process surface treatment of 0.6-0.8mm, removes the dirt on molybdenum plate surface, obtains certain cleannes and roughness with copper coin;
B, coating: molybdenum plate is placed in the middle of the two-layer copper coin, coats molybdenum plate four limits with copper coin, compacting is to get rid of the air of interlayer;
C, hot rolling: above-mentioned coating sheet material in the hot rolling of 600-1000 ℃ of process 2-5 passage, is obtained the dimensions near the finished product requirement, and its thickness is 0.5-1.2mm;
D, annealing: 10
-1Pa-10
-3Under Pa vacuum or the gas shield state, will be through the copper/molybdenum/copper composite plate of hot rolling under 500-900 ℃ of temperature annealing in process 1-2 hour;
E, cold rolling: cold rolling through the 2-10 passage on four-high mill annealed composite plate, to obtain the dimensions that final finished requires, its thickness is 0.1-1mm;
F, subsequent treatment: comprise mainly and cut limit, annealing, aligning, check that with the final finished that obtains to meet the demands, the thickness ratio of finished product sheet material copper/molybdenum/copper is 1: 1: 1～1: 4: 1.
2. the preparation method of copper/molybdenum according to claim 1/copper/molybdenum/copper electronic package composite material is characterized in that protective gas described in the above-mentioned Technology for Heating Processing is a kind of in hydrogen or the nitrogen.
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| CNB2006100728245A CN100404197C (en) | 2006-04-10 | 2006-04-10 | Preparation method of copper/molybdenum/copper electronic package composite material |
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| CN100404197C true CN100404197C (en) | 2008-07-23 |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102527747A (en) * | 2012-02-22 | 2012-07-04 | 上海大学 | Method for preparing copper-molybdenum-copper laminar composite material |
| CN102941441B (en) * | 2012-11-02 | 2015-10-21 | 中南大学 | A kind of high bond strength high accuracy copper-molybdenum-copper laminated composite materials preparation method |
| CN105619931B (en) * | 2015-12-28 | 2019-08-02 | 重庆金荣金属有限公司 | A kind of laminated metal Cu/Mo/Cu coiled strip and continuous process |
| CN109877156B (en) * | 2019-03-20 | 2020-10-27 | 汕尾市索思电子封装材料有限公司 | Copper-molybdenum-copper laminated composite material and manufacturing method thereof |
| CN110814078B (en) * | 2019-09-24 | 2021-02-09 | 无锡乐普金属科技有限公司 | Preparation method of molybdenum-copper stepped material |
| CN110712419A (en) * | 2019-09-24 | 2020-01-21 | 无锡乐普金属科技有限公司 | Preparation method of copper-molybdenum-copper alloy material |
| CN114406260B (en) * | 2021-12-24 | 2024-03-05 | 海特信科新材料科技有限公司 | Production process of high-reliability CPC composite material |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60239032A (en) * | 1984-05-11 | 1985-11-27 | Tokyo Tungsten Co Ltd | Manufacture of copper-molybdenum composite electrode material |
| US4950554A (en) * | 1989-05-30 | 1990-08-21 | Amax Inc. | Composite copper-molybdenum sheet |
| US4957823A (en) * | 1989-05-30 | 1990-09-18 | Amax Inc. | Composite sheet made of molybdenum and dispersion-strengthened copper |
| US4988392A (en) * | 1989-05-30 | 1991-01-29 | Nicholson Richard D | Composite sheet made of molybdenum and dispersion-strengthened copper |
| JPH05125407A (en) * | 1991-11-05 | 1993-05-21 | Tokyo Tungsten Co Ltd | Production of cu-mo composite rolled sheet |
| CN1408485A (en) * | 2001-09-18 | 2003-04-09 | 长沙升华微电子材料有限公司 | Method for producing copper-molybdenum-copper three layer composite plate |
| JP2004249589A (en) * | 2003-02-20 | 2004-09-09 | Toshiba Corp | Copper-molybdenum composite material and heat sink using the same |
-
2006
- 2006-04-10 CN CNB2006100728245A patent/CN100404197C/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60239032A (en) * | 1984-05-11 | 1985-11-27 | Tokyo Tungsten Co Ltd | Manufacture of copper-molybdenum composite electrode material |
| US4950554A (en) * | 1989-05-30 | 1990-08-21 | Amax Inc. | Composite copper-molybdenum sheet |
| US4957823A (en) * | 1989-05-30 | 1990-09-18 | Amax Inc. | Composite sheet made of molybdenum and dispersion-strengthened copper |
| US4988392A (en) * | 1989-05-30 | 1991-01-29 | Nicholson Richard D | Composite sheet made of molybdenum and dispersion-strengthened copper |
| JPH05125407A (en) * | 1991-11-05 | 1993-05-21 | Tokyo Tungsten Co Ltd | Production of cu-mo composite rolled sheet |
| CN1408485A (en) * | 2001-09-18 | 2003-04-09 | 长沙升华微电子材料有限公司 | Method for producing copper-molybdenum-copper three layer composite plate |
| JP2004249589A (en) * | 2003-02-20 | 2004-09-09 | Toshiba Corp | Copper-molybdenum composite material and heat sink using the same |
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| CN1843691A (en) | 2006-10-11 |
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